KR101487986B1 - A wire saw - Google Patents

Abstract

(Diamond) electrodeposited on a wire saw, thereby improving the cutting speed and cutting precision, and a method for manufacturing the same.

The wire saw of the embodiment is formed by plating a soft first metal layer 45 on the surface of a wire 41 such as a piano wire and forming a second metal layer 45 on the surface of the first metal layer 45, And a part of the cutting particles 43 such as diamond particles is planted and fixed to the first metal layer 45 and the second metal layer 46. [

Such an electrodeposited wire saw for cutting can fix diamond particles with a soft and hard multi-layered plating layer to remarkably improve the adhesion of diamond particles, thereby suppressing reduction in cutting speed due to dropping of particles generated during cutting operation, And it is also advantageous to minimize the cutting marks on the cut surface.

Wire sawing, cutting particles, copper, nickel, diamond

Description

A wire saw for cutting

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrodeposited wire saw for cutting and slicing a hard material such as semiconductor, ceramic, cemented carbide and the like, and a method of manufacturing the same. Particularly, To improve the cutting speed and cutting precision by reducing the dropout rate by improving the cutting performance and the manufacturing method thereof.

Silicon or compound semiconductors or quartz and oxide single crystal materials used as semiconductor wafer materials are very high in surface hardness. For cutting a silicon ingot to a certain thickness, cutting particles such as high-hardness diamond are required. Cut to slightly thicker than the thickness.

In recent years, a cutting method using a wire saw has been used in a cutting method using a diamond blade.

Cutting using wire saw can reduce yield, thickness deviation and warpage compared with the method of cutting a blade type using diamond.

Such a wire saw is fed several times to a supply reel and a take-up reel so as to be able to be fed and rewound, and the wire contacts the workpiece while cutting the wire.

In the wire saw as described above, there are provided a multi-wire saw in which a plurality of wire saws are passed through cut surfaces while supplying a grinding fluid containing cutting particles such as silicon carbide powder and cutting powder and oil or the like to a cut portion, And electrodeposited wire saw for electrodeposition of diamond particles.

In the case of a multi-wire saw using slurry for cutting, it is advantageous to cut a large workpiece by several times or several hundreds of pieces by a single cutting operation. However, since oil is mixed with the slurry slurry, It is easy and difficult to treat waste slurry, the cutting speed is slow, and the cutting surface is rough. In addition, if the wire saw is broken during the cutting operation, the silicon ingot becomes defective and the economic loss is very large.

On the other hand, the diamond electrodeposited wire saw is widely used as a cutting tool of a semiconductor material of a silicon ingot because it has less cutting marks on the cut surface and has a relatively excellent precision in cutting.

A typical example of such a conventional diamond electrodeposited wire saw is as follows.

Japanese Patent Publication No. 62-260006 discloses a diamond saw in which the surface of a piano wire is heat treated to have a soft ferrite structure and then diamond particles are physically embedded in the ferrite base.

However, this wire is disadvantageous in that it is prone to break in the cutting operation due to a large number of surface flaws due to the pressing of the diamond on the surface.

As another example, Japanese Unexamined Patent Publication No. 7-96455 discloses a method in which a first nickel plating layer 1 is coated on a piano wire 2, and a resin layer 14 such as a fluorine resin is coated thereon The resin layer 14 is removed in the form of a spiral having a predetermined width to form a spiral diamond layer 12 on which the diamond particles 12 are electrodeposited together with the optional secondary nickel plating layer 11 on the exposed first nickel plating layer 1. Then, Sowing is disclosed.

This type of wire saw involves a process of covering the resin layer and grinding it in a spiral form, thereby complicating the production process of the wire saw, resulting in low productivity and high manufacturing cost.

The diamond particles 12 are electrodeposited on the hard secondary nickel plating layer 11 so that cracks are generated at the boundary between the hard diamond particles 12 and the secondary nickel plating layer 11 due to the impact caused by friction during cutting So that the diamond particles 12 fall off.

In addition, as the most general form of diamond electrodeposited wire saw, it is relatively easy to make wire sow which is subjected to primary ground plating on the surface of piano wire and electrodeposited diamond particles together with secondary nickel plating, However, when the ingot is cut at a diameter of 8 inches or more, the cutting of the wire saw and the disconnection of the diamond saw are markedly large. There is a problem that gets rough.

Also, there is a problem that the cutting ability is drastically lowered during use due to the drop of the diamond particles.

The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a diamond electrodeposited wire saw and a diamond electrodeposited wire saw which are capable of reducing the deterioration of diamond particles affecting the precision of cutting of hard material, And a manufacturing method thereof.

In order to achieve the above object, the present invention provides an electrodeposited wire saw for cutting,

A soft first metal layer plated on the surface of the wire and a hard second metal layer plated on the surface of the first metal layer, wherein the first metal layer and the second metal layer are alternately stacked to form a multilayer plating layer, And cutting particles fixed to the first metal layer and the second metal layer so as to be partially embedded therein.

According to another aspect of the present invention, there is provided an electrodeposited wire saw for cutting,

A hard second metal layer plated on the surface of the wire and a soft first metal layer plated on the surface of the second metal layer, wherein the second metal layer and the first metal layer are alternately stacked to form a multilayer plating layer, And cutting particles fixed to the first metal layer and the second metal layer so as to be partially embedded therein.

In the wire saw of the present invention, the first metal layer is copper (Cu) and the second metal layer is nickel (Ni).

Also, the wire diameter of the wire is 0.05 to 0.30 mm, and the first and second metal layers are each plated to a thickness of 0.05 to 1 탆.

Further, the present invention is characterized in that a soft copper plating layer or a brass plating layer is formed between the first metal layer and the wire surface in a thickness of 0.1 to 1 μm.

Further, a soft copper plating layer or a brass plating layer is formed between the second metal layer and the wire surface to a thickness of 0.1-1 탆.

Further, the cutting particles are diamond.

INDUSTRIAL APPLICABILITY The electrodeposited wire saw for cutting according to the present invention fixes diamond particles with a soft and hard multi-layered plating layer to remarkably improve the adhesion force of diamond particles, thereby suppressing reduction of cutting speed due to dropping of particles generated during cutting operation, It is possible not only to remarkably improve but also to minimize the cutting marks on the cut surface.

As a result, the cutting speed can be improved and at the same time, good cutting precision can be obtained, and the yield of the expensive raw material such as single crystal ferrite can be remarkably increased.

Accordingly, a remarkable effect is exhibited when it is used for cutting a magnetic head such as a VTR or an ATR, or a semiconductor chip, which requires very precise surface precision.

The electrodeposited wire saw for cutting according to the present invention is formed by alternately laminating a soft metal layer and a hard metal layer on the wire surface of a metal and fixing the diamond particles as cutting particles, By lowering the dropout rate, the cutting speed and cutting precision are improved.

≪ Embodiment 1 >

3 showing a section of the wire saw in the embodiment of the present invention, a soft first metal layer 45 is plated on the surface of a wire 41 such as a piano wire, and a first metal layer 45 is coated on the surface of the first metal layer 45, The second metal layer 46 is harder than the metal layer 45 and a part of the cutting particles 43 such as diamond particles is planted on the first metal layer 45 and the second metal layer 46, Structure.

In the embodiment of the present invention, the wire diameter of the wire 41 is 0.05 to 0.30 mm, and the first and second metal layers are respectively plated with a thickness of 0.05 to 1 탆.

The first metal layer is a copper (Cu) plating layer, and the second metal layer is a nickel (Ni) plating layer.

A soft copper plating layer or a brass plating layer (not shown) may be formed between the first metal layer 45 and the surface of the wire 41 to a thickness of 0.1-1 탆.

≪ Embodiment 2 >

The wire saw of the second embodiment is formed by changing the plating order of the first and second metal layers 45 and 46 in the first embodiment.

That is, a second metal layer 46 is first formed on the surface of the wire 41 having a wire diameter of 0.05 to 0.30 mm to a thickness of 0.05 to 1 탆 and a first metal layer 45 is formed on the surface of the second metal layer 46 And is formed by plating with a thickness of 0.05 to 1 mu m.

A soft copper plating layer or a brass plating layer (not shown) may be formed between the second metal layer 46 and the surface of the wire 41 to a thickness of 0.1 to 1 μm.

≪ Third Embodiment >

Referring to FIG. 4, in this embodiment, a soft first metal layer 45 and a hard second metal layer 46 are alternately stacked and formed on the surface of the wire 41 of the above embodiments, A part of the cutting particles 43 such as diamond particles are planted on the first metal layer 45 and the second metal layer 46 to be fixed. The first metal layer 45 and the second metal layer 46 form a unit metal layer. When the unit metal layer is formed, a part of the cutting particles is planted on the unit metal layer and is fixed. According to the present embodiment, as shown in FIG. 4, the unit metal layer is provided in at least two layers. The cutting particles include depressed particles that are embedded in the unit metal layer and exposed particles that are exposed to the outside and fixed.

In this case, the first metal layer 45 may be formed first, and the second metal layer 46 may be formed first. In both cases, a portion of the cutting particles 43 may be formed in the first and second metal layers 45, (46).

Also in this embodiment, a soft copper plating layer or brass plating layer 44 can be formed between the second metal layer 46 and the surface of the wire 41 at a thickness of 0.1-1 탆.

In the above embodiments, the wire saw 40 travels while the cutting particles 43 (diamond particles) are fixed so as to be embedded in the soft first metal layer 45 and the hard second metal layer 46, It is possible to reduce the dropout rate of the cutting particles 43 from the friction impact with the workpiece when cutting the cutting material.

That is, the hard second metal layer 46 such as nickel (Ni) can adhere the cutting particles 43 with a strong adhesive force, but the boundary portion with the cutting particles 43 (see FIG. 3) So that cracks may be caused to occur.

However, since the cutting particles 43 are touched together with the soft first metal layer 45 such as copper (Cu), the abrasion resistance and toughness can be secured at the same time, and the dropout rate can be lowered.

Particularly, as in the case of the third embodiment, the first and second metal layers 45 and 46 are repeatedly laminated two or more times, and the cutting particles 43 are coated on the first and second metal layers 45 and 46, It is possible to effectively prevent the cutting particles 43 from falling off.

Hereinafter, a method of manufacturing a wire saw according to an embodiment of the present invention will be described.

The primary wire having a wire diameter of 1.0 to 1.5 mm is obtained by cold drawing in a dry continuous drawing machine using a wire wire of 5.5 mm in diameter containing 0.7 to 1.1 wt% of carbon.

Then, the fresh primary wire is heat treated (heat treated) through a lead furnace by heating and then copper plating and galvanizing are performed while passing through a pickling bath, a water bath, a copper plating bath and a galvanizing bath.

Subsequently, the primary wire is passed through a heat diffusion bath to convert the plated layer into a brass layer, and the oxide layer on the surface is removed from the phosphoric acid bath, then washed again in a water bath and dried in a hot air oven to obtain a brass plated middle line.

The obtained intermediate wire is drawn by a plurality of dies in a wet continuous drawer at a high cost of 95% to 98% to form a secondary wire 41 having a super high strength of a tensile strength of 3000 to 4500 MPa and a wire diameter of 0.05 to 0.30 mm.

The obtained secondary wire is subjected to multi-layer plating in which a thin layer of copper / nickel is formed in a multilayer plating bath in which diamond particles 43 are dispersed, and the diamond particles 43 are electrodeposited and fixed firmly by the multilayer plating layer .

The multi-layered plating bath is prepared by forming copper and nickel components in one plating solution and then subjecting copper plating to plating at a low current density and nickel plating at a low current density using a sufficiently different electrochemical method by cyclic purging of current or voltage. Plating is performed.

The diamond particles 43 are electrodeposited while the copper layer and the nickel layer are alternately and repeatedly stacked on the surface of the wire 41 so that the diamond layer 43 is formed on the soft first metal layer 45 ) And the hard second metal layer 46 (nickel) alternately.

When forming the multilayered plating layer, the first metal layer 45 (copper layer) may be formed first, or the second metal layer 46 (nickel layer) may be formed first. If the adhesion strength of the diamond is important in the multilayer plating, it is preferable to increase the number of the plating layers while thinning each of the first and second metal layers 45 and 46 in the multi-layers, and the object of the present invention is to minimize the drop- It is preferable that the plating layers of the multilayer plating layers are alternately stacked five or more times. More preferably, in the multilayered plated layer, it is advantageous that the thickness of the plated layer of each of copper and nickel is formed to be about 0.05 to 1.0 탆 and of a similar thickness.

On the other hand, although a plating method using cyclic pulsing is adopted as a method for obtaining a more economical and preferable diamond electrodeposited plating layer in the above embodiment by plating a soft and hard plating layer in multiple layers, A plating method may be adopted in which a plating vessel is arranged in the order of copper plating-> water-washing-> nickel plating-> water-washing-> copper plating-> water washing-> nickel plating, and advancing the wire.

[Experimental Example]

Hereinafter, an experimental example through a wire saw of the embodiment of the present invention and a cutting test of a wire saw of a comparative object (conventional example) will be described.

The wire saw of the embodiment of the present invention is formed by alternately and repeatedly laminating a first metal layer 45 and a second metal layer 46 each having a thickness of about 0.05 to 1 占 퐉 on the surface of a high strength wire 41 having a diameter of 0.14 mm , Diamond particles (43) having a size of 5 to 20 mu m were electrodeposited, and a wire saw having a wire diameter of 0.18 mm was used as the final wire saw.

The diamond electrodeposited wire saw to be compared was made by copper plating after cleaning a high strength wire (AISI 1080) having a wire diameter of 0.14 mm and nickel plating for electrodeposition of diamond particles of 5 to 20 탆 in size, Diamond electrodeposited wire saw was used.

Cutting ability according to the number of reciprocations, precision of a workpiece, and dropout rate of diamond particles were measured while cutting quartz as a brittle material with respect to the two kinds of wire saws, and the results are shown in Table 1 and FIG. 5 below.

The speed of the wire for cutting quartz was 1 m / sec and the load was 1 kgf.

<Table 1>

According to the experiment, the wire saw of the embodiment of the present invention showed a very good cutting precision (warp) at the same number of reciprocations as compared with the wire saw of the comparative example, and the cutting speed of the cut- .

Particularly, in the diamond electrodeposited wire saw of the present invention, no drop of the diamond particles was found even at the number of reciprocations of 2,000 times. However, in the diamond electrodeposited wire saw to be compared, the dropout rate of the diamond particles reached 14%. Under the 4000 reciprocating conditions, The dropout rate of the electrodeposited wire saw was 8% whereas the dropout rate of the diamond particles was 64% in the comparative example.

From the results of the above experiment, it is evident that the diamond particles are firmly fixed to the wire saw by combining the soft and hard multilayer plating layers in the diamond electrodeposited wire saw, so that the diamond particles are prevented from falling off during the cutting operation, Speed and good cutting accuracy.

Figures 1 and 2 are schematic diagrams of conventional wire saws,

3 is a cross-sectional view showing a wire saw in an embodiment of the present invention,

4 is a cross-sectional view showing a wire saw in another embodiment of the present invention,

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FIG. 5 is a graph showing a cutting test result of a wire saw according to the present invention and a wire saw to be compared. FIG.

Claims (7)

In the electrodeposited wire saw for cutting, A first metal layer plated on the surface of the wire and a second metal layer plated on the surface of the first metal layer and relatively harder than the first metal layer, Wherein a part of cutting particles is planted and fixed to the unit metal layer when the unit metal layer is formed, and at least two or more unit metal layers are provided, Wherein the cutting particles include depressed particles that are embedded in the unit metal layer and exposed particles that are exposed and fixed to the outside. In the electrodeposited wire saw for cutting, A unit metal layer made of a hard second metal layer plated on the surface of the wire and a first metal layer plated on the surface of the second metal layer and relatively softer than the second metal layer, Wherein a part of cutting particles is planted and fixed to the unit metal layer when the unit metal layer is formed, and at least two or more unit metal layers are provided, Wherein the cutting particles include depressed particles that are embedded in the unit metal layer and exposed particles that are exposed and fixed to the outside. The electrodeposited wire cutting tool according to claim 1 or 2, wherein the first metal layer is copper (Cu) and the second metal layer is nickel (Ni). The electrodeposited wire cutting tool according to claim 3, wherein the wire has a wire diameter of 0.05 to 0.30 mm, and the first and second metal layers are respectively plated with a thickness of 0.05 to 1 탆. The electrodeposited wire cutting tool according to claim 1, wherein a soft copper plating layer or a brass plating layer is formed between the first metal layer and the wire surface in a thickness of 0.1 to 1 占 퐉. 3. The electrodeposited wire cutting tool according to claim 2, wherein a soft copper plating layer or a brass plating layer is formed between the second metal layer and the wire surface in a thickness of 0.1 to 1 m. The electrodeposited wire cutting tool according to claim 1 or 2, wherein the cutting particles are diamond.

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