JPS61270075A - Manufacture of grinding wheel - Google Patents

Manufacture of grinding wheel

Info

Publication number
JPS61270075A
JPS61270075A JP60108445A JP10844585A JPS61270075A JP S61270075 A JPS61270075 A JP S61270075A JP 60108445 A JP60108445 A JP 60108445A JP 10844585 A JP10844585 A JP 10844585A JP S61270075 A JPS61270075 A JP S61270075A
Authority
JP
Japan
Prior art keywords
grinding
plating
grinding wheel
solid lubricant
bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60108445A
Other languages
Japanese (ja)
Inventor
Shiro Morita
森田 四郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nachi Fujikoshi Corp
Original Assignee
Nachi Fujikoshi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nachi Fujikoshi Corp filed Critical Nachi Fujikoshi Corp
Priority to JP60108445A priority Critical patent/JPS61270075A/en
Publication of JPS61270075A publication Critical patent/JPS61270075A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To grind a soft, ungrindable material as well as to make a work of high load and low grinding speed grindable, by forming a solid lubricant plating layer on a grinding wheel. CONSTITUTION:A grinding wheel consists of the following method that super abrasive grains 1 are fixed on a base metal (base plate) 2 by means of an electrodeposition process, on top of which a plating film (bond) 3 mixing and including a solid lubricant and wear-proof powder applied to chemical plating is bonded. At this time, a plating bond 4 by the electrodeposition process has thickness commensurate to 40-60% of an abrasive grain diameter, and the plating film 3 including the solid lubricant and the wear-proof powder formed on this plating bond 4 has thickness commensurate to 20-50% of a super abrasive grain diameter. With the grinding wheel formed like this, a soft, ungrindable material can be ground and, what is more, a work is grindable at high load and low grinding speed.

Description

【発明の詳細な説明】 (産業上の利用分野) オーステナイト系ステンレス等、軟質難削材の研削加工
と研削時の環境が高荷重で低研削速度の研削加工用に使
用される研削砥石の製造方法に関する。
[Detailed Description of the Invention] (Industrial Application Field) Manufacture of grinding wheels used for grinding soft, difficult-to-machine materials such as austenitic stainless steel, and for grinding in a high-load, low-grinding-speed environment. Regarding the method.

(従来の技術) 一般に供せられる電着砥石はダイヤモシド、CBN等の
超砥粒を電着法あるいは、化学メッキ法で固定したもの
が一般的であるが、これ等はオーステナイト系ステンレ
ス(例へハ5US304 ) 等の軟質難削材の研削に
おいては、研削粉がポンド金属と溶着し砥石の目詰りあ
るいはこの目詰片の機械的な剥脱時に砥粒も脱落し砥石
は早期寿命となるばかシか研削面にもむしれやびびりを
発生させるため使用出来なかった。また研削時の環境が
高荷重(20−100すf/c!II)で低研削速度(
300′/min以下)の厳しい条件を負荷する必要の
ある研削条件では一般電着砥石では研削できなかった。
(Prior art) Generally available electrodeposited grindstones are those with superabrasive grains such as diamond or CBN fixed by electrodeposition or chemical plating, but these grindstones are made of austenitic stainless steel (for example, When grinding soft, difficult-to-cut materials such as HA5US304), the grinding powder adheres to the pound metal and the grinding wheel becomes clogged, or when these clogged pieces are mechanically peeled off, the abrasive grains also fall off, resulting in a premature end to the life of the grinding wheel. However, it could not be used because it caused peeling and chatter on the grinding surface. In addition, the environment during grinding is high load (20-100 f/c! II) and low grinding speed (
Grinding was not possible with a general electrodeposited grindstone under severe grinding conditions (300'/min or less).

(本発明が解決しようとする問題点) 本発明は従来砥石の欠陥全解決し、軟質難削材の研削や
高荷重、低研削速度の加工も可能な研削砥石の製造方法
全提供することを目的とする。
(Problems to be Solved by the Present Invention) The present invention aims to solve all of the defects of conventional grinding wheels and to provide a complete method for manufacturing a grinding wheel that is capable of grinding soft and difficult-to-cut materials and processing at high loads and low grinding speeds. purpose.

(問題点を解決するための手段) このため本発明は、超砥粒研削材の砥粒径の40〜60
%を電着方法により基板即ち台金上に埋込固定し更にそ
の上方に複合化学メッキ法により、固体潤滑剤の単独層
または固体潤滑剤と耐摩耗性物質の微粉との混合物層全
超砥粒々径の20〜50チ厚さよりなる層として形成し
たことを特徴とする研削砥石の製造方法としたものであ
る。
(Means for solving the problem) For this reason, the present invention provides an abrasive grain diameter of 40 to 60
% is embedded and fixed on a substrate, i.e., a base metal, by an electrodeposition method, and then a single layer of a solid lubricant or a layer of a mixture of a solid lubricant and fine powder of a wear-resistant substance is entirely superabrased by a composite chemical plating method. A method for manufacturing a grinding wheel characterized in that the grinding wheel is formed as a layer having a grain size of 20 to 50 inches thick.

(溶着と軟質材の研削) 金属の溶着の2面間の摩擦においては、2面の突起接触
部におこる溶着は単なる機械的付着(intertok
ing)から溶着(we!Aing) +  化学反応
まで種々の形式があるので各々分類されている。要する
に溶着は、面の圧力、すベシ速度、温度、表面状態、親
和性、雰囲気に影響される。研削砥石では特に摩擦面の
温度が高くなるので溶着を発生し易く軟かく展性に富む
材料はど接触面の凹凸、その他幾何学的形状の変化に応
じ易すく砥粒間付着やボンドへの溶着が起り易すい。機
械的付着は砥石回転による遠心力や研削油の油膜によっ
て切粉の目詰への成長を防げるが、溶着によるものはこ
の防止対策が必須である。溶着は単なる滑り摩擦面では
面と親和性の少ない金属との組合せつまり相互の材料の
固溶性と周期表上の相対的位置により、そしてその強さ
は原子の相対的大きさ、結晶格子等が保持力に関係する
が同一条件下での溶着性の難易は摩擦面間の摩擦係数が
小さいものが溶着全起し難4い。第1表と第2表に各種
加工材と1ン゛工具材料の組合せにおける摩擦係数全文
献より抜すいして示す。
(Welding and grinding of soft materials) In the friction between two surfaces of metal welding, the welding that occurs at the protrusion contact part of the two surfaces is a mere mechanical adhesion (intertok
There are various types, from welding (we!Aing) to welding (we!Aing) + chemical reaction, so they are classified into each type. In short, welding is influenced by surface pressure, welding speed, temperature, surface condition, affinity, and atmosphere. In grinding wheels, the temperature of the friction surface is especially high, so welding easily occurs.The soft and malleable material easily responds to irregularities on the contact surface and other changes in geometric shape, resulting in adhesion between abrasive grains and bonding. Welding easily occurs. Mechanical adhesion can be prevented by the centrifugal force caused by the rotation of the grinding wheel and the oil film of the grinding oil, but in the case of welding, preventive measures are essential. Welding is a combination of a surface with a metal that has little affinity for simple sliding friction surfaces, that is, the solid solubility of the mutual materials, and their relative positions on the periodic table.The strength of the welding depends on the relative sizes of atoms, crystal lattices, etc. Although it is related to the holding force, the difficulty in welding under the same conditions is that those with a small friction coefficient between friction surfaces are less likely to fully weld. Tables 1 and 2 show friction coefficients selected from all literature for combinations of various work materials and one-piece tool materials.

第1 表    溶着の形式と摩擦係数および摩耗の関
係(OoffiQ)第 2表    各種加工材料と工
具材料の組合tKおける摩擦係数(Merchant)
「切削油剤と其の効果」(山水、鈴木)54P(朝倉書
店刊) (低摩擦係数化ボンド砥石の構成) 研削時の環境が高荷重(20〜ZooすJ7cd )で
低研削速度(a o o m/min )の厳しい条件
全負荷する必要のある研削条件ではボンド金属の摩耗を
溶着防止する必要がありこのためにボンド面の低摩擦係
数化が有効であることが判った。研削における低摩擦係
数化として研削油、研削砥石の改善が必要で、特に電着
法で製作される砥石(工具)ではボンドとなるメッキボ
ンドが周期表上の快族(第8族、Fθ、Ni、Co )
が用いられ被削材が鉄系金属、鉄鋼、ステンレス鋼(5
US304 )等では周期表上同族であり切粉の溶着が
発生し易すくボンドの低摩擦係数化が有効である。
Table 1 Relationship between welding type, friction coefficient, and wear (OoffiQ) Table 2 Friction coefficient for combinations tK of various processing materials and tool materials (Merchant)
"Cutting fluids and their effects" (Sansui, Suzuki) 54 pages (Published by Asakura Shoten) (Configuration of bonded grinding wheel with low friction coefficient) The environment during grinding is high load (20~Zoosu J7cd) and low grinding speed (a o Under severe grinding conditions that require a full load (0 m/min), it is necessary to prevent wear of the bond metal from adhesion, and it has been found that lowering the friction coefficient of the bond surface is effective for this purpose. In order to lower the coefficient of friction during grinding, it is necessary to improve the grinding oil and grinding wheel. In particular, in the case of grinding wheels (tools) manufactured by electrodeposition, the plating bond that acts as a bond is a member of the group 8 on the periodic table (group 8, Fθ, Ni, Co)
is used, and the workpiece material is ferrous metals, steel, stainless steel (5
US304), etc., are homologous on the periodic table and are susceptible to welding of chips, so it is effective to lower the coefficient of friction of the bond.

電着砥石(工具)のボンドの低摩擦係数化の方法として
はMO82(、二硫化モリブデン)hBN(大方晶窒化
ホウ素)等固体潤滑剤の分散包含させることが当然有効
である。方法として、電気メツキ法と化学メッキによる
方法がある、各々に製作上の覆 はその本質的な構成(低層が砥粒が単層)上ツルーイン
グが困難で、合金の形状精度が砥石(工具)精度となる
ので、工具(砥石)の角、Ri保持等の形状維持には、
電気メッキで発生する電界のコーナエフェクトのない化
学メッキが有効であり本発明者はこの化学メッキを併用
し、潤滑材や耐摩性剤を含むボンド金もつ研削砥石を研
究開発し到達し友ものである。
As a method for reducing the coefficient of friction of the bond of an electrodeposited grindstone (tool), it is naturally effective to disperse and include a solid lubricant such as MO82 (molybdenum disulfide) or hBN (orthogonal boron nitride). There are two methods: electroplating and chemical plating.The manufacturing process of each method is difficult due to its essential structure (the lower layer is a single layer of abrasive grains), and the accuracy of the shape of the alloy is limited by the grindstone (tool). To maintain the shape of the tool (grindstone) corner, Ri etc.
Chemical plating without the corner effect of the electric field generated by electroplating is effective, and the present inventor has researched and developed a grinding wheel with bonded gold containing lubricants and anti-wear agents by using this chemical plating together, and has finally achieved a new one. be.

(実 施 例) 砥石は基本的に第1図に示す様に超砥粒(1)全電着法
で合金(基板)(2)上に固定し、その上方に化学メッ
キ全応用した固体潤滑剤および耐摩耗性粉末全混合包含
するメッキ皮膜(ボンド)(3)71・ら構成している
。電着法によるメッキボンド(4)はOu。
(Example) As shown in Figure 1, the grinding wheel is basically a super abrasive grain (1) fixed on an alloy (substrate) (2) using a full electrodeposition method, and a solid lubricant coated with chemical plating applied above the superabrasive grain (1). It consists of a plating film (bond) (3) 71. containing a complete mixture of additives and wear-resistant powders. The plating bond (4) formed by electrodeposition is Ou.

Co、Ni共に有効であるが、機械強度と経済性力・ら
光沢スルファミン酸ニッケル浴によるニッケルメッキで
砥粒を固定した。
Both Co and Ni are effective, but the abrasive grains are fixed by nickel plating using a bright nickel sulfamate bath for mechanical strength and economical reasons.

潤滑剤や耐摩粉剤を包含する皮膜はニッケルー燐(tu
−p)やニッケルー硼素(Ni−B)メッキ法が有効で
あるが液の安定性、経済性からN1−P系の市販液や一
般的なN1−Pメッキ基本液、例へば硫酸ニッケル(N
iS0.6H,O) 0.1moULPH4,5〜5.
2次無りん酸ソーダ(NaH2PO1) 0.2mo4
/Z液温85〜95℃金属イオン錯化剤(リコン酸塩等
) 0.1m01/を安定剤(サク酸ソーダ、リンゴ酸
等)0.1〜0.2mot/を粉末の分散剤(ドデシル
硫酸塩等)   1.f/を以下に潤滑剤や耐摩剤の0
.5〜5μの粉末2〜5fv/を添加したメッキ浴中で
製作した。
The film containing the lubricant and anti-friction agent is made of nickel-phosphorus (tu).
-p) and nickel-boron (Ni-B) plating methods are effective, but due to the stability and economic efficiency of the solution, commercially available N1-P solutions and general N1-P plating base solutions, such as nickel sulfate (Ni-B) plating methods, are effective.
iS0.6H,O) 0.1moULPH4,5-5.
Secondary phosphate-free soda (NaH2PO1) 0.2mo4
/Z liquid temperature 85-95℃ Metal ion complexing agent (riconate, etc.) 0.1m01/Stabilizer (sodium succinate, malic acid, etc.) 0.1-0.2mot/Powder dispersing agent (dodecyl sulfates, etc.) 1. If f/ is less than 0 of the lubricant or anti-wear agent
.. Fabricated in a plating bath to which 2-5 fv/5-5 micron powder was added.

次にいくつかの実施例につき詳説する。Next, some examples will be explained in detail.

イ)  8US304 (軟質難削材)の研削での比較
研削条件 一砥石寸法  φ85X8.5TX31.75H11回
転数   3.85 Orpm ・ 〃 切込  0.02WLM/ pass・被研削
材    SUS 304 (オーステナイト系ステン
レス)(イ)−1表乾式研削の場合 (1pass =
 20 om) (第2図参照)(イ)−2表 湿式研
削の場合(第3図参照) (1pass=1,600g
)(基本埋込チ、電着法による埋込%) 被研削材5US304の乾式研削との比較では、分散メ
ッキで30%以上埋込んだ&3&4は60pass以上
研削しても目詰することはなく研削続行が可能であるの
に対し、分散メッキをしてない普通の電着砥石(屋1)
はtapass で目詰寿命に致る、併し分散メッキ1
5%(A2)では36 pa813で寿命となる。又湿
式の研削でhBN i分散剤として分散メッキ係と基本
埋込チで比較した場合基本メッキ40チ以下で分散メッ
キ1 s % (A2)の場合’17 Q passで
寿命となり基本メッキ45〜50チで分散メッキ15%
(/L3 )の場合も30 passで寿命となるのに
対し基本メッキ45〜50%で分散メッキ30%の場合
は40 pass以上研削しても研削続行が可能である
。又非電着砥石であるビトリファイド砥石のWA+80
.7の普通砥石ではZ paS8  と全く研削能力が
ない。
B) Comparative grinding conditions for grinding 8US304 (soft difficult-to-cut material) Grinding wheel dimensions φ85X8.5TX31.75H11 Number of revolutions 3.85 Orpm ・〃 Depth of cut 0.02WLM/pass・Grinded material SUS 304 (Austenitic stainless steel) (B) - In the case of 1-table dry grinding (1 pass =
20 om) (See Figure 2) (A)-2 Table In the case of wet grinding (See Figure 3) (1 pass = 1,600g
) (Basic embedding, embedding % by electrodeposition method) In comparison with dry grinding of the material to be ground 5US304, &3 & 4, which were embedded by dispersion plating by more than 30%, did not become clogged even after grinding for more than 60 passes. While it is possible to continue grinding, an ordinary electroplated grindstone without dispersion plating (Ya 1)
The plugging life is reached with tapass, but dispersion plating 1
At 5% (A2), the life span is 36 pa813. In addition, when comparing dispersion plating with hBN i dispersant as a dispersant in wet grinding and basic embedded chip, in the case of basic plating of 40 chips or less and dispersion plating of 1 s % (A2), the life is reached at '17 Q pass, and the basic plating is 45 to 50. 15% dispersion plating
(/L3), the service life ends after 30 passes, but when the basic plating is 45 to 50% and the dispersion plating is 30%, it is possible to continue grinding even after 40 passes or more. Also, the vitrified whetstone, which is a non-electrodeposited whetstone, has a WA+80
.. A normal whetstone of 7 has no grinding ability at all, Z paS8.

口)ssoc(生材)乾式研削の場合(第4図参照)研
削条件 砥石寸法 φ8 sxs、s’rx31.75
1 回転数 3.85 Orpm 〃 切込 0.05g/pass 被研削材 550CHRB 90 研削液な し く口)表(第4図参照)       1 pass=
1,600xxSUS304以外で生材で研削目詰りを
起し易すいS50&(HRB150)  で効果を比較
した場合、分散メツでキを施さない普通電着砥石(煮1
)が12 pa[38で目詰寿命に到るのに対し、Si
C,hBNの分散メッキ30〜40%施したものが40
 pa88以上研削して^゛\ も寿命に到らず更に研刷続行が可能である。
In the case of SSOC (green material) dry grinding (see Figure 4) Grinding conditions Grinding wheel dimensions φ8 sxs, s'rx31.75
1 Number of revolutions 3.85 Orpm Depth of cut 0.05g/pass Material to be ground 550CHRB 90 Grinding liquid (without grinding fluid) table (see Fig. 4) 1 pass=
When comparing the effects of S50 & (HRB150), which are other than 1,600xx SUS304 and tend to clog with raw materials, compared to ordinary electrodeposited grindstones (boiled 1
) reaches its clogging life at 12 pa[38, whereas Si
C, those with 30-40% hBN dispersion plating are 40
Even after grinding to pa88 or higher, the service life has not reached the end and it is possible to continue grinding.

ハ)高負荷、研削での比較(第5図参照)初期研削圧3
0す、励角15°、切込0.03 m/pa8”分散メ
ッキなしと分散メッキ1lBN 10〜15%の砥石は
研削長0.63〜0.65で背分力が612〜772す
/U となシ研削不能におちいるが25〜30%では研
削長098mで背分力が120’y/yと低い直ヲ−示
す。
C) Comparison with high load and grinding (see Figure 5) Initial grinding pressure 3
0, Excitation angle 15°, Depth of cut 0.03 m/pa 8” No dispersion plating and Dispersion plating 11BN 10-15% grinding wheel has a grinding length of 0.63-0.65 and a back force of 612-772/ At 25% to 30%, grinding becomes impossible, but when the grinding length is 098 m, the thrust force is as low as 120'y/y.

(ハ)表  研削条件第5図参照 1)電着法によるメッキ層の厚さは、砥粒々径の40%
以上が必要である。
(C) Table Grinding conditions Refer to Figure 5 1) The thickness of the plating layer by electrodeposition is 40% of the diameter of the abrasive grains.
The above is necessary.

11)分散剤を含むメッキ層の厚さは砥粒粒径の20チ
以上が必要である。
11) The thickness of the plating layer containing the dispersant must be at least 20 inches thicker than the abrasive grain size.

即ち、分散剤を含む分散メッキ層は、電着法に歓 比寺脆弱で砥粒の保持力が劣り少くとも4o%以上の電
着層の存在が必要である。又分散剤を含むメッキ層は5
0%が限度である。つまり電命 着法(40%)の残→が60%あるがこの量を全て両分
散メッキで埋込ならば砥粒の突出がなく、切粉の逃げが
なくなり研削不能となる。実用上は結果の示す通シ2o
%以上なければ効果寿命が短くな・るので必然的に特許
請求の範囲に示す如く、超砥粒々径の4o〜eo%を電
着法で固定し更だ其の上方に化学メッキを応用した分散
メッキで潤滑剤や耐摩物質の微粉末の混合物層を粒径の
20〜50%厚で構成し一全5:/ドの厚さが粒径の6
0〜90チの研削砥石が実用的に提案されるものである
That is, the dispersion plated layer containing a dispersant is weak to electrodeposition and has poor abrasive grain retention, so it is necessary to have an electrodeposition layer of at least 40% or more. In addition, the plating layer containing the dispersant is 5
0% is the limit. In other words, there is 60% left over from the electroplating method (40%), but if this amount is completely filled in with both dispersion plating, there will be no protrusion of the abrasive grains, and no chips will escape, making grinding impossible. In practical terms, the results show that 2o
% or more, the effective life will be shortened. Therefore, as shown in the claims, 4o to eo% of the diameter of the superabrasive grains is fixed by electrodeposition, and furthermore, chemical plating is applied above it. By dispersion plating, a layer of a mixture of fine powder of a lubricant or wear-resistant substance is formed with a thickness of 20 to 50% of the particle size.
A grinding wheel of 0 to 90 inches is proposed for practical use.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の実施例を示す概略図、第2図は(イ)
−1表の、第3図は(イ)−2表の、第4図は(ロ)表
の、そして第5図は(ハ)表の結果をそれぞれ図示する
グラフである。 1・・・超砥粒研削材   2・・・台 金3・・・分
散メッキ層(複合化学メッキ層)4・・・電気メツキ層
Fig. 1 is a schematic diagram showing an embodiment of the present invention, Fig. 2 is (a)
FIG. 3 is a graph showing the results of Table -1, FIG. 3 is of Table (A)-2, FIG. 4 is of Table (B), and FIG. 5 is a graph showing the results of Table (C). 1... Super abrasive grinding material 2... Base Metal 3... Dispersion plating layer (composite chemical plating layer) 4... Electroplating layer

Claims (1)

【特許請求の範囲】[Claims] 超砥粒研削材の砥粒径の40〜60%を電着方法により
基板即ち台金上に埋込固定し更にその上方に複合化学メ
ッキ法により、固体潤滑剤の単独層または固体潤滑剤と
耐摩耗性物質の微粉との混合物層を超砥粒々径の20〜
50%厚さよりなる層として形成したことを特徴とする
研削砥石の製造方法。
40 to 60% of the abrasive grain diameter of the superabrasive abrasive material is embedded and fixed on the substrate, that is, the base metal, by electrodeposition, and then a single layer of solid lubricant or a layer of solid lubricant is applied above it by composite chemical plating. A mixture layer with fine powder of wear-resistant material is formed using super abrasive grains with a diameter of 20~
A method for manufacturing a grinding wheel, characterized in that the grinding wheel is formed as a layer having a thickness of 50%.
JP60108445A 1985-05-22 1985-05-22 Manufacture of grinding wheel Pending JPS61270075A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60108445A JPS61270075A (en) 1985-05-22 1985-05-22 Manufacture of grinding wheel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60108445A JPS61270075A (en) 1985-05-22 1985-05-22 Manufacture of grinding wheel

Publications (1)

Publication Number Publication Date
JPS61270075A true JPS61270075A (en) 1986-11-29

Family

ID=14484958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60108445A Pending JPS61270075A (en) 1985-05-22 1985-05-22 Manufacture of grinding wheel

Country Status (1)

Country Link
JP (1) JPS61270075A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63221977A (en) * 1987-03-10 1988-09-14 Mitsubishi Heavy Ind Ltd Electrodeposited grindstone

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5429189A (en) * 1977-08-09 1979-03-05 Honda Motor Co Ltd Abrasive wheel for glinding purpose
JPS5845871A (en) * 1981-09-08 1983-03-17 Matsushita Electric Ind Co Ltd Production method of grindstone
JPS59110560A (en) * 1982-12-16 1984-06-26 Matsushita Electric Ind Co Ltd Manufacturing method of electrodeposition grindstone for cutting
JPS59124574A (en) * 1982-12-29 1984-07-18 Daiyamondo Giken Kk Preparation of cutting edge

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5429189A (en) * 1977-08-09 1979-03-05 Honda Motor Co Ltd Abrasive wheel for glinding purpose
JPS5845871A (en) * 1981-09-08 1983-03-17 Matsushita Electric Ind Co Ltd Production method of grindstone
JPS59110560A (en) * 1982-12-16 1984-06-26 Matsushita Electric Ind Co Ltd Manufacturing method of electrodeposition grindstone for cutting
JPS59124574A (en) * 1982-12-29 1984-07-18 Daiyamondo Giken Kk Preparation of cutting edge

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63221977A (en) * 1987-03-10 1988-09-14 Mitsubishi Heavy Ind Ltd Electrodeposited grindstone

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