CN110076705B - Bare powder sanding diamond wire electroplating process - Google Patents
Bare powder sanding diamond wire electroplating process Download PDFInfo
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- CN110076705B CN110076705B CN201910119747.1A CN201910119747A CN110076705B CN 110076705 B CN110076705 B CN 110076705B CN 201910119747 A CN201910119747 A CN 201910119747A CN 110076705 B CN110076705 B CN 110076705B
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 140
- 239000010432 diamond Substances 0.000 title claims abstract description 140
- 239000000843 powder Substances 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 25
- 230000008569 process Effects 0.000 title claims abstract description 22
- 238000009713 electroplating Methods 0.000 title claims abstract description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 121
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 60
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 43
- 239000010959 steel Substances 0.000 claims abstract description 43
- 238000007747 plating Methods 0.000 claims abstract description 24
- 238000004140 cleaning Methods 0.000 claims abstract description 7
- 238000000151 deposition Methods 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims description 34
- 229910052751 metal Inorganic materials 0.000 claims description 34
- 238000005406 washing Methods 0.000 claims description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- 239000002245 particle Substances 0.000 claims description 16
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 14
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 14
- 239000004327 boric acid Substances 0.000 claims description 14
- 239000003093 cationic surfactant Substances 0.000 claims description 14
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 14
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 claims description 14
- 238000001035 drying Methods 0.000 claims description 12
- 238000003756 stirring Methods 0.000 claims description 12
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 238000009826 distribution Methods 0.000 claims description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 6
- 102220043159 rs587780996 Human genes 0.000 claims description 6
- 238000004804 winding Methods 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 claims description 4
- 230000004913 activation Effects 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims description 3
- 238000007596 consolidation process Methods 0.000 claims description 3
- 238000005237 degreasing agent Methods 0.000 claims description 3
- 239000013527 degreasing agent Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 claims description 3
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 claims description 2
- 239000004576 sand Substances 0.000 abstract description 19
- 238000005520 cutting process Methods 0.000 abstract description 14
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 4
- 239000011574 phosphorus Substances 0.000 abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 2
- 230000007797 corrosion Effects 0.000 abstract description 2
- 238000005260 corrosion Methods 0.000 abstract description 2
- 239000012535 impurity Substances 0.000 abstract description 2
- 238000012545 processing Methods 0.000 abstract description 2
- 239000011863 silicon-based powder Substances 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract description 2
- 239000002351 wastewater Substances 0.000 abstract description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 2
- 229910000677 High-carbon steel Inorganic materials 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Chemically Coating (AREA)
Abstract
The invention relates to the technical field of electroplated diamond wires, in particular to a process for electroplating diamond wires by sanding bare powder; cleaning and chemically treating the bare diamond to enable the surface of the bare diamond to be attached with high-density positive charges, depositing the treated bare diamond on the surface of the steel wire in a sand feeding groove, and electrochemically solidifying the diamond to prepare a finished product of the electroplated diamond wire; compared with the common diamond wire, the diamond used by the diamond wire is not subjected to nickel preplating (the nickel preplating can generate a large amount of nickel and phosphorus wastewater to pollute the environment), the pollution of nickel and phosphorus is reduced, the diamond wire uses bare diamond, the working procedure of chemical nickel plating is omitted, the diamond cost is reduced by 40%, the diamond on the surface of the bare sand electroplated diamond wire is not coated by a nickel layer, and the cutting capability is stronger; impurities such as nickel or silicon powder are not easy to stick in the cutting process, the cutting force cannot be influenced in the later cutting period, the diamond used by the bare sand electroplating diamond wire does not have the corrosion problem of a nickel layer in plating solution, the sand is not required to be subjected to treatment such as deplating, and the labor and processing cost is reduced.
Description
Technical Field
The invention relates to the technical field of electroplated diamond wires, in particular to a process for electroplating diamond wires by sanding bare powder.
Background
At present, the electroplated diamond wire is a linear cutting tool, called a wire saw for short, which is manufactured by taking electroplated metal nickel as a bonding agent and solidifying diamond grinding materials on a high-carbon steel wire through electrodeposition. The electroplated diamond wire has high cutting efficiency, good stability and excellent cutting surface quality, and is widely applied to the cutting of non-metal hard and brittle materials such as crystals, sapphires and the like and magnetic materials, particularly silicon materials.
Because the diamond is not conductive, a metal nickel layer needs to be pre-plated on the surface of the diamond to make the diamond conductive, namely, the diamond 4 with the nickel plated layer is plated as shown in figures 1.1 and 1.2, so that sand can be electroplated on the core wire steel wire 1 pre-plated with the pre-plated nickel layer 2, and a metal nickel layer 3 is deposited after the sand is plated to be solidified on the steel wire, therefore, the top end of the diamond on the surface of the finished electroplated diamond wire is provided with a nickel metal layer with a certain thickness, the outer diameter of the steel wire is increased, and the diamond is abraded into powder to be adhered to the surface of the diamond wire in the cutting process, so that the cutting force of the diamond wire is weakened.
Disclosure of Invention
The purpose of the invention is: the process overcomes the defects in the prior art, and provides the process for electroplating the diamond wire by sanding on bare powder.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
a bare powder sanding electroplating diamond wire process comprises the following steps:
(1) surface treatment of diamond: diamond powder with D50=8.5 is selected,
a) washing diamond powder with NaOH solution with concentration of 40 + -5 g/L and temperature of 50 deg.C for 10min, and washing with water;
b) cleaning diamond powder for 10min at normal temperature by using sulfamic acid solution with the concentration of 40 +/-5 g/L, and then washing with water;
c) putting the cleaned diamond powder into a beaker, adding a cationic surfactant A, stirring for 20min at the temperature of 55 +/-5 ℃, then washing with water, and drying at the temperature of 80 ℃;
d) putting the diamond powder dried in the previous step into a beaker, adding a cationic surfactant B, stirring for 20min at the temperature of 55 +/-5 ℃, then washing with water, and drying at the temperature of 80 ℃ for later use;
(2) cleaning the surface of the steel wire: the steel wire is sequentially treated by 60 +/-5 ℃ alkaline degreasing agent solution, washing water, 40 +/-5 ℃ 10% sulfuric acid solution and washing water to obtain a core wire with a clean surface;
(3) surface pretreatment: depositing a layer of nickel layer medium with high binding force and fine grains on the surface of the core wire steel wire with the cleaned surface by a nickel electroplating process, wherein the thickness of the nickel layer medium is 0.1-0.5 mu m, and adjusting the grain size and the film thickness distribution of a nickel coating by adjusting the linear speed of the metal steel wire, the formula of a nickel plating solution, the current, the pH value and the temperature;
(4) diamond adhesion: attaching diamond particles to the surface of the metal steel wire by an electrochemical codeposition technology, and adjusting the density and distribution of diamond abrasive particles by adjusting the linear velocity of the metal steel wire, the formula of a nickel plating solution, current, the concentration of diamond powder, the pH value, the surface activation degree of the diamond powder, the temperature and the stirring speed;
(5) and (3) diamond consolidation: connecting the metal steel wire attached with the diamond particles with a cathode of a direct current power supply, applying a nickel plating solution, depositing a nickel layer on the surface of the metal steel wire after applying current to consolidate the diamond particles, adjusting the embedding depth of the diamond by adjusting the linear speed and the current magnitude of the metal steel wire, and controlling the peak height of the diamond with the same embedding depth by adjusting the formula of the nickel plating solution;
(6) and (3) drying: drying the metal steel wire by a blowing and heating device;
(7) and (3) quality detection: monitoring the product quality in a whole process by an online quality detection instrument;
(8) taking up: and winding the obtained electroplated diamond wire saw on a setting spool at a specified tension and a specified winding displacement interval to obtain a finished diamond wire.
Further, the diameter of the steel wire is 55-170 μm.
Further, the diamond particle size D50 is 8.0-35 μm.
Further, the concentration of the cationic surfactant A and the cationic surfactant B is 1 g/L.
Further, the nickel electroplating process for surface pretreatment in the step (3) is specifically as follows: the speed of the metal wire is 20-50m/min, the formula of the nickel plating solution is 120 plus or minus 20g/L nickel sulfamate, 40 plus or minus 5g/L boric acid and 10 plus or minus 2g/L nickel chloride, the pH value is 3.2-4.2, and the temperature is 55 plus or minus 5 ℃.
Further, the speed of the metal wire in the step (4) is 20-50m/min, and the formula of the nickel plating solution is 100 plus or minus 20g/L nickel sulfamate, 40 plus or minus 5g/L boric acid and 10 plus or minus 2g/L nickel chloride; the diamond powder concentration is 0.5-5g/ml, the pH value is 3.8-5.0, the temperature is 55 +/-5 ℃, and the stirring speed is 50-120 r/min.
Further, the speed of the metal wire line in the step (5) is 20-50m/min, the embedding depth of the diamond is 3-5 μm, and the height of the diamond edge of the diamond embedded in the same depth is 3-6 μm by adjusting the formula of the nickel-plating solution to 100 +/-20 g/L nickel sulfamate, 40 +/-5 g/L boric acid and 10 +/-2 g/L nickel chloride.
Further, the tension in the step (8) is 5-10N, and the row line spacing is 0.2-0.6 mm.
The technical scheme adopted by the invention has the beneficial effects that:
1. compared with the common diamond wire, the diamond used by the diamond wire is not subjected to nickel preplating (the nickel preplating can generate a large amount of nickel and phosphorus wastewater to pollute the environment), and the pollution of nickel and phosphorus is reduced.
2. The diamond wire uses bare diamond, reduces the working procedure of chemical nickel plating compared with the diamond of pre-plating nickel, and reduces the diamond cost by 40 percent.
3. Compared with the common electroplated diamond wire, the diameter of the bare sand electroplated diamond wire is reduced by 3-10%, the material loss of a client caused by the seam is reduced by 1-5%, and the product rate of the client is increased by 1-5%.
4. The bare sand electroplated diamond wire has more uniform particle distribution, no diamond agglomeration, more stable wire diameter and better surface quality of cut products.
5. The surface diamond of the bare sand electroplating diamond wire is not coated by a nickel layer, so that the cutting capability is stronger; impurities such as nickel or silicon powder are not easy to stick in the cutting process, and the cutting force in the later cutting stage cannot be influenced.
6. The diamond used by the bare sand electroplating diamond wire has no corrosion problem of a nickel layer in a plating solution, and sand does not need to be subjected to treatment such as deplating, so that the labor cost and the processing cost are reduced.
Drawings
FIG. 1.1 is a schematic side view of a sand-plated electroplated diamond wire;
FIG. 1.2 is a schematic cross-sectional view of a sand-plated diamond wire;
FIG. 2 is an SEM image of the surface of a sand-plated diamond wire;
FIG. 3 is a process flow diagram of bare sand electroplated diamond wire;
FIG. 4.1 is a schematic side view of a bare sand electroplated diamond wire;
FIG. 4.2 is a schematic cross-sectional view of a bare sand electroplated diamond wire;
FIG. 5 SEM image of bare sand electroplated diamond wire surface.
In the figure: 1 steel wire, 2 nickel preplating layer, 3 metallic nickel layer, 4 diamond with nickel plating layer and 5 diamond.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Example 1
FIG. 2 is an SEM image of the surface of a sand-plated diamond wire;
FIG. 3 is a process flow diagram of bare sand electroplating diamond wire;
FIG. 4.1 is a schematic side view of a bare sand electroplated diamond wire;
FIG. 4.2 is a schematic cross-sectional view of a bare sand electroplated diamond wire;
FIG. 5 SEM image of bare sand electroplated diamond wire surface.
By using the method of the invention, the electroplated diamond wire is produced by using 65um steel wire matched with diamond with D50=8.5um, and the production process is as follows:
(1) surface treatment of diamond 5: diamond powder with D50=8.5 is selected,
a) washing diamond powder with NaOH solution with concentration of 40 + -5 g/L and temperature of 50 deg.C for 10min, and washing with water;
b) cleaning diamond powder for 10min at normal temperature by using sulfamic acid solution with the concentration of 40 +/-5 g/L, and then washing with water;
c) putting the cleaned diamond powder into a beaker, stirring for 20min at the temperature of 55 +/-5 ℃ by using 1g/L of cationic surfactant A, then washing with water, and drying at the temperature of 80 ℃, wherein the cationic surfactant A is quaternary ammonium salt cationic surfactant;
d) putting the diamond powder dried in the previous step into a beaker, stirring for 20min at the temperature of 55 +/-5 ℃ by using 1g/L of cationic surfactant B, then washing with water, and drying at the temperature of 80 ℃ for later use, wherein the cationic surfactant B is quaternary ammonium salt cationic surfactant;
(2) cleaning the surface of the steel wire 1: the steel wire 1 is sequentially treated by 60 +/-5 ℃ alkaline degreasing agent solution, washing water, 40 +/-5 ℃ 10% sulfuric acid solution and washing water to obtain a core wire with a clean surface;
(3) surface pretreatment: the core wire steel wire 1 with the cleaned surface is subjected to nickel electroplating technology to deposit a layer of nickel layer medium (namely a pre-plated nickel layer 2) with high binding force and fine grains on the surface by 0.1-0.5 mu m, and the grain size and the film thickness distribution of the nickel layer are adjusted by adjusting the linear speed of the metal wire by 20-50m/min, the formula of the nickel plating solution by 120 +/-20 g/L of nickel sulfamate, 40 +/-5 g/L of boric acid, 10 +/-2 g/L of nickel chloride, the current by 0.5-1.5A, pH, the value by 3.2-4.2, the temperature by 55 +/-5 ℃ and other parameters; preferably 0.3 mu m of nickel layer medium, and the nickel sulfamate, the boric acid and the nickel chloride are mixed by adjusting the linear speed of the metal steel wire to be 40m/min and the solution formula to be 120g/L, the current is 1A, pH to be 4, and the temperature is 55 +/-5 ℃;
(4) attachment of diamond 5: attaching diamond 5 particles on the surface of a metal steel wire by an electrochemical codeposition technology, and adjusting the density and distribution of diamond abrasive particles by adjusting parameters such as the linear speed of the metal steel wire to be 20-50m/min, 100 +/-20 g/L nickel sulfamate of a nickel plating solution formula, 40 +/-5 g/L boric acid, 10 +/-2 g/L nickel chloride, 2-6A current, 0.5-5g/ml diamond powder concentration, 3.8-5.0 pH value, the surface activation degree of the diamond powder, the temperature to be 55 +/-5 ℃, stirring for 50-120 r/min and the like; preferably nickel sulfamate with the linear velocity of metal steel wire of 40m/min and the solution formula of 100g/L, 40g/L boric acid, 10g/L nickel chloride, the current of 5A, the diamond powder concentration of 4g/ml, the pH value of 4.0, the temperature of 55 +/-5 ℃, the stirring of 100 r/min and the like
(5) And (3) consolidation of the diamond 5: connecting the metal steel wire attached with the diamond 5 particles with a direct current power supply cathode, solidifying the diamond 5 particles by depositing a nickel layer on the surface of the metal steel wire after applying current through 100 +/-20 g/L nickel sulfamate, 40 +/-5 g/L boric acid and 10 +/-2 g/L nickel chloride of a nickel plating solution, adjusting the diamond embedding depth to be 3-5 mu m by adjusting the linear speed of the metal steel wire to be 20-50m/min and the current magnitude, and realizing the control of the peak emergence height to be 3-6 mu m under the same embedding depth by adjusting 100 +/-20 g/L nickel sulfamate, 40 +/-5 g/L boric acid and 10 +/-2 g/L nickel chloride of a solution formula; preferably, 100g/L nickel sulfamate, 40g/L boric acid and 10g/L nickel chloride of a nickel plating solution are adopted, the embedding depth of the diamond 5 is adjusted to be 4 mu m by 40m/min of linear speed of a metal steel wire and the current, and the peak height under the same embedding depth is controlled to be 4 mu m by adjusting 100g/L nickel sulfamate, 40g/L boric acid and 10g/L nickel chloride of a solution formula;
(6) and (3) drying: drying the metal steel wire by a blowing and heating device;
(7) and (3) quality detection: monitoring the product quality in a whole process by an online quality detection instrument;
(8) taking up: and winding the obtained electroplated diamond wire saw on a setting spool to obtain the finished diamond wire with the specified tension of 5-10N, preferably 8N and the interval of the flat cables of 0.2-0.6mm, preferably 0.5 mm.
Example 2: the difference from example 1 is that the core wire is a 55um diameter steel wire and diamond powder with a particle size of D50=8.0 μm is used. The other steps are the same as the example 1, and the specification of the finished product of the electroplated diamond wire is 68 +/-3 mu m.
Example 3: the difference from example 1 is that the core wire is a 170um diameter steel wire and diamond powder with a particle size of D50=35 μm is used. The other steps are the same as the example 1, and the specification of the finished product of the electroplated diamond wire is 250 +/-10 mu m.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (6)
1. The bare powder sanding electroplating diamond wire process is characterized by comprising the following steps:
(1) surface treatment of diamond: diamond powder with D50=8.5 is selected,
a) washing diamond powder with NaOH solution with concentration of 40 + -5 g/L and temperature of 50 deg.C for 10min, and washing with water;
b) cleaning diamond powder for 10min at normal temperature by using sulfamic acid solution with the concentration of 40 +/-5 g/L, and then washing with water;
c) putting the cleaned diamond powder into a beaker, adding a cationic surfactant A, stirring for 20min at the temperature of 55 +/-5 ℃, then washing with water, and drying at the temperature of 80 ℃;
d) putting the diamond powder dried in the previous step into a beaker, adding a cationic surfactant B, stirring for 20min at the temperature of 55 +/-5 ℃, then washing with water, and drying at the temperature of 80 ℃ for later use;
(2) cleaning the surface of the steel wire: the steel wire is sequentially treated by 60 +/-5 ℃ alkaline degreasing agent solution, washing water, 40 +/-5 ℃ 10% sulfuric acid solution and washing water to obtain a core wire with a clean surface;
(3) surface pretreatment: depositing a layer of nickel layer medium with high binding force and fine grains on the surface of the core wire steel wire with the cleaned surface by a nickel electroplating process, wherein the thickness of the nickel layer medium is 0.1-0.5 mu m, and adjusting the grain size and the film thickness distribution of a nickel coating by adjusting the linear speed of the metal steel wire, the formula of a nickel plating solution, the current, the pH value and the temperature;
(4) diamond adhesion: attaching diamond particles to the surface of the metal steel wire by an electrochemical codeposition technology, and adjusting the density and distribution of diamond abrasive particles by adjusting the linear velocity of the metal steel wire, the formula of a nickel plating solution, current, the concentration of diamond powder, the pH value, the surface activation degree of the diamond powder, the temperature and the stirring speed;
(5) and (3) diamond consolidation: connecting the metal steel wire attached with the diamond particles with a cathode of a direct current power supply, applying a nickel plating solution, depositing a nickel layer on the surface of the metal steel wire after applying current to consolidate the diamond particles, adjusting the embedding depth of the diamond by adjusting the linear speed and the current magnitude of the metal steel wire, and controlling the peak height of the diamond with the same embedding depth by adjusting the formula of the nickel plating solution;
(6) and (3) drying: drying the metal steel wire by a blowing and heating device;
(7) and (3) quality detection: monitoring the product quality in a whole process by an online quality detection instrument;
(8) taking up: winding the obtained electroplated diamond wire saw on a setting spool at a specified tension and a specified winding displacement interval to obtain a finished diamond wire;
the speed of the metal steel wire in the step (4) is 20-50m/min, and the formula of the nickel plating solution comprises 100 +/-20 g/L nickel sulfamate, 40 +/-5 g/L boric acid and 10 +/-2 g/L nickel chloride; the diamond powder concentration is 0.5-5g/ml, the pH value is 3.8-5.0, the temperature is 55 +/-5 ℃, and the stirring speed is 50-120 r/min;
the speed of the metal wire line in the step (5) is 20-50m/min, the embedding depth of the diamond is 3-5 mu m, and the peak height of the diamond with the same embedding depth is 3-6 mu m by adjusting the formula of the nickel plating solution to 100 +/-20 g/L nickel sulfamate, 40 +/-5 g/L boric acid and 10 +/-2 g/L nickel chloride.
2. The bare powder sand-coating electroplating diamond wire process according to claim 1, which is characterized in that: the diameter of the steel wire is 55-170 μm.
3. The bare powder sand-coating electroplating diamond wire process according to claim 1, which is characterized in that: the diamond grain diameter D50 is 8.0-35 μm.
4. The bare powder sand-coating electroplating diamond wire process according to claim 1, which is characterized in that: the concentration of the cationic surfactant A and the cationic surfactant B is 1 g/L.
5. The bare powder sand-coating electroplating diamond wire process according to claim 1, which is characterized in that: the nickel electroplating process for surface pretreatment in the step (3) is specifically as follows: the speed of the metal wire is 20-50m/min, the formula of the nickel plating solution is 120 plus or minus 20g/L nickel sulfamate, 40 plus or minus 5g/L boric acid and 10 plus or minus 2g/L nickel chloride, the pH value is 3.2-4.2, and the temperature is 55 plus or minus 5 ℃.
6. The bare powder sand-coating electroplating diamond wire process according to claim 1, which is characterized in that: the tension in the step (8) is 5-10N, and the row wire spacing is 0.2-0.6 mm.
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| CN110438550B (en) * | 2019-08-14 | 2021-07-09 | 苏州韦度新材料科技有限公司 | Preparation method of ultra-sharp diamond wire saw and diamond wire saw |
| CN112192459B (en) * | 2020-09-30 | 2022-06-28 | 苏州韦度新材料科技有限公司 | Preparation process of diamond wire saw suitable for cutting large-size semiconductor |
| CN113275659B (en) * | 2021-04-25 | 2022-03-08 | 江苏聚成金刚石科技有限公司 | Superfine high-strength alloy tungsten wire diamond wire saw and preparation method thereof |
| CN113549990A (en) * | 2021-06-11 | 2021-10-26 | 洛阳吉瓦新材料科技有限公司 | Method for treating sand plating solution on electroplated diamond wire saw |
| CN115584540B (en) * | 2022-11-29 | 2024-01-12 | 江苏三超金刚石工具有限公司 | Diamond wire saw with composite coating and preparation process thereof |
Citations (8)
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| CN101602231A (en) * | 2009-06-26 | 2009-12-16 | 江苏锋菱超硬工具有限公司 | The preparation method of electroplating diamond fret saw |
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| KR20130111758A (en) * | 2012-04-02 | 2013-10-11 | 한국생산기술연구원 | Method for manufacturing diamond coated wire saw |
| WO2016062880A2 (en) * | 2014-10-24 | 2016-04-28 | Basf Se | Non-amphoteric, quaternisable and water-soluble polymers for modifying the surface charge of solid particles |
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| CN107699938A (en) * | 2017-10-18 | 2018-02-16 | 上海都为电子有限公司 | A kind of preparation technology of diamond cutting secant |
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| CN110076705A (en) | 2019-08-02 |
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