JP2007152486A - Manufacturing method of saw wire - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electrodeposition fixed type saw wire, having high productivity without reducing the surface accuracy of a cut surface of a material to be cut of an electric part material such as semiconductor and a silicon wafer. <P>SOLUTION: In this manufacturing method of a saw wire, abrasive 2 is stuck to a metal wire 1 and the abrasive is fixed to the metal wire by a metal plated layer formed by electroplating. In order to stick the abrasive 2 to the metal wire 1, as the surface preparation, the metal wire is metal-plated (ground plated) by electroplating, the abrasive is stuck to the metal-plated layer 3 (the ground plated layer) of the metal wire formed by the surface preparation to be temporarily stopped, and press-bonded so that some of the abrasive 2 is caused to bite into the ground plated layer 3 and fixed, and after that, a metal plated layer 4 (a fixed plated layer) formed by electroplating is stacked on the ground plated layer 3 where the abrasive is caused to bite, thereby strengthening fixation of the abrasive 2 to the metal wire 1. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a saw wire used for cutting an expensive material such as a semiconductor, a silicon wafer, a crystal, a magnetic material and the like, and the abrasive grains are fixed by an electrodeposition layer. With respect to the fixed abrasive type saw wire, the productivity of the uniform abrasive grain distribution can be improved and the production cost can be reduced.

  In recent years, fixed abrasive saw wires in which fine abrasive grains are fixed on the surface of a thin metal wire have been used. In this conventional fixed abrasive saw wire, for example, an electrodeposition layer (plating layer) is formed on a fine metal wire drawn to a wire diameter of 0.2 to 1.0 mm, and the abrasive is applied to the electrodeposition layer. Some are buried and fixed. In this manufacturing method, the metal wire is passed through a plating solution (Ni plating solution or the like) in which abrasive grains are dispersed and precipitated, so that the abrasive grains adhere to the surface of the metal wire as the plating layer grows during the plating process. (Japanese Patent Laid-Open No. 63-22275). Such a saw wire by electrodeposition plating is basically as shown in FIG. 4, in which a plating layer 26 is formed on a metal wire 27, and minute abrasive grains 25 are fixed by the plating layer 26. is there.

  In this case, the saw wire in which the abrasive grains 25 are fixed to the surface of the metal wire with the plating layer 26 having a sufficient thickness is sufficient to fix the abrasive grains 25 to the metal wire 27, and therefore the cutting performance is maintained for a long time. Is done. However, for that purpose, it is necessary to form a plating layer having a sufficient thickness, and this tendency becomes more remarkable as the abrasive grains 25 have a larger diameter. In order to form the plating layer 26 having a sufficient thickness, it is necessary to pass the metal wire 27 through the plating solution at a low speed and to form the plating layer 26 having a required thickness on the surface of the metal wire during that time. . Therefore, such a manufacturing method has low productivity of saw wire and high production cost.

  Furthermore, since this electroplating manufacturing method is a method in which the abrasive grains 25 are deposited on the surface of the metal wire 27 while continuously moving the metal wire 27, the abrasive grains 25 and the metal wire 27 are mutually connected. There is always relative movement in the process of landing. Because of this relative movement, when the abrasive grain size is large, the plating layer 26 grows and the abrasive grains fall from the metal wire before being reliably deposited on the metal wire 27. There is a limit to the size of the abrasive particle size that can be fixed to the wire 27, and therefore the range of usable abrasive particle size is not so wide. In order to solve this problem, Japanese Patent Application Laid-Open No. 7-227767 discloses that a wire is intermittently fed. In this case, since the metal wire is sent intermittently, the thickness of the plating layer and the adhesion density of the abrasive grains may not be stable.

Further, in the above manufacturing method, it is known that the use of metal coated abrasive grains (for example, Ni coating) increases the fixing speed and increases the productivity of the saw wire. However, when abrasive grains coated with Ni by electroplating are used, the abrasive grains are agglomerated and adhere to the surface of the metal wire. This is because the current of the cathode flows also on the surface of the abrasive grains that are in contact with or fixed on the metal wire, and other abrasive grains are fixed thereto. When the abrasive grains aggregate and adhere as described above, the diameter of the portion becomes large, and the adhesion of the abrasive grains becomes non-uniform, and the surface accuracy of the workpiece is greatly reduced (deteriorated).
Japanese Unexamined Patent Publication No. 63-22275 JP-A-7-227767

  The present invention provides a method for manufacturing an electrodeposition-fixed saw wire that prevents agglomeration of abrasive grains, has a substantially uniform abrasive grain size, and has high productivity without reducing the surface accuracy of the cut surface of the workpiece. It is to provide.

The solution of the present invention is a method of manufacturing a saw wire in which abrasive grains are pressure-bonded to a metal wire, and the metal wire is metal-plated by electroplating and the abrasive grains are fixed by the plating layer.
In order to adhere the abrasive grains to the metal wire, the metal wire is subjected to metal plating (base plating) by electroplating as a base treatment,
Abrasive grains are uniformly attached and temporarily fixed to the metal plating layer (base plating layer) of the metal wire by the above base treatment,
This is pressure-bonded to fix a part of the abrasive grains by biting into the base plating layer,
After that, a metal plating layer (fixed plating layer) by electroplating is laminated on the base plating layer into which the abrasive grains have penetrated, thereby strengthening the fixation of the abrasive grains to the metal wire.
Specifically, this is due to the following configuration.

Electroplating the metal wire to form a base plating layer,
Apply the abrasive grains evenly to the base plating layer in a mixed state with water,
The metal wire coated with the abrasive grains is made to bite into the ground plating layer through a pressure die or a pressure roller,
Thereafter, a metal plating layer (fixed plating layer) by electroplating is further laminated on the base plating layer into which the abrasive grains have been entrapped,
And the said base plating is plating of nickel, copper, zinc, or tin,
The fixed plating is an appropriate metal plating.
The thickness of the base plating layer is suitably 5 to 80% of the grain size of the abrasive grains, and the thickness of the fixed plating layer is such that the required fixing force of the abrasive grains is fixed. The thickness is appropriate.

When a mixture of water and abrasive grains is evenly applied to a metal wire with a base plating layer made of nickel, copper, zinc or tin, the abrasive grains adhere to the base plating layer and are temporarily fixed by the adhesive force of water. The In this way, the metal wire on which the abrasive grains are evenly adhered is pressed, for example, through a pressure die or a pressure roller, and the entire circumference of the metal wire is pushed into the base plating layer (they are pushed in until the metal wire is bitten). May be) Since the base plating layer is a nickel, copper or lead plating layer, the abrasive grains easily bite in and are fixed relatively firmly.
Next, the metal wire on which the abrasive grains are fixed is further electroplated, and the metal plating layer (fixed plating layer) is laminated on the base plating layer.
When pressure is applied until the abrasive grains bite into the metal wire, the pressure-bonding portion of the metal wire material is hardened due to work hardening caused by plastic deformation, so that the holding power of the abrasive grains is further increased. Further, since the abrasive grains are held by the fixed plating layer, the abrasive grains are firmly held in a state where the abrasive grains are partially embedded in the base plating layer and the fixed plating layer, and are firmly fixed.

  Examples of the present invention will be described below.

Embodiments of the present invention will be described with reference to the drawings.
In this embodiment, Ni plating is performed by electroplating on a piao wire having a wire diameter of 0.2 mm, then abrasive grains having a particle size of 30 to 40 μm are equally distributed, and this is fixed to produce a saw wire. .
First, a 20 μm thick Ni plating layer (base plating layer) is formed by electroplating on a piano wire whose surface is brass-plated and drawn to a wire diameter of 0.2 mm.
Next, a mixed solution (mixing ratio is approximately 1: 1 by weight) in which diamond abrasive grains having a particle size of 30 to 40 μm are mixed with water is uniformly applied to the underlying plating layer of the metal wire. At this time, the abrasive grains are attached to the base plating layer by the adhesive force of water and temporarily fixed.
This is passed through a pressurizing means and continuously pressed, and the abrasive grains are pushed into the underlying plating layer and bite. In this embodiment, as a pressurizing means, a pressurizing die 20 is used as shown in FIG. The abrasive grains 2 are pressed by the taper surface of the pressure die 20 and pressed into the base plating layer 3, and a part of the abrasive grains 2 is fixed in a state of being bitten into the base plating layer 3. Further, the pressure means may be a pressure roller 30 by a pair of grooved pressure rollers 30a and 30b as shown in FIG.
Next, an Ni plating layer having a thickness of 20 μm is further laminated on the base plating layer by electroplating. This Ni plating layer becomes a fixed plating layer, and the abrasive grains are firmly fixed.

These are sectional drawings which show the section of an example typically. (A) is sectional drawing which shows an example of a pressurizing means, (b) is an AA arrow directional view of figure (a), (c) is a BB arrow directional view of figure (a). (A) is a schematic side view which shows another example of a pressurization means, (b) is a XX arrow directional view of Fig. (A). These are sectional drawings showing typically a longitudinal section of a prior art example.

Explanation of symbols

1 Metal wire (metal wire)
2 Abrasive grains 3 Base plating layer 4 Fixed plating layer 20 Pressure die 30 Pressure roller

Claims (3)

About a method of manufacturing a saw wire in which abrasive grains are attached to a metal wire, and the abrasive grains are fixed to the metal wire with a metal plating layer by electroplating.
In order to attach abrasive grains to the metal wire, metal plating (base plating) is performed on the metal wire by electroplating as a base treatment.
Attaching the abrasive grains to the metal plating layer (base plating layer) of the metal wire by the above base treatment, temporarily fixing it,
This is pressure-bonded to fix a part of the abrasive grains by biting into the base plating layer,
Thereafter, a metal plating layer (fixed plating layer) by electroplating is laminated on the base plating layer into which the abrasive grains have sunk, thereby strengthening the fixing of the abrasive grains to the metal wire. About a method of manufacturing a saw wire in which abrasive particles are attached to a metal wire and the abrasive particles are fixed to the metal wire by a metal plating layer by electroplating.
Electroplating the metal wire to form a base plating layer,
Apply the abrasive grains evenly to the base plating layer in a mixed state with water,
The metal wire coated with the abrasive grains is made to bite into the ground plating layer through a pressure die or a pressure roller,
Thereafter, a metal plating layer (fixed plating layer) by electroplating is further laminated on the base plating layer into which the abrasive grains have been entrapped,
And the said base plating is plating of nickel, copper, or lead,
A saw wire manufacturing method wherein the fixed plating is an appropriate metal plating.   The method of manufacturing a saw wire according to claim 2, wherein the thickness of the base plating is 5 to 80% of the grain size of the abrasive grains, and the abrasive grains are fixed by fixed plating.

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