CN100371117C - Apparatus for preparing stainless steel cutting line by composite electric spraying apparatus and method thereof - Google Patents
Apparatus for preparing stainless steel cutting line by composite electric spraying apparatus and method thereof Download PDFInfo
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- CN100371117C CN100371117C CNB2004100206180A CN200410020618A CN100371117C CN 100371117 C CN100371117 C CN 100371117C CN B2004100206180 A CNB2004100206180 A CN B2004100206180A CN 200410020618 A CN200410020618 A CN 200410020618A CN 100371117 C CN100371117 C CN 100371117C
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Abstract
The present invention relates to a device and a method thereof for producing a diamond cutting wire for cutting crystals. The device comprises a pulse power source, an electroplating brush, a magnetic circulating pump, a plating solution concentration balancing tank, an air compressor and a wire unfolding and folding roller. The method comprises cleanness of stainless steel wires, heat treatment, cleaning, composite electrospraying, detection, heat treatment, cleaning, check and package. The present invention has the advantages of automatic production line, adjustable length of the prepared cutting wire, good abrasion resistance of the diamond wire, high tensile strength, falling prevention of diamonds, low production cost and simple technology. The diamond wire prepared by the present invention can be used for cutting semiconductors, light pressure crystals, ceramics, etc.
Description
Technical field:
The present invention relates to a kind of devices and methods therefor of producing sliced crystal with the diamond cut line.
Background technology:
Semiconductor crystal, as monocrystalline silicon, monocrystalline germanium, GaAs and photoelectric crystal, as lithium niobate, quartz, growth diameter continues to increase, and how efficient low-consume ground cuts these crisp and valuable crystal, becomes a vital problem in the crystal processing.
Traditional sliced crystal method is to adopt the diamond inner circle saw blade.This method can only the monolithic cutting diameter less than 6 inches crystal, and saw blade is thicker, the big efficient of crystal loss is low.Development abroad goes out the multitool wire cutting machine in recent years, adopts the level and smooth high-strength steel silk thread of reciprocating 0.15～0.3mm diameter to add abrasive materials such as S:C, with the crystal grinding and cutting.Though this kind method can be cut the wafer more than 6 inches, equipment cost is higher, and the wafer face type instability after the cutting, and a large amount of waste liq abrasive materials also cause environmental pollution.
And adopt the line of cut that has diamond coatings of 0.15～0.3mm, and replace level and smooth light, avoid using the liquid abrasive material further to improve cutting efficiency, reduce cutting cost is the research and development target of crystal processing industry always.This requirement has the wire of diamond coatings, and continuous length reaches at least 20 meters long, and it is long generally should to reach 6 myriametres.And coating is firm, and the fine wire rod that the line footpath evenly forms a kind of diamond and metallic composite has higher wearability and corrosion stability, and line of cut generally has higher stretching and bending strength.
United States Patent (USP) 4485757 once proposed a kind of technology for preparing continuous diamond wire with the roll extrusion mode.But the diamond coatings diameter uniform thickness of this kind technology preparation and line footpath are inhomogeneous, are difficult to produce greater than 120 meters long diamond wires, can't cutting diameter greater than 6 " crystal.
The inventor once proposed to adopt the patent application (number of patent application is 03133434.2) of pressing method processing diamond cut line, used through reality and had received effect preferably.A kind of can the boosting productivity but electric metallikon still be can yet be regarded as solves the caducous good method of diamond.Overcome the defectives such as technology cost height that this kind method exists, just the problem to be solved in the present invention.
Summary of the invention:
The object of the present invention is to provide a kind of, utilize compound EFI coating technology to produce the method and the isolated plant thereof of stainless steel diamond cut line, make it to reach the complex art characteristics of utilizing spray, plating, realize that the diamond adhesion property is strong and simplify the goal of the invention of technology.
The objective of the invention is to be achieved through the following technical solutions:
Compound EFI plating legal system is equipped with the device of stainless steel diamond cut line, includes the pulse power, plating pen, magnetic force circulating pump, bath concentration counterbalance cell, air compressor, and unwrapping wire, take-up roller composition.
Its plating bath is prepared by following volumetric ratio: nickelous sulfate 100-200 grams per liter, nickel chloride 5-20 grams per liter, sodium hypophosphite 20-30 grams per liter, sodium sulphate 20-50 grams per liter, sodium acetate 10-20 grams per liter, natrium citricum 3-10 grams per liter, lactic acid 60-80 grams per liter, plumbi nitras 0-0.005 grams per liter, bortz powder hybrid particles 5-100 μ m20-100 grams per liter.Preparation back pH value is 1.5～6, and the liquid temperature is between 70～90 ℃.
Technical process is: stainless steel wire cleans, and---heat treatment---is cleaned---compound EFI plating---detection---heat treatment---cleaning---check---packing.
Advantage of the present invention and good effect are:
The production diamond cut Wiring technology that the present invention proposes and the method for device can form automatic production line, preparation line of cut adjustable length, and the diamond wire wear resistence is good, the hot strength height, the diamond difficult drop-off, production cost is low, and technology is simple.The diamond wire that uses the present invention to prepare can pass through materials such as any wire cutting machine cutting semiconductor, optical pressure crystal, pottery.
Description of drawings:
Accompanying drawing is a preparation diamond cut Wiring technology flow chart of the present invention.
The specific embodiment:
Its preparation principle is: compound EFI coating technology is an important branch in the electroplating technology.Except the common feature that plating is arranged, on the basis that guarantees the coating quality, more emphasize the deposition rapidly and efficiently of coating.The basic process of compound EFI plating be the plating pen (anode) with extraordinary plating bath be fitted in workpiece (negative electrode) plated the position and the formation coating that does relative motion, compound EFI plating power supply is serially connected with between the two poles of the earth.In order stably to provide enough by the plating ion to the surface of the work liquid layer, the compound EFI plating direct pumping of plating bath of high concentration or natural back flow are between the anode and cathode.In the plating bath of high concentration, be mixed with the bortz powder of 5-100 μ m, and make itself and base metal codeposition on base material, form composite deposite.
Embodiment one:
Get 100 kilograms/kilolitre of nickelous sulfate, 5 kilograms/kilolitre of nickel chloride, 20 kilograms/kilolitre of sodium hypophosphite, 20 kilograms/kilolitre of sodium sulphate, 10 kilograms/kilolitre of sodium acetate, 3 kilograms/kilolitre of natrium citricum, 60 kilograms/kilolitre of lactic acid, 20 kilograms/kilolitre of bortz powder hybrid particles 5-100 μ m.Above-mentioned dosing pH value is between 1.5～6, and the control temperature is between 70～90 ℃, and is standby.
Stainless steel wire (is generally carried out oil removing, removal of impurity cleaning 0.1～1mm), 200～500 ℃ of temperature heat treatments about following half an hour, and then carries out removal of impurity clear water and clean.To wind the line by anode and cathode plating bath pond when carrying out the EFI plating, 5～30 meters/minute of relative motions are carried out coating then and are detected, and generally control thickness of coating and get final product between 5～80 μ m.Heat-treat again after the detection about 200-500 ℃ of half an hour, carry out removal of impurity clear water again and clean, through packing after the assay was approved.Whole process of production all is to work continuously, and certified products are baling, again according to the needs size of cutting machine, cuts and gets final product with length.
The output voltage that should control its pulse power in the production is that the 0-30 volt is adjustable, and the rated current of brushing plating pen is that 0-100A is adjustable, solution feed pump 0-10 liter/minute, its anode can adopt graphite or platinum-iridium alloy.
Embodiment two:
Get 150 kilograms/kilolitre of nickelous sulfate, 17.5 kilograms/kilolitre of nickel chloride, 25 kilograms/kilolitre of sodium hypophosphite, 35 kilograms/kilolitre of sodium sulphate, 15 kilograms/kilolitre of sodium acetate, 6.5 kilograms/kilolitre of natrium citricum, 70 kilograms/kilolitre of lactic acid, 0.0025 kilogram/kilolitre of plumbi nitras, 60 kilograms/kilolitre of bortz powder hybrid particles 5-100 μ m.Above-mentioned dosing pH value is between 1.5～6, and the control temperature is between 70～90 ℃, and is standby.
Stainless steel wire (is generally carried out oil removing, removal of impurity cleaning 0.1～1mm), 200～500 ℃ of temperature heat treatments about following half an hour, and then carries out removal of impurity clear water and clean.To wind the line by anode and cathode plating bath pond when carrying out the EFI plating, 5～30 meters/minute of relative motions are carried out coating then and are detected, and generally control thickness of coating and get final product between 5～80 μ m.Heat-treat again after the detection about 200-500 ℃ of half an hour, carry out removal of impurity clear water again and clean, through packing after the assay was approved.Whole process of production all is to work continuously, and certified products are baling, again according to the needs size of cutting machine, cuts and gets final product with length.
The output voltage that should control its pulse power in the production is that the 0-30 volt is adjustable, and the rated current of brushing plating pen is that 0-100A is adjustable, solution feed pump 0-10 liter/minute, its anode can adopt graphite or platinum-iridium alloy.
Embodiment three:
Get 200 kilograms/kilolitre of nickelous sulfate, 20 kilograms/kilolitre of nickel chloride, 30 kilograms/kilolitre of sodium hypophosphite, 50 kilograms/kilolitre of sodium sulphate, 20 kilograms/kilolitre of sodium acetate, 10 kilograms/kilolitre of natrium citricum, 80 kilograms/kilolitre of lactic acid, 0.005 kilogram/kilolitre of plumbi nitras, 100 kilograms/kilolitre of bortz powder hybrid particles 5-100 μ m, transfer between the pH value 1.5～6, the control temperature is between 70～90 ℃, and is standby.
Stainless steel wire (is generally carried out oil removing, the removal of impurity, cleaning 0.1～1mm), 200～500 ℃ of temperature heat treatments about following half an hour, and then carries out removal of impurity clear water and clean.To wind the line by anode and cathode plating bath pond when carrying out the EFI plating, 5～30 meters/minute of relative motions are carried out coating then and are detected, and generally control thickness of coating and get final product between 5～80 μ m.Heat-treat again after the detection about 200-500 ℃ of half an hour, carry out removal of impurity clear water again and clean, through packing after the assay was approved.Whole process of production all is to work continuously, and certified products are baling, again according to the needs size of cutting machine, cuts and gets final product with length.
The output voltage that should control its pulse power in the production is that the 0-30 volt is adjustable, and the rated current of brushing plating pen is that 0-100A is adjustable, solution feed pump 0-10 liter/minute, its anode can adopt graphite or platinum-iridium alloy.
If can choose particle when choosing the stainless steel wire of diameter 0.1mm during preparation and be the diamond particles about 5 μ m, if can choose diamond particles about 100 μ m when choosing the 1mm line.
With the stainless steel cut line that the present invention produces, its cutting life-span can reach more than 4 hours.
Claims (1)
1. compound EFI plating legal system is equipped with the method for stainless steel diamond cut line, it is characterized in that:
A. plating bath is prepared by following volumetric ratio: nickelous sulfate 100-200 grams per liter, nickel chloride 5-20 grams per liter, sodium hypophosphite 20-30 grams per liter, sodium sulphate 20-50 grams per liter, sodium acetate 10-20 grams per liter, natrium citricum 3-10 grams per liter, lactic acid 60-80 grams per liter, plumbi nitras 0-0.005 grams per liter, bortz powder hybrid particles 5-100 μ m 20-100 grams per liter; Preparation back pH value is 1.5～6, and the liquid temperature is between 70～90 ℃;
B. technical process is: stainless steel wire cleans, and---heat treatment---is cleaned---compound EFI plating---detection---heat treatment---cleaning---check---packing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100206180A CN100371117C (en) | 2004-05-27 | 2004-05-27 | Apparatus for preparing stainless steel cutting line by composite electric spraying apparatus and method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100206180A CN100371117C (en) | 2004-05-27 | 2004-05-27 | Apparatus for preparing stainless steel cutting line by composite electric spraying apparatus and method thereof |
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| CN1583336A CN1583336A (en) | 2005-02-23 |
| CN100371117C true CN100371117C (en) | 2008-02-27 |
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| CNB2004100206180A Expired - Fee Related CN100371117C (en) | 2004-05-27 | 2004-05-27 | Apparatus for preparing stainless steel cutting line by composite electric spraying apparatus and method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102352523A (en) * | 2011-11-09 | 2012-02-15 | 长沙岱勒新材料科技有限公司 | Heat treatment method for electroplated diamond wire saw |
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| JP5412320B2 (en) * | 2009-05-26 | 2014-02-12 | 株式会社コベルコ科研 | Coated saw wire |
| WO2011020105A2 (en) | 2009-08-14 | 2011-02-17 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
| JP5537660B2 (en) | 2009-08-14 | 2014-07-02 | サンーゴバン アブレイシブズ，インコーポレイティド | Abrasive article comprising abrasive particles bonded to an elongated object and method of forming the abrasive article |
| TW201507812A (en) | 2010-12-30 | 2015-03-01 | Saint Gobain Abrasives Inc | Abrasive article and method of forming |
| KR101902754B1 (en) * | 2011-03-15 | 2018-10-01 | 가부시키가이샤 나카무라초코 | Method and device for manufacturing saw wire |
| BR112014006126A2 (en) | 2011-09-16 | 2017-04-11 | Saint Gobain Abrasifs Sa | abrasive article and forming method |
| EP2760638A4 (en) | 2011-09-29 | 2015-05-27 | Saint Gobain Abrasives Inc | Abrasive articles including abrasive particles bonded to an elongated substrate body having a barrier layer, and methods of forming thereof |
| CN102586844B (en) * | 2012-03-28 | 2014-06-18 | 中原工学院 | Sand charging groove for manufacturing electroplated diamond fretsaw |
| TWI477343B (en) | 2012-06-29 | 2015-03-21 | Saint Gobain Abrasives Inc | Abrasive article and method of forming |
| TW201402274A (en) | 2012-06-29 | 2014-01-16 | Saint Gobain Abrasives Inc | Abrasive article and method of forming |
| TWI474889B (en) | 2012-06-29 | 2015-03-01 | Saint Gobain Abrasives Inc | Abrasive article and method of forming |
| TW201404527A (en) | 2012-06-29 | 2014-02-01 | Saint Gobain Abrasives Inc | Abrasive article and method of forming |
| TW201441355A (en) | 2013-04-19 | 2014-11-01 | Saint Gobain Abrasives Inc | Abrasive article and method of forming |
| TWI621505B (en) | 2015-06-29 | 2018-04-21 | 聖高拜磨料有限公司 | Abrasive article and method of forming |
| CN113638030B (en) * | 2021-08-16 | 2023-04-07 | 厦门理工学院 | Manufacturing equipment and manufacturing method of ultrathin cutting blade |
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|---|---|---|---|---|
| US4485757A (en) * | 1981-11-28 | 1984-12-04 | Caspar O. H. Messner | Process and apparatus for applying relatively hard particles to a circular wire-like form or a wire-like form without longitudinal edges, as well as wire-shaped saw |
| JPH07227767A (en) * | 1994-02-15 | 1995-08-29 | Shibuya Kogyo Co Ltd | Manufacture of abrasive-coated wire tool |
| JPH09150314A (en) * | 1995-11-27 | 1997-06-10 | Asahi Daiyamondo Kogyo Kk | Wire saw and manufacture thereof |
| JPH10337612A (en) * | 1997-06-04 | 1998-12-22 | Hitachi Cable Ltd | Manufacture of abrasive grain-equipped saw wire |
| CN1300883A (en) * | 2000-11-22 | 2001-06-27 | 张绍和 | Application and technology for pulsive electroplating |
| CN1456410A (en) * | 2003-06-12 | 2003-11-19 | 江晓平 | Process and apparatus for producing highly wear resistant diamond cutting wires |
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2004
- 2004-05-27 CN CNB2004100206180A patent/CN100371117C/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4485757A (en) * | 1981-11-28 | 1984-12-04 | Caspar O. H. Messner | Process and apparatus for applying relatively hard particles to a circular wire-like form or a wire-like form without longitudinal edges, as well as wire-shaped saw |
| JPH07227767A (en) * | 1994-02-15 | 1995-08-29 | Shibuya Kogyo Co Ltd | Manufacture of abrasive-coated wire tool |
| JPH09150314A (en) * | 1995-11-27 | 1997-06-10 | Asahi Daiyamondo Kogyo Kk | Wire saw and manufacture thereof |
| JPH10337612A (en) * | 1997-06-04 | 1998-12-22 | Hitachi Cable Ltd | Manufacture of abrasive grain-equipped saw wire |
| CN1300883A (en) * | 2000-11-22 | 2001-06-27 | 张绍和 | Application and technology for pulsive electroplating |
| CN1456410A (en) * | 2003-06-12 | 2003-11-19 | 江晓平 | Process and apparatus for producing highly wear resistant diamond cutting wires |
Non-Patent Citations (1)
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| 电镀金钢石线切工具高速生产. 千叶康雅等.超硬材料与宝石（特辑），第15卷第4期. 2003 * |
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|---|---|---|---|---|
| CN102352523A (en) * | 2011-11-09 | 2012-02-15 | 长沙岱勒新材料科技有限公司 | Heat treatment method for electroplated diamond wire saw |
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| CN1583336A (en) | 2005-02-23 |
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Owner name: SHENYANG KEJING AUTOMATIC EQUIPMENT CO., LTD. Free format text: FORMER NAME OR ADDRESS: JINGTONG DIAMOND COMPOSITE MATERIALS CO., LTD., SHENYANG CITY |
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Address after: Liaoning Province, Shenyang Hunnan Feiyun Road No. 18 Patentee after: Shenyang Kejing Automatic Equipment Co., Ltd. Address before: Liaoning province Shenyang City Hunnan Industrial Zone in Shenyang hi tech Industrial Development Zone, No. 29 Liaoning Road, overseas students entrepreneurship Park H block Patentee before: Jingtong Diamond Composite Materials Co., Ltd., Shenyang City |
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Granted publication date: 20080227 |