JP4157724B2 - Wire saw manufacturing method and manufacturing apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention, WaThe present invention relates to an ear saw manufacturing method and a wire saw manufacturing apparatus. More specifically, the present invention is used for cutting highly brittle materials such as single crystal silicon, quartz, and amorphous silicon, and can be cut without clogging and has almost no probability of disconnection during use. Wire saw-The present invention relates to a method and an apparatus for manufacturing a wire saw that can be manufactured.
[0002]
[Prior art]
For semiconductor devices, brittle materials such as single crystal silicon used for substrates of integrated circuits such as memories, quartz used for oscillators, and amorphous silicon used for solar cells are used. The technology to manufacture at a low price is extremely important.
[0003]
In order to obtain a substrate or the like used for manufacturing a semiconductor device, there is a slicing process in which a columnar material ingot is cut in a radial direction to cut a large number of thin wafers. In the slicing process, it is required to reduce the size of defects and crack layers by slicing as much as possible, and to cut out as many wafers as possible from one ingot as quickly as possible.
[0004]
Conventionally, this slicing process includes a method using an inner peripheral blade and a method using a wire saw using loose abrasive grains.
[0005]
The inner peripheral blade is obtained by fixing diamond abrasive grains to the inner peripheral portion of a thin metal ring by a plating method, has a high cutting efficiency per tool, and is widely used for cutting silicon ingots and the like. However, increasing the inner diameter of the inner peripheral blade has a manufacturing limit as the ingot becomes larger in diameter (300 mm in diameter), and it is difficult to realize a multi-saw that simultaneously processes with a large number of tools. There is a drawback of being.
[0006]
On the other hand, a method using a wire saw using loose abrasive grains is used to supply a wire with a working fluid (paste or slurry) containing GC abrasive grains (high purity silicon carbide abrasive grains) as loose abrasive grains. In this method, the wire is run while being pressed against the object to be processed. In this method, a multi-saw can be easily realized by winding a long wire between two multi-groove pulleys, and a machining efficiency can be improved by simultaneously cutting a large number of wafers from an ingot. In addition, it is easy to cope with a large diameter ingot.
[0007]
However, the method using a wire saw using loose abrasive grains is low in processing efficiency per wire, and because processing is performed while flowing a large amount of machining liquid using GC abrasive grains as loose abrasive grains, There are problems in the usage environment and waste disposal.
[0008]
Recently, a fixed abrasive wire saw such as an electrodeposited wire saw or a resin wire saw in which diamond abrasive grains are fixed to a wire by metal plating or resin has been proposed as a tool having the advantages of both of the above.
[0009]
[Problems to be solved by the invention]
An electrodeposited wire saw in which diamond abrasive grains are fixed to a wire by metal plating has a high abrasive grain holding power because diamond abrasive grains are fixed by metal plating, and can be said to be an ideal tool.
[0010]
However, in a conventional method for producing an electrodeposited wire saw (for example, JP-A-11-277398, JP-A-9-254008, etc.), abrasive grains are adhered to the wire by passing an abrasive pool through the wire. As a result, the amount of abrasive grains adhering to the wire is excessively large (the coverage of the outer peripheral surface of the wire is generally 50% or more), and the amount of abrasive grains per unit length to be fixed to the wire is reduced. It is difficult to produce an electrodeposited wire saw with a low density abrasive grain distribution. Therefore, an electrodeposited wire saw manufactured by a conventional manufacturing method has a high elastic modulus and is weak against twisting, so that there is a high risk of disconnection during use. Moreover, it was not possible to select and use an electrodeposited wire saw having an appropriate abrasive grain distribution (particularly, a low-density abrasive grain distribution) according to the workpiece (cutting target) and processing conditions. Furthermore, it has been difficult to increase the production speed in the conventional method for producing an electrodeposited wire saw.
[0011]
In the method of manufacturing a fixed abrasive wire described in Japanese Patent Application Laid-Open No. 9-254008, when the abrasive grains are fixed in a spiral band shape to the outer peripheral surface of the wire, the wire is rotated around the axis while fixing the abrasive grains. Since it is necessary to rotate and abrasive grains may fall off from the wire at this time, there is a limit to increase the production speed (the wire feed speed, which is the production speed, is about 200 mm / min).
[0012]
For the above reasons, resin wire saws are manufactured in which diamond abrasive grains are fixed to a wire with a resin with an emphasis on production speed, although they are inferior in abrasive grain retention. However, when manufacturing a resin wire saw using a thermosetting resin, a heat-resistant resin cannot be applied to the thermosetting resin in order to prevent the wire from deteriorating. There is a difficult problem to do.
[0013]
In addition, when manufacturing a resin wire saw using a photo-curable resin that does not require heating, the radical reaction of acrylic resin will be used, but polyfunctional monomers with excellent heat resistance cannot be used due to large shrinkage in curing. There is still a problem with heat resistance. In addition, it is conceivable to add metal powder in order to enhance heat resistance. However, since the metal powder does not transmit light, it is difficult to photocur the photocurable resin to which the metal powder is added.
[0014]
  BookThe objective of invention is providing the manufacturing method of the wire saw which can manufacture the electrodeposition wire saw made into the low density abrasive grain distribution from one viewpoint. Moreover, the objective of this invention is providing the manufacturing apparatus of the wire saw which can manufacture the electrodeposition wire saw made into the low density abrasive grain distribution from one viewpoint.
[0015]
[Means for Solving the Problems]
[0018]
  According to the present invention, the first1In the long linear body in which the abrasive grains are adhered to the outer peripheral surface by running in the abrasive grain sedimentation area of the liquid material having at least a part of the abrasive grain sedimentation area in which the abrasive grains are dispersed and settled. The abrasive grains adhered to the outer peripheral surfaceIn a region other than the abrasive sedimentation regionThe above object can be achieved by a method of manufacturing a wire saw including an electrodeposition step of fixing to the outer peripheral surface by forming an electrodeposition layer. In the method of manufacturing a wire saw of the present invention, an electrodeposition liquid having at least a part of an abrasive grain settling region in which abrasive grains are dispersed and settled is used as the liquid material and is long in the abrasive settling region of the electrodeposition liquid. Abrasive adhesion work that attaches abrasive grains to the outer peripheral surface of the linear bodyAbout, Before the electrodeposition step.
[0019]
  According to the present invention, the first2In this aspect, the long linear body is caused to travel in the abrasive sedimentation area in the electrodeposition liquid having at least a part of the abrasive sedimentation area in which the abrasive grains are dispersed and settled. Abrasive adhesion work to attach abrasive grains to the outer peripheral surface ofAbout,In regions other than the abrasive sedimentation region,Including an abrasive electrodeposition step of fixing the abrasive particles adhered to the outer peripheral surface in the abrasive particle adhesion step to the outer peripheral surface by forming an electrodeposition layer, and in the abrasive particle adhesion step, the long linear body The above object can be achieved by a method of manufacturing a wire saw that controls the supply amount of abrasive grains or abrasive grains to be supplied to the abrasive sedimentation region so that abrasive grains are distributed at a desired density on the outer peripheral surface. it can.
[0020]
  According to the present invention, the first3In the electrodeposition bath stored in the electrodeposition bath, an electrodeposition rod capable of forming an electrodeposition layer on a long linear body and an abrasive sedimentation region in which the abrasive particles are dispersed and settled And a means for causing the long linear body to travel in the abrasive sedimentation region, and the abrasive grain ejecting portion is used as an abrasive. An abrasive grain supply unit that stirs the abrasive grains or abrasive grain-containing material supplied from the grain inlet, and an abrasive release that is released in a state where the abrasive grains or abrasive grain-containing material stirred in the abrasive grain supply unit is dispersed. A substantially U connecting the outlet, an abrasive recovery unit that recovers abrasive grains or abrasive-containing materials discharged from the abrasive discharge port from the abrasive recovery port, and the abrasive recovery unit and the abrasive supply unit A shaped return pipe part and abrasive grains or abrasive grain-containing materials recovered by the abrasive grain recovery part through the substantially U-shaped return pipe part The apparatus for manufacturing a wire saw comprising an abrasive circulation system comprising a pump for transporting the sheet portion, it is possible to achieve the above object. The apparatus for manufacturing a wire saw according to the present invention can reduce the amount of abrasive grains or abrasive-grain-containing materials released from the abrasive grain discharge portion so that abrasive grains are distributed at a desired density on the outer peripheral surface of the long linear body. An abrasive grain discharge amount control unit can be provided. In the present invention, the description of the numerical value range includes not only both end values but also any arbitrary intermediate value included therein.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
[Wire saw]
  Of the wire saw of the present inventionA wire saw that can be manufactured by a manufacturing method (hereinafter, simply referred to as a wire saw of the present invention)The coverage (percentage) of the outer periphery of the long linear body with abrasive grains is preferably 1 to 35% (more preferably 1 to 25%, still more preferably 5 to 25%). By setting the coverage to 35% or less, the rigidity of the wire saw can be suppressed. As a result, in the wire saw of the present invention, the shearing force generated when twisted is reduced and it is difficult to break.
[0022]
The long linear body may be a long linear body conventionally used for a wire saw as long as it is a material that can form an electrodeposition layer (for example, an electroplating layer) on the outer peripheral surface. It may be covered with a layer. The long linear body is, for example, a conductive wire (for example, a steel wire) or one or more conductive layers (for example, a conductive plating layer) on the outer peripheral surface of the wire. The layer can be a conductive layer-coated wire. The long linear body can be a combination of two or more of these wires.
[0023]
As one form of the wire saw of the present invention, there is a wire saw in which abrasive grains are dispersed and distributed at a substantially uniform density (area density) over the entire outer peripheral surface of a long linear body. The wire saw of this form can be divided into sections (however, the final end portion is equal to or less than the length L) divided in the length direction by a length L (L = 1 to 1000 mm). The coverage by the abrasive grains on the outer periphery of the long linear body in each section is preferably 1 to 35% (more preferably 1 to 25%, still more preferably 5 to 25%). In addition, as the length L of the segmented section becomes smaller than 1000 mm (for example, 800 mm, 600 mm, 400 mm, 200 mm, 100 mm, 50 mm, 10 mm, 5 mm, 1 mm), the coverage becomes 1-35% (further 1 to 25%, and further 5 to 25%) is preferable because the abrasive grains are more uniformly dispersed.
[0024]
In this form of wire saw, the coverage by the abrasive grains on the outer circumference of the long linear body exists in each section divided by the length L, and the maximum value and the minimum of these coverages The absolute value of the difference between the values is preferably 3 (%) or less (more preferably 0 to 2 (%), still more preferably 0 to 1 (%)). As a wire saw of this form, for example, a wire saw in which the maximum value of the coverage is 15% and the minimum value is 12% (the absolute value of the difference between the maximum value and the minimum value of the coverage is 3 (% )).
[0025]
  Moreover, as another form of the wire saw of the present invention, the abrasive grains are distributed at a high density (high surface density) (preferably uniformly distributed) on the outer periphery of the long linear body, and a low density ( There is a wire saw in which a low density region distributed (preferably uniformly distributed) with a low areal density repeats alternately in the length direction of the long linear body. The high-density region of this form of wire sawAll ofIn this case, the coverage A by the abrasive grains on the outer peripheral surface of the long linear body is1~ 35%(Good1-25%,ThanPreferably it is 5 to 25%). Also, the low density regionAll ofThe coverage B by the abrasive grains on the outer circumference of the long linear body is, 0. 2-28%(GoodPreferably 0.2-23%,ThanPreferably it is 1 to 20%). The high density region and the low density regionAll ofCombinationIn any wayabout,B / A is 0.2 to 0.8.
[0026]
Each of the high-density regions of the wire saw of this form has a coverage by the abrasive grains on the outer peripheral surface of the long linear body, but the difference between the maximum value and the minimum value in these coverages (percentage) The absolute value is preferably 3 (%) or less (more preferably 0 to 2 (%), still more preferably 0 to 1 (%)). Further, each of the low-density regions of the wire saw of this embodiment has a coverage by the abrasive grains on the outer peripheral surface of the long linear body, and the maximum value and the minimum value among these coverages (percentage) The absolute value of the difference is preferably 3 (%) or less (more preferably 0 to 2 (%), still more preferably 0 to 1 (%)).
[0027]
The present invention has a region in which a high-density region in which abrasive grains are distributed at a high density and a low-density region in which a low-density distribution is distributed alternately on the outer circumferential surface of the long linear body in the length direction of the long linear body. An example of a wire saw will be described with reference to FIGS. 3-5, the electrodeposition layer which fixes an abrasive grain is abbreviate | omitted. FIG. 3 is a schematic perspective view of an example of the wire saw of the present invention. The wire saw 30 in FIG. 3 includes a high density region 33 in which abrasive grains 32 are distributed at a high density on a peripheral surface of a substantially cylindrical long linear body 31, a low density region 34 in which abrasive grains 32 are distributed at a low density, A high-density region 35 in which the abrasive grains 32 are distributed at a high density is provided in the length direction of the long linear body 31 in this order.
[0028]
The coverage A of the high-density regions 33 and 35 of the long linear body 31 by the abrasive grains 32 on the outer circumferential surfaces 33s and 35s of the long linear body is in the range of 1 to 35%, respectively. In addition, the coverage B of the low-density region 34 of the long linear body 31 with the abrasive grains 32 on the outer periphery 34s of the long linear body is in the range of 0.2 to 28%. For the high density region 33 and the low density region 34, B / A is in the range of 0.2 to 0.8. Moreover, B / A is in the range of 0.2 to 0.8 for the high density region 35 and the low density region 34.
[0029]
4 is a schematic cross-sectional view of the wire saw of FIG. 3, wherein (a) is a schematic cross-sectional view in the radial direction of the high-density region, and (b) is a schematic cross-sectional view in the radial direction of the low-density region. . In the high density region 33, the abrasive grains 32 are distributed at a high density on the outer circumferential surface 33s of the long linear body as shown in (a), and in the low density region 34, the outer circumferential surface of the long linear body as shown in (b). The abrasive grains 32 are distributed at a low density in 34 s.
[0030]
FIG. 5 is a developed view in which the outer peripheral surface of a long linear body as another example of the wire saw of the present invention is cut in the length direction of the long linear body to make a flat surface. In the developed view, there are rectangular high density regions 53 and 55 in which abrasive grains 52 are distributed at high density, and rectangular low density regions 54 and 56 in which abrasive grains 52 are distributed at low density. The high-density region 53, the low-density region 54, the high-density region 55, and the low-density region 56 are alternately repeated in the order of the high-density region and the low-density region in the length direction of the long linear body.
[0031]
The coverage A of the long linear body outer peripheral surfaces 53s and 55s by the abrasive grains 52 in each of the high-density regions 53 and 55 is in the range of 1 to 35%. The coverage B of the long linear body outer peripheral surfaces 54s and 56s by the abrasive grains 52 in each of the low density regions 54 and 56 is in the range of 0.2 to 28%. For four combinations between the high density regions 53, 55 and the low density regions 54, 56, B / A is in the range of 0.2 to 0.8.
[0032]
The thickness of the abrasive fixed electrodeposition layer for fixing abrasive grains to the outer peripheral surface of the long linear body of the wire saw of the present invention is, for example, 5 to 200% of the diameter of the abrasive grains to be fixed. can do. The wire saw of the present invention can be provided with at least one coating layer that covers the abrasive fixed electrodeposition layer. The material of the coating layer can be the same as the material of the abrasive fixed electrodeposition layer, or can be a different material. The coating layer can be a layer formed by electrodeposition, or can be a layer formed by a method other than electrodeposition. When the front-end | tip part of an abrasive grain protrudes from the said abrasive fixed electrodeposition layer, the front-end | tip part of an abrasive grain can be protruded from the said coating layer, and can be made to embed in the said coating layer.
[0033]
  An abrasive grain can be suitably selected according to a cutting object. When the hardness to be cut is small, ordinary abrasive grains such as alumina abrasive grains can be used. The abrasive grains are preferably superabrasive grains having a hardness higher than that of cubic boron nitride (for example, diamond abrasive grains, cubic boron nitride abrasive grains, or a mixture thereof). From the relationship with the diameter of the long linear body, the average grain size of the abrasive grains is, Long35% or less of the diameter of the linear body(GoodPreferably 1-35%,ThanPreferably, it is 5 to 35%. In addition, the average grain size of the abrasive grains ensures a good grinding force.1μm or more and 60 μm or less (more preferably 2 μm or more and 55 μm or less, and further preferably 3 μm or more and 50 μm or less).
[0034]
Moreover, as an abrasive grain, the coated abrasive grain which is an abrasive grain with which the abrasive grain surface is coat | covered with the at least 1 layer of coating layer can be used. The coating layer can be, for example, a metal plating layer such as a nickel plating layer, and preferably has an affinity (for example, chemical affinity) to a long linear body (more preferably, The covering layer is made of a material that is the same as or similar to the material of the long linear body. For example, when the long linear body is steel, the coating layer is a metal layer such as a nickel layer (preferably a metal plating layer such as a nickel plating layer).
[0035]
In the case of bare abrasive grains (for example, diamond abrasive grains) that do not have a coating layer, the abrasive grains are physically held by an electrodeposited layer (for example, a plating layer) against a long linear body in a wire saw. The On the other hand, the coating coated with a coating layer (for example, a metal plating layer such as a nickel plating layer) having an affinity (for example, chemical affinity) to a long linear body (for example, steel) In the case of abrasive grains, the coated abrasive grains are not only physically held by an electrodeposition layer (for example, a metal plating layer) but also chemically held with respect to a long linear body in a wire saw. Is possible.
[0036]
Therefore, when the coated abrasive is temporarily fixed to the long linear body when the coated saw is used to manufacture the wire saw of the present invention, a bare abrasive grain having no coating layer (for example, diamond abrasive) ) Is temporarily fixed (for example, in the first electrodeposition iron C1 of Example 1, when the adhered abrasive grains are fixed with a plating layer), a smaller amount of electrodeposition layer (for example, plating) Layer) can be temporarily fixed to a long linear body (fixed to the extent that it does not fall off with a pulley). When using coated abrasive grains, the thickness of the plating layer for temporarily fixing the abrasive grains is such that the abrasive grains fixed to the traveling long wire do not fall off the long wires with a pulley, and preferably the adhered abrasive The thickness is about 1 to 10% of the grain diameter.
[0037]
As the coated abrasive, one having a coverage (weight percentage of the coating layer in the coated abrasive) of, for example, 30 to 55% by weight can be used. Those with a coverage in the above range are commercially available. As the coated abrasive, for example, there is one in which a metal layer (metal layer of nickel, titanium, copper, etc.) covers the surface of the abrasive. As the coated abrasive grains, those commercially available as coated abrasive grains used for diamond wheels using resin bonds (annular grinding wheels using diamond abrasive grains) can be used.
[0038]
In addition, since the diamond abrasive grains coated with a nickel layer (for example, nickel plating layer) are dispersed in the plating solution and then charged slightly positive (positive), this charging causes a long linear shape as a cathode. It will be attracted to the body (eg, steel wire). For this reason, in particular, in the case of fine particles (for example, an average particle diameter of 20 μm or less), it is possible to electrically approach the long linear body against gravity, so the lower side of the long linear body (towards the direction of gravity) Abrasive grains can also be attached to the other side.
[0039]
[Wire saw manufacturing method]
  In the method of manufacturing a wire saw according to the present invention, preferably, the abrasive grains are dispersed in the abrasive sedimentation area of the liquid material having at least a part of the abrasive grain sedimentation area in which a large number of abrasive grains are dispersed and settled in substantially the same direction. In the long linear body adhered to the outer circumferential surface, the abrasive grains adhered to the outer circumferential surfaceIn a region other than the abrasive sedimentation regionAbrasive electrodeposition step of fixing to the outer peripheral surface by forming an electrodeposition layer is included. Electrodeposition of the abrasive grains adhered to the outer peripheral surface to the outer peripheral surface can be performed, for example, by electroplating.
[0040]
In the electrodeposition step of the wire saw manufacturing method of the present invention, only one to several layers of abrasive grains are present on the outer peripheral surface of the long linear body, which hinders the formation of an electrodeposition layer (for example, an electroplating layer). Since the electrodeposition layer can be formed in the state, the supply of metal ions in the vicinity of the long linear body is performed quickly, so even if the current density is set high, problems such as "burning / hydrogen generation" Does not occur. As a result, according to the method for manufacturing a wire saw of the present invention, the current density in the electrodeposition process can be set high without causing problems, and the manufacturing speed can be increased.
[0041]
The wire saw manufacturing method of the present invention is an electrodeposition liquid having at least a part of an abrasive grain settling region in which a majority of abrasive grains are dispersed and settle in substantially the same direction before the abrasive electrodeposition process. An abrasive grain attaching step of attaching abrasive grains to the outer peripheral surface of the long linear body can be provided. In the abrasive grain adhesion step, the traveling direction of the long linear body with respect to the sedimentation direction of the abrasive grains is appropriately set so that the abrasive grains adhere to the outer peripheral surface of the long linear body, and the abrasive sedimentation region The long linear body is made to travel with. In addition, the adhesion amount of the abrasive grain to the outer peripheral surface of a long linear body can be changed by changing suitably the running direction of a long linear body with respect to the sedimentation direction of an abrasive grain. The long linear body is in the abrasive grain settling region so as to intersect at substantially right angles (preferably 70 to 110 °, more preferably 80 to 100 °) with the abrasive settling direction (generally the gravity direction). Can be run.
[0042]
Change (expansion or reduction) of the range of the abrasive grain settling region, change (increase or decrease) of the travel distance of the long linear body in the abrasive settling region, degree of dispersion of abrasive grains in the abrasive settling region ( The amount of abrasive grains adhered to the outer peripheral surface of the long linear body or the long linear body by at least one of the change (increase or decrease) of the weight or number of abrasive grains dispersed per fixed volume It is possible to change (increase or decrease) the degree of distribution of the abrasive grains on the outer peripheral surface of.
[0043]
In the abrasive grain adhesion step, for example, most of the abrasive grains dispersed in at least a part of an electrodeposition liquid (for example, electroplating liquid) stored in an electrodeposition bath capable of electrodepositing abrasive grains are substantially the same. In the abrasive grain settling region that settles in the direction, the long linear body can be made to travel so that the abrasive grains adhere to the outer peripheral surface of the long linear body.
[0044]
Examples of the abrasive sedimentation region include a majority (preferably 70% or more, more preferably 80% or more, still more preferably 90% or more, particularly preferably 95 to 90%) dispersed in a liquid material (for example, electrodeposition liquid). There is an abrasive sedimentation region where 100% of the abrasive grains naturally settle in the direction of gravity due to the weight of the abrasive.
[0045]
In the abrasive grain adhesion step, the abrasive grains are supplied to the abrasive sedimentation region so that the abrasive grains are distributed at a desired density (surface density) in the longitudinal direction of the long linear body on the outer circumferential surface of the long linear body. It is possible to control the supply amount of abrasive grains or abrasive grains-containing materials (slurry or paste-like abrasive grains-containing materials). For example, by controlling the supply amount to be substantially constant over time, and running a long linear body in an abrasive sedimentation region in which the amount of abrasive particles that settle per unit time is controlled to be substantially constant. The amount of abrasive grains adhering to the outer circumference of the long linear body in the length direction of the long linear body (unit length or amount of abrasive grains per unit area) and the degree of dispersion can be made substantially uniform. . In addition, the amount of abrasive grains settled per unit time in a cross section in a direction perpendicular to the abrasive grain settling direction is increased by controlling the supply amount to be increased and decreased time periods alternately. By running a long linear body in an abrasive grain settling area that is controlled so that the time zone and a few time zones are repeated alternately, the abrasive grains are dispersed at a high density, and the abrasive grains are dispersed at a low density. Thus, it is possible to form a region on the outer peripheral surface of the long linear body, in which the region to be adhered alternately repeats in the length direction of the long linear body.
[0046]
In the abrasive grain adhesion step, coated abrasive grains (for example, coated abrasive grains whose coating layer is a nickel layer) whose coating layer is a magnetic body (preferably a ferromagnetic body) are adhered to the outer peripheral surface of the long linear body. In this case, when the long linear body can be magnetized (for example, when the long linear body is a steel wire), the long linear body can be magnetized before the coated abrasive is attached. it can. The long linear body can be magnetized using a permanent magnet (for example, an alnico magnet).
[0047]
By magnetizing the long linear body, the coated abrasive particles are attracted to the long linear body and magnetically attached, and once attached, they do not easily fall off. In particular, when the production speed (running speed of the long linear body) is increased (for example, 1000 mm / min), the abrasive grains become long linear due to friction with the liquid body (for example, electrodeposition liquid such as plating solution). It can be prevented from falling off the body. Further, the long linear body travels in a direction substantially perpendicular to the settling direction of the coated abrasive grains in the abrasive dispersion settling region where the coated abrasive grains are dispersed and settled. The said coated abrasive grain can be made to adhere to the outer peripheral surface (including the outer peripheral surface part which faces a gravitational direction) over the perimeter of the circumferential direction of a body. In addition, by appropriately setting the degree of magnetization of the long linear body, or the travel distance, traveling time, traveling speed, etc. of the long linear body in the abrasive grain dispersion sedimentation region, the long linear body The coated abrasive grains can be dispersed and adhered to the outer peripheral surface over the entire circumference in the circumferential direction of the body.
[0048]
Moreover, the manufacturing method of the wire saw of this invention is the pre-processing process which pre-processes a elongate linear body so that electrodeposition can be favorably performed before the said abrasive grain adhesion process, and the said abrasive grain electrodeposition process. Base electrodeposition to form a base electrodeposition layer (preferably a base electrodeposition layer of the same material as the electrodeposition layer to be formed) on the outer peripheral surface of the long linear body so that the electrodeposition layer to be formed can be easily formed Either or both of the layer forming steps can be included. As the pretreatment step, for example, the deposit removal step of removing deposits such as oil adhering to the long linear body with a solvent that dissolves or disperses the deposits, and the long linear body There is a step of dissolving and removing the non-conductive film in which the formed non-conductive film (non-conductive oxide film or the like) is dissolved and removed.
[0049]
As a long linear body used in the method of manufacturing a wire saw of the present invention, any wire wire saw conventionally used as long as an electrodeposition layer (electroplating layer or the like) can be formed on the outer peripheral surface is appropriately used. It can be selected and used, and it may be coated with one or more coating layers. The long linear body is, for example, a conductive wire (for example, a steel wire) or one or more conductive layers (for example, a conductive plating layer) on the outer peripheral surface of the wire. Layer). Further, the long linear body can be formed by twisting two or more of these wires.
[0050]
The average grain size of the abrasive grains used in the method of manufacturing a wire saw of the present invention is set to a range in which the abrasive grains can be dispersed in a liquid material (for example, electroplating liquid), and preferably transferred with the liquid material. Set to a range that can be circulated. The average grain size of the abrasive grains is preferably 1 μm or more and 60 μm or less (more preferably 2 μm or more and 55 μm or less, and further preferably 3 μm or more and 50 μm or less). This is because abrasive grains having an average particle size exceeding 60 μm tend to be difficult to disperse in a liquid or to be transported or circulated together with the liquid. In addition, the average particle diameter of the abrasive grains is preferably 35% or less (more preferably 30% or less) of the diameter of the long linear bodies from the relationship with the diameter of the long linear bodies to which the abrasive grains are to be attached. And more preferably 25% or less).
[0051]
[Wire saw manufacturing equipment]
The wire saw manufacturing apparatus of the present invention includes a first roll for winding a long linear body in addition to the electrodepositing iron, the abrasive grain discharge part, and the abrasive grain discharge amount control part specified in the present invention, Means for running a long linear body such as a second roll for winding the long linear body drawn from the first roll, a motor for rotating the rolls around the central axis, etc. A means for changing the traveling direction of the long linear body such as a pulley can be provided.
[0052]
【Example】
[Example 1]
The manufacturing method of the wire saw of one Example of this invention is demonstrated based on FIG. 1 of drawing. Drawing 1 is an outline fragmentary sectional view of the running direction of a long wire for explaining an outline of a manufacturing method of a wire saw of this example. The long wire W is wound around a roll R and travels while being guided by a pulley P when its tip is wound around a rotating shaft (not shown) such as a motor. In the method of manufacturing the wire saw of this embodiment, the degreasing iron A1, the first water washing iron A2, the pickling iron A3, the second water washing iron A4, the base plating iron B, the first electrodeposition iron C1, the second A pulley P is provided so that the long wire W sequentially passes through a predetermined liquid material stored in each of the electrodeposition rod C2, the embedded rod D, and the water washing rod A5.
[0053]
Each of the above-mentioned irons is electroplated so that the traveling long wire is electroplated with each of the base plating iron B, the first electrodeposition iron C1, the second electrodeposition iron C2, and the embedded iron D. In addition, an anode electrode (not shown) is provided in the plating bath, and a traveling long wire is brought into contact with the cathode electrodes Z1, Z2, Z3, Z4, Z5 and Z6. The cathode electrode will be described in detail as follows.
[0054]
The cathode electrode Z1 is in contact with the long wire portion after being immersed in the water of the second water rinsing bath A4 and before being immersed in the plating bath of the base plating bath B. The cathode electrode Z2 is in contact with the long wire portion after being immersed in the plating bath of the base plating rod B and before being immersed in the plating bath of the first electrodeposition rod C1. The cathode electrodes Z3 and Z4 are in contact with the long wire portion after being immersed in the plating bath of the first electrodeposition rod C1 and before being immersed in the plating bath of the second electrodeposition rod C2. The cathode electrode Z5 is in contact with the long wire portion after being immersed in the plating bath of the second electrodeposition rod C2 and before being immersed in the plating bath of the embedded rod D. The cathode electrode Z6 is in contact with the long wire portion after being immersed in the plating bath of the embedded rod D and before being immersed in the water of the water rinsing A5.
[0055]
The travel of the long wire W will be described in detail as follows. First, since the long wire part which is a part of the long wire W which is the steel wire pulled out from the roll R passes through the degreasing liquid (sodium hydroxide aqueous solution) of the degreasing pad A1, the long wire part is long. When oil is attached to the length wire portion, the oil content can be removed from the long wire portion. Next, since the long wire portion passes through the water of the first water washing bowl A2, the degreasing liquid adhering to the long wire portion can be removed (replaced with water). .
[0056]
Next, since the long wire portion passes through the pickling solution A3 (hydrochloric acid), when the oxide layer is formed on the surface of the long wire portion, the long wire portion is long. The oxide layer can be removed from the wire portion. Next, since the long wire portion passes through the water of the second washing bowl A4, the pickling solution adhering to the long wire portion may be removed (replaced with water). it can.
[0057]
Next, since the long wire portion passes through the plating bath of the base plating rod B, the outer peripheral surface of the long wire portion is coated on the surface (outer peripheral surface) of the long wire portion without the oxide layer. Thus, a tubular base plating layer is formed by electroplating. The base plating layer is a layer formed in advance so that a plating layer for abrasive electrodeposition can be easily formed on a long wire. The thickness of the base plating layer formed on the long wire is about 1 to 10 μm.
[0058]
Next, the long wire portion passes through the plating bath of the first electrodeposition rod C1. A first abrasive grain settling region T1 is provided in a partial region of the plating bath of the first electrodeposit iron C1. In the abrasive grain settling region, since the abrasive grains are supplied in a dispersed state with respect to the liquid level of the plating bath, the abrasive grains settle in the plating bath in a dispersed state.
[0059]
In the plating bath of the first electrodeposition rod C1, the long wire portion passes through the first abrasive sedimentation region T1 of the plating bath of the first electrodeposition rod C1, so that the long wire portion (underlying plating layer) Abrasive grains settle and are supplied in the direction of gravity from the upper side (plating bath liquid level side), so that part of the outer peripheral surface of the long wire portion (mainly facing the plating bath liquid level) Abrasive grains adhere only to the substantially half circumferential surface on the side. Next, since the long wire portion continues to pass through a region (region where no abrasive grains are supplied) other than the abrasive sedimentation region of the plating bath of the first electrodeposition rod C1, a plating layer is formed. By this formed plating layer (abrasive-fixing plating layer), the base plating layer of the long wire portion (in some cases, the electroplating newly formed on the base plating layer with the first electrodeposition electrode C1) The abrasive grains adhering to the layer) are fixed to a base plating layer (in some cases, an electroplating layer newly formed on the base plating layer with the first electrodeposition electrode C1). The thickness of the plating layer for fixing the abrasive grains is set so that the abrasive grains fixed to the traveling long wire do not fall off from the long wire with a pulley, and preferably 5 to 25 of the diameter of the adhered abrasive grains. % Thickness. Here, the side on which the abrasive grains are fixed to the long wire by the first electrodeposition electrode C1 is referred to as the “front side” of the long wire, and the side on which the abrasive grains are not fixed is referred to as the “back side” of the long wire. I will call it.
[0060]
The long wire portion that has passed through the plating bath of the first electrodeposition rod C1 is a pulley so that the front side to which the abrasive grains are fixed faces the direction of gravity before entering the plating bath of the second electrodeposition rod C2. 11 and 12 reverse the traveling direction by 180 °.
[0061]
Next, the long wire portion passes through the plating bath of the second electrodeposition rod C2. Similar to the first electrodeposition iron C1, the second electrodeposition iron C2 is provided with a second abrasive sedimentation region T2 in a partial region of the plating bath. In the abrasive grain settling region, since the abrasive grains are supplied in a dispersed state with respect to the liquid level of the plating bath, the abrasive grains settle in the plating bath in a dispersed state.
[0062]
In the plating bath of the second electrodeposition rod C2, the long wire portion has the second abrasive sedimentation region T2 of the plating bath of the second electrodeposition rod C2 on the side (front side) on which the abrasive grains are fixed. Passes with the side (back side) where the abrasive grains are not fixed by the first electrodeposition rod C1 facing the liquid surface side of the plating bath, facing downward (the inner bottom surface of the second electrodeposition rod C2). . Therefore, abrasive grains adhere only to the back side of the long wire portion. Next, since the long wire portion continues to pass through a region other than the second abrasive sedimentation region T2 of the plating bath of the second electrodeposition rod C2, a plating layer is formed on the long wire portion. By the plating layer formed by the second electrodeposition rod C2, the abrasive grains adhering to the plating layer of the long wire portion (plating layer formed by the first electrodeposition rod) are fixed to the adhered plating layer. Is done. The thickness of the plating layer formed by the second electrodeposition electrode C2 is set to such a thickness that the abrasive grains fixed to the traveling long wire portion do not fall off from the long wire portion with a pulley, and preferably the adhered abrasive The thickness is about 5 to 25% of the grain diameter.
[0063]
Next, since the long wire portion passes through the plating bath of the embedded rod D, a new plating layer is formed on the surface of the long wire portion in the embedded rod D by electroplating. This plating layer is a buried plating layer formed so that the abrasive grains electrodeposited on the surface of the long wire in the first and second electrodeposition plating baths are completely buried. The thickness of the embedded plating layer is set to such a thickness that the abrasive grains are completely embedded, for example, 20 to 80% (preferably 25 to 75%, more preferably 30 to 70%) of the diameter of the embedded abrasive grains. To.
[0064]
Finally, the long wire portion passes through the water of the water rinsing A5 to remove the plating solution of the plating bath adhering to the long wire portion (replace with water).
[0065]
[Example 2]
In Example 1, the plating layer from the base plating layer to the embedded layer is formed using the base plating rod B, the first electrodeposition rod C1, the second electrodeposition rod C2, and the embedded rod D. However, the plating layer can be formed in the same manner using only one electrodeposition electrode. An example of this case will be described with reference to FIG. FIG. 2 is a schematic partial cross-sectional view of an electrodeposition rod 20 that can be used in the method for manufacturing a wire saw according to another embodiment of the present invention.
[0066]
The electrodepositing rod 20 is provided with an abrasive circulation device 29. This abrasive circulator will be described as follows. First, abrasive grains or abrasive grains-containing material (slurry or paste containing abrasive grains) is supplied from the abrasive grain inlet 29a. The supplied abrasive grains or abrasive grain-containing materials reach the abrasive grain supply unit 29b and are stirred, and are discharged into the plating solution from the abrasive grain discharge port 29c in a state where the abrasive grains are dispersed. The majority of the abrasive grains in the released abrasive grains or abrasive grain-containing material settle down toward the abrasive grain recovery port 29d in a dispersed state, and an abrasive grain settling area T is formed.
[0067]
The settling abrasive grains enter the abrasive grain collection unit 29e from the abrasive grain collection port 29d and are collected. The collected abrasive grains are transferred together with the plating solution to the abrasive grain supply section 29b through a substantially U-shaped return pipe section 29f by a pump provided in the abrasive grain collection section 29e. The abrasive grains and the plating solution that have reached the abrasive grain supply unit 29b are stirred by the abrasive grain supply unit 29b, and discharged from the abrasive grain discharge port 29c into the plating liquid as slurry (plating liquid in which the abrasive grains are dispersed). Since most of the abrasive grains contained in the discharged slurry settle toward the abrasive collection port 29d in a dispersed state, the abrasive grain settling region T is continuously maintained. In addition, since the amount of abrasive grains circulating through the abrasive circulation device adheres to the long wire and gradually decreases, abrasive grains or abrasive grains containing materials (slurry or paste containing abrasive grains) can be ground as necessary. It is supplied from the grain inlet 29a.
[0068]
On the other hand, in the same manner as in Example 1, the long wire W ′ that has passed the predetermined liquid stored in each of the degreasing basket, the first washing bowl, the pickling bowl, and the second washing bowl is provided with pulleys 21 to 28. And travels in the electrodeposition rod 20 filled with the plating solution 20a, so that a plating layer is formed. More details are as follows.
[0069]
A base plating layer is formed on the outer peripheral surface of the long wire portion that is a part of the long wire W ′ that is guided by the pulleys 21 and 22 and enters the plating bath before entering the abrasive grain settling region T. Next, the long wire portion on which the base plating layer is formed passes through the abrasive sedimentation region T, thereby attaching abrasive grains to the base plating layer. Specifically, the abrasive grains are attached to a part of the outer peripheral surface of the long wire portion (mainly, the substantially half peripheral surface portion facing the side where the abrasive grain discharge port 29c of the abrasive circulation device 29 is present).
[0070]
Since the long wire portion in which the abrasive grains are adhered to the underlying plating layer by passing through the abrasive sedimentation region T is formed before reaching the pulley 23, the abrasive grains adhered to the underlying plating layer are Fixed to the underlying plating layer. The long wire portion that is guided by the pulleys 23 and 24 and before entering the abrasive grain settling region T again is guided by the pulleys 23 and 24, so that the traveling direction is reversed by 180 ° and passes through the plating bath. Since it runs, the central part on the side (front side) where the abrasive grains are attached faces downward (the abrasive recovery port 29d of the abrasive circulation device 29), and the central part on the side (back side) where the abrasive grains are not attached is While facing upward (the abrasive discharge port 29c of the abrasive circulation device 29), a plating layer is further formed.
[0071]
Since the long wire portion in which the abrasive grains are attached only to the back side by re-passing through the abrasive sedimentation region T is formed with a plating layer before reaching the pulley 25, the abrasive grains attached to the back side are Fixed to the deposited plating layer. The long wire portion to which the abrasive grains are fixed in this way is guided by pulleys 25, 26, 27 and 28 and travels in the plating bath. Therefore, the fixed abrasive particles are buried in the long wire portion. An embedded plating layer is further formed with such a thickness.
[0072]
The pulleys 21 to 28 can be fixed by moving the arrangement positions. Therefore, the thickness of each plating layer (the base plating layer, the plating layer for fixing the abrasive grains to the long wire and the embedded plating layer) can be set by appropriately setting the arrangement positions of the pulleys 21 to 28. Can be adjusted. Further, the abrasive circulation device 29 is set to the first and second electrodeposition irons C1 and C1 so that the abrasive grains settle in the abrasive grain settling regions T1 and T2 of the first and second electrodeposition irons C1 and C2 of the first embodiment. 2 can be provided.
[0073]
Moreover, in Examples 1 and 2, after reversing the traveling direction of the long wire portion having the side (front side) on which the abrasive grains were fixed first by 180 °, the abrasive grain unfixed side of the outer peripheral surface of the long wire portion When electrodepositing abrasive grains on the back side, in order to eliminate the difference in the formation amount of the plating layer on the front side and the back side and form a plating layer with a uniform thickness in the circumferential direction, The plating solution can be removed from the front side by running so that the front side is in contact with the shield so that the formation speed becomes slow. The thickness of the plating layer when electrodepositing the abrasive grains on the back side of the outer peripheral surface of the long wire portion is preferably about 5 to 25% of the diameter of the abrasive grains adhered to the back side.
[0074]
Further, when complete embedding of the electrodeposited abrasive grains on the outer peripheral surface of the long wire portion is performed, the embedding rate (ratio of the thickness of the embedded plating layer to the abrasive grain size) is preferably 20 to 80%. (More preferably 25 to 75%, still more preferably 30 to 70%). The higher the wire feed rate (running speed), the faster the production speed, but it is appropriately determined according to the current density to be set and the size of the plating tank.
[0075]
[Example 3]
The manufacturing method of the wire saw of other one Example of this invention is demonstrated based on FIG. FIG. 6 is a schematic partial cross-sectional view in the traveling direction of the long wire for explaining the outline of the manufacturing method of the wire saw of the present embodiment, and the same reference numerals as those in FIG. The description is omitted.
[0076]
As in Example 1, the long wire portion that is a part of the long wire W that has passed through the degreasing rod A1, the first water washing rod A2, the acid washing rod A3, the second water washing rod A4, and the base plating rod B, It is magnetized by the Alnico magnet M, which is a permanent magnet provided in the vicinity of the cathode electrode Z2, so that a ferromagnetic material (for example, iron, cobalt, nickel) can be attracted.
[0077]
The magnetized long wire portion passes through the plating bath of the electrodeposition electrode C1 '. An abrasive grain settling region T1 'is provided in a partial region of the plating bath of the electrodeposition rod C1'. In the abrasive sedimentation region, nickel-coated abrasive grains having an average particle diameter of 15 μm with respect to the liquid surface of the plating bath (the abrasive grains are coated with a nickel layer on the surface of the nickel-coated abrasive grains, The nickel-coated abrasive grains settle in the plating bath in a dispersed state. The nickel-coated abrasive grains can be supplied as a slurry dispersed in water to the liquid surface of the plating bath or near the lower side thereof.
[0078]
In the plating bath of the electrodeposition rod C1 ′, when the magnetized long wire portion passes through the grain settling region T1 ′ of the plating bath of the electrodeposition rod C1 ′, unlike the first embodiment, the long wire portion ( The nickel-coated abrasive grains can be dispersed and attached not only on the upper side (which includes the base plating layer) (the liquid surface side of the plating bath) but also on the entire outer peripheral surface of the long wire portion. Therefore, the second electrodeposition electrode C2 provided in Example 1 is not provided because it is not necessary to provide it.
[0079]
Next, the long wire portion continues to pass through a region (region where no abrasive grains are supplied) other than the abrasive grain settling region of the plating bath of the electrodeposition rod C1 ', so that a plating layer is formed. By this formed plating layer (abrasive-fixing plating layer), a base plating layer for the long wire portion (in some cases, an electroplating layer newly formed on the base plating layer with an electrodeposition electrode C1 ′) The abrasive grains adhering to are fixed to a base plating layer (in some cases, an electroplating layer newly formed on the base plating layer with an electrodeposition iron C1 ′). The thickness of the plating layer for fixing the abrasive grains is set to such a thickness that the abrasive grains fixed to the traveling long wire does not fall off from the long wire with a pulley, and preferably 1 to 10 of the diameter of the adhered abrasive grains. % Thickness.
[0080]
Next, in the same manner as in Example 1, the long wire portion passes through the plating bath of the embedded rod D to form an embedded plating layer having a thickness enough to completely bury the nickel-coated abrasive grains. Finally, it passes through the water of the water rinsing A5 and removes the plating solution of the plating bath adhering to the long wire portion (replaces with water). Examples of manufacturing conditions in the method for manufacturing a wire saw include the following.
[0081]
<Examples of manufacturing conditions>
Type of plating bath: Watt bath (adjusted with nickel sulfate, nickel chloride, boric acid)
Plating bath pH: 3.0 to 6.0
Plating bath temperature: 30-50 ° C
Wire feed rate: 50-5000mm / min
Current density: 0.5 to 15 A / dm²
Wire diameter: φ0.05-0.30mm
Abrasive grains: Diamond abrasive grains (average grain size 1-80 μm)
[0082]
In the method of manufacturing the wire saw of the above embodiment, plating inhibition due to abrasive grains hardly occurs, and even when a watt bath is used, the current density can be increased. For this reason, the production speed can be increased, and the plating bath can be easily maintained, so that it can be produced at low cost. In addition, it becomes easier to fully automate and can withstand the production of long-distance wire saws.
[0083]
【The invention's effect】
[0084]
  The method of manufacturing a wire saw according to the present invention is a method in which the abrasive grains are adhered to the outer peripheral surface by running in the abrasive sedimentation area of the liquid material having at least a part of the abrasive grain sedimentation area in which the abrasive grains are dispersed and settled. Abrasive grains attached to the outer peripheral surface of the linear bodyIn a region other than the abrasive sedimentation regionSince the electrodeposition step of fixing to the outer peripheral surface by forming an electrodeposition layer is included, a wire saw can be manufactured by controlling the degree of distribution of abrasive grains to be electrodeposited on the outer peripheral surface of the long linear body. In particular, it is possible to manufacture a wire saw in which the distribution of abrasive grains electrodeposited on the outer peripheral surface of a long linear body is made low density.
[0085]
In the method for manufacturing a wire saw of the present invention, when the distribution of abrasive grains to be electrodeposited on the outer peripheral surface of a long linear body is in a low density range, the rigidity is low, the surface elastic modulus is small, and the strength against twisting A wire saw that is strong, hard to break, and has a good sharpness can be produced at a high production rate. Further, when a relatively thick material such as glass or crystal is cut with a wire saw, it is necessary to use a wire saw with a gap between the abrasive grains because it is easily clogged. According to the method for manufacturing a wire saw of the present invention, it is possible to manufacture a wire saw having such an interval between abrasive grains.
[0086]
  In the wire saw manufacturing apparatus of the present invention, an electrodeposition rod capable of forming an electrodeposition layer on a long linear body, and an abrasive sedimentation region in which abrasive grains are dispersed and settled are stored in the electrodeposition rod. Abrasive grain discharge part that discharges abrasive grains or abrasive grains-containing material so as to form in the electrodeposition bathAnd means for running the long linear body in the abrasive grain settling regionHaveAs the abrasive discharge part, there are an abrasive supply part for stirring the abrasive grain or abrasive grain-containing material supplied from the abrasive grain inlet, and an abrasive grain or abrasive grain-containing substance stirred by the abrasive grain supply part Abrasive grain discharge port that is released in a dispersed state, an abrasive grain recovery unit that collects abrasive grains or abrasive grain-containing materials released from the abrasive grain release port from an abrasive grain recovery port, the abrasive grain recovery unit, and the A substantially U-shaped return pipe part connecting the abrasive grain supply part, and the abrasive grains or abrasive-containing material collected by the abrasive grain recovery part through the substantially U-shaped return pipe part. Abrasive circulation device having a pump for transferring to the sectionTherefore, a wire saw can be manufactured by controlling the degree of distribution of the abrasive grains to be electrodeposited on the outer circumferential surface of the long linear body. In particular, it is possible to manufacture a wire saw in which the distribution of abrasive grains electrodeposited on the outer peripheral surface of a long linear body is made low density.
[Brief description of the drawings]
FIG. 1 is a schematic partial cross-sectional view in the traveling direction of a long wire for explaining the outline of the method for manufacturing a wire saw of Example 1. FIG.
FIG. 2 is a schematic partial sectional view of an electrodepositing iron that can be used in the method of manufacturing a wire saw according to the second embodiment of the present invention.
FIG. 3 is a schematic perspective view of an example of the wire saw of the present invention.
4 is a schematic cross-sectional view of the wire saw of FIG. 3, wherein (a) is a schematic cross-sectional view in the radial direction of the high-density region, and (b) is a schematic cross-sectional view in the radial direction of the low-density region. It is sectional drawing.
FIG. 5 is a developed view in which the outer peripheral surface of a long linear body as an example of the wire saw of the present invention is cut in the length direction of the long linear body to make a flat surface.
FIG. 6 is a schematic partial cross-sectional view in the traveling direction of the long wire for explaining the outline of the method of manufacturing the wire saw according to the present embodiment.
[Explanation of symbols]
A1 Degreasing tank (sodium hydroxide aqueous solution)
A2 washing tank
A3 Pickling tank (hydrochloric acid)
A4 washing tank
Z1 electrode 1
B Base plating tank
Z2 electrode 2
C1 Electrodeposition tank 1
Z3 electrode 3
Z4 electrode 4
C2 Electrodeposition tank 2
Z5 electrode 5
D1 Embedded tank
Z6 electrode 6
A5 water wash bowl

Claims (5)

A long linear body is caused to travel in the abrasive grain settling area in the electrodeposition liquid having at least a part of the abrasive grain settling area in which the abrasive grains are dispersed and settled, and the outer circumferential surface of the long linear body is formed. and the extent abrasive with grain starts to adhere the abrasive grains,
In a region other than the abrasive sedimentation region , including an abrasive electrodeposition step of fixing the abrasive particles adhered to the outer peripheral surface in the abrasive particle adhesion step to the outer peripheral surface by forming an electrodeposition layer,
In the abrasive grain adhesion step, the supply amount of abrasive grains or abrasive grain-containing materials supplied to the abrasive grain sedimentation region is controlled so that the abrasive grains are distributed at a desired density on the outer peripheral surface of the long linear body. A method of manufacturing a wire saw. In the long linear body in which the abrasive grains are adhered to the outer peripheral surface by running in the abrasive sedimentation area of the liquid material having at least a part of the abrasive sedimentation area in which the abrasive grains are dispersed and settled. A method of manufacturing a wire saw, comprising: an electrodeposition step of fixing the adhered abrasive grains to the outer peripheral surface by forming an electrodeposition layer in an area other than the abrasive grain settling area . An electrodeposition liquid having at least a part of an abrasive grain settling area in which abrasive grains are dispersed and settled is used as the liquid material, and the abrasive grains are formed on the outer circumferential surface of the long linear body in the abrasive grain settling area of the electrodeposition liquid. method for producing a wire saw according to claim 2, characterized in that it comprises a a degree abrasive with grain starts to be deposited, prior to the electrodeposition step. An electrodepositing iron capable of forming an electrodeposition layer on a long linear body;
An abrasive grain discharge part for discharging abrasive grains or abrasive grains-containing material so as to form an abrasive deposition area in which the abrasive grains are dispersed and settled in the electrodeposition bath stored in the electrodeposition bath;
Means for running the long linear body in the abrasive grain settling region;
As the abrasive grain release part, the abrasive grain supply part that stirs the abrasive grain or the abrasive grain-containing material supplied from the abrasive grain inlet, and the abrasive grain or abrasive grain-containing substance stirred by the abrasive grain supply part are dispersed. Abrasive grain discharge port that is released in a state, an abrasive grain recovery unit that recovers abrasive grains or abrasive grain-containing materials discharged from the abrasive grain discharge port from the abrasive grain recovery port, the abrasive grain recovery unit, and the abrasive grain A substantially U-shaped return pipe part connecting the supply part, and abrasive grains or abrasive-grain-containing materials recovered by the abrasive grain recovery part to the abrasive grain supply part via the substantially U-shaped return pipe part An apparatus for manufacturing a wire saw, comprising an abrasive circulation device including a pump for transferring. It has an abrasive discharge amount control unit for controlling the discharge amount of abrasive grains or abrasive grains discharged from the abrasive discharge unit so that abrasive grains are distributed at a desired density on the outer peripheral surface of the long linear body. The manufacturing apparatus of the wire saw of Claim 4 characterized by the above-mentioned.

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