KR100806371B1 - Fixed abrasive-grain wire - Google Patents

Abstract

The fixed abrasive grain wire which fixed the abrasive grain to the wire is provided, and the fixed abrasive grain wire excellent in the fixing force is provided. The degreasing step, the pickling step, the washing step, and the electroplating step are sequentially performed on the wire to fix the abrasive particles to the electroplating wire. As a component of the plating liquid of an electroplating process, it has a nickel containing organic acid or a nickel containing inorganic acid, a leveling agent, and abrasive grains.

Fixed, abrasive grain, wire, electroplating

Description

Fixed abrasive-grain wire

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to fixed abrasive wires, and in particular, cutting, slice, internal polishing, dies, and ingot cutting of hard materials such as silicon, quartz, and ceramics. The fixed abrasive grain wire which fixed the abrasive grain to the wire used for the application is related.

As an example, a wire saw using a fixed abrasive grain wire travels through a thin wire row provided with a tension and mounts a slurry-like abrasive containing abrasive grains in the wire row. Is a device that cuts a workpiece into a wafer shape by pressing glass workpieces (for example, silicon ingots) with a row of wires and polishing glass abrasive particles, and at the same time, a plurality of wafers can be obtained. It is also called the cutting method. 14, the schematic block diagram of the wire saw apparatus used for the processing of single crystal silicon as an example is shown.

14, the wire 42 supplied from the unwinding bobbin 41 passes through a plurality of guide rollers 43 for guiding the wire, and has a plurality of group rollers 44 having a plurality of grooves. ) Form a row of wires of a predetermined pitch, and while pressing the workpiece 46 with the feed unit 45 with respect to the wire row, slurry-like glass abrasive particles are moved from the nozzle 47 toward the wire row. By cutting, the workpiece 46 is cut into a wafer shape, and then the wire row is wound around the winding bobbin 49 via a plurality of guide rollers 48. The wire 42 is driven by the driving force of the drive motor 50 attached to the group roller 44, but the movement information of the dancer rollers 51 and 52 is supplied to the supply bobbin 41 at this time. ) And the rotation of the winding bobbin 49, and a constant tension is maintained. Typically, the wire 42 is moved forward and finally wound up in the winding bobbin 49 with a constant bidirectional or one-way travel at the request of quality, such as effective use as the material and improvement of cut surface roughness.

Generally as the slurry-shaped glass abrasive particles, those in which silicon carbide abrasive particles are dispersed in an oil agent are often used. Mineral oils are used as mineral oils. However, due to environmental problems, such as organic solvents are required for cleaning, conversion to glycol-based water-soluble solvents is used. This is going on. The characteristics of the wire saw using such glass abrasive particles are (1) cutting all the workpieces at once, so that even if the cutting speed increases, the wire saw can be processed in large quantities. Although it is relatively easy to cut, and (3) the cutting uses the grinding action of the glass abrasive particles, it is characterized by cutting thin wafers because of the thin wire of the tool. In addition to the disadvantages that the abrasive particles are scattered on the work table and dried, contaminating the working environment, and also have disadvantages such as waste liquid treatment and cleaning of the cut wafer.

Therefore, as a means of resolving the above disadvantages, a wire having diamond abrasive particles or the like attached to the wire with a thermosetting resin binder or a photocurable resin binder and having the fixed abrasive particles attached thereto by thermosetting or photocuring the resin is proposed. It is. However, in the method of attaching abrasive particles with resin, since the fixing force is not sufficient, there is a possibility that the abrasive particles may fall out due to the friction action accompanying the cutting in the process of cutting the workpiece into wafer shape due to the severe reciprocation of the wire. There is this.

Accordingly, in order to solve the problem of the glass abrasive particle wire saw and the wire saw in which the abrasive particles are attached to the wire with a resin, the abrasive grain electrodeposition wire saw for fixing the abrasive particles to the wire by an electrolytic method is patented. Documents 1 to 3 are proposed.

In Patent Document 1, as shown in FIG. 15, the polishing is performed on the first electrodeposition layer 63 and the first electrodeposition layer 63 electrodeposited with the coarse diamond abrasive grain 62 on the wire or ribbon material 61. A diamond electrodeposition wire or ribbon having a second electrodeposition layer 65 electrodeposited diamond abrasive grains 64 significantly thinner than the particles is disclosed.

In Patent Literature 2, as shown in FIG. 16, an electroplating layer 73 for implanting the abrasive grains 72 on the surface of the wire 71 and an implantation state of the abrasive grains 72 on the outer side of the electroplating layer 73 are disclosed. Disclosed is an abrasive grain coated wire with an electroless plating layer 74 for reinforcing the structure.

In Patent Literature 3, as shown in FIG. 17, the soft plating layer 82 is coated on the surface of the wire 81, the hard plating layer 83 is further coated on the soft plating layer 82, and the second plating layer is used to coat the second coating layer. The abrasive grain 84 is a fixed wire saw, the inner end 85 of the super abrasive grains 84 is inside the soft plating layer 82, and the outer end 86 of the super abrasive grains 84 is the hard plating layer 83. A wire saw is disclosed that is exposed on the outside and on the same cylindrical surface.

Patent Document 1: Japanese Patent Application Laid-Open No. 63-22275

Patent Document 2: Japanese Patent Application Laid-Open No. 9-1455

Patent Document 3: Japanese Patent Application Laid-Open No. 9-150314

In the abrasive grain electrodeposition wire shown in Figs. 15 to 17, the adhesion of the abrasive grains to the plated layer is superior to that of the abrasive grains attached to the wire with a resin, but in the wire saw the workpiece is subjected to severe reciprocating motion of the wire. Since the frictional force generated with the cutting in the process of cutting into the wafer shape is very large, as shown in FIGS. 15 to 17, the abrasive grain fixing force of the wire in which the head of the abrasive grain is exposed from the plating layer is sufficiently sufficient. It has been confirmed by the present inventors that the abrasive grains fall out within a relatively short period of time without being able to withstand actual use.

Accordingly, the present inventor has produced an abrasive grain electrodeposition wire in which Ni-coated diamond abrasive grains formed by coating abrasive grains (diamonds) with the same metal component (nickel) as the plating layer are fixed to the wire by an electrolytic method. As a result, an abrasive grain electrodeposition wire having an external appearance as shown in FIG. 18 was obtained. In FIG. 18, diamond abrasive grains exist inside the protrusion part 91. In FIG. However, this abrasive grain electrodeposition wire, as shown in Figs. 6B and 6C to be described later, since the portion extending from the substantially flat portion to the curved projection portion 91 is formed as a concave recessed portion toward the inner side. It was confirmed by the present inventors that stress concentration occurs, and even in this case, the adhesion of the abrasive grains to the plating layer is not at a level that can withstand actual use, but the abrasive grains fall out within a relatively short period of time.

The present invention has been made in view of the above problems in the prior art, and an object thereof is to provide a fixed abrasive grain wire having a fixed abrasive grain adhered to the wire with excellent abrasive force.

In order to achieve the above object, the fixed abrasive grain wire of the present invention is coated with a metal plating layer containing a plurality of abrasive particles on the surface of the wire, the surface of the metal plating layer is a roughly flat portion of the curved projections containing the abrasive particles When the height of the curved projections with respect to the surface of the flat portion is set to H, and the height of the curved projections is approximately from the height of (1/3) H to the approximately flat surface, It is characterized in that the cross-sectional area of the direction increases.

In addition, the fixed abrasive grain wire of the present invention is coated with a metal plating layer containing a plurality of abrasive particles on the surface of the wire, and the surface of the metal plating layer is such that a curved projection having the abrasive grains protrudes from a substantially flat portion. It has a shape, and the part from the substantially flat part to the curved protrusion part has no concave recessed inward, and the tangent at the part from the substantially flat part to the curved protrusion part is continuously changed.

In addition, the thickness of the plated film on the upper side of the abrasive grains is thinner than the theoretical value.

As the abrasive particles, it is preferable to use those coated with the same metal as some or all of the metal constituting the metal plating layer in advance.

The fixed abrasive grain wire of claim 1 has a shape in which a plurality of abrasive grains are embedded in a metal plating layer coated on the surface of the wire, and the surface of the metal plating layer has a shape such that a curved protrusion protruding from the abrasive grains protrudes from a substantially flat portion. When the height of the curved projections with respect to the surface of the substantially flat portion is set to H, the cross-sectional area in the horizontal direction of the curved projections increases from the height of (1/3) H to the approximately flat surface. Stress concentration hardly occurs in a portion from the substantially flat portion to the curved protrusion portion, and the abrasive grains are hard to fall off even when a large friction force generated along with the cutting is applied to the wire in the process of cutting the workpiece. It is preferable that the quantity of such a protrusion part is large, but it is preferable that at least 80% or more of the whole protrusion part has the said characteristic.

The fixed abrasive grain wire of claim 2, wherein a plurality of abrasive grains are embedded in a metal plating layer coated on the surface of the wire, and the surface of the metal plating layer has a shape such that a curved protrusion having the abrasive grains protrudes from the substantially flat portion. And the portion extending from the substantially flat portion to the curved projection portion has no concave recesses inward, and the tangent at the portion extending from the approximately flat portion to the curved projection portion continuously changes, so that the curved portion from the approximately flat portion to the curved projection portion is The stress concentration hardly occurs at the part leading to the hardened part, and the abrasive grains are hard to fall off even when the wire is loaded with a large frictional force generated in the cutting of the workpiece. It is preferable that the quantity of such a protrusion part is large, but it is preferable that at least 80% or more of the whole protrusion part has the said characteristic.

The fixed abrasive grain wire of claim 3 is characterized in that the thickness of the plated coating on top of the abrasive grain is thinner than the theoretical value, so that the plated coating of the bottom portion effectively contributes to relatively secure the abrasive particles to the plated coating. Since the thickness of is thick, the adhesion of the abrasive grains by the plating film is increased.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure explaining the smoothing operation | movement of the plating film surface by a leveler.

It is a figure explaining the growth state of the plating film in general electroplating.

FIG. 3 is a view for explaining a growth state of a plating film in the case of containing a leveling agent in a plating bath of electroplating, and shows the case where the abrasive grain is coated with the same metal as the plating metal in advance.

FIG. 4 is a diagram illustrating a growth state of a plating film in the case of containing a leveling agent in a plating bath of electroplating, and shows a case where the abrasive grains are not previously coated with the same metal as the plating metal.

5 is a schematic structural diagram of an apparatus suitable for producing the fixed abrasive grain wire of the present invention.

Figure 6a is an enlarged photograph (2200 times) of a part of the surface of the fixed abrasive grain wire of the present invention,

Figure 6b is a schematic diagram showing an enlarged portion of the surface of the other fixed abrasive wire,

Figure 6c is an enlarged schematic view showing a portion of the surface of another fixed abrasive wire.

FIG. 7A is a schematic view showing some surface portions in the longitudinal direction of the fixed abrasive grain wire of the present invention, and FIG. 7B is a cross-sectional view taken along the line X-X of FIG. 7A.

8 is a surface photograph (200 times) before slicing of the fixed abrasive grain wire of the present invention.

9 is a photograph of the surface (250 times) after the slicing operation of the fixed abrasive grain wire of the present invention.

10 is a view for explaining the scratch test method of the fixed abrasive grain wire of the present invention.

It is a figure explaining the scratch test method of the conventional abrasive grain electrodeposition wire.

12 is a photograph of the surface (370 times) after the scratch test of the fixed abrasive grain wire of the present invention.

13 is a photograph of the surface of the conventional abrasive grain electrodeposition wire after the scratch test (350 times).

14 is a schematic configuration diagram of a general wire saw device.

15 is a view showing a cross section of a conventional abrasive grain electrodeposition wire.

16 is a view showing a cross section of another conventional abrasive grain electrodeposition wire.

17 is a view showing a cross section of another conventional abrasive grain electrodeposition wire.

18 is an enlarged photograph (2700 times) of the surface of a conventional abrasive grain electrodeposition wire.

<Description of the code>

1: anode

2: purpose metal

3: high current part

4: additive

5: low current

6: plating film

7: smoothing level

10: anode

11: abrasive grain

12: high current portion

13: plating film

14: low current portion

15: vertex

16: bottom part

17: abrasive grain

21: discharge machine

22: steel wire

23: alkali degreasing tank

24: Sansejo

25: washing tank

26: pretreatment tank

27: plating bath

28: flush

29: winder

30: curved projection

31: approximately flat

32: curved projection

34a: main part

34b: main part

35: wire

36: abrasive grain

37: nickel plating layer

38: curved projection

39: approximately flat part

41: unwind bobbin

42: wire

43: guide roller

44: group roller

45: guide unit

46: workpiece

47: nozzle

48: guide roller

49: winding bobbin

50: drive motor

51: dancer roller

52: dancer roller

The wire used for the fixed abrasive grain wire of the present invention is not particularly limited as long as it can be electroplated and the strength and elastic modulus withstand the tension between the guide roller and the group roller, and as such a wire, for example, a piano wire of a long length, etc. And metal wires such as steel wires, tungsten wires, and molybdenum wires.

The diameter of the wire used for this invention can be suitably selected according to the shape and the characteristic of a to-be-cut, Usually, about 0.01-0.5 mm is employ | adopted, Usually, it is a thin wire of 0.1 mm or less, or thick exceeding 0.1 mm. Even if it is a wire, the effect of this invention is the same.

It is desirable to degrease and clean the surface of the wire prior to electroplating. There is no restriction | limiting in particular in the degreasing method, For example, it can carry out by acid immersion, solvent degreasing, emulsifier degreasing, alkali degreasing, etc., and can finish by electrolytic degreasing as needed.

The alkali-degreased wire is preferably neutralized by passing through an pickling bath, and there is no particular limitation on the kind of the acid, and for example, sulfuric acid, hydrochloric acid or nitric acid is preferably used.

It is preferable to wash the wire which passed the pickling tank by washing it with a water washing tank.

It is preferable to pretreat the wire before electroplating. The pretreatment is a treatment for improving the adhesion of the plating layer, and as the pretreatment, for example, strike plating can be performed, but is not limited thereto.

Although there is no restriction | limiting in particular in the method of performing electroplating on the wire surface following pretreatment, For example, a plating layer can be formed in the wire surface by connecting an anode to a wire, connecting an anode to a plating liquid, and performing electroplating. In preparing the fixed abrasive grain wire of the present invention, for example, a plating liquid containing nickel-containing organic acid or nickel-containing inorganic acid and abrasive particles can be used. Although it does not specifically limit, A nickel sulfamate type plating liquid can be used as a nickel containing organic acid.

As abrasive grains, it is preferable to use those coated with the same metal as some or all of the metal constituting the plating layer in advance. This is because the intimacy between the abrasive grains and the plating layer is improved, and the adhesion force of the abrasive grains is increased. The abrasive particles are not particularly limited, but diamond abrasive particles having a diameter of 100 μm or less can be used.

Moreover, it is preferable that a plating liquid contains a leveling agent. As described below, the force of adhering the abrasive grains to the plating layer increases, the predetermined cutting force by the abrasive grains is exerted quickly after the start of the cutting operation, and the cutting chips generated at the time of cutting hardly stay on the wire surface. You can expect a losing effect.

(Smoothing of the plating film by the leveling agent)

Since the leveling agent is added to promote the smoothing of the plating film and impart glossiness, the surface of the plating film can be smoothed with the configuration described below.

As shown in Fig. 1, which is a schematic diagram of the electroplating method, when the plating liquid contains a leveling agent, 1 is the anode, and 2 is the target metal (cathode) to which plating is performed, a point close to the anode 1 An additive 4, such as a leveling agent, is preferentially adsorbed on the high current portion 3 of the surface of the target metal 2 at. As a result, the surface of the target metal 2 to which the additive 4 has been adsorbed is a point that is concave inward from the high current portion 3 and the surface of the surface of the target metal 2 because the additive 4 becomes a resistance. The potential of the low current portion 5 at a point far from the anode 1 is reversed, the growth rate of the plated film 6 of the low current portion 5 is faster than the high current portion 3, and finally the plated film ( The plating film 6 is formed according to the structure until 6) forms the smooth level 7.

(Improvement of Adhesion of Abrasive Particles in Plating Film by Leveling Agent, Early Cutting Force of Abrasive Particles, and Prevention of Retention of Cutting Debris)

By containing the leveling agent in the plating liquid, the action of the leveling agent can be precisely used to form abrasive grains excellent in adhesion to the plated film and hardly falling off with the configuration described below.

In the conventional electroplating, as shown in FIG. 2, in the case where the abrasive particles 1 coated with the same metal as the plated metal are adhered to the target metal 2 by the electrolytic method, the objective is located near the cathode 10. The growth rate of the plated film 13 of the high current portion 12 on the surface of the metal 2 is faster than the growth rate of the plated film of the low current portion 14 at a point far from the anode 10. However, by including the leveling agent in the plating liquid during electroplating, the growth rate of the plating film of the low current portion 14 is faster than the high current portion 12 as described based on FIG. 1. That is, as shown in FIG. 3, the growth of the plating film of the apex 15 of the abrasive grain 11 close to the anode 10 is suppressed, and the abrasive grains 11 are fixed to the plating film 13. For this reason, the growth of the plated film 13 of the bottom portion 16 which contributes effectively is promoted, and the fixing force of the abrasive grains 11 by the plated film 13 is increased.

By the way, the actual cutting operation is carried out by the abrasive grains 11, and the plated film 13 performs the action of fixing the abrasive grains 11 so as not to fall off during the cutting operation, as shown in FIG. If the amount of the plated film 13 in the portion that is higher than the particles 11 and does not contribute to the cutting operation is less than the base portion 16, the plated film is dropped at a relatively early time after the start of cutting and thus the abrasive grains 11 Since the head is exposed, the ability of the abrasive particles 11 inherently exhibits quickly after cutting.

Further, as the shape of the plating film 13, as shown in FIG. 3, the plating film 13 of the bottom portion 16 close to the target metal 2 is thickened to remove the recesses, and thus, cutting is performed compared with that of FIG. The effect that the cutting chips which generate | occur | produce at the time become difficult to remain on the surface of the target metal 2 can also be anticipated.

The growth of the plating film of the apex 15 of the abrasive grains 11 is suppressed, and the growth of the plating film of the bottom portion 16 is promoted. Even in the case where the uncoated abrasive grains 17 are fixed to the target metal 2 by the electrolytic method, the same principles as described above can be expected, and the plating film 13 of the apex 15 of the abrasive grains 17 can be expected. The thickness is thin, and the thickness of the plated film 13 of the base 16 is thickened.

The leveling agent promotes the smoothing of the plating film and imparts gloss. As described above, the leveling agent added in the plating liquid precipitates together with the metal ions on the surface of the target metal 2, so that the material that lowers the cathode potential acts as a leveling agent under suitable conditions. Since the function differs according to the kind of leveling agent, it becomes possible to obtain a uniform leveling effect also to a complicated-shaped article by using multiple types of leveling agents together. As a leveling agent, there exists a substance generally called a 1st class varnish, and a substance called a 2nd class varnish. The use of the first type of varnish has the characteristics of easily obtaining the same gloss as that of the base, and the second type of varnish has excellent gloss enhancement effect, but when used alone, the plated film is weakened or the adhesion of the plated film is poor. Therefore, it is preferable to use a 1st type varnish and a 2nd type varnish together.

The first kind of gloss agent is an organic compound having a structure of = C-SO _2- , and examples thereof include 1,5-naphthalindisulfonate sodium, 1,3,6 sodium naphthalintrisulfonic acid, and saccharin. .

Type 2 polishes include C = O (various aldehydes), C = C (gelatin), C≡C (2butin-1, 4diol), C = N (kinaldine, pyridium compounds), C≡N (ethylene Organic compounds having structures such as cyanhydrin), NC = S (thiourea), and N = N (azo dyes) can be used.

In order to achieve the above-described effects of the present invention, a type 1 varnish contains 1 to 50 milliliters / liter in the plating solution, a type 2 varnish contains 1 to 150 milliliters / liter in the plating solution, and a type 1 varnish to varnish It is preferable to make the weight ratio of 1 (electronic) to 2-5 (the latter).

It is preferable to wash with water the electroplated wire through a water washing tank.

Moreover, it is preferable to apply dressing (grinding) to the wire after electroplating, and to make it into a suitable surface form as a wire for wire saws.

Hereinafter, examples of the present invention will be described, but the present invention is not limited to the following examples and can be appropriately changed and modified without departing from the technical scope of the present invention.

(1) production of fixed abrasive grain wire by electroplating

The fixed abrasive grain wire was produced by the plating apparatus of the schematic structure as shown in FIG. In other words, the forced wire 22 having a diameter of 160 µm is sent out from the feeder 21, and the forced wire 22 is alkali-degreased in an alkali degreasing tank (alkali degreasing agent having a pH of 11) 23 and pickling tank (pH). Pickled in sulfuric acid (24) (24), washed in a washing tank (25), pretreated in a pretreatment tank (bath composition with a nickel sulfamate tetrahydrate 600 g / liter, pH 4.2) 26, forced Nickel plating having a thickness of 7 μm was applied to the surface of the wire 22 in the plating bath 27. The composition of the plating bath of the plating bath 27 was 600 g / liter of nickel sulfamate tetrahydrate, 55 g / liter of nickel chloride hexahydrate, 30 g / liter of boric acid as a pH buffer, and 1 type of brightener (saccharin). Diamond abrasive grains having a particle diameter of 15 to 25 µm, in which 15 milliliters / liter, a second class of varnishes (2 butene-1, 4 diol) are coated with 50 milliliters / liter and nickel in advance (thickness of coated nickel is 0.1 to 1.0 mu m). 10g / liter), the plating conditions were pH 3.0, the temperature of 55 degreeC, and the current density of 45A / dm <^2> . In addition, the current efficiency at this time was 90%.

Thereafter, the steel wire 22 on which the nickel plated film was formed was washed with water in the washing tank 28, and then the steel wire 22 on which diamond abrasive grains were fixed in the nickel plated film was wound on the winding machine 29.

(2) surface of fixed abrasive grain wire

6A is an enlarged photograph (2200 times) of a part of the surface of the fixed abrasive grain wire of the present invention obtained as described above, and is composed of a curved projection portion 30 containing diamond abrasive grains and another roughly flat portion. The protruding portion 30 is shaped like protruding from a substantially flat portion. In the portion extending from the substantially flat portion to the curved projection 30 formed in a large round mark, there is no concave recess inward, and the tangent at the portion extending from the approximately flat portion to the curved projection 30 is continuously. Change.

On the other hand, on the surface of the other fixed abrasive grain wire shown in FIG. 6B, there is a recessed portion 34a which is concave inward in a portion extending from the substantially flat portion 31 to the curved protrusion portion 32, and the other shown in FIG. 6C. On the surface of the fixed abrasive grain wire, there are recesses 34b which are concave inward in a portion extending from the substantially flat portion 31 to the curved protrusions 33, and stress concentrations are likely to occur in these recesses 34a and 34b. .

However, the portion of the wire surface of the present invention that extends from the substantially flat portion to the curved projections 30 has no concave recesses toward the inside corresponding to 34a and 34b, and extends from the approximately flat portion to the curved projections 30. Since the tangents in the part change continuously, stress concentration is unlikely to occur.

FIG. 7A is a schematic diagram showing a result of observing a part of the surface portion of the fixed abrasive grain wire of the present invention manufactured as described above with a scanning electron microscope having a side instrument. In FIG. 7A, the surface of the wire 35 is coated with a nickel plated layer 37 containing abrasive particles 36, and the curved projections 38 containing abrasive particles 36 have a substantially flat portion 39. It is the same shape as protruding from). In the case where the height of the curved projections 38 of the curved shape relative to the surface of the flat portion 39 is H, the curved surface from the height of (1/3) H to the surface of the flat portion 39 is approximately. The horizontal cross-sectional area A of the projection 39 increases gradually. Thus, since the thickness of the plated film of the bottom portion which contributes effectively to fix the abrasive grains 36 to the nickel plated layer 37 is thick, the abrasive grains 36 are firmly fixed to the nickel plated layer (plated film) 37. do. FIG. 7B is a cross-sectional view taken along the line X-X of FIG. 7A. In addition, in order to measure the thickness of a plating film, a laser microscope can be used in addition to the scanning electron microscope which has a measuring instrument.

(3) the thickness of the coating film

Next, each condition of the tank from the alkali degreasing tank 23 to the water washing tank 28 was made the same as above (containing the leveling agent), and the first type of polishing agent (the leveling agent in the plating bath in the plating layer 27). ) And the abrasive grains shown in FIG. 2 except that the conditions of the respective baths from the alkali degreasing tank 23 to the water washing tank 28 are the same as above except that they do not contain the second type varnish (leveling agent). 11) As a result of electroplating on a plurality of steel wires under the condition that the thickness t of the plated film 13 on the upper surface is theoretically 8 µm, a leveling agent is contained as the actual thickness t after the electroplating. The plating film thickness t of the wire which performed the electroplating to become as follows Table 1, and the plating film thickness t of the wire which performed the electroplating containing no leveling agent became as follows in Table 2. .

In addition, the measurement of the thickness (t) of the plating film is "a wire which has a plating film obtained by applying a release agent to the inner surface of a cylindrical body (not shown), filling this cylindrical body with a thermosetting resin, and then in this thermosetting resin as described above. After inserting and heating the resin to a predetermined temperature condition to cure the resin, the cylindrical thermosetting resin body containing the wire was taken out from the cylindrical body, and the cross section of the cylindrical thermosetting resin body was scraped in the longitudinal direction, and FIG. 2. The thickness t was measured by exposing a portion having a shape as shown in Fig. 2 and measuring the thickness t with a scanning electron microscope having a measuring instrument.

Thickness (t) 2㎛ 3㎛ 4㎛ 5㎛ 6 μm 7㎛ 8㎛ Number of wires 6 11 2 0 0 0 0

Thickness (t) 2㎛ 3㎛ 4㎛ 5㎛ 6 μm 7㎛ 8㎛ Number of wires 0 0 0 0 6 10 3

Comparing Table 1 and Table 2, it can be seen that the thickness of the plated film 13 on the abrasive grains 11 is reduced by performing electroplating containing the leveling agent.

(4) concentration of fixed abrasive grain wire

The concentration of the fixed abrasive grain wire produced as described above (the numerical value obtained by dividing the total projected area of the abrasive grains fixed per unit length of the fixed abrasive grain wire divided by the surface area of the wire) was examined. That is, if the diameter of the wire is d, the length is L, and the projection areas of each abrasive grain are A1, A2, A3, ..., An, the concentration is expressed by the following equation.

Concentration = {(A1 + A2 + A3 + ... + An) / πdL} X100 (%)

In this embodiment, 177 diamond abrasive grains are fixed within an arbitrary length (365.5 mu m) of the wire when observed with a scanning electron microscope. Although the abrasive particles are actually of various shapes, they are regarded as spheres of equal size for convenience of calculation, and moreover, if the spheres are projected onto a circumferential wire, they are actually elliptical but are regarded as circles for the convenience of calculation. 177 abrasive grains having a diameter of 160 µm and being fixed to the surface of a wire having a length of 365.5 µm were 25% when the concentration was calculated by the above formula.

(5) surface hardness of fixed abrasive grain wire

When the surface hardness of the fixed abrasive grain wire produced as mentioned above was measured about five points spaced about 0.1 mm apart, 610HMV (0.1), 620HMV (0.1), 630HMV (0.1), 650HMV (0.1), 680HMV (0.1) was obtained. HMV also refers to Micro Vickers hardness.

(6) slicing by fixed abrasive grain wire

Since slicing was actually performed using the fixed abrasive grain wire obtained as mentioned above, this detail is demonstrated. The layout of the wire saw is the same as that shown in FIG. 14, the cutting target 46 is a flat soda glass 15 mm thick x 125 mm wide x 450 mm long, and the wire 42 is 0.95 mm. The soda glass 46 to be cut is 1.0 mm with respect to the wire 42 while being laid on the group roller 44 at a tension of 25 N at a distance of 10 m and scattering tap water from the nozzle 47 with respect to the wire 42. The wire 42 is transferred from the unwinding bobbin 41 to the winding bobbin 49 at a maximum speed of 800 m / min and an average speed of 600 m / min while being conveyed at a rate of / min, and then the unwinding bobbin from the winding bobbin 49 A method of advancing the wire 42 from the unwinding bobbin 41 to the winding bobbin 49 by 2 m / min while performing a two-way run rewinding at a maximum speed of 800 m / min and an average speed of 600 m / min with respect to (41). Soda glass 46 was cut for 25 minutes.

(7) Surface condition of fixed abrasive grain wire before and after slicing

8 is a photograph of the surface of the fixed abrasive grain wire (200 times) before the slicing operation, and FIG. 9 is a photograph of the surface of the fixed abrasive grain wire (250 times) after the slicing operation. 8 and 9, diamond abrasive grains are embedded directly under the protruding portion. As apparent from the comparison of Figs. 8 and 9, it is understood that even after the slicing operation, the dropping and peeling of the diamond abrasive grains is found to be small, and the diamond abrasive grains are firmly fixed to the nickel plated film.

(8) scratch test

For comparison, a scratch test was performed using the apparatus of the schematic configuration as shown in FIGS. 10 and 11. That is, as shown in Fig. 10, against the fixed abrasive grain wire 40a of the present invention manufactured as described above, the member (40g of self-weight 500g of low carbon steel) having a sharp tip is pressed firmly and the member The scratch test was carried out by mounting the 4500g weight W on 40b and pressing the sharp member 40b from the left to the right at a speed of 1 cm / sec. As a result, what was shown the surface as shown in FIG. 8 before this scratch test became the surface as shown in FIG. 8 and 12, diamond abrasive grains are embedded directly under the protruding portion. As apparent from the comparison of Figs. 8 and 12, it is clear that even after the scratch test, no dropping or peeling of the diamond abrasive grains is found, and the diamond abrasive grains are firmly fixed to the nickel plating film.

Next, for comparison, a member 40b having a sharp tip (40 g of self-weight of a low carbon rigid body) with respect to the abrasive grain electrodeposition wire 40c having a surface as shown in FIG. 18 as shown in FIG. And a scratch test was conducted in which the sharp member 40b was pressed at a speed of 1 cm / sec from left to right. As a result, what was shown the surface as shown in FIG. 18 before this scratch test became the surface as shown in FIG. 13 and 18, diamond abrasive grains are embedded directly under the protruding portion. As can be seen by comparing FIG. 13 with FIG. 18, this abrasive grain electrodeposition wire can be seen that even if the weight of the wire is 10% of the scratch test of the wire of the present invention, a large number of diamond abrasive grains are dropped after the scratch test. Can be.

(9) Conclusion

According to the present invention as described above, it is possible to provide a fixed abrasive grain wire having a nickel plated film in which diamond abrasive grains are firmly fixed.

The fixed abrasive grain wire of the present invention can be used for cutting, slicing, internal polishing, dice, and ingot cutting of hard materials such as silicon, quartz, and ceramics.

Claims (3)

As a method of manufacturing a fixed abrasive grain wire by electroplating, By electroplating the wire using a plating solution containing a leveling agent together with the abrasive grain, a metal plating layer containing a plurality of abrasive grains is coated on the surface of the wire, and the surface of the metal plating layer contains the abrasive grains. In the case where the curved projection is formed to protrude from the flat portion, and the height of the curved projection relative to the surface of the flat portion is set to H, from the height of (1/3) H to the flat portion surface, Method for producing a fixed abrasive grain wire by electroplating, characterized in that the cross-sectional area in the horizontal direction of the curved projections until this increases. A wire on which abrasive particles are fixed, wherein a surface of the wire is coated with a metal plating layer containing a plurality of abrasive particles, and the surface of the metal plating layer has a shape such that a curved protrusion protruding from the abrasive particles protrudes from a flat portion. And a portion extending from the flat portion to the curved projection portion has no concave recessed inwardly, and the inclination of the tangent line at the portion from the flat portion to the curved projection portion continuously changes. Abrasive grain wire. 3. The plating according to claim 2, wherein when the thickness of the plated film which is above the apex of the abrasive grain is t, the plating is performed when the wire is electroplated under the plating condition that the thickness of the plated film is theoretically t _0. A fixed abrasive grain wire, wherein the thickness t of the coating is less than t ₀ .

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