JPS5845871A - Production method of grindstone - Google Patents

Abstract

PURPOSE:To prevent grind particles from being dropped during the cutting process by applying the eutectoid plating layer of grind particles such as diamond and a metal such as nickel to a substratum then by applying a protective plating layer further to the remaining grind particles protruded through the plating layer. CONSTITUTION:The eutectoid plating of grind particles 1 such as diamond and a metal 2 such as nickel is applied to a substratum 3 such as stainless steel, then a protective plating layer 4 of a solution containing nickel sulfamic acid, nickel chloride, and boric acid is formed with such a thickness that the grind particles protruded through the eutectoid plating layer are not buried.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing an electrodeposited grindstone used for cutting metal materials, non-metal materials, particularly hard and brittle materials such as ferrite, crystal, and glass.

Conventionally, the manufacturing method for this type of electrodeposited whetstone is to simply suspend the abrasive grains in an electroplating bath, deposit the abrasive grains on a base metal placed at the bottom of the plating bath, and after shaking off the excess abrasive grains, apply electricity. The method of joining with nickel plating, and plating both sides of the alloy at the same time, was a work in progress and had the disadvantage that the plating thickness was uneven. In order to improve the drawbacks of this electrodeposited grindstone, the inventors of the present invention have already filed Japanese Patent Application No. 65-56969. Special request 1977
6-4811 etc.

In this method, abrasive grains such as diamond are uniformly dispersed in the plating bath without settling, and metal and abrasive grains can be co-deposited simultaneously on the base metal.■ Deposition of abrasive grains such as diamond The amount can be controlled. ■ The deposition of abrasive grains such as diamond is uniform. ■ The adhesion is good due to the eutectoid plating of abrasive grains such as diamond and metal ions. ■ Both sides of the base metal can be plated at the same time. It exhibits the following effects.

However, in the electrodeposited grindstone proposed here, as shown in the enlarged cross-sectional view of the grindstone in FIG. 1, the diamond abrasive grains 1 in the uppermost layer protrude beyond the eutectoid plating layer 2. For this reason, the holding power of the diamond abrasive grains 1 is weak, and the diamond abrasive grains fall off during cutting, resulting in significant wear on the tip and side surfaces of the whetstone.

The present invention strengthens the holding power of abrasive grains such as diamond in eutectoid plating of abrasive grains such as diamond and metal ions,
This paper proposes a manufacturing method for electrodeposited grindstones that improves wear resistance.

Embodiments of the present invention will be described below with reference to FIGS. 2 to 6.

[Example 1] First, the material 5US304 with a thickness of 0.061B was processed into a circular shape as shown in Fig. 2 by the usual 7-oto-etching method, and after being processed through processes such as degreasing, pickling, and strike nickel plating. Eutectoid plating of diamond abrasive grains and nickel was performed by the method shown below.

Next, protective plating was carried out under the following conditions in order to strengthen the holding power of the diamond small grains in the uppermost layer of the eutectoid plating.

Figure 3 shows an enlarged cross-sectional view of the grindstone manufactured above. Third
As shown in the figure, the diamond abrasive grains 1 protruding from the eutectoid plating layer 2 of diamond abrasive grains and nickel on the base metal 3 are covered with the protective plating layer 4, and the diamond abrasive grains It can be seen that the retention of was strengthened.

Furthermore, a cutting test was conducted on the grindstone manufactured above under the following conditions.

Figure 4 shows the wear status of the side surface of the grindstone. Curve 6 in Figure 1
shows a conventional eutectoid plated grindstone with diamond abrasive grains and nickel plating, the thickness of the eutectoid plating is 26μ, and no protective plating is applied.

Curve 6 shows a grindstone manufactured by the method described in Example 1. Song #i! 5 and curve 6, it is clear that Example 1
There is less side wear of the grinding wheel. This indicates that protective plating has the effect of strengthening the holding power of diamond abrasive grains.

[Example 2] Instead of the protective plating method described in Example 1, protective plating was performed under the following conditions.

Bath composition: Nickel sulfamino acid 450 g/
l Nickel chloride 101i1μ boric acid
309μ FIG. 6 shows an enlarged cross-sectional view of the grindstone manufactured above. 6th
As shown in the figure, the diamond abrasive grains 1 protruding from the eutectoid plating layer 2 of diamond abrasive grains 8■ on gold 3 and nickel are completely covered and held by the protective plating layer 8. The protective plating layer itself also consists of a eutectoid plating layer of diamond abrasive grains 9 of ≠2000 and nickel.

Next, a cutting test of the grindstone manufactured above was carried out in the same manner as described in Example 1.

The results are shown by curve 7 in FIG. From the fourth example, it was found that there was even less wear on the side surface of the grinding wheel in both Example 1 and Example 1, showing the effect of reinforcing the retention of the abrasive grains and at the same time helping to improve the wear resistance.

Although the embodiments have been described above, as a protective plating method for retaining the uppermost layer of diamond abrasive grains in a eutectoid plating grindstone in which abrasive grains such as diamond and metal ions such as nickel are plated, copper and tin other than those in the embodiments can be used.

It is also possible to perform plating with zinc, chromium, etc. or an alloy thereof.

As described above, the present invention has the following effects.

(1) The protective plating strengthened the retention of diamond abrasive grains, and the dropout of diamond abrasive grains was greatly reduced.

(2) The amount of wear on the side surface of the grinding wheel is greatly reduced, the thickness of the grinding wheel is stabilized, and high-precision machining is possible.

[Brief explanation of the drawing]

FIG. 4 is an explanatory diagram of the results of a side abrasion test of the grindstone, and FIG. 5 is a partial cross-sectional view of the grindstone in another embodiment of the present invention. 1...Diamond abrasive grains, 2...Eutectoid plating layer, 3...Base metal, 4...Protective plating layer, 8...・Protective plating layer. Figure 2 @ Figure 3!

Claims (1)

[Claims] After performing eutectoid plating of abrasive grains such as diamond or cubic boron nitride and metal such as nickel on a base material such as stainless steel, a solution containing nickel sulfur amino acid, nickel chloride, and boric acid is used to coat the base material to the desired thickness. A method for manufacturing a grindstone, in which a protective plating layer is formed to such an extent that the abrasive grains protruding from the eutectoid plating layer remain, and retention of the abrasive grains protruding from the eutectoid plating layer is strengthened by the protective plating.