JP2020163550A - Abrasive grain electro-deposition wire - Google Patents

Abstract

To provide an abrasive grain electro-deposition wire which has a high abrasive grain holding force and has high working performance.SOLUTION: A nickel plating film 14 formed on the surface of a metal wire 12 has a polygonal particle abrasion ratio (erosion ratio) (μm/g) when a polygonal particle is used of 0.15-0.6 μm/g and/or a spherical particle abrasion ratio (erosion ratio) (μm/g) when a spherical particle is used of 0.6-1.5 μm/g among abrasion ratios that are degrees of abrasion to a projection particle amount obtained by a slurry local spray abrasion method, and accordingly an abrasive grain holding force is high and the nickel plating film 14 on abrasive grains 16 is appropriately peeled, an increase in grinding resistance is suppressed, therefore, high working performance is obtained.SELECTED DRAWING: Figure 6

Description

The present invention relates to an abrasive grain electrodeposition wire in which abrasive grains are fixed to the surface of a metal wire by plating.

As a wire saw which is a fixed abrasive grain type grinding tool, an abrasive grain electrodeposition wire in which abrasive grains are fixed to the outer peripheral surface of a metal wire such as a piano wire by, for example, nickel plating is known. This is the abrasive grain electrodeposition wire described in Patent Document 1, Patent Document 2, and Patent Document 3. According to this, there is an advantage that the abrasive grain holding power and the processing efficiency are high.

On the other hand, a resin wire in which abrasive grains are fixed to the surface of a metal wire with a resin is known. That is what is described in Patent Document 4 and Patent Document 5. According to this, there are advantages that the flexibility is high, there is no disconnection due to twisting, and the surface roughness of the processed surface is good, but there are disadvantages that the abrasive grain holding force is small and the processing efficiency is low. It was.

Japanese Unexamined Patent Publication No. 2006-181698 Special Floor 2004-027283 Japanese Patent Application Laid-Open No. 09-150314 Japanese Patent Application Laid-Open No. 10-138114 JP-A-11-347911

By the way, for example, the use of abrasive grain electrodeposited wire for cutting a single crystal material has been widely used, and in recent years, difficult-to-cut materials such as sapphire, gallium nitride, and silicon carbide, which are harder work materials. High processing efficiency is required for cutting. However, although the processing performance of the abrasive grain electrodeposited wire depends on the characteristics of the nickel-plated film that holds the abrasive grains, the characteristics of the nickel-plated film, especially the strength and wear characteristics, cannot be objectively expressed. It was. For this reason, the quality of the processing performance of the abrasive grain electrodeposited wire could not be guaranteed, and it relied on experience.

If the strength of the nickel-plated film is too high in the abrasive grain electrodeposition wire, it becomes difficult to remove the portion of the nickel-plated film that covers the abrasive grains, and thus the processing performance deteriorates due to the increase in grinding resistance. On the other hand, if the strength of the nickel-plated film is too low, the holding power of the abrasive grains is lowered, and the processing performance is lowered due to the shedding. Therefore, it is not possible to objectively grasp how the strength range of the nickel-plated film should be used to optimize the processing performance of the abrasive grain electrodeposited wire, so that the abrasive grain holding power is high and high. It was not possible to provide an abrasive grain electrodeposited wire having processing performance.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an abrasive grain electrodeposited wire having high abrasive grain holding power and high processing performance.

As a result of various studies against the background of the above circumstances, the present inventors locally inject a slurry containing fine inorganic particles onto a nickel plating film by using the slurry local injection wear method, and receive the injection. When the ratio of the degree of wear (depth) to the amount of projected particles of the local nickel-plated film is quantified using the wear rate (= maximum wear depth μm / amount of projected particles g), the wear rate and the nickel-plated film It was found that the correlation with the strength can be suitably associated, and that the processing performance of the abrasive grain electrodeposited wire can be objectively specified by using the numerical range of the wear rate corresponding to the strength of the nickel plating film. .. The present invention has been made based on such findings.

That is, the gist of the first invention is an abrasive grain electrodeposited wire in which the abrasive grains are electrodeposited on the surface of the metal wire by nickel plating, and the nickel plating film formed on the surface of the metal wire is: The average value of the wear rate, which is the degree of wear with respect to the amount of projected particles obtained by the slurry local injection wear method using polygonal particles, has a strength of 0.15 to 0.6 μm / g.

The gist of the second invention is an abrasive grain electrodeposition wire in which abrasive grains are electrodeposited on the surface of a metal wire by nickel plating, and the nickel plating film formed on the surface of the metal wire is spherical particles. The average value of the wear rate, which is the degree of wear with respect to the amount of projected particles obtained by the slurry local injection wear method using the above, is to have a strength showing 0.6 to 1.5 μm / g.

The gist of the third invention is an abrasive grain electrodeposition wire in which abrasive particles are electrodeposited on the surface of a metal wire by nickel plating, and the nickel plating film formed on the surface of the metal wire is a slurry local. The average value of the wear rate, which is the degree of wear with respect to the amount of projected particles obtained by the jet wear method, was 0.15 to 0.6 μm / g when polygonal particles were used, and spherical particles were used. In some cases, it has a strength of 0.6 to 1.5 μm / g.

The gist of the fourth invention is that the nickel-plated film has a multilayer structure in any one of the first to third inventions.

The gist of the fifth invention is that in any one of the first to fourth inventions, the nickel-plated film has a film thickness of 25 to 70% of the average particle size of the abrasive grains. is there.

According to the abrasive grain electrodeposition wire of the first invention, the nickel-plated film formed on the surface of the metal wire is the degree of wear with respect to the amount of projected particles obtained by the slurry local injection wear method using polygonal particles. Since the average value of the wear rate has a strength of 0.15 to 0.6 μm / g, the abrasive grain holding power is high and the nickel plating on the abrasive grains is appropriately peeled off to suppress an increase in grinding resistance. Therefore, high processing performance can be obtained.

According to the abrasive grain electrodeposition wire of the second invention, the nickel plating film formed on the surface of the metal wire is the degree of wear with respect to the amount of projected particles obtained by the slurry local injection wear method using spherical particles. Since the average value of the wear rate has a strength of 0.6 to 1.5 μm / g, the abrasive grain holding power is high and the nickel plating on the abrasive grains is appropriately peeled off to suppress an increase in grinding resistance. Therefore, high processing performance can be obtained.

According to the abrasive grain electrodeposition wire of the third invention, the nickel-plated film formed on the surface of the metal wire has an average value of the wear rate, which is the degree of wear with respect to the amount of projected particles obtained by the slurry local injection wear method. However, when polygonal particles are used, the strength is 0.15 to 0.6 μm / g, and when spherical particles are used, the strength is 0.6 to 1.5 μm / g. High processing performance can be obtained because the grain retention is high and the nickel plating on the abrasive grains is appropriately peeled off to suppress an increase in grinding resistance.

According to the abrasive grain electrodeposition wire of the fourth invention, the nickel plating film has a multilayer structure. As a result, for example, by electrodepositing the abrasive grains on the base layer, a high abrasive grain holding force can be obtained with respect to the metal wire.

According to the abrasive grain electrodeposition wire of the fifth invention, the nickel-plated film has a film thickness of 25 to 70% of the average particle size of the abrasive grains. From this, the holding of the abrasive grains by the nickel plating film and the amount of the abrasive grains protruding from the nickel plating film are well-balanced, and high grinding performance can be obtained.

It is a figure which shows a part of the abrasive grain electrodeposition wire, that is, the wire saw of one Example of this invention by an enlarged photograph. It is a figure explaining the manufacturing process of the abrasive grain electrodeposition wire of FIG. It is an evaluation result of wear rate, processing performance and life for each sample of electrodeposition wire. It is explanatory drawing explaining the structure of the slurry local injection wear apparatus which enables the slurry local injection wear method used for the evaluation of the abrasive grain holding force and the processing performance of the abrasive grain electrodeposition wire manufactured in the manufacturing process of FIG. It is a figure which shows an example of the profile at the time of measuring the wear depth of the local wear formed on the surface of the electrodeposited wire sample by the slurry local injection wear device of FIG. 4 using a stylus type measuring instrument. It is a figure which showed the spherical particle wear rate (μm / g) and the polygonal particle wear rate (μm / g) for each sample of the electrodeposition wire in two-dimensional coordinates.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In the following examples, the drawings are appropriately simplified or deformed, and the dimensional ratios and shapes of each part are not necessarily drawn accurately.

FIG. 1 shows an enlarged photograph of a part of the abrasive grain electrodeposited wire 10 of an embodiment of the wire tool of the present invention in the longitudinal direction. The abrasive grain electrodeposition wire 10 is an abrasive grain fixed wire saw used for cutting, for example, single crystal or polycrystalline sapphire, difficult-to-cut materials such as gallium nitride and silicon carbide, semiconductor ingots, and magnetic materials. is there. The abrasive grain electrodeposition wire 10 is composed of a relatively hard metal wire 12 and a large number of abrasive grains 16 fixed to the outer peripheral surface of the metal wire 12 by a nickel plating film 14.

The metal wire 12 is made of a steel wire such as a piano wire, and has a wire diameter in the range of, for example, about 0.05 to 0.30 (mm). Further, the abrasive grains 16 are single crystal diamond abrasive grains or CBN abrasive grains, that is, superabrasive grains having an average particle size in the range of, for example, 5 to 100 (μm), for example, about 50 (μm).

Further, the nickel plating film 14 has a film thickness in the range of, for example, 1.25 to 70 (μm), and is formed so as to have a film thickness of 25 to 70% of the average particle size of the abrasive grains 16. .. Further, the nickel plating film 14 is a multilayer having, for example, a base layer directly formed on the surface of the metal wire 12 and an abrasive grain fixing layer formed on the base layer for fixing the abrasive grains 16. It is a plating film. By this base layer, the adhesion strength of the nickel plating film 14 to the metal wire 12 is increased, and as a result, the adhesion strength of the abrasive grains 16 to the metal wire 12 is increased. In FIG. 1, the abrasive grains 16 are thinly covered with the nickel plating film 14.

Further, the nickel plating film 14 is formed on the surface of the metal wire 12 so as to have a film thickness of 25 to 70% of the average particle size of the abrasive grains 16. As a result, the holding of the abrasive grains 16 by the nickel plating film 14 and the amount of protrusion of the abrasive grains 16 from the nickel plating film 14 are well-balanced, and high grinding performance can be obtained.

In order to increase the holding power of the abrasive grains 16 and to suppress an increase in grinding resistance by appropriately peeling off the nickel plating on the abrasive grains to obtain high processing performance, the nickel plating film 14 is sprayed locally on the slurry. The average value of the wear rate (erosion rate) (μm / g), which is the degree of wear with respect to the amount of projected particles obtained by the wear method, is 0.15 to 0.6 μm / g when polygonal particles are used. Moreover, when spherical particles are used, it has a strength of 0.6 to 1.5 μm / g.

FIG. 2 is a schematic view illustrating a main part of a manufacturing facility used for manufacturing the abrasive grain electrodeposition wire 10. In FIG. 2, an alkaline degreasing tank 20, a water washing tank 22, an acid washing tank 24, a water washing tank 26, a base plating tank 28, and an electrodeposition tank 30 are arranged in series on the floor, and a plurality of metal wires 12 are provided. By being guided by the guide pulley 32 of the above, the alkali degreasing tank 20, the water washing tank 22, the acid washing tank 24, the water washing tank 26, the base plating tank 28, and the electrodeposition tank 30 can be passed through, respectively.

In the alkaline degreasing tank 20, an aqueous solution of sodium salts such as sodium hydroxide and sodium carbonate is stored, and an alkaline degreasing step of removing fats and oils existing on the surface of the metal wire 12 with an aqueous solution of sodium salt prior to nickel plating. Is done. In the washing tank 22, washing water is stored, and a washing step is performed in which the sodium salt remaining on the surface of the metal wire 12 that has passed through the alkaline degreasing tank 20 is removed by washing with water. In the acid cleaning tank 24, an aqueous solution containing sulfuric acid, hydrochloric acid, etc. is stored, and the oxide film, passivation film, rust, etc. existing on the surface of the metal wire 12 are removed by the acid aqueous solution prior to nickel plating. The process is carried out. In the water washing tank 26, washing water is stored, and a water washing step is performed in which the acid remaining on the surface of the metal wire 12 that has passed through the acid washing tank 24 is removed by washing with water.

In the base plating tank 28, an electrodeposition liquid (plating liquid) containing nickel ions is stored, and a base forming step of forming a base layer for increasing the adhesion strength of the nickel plating film 14 is performed on the surface of the metal wire 12. .. The electrodeposition liquid, that is, the plating bath in the base plating tank 28 is, for example, a sulfamic acid bath composed of nickel sulfamate, nickel chloride, and boric acid, and is prepared to have a pH in the range of, for example, about 3.0 to 5.0. ing. The temperature of the plating bath is, for example, in the range of about 30 to 60 (° C.).

Further, in the electrodeposition tank 30, an electrodeposition liquid containing nickel ions in which abrasive grains 16 are dispersed is stored, and the abrasive grains 16 are fixed to a metal wire 12 provided with a base layer by nickel plating (electroplating). The abrasive grain electrodeposition step of forming the nickel-plated film 14 having a multi-layer structure is performed. The electrodeposition liquid, that is, the plating bath in the electrodeposition tank 30, is also a sulfamic acid bath similar to the base plating tank 28. The abrasive grains 16 contained in the electrodeposition liquid are selected fine-grained diamonds having a particle size of, for example, about 50 (μm) (for example, FMM M40 / 60 manufactured by Global Diamond Co., Ltd.). Here, a device for supplying the plating liquid, a recovery device for recovering the surplus abrasive grains 16 that have settled, and the like are appropriately provided.

Further, among the traveling paths of the metal wire 12, cathode electrodes that come into contact with the metal wire 12 are provided at three locations before and after the base plating tank 28 and the electrodeposition tank 30, and the base plating tank 28 and the electric current are provided. Energization is performed between the anode electrode provided in the landing tank 30 and the current density so as to have a current density in the range of, for example, 0.5 to 50 (A / dm ² ).

When manufacturing the abrasive grain electrodeposition wire 10 using such a manufacturing facility, first, in the plating process (abrasive electrodeposition process), the alkali degreasing tank 20 to the electrodeposition tank is guided by the guide pulley 32. The metal wire 12 that is sequentially passed through the inside of the 30 is continuously moved by being wound by an appropriate winding device (not shown) such as a motor provided at the tip of the electrodeposition tank 30. The feed rate of the metal wire 12 is, for example, 1000 (mm / min) or more.

In the electrodeposition tank 30, an abrasive grain settling region provided on a part of the metal wire 12 on the rear side in the traveling direction is provided. In the abrasive grain settling region, the plating solution containing the abrasive grains 16 is supplied from above toward the metal wire 12, so that the plating liquid containing the abrasive grains 16 is brought into contact with the cathode electrode to reach the outer peripheral surface 32 of the metal wire 12 which is the negative electrode. The abrasive grains 16 that settle in a dispersed state are adhered, and metal ions (nickel ions) in the electrodeposited liquid are attracted to the outer peripheral surface thereof to form the nickel plating film 14. As a result, the abrasive grains 16 are fixed to the outer peripheral surface of the metal wire 12 by the nickel plating film 14. The nickel plating film 14 is formed so as to have a film thickness of 25 to 70% of the average particle size of the abrasive grains 16.

Since the abrasive grain settling region is provided in a part of the electrodeposition tank 30 on the rear side in the traveling direction of the metal wire 12, the metal wire 12 is placed on the outer peripheral surface of the metal wire 12 in the electrodeposition tank 30. Is moved in the horizontal direction with the metal attached. In this embodiment, the metal wire 12 is nickel-plated in the process of being moved with the abrasive grains 16 placed on it, the abrasive grains 16 are fixed, and the abrasive grain electrodeposition wire 10 shown in FIG. 1 is formed. can get.

First, the present inventors have made a plurality of types (12 types) of electrodeposited wire samples W1 to the same materials, dimensions, and film thickness except that the strength of the nickel plating film is different by different plating conditions. W12 was produced using a production process similar to the production process shown in FIG. The electrodeposited wire samples W1 to W12 show that the larger the sample number, the higher the strength. Then, the present inventors conducted the following processing tests to evaluate the processing performance and life of each of the electrodeposited wire samples W1 to W12.

(Processing test)
・ Cutting machine: Wire saw WSD-K2 type manufactured by Takatori Co., Ltd. ・ Work material: Sapphire (evaluation of processing performance)
-Measure the amount of cut into the work material when cutting into the work material for a predetermined fixed machining performance evaluation time (30 minutes), and from a practical point of view, there are three stages of ○, △, and ×. Relative evaluation was performed.
(Evaluation of life)
-When the work material is cut by a predetermined number of life evaluations, the diameters of the electrodeposited wire samples W1 to W12 are measured at multiple locations (10 locations) using a micrometer, and before the start of cutting. The average value of the amount of decrease in diameter (diameter wear amount) with the diameter of the diameter is calculated, and based on the amount of decrease and the surface condition (residual state of abrasive grains) by SEM observation, ○, Δ Relative evaluation was performed in three stages of, and ×.

FIG. 3 shows the evaluation results of the above-mentioned processing performance and life of each electrodeposited wire sample W1 to W12. According to FIG. 3, the processing performance and life of the electrodeposited wire samples W3 to W10 are evaluated to be practical.

(Formation of wear by local injection of slurry)
Next, in order to evaluate the characteristics of the nickel-plated films of the above-mentioned electrodeposited wire samples W1 to W12, the present inventors have conducted a slurry local injection wear method using a slurry containing spherical silica and polygonal alumina particles. Based on the slurry local injection wear method using the slurry containing the slurry, the nickel-plated films of the electrodeposited wire samples W1 to W12 were formed with recesses that were worn by the local injection of the slurry.

FIG. 4 illustrates the configuration of a slurry local injection wear device (MSR-A type manufactured by Palmeso Co., Ltd.) 33 used by the present inventors to evaluate the characteristics of the nickel-plated films of the electrodeposited wire samples W1 to W12. are doing. As the slurry local injection wear device 33, a spherical silica slurry in which 3 volumes of spherical silica having an average particle diameter of 5 μm is mixed in water and 3 volumes of polygonal alumina having an average particle diameter of 1.2 μm are mixed in water. There are two types used, one that uses a polygonal alumina slurry mixed with%, but the same configuration is used only with the difference in the slurry used. The average particle size is measured by a laser diffraction type particle size measuring device.

In FIG. 4, the slurry 34 is stored in the slurry tank 35 and is stirred by the stirrer 36. From the compressed air source 38, the slurry pressure Ps is applied into the slurry tank 35 via the slurry pressure regulating valve 40, so that the slurry 34 from the slurry tank 35 is supplied to the projection gun 42 through the slurry flow meter 44. It has become like. Further, the air pressure is supplied from the compressed air source 38 to the projection gun 42 via the air pressure adjusting valve 46 and the air flow meter 48. The projection nozzle 50 provided at the lower part of the projection gun 42 has a nozzle with a projection cross-sectional area of 1.0 mm ² (length 1 mm × width 1 mm), and is covered by a projection booth 54. The projection gun 42 mixes the supplied slurry 34 and air and locally injects the supplied slurry 34 and air from the projection nozzle 50 toward the sample W of the electrodeposited wire fixed to the jig 52 at a projection distance of 4 mm. A recess is formed in which the surface of the sample W of the electrodeposited wire is locally worn. The jig 52 to which the sample W of the electrodeposition wire is fixed is taken in and out of the projection booth 54 by the table driving device 56. The slurry 34 stored in the projection booth 54 is returned to the slurry tank 35 by the recovery pump 58.

When the slurry local injection wear method using a spherical silica slurry containing spherical silica particles is used, the air pressure supplied to the projection nozzle 50 is, for example, 0.335 MPa, the slurry pressure is 0.317 MPa, and the slurry pressure is supplied to the projection nozzle 50. An impact mode in which the air flow rate is set to, for example, 10.8 L / min and the slurry flow rate is set to 125 L / min is selected. The projection force in this impact mode is confirmed by the fact that the erosion rate formed on the standard piece made of acrylic resin is 24.0 ± 5% μm / g. When the slurry local injection wear method using a polygonal alumina slurry containing polygonal alumina particles is used, the air pressure supplied to the projection nozzle 50 is, for example, 0.216 MPa, the slurry pressure is 0.210 MPa, and the projection nozzle 50. A cutting mode is selected in which the air flow rate supplied to is set to, for example, 6.1 L / min and the slurry flow rate is set to 125 L / min. The projection force in this cutting mode is confirmed by the erosion rate formed on the standard piece made of silicon wafer being 6.36 ± 5% μm / g.

(Measurement of wear depth formed by wear and calculation of erosion rate)
The present inventors have used a slurry local injection wear method using a spherical silica slurry containing spherical silica particles and a slurry local injection wear method using a polygonal alumina slurry containing polygonal alumina particles by injecting the slurry. The wear depth (erosion depth) locally formed on the nickel-plated films of the electrodeposited wire samples W1 to W12 was measured at a plurality of positions under the following measurement conditions. Next, the maximum value D (μm) of the wear depth is measured from the obtained profile. FIG. 5 is an example of the profile. Next, due to the preset relationship between the spherical silica slurry containing the spherical silica particles and the polygonal alumina slurry containing the polygonal alumina particles, the particles are supplied to the projection nozzle 50 and projected onto the electrodeposition wire sample W based on the slurry flow rate. The amount of projected particles (g) to be projected is calculated. Then, for the electrodeposited wire samples W1 to W12, by dividing the average value of the maximum value D (μm) by the amount of projected particles (g), a slurry local injection wear method using a spherical silica slurry containing spherical silica particles is performed. Spherical particle wear rate (spherical particle erosion rate) (μm / g) and polygonal particle wear rate (when used and when the slurry local injection wear method using a polygonal alumina slurry containing polygonal alumina particles is used. Polygonal particle erosion rate) (μm / g) is calculated respectively.

(Measurement condition)
Model used: Stylus type measuring instrument (PU-EU1) manufactured by Kosaka Laboratory Co., Ltd.
Touch needle load: 200 μN
Measurement magnification: 10000
Side length: 4 mm
Measurement speed: 0.2 mm / sec

FIG. 6 shows the spherical particle wear rate (erosion rate) (μm / g) obtained by the slurry local injection wear method using the spherical silica slurry containing the spherical silica particles for the electrodeposited wire samples W1 to W12, and the polygonal shape. It is a figure which showed the polygonal particle wear rate (erosion rate) (μm / g) obtained by the slurry local injection wear method using the polygonal alumina slurry containing alumina particles in two-dimensional coordinates. As is clear from FIG. 6, the electrodeposited wire samples W3 to W10 evaluated as ○ in FIG. 3 have a polygonal particle wear rate (polygonal particle erosion rate) on the horizontal axis of 0.15 to 0.6 μm / g. It is located within the range, and the spherical particle wear rate (spherical particle erosion rate) on the vertical axis is located within the range of 0.6 to 1.5 μm / g. That is, the strength of the nickel-plated films of the electrodeposited wire samples W3 to W10 is such that the polygonal particle wear rate (polygonal particle erosion rate) is within the range of 0.15 to 0.6 μm / g and / or the vertical axis. When the spherical particle wear rate (spherical particle erosion rate) is in the range of 0.6 to 1.5 μm / g, the abrasive grain holding power is high and the nickel plating on the abrasive grains is appropriately peeled off to reduce grinding resistance. Since the increase is suppressed, it is clear that high processing performance can be obtained.

As shown in FIG. 6, the strength of the nickel plating film includes the polygonal particle wear rate (erosion rate) (μm / g) shown on the horizontal axis and the spherical particle wear rate (erosion rate) (μm / g) shown on the vertical axis. ) Can be specified by at least one numerical range.

As described above, according to the abrasive grain electrodeposition wire 10 of this embodiment, the nickel-plated film 14 formed on the surface of the metal wire 12 has a degree of wear with respect to the amount of projected particles obtained by the slurry local injection wear method. Of the wear rates (erosion rates), the polygonal particle wear rate (erosion rate) (μm / g) when polygonal particles are used has a strength of 0.15 to 0.6 μm / g. Since the abrasive grain holding power is high and the nickel plating film 14 on the abrasive grains 16 is appropriately peeled off to suppress an increase in grinding resistance, high processing performance can be obtained.

Further, according to the abrasive grain electrodeposition wire 10 of this embodiment, the nickel plating film 14 formed on the surface of the metal wire 12 is worn, which is the degree of wear with respect to the amount of projected particles obtained by the slurry local injection wear method. Of the rates, the spherical particle wear rate (erosion rate) (μm / g) when spherical particles are used has a strength of 0.6 to 1.5 μm / g, so that the abrasive grain holding power is high and Since the nickel plating film 14 on the abrasive grains 16 is appropriately peeled off and the increase in grinding resistance is suppressed, high processing performance can be obtained.

Further, according to the abrasive grain electrodeposition wire 10 of the present embodiment, the nickel plating film 14 formed on the surface of the metal wire 12 is worn, which is the degree of wear with respect to the amount of projected particles obtained by the slurry local injection wear method. Among the rates, the polygonal particle wear rate (erosion rate) (μm / g) when polygonal particles are used shows 0.15 to 0.6 μm / g, and spherical particle wear when spherical particles are used. Since the rate (erosion rate) (μm / g) has a strength of 0.6 to 1.5 μm / g, the abrasive grain holding power is high and the nickel plating film 14 on the abrasive grains 16 is appropriately peeled off for grinding. Since the increase in resistance is suppressed, high processing performance can be obtained.

Further, according to the abrasive grain electrodeposition wire 10 of this embodiment, the nickel plating film 14 has a multilayer structure. For example, the abrasive grains 16 are electrodeposited on the base layer. As a result, a high abrasive grain holding force can be obtained with respect to the metal wire 12.

Further, according to the abrasive grain electrodeposition wire 10 of the present embodiment, since the nickel plating film 14 has a film thickness of 25 to 70% of the average particle size of the abrasive grains 16, the nickel plating film 14 of the abrasive grains 16 is used. The retention and the amount of abrasive grains protruding from the nickel plating film 14 are well-balanced, and high grinding performance can be obtained.

Although the present invention has been described in detail with reference to the drawings above, the present invention can be carried out in still another embodiment, and various modifications can be made without departing from the gist thereof.

10: Abrasive electrode electrodeposition wire 12: Metal wire 14: Nickel plating film 16: Abrasive grains 20: Alkaline degreasing tank 22: Water washing tank,
24: Acid washing tank 26: Water washing tank 28: Base plating tank 30: Electroplated tank 32: Guide pulley 33: Slurry local injection wear device 34: Slurry 35: Slurry tank 36: Stirrer 38: Compressed air source 40: Slurry pressure adjustment Pressure valve 42: Projection gun 44: Slurry flow meter 46: Air pressure control valve 48: Air flow meter 50: Projection nozzle 52: Jig 54: Projection booth 56: Table drive device 58: Recovery pump

Claims (5)

An abrasive grain electrodeposited wire in which the abrasive grains are electrodeposited on the surface of the metal wire by nickel plating.
The nickel-plated film formed on the surface of the metal wire has an average wear rate of 0.15 to 0, which is the degree of wear with respect to the amount of projected particles obtained by the slurry local injection wear method using polygonal particles. An abrasive grain electrodeposition wire having a strength of 6 μm / g. An abrasive grain electrodeposited wire in which the abrasive grains are electrodeposited on the surface of the metal wire by nickel plating.
The nickel-plated film formed on the surface of the metal wire has an average wear rate of 0.6 to 1, which is the degree of wear with respect to the amount of projected particles obtained by the slurry local injection wear method using spherical particles. An abrasive grain electrodeposition wire having a strength of 5 μm / g. An abrasive grain electrodeposited wire in which the abrasive grains are electrodeposited on the surface of the metal wire by nickel plating.
The nickel-plated film formed on the surface of the metal wire has an average value of wear rate, which is the degree of wear with respect to the amount of projected particles obtained by the slurry local injection wear method, of 0.15 when polygonal particles are used. An abrasive grain electrodeposition wire having a strength of about 0.6 μm / g and showing a strength of 0.6 to 1.5 μm / g when spherical particles are used. The abrasive grain electrodeposition wire according to any one of claims 1 to 3, wherein the nickel-plated film has a multilayer structure. The abrasive grain electrodeposition wire according to any one of claims 1 to 4, wherein the nickel-plated film has a film thickness of 25 to 70% of the average particle size of the abrasive grains.