CN110076705A - Buddha's warrior attendant Wiring technology is electroplated in sand on a kind of naked powder - Google Patents
Buddha's warrior attendant Wiring technology is electroplated in sand on a kind of naked powder Download PDFInfo
- Publication number
- CN110076705A CN110076705A CN201910119747.1A CN201910119747A CN110076705A CN 110076705 A CN110076705 A CN 110076705A CN 201910119747 A CN201910119747 A CN 201910119747A CN 110076705 A CN110076705 A CN 110076705A
- Authority
- CN
- China
- Prior art keywords
- diamond
- nickel
- sand
- naked
- buddha
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000843 powder Substances 0.000 title claims abstract description 40
- 239000004576 sand Substances 0.000 title claims abstract description 36
- 238000005516 engineering process Methods 0.000 title claims abstract description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 125
- 239000010432 diamond Substances 0.000 claims abstract description 89
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 88
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 65
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 46
- 239000010959 steel Substances 0.000 claims abstract description 46
- 238000007747 plating Methods 0.000 claims abstract description 44
- 238000005520 cutting process Methods 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 17
- 230000008569 process Effects 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 28
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 13
- 239000004327 boric acid Substances 0.000 claims description 13
- 238000004140 cleaning Methods 0.000 claims description 13
- DITXJPASYXFQAS-UHFFFAOYSA-N nickel;sulfamic acid Chemical compound [Ni].NS(O)(=O)=O DITXJPASYXFQAS-UHFFFAOYSA-N 0.000 claims description 13
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 12
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 12
- 238000005406 washing Methods 0.000 claims description 12
- 239000003093 cationic surfactant Substances 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000009826 distribution Methods 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 6
- 102220043159 rs587780996 Human genes 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 238000006073 displacement reaction Methods 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- 238000004804 winding Methods 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 239000013078 crystal Substances 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 239000006061 abrasive grain Substances 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 230000004913 activation Effects 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000003717 electrochemical co-deposition Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 claims description 3
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 2
- 239000005864 Sulphur Substances 0.000 claims description 2
- 238000009472 formulation Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 230000003213 activating effect Effects 0.000 claims 1
- 125000002091 cationic group Chemical group 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 4
- 239000011574 phosphorus Substances 0.000 abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 2
- 238000005253 cladding Methods 0.000 abstract description 2
- 238000005530 etching Methods 0.000 abstract description 2
- 239000012535 impurity Substances 0.000 abstract description 2
- 239000011863 silicon-based powder Substances 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract description 2
- 239000002351 wastewater Substances 0.000 abstract description 2
- 230000005518 electrochemistry Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910000677 High-carbon steel Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-N sulfonic acid Chemical compound OS(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
Abstract
The present invention relates to plating Buddha's warrior attendant line technology field, Buddha's warrior attendant Wiring technology is electroplated in sand on especially a kind of naked powder；Naked diamond is cleaned and is chemically treated, its surface is made to be attached to high density positive charge, treated naked diamond is deposited on steel wire surface in upper sand launder, and finished product plating diamond wire is made in electrochemistry consolidated diamond；Compared with common diamond wire, the diamond that this diamond wire uses does not have nickel preplating, and (nickel preplating can generate a large amount of nickel and phosphorus waste water, pollute environment), reduce the pollution of nickel and phosphorus, this diamond wire uses naked diamond, has lacked the process of chemical nickel plating, and diamond cost reduces by 40%, naked sand plating diamond wire surface diamond does not have the cladding of nickel layer, and cutting power is stronger；It is not easy to be stained with the impurity such as nickel or silicon powder in cutting process, cutting later period cutting force will not be impacted, and the etching problem of nickel layer is not present in the diamond that naked sand plating diamond wire uses in the plating solution, does not need to carry out sand the processing such as strip, reduces artificial and processing cost.
Description
Technical field
The present invention relates to plating Buddha's warrior attendant line technology field, Buddha's warrior attendant Wiring technology is electroplated in sand on especially a kind of naked powder.
Background technique
Electroplated diamond line is, by electro-deposition, diamond abrasive to be fixedly arranged at using plating metal nickel as bonding agent at present
Manufactured a kind of linear cutting tool on high-carbon steel wire, referred to as " scroll saw ".Plating Buddha's warrior attendant wire cutting is high-efficient, stability is good,
Cutting surfaces are quality, are widely used in the nonmetallic hard brittle material such as crystal, sapphire, magnetic material, especially silicon materials
Cutting.
Since diamond is non-conductive, it is therefore desirable to make its conduction in one layer of metal nickel layer of diamond surface preplating, that is, have
The diamond 4 of nickel coating, as shown in Fig. 1 .1, Fig. 1 .2, in this way could composite electroplating to one layer of preplating nickel coating 2 of preplating core wire
On steel wire 1, redeposited one layer of metal nickel layer 3 is fixedly arranged at it on steel wire after upper sand, therefore diamond wire surface Buddha's warrior attendant is electroplated in finished product
There is one layer of certain thickness nickel metal layer on the top of stone, increases the outer diameter of steel wire, and powder can be worn into cutting process
It is sticked to diamond wire surface, weakens its cutting force.
Summary of the invention
The purpose of the present invention is: overcome deficiency in the prior art, sand plating Buddha's warrior attendant Wiring technology on a kind of naked powder is provided, it should
The plating Buddha's warrior attendant wire cutting power of technique production is strong, production cost is low.
In order to solve the above technical problems, The technical solution adopted by the invention is as follows:
Buddha's warrior attendant Wiring technology is electroplated in sand on a kind of naked powder, the technique the following steps are included:
(1) surface treatment of diamond: selecting the bortz powder of D50=8.5,
A) cleaning 10min, Zhi Houshui are carried out to bortz powder using the NaOH solution that concentration is 40 ± 5g/L, temperature is 50 DEG C
It washes；
B) it uses and cleaning 10min, Zhi Houshui is carried out to bortz powder under the sulfamic acid solution room temperature that concentration is 40 ± 5g/L
It washes；
C) bortz powder after cleaning is put into beaker, and cationic surfactant A is added, and temperature is 55 ± 5 DEG C, stirring
20min, washing is clean later, and dries at 80 DEG C；
D) bortz powder after previous step drying is put into beaker, and cationic surfactant B is added, and temperature is 55 ± 5 DEG C,
20min is stirred, washing is clean later, and is dried for standby at 80 DEG C；
(2) steel wire surface cleans: steel wire successively passes through 60 ± 5 DEG C of alkaline defatting agent solution, washing water, 40 ± 5 DEG C of 10% sulphur
Acid solution and washing water process, obtain the core wire of surface cleaning；
(3) surface preparation: the core wire steel wire that surface has cleaned up deposits one layer of binding force on surface by electro-nickel process
Nickel layer medium high, crystal grain is careful, the nickel layer medium with a thickness of 0.1-0.5 μm, pass through and adjust metal steel wire linear velocity, plating
Nickel solution formula, electric current, pH value, temperature adjust the crystallite dimension and film thickness distribution of nickel coating；
(4) diamond adheres to: diamond particle being attached to metal steel wire surface by electrochemical co-deposition technology, passes through adjusting
Metal steel wire linear velocity, nickel plating solution formula, electric current, bortz powder concentration, pH value, bortz powder degree of surface activation, temperature,
Mixing speed adjusts the density and distribution of diamond abrasive grain；
(5) diamond consolidates: the metal steel wire for being attached with diamond particle is connected into DC power supply cathode and passes through nickel plating solution,
Metal steel wire surface deposited nickel layer consolidates diamond particle after applying electric current, big by adjusting metal steel wire linear velocity and electric current
Small to adjust diamond length of embedment, the diamond of same length of embedment is controlled by adjusting the formula of nickel plating solution goes out cutting edge of a knife or a sword
Highly；
(6) dry: metal steel wire is dried by air blowing and heating device；
(7) complete monitoring Quality Detection: is carried out to product quality by online Quality Detection instrument；
(8) take-up: gained electroplating diamond wire saw is wound in formulation I-beam wheel and is got product with defined tension, winding displacement spacing
Diamond wire.
Further, the gauge of wire is 55-170 μm.
Further, the diamond partial size D50 is 8.0-35 μm.
Further, the concentration of the cationic surfactant A and cationic surfactant B is 1g/L.
Further, the electro-nickel process of surface preparation is specific as follows in the step (3): the speed of metallic steel silk thread
For 20-50m/min, the formula of nickel plating solution is nickel sulfamic acid, 40 ± 5g/L boric acid and the 10 ± 2g/L chlorine of 120 ± 20g/L
Change nickel, pH value 3.2-4.2, temperature are 55 ± 5 DEG C.
Further, in the step (4) metallic steel silk thread speed 20-50m/min, nickel plating solution formula be 100 ±
Nickel sulfamic acid, 40 ± 5g/L boric acid, the 10 ± 2g/L nickel chloride of 20g/L；Bortz powder concentration is 0.5-5g/ml, pH value is
3.8-5.0, temperature are 55 ± 5 DEG C, mixing speed is 50-120 r/min.
Further, the speed of step (5) the metallic steel silk thread is 20-50m/min, and the length of embedment of diamond is 3-
5 μm, by adjusting nickel sulfamic acid, 40 ± 5g/L boric acid and the 10 ± 2g/L chlorination that nickel plating solution formula is 100 ± 20g/L
The cutting edge of a knife or a sword height that goes out of nickel, the diamond of same length of embedment is 3-6 μm.
Further, the tension in the step (8) is 5-10N, winding displacement spacing is 0.2-0.6mm.
It is using the beneficial effect of technical solution of the present invention:
1. the diamond that this diamond wire uses does not have nickel preplating, and (nickel preplating can generate a large amount of nickel and phosphorus compared with common diamond wire
Waste water pollutes environment), reduce the pollution of nickel and phosphorus.
2. this diamond wire uses naked diamond, than the process that nickel preplating diamond reduces chemical nickel plating, diamond cost
Reduce by 40%.
3. naked sand plating diamond wire reduces 3%-10% than Common platings Buddha's warrior attendant linear diameter, client's material caused by linear slit is damaged
1%-5% is lacked in depletion, and consumer product rate increases 1%-5%.
4. naked sand plating diamond wire distribution of particles is more uniform, diamond is not reunited, and line footpath is more stable, is cut into
Product surface quality it is more preferable.
5. naked sand plating diamond wire surface diamond does not have the cladding of nickel layer, cutting power is stronger；In cutting process not
The impurity such as upper nickel or silicon powder easy to stick, cutting later period cutting force will not be impacted.
6. the etching problem of nickel layer is not present in the diamond that naked sand plating diamond wire uses in the plating solution, do not need to sand
The processing such as strip is carried out, artificial and processing cost is reduced.
Detailed description of the invention
Fig. 1 .1 is the side structure schematic diagram that diamond wire is electroplated in plating sand；
Fig. 1 .2 is the diagrammatic cross-section that diamond wire is electroplated in plating sand；
Fig. 2 is that diamond wire surface SEM figure is electroplated in plating sand；
Fig. 3 is the process flow chart that diamond wire is electroplated in naked sand；
Fig. 4 .1 is the side structure schematic diagram that diamond wire is electroplated in naked sand；
Fig. 4 .2 is the diagrammatic cross-section that diamond wire is electroplated in naked sand；
The naked sand plating diamond wire surface SEM figure of Fig. 5.
In figure: 1 steel wire, 2 preplating nickel coatings, 3 metal nickel layers, 4 have the diamond of nickel coating, 5 diamonds.
Specific embodiment
The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
Embodiment 1
Diamond wire surface SEM figure is electroplated in Fig. 2 plating sand；
The process flow chart of the naked sand plating diamond wire of Fig. 3；
Fig. 4 .1 is the side structure schematic diagram that diamond wire is electroplated in naked sand；
Fig. 4 .2 is the diagrammatic cross-section that diamond wire is electroplated in naked sand；
The naked sand plating diamond wire surface SEM figure of Fig. 5.
It was produced with method of the invention using the diamond production plating diamond wire of 65um steel wire cooperation D50=8.5um
Journey is as follows:
(1) surface treatment of diamond 5: selecting the bortz powder of D50=8.5,
A) cleaning 10min, Zhi Houshui are carried out to bortz powder using the NaOH solution that concentration is 40 ± 5g/L, temperature is 50 DEG C
It washes；
B) it using cleaning 10min is carried out to bortz powder under the sulfamic acid solution room temperature that concentration is 40 ± 5g/L, washes later；
C) bortz powder after cleaning is put into beaker, and using the cationic surfactant A of 1g/L, temperature is 55 ± 5 DEG C, is stirred
20min is mixed, washing is clean later, and dries at 80 DEG C, and cationic surfactant A is quaternaries cation surface active
Agent；
D) bortz powder after previous step drying is put into beaker, uses the cationic surfactant B of 1g/L, temperature 55
± 5 DEG C, stir 20min, washing is clean later, and is dried for standby at 80 DEG C, cationic surfactant B be quaternary ammonium salt sun from
Sub- surfactant；
(2) 1 surface cleaning of steel wire: steel wire 1 successively passes through 60 ± 5 DEG C of alkaline defatting agent solution, washing water, the 10% of 40 ± 5 DEG C
Sulfuric acid solution and washing water process, obtain the core wire of surface cleaning；
(3) surface preparation: the core wire steel wire 1 that surface has cleaned up deposits one layer of binding force on surface by electro-nickel process
0.1-0.5 μm of nickel layer medium (i.e. preplating nickel coating 2) high, crystal grain is careful, by adjusting metal steel wire linear velocity 20-50m/
Min, nickel plating solution are formulated the nickel sulfamic acid of 120 ± 20g/L, 40 ± 5g/L boric acid, 10 ± 2g/L nickel chloride, electric current 0.5-
1.5A, pH value 3.2-4.2, the parameters such as 55 ± 5 DEG C of temperature adjust the crystallite dimension and film thickness distribution of nickel coating；Preferably nickel
0.3 μm of medium of layer, by adjusting the nickel sulfamic acid of metal steel wire linear velocity 40m/min, solution formula 120g/L, 40g/L boron
Acid, 10g/L nickel chloride, electric current 1A, pH value 4,55 ± 5 DEG C of temperature；
(4) diamond 5 adheres to: 5 particle of diamond being attached to metal steel wire surface by electrochemical co-deposition technology, passes through tune
The nickel sulfamic acid of section metal steel wire linear velocity 20-50m/min, 100 ± 20g/L of nickel plating solution formula, 40 ± 5g/L boric acid, 10
± 2g/L nickel chloride, electric current 2-6A, bortz powder concentration 0.5-5g/ml, pH value 3.8-5.0, bortz powder degree of surface activation,
55 ± 5 DEG C of temperature stirs the parameters such as 50-120 r/min to adjust the density and distribution of diamond abrasive grain；Preferably metallic steel
The nickel sulfamic acid of silk thread speed 40m/min, solution formula 100g/L, 40g/L boric acid, 10g/L nickel chloride, electric current 5A, Buddha's warrior attendant
Mountain flour concentration 4g/ml, pH value 4.0,55 ± 5 DEG C of temperature, 100 r/min of stirring etc.
(5) diamond 5 consolidate: will be attached with 5 particle of diamond metal steel wire connect DC power supply cathode and by nickel plating it is molten
The nickel sulfamic acid of 100 ± 20g/L of liquid, 40 ± 5g/L boric acid, 10 ± 2g/L nickel chloride apply metal steel wire surface after electric current
Deposited nickel layer consolidates 5 particle of diamond, adjusts gold by adjusting metal steel wire linear velocity 20-50m/min and size of current
3-5 μm of hard rock length of embedment, by adjust 100 ± 20g/L of solution formula nickel sulfamic acid, 40 ± 5g/L boric acid, 10 ±
2g/L nickel chloride controls 3-6 μm come the cutting edge of a knife or a sword height that goes out realized under same length of embedment；The preferably ammonia of nickel plating solution 100g/L
Base nickel sulphonic acid, 40g/L boric acid, 10g/L nickel chloride, metal steel wire linear velocity 40m/min adjust diamond 5 with size of current
4 μm of length of embedment, by adjusting the nickel sulfamic acid of solution formula 100g/L, 40g/L boric acid, 10g/L nickel chloride is realized
The cutting edge of a knife or a sword height that goes out under same length of embedment controls 4 μm；
(6) dry: metal steel wire is dried by air blowing and heating device；
(7) complete monitoring Quality Detection: is carried out to product quality by online Quality Detection instrument；
(8) take-up: with defined tension 5-10N, preferably 8N, winding displacement spacing 0.2-0.6mm, preferably 0.5mm, by gained
Electroplating diamond wire saw, which is wound on to formulate, gets product diamond wire in I-beam wheel.
Embodiment 2: difference from Example 1 is that core wire is diameter 55um steel wire, and bortz powder partial size used is
D50=8.0μm.For other steps with embodiment 1, it is 68 ± 3 μm that Buddha's warrior attendant line gauge lattice, which are electroplated, in gained finished product.
Embodiment 3: difference from Example 1 is that core wire is diameter 170um steel wire, and bortz powder partial size used is
D50=35μm.For other steps with embodiment 1, it is 250 ± 10 μm that Buddha's warrior attendant line gauge lattice, which are electroplated, in gained finished product.
Taking the above-mentioned ideal embodiment according to the present invention as inspiration, through the above description, relevant staff is complete
Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention' entirely.It is all in essence of the invention
Within mind and principle, any modification, equivalent substitution, improvement and etc. done be should all be included in the protection scope of the present invention.This
The technical scope of item invention is not limited to the contents of the specification, it is necessary to its technology is determined according to scope of the claims
Property range.
Claims (8)
1. on a kind of naked powder sand be electroplated Buddha's warrior attendant Wiring technology, which is characterized in that the technique the following steps are included:
(1) surface treatment of diamond: selecting the bortz powder of D50=8.5,
A) cleaning 10min, Zhi Houshui are carried out to bortz powder using the NaOH solution that concentration is 40 ± 5g/L, temperature is 50 DEG C
It washes；
B) it using cleaning 10min is carried out to bortz powder under the sulfamic acid solution room temperature that concentration is 40 ± 5g/L, washes later；
C) bortz powder after cleaning is put into beaker, and cationic surfactant A is added, and temperature is 55 ± 5 DEG C, stirring
20min, washing is clean later, and dries at 80 DEG C；
D) bortz powder after previous step drying is put into beaker, and cationic surfactant B is added, and temperature is 55 ± 5 DEG C, is stirred
20min is mixed, washing is clean later, and is dried for standby at 80 DEG C；
(2) steel wire surface cleans: steel wire successively passes through 60 ± 5 DEG C of alkaline defatting agent solution, washing water, 40 ± 5 DEG C of 10% sulphur
Acid solution and washing water process, obtain the core wire of surface cleaning；
(3) surface preparation: the core wire steel wire that surface has cleaned up deposits one layer of binding force on surface by electro-nickel process
Nickel layer medium high, crystal grain is careful, the nickel layer medium with a thickness of 0.1-0.5 μm, pass through and adjust metal steel wire linear velocity, plating
Nickel solution formula, electric current, pH value, temperature adjust the crystallite dimension and film thickness distribution of nickel coating；
(4) diamond adheres to: diamond particle being attached to metal steel wire surface by electrochemical co-deposition technology, passes through adjusting
Metal steel wire linear velocity, nickel plating solution formula, electric current, bortz powder concentration, pH value, bortz powder degree of surface activation, temperature,
Mixing speed adjusts the density and distribution of diamond abrasive grain；
(5) diamond consolidates: the metal steel wire for being attached with diamond particle is connected into DC power supply cathode and passes through nickel plating solution,
Metal steel wire surface deposited nickel layer consolidates diamond particle after applying electric current, big by adjusting metal steel wire linear velocity and electric current
Small to adjust diamond length of embedment, the diamond of same length of embedment is controlled by adjusting the formula of nickel plating solution goes out cutting edge of a knife or a sword
Highly；
(6) dry: metal steel wire is dried by air blowing and heating device；
(7) complete monitoring Quality Detection: is carried out to product quality by online Quality Detection instrument；
(8) take-up: gained electroplating diamond wire saw is wound in formulation I-beam wheel and is got product with defined tension, winding displacement spacing
Diamond wire.
2. Buddha's warrior attendant Wiring technology is electroplated in sand on a kind of naked powder according to claim 1, it is characterised in that: the gauge of wire
It is 55-170 μm.
3. Buddha's warrior attendant Wiring technology is electroplated in sand on a kind of naked powder according to claim 1, it is characterised in that: the diamond partial size
D50 is 8.0-35 μm.
4. Buddha's warrior attendant Wiring technology is electroplated in sand on a kind of naked powder according to claim 1, it is characterised in that: the cationic surface
The concentration of activating agent A and cationic surfactant B are 1g/L.
5. Buddha's warrior attendant Wiring technology is electroplated in sand on a kind of naked powder according to claim 1, it is characterised in that: in the step (3)
The electro-nickel process of surface preparation is specific as follows: the speed of metallic steel silk thread is 20-50m/min, and the formula of nickel plating solution is
Nickel sulfamic acid, 40 ± 5g/L boric acid and the 10 ± 2g/L nickel chloride of 120 ± 20g/L, pH value 3.2-4.2, temperature be 55 ±
5℃。
6. Buddha's warrior attendant Wiring technology is electroplated in sand on a kind of naked powder according to claim 1, it is characterised in that: in the step (4)
The speed 20-50m/min of metallic steel silk thread, nickel plating solution formula be the nickel sulfamic acid of 100 ± 20g/L, 40 ± 5g/L boric acid,
10 ± 2g/L nickel chloride；Bortz powder concentration is 0.5-5g/ml, pH value 3.8-5.0, temperature are 55 ± 5 DEG C, mixing speed is
50-120 r/min。
7. Buddha's warrior attendant Wiring technology is electroplated in sand on a kind of naked powder according to claim 1, it is characterised in that: step (5) gold
The speed for belonging to wire is 20-50m/min, and the length of embedment of diamond is 3-5 μm, is 100 by adjusting nickel plating solution formula
Nickel sulfamic acid, 40 ± 5g/L boric acid and the 10 ± 2g/L nickel chloride of ± 20g/L, the diamond of same length of embedment go out cutting edge of a knife or a sword height
Degree is 3-6 μm.
8. Buddha's warrior attendant Wiring technology is electroplated in sand on a kind of naked powder according to claim 1, it is characterised in that: in the step (8)
Tension be 5-10N, winding displacement spacing is 0.2-0.6mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910119747.1A CN110076705B (en) | 2019-02-18 | 2019-02-18 | Bare powder sanding diamond wire electroplating process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910119747.1A CN110076705B (en) | 2019-02-18 | 2019-02-18 | Bare powder sanding diamond wire electroplating process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110076705A true CN110076705A (en) | 2019-08-02 |
| CN110076705B CN110076705B (en) | 2021-07-16 |
Family
ID=67413044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910119747.1A Active CN110076705B (en) | 2019-02-18 | 2019-02-18 | Bare powder sanding diamond wire electroplating process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110076705B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110438550A (en) * | 2019-08-14 | 2019-11-12 | 苏州韦度新材料科技有限公司 | A kind of preparation method and diamond fretsaw of an ultra sharp type diamond fretsaw |
| CN112192459A (en) * | 2020-09-30 | 2021-01-08 | 苏州韦度新材料科技有限公司 | Preparation process of diamond wire saw suitable for cutting large-size semiconductor |
| CN113275659A (en) * | 2021-04-25 | 2021-08-20 | 江苏聚成金刚石科技有限公司 | Superfine high-strength alloy tungsten wire diamond wire saw and preparation method thereof |
| CN113549990A (en) * | 2021-06-11 | 2021-10-26 | 洛阳吉瓦新材料科技有限公司 | Method for treating sand plating solution on electroplated diamond wire saw |
| CN115584540A (en) * | 2022-11-29 | 2023-01-10 | 江苏三超金刚石工具有限公司 | Diamond wire saw with composite coating and preparation process thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101602231A (en) * | 2009-06-26 | 2009-12-16 | 江苏锋菱超硬工具有限公司 | The preparation method of electroplating diamond fret saw |
| CN101812710A (en) * | 2010-04-26 | 2010-08-25 | 长沙岱勒金刚石制品有限公司 | Diamond wire saw production method of surface modified diamond |
| KR20130111758A (en) * | 2012-04-02 | 2013-10-11 | 한국생산기술연구원 | Method for manufacturing diamond coated wire saw |
| WO2016062880A2 (en) * | 2014-10-24 | 2016-04-28 | Basf Se | Non-amphoteric, quaternisable and water-soluble polymers for modifying the surface charge of solid particles |
| CN106222730A (en) * | 2016-08-31 | 2016-12-14 | 山东山田新材科研有限公司 | A kind of surface modifying method of ultra-fine diamond scroll saw diadust |
| CN107378814A (en) * | 2017-06-27 | 2017-11-24 | 盛利维尔（中国）新材料技术股份有限公司 | A kind of self-lubricating diamond wire and its production method |
| CN107699938A (en) * | 2017-10-18 | 2018-02-16 | 上海都为电子有限公司 | A kind of preparation technology of diamond cutting secant |
| CN108286066A (en) * | 2018-02-07 | 2018-07-17 | 浙江新瑞欣精密线锯有限公司 | A kind of diamond cutting secant processing method and device |
-
2019
- 2019-02-18 CN CN201910119747.1A patent/CN110076705B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101602231A (en) * | 2009-06-26 | 2009-12-16 | 江苏锋菱超硬工具有限公司 | The preparation method of electroplating diamond fret saw |
| CN101812710A (en) * | 2010-04-26 | 2010-08-25 | 长沙岱勒金刚石制品有限公司 | Diamond wire saw production method of surface modified diamond |
| KR20130111758A (en) * | 2012-04-02 | 2013-10-11 | 한국생산기술연구원 | Method for manufacturing diamond coated wire saw |
| WO2016062880A2 (en) * | 2014-10-24 | 2016-04-28 | Basf Se | Non-amphoteric, quaternisable and water-soluble polymers for modifying the surface charge of solid particles |
| CN106222730A (en) * | 2016-08-31 | 2016-12-14 | 山东山田新材科研有限公司 | A kind of surface modifying method of ultra-fine diamond scroll saw diadust |
| CN107378814A (en) * | 2017-06-27 | 2017-11-24 | 盛利维尔（中国）新材料技术股份有限公司 | A kind of self-lubricating diamond wire and its production method |
| CN107699938A (en) * | 2017-10-18 | 2018-02-16 | 上海都为电子有限公司 | A kind of preparation technology of diamond cutting secant |
| CN108286066A (en) * | 2018-02-07 | 2018-07-17 | 浙江新瑞欣精密线锯有限公司 | A kind of diamond cutting secant processing method and device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110438550A (en) * | 2019-08-14 | 2019-11-12 | 苏州韦度新材料科技有限公司 | A kind of preparation method and diamond fretsaw of an ultra sharp type diamond fretsaw |
| CN112192459A (en) * | 2020-09-30 | 2021-01-08 | 苏州韦度新材料科技有限公司 | Preparation process of diamond wire saw suitable for cutting large-size semiconductor |
| CN113275659A (en) * | 2021-04-25 | 2021-08-20 | 江苏聚成金刚石科技有限公司 | Superfine high-strength alloy tungsten wire diamond wire saw and preparation method thereof |
| CN113275659B (en) * | 2021-04-25 | 2022-03-08 | 江苏聚成金刚石科技有限公司 | Superfine high-strength alloy tungsten wire diamond wire saw and preparation method thereof |
| CN113549990A (en) * | 2021-06-11 | 2021-10-26 | 洛阳吉瓦新材料科技有限公司 | Method for treating sand plating solution on electroplated diamond wire saw |
| CN115584540A (en) * | 2022-11-29 | 2023-01-10 | 江苏三超金刚石工具有限公司 | Diamond wire saw with composite coating and preparation process thereof |
| CN115584540B (en) * | 2022-11-29 | 2024-01-12 | 江苏三超金刚石工具有限公司 | Diamond wire saw with composite coating and preparation process thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110076705B (en) | 2021-07-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110076705A (en) | Buddha's warrior attendant Wiring technology is electroplated in sand on a kind of naked powder | |
| CN107299378B (en) | A kind of manufacturing method of high efficiency cutting silicon wafer diamond wire | |
| CN101602231B (en) | Preparation method of electroplating diamond fret saw | |
| CN103173840B (en) | A kind of preparation method of grinding plated diamond grinding wheel | |
| CN101531035B (en) | A method for manufacturing electroplating diamond wire saw | |
| JP5820950B1 (en) | Method for producing nickel plating solution and solid fine particle-attached wire | |
| CN102392286B (en) | Device for preparing diamond wire saw and method for preparing diamond wire saw by device | |
| CN101812710A (en) | Diamond wire saw production method of surface modified diamond | |
| CN203566873U (en) | Isomerous solidification abrasive-material saw line for multi-line cutting and manufacturing device of isomerous solidification abrasive-material saw line for multi-line cutting | |
| CN112192459B (en) | Preparation process of diamond wire saw suitable for cutting large-size semiconductor | |
| CN104723229A (en) | Production device and method for diamond wire saw | |
| TW201249602A (en) | Electrodeposition liquid for fixed-abrasive saw wire | |
| CN110438550A (en) | A kind of preparation method and diamond fretsaw of an ultra sharp type diamond fretsaw | |
| CN110480530B (en) | Self-sharpening diamond wire for cutting silicon wafer and manufacturing method and using method thereof | |
| CN101787552B (en) | Cu-W-Ni copper matrix composite used for liner, electroforming method and electroforming solution thereof | |
| CN102653878A (en) | Process for plating diamond on surface of cutting steel wire | |
| CN104647617A (en) | Special-shaped fixed abrasive wire saw for multi-wire cutting and manufacturing equipment and method thereof | |
| WO1979000608A1 (en) | Electrotreating a metal surface | |
| CN113275659A (en) | Superfine high-strength alloy tungsten wire diamond wire saw and preparation method thereof | |
| CN202114645U (en) | Diamond wire saw | |
| CN109280954A (en) | The electroplating solution of diamond cutting secant | |
| KR102164683B1 (en) | Method for manufacturing wire saw using foam coating process and wire saw manufactured thereby | |
| RU2291232C2 (en) | Method for producing cutting wire with strength diamond -containing coating | |
| CN216860230U (en) | Wire saw with high cutting force and production equipment thereof | |
| CN111118582B (en) | Preparation device and method of Ni-SiC composite coating with (220) high preferred orientation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 213200 No. 268 Nanhuan Second Road, Jintan District, Changzhou City, Jiangsu Province Patentee after: Shengliwei (Changzhou) metal material Co.,Ltd. Address before: 213200 No. 268 Nanhuan Second Road, Jintan District, Changzhou City, Jiangsu Province Patentee before: SUNNYWELL (CHINA) NEW MATERIAL TECHNOLOGY CO.,LTD. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20240408 Address after: No. 566 Changjiang East Road, Huaiyin District, Huai'an City, Jiangsu Province, 223300 Patentee after: Zhongtian Iron and Steel Group (Huai'an) New Materials Co.,Ltd. Country or region after: China Address before: 213200 No. 268 Nanhuan Second Road, Jintan District, Changzhou City, Jiangsu Province Patentee before: Shengliwei (Changzhou) metal material Co.,Ltd. Country or region before: China |