KR101151051B1 - Sharp-edge grinding wheel - Google Patents

Sharp-edge grinding wheel Download PDF

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KR101151051B1
KR101151051B1 KR1020107018322A KR20107018322A KR101151051B1 KR 101151051 B1 KR101151051 B1 KR 101151051B1 KR 1020107018322 A KR1020107018322 A KR 1020107018322A KR 20107018322 A KR20107018322 A KR 20107018322A KR 101151051 B1 KR101151051 B1 KR 101151051B1
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grindstone
plating layer
thin blade
layer
metal binder
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KR1020107018322A
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KR20100113578A (en
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유스케 스즈키
쇼조 오테라
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가부시키가이샤 무라타 세이사쿠쇼
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

It provides a thin blade grindstone with long life and long lasting good cutting performance.
The grindstone particles 2 are dispersed and disposed in the metal binder 3 made of Ni, and a Cu plating layer 4 having a thickness not exceeding the protrusion amount of the grindstone particles from the metal binder is formed on the surface of the metal binder 3. have. The soft Cu plating layer 4 acts as a buffer layer when the grindstone particles 2 come into contact with the workpiece, thereby reducing damage to the workpiece, thereby suppressing chipping of the workpiece, and at the same time, the Cu plating layer. Since (4) is excellent in abrasion resistance, the abrasion speed of both sides provided with the Cu plating layer can be reduced, and it can lengthen life.

Description

Thin blade sharpener {SHARP-EDGE GRINDING WHEEL}

TECHNICAL FIELD This invention relates to the thin blade grinding wheel suitable for cut-processing workpieces, such as ceramics and a single crystal material.

BACKGROUND ART Conventionally, as a thin blade grindstone (dicing blade) for cutting a workpiece such as silicon, GaAs, ferrite, etc. with high precision, an electro-cast thin blade grindstone in the form of a thin plate ring is known. This electro-cast thin blade grindstone is a dispersion of abrasive grains such as diamond and cBN in a metal binder, and the thickness thereof is formed in a thin plate-like shape of several tens of micrometers to several hundreds of micrometers. The thin blade grindstone can be cut and grooved in the workpiece in the outer circumferential side region by holding the inner circumferential side region as the grindstone shaft and rotating the grindstone shaft.

Due to the recent miniaturization of electronic components and improvement in yield, thinner blades are desired for electro-cast thin blade grindstones, and ultra-thin thicknesses of 50 µm or less are achieved by using a metal material having high mechanical strength such as Ni as the metal binder. (Iii) Electric casting burrs are also provided. However, when the holding force of the grindstone particles by the metal binder increases, the damage to the workpieces by the grindstone particles increases, so that there is a problem of increasing the cracking and dropping of the workpiece called chipping during cutting.

In order to solve such a problem, in patent document 1, the Sn plating layer of the thickness which does not exceed the protrusion amount of the grindstone particle from this metal binder is formed in the surface of the blade edge part of the metal binder which consists of Ni, Co, or these alloys. Electroforming thin blade sharpener has been proposed. In this case, when the Sn plating layer covers the surface of the metal binder, the sliding property is improved, and the Sn plating layer, which is softer than the metal binder, constitutes the buffer layer, thereby reducing damage to the workpiece and suppressing chipping. have.

However, when a high hardness brittle material such as electronic ceramics or single crystal material is cut and processed using an electro-cast thin blade grindstone having this structure, the Sn plating layer is greatly abraded at the beginning of the processing, thereby stably inhibiting chipping for a long time. There is a problem that can not be maintained, which is not practical. The state will be described with reference to FIG. 6.

6 (a) shows the thin blade grindstone 10 before processing, and (b) shows the thin blade grindstone 10 during cutting processing. On the surface of the metal binder 11 made of Ni, a Sn plating layer 12 having a thickness not exceeding the protrusion amount of the grindstone particles is formed. In FIG. 6, whetstone particles were omitted. By cutting the workpiece 13, the outer peripheral portion of the thin blade grindstone 10 is worn, but the wear in the thickness direction is greater than the wear in the radial direction, especially the wear on both sides provided with the Sn plating layer 12, FIG. As shown in Fig. 1), the metal binder 11 appears on both sides in a short time. This eliminates the buffering effect of the Sn plating layer 12 and prevents maintaining good cutting performance (chip suppression) and processing accuracy. Therefore, there exists a fault that the lifetime of the thin blade grindstone 10 coated with Sn plating layer is very short. In addition, when the electroforming thin blade grindstone is used for cutting processing, in order to adjust the amount of protrusion of the grindstone particles to stabilize the processing quality, a blade raising operation called dressing is performed on the grindstone edge portion in advance. This blade raising operation is performed by cutting the dress board which hardened the grindstone grain by the grindstone edge part, for example. By cutting this dress board, the metal binder material between the grindstone particles is scraped off at the grindstone blade edge to form chip pockets. However, in this work, since the Sn plating layer is simply worn out, there is a drawback that almost no Sn plating layer remains during the actual cutting process, and the buffering effect by the Sn plating layer cannot be sufficiently exhibited.

In Patent Literature 1, the thickness of the Sn plating layer is set to, for example, 10 to 15 µm. However, when such a thick Sn plating layer is formed, it is necessary to increase the particle diameter of the grindstone particles to be larger than that. There is a problem that the increase in chipping, the decrease in the work quality and the increase in the work width are caused by the increase.

Japanese Laid-Open Patent Publication No. 2002-66935

Thus, an object of a preferred embodiment of the present invention is to provide a thin blade grindstone which has a long life and can maintain a good cutting performance for a long time.

The present invention is a thin blade grindstone obtained by dispersing and arranging whetstone particles in a metal binder composed of Ni or an Ni-based alloy, the protruding amount of the grindstone particles from the metal binder not exceeding the surface of the metal binder. It is a thin blade grindstone characterized by the formation of a thick Cu plating layer or an alloy plating layer mainly composed of Cu.

When the workpiece is cut with the thin blade grindstone of the present invention, the damage to the workpiece can be reduced by the buffering effect of the Cu plating layer that is softer than Ni, and chipping can be suppressed. In addition, since the Cu plating layer is superior in wear resistance as compared with the Sn plating layer, the wear rate of both sides provided with the Cu plating layer can be reduced. As a measure of wear resistance, Mohs hardness is 1.8. Mohs hardness of Sn is 1.8, Mohs hardness of Cu is 3.0, and Mohs hardness of Ni is 3.5. Thus, since Mohs' Hardness of Cu is close to Mohs's Hardness of Ni, when the outer peripheral part of a thin blade grindstone wears with cutting, it can balance the abrasion rate of a radial direction and the wear rate of a thickness direction. Therefore, even if the thin blade grindstone is worn, both sides are not extremely worn and the same performance as the initial cutting performance (suppression of chipping) can be maintained, and a long life thin blade grindstone can be realized. In addition, in the blade straightening work performed before the actual cutting, the Cu plating layer is not easily worn, and thus the buffering effect by the Cu plating layer can be sufficiently exhibited at the time of cutting. In addition, since the Cu plating layer has high adhesion with the Ni metal bonding material, the Cu plating layer does not peel off from the Ni metal bonding material during cutting.

The thickness of the Cu plating layer or the alloy plating layer mainly composed of Cu is preferably 1 to 10 µm. Since the Cu plating layer is not easily worn as described above, even a thin film having a thickness of 10 μm or less can exhibit sufficient buffering effect. That is, the particle diameter of the grindstone particles can be reduced by that much, and high precision cutting can be performed. The thickness of the Cu plating layer or the alloy plating layer mainly composed of Cu is set according to the particle diameter of the grindstone particles. When the particle diameter of the grindstone particles is 5 to 10 µm, 1 to 10 µm, preferably 1 to 5 µm is used. good.

As a thin blade grindstone, an electrodeposition thin blade grindstone or an electroforming thin blade grindstone can be used. For example, in the case of electrodeposition thin blade grindstone, a thin blade grindstone is formed by forming a metal binder composed of Ni or Ni mainly as a cathode by using a cathode such as stainless steel as a cathode. I can write it. In addition, in the case of electroforming thin blade grindstone, a very thin blade grindstone can also be produced by peeling a metal binder from the cathode.

The alloy plating layer mainly containing Cu means the alloy containing at least 50 weight% of Cu. Such alloy plating layer is a material whose Young's modulus is smaller than the Young's modulus of the metal constituting the metal binder, and whose Mohs hardness is higher than 2.5 by the Mohs hardness evaluation method described in BS6430-13: 1986, EN101: 1991. Preference is given to using. This is because when the Mohs' Hardness is 2.5 or less (for example, Au, Sn, etc.), the wear resistance is low and wears out quickly, so that the original cutting performance cannot be maintained.

The metal constituting the metal bonding material may be an alloy of Ni, which is the main body, and other metals (for example, Co) in addition to Ni. Here, the alloy mainly containing Ni means the alloy containing 50 weight% or more of Ni at least. What is necessary is just an alloy which has mechanical strength and abrasion resistance equivalent to Ni. As the work piece to the cutting edge with a thin grinding wheel of the invention, and includes a high hardness material such as silicon or GaAs, other than such as ferrite, a piezoelectric ceramic, such as modifications of PZT, LiTaO 3 single crystal, the dielectric.

According to the thin blade grinding wheel according to the present invention, since the Cu plating layer or the alloy plating layer mainly composed of Cu is formed on the surface of the metal binder composed of Ni or Ni mainly alloy, the abrasive grains are softer than the Cu plating layer which is softer than Ni. It acts as a buffer layer when it touches a workpiece, and damage to a workpiece can be reduced and chipping can be suppressed. Moreover, since Cu plating layer is excellent in abrasion resistance, the wear rate of the both sides which provided the Cu plating layer can be reduced. Therefore, when the outer periphery of the thin blade grindstone is worn with cutting, the radial wear rate and the wear rate in the thickness direction can be balanced, and the same performance as the initial cutting performance can be maintained. As a result, a thin blade grinding wheel can be realized. In addition, since the Cu plating layer is not easily abraded, a sufficient buffering effect can be exhibited even when the thickness thereof is thin, and the particle diameter of the grindstone particles can be reduced by that much, so that high precision cutting can be performed.

BRIEF DESCRIPTION OF THE DRAWINGS The front view and AA sectional view of 1st Embodiment of a thin blade grinding wheel which concerns on this invention.
It is sectional drawing which shows the manufacturing process of the thin blade grinding wheel shown in FIG.
3 is a side view before and during the processing of the thin blade grinding wheel according to the present invention.
4 is a comparative diagram showing the chipping results of various thin blade grinding wheels.
Fig. 5 is a diagram evaluating the persistence of the chipping inhibitory effect of the Sn 3-layer whetstone and the Cu 3-layer whetstone.
It is a side view before and during the process of the conventional thin blade grinding wheel.

EMBODIMENT OF THE INVENTION Below, preferred embodiment of this invention is described with reference to drawings. BRIEF DESCRIPTION OF THE DRAWINGS The 1st Embodiment of the thin blade grinding wheel which concerns on this invention is shown, (a) is a front view of a thin blade grinding wheel, (b) is A-A line enlarged sectional view. The thin blade grindstone (1) of this embodiment is a thin ring-shaped electro-cast thin blade grindstone, and is obtained by dispersing and arranging the grindstone particles (2) such as diamond or cBN in the metal binder 3, and the thickness thereof is from several tens of mu m to It is set to about several hundred micrometers, Preferably it is 50 micrometers or less. The metal bonding material 3 consists of Ni plating layer or the alloy plating layer mainly containing Ni. Examples of the Ni alloys include Ni-Co alloys, Ni-W alloys, and Ni-B alloys.

On the surface of the metal binder 3, a Cu plating layer 4 having a thickness not exceeding the amount of protrusion of the grindstone particles 2 from the metal binder 3 is formed. Although the thickness of the Cu plating layer 4 should not exceed the protrusion amount of the grindstone particle 2, when the particle diameter of the grindstone particle 2 is 5-10 micrometers, it is about 1-10 micrometers, Preferably it is 1-5 The micrometer is good, and 15% to 100% of the average grindstone diameter is preferable. In addition, in FIG. 1B, all the grindstone particles 2 protrude from the Cu plating layer 4 to the surface of the surface layer part, but some of the grindstone particles 2 are buried in the Cu plating layer 4. You may be.

Instead of the Cu plating layer 4, you may use the alloy plating layer which mainly has Cu. As the alloy plating layer, for example, CuZn, CuZnSn, CuSn, etc., the Young's modulus is smaller than the Young's modulus (210GPa) of Ni constituting the metal bonding material 3, the MoS hardness (BS6430-13: 1986, EN101: 1991 It is preferable that it is a material larger than Mohs' Hardness by the Mohs hardness evaluation method described) 2.5. The Cu plating layer 4 is formed at least on the blade tip portion 1a of the thin blade grindstone 1, and the Cu plating layer 4 may be formed not only on the blade tip portion 1a but the entire thin blade grindstone 1. .

Next, an example of the manufacturing method of the thin blade grindstone 1 which consists of the said structure is demonstrated with reference to FIG.

First, an electrolytic plating solution containing Ni obtained by dispersing whetstone particles 2 such as diamond is prepared. In this plating solution, a substrate such as stainless steel and an anode plate are disposed to face each other, and the substrate is connected to the cathode. When electricity is supplied between the cathode and the anode, a Ni alloy plating layer is deposited on the substrate to form a metal binder 3 in which the whetstone particles 2 are uniformly dispersed. Plating is complete | finished when the metal bonding material 3 became several tens of micrometers-several hundred micrometers, the board | substrate which formed this metal bonding material 3 is taken out from a plating liquid, and the metal bonding material 3 is peeled off from a board | substrate. The peeled metal binder 3 is molded into a ring to obtain a single-layer grindstone 1A shown in Fig. 2A.

Next, the surface of the metal bonding material 3 of the single-layer grindstone 1A is removed by etching or the like, and a single-layer grindstone 1B is obtained in which the protruding amount of the grindstone particles 2 is increased as shown in FIG.

Subsequently, when the monolayer grindstone 1B is immersed in a plating solution containing Cu ions, the monolayer grindstone 1B is used as a cathode, an anode plate is disposed to face the cathode, and Cu is supplied between the anode and the anode. It precipitates on (1B), and the Cu plating layer 4 is formed. Cu plating does not precipitate on the non-conductive grindstone particles 2, but only on the metal binder 3. In this way, the thin blade grindstone 1 shown to Fig.2 (c) is obtained. Moreover, it is good to perform a blade raising by dressing the blade edge part of the thin blade grindstone 1 before actual cutting process.

The Young's modulus 120GPa of the Cu plating layer 4 is lower than the Young's modulus 210GPa of the metal binder 3 made of Ni. That is, since the Cu plating layer 4 is softer than the metal binder 3, when the grindstone particle 2 collides with a workpiece, it exhibits a buffering effect, can reduce damage to a workpiece, and can suppress chipping. Can be. On the other hand, the Mohs hardness, which is a measure of wear resistance, is 3.0 in Cu and 3.5 in Ni, and the Mohs hardness of Cu is close to the Mohs hardness of Ni. Therefore, when the outer peripheral part of the thin blade grindstone is worn with cutting, the radial direction It is possible to balance the wear rate in the thickness direction with the wear rate. The middle part of the grindstone particles 2 is held by a soft Cu plating layer 4, and the bottom part of the grindstone particles 2 is held by a hard metal binder 3, thereby preventing the grindstone particles 2 from simply falling off. can do.

The initial state (a) of the thin blade grindstone 1 in this embodiment and the state (b) after performing several cutting processes are shown in FIG. 3, grindstone particles are omitted. By cutting the workpiece 5, the outer peripheral portion of the thin blade grindstone 1 is abraded. Since Cu and Ni have similar Mohs hardness, the outer peripheral portion of the metal binder 3 wears in an arc shape, and Cu The tip of the plating layer 4 also wears, and wear progresses while maintaining this shape. In particular, the hardness of both sides of the outer peripheral portion of the thin blade grindstone 1 greatly affects the generation of chipping. In the case of the thin blade grindstone 1 of the present embodiment, as shown in FIG. Since the wear is performed while leaving the Cu plating layer 4 on both sides of the outer peripheral portion of the thin blade grindstone 1, the buffer effect by the Cu plating layer 4 can be maintained, and thus the cutting performance (chip suppression) and the processing accuracy are good. Can be maintained. Therefore, the life of the thin blade grindstone 1 becomes long.

<Examples>

Here, the amount of chipping when the single crystal material (LiTaO 3 ) is processed using the following four types of thin grinding wheels is compared with the wear state of the grindstone outer layer. Thin blade grindstone (1) is a single-layer grindstone consisting of only a metallic binder of Ni in which whetstone particles are dispersed, and thin blade grindstone (2) is a three-layer grindstone in which a Sn plating layer is formed on a metallic binder of Ni in which whetstone particles are dispersed (patent document) 1), the thin blade grindstone (3) is a three-layer grindstone (inventive product) in which a Cu plating layer is formed on a metal binder of Ni in which the grindstone particles are dispersed, and the thin blade grindstone (4) is formed of Ni in which the grindstone particles are dispersed. It is a three-layer grindstone (comparative example) in which an Au plating layer was formed on a metal binder.

(1) Ni electroforming single layer whetstone (prior art)

Metallic binder: Ni (Moss hardness: 3.5, Young's modulus: 210 [GPa])

Whetstone particle diameter: 5 / 10㎛

Shape: outer diameter 52 × thickness 0.04 × inner diameter 40 [mm]

(2) Sn three levels sharpener (advanced technical product)

Metal Bonding Material: Ni

Outer layer material: Sn (Moss hardness: 1.5, Young's modulus: 55 [GPa])

Outer layer thickness: 1.2㎛

(3) Cu 3-layer whetstone (this invention)

Metal Bonding Material: Ni

Outer layer material: Cu (Moss hardness: 3.0, Young's modulus: 120 [GPa])

Outer layer thickness: 1.2㎛

(4) Au 3rd floor whetstone (comparative example)

Metal Bonding Material: Ni

Outer layer material: Au (Moss hardness: 2.5, Young's modulus: 78 [GPa])

Outer layer thickness: 1.2㎛

Processing conditions are as follows.

Machine: Dicer DAD522 (manufactured by Disco)

Spindle Speed: 30000rpm

Workpiece: single crystal material (LiTaO 3 )

Workpiece shape: strip shape (20 × 80mm)

Sending Speed: 20mm / s

Number of cuts: 5

Cutting length: 20 mm x 5 total 100 mm

4 shows a chipping result when the thin blade grinding wheels 1 to 4 are processed. This figure shows the size of the chipping that appears on the cut surface when the flat workpiece is cut. The maximum chipping on each cut surface is aggregated, and the maximum, minimum and average values are shown. As shown in FIG. 4, in the case of Ni-single whetstone, chipping is large because the hardness of the Ni metal binder is high. The Sn three-layer grindstone and the Au three-layer grindstone have the outer layer Sn-plated layer and the Au-plated layer to act as a buffer layer, but the wear resistance is low, and since the Sn-plated layer and the Au-plated layer are almost worn out by the sharpening operation, the actual cutting The chipping results in the machining are almost the same as in the case of Ni single-head grindstones. On the other hand, in the Cu three-layer grindstone, since the Cu plating layer is not abraded by the blade straightening operation, the chipping result in the cutting process is significantly reduced compared to the Ni single-layer grindstone, the Sn three-layer grindstone and the Au three-layer grindstone, and the variation is small. I can see that I am losing. Thus, it turns out that Cu 3-layer grinding wheel has favorable cutting performance compared with other grinding wheels.

Next, the persistence of the chipping inhibitory effect at the time of processing using three types of thin blade grindstones, such as Ni single-layer grindstone, Cu three-layer grindstone, and Sn three-layer grindstone, was evaluated. Experimental conditions are as follows.

(1) Ni-single whetstone

Whetstone particle diameter: 5 / 10㎛

Shape: outer diameter 52 * thickness 0.04 * inner diameter 40 [mm]

(2) Cu 3F Burrs

Materials: Ni singlet burr

Etching treatment

Etching solution: 35% hydrochloric acid: 60% nitric acid: pure water = 1: 1: 3 (vo1%)

Etching solution volume: 400ml

Etch Thickness: 1.7㎛

Plating treatment

Plating Solution: Copper Sulfate Plating Solution

Current: 0.2 A

Plating time: 340s

Bath temperature: 25 ℃

Cu plating thickness: 1.1㎛

(3) Sn 3-layer whetstone

Materials: Ni singlet burr

Etching treatment: same conditions as Cu three-layer whetstone

Plating treatment

Plating Solution: Tin Plated Acid Bath

Current: 0.04 A

Plating time: 780s

Bath temperature: 25 ℃

Sn plating thickness: 1.1㎛

Processing conditions are as follows.

Machine: DAD3350 (manufactured by Disco)

Spindle Speed: 30000rpm

Processing speed: 20mm / s

Cutting water flow: 1.0 liters / min

Machining work: PFLT board (X-Y pyroelectric processed product) φ 100 mm

Machining Pitch: 0.9mm

Number of cuts: 100

Number of cuts: 2

Under the above conditions, each of the two PFLT wafers is processed with three types of grindstones (1) to (3), and the amount of backside chipping generated at that time is shown in FIG. 5. Fig. 5 shows the total machining length of the grindstone as the horizontal axis, and the chipping amount at the time of processing the back surface chipping in the Sn three-layer grindstone and the Cu three-layer grindstone at the vertical axis with Ni single-layer grindstone to 1; It is expressed as a ratio when. From the results of FIG. 5, in the Sn 3-layer grindstone, the cutting length can be confirmed by 20% reduction in chipping compared to Ni single-layer grindstone up to 10000 mm, but the chipping suppression effect starts from a cutting length exceeding 13000 mm (for 1.5 wafers). It becomes small and worsens to the amount of chipping equivalent to Ni single-layer grindstone in the area | region exceeding 15000 mm (two wafers) for cutting length. In contrast, it can be seen that in the Cu three-layer grindstone, the chipping suppression effect of about 20 to 30% is maintained from the beginning to the end.

As described above, it was confirmed that the Cu film was retained in the Cu film, while the chipping suppression effect did not last long. In the case of this workpiece | work, nearly 150-200 wafers were cut | disconnected using one Cu three-layer grindstone, and the long life of the grindstone was achieved.

This invention is not limited to the said embodiment. In the said embodiment, although the electroforming thin blade grinding wheel was demonstrated as an example, the Ni plating layer was provided by electrodeposition to the price of stainless steel etc., and the metal bonding material was comprised, and the Cu plating layers may be formed in the both sides of this metal bonding material. .

1: thin blade sharpener
2: burr particles
3: metal binder (Ni plating layer)
4: Cu plating layer
5: workpiece

Claims (4)

In an electro-cast thin blade whetstone, wherein the abrasive grains are dispersed in a metal binder composed of Ni or an Ni-based alloy, and a part of the abrasive grains is projected from the surface of the metal binder.
On the surface of the metal binder, a Cu plating layer or an alloy plating layer mainly composed of Cu having a thickness not exceeding the protrusion amount of the grindstone particles from the metal binder is formed,
The thickness of the said Cu plating layer or the alloy plating layer mainly containing Cu is 1-10 micrometers,
The Cu plating layer or the alloy plating layer mainly composed of Cu has a Young's modulus less than the Young's modulus of the metal constituting the metal binder, and according to the Mohs hardness evaluation method described in BS6430-13: 1986, EN101: 1991. Electro-cast thin blade sharpener, characterized in that the Mohs hardness is greater than 2.5. The method of claim 1,
The Cu plating layer or the alloy plating layer mainly composed of Cu is formed with a thickness of 15 to 100% of the average particle diameter of the grindstone particles. The method according to claim 1 or 2,
The electroforming thin blade grinding wheel, characterized in that the total thickness of the electroforming thin blade grinding wheel is 50㎛ or less. delete
KR1020107018322A 2008-02-25 2008-10-16 Sharp-edge grinding wheel KR101151051B1 (en)

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JP2008042571A JP4400677B2 (en) 2008-02-25 2008-02-25 Thin blade whetstone

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JP5140715B2 (en) * 2010-10-19 2013-02-13 株式会社アライドマテリアル Superabrasive wheel, molded body and processing method thereof
CN103459091B (en) * 2010-11-29 2017-05-10 信越化学工业株式会社 Super hard alloy baseplate outer circumference cutting blade and manufacturing method thereof
GB201208680D0 (en) 2012-05-17 2012-06-27 Origold As Method of manufacturing an electronic card
US20150105006A1 (en) * 2013-10-11 2015-04-16 HGST Netherlands B.V. Method to sustain minimum required aspect ratios of diamond grinding blades throughout service lifetime
CN105252446B (en) * 2015-08-24 2017-11-03 镇江丰成特种工具有限公司 A kind of emery wheel preparation technology of high-efficiency abrasion-proof
CN105252447B (en) * 2015-08-24 2017-12-15 镇江丰成特种工具有限公司 A kind of efficient emery wheel

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JP2002066935A (en) * 2000-08-31 2002-03-05 Mitsubishi Materials Corp Electroforming sharp-edged grinding wheel and method of manufacturing the same

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KR20100113578A (en) 2010-10-21
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CN101945733A (en) 2011-01-12
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