JPH09150314A - Wire saw and manufacture thereof - Google Patents
Wire saw and manufacture thereofInfo
- Publication number
- JPH09150314A JPH09150314A JP7330999A JP33099995A JPH09150314A JP H09150314 A JPH09150314 A JP H09150314A JP 7330999 A JP7330999 A JP 7330999A JP 33099995 A JP33099995 A JP 33099995A JP H09150314 A JPH09150314 A JP H09150314A
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- wire
- soft
- hard
- superabrasive grains
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ワイヤーソー及び
その製造方法に関する。さらに詳しくは、本発明は、シ
リコンインゴットなどの高脆性材料の切断に用いて、切
りしろによる切断ロスが少なく、反りやソーマークの少
ない高精度な切断が可能なワイヤーソー及びその製造方
法に関する。TECHNICAL FIELD The present invention relates to a wire saw and a method for manufacturing the same. More specifically, the present invention relates to a wire saw that is used for cutting a highly brittle material such as a silicon ingot and that can perform highly accurate cutting with less cutting loss due to a cutting margin and less warpage and saw marks, and a manufacturing method thereof.
【０００２】[0002]
【従来の技術】従来より、シリコン、ＧＧＧ、ガリウム
−ヒ素、ガリウム−燐、ゲルマニウムなどの半導体用イ
ンゴットのスライス加工には、高能率、高精度にスライ
ス加工ができるＩＤブレードが使用されてきた。シリコ
ンインゴットの大形化に対応して、ＩＤブレードも大径
化し、また切断ロス低減のための薄型化が図られてい
る。しかし、シリコンインゴットの径が、６インチから
８インチとなり、将来は１２インチを超えるシリコンイ
ンゴットも予想されるようになると、ＩＤブレードの薄
型化には限界があり、高価な被削材の切断ロスの低減に
も限度がある。ＩＤブレードに代わる半導体用インゴッ
トの切断方法として、油中に混在するＷＡ、ＧＣなどの
遊離砥粒を利用するワイヤー切断法が提案されている。
しかし、この方法は、切断速度が遅い上に、切断精度が
悪く、また、被削材に油汚れを生じ、環境汚染になると
いう問題がある。ワイヤーソーは、鋼線などに超砥粒を
固着したものであり、案内ロール間にワイヤーソーを張
り、被削材である半導体インゴットなどに適当な荷重を
かけ、接触させることにより、細いワイヤーソーで大径
の被削材の切断が可能であり、切断ロスを低減すること
ができる。また、水系の研削液を使用することができ
る。従来のダイヤモンドワイヤーソーの製造法として
は、粗いダイヤモンド砥粒を電着したのち細かいダイヤ
モンド砥粒を電着する方法（特公平４−４１０５号公
報）、ワイヤー吊具にワイヤーを数回螺旋状に巻回支持
し、砥粒槽内に挿入して静的にメッキする方法（特開平
７−２２７７６６号公報）、ワイヤーをメッキ槽中に配
設した砥粒収容部に間欠的に通過させることにより、ワ
イヤーが停止した状態でメッキを行う方法（特開平７−
２２７７６７号公報）などが提案されている。しかし、
このような方法で製造されたワイヤーソーは、超砥粒の
固着が不十分であるため、使用中に超砥粒の脱落が生じ
て被削材を傷つけたり、あるいはワイヤーソーの外径が
一定でないため、反りやソーマークなどが生じ、高い切
断精度が得られないという問題があった。2. Description of the Related Art Conventionally, for slicing semiconductor ingots such as silicon, GGG, gallium-arsenic, gallium-phosphorus, and germanium, an ID blade capable of slicing with high efficiency and high precision has been used. In response to the increase in size of silicon ingots, ID blades have also been increased in diameter and made thinner to reduce cutting loss. However, if the diameter of the silicon ingot changes from 6 inches to 8 inches, and it is expected that silicon ingots will exceed 12 inches in the future, there is a limit to the thinning of the ID blade, and cutting loss of expensive work material is limited. There is a limit to the reduction of As a method of cutting an ingot for a semiconductor, which replaces the ID blade, a wire cutting method has been proposed which utilizes free abrasive grains such as WA and GC mixed in oil.
However, this method has the problems that the cutting speed is slow, the cutting accuracy is poor, and that the work material is contaminated with oil to cause environmental pollution. A wire saw is a steel wire to which superabrasive grains are fixed.A wire saw is stretched between guide rolls, and a semiconductor ingot, which is the work material, is loaded with an appropriate load and brought into contact with it. With this, it is possible to cut a large-diameter work material, and cutting loss can be reduced. Further, a water-based grinding liquid can be used. As a conventional method for manufacturing a diamond wire saw, a method in which coarse diamond abrasive grains are electrodeposited and then fine diamond abrasive grains are electrodeposited (Japanese Patent Publication No. 4105/1992) is used. A method of supporting by winding, inserting into an abrasive grain tank and statically plating (JP-A-7-227766), by intermittently passing a wire through an abrasive grain accommodating portion arranged in the plating tank. , A method of performing plating while the wire is stopped (JP-A-7-
No. 227767) has been proposed. But,
The wire saw manufactured by such a method has insufficient adhesion of the superabrasive grains, so that the superabrasive grains may fall off during use to damage the work material, or the outer diameter of the wire saw may be constant. Therefore, there is a problem in that a warp, a saw mark, or the like occurs and high cutting accuracy cannot be obtained.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、超砥粒がワ
イヤーに強固に固着して脱落することがなく、太さが一
定で高い切断精度が得られるワイヤーソー及びその製造
方法を提供することを目的としてなされたものである。DISCLOSURE OF THE INVENTION The present invention provides a wire saw having a constant thickness and high cutting accuracy, in which superabrasive grains are firmly fixed to the wire and do not fall off, and a method for manufacturing the same. It was made for the purpose.
【０００４】[0004]
【課題を解決するための手段】本発明者は、上記の課題
を解決すべく鋭意研究を重ねた結果、ワイヤーの表面に
軟質メッキ層を設けたのち超砥粒を固着し、円形の超硬
質ダイスを通過させることにより、太さが一定で、超砥
粒が強固に固着したワイヤーソーを得ることができるこ
とを見いだし、この知見に基づいて本発明を完成するに
至った。 すなわち、本発明は、（１）ワイヤーの表面が軟質メッ
キ層により被覆され、軟質メッキ層がさらに硬質メッキ
層により被覆され、両メッキ層により超砥粒が固着され
たワイヤーソーであって、超砥粒の内端が軟質メッキ層
内にあり、超砥粒の外端が硬質メッキ層外に露出して同
一の円筒面上にあることを特徴とするワイヤーソー、
（２）ワイヤーの表面に軟質金属をメッキして軟質メッ
キ層を形成し、次いで超砥粒を電気メッキにより一層分
仮固定し、さらに硬質金属を電気メッキして超砥粒を固
着したのち、超硬質ダイスを通過させることを特徴とす
る第(１)項記載のワイヤーソーの製造方法、（３）ワイ
ヤーの表面に軟質金属をメッキして軟質メッキ層を形成
し、次いで超砥粒を電気メッキにより一層分仮固定し、
超硬質ダイスを通過させたのち、さらに硬質金属を電気
メッキして超砥粒を固着することを特徴とする第(１)項
記載のワイヤーソーの製造方法、（４）軟質メッキ層が
銅、錫、鉛又はハンダ（鉛−錫）メッキ層であり、硬質
メッキ層がニッケルメッキ層である第(１)項記載のワイ
ヤーソー、及び、（５）軟質金属が銅、錫、鉛又はハン
ダ（鉛−錫）であり、硬質金属がニッケルである第(２)
項又は第(３)項記載のワイヤーソーの製造方法、を提供
するものである。As a result of intensive studies to solve the above-mentioned problems, the present inventor has found that after forming a soft plating layer on the surface of the wire, the superabrasive grains are fixed to the circular superhard By passing through a die, it was found that a wire saw having a constant thickness and firmly fixed with superabrasive grains could be obtained, and the present invention was completed based on this finding. That is, the present invention is (1) a wire saw in which the surface of the wire is covered with a soft plating layer, the soft plating layer is further covered with a hard plating layer, and the superabrasive grains are fixed by both plating layers. The inner end of the abrasive grains is in the soft plating layer, the outer ends of the superabrasive grains are exposed to the outside of the hard plating layer and are on the same cylindrical surface, a wire saw,
(2) A soft metal is plated on the surface of the wire to form a soft plated layer, and then superabrasive grains are temporarily fixed by electroplating for one layer, and then hard metal is electroplated to fix the superabrasive grains, A method of manufacturing a wire saw according to item (1), characterized by passing through a super-hard die, (3) forming a soft plating layer by plating a soft metal on the surface of the wire, and then applying superabrasive grains to electricity. Temporarily fixed one layer by plating,
After passing through an ultra-hard die, further electroplating a hard metal to fix the superabrasive grains, (4) the method of manufacturing a wire saw, (4) the soft plating layer is copper, A wire saw according to item (1), which is a tin, lead or solder (lead-tin) plating layer, and the hard plating layer is a nickel plating layer, and (5) the soft metal is copper, tin, lead or solder ( Lead-tin) and the hard metal is nickel (2)
And a method for manufacturing a wire saw according to item (3).
【０００５】[0005]
【発明の実施の形態】本発明のワイヤーソーに用いるワ
イヤーは、メッキが可能で強度と弾性率が案内ロール間
の張りに耐えるものであれば特に制限はなく、このよう
なワイヤーとしては、例えば、長尺のピアノ線などの鋼
線、タングステン線、モリブデン線などの金属ワイヤー
などを挙げることができる。本発明に使用するワイヤー
の直径には特に制限はなく、被削材の形状及び性質によ
り適宜選択することができるが、通常は０.０５〜０.５
mmであることが好ましく、０.１〜０.４mmであることが
より好ましく、０.１５〜０.３mmであることがさらに好
ましい。本発明方法においては、ワイヤーの表面に軟質
金属をメッキして軟質メッキ層を形成する。軟質金属の
メッキに先だって、ワイヤーの表面を脱脂し、清浄にす
ることが好ましい。ワイヤー表面の脱脂方法には特に制
限はなく、例えば、酸浸漬、溶剤脱脂、乳化剤脱脂、ア
ルカリ脱脂などにより行うことができ、さらに必要に応
じて、電解脱脂により仕上げることができる。メッキす
る軟質金属は、超砥粒を押し込むことができるものであ
れば、特に制限なく使用することができる。軟質金属と
しては、硬度が比較的低く、適度の延性を有する金属を
好適に使用することができ、このような軟質金属として
は、例えば、銅、錫、鉛、ハンダ（鉛−錫）などを挙げ
ることができる。ワイヤー表面に軟質メッキ層を形成す
る方法には特に制限はないが、例えば、ワイヤーに陰極
を接続し、メッキ液に陽極を接続して電気メッキを行う
ことにより、ワイヤー表面に軟質メッキ層を形成するこ
とができる。軟質メッキ層の厚みは、使用する超砥粒の
粒径の２０〜５０％とすることが好ましい。本発明方法
においては、ワイヤーの表面に形成された軟質メッキ層
の上に、超砥粒を電気メッキにより一層分仮固定する。
超砥粒を電気メッキにより仮固定する方法には特に制限
はないが、例えば、超砥粒を添加したメッキ槽の中に軟
質メッキ層を有するワイヤーを浸漬し、ワイヤーに陰極
を接続し、メッキ液に陽極を接続して、電流密度及びメ
ッキ時間を適宜選択して電気メッキを行うことにより、
超砥粒を一層分仮固定することができる。超砥粒の仮固
定のための電流メッキには、軟質金属又は硬質金属のい
ずれをも使用することができるが、硬質金属を使用する
ことが好ましい。BEST MODE FOR CARRYING OUT THE INVENTION The wire used in the wire saw of the present invention is not particularly limited as long as it can be plated and has strength and elasticity that can withstand the tension between the guide rolls. Examples include steel wire such as long piano wire, metal wire such as tungsten wire and molybdenum wire. The diameter of the wire used in the present invention is not particularly limited and can be appropriately selected depending on the shape and properties of the work material, but is usually 0.05 to 0.5.
mm is preferable, 0.1 to 0.4 mm is more preferable, and 0.15 to 0.3 mm is further preferable. In the method of the present invention, the surface of the wire is plated with a soft metal to form a soft plated layer. It is preferable to degrease and clean the surface of the wire before plating the soft metal. The degreasing method of the wire surface is not particularly limited, and for example, it can be carried out by acid immersion, solvent degreasing, emulsifier degreasing, alkaline degreasing, and if necessary, it can be finished by electrolytic degreasing. The soft metal to be plated can be used without particular limitation as long as it can push in the superabrasive grains. As the soft metal, a metal having a relatively low hardness and an appropriate ductility can be preferably used, and examples of such a soft metal include copper, tin, lead, and solder (lead-tin). Can be mentioned. The method of forming the soft plating layer on the wire surface is not particularly limited, for example, by forming a soft plating layer on the wire surface by connecting the cathode to the wire and connecting the anode to the plating solution and performing electroplating. can do. The thickness of the soft plating layer is preferably 20 to 50% of the particle size of the superabrasive grains used. In the method of the present invention, one layer of superabrasive particles is temporarily fixed by electroplating on the soft plating layer formed on the surface of the wire.
There is no particular limitation on the method of temporarily fixing the superabrasive grains by electroplating, for example, immersing the wire having the soft plating layer in the plating bath containing the superabrasive grains, connecting the cathode to the wire, and plating. By connecting the anode to the solution and performing electroplating by appropriately selecting the current density and plating time,
One layer of superabrasive particles can be temporarily fixed. Either soft metal or hard metal can be used for current plating for temporary fixing of superabrasive grains, but it is preferable to use hard metal.
【０００６】本発明方法においては、超砥粒を一層分仮
固定したワイヤーを超硬質ダイスを通過させることがで
きる。円形の孔を有する超硬質ダイスを通過させること
により、ワイヤーに安定して仮固定されていない超砥粒
の浮き石は脱落し、安定して仮固定されている超砥粒は
軟質メッキ層に押し込まれ、超砥粒の内端は軟質メッキ
層内に位置し、超砥粒の外端は超硬質ダイスの孔径とほ
ぼ等しい直径を有する円筒面上に位置する状態となる。
本発明方法においては、超硬質ダイスの通過を超砥粒の
仮固定後に行うことができ、硬質金属の電気メッキ後に
行うことができ、あるいは、仮固定後及び硬質金属の電
気メッキ後に２回行うことができる。本発明方法におい
ては、超砥粒を仮固定し、あるいは、超砥粒を仮固定し
たのち超硬質ダイスを通過させたワイヤーに、さらに硬
質金属を電気メッキして硬質メッキ層を形成し、超砥粒
をワイヤーに固着する。電気メッキする硬質金属は、超
砥粒を固着することができるものであれば、特に制限な
く使用することができる。硬質金属としては、硬度が比
較的高く、適度の延性を有する金属を好適に使用するこ
とができ、このような硬質金属としては、例えば、ニッ
ケル、クロムなどを挙げることができる。ワイヤーに陰
極を接続し、メッキ液に陽極を接続して電気メッキを行
うことにより、ワイヤー表面に硬質メッキ層を形成する
ことができる。硬質メッキ層の厚みは、使用する超砥粒
の粒径の２０〜５０％とすることが好ましい。本発明方
法においては、仮固定後にワイヤーを超硬質ダイスに通
過させない場合は、硬質メッキ後にワイヤーを超硬質ダ
イスに通過させる。円形の孔を有する超硬質ダイスを通
過させることにより、ワイヤーに安定して固着されてい
ない超砥粒の浮き石は脱落し、安定して固着されている
超砥粒はメッキ層内へ押し込まれ、超砥粒の内端は軟質
メッキ層内に位置し、超砥粒の外端は超硬質ダイスの孔
径とほぼ等しい直径を有する円筒面上に位置する状態と
なる。本発明方法においては、超硬質ダイスの通過を、
仮固定後及び硬質金属の電気メッキ後の２回行うことが
できる。本発明方法に用いる超硬質ダイスの材料には特
に制限はなく、例えば、超硬合金、ダイヤモンド焼結
体、ダイヤモンド単結晶などで作製されたダイスを用い
ることができる。In the method of the present invention, the wire in which one layer of superabrasive grains is temporarily fixed can be passed through the superhard die. By passing through an ultra-hard die with circular holes, floating stones of superabrasive grains that have not been temporarily fixed to the wire will fall off, and superabrasive grains that have been temporarily fixed to the wire will become a soft plating layer. The inner ends of the superabrasive grains are pushed into the soft plating layer, and the outer ends of the superabrasive grains are located on a cylindrical surface having a diameter substantially equal to the hole diameter of the superhard die.
In the method of the present invention, the passage through the ultra-hard die can be performed after the temporary fixing of the superabrasive grains, after the electroplating of the hard metal, or twice after the temporary fixing and after the electroplating of the hard metal. be able to. In the method of the present invention, the superabrasive grains are temporarily fixed, or, after the superabrasive grains are temporarily fixed, the wire that has passed through the superhard die is further electroplated with a hard metal to form a hard plated layer, Stick the abrasive to the wire. The hard metal to be electroplated can be used without particular limitation as long as it can fix the superabrasive grains. As the hard metal, a metal having a relatively high hardness and an appropriate ductility can be preferably used, and examples of such a hard metal include nickel and chromium. A hard plating layer can be formed on the surface of the wire by connecting the cathode to the wire and connecting the anode to the plating solution and performing electroplating. The thickness of the hard plating layer is preferably 20 to 50% of the particle size of the superabrasive grains used. In the method of the present invention, when the wire is not passed through the super-hard die after the temporary fixing, the wire is passed through the super-hard die after the hard plating. By passing through a super-hard die having a circular hole, the fluff of superabrasive grains that are not stably fixed to the wire falls off, and the superabrasive grains that are stably fixed are pushed into the plating layer. The inner ends of the superabrasive grains are located inside the soft plating layer, and the outer ends of the superabrasive grains are located on a cylindrical surface having a diameter substantially equal to the hole diameter of the superhard die. In the method of the present invention, passing through a super-hard die,
It can be performed twice after the temporary fixing and after the electroplating of the hard metal. The material of the cemented carbide die used in the method of the present invention is not particularly limited, and for example, a die made of cemented carbide, diamond sintered body, diamond single crystal or the like can be used.
【０００７】以下、図面により、本発明方法及び本発明
のワイヤーソーを説明する。図１は、本発明方法の実施
の一態様の工程図である。ワイヤー１がロール２から繰
り出され、アルカリ脱脂槽３で脱脂され、中和槽４で酸
により中和され、水洗槽５で水洗され、銅メッキ槽６で
銅メッキされて軟質の銅メッキ層が形成される。銅メッ
キ層を形成したワイヤーは、超砥粒を添加したニッケル
メッキ槽７で超砥粒を一層分ニッケルメッキにより仮固
定し、さらにニッケルメッキ槽８で硬質のニッケルメッ
キ層を形成して超砥粒を固着したのち、水洗槽９で水洗
し、最後に円形の孔を有する超硬質ダイス１０を通過さ
せ、ワイヤーに安定して固着されていない超砥粒の浮き
石は脱落させ、安定して固着されている超砥粒をメッキ
層内へ押し込み、超砥粒の内端は銅メッキ層内に位置
し、超砥粒の外端は超硬質ダイスの孔径とほぼ等しい直
径を有する円筒面上に位置する状態として、本発明のワ
イヤーソー１１を完成する。ワイヤーソーは、ロール１
２により巻き取る。本工程は、ワイヤーを連続的に移動
することにより連続的に処理することができ、あるい
は、槽間の間隔と浸液部分の長さを調整し、ワイヤーを
間欠的に移動しながら連続的に処理することができる。
図２は、本発明方法の実施の他の態様の工程図である。
ワイヤー１がロール２から繰り出され、アルカリ脱脂槽
３で脱脂され、中和槽４で酸により中和され、水洗槽５
で水洗され、銅メッキ槽６で銅メッキされて軟質の銅メ
ッキ層が形成される。銅メッキ層を形成したワイヤー
は、超砥粒を添加したニッケルメッキ槽７で超砥粒を一
層分ニッケルメッキにより仮固定し、次いで円形の孔を
有する超硬質ダイス１０を通過させ、ワイヤーに安定し
て仮固定されていない超砥粒の浮き石は脱落させ、安定
して仮固定されている超砥粒を銅メッキ層内へ押し込
み、超砥粒の内端は銅メッキ層内に位置し、超砥粒の外
端は超硬質ダイスの孔径とほぼ等しい直径を有する円筒
面上に位置する状態とする。さらに、このワイヤーにニ
ッケルメッキ槽８で硬質のニッケルメッキ層を形成して
超砥粒を固着したのち、水洗槽９で水洗し、本発明のワ
イヤーソー１１を完成する。ワイヤーソーは、ロール１
２により巻き取る。本工程は、ワイヤーを連続的に移動
することにより連続的に処理することができ、あるい
は、槽間の間隔と浸液部分の長さを調整し、ワイヤーを
間欠的に移動しながら連続的に処理することができる。The method of the present invention and the wire saw of the present invention will be described below with reference to the drawings. FIG. 1 is a process chart of an embodiment of the method of the present invention. The wire 1 is fed from the roll 2, degreased in the alkaline degreasing tank 3, neutralized with acid in the neutralization tank 4, washed with water in the washing tank 5, and copper-plated in the copper plating tank 6 to form a soft copper plating layer. It is formed. For a wire having a copper plating layer formed thereon, superabrasive particles are temporarily fixed by nickel plating for one layer in a nickel plating tank 7 containing superabrasive particles, and a hard nickel plating layer is further formed in a nickel plating tank 8 for superabrasive polishing. After fixing the particles, the particles are washed with water in a water washing tank 9, and finally passed through a super-hard die 10 having a circular hole to remove the floating stones of the super-abrasive particles that are not stably fixed to the wire, and to stabilize the particles. The fixed superabrasive grains are pushed into the plating layer, the inner ends of the superabrasive grains are located in the copper plating layer, and the outer ends of the superabrasive grains are on a cylindrical surface having a diameter approximately equal to the hole diameter of the superhard die. Then, the wire saw 11 of the present invention is completed. Wire saw roll 1
Take up with 2. This process can be performed continuously by moving the wire continuously, or by adjusting the distance between the tanks and the length of the immersion liquid, and continuously moving the wire while moving it intermittently. Can be processed.
FIG. 2 is a process drawing of another embodiment of the method of the present invention.
The wire 1 is unwound from the roll 2, degreased in the alkaline degreasing tank 3, neutralized with acid in the neutralization tank 4, and washed in the water tank 5.
Then, it is washed with water and plated with copper in the copper plating tank 6 to form a soft copper plating layer. The wire with the copper plating layer is temporarily fixed by nickel plating for one layer of superabrasive particles in a nickel plating tank 7 containing superabrasive particles, and then passed through a superhard die 10 having circular holes to stabilize the wire. Then, float stones of superabrasive grains that are not temporarily fixed are dropped off, and the superabrasive grains that are temporarily fixed are pushed into the copper plating layer, and the inner ends of the superabrasive grains are located in the copper plating layer. The outer ends of the superabrasive grains are positioned on a cylindrical surface having a diameter substantially equal to the hole diameter of the superhard die. Further, a hard nickel plating layer is formed on this wire in a nickel plating tank 8 to fix superabrasive grains, and then the wire is washed in a water washing tank 9 to complete the wire saw 11 of the present invention. Wire saw roll 1
Take up with 2. This process can be performed continuously by moving the wire continuously, or by adjusting the distance between the tanks and the length of the immersion liquid, and continuously moving the wire while moving it intermittently. Can be processed.
【０００８】図３は、図１の工程において、ニッケルメ
ッキ槽８で硬質のニッケルメッキ層を形成して超砥粒を
固着した状態のワイヤーの軸と直角方向の断面図であ
る。本図に示すように、ワイヤー１の表面が銅メッキ層
１３により被覆され、銅メッキ層がさらにニッケルメッ
キ層１４により被覆され、ニッケルメッキ層に超砥粒１
５が固着されている。超砥粒の中には、ニッケルメッキ
層に固着されず、浮き石１６となっているものも存在す
る。図４は、本発明のワイヤーソーの軸と直角方向の断
面図である。図３の状態のワイヤーを超硬質ダイスを通
過させることにより、ワイヤーに安定して固着されてい
ない超砥粒の浮き石１６は脱落し、安定して固着してい
る超砥粒１５はメッキ層内へ押し込まれ、超砥粒の内端
１７は銅メッキ層内に位置し、超砥粒の外端１８はニッ
ケルメッキ層外に露出して、超硬質ダイスの孔径とほぼ
等しい直径を有する円筒面上に位置する状態となってい
る。本図においては、理解を助けるために超砥粒の外端
が位置する円筒面を破線で示している。図５は、図４に
示す本発明のワイヤーソーの軸方向の断面図である。本
図に示すように、ワイヤー１の表面が銅メッキ層１３に
より被覆され、銅メッキ層がさらにニッケルメッキ層１
４により被覆され、両メッキ層により超砥粒１５が固着
され、超砥粒の内端１７は銅メッキ層内にあり、超砥粒
の外端１８はニッケルメッキ層外に露出して、超硬質ダ
イスの孔径とほぼ等しい直径を有する円筒面上に位置す
る状態となっている。本図においては、理解を助けるた
めに超砥粒の外端が位置する円筒面を破線で示してい
る。本発明のワイヤーソーは、不安定な浮き石となって
いる超砥粒を取り除き、超砥粒を堅固にメッキ層により
保持しているので、切断加工中に超砥粒が脱落して被削
材を傷つけることがない。また、ワイヤーソーの外径が
一定であるので、良好な切断を行うことができ、切断加
工において反りやソーマークなどが生じにくく、切断精
度が向上する。そのため、後工程のラッピングに要する
時間が短く、ラップしろを少なくすることができる。さ
らに、ＩＤブレードによる切断では、インゴットから１
回の切断で１枚のウエハしか得られないが、ワイヤーソ
ーは複数本を平行して使用することにより、同時に複数
枚のウエハの切断が可能である。さらに、水系の研削液
を使用することができるので、被削材の油汚れを生ずる
ことがない。FIG. 3 is a cross-sectional view of the wire in a direction perpendicular to the axis of the wire in the state of forming a hard nickel plating layer in the nickel plating bath 8 and fixing the superabrasive grains in the process of FIG. As shown in the figure, the surface of the wire 1 is coated with a copper plating layer 13, the copper plating layer is further coated with a nickel plating layer 14, and the nickel plating layer is coated with the superabrasive grains 1
5 is fixed. Among the superabrasive grains, there are some that are not fixed to the nickel plating layer and are floating stones 16. FIG. 4 is a sectional view of the wire saw of the present invention in a direction perpendicular to the axis. By passing the wire in the state of FIG. 3 through the ultra-hard die, the floating stones 16 of the superabrasive grains that are not stably fixed to the wire fall off, and the superabrasive grains 15 that are stably fixed are plated layer. The inner end 17 of the superabrasive grain is located inside the copper plating layer, and the outer end 18 of the superabrasive grain is exposed outside the nickel plating layer, and has a diameter substantially equal to the hole diameter of the super hard die. It is located on the surface. In this figure, the cylindrical surface on which the outer end of the superabrasive grain is located is indicated by a broken line for the sake of easy understanding. FIG. 5 is a cross-sectional view in the axial direction of the wire saw of the present invention shown in FIG. As shown in this figure, the surface of the wire 1 is covered with the copper plating layer 13, and the copper plating layer is further coated with the nickel plating layer 1.
4, the superabrasive grains 15 are fixed by both plating layers, the inner ends 17 of the superabrasive grains are in the copper plating layer, and the outer ends 18 of the superabrasive grains are exposed to the outside of the nickel plating layer. It is located on a cylindrical surface having a diameter substantially equal to the hole diameter of the hard die. In this figure, the cylindrical surface on which the outer end of the superabrasive grain is located is indicated by a broken line for the sake of easy understanding. Since the wire saw of the present invention removes the superabrasive grains that are unstable floating stones and firmly holds the superabrasive grains by the plating layer, the superabrasive grains fall off during cutting and are not machined. Does not damage the material. Moreover, since the outer diameter of the wire saw is constant, good cutting can be performed, and warping, saw marks, and the like are less likely to occur during the cutting process, and the cutting accuracy is improved. Therefore, the time required for lapping in the subsequent process is short, and the wrap margin can be reduced. Furthermore, when cutting with an ID blade, 1 from the ingot
Only one wafer can be obtained by cutting once, but by using a plurality of wire saws in parallel, it is possible to simultaneously cut a plurality of wafers. Furthermore, since a water-based grinding fluid can be used, oil stains on the work material do not occur.
【０００９】[0009]
【実施例】以下に、実施例を挙げて本発明をさらに詳細
に説明するが、本発明はこれらの実施例によりなんら限
定されるものではない。 実施例１ 図１に示す工程により、ワイヤーソーを作製した。直径
０.１５mmの長尺のピアノ線を、連続的にアルカリ脱脂
槽、中和槽、水洗槽に浸漬して脱脂処理を行ったのち、
硫酸銅系メッキ槽で厚さ１０μｍの銅メッキを行った。
硫酸銅系メッキ浴の処方は、硫酸銅２００ｇ／リット
ル、硫酸５０ｇ／リットルに少量の応力調整剤及びピッ
ト防止剤を添加したものであり、メッキ条件は、温度５
０℃、電流密度８Ａ／dm2である。その後、水洗槽で水
洗したのち、粒径３０〜４０μｍのダイヤモンド砥粒を
添加したスルファミン酸ニッケル系メッキ槽で、厚さ８
μｍのニッケルメッキを行い、銅メッキ層の上にダイヤ
モンド砥粒を一層分仮固定した。スルファミン酸ニッケ
ル系メッキ浴の処方は、スルファミン酸ニッケル５００
ｇ／リットル、塩化ニッケル１５ｇ／リットル、硼酸４
０ｇ／リットルに少量の応力調整剤及びピット防止剤を
添加したものであり、仮固定のためのメッキ条件は、温
度５０℃、電流密度１０Ａ／dm2である。さらに、次の
スルファミン酸ニッケル系メッキ槽で厚さ１０μｍのニ
ッケルメッキを行い、ダイヤモンド砥粒を埋め込んだ。
スルファミン酸ニッケル系メッキ浴の処方は、スルファ
ミン酸ニッケル５００ｇ／リットル、塩化ニッケル１５
ｇ／リットル、硼酸４０ｇ／リットルに少量の応力調整
剤及びピット防止剤を添加したものであり、メッキ条件
は、温度５０℃、電流密度１０Ａ／dm2である。電着を
完了したワイヤーを、水洗槽で水洗したのち、孔径０.
２５mmのダイヤモンドダイスに通して引き抜き、ワイヤ
ーの表面に直径０.２５mmを超えて不安定に付着してい
るダイヤモンド砥粒の浮き石を脱落させ、安定して固着
しているダイヤモンド砥粒をメッキ層中に押し込んで、
外径寸法が０.２５mmに精度よく仕上げられたダイヤモ
ンドワイヤーソーを得た。EXAMPLES The present invention will be described in more detail with reference to the following Examples, which should not be construed as limiting the present invention. Example 1 A wire saw was produced by the process shown in FIG. After a long piano wire with a diameter of 0.15 mm is continuously immersed in an alkaline degreasing tank, a neutralization tank, and a water washing tank for degreasing treatment,
Copper plating with a thickness of 10 μm was performed in a copper sulfate plating bath.
The copper sulphate-based plating bath is formulated such that copper sulfate 200 g / liter, sulfuric acid 50 g / liter and a small amount of a stress adjusting agent and a pit inhibitor are added, and the plating condition is a temperature of 5
The temperature is 0 ° C. and the current density is 8 A / dm 2 . Then, after washing with water in a washing tank, a nickel sulfamate-based plating tank to which diamond abrasive grains having a particle diameter of 30 to 40 μm was added was used to obtain a thickness of 8
μm nickel plating was performed, and one layer of diamond abrasive grains was temporarily fixed on the copper plating layer. Nickel sulfamate plating bath is formulated with nickel sulfamate 500
g / l, nickel chloride 15g / l, boric acid 4
A small amount of a stress adjusting agent and a pit preventing agent were added to 0 g / liter, and the plating conditions for temporary fixing were a temperature of 50 ° C. and a current density of 10 A / dm 2 . Further, nickel plating with a thickness of 10 μm was performed in the next nickel sulfamate plating bath to embed diamond abrasive grains.
Nickel sulfamate plating bath is formulated with nickel sulfamate 500 g / liter, nickel chloride 15
g / liter, 40 g / liter of boric acid to which a small amount of a stress adjusting agent and a pit inhibitor were added, and the plating conditions were a temperature of 50 ° C. and a current density of 10 A / dm 2 . After the electrodeposited wire is washed with water in a washing tank, the hole diameter is
It is pulled out through a 25 mm diamond die, the floating stones of diamond abrasive grains that are unstablely adhered to the surface of the wire with a diameter of more than 0.25 mm are dropped off, and the diamond abrasive grains that are stably fixed are plated. Push it in,
A diamond wire saw having an outer diameter dimension accurately finished to 0.25 mm was obtained.
【００１０】[0010]
【発明の効果】本発明のワイヤーソーは、不安定な浮き
石となっている超砥粒を取り除き、超砥粒を堅固にメッ
キ層により保持しているので、切断加工中に超砥粒が脱
落して被削材を傷つけることがない。また、ワイヤーソ
ーの外径が一定であるので、良好な切断を行うことがで
き、切断加工において反りやソーマークなどが生じにく
く、切断精度が向上する。EFFECTS OF THE INVENTION The wire saw of the present invention removes superabrasive grains which are unstable floating stones and firmly holds the superabrasive grains by the plating layer. It does not fall off and damage the work material. Moreover, since the outer diameter of the wire saw is constant, good cutting can be performed, and warping, saw marks, and the like are less likely to occur during the cutting process, and the cutting accuracy is improved.
【図１】図１は、本発明方法の実施の一態様の工程図で
ある。FIG. 1 is a process drawing of an embodiment of the method of the present invention.
【図２】図２は、本発明方法の実施の他の態様の工程図
である。FIG. 2 is a process drawing of another embodiment of the method of the present invention.
【図３】図３は、ニッケルメッキ層により超砥粒を固着
したワイヤーの断面図である。FIG. 3 is a cross-sectional view of a wire having superabrasive grains fixed thereto by a nickel plating layer.
【図４】図４は、本発明のワイヤーソーの軸と直角方向
の断面図である。FIG. 4 is a cross-sectional view of the wire saw of the present invention in a direction perpendicular to the axis.
【図５】図５は、本発明のワイヤーソーの軸方向の断面
図である。FIG. 5 is a cross-sectional view in the axial direction of the wire saw of the present invention.
【符号の説明】 １ ワイヤー ２ ロール ３ アルカリ脱脂槽 ４ 中和槽 ５ 水洗槽 ６ 銅メッキ槽 ７ ニッケルメッキ槽 ８ ニッケルメッキ槽 ９ 水洗槽 １０ 超硬質ダイス １１ ワイヤーソー １２ ロール １３ 銅メッキ層 １４ ニッケルメッキ層 １５ 超砥粒 １６ 浮き石 １７ 超砥粒の内端 １８ 超砥粒の外端[Explanation of symbols] 1 wire 2 roll 3 alkaline degreasing tank 4 neutralization tank 5 water washing tank 6 copper plating tank 7 nickel plating tank 8 nickel plating tank 9 water washing tank 10 super hard die 11 wire saw 12 roll 13 copper plating layer 14 nickel Plating layer 15 Super abrasive grain 16 Floating stone 17 Inner edge of super abrasive grain 18 Outer edge of super abrasive grain
Claims (5)
され、軟質メッキ層がさらに硬質メッキ層により被覆さ
れ、両メッキ層により超砥粒が固着されたワイヤーソー
であって、超砥粒の内端が軟質メッキ層内にあり、超砥
粒の外端が硬質メッキ層外に露出して同一の円筒面上に
あることを特徴とするワイヤーソー。1. A wire saw in which the surface of a wire is covered with a soft plating layer, the soft plating layer is further covered with a hard plating layer, and the superabrasive grains are fixed by both plating layers. A wire saw having an end inside the soft plating layer and an outer end of the superabrasive grain exposed on the outside of the hard plating layer and on the same cylindrical surface.
質メッキ層を形成し、次いで超砥粒を電気メッキにより
一層分仮固定し、さらに硬質金属を電気メッキして超砥
粒を固着したのち、超硬質ダイスを通過させることを特
徴とする請求項１記載のワイヤーソーの製造方法。2. A soft metal is plated on the surface of the wire to form a soft plating layer, and then superabrasive grains are temporarily fixed by electroplating for one layer. Further, hard metal is electroplated to fix the superabrasive grains. Then, the method for manufacturing a wire saw according to claim 1, wherein the wire saw is passed through a super-hard die.
質メッキ層を形成し、次いで超砥粒を電気メッキにより
一層分仮固定し、超硬質ダイスを通過させたのち、さら
に硬質金属を電気メッキして超砥粒を固着することを特
徴とする請求項１記載のワイヤーソーの製造方法。3. A soft metal is plated on the surface of the wire to form a soft plated layer, and then superabrasive grains are temporarily fixed by electroplating for one layer and passed through a superhard die. The method of manufacturing a wire saw according to claim 1, wherein the superabrasive grains are fixed by plating.
−錫）メッキ層であり、硬質メッキ層がニッケルメッキ
層である請求項１記載のワイヤーソー。4. The wire saw according to claim 1, wherein the soft plating layer is a copper, tin, lead or solder (lead-tin) plating layer, and the hard plating layer is a nickel plating layer.
錫）であり、硬質金属がニッケルである請求項２又は請
求項３記載のワイヤーソーの製造方法。5. The soft metal is copper, tin, lead or solder (lead-
The method of manufacturing a wire saw according to claim 2 or 3, wherein the hard metal is nickel and the hard metal is nickel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7330999A JPH09150314A (en) | 1995-11-27 | 1995-11-27 | Wire saw and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7330999A JPH09150314A (en) | 1995-11-27 | 1995-11-27 | Wire saw and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09150314A true JPH09150314A (en) | 1997-06-10 |
Family
ID=18238707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7330999A Pending JPH09150314A (en) | 1995-11-27 | 1995-11-27 | Wire saw and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09150314A (en) |
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