JP2004058169A - Saw wire manufacturing method and saw wire - Google Patents

Saw wire manufacturing method and saw wire Download PDF

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Publication number
JP2004058169A
JP2004058169A JP2002216212A JP2002216212A JP2004058169A JP 2004058169 A JP2004058169 A JP 2004058169A JP 2002216212 A JP2002216212 A JP 2002216212A JP 2002216212 A JP2002216212 A JP 2002216212A JP 2004058169 A JP2004058169 A JP 2004058169A
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Prior art keywords
abrasive grains
wire
coating layer
abrasive
metal wire
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JP2002216212A
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Japanese (ja)
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Hiroshi Yamada
山田 廣志
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Individual
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Abstract

<P>PROBLEM TO BE SOLVED: To devise a manufacturing method for improving the productivity by firmly fixing abrasive grains by a mechanical method and improving the linear velocity of a wire in a manufacturing process. <P>SOLUTION: A metal wire is coated with a prescribed thickness of copper, zinc, nickel, aluminium, or brass, the coated metal wire (w) is laid in contact with feed members 4 and 4 disposed at a prescribed interval, the coated layer of the metal wire is heated by resistance to be softened, the metal wire whose coated layer is heated and softened is fed with the abrasive grains D before passing through a pair of annular grooved rollers 2 and 2, the abrasive grains stuck to the softened coated surface are pressurized and pushed in the softened coated layer by the annular grooved rollers, and the coated layer is cooled and hardened so as to fix the abrasive grains to the coated layer. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【産業上の利用分野】
この発明は、半導体用ウエハーの母材であるシリコン結晶や、人工水晶、超硬合金、セラミックス等の高価な素材を切断するのに用いられるソーワイヤの製造方法に関するものであり、その生産性を改良して生産コストを低減することができるものである。
【0002】
【従来の技術】
近年細い金属線の表面にダイヤモンドなどの微細な砥粒を固着した固定砥粒式ソーワイヤが使用されはじめている。この従来の固定砥粒式ソーワイヤには、例えば伸線加工して細径化した金属線にレジンボンド(熱硬化性樹脂)を積層して、上記レジンボンド層によって、その表面に密にダイヤモンド砥粒やCBN砥粒、硬質微細繊維などの硬質微片(以下これを砥粒という)を固着したもの、或いは、メッキ層に砥粒を埋設して固着したものがある。前者の固定砥粒式ソーワイヤの製造方法は砥粒を混入させたレジンボンドの中をワイヤを通過させることでその表面に砥粒を混入したレジンボンドを付着させ、これを冷却硬化させる方法であり、後者の固定砥粒式ソーワイヤの製造方法はメッキ液に砥粒を浮遊させておいてメッキ(電気メッキ)処理時にメッキ層に砥粒が付着するようにする方法である。なお、上記の「CBN」は、立方晶窒化ホウ素の略称である。
【0003】
前者の場合は混入した砥粒のレジンボンド中での分布が不均一であると、また、後者の場合はメッキ液中の砥粒分布が不均一であるとソーワイヤ表面に付着した砥粒分布が不均一になり、さらに前者の場合は砥粒の金属線表面への固着力が必ずしも十分でないために、使用中に砥粒が脱落してその分布が粗になり、その結果ソーワイヤの切削性能が低下するという問題がある。
【0004】
後者の場合は、砥粒の金属線表面への固着力は十分で、したがって、長時間に亘って切削性能が保持されるが、砥粒を十分な固着力で固着、保持するために必要な厚さにメッキ層を形成しなければならない。このメッキ処理は、細径の金属線をメッキ液中を微速で通過させてその間にメッキ層を所要の厚さに成長させるものであるから、メッキ液槽の通過時間を長くしなければならないので、メッキ処理を施すための線材の線速が遅く、したがって、ソーワイヤの生産性が低く、その生産コストが高いという問題がある。
【0005】
【発明が解決しようとする課題】
この発明は、従来のソーワイヤの製造方法のいずれとも根本的に異なり、砥粒に対する固着力が高くかつ製造工程での線材の線速を高めて、その生産性を向上できる、新たな製造方法を工夫することをその課題とするものである。
【0006】
【課題を解決するための手段】
上記課題解決のための製造方法は、次の(イ)乃至(ホ)によって構成されるものである。
(イ)金属ワイヤに所要厚さの銅、亜鉛、ニッケル、アルミニュウム又は真鍮を被覆し、
(ロ)銅、亜鉛、ニッケル、アルミニュウム又は真鍮を被覆した金属ワイヤを、所定間隔で配置した給電部材に接触させながら走行させて、上記金属ワイヤの被覆層を抵抗加熱して軟化させ、
(ハ)被覆層が加熱軟化された金属ワイヤに、砥粒圧着手段を通過させる前に砥粒を供給し、
(ニ)軟化被覆表面に付着した上記砥粒を上記砥粒圧着手段によって加圧して軟化被覆層に押し込み、
(ホ)上記被覆層を冷却硬化させて上記砥粒を上記被覆層に固着させること。
【0007】
【作用】
上記要件(イ)の工程による被覆層が要件(ロ)で加熱軟化された状態で、上記要件(ハ)で付着された砥粒とともに砥粒圧着手段を通過することで、上記砥粒が軟化被覆層に押し込まれる。そして軟化被覆層が冷却硬化するときに収縮するので、砥粒が被覆層に押し込まれた状態で極めて強固に固定される。
金属ワイヤの銅、亜鉛、ニッケル、アルミニュウム又は真鍮の被覆層は、上記給電部材間を通過する間に一瞬のうちに加熱軟化され、また、砥粒圧着手段を通過するとき上記砥粒が軟化被覆層に押し込まれ、被覆層の冷却硬化によって砥粒が固定される。
上記(ロ)乃至(ニ)の工程は一瞬であるから、走行する金属ワイヤの線速度を高速にすることが可能である。
【0008】
【実施態様1】
実施態様1は、解決手段(前記の課題を解決するための手段)について、上記砥粒圧着手段を一対の環状溝付きローラ(フリーローラ)とし、上記砥粒を当該一対の環状溝付きローラによって加圧して軟化被覆層に押し込むことである。
【作用】
金属ワイヤの軟化被覆層に付着した砥粒は上記環状溝によって形成される一対の加圧ローラ間の円形孔を通過するから、金属ワイヤ表面に突出した砥粒先端の被覆層からの突出高さは上記円形孔によって整えられる。
【0009】
【実施態様2】
実施態様2は、解決手段について、上記一対の加圧ローラを通過してから、引き続き成形ダイスを通過させることである。
【作用】
砥粒を被覆層に押し込まれた状態で、被覆層が軟化状態で成形ダイスを通過させることによって、ソーワイヤの外径がダイス内径に調整される。
【0010】
【実施態様3】
実施態様3は、解決手段の要件(イ)の被覆がメッキ層であることである。
上記メッキは電気メッキあるいは溶融メッキが採用できる。
【0011】
【実施態様4】
実施態様4は、解決手段における被覆層の厚さが砥粒平均径の1/2〜2/3であることである。
【作用】
砥粒が被覆層に埋設される深さは被覆層の厚さにほぼ等しくなる。埋設深さが砥粒径の1/2以上であれば、砥粒に対する上記被覆層による保持力が安定的に確保され、埋設深さが砥粒径の2/3を著しく越えなければ、砥粒の被覆層表面からの突出高さが十分確保され、したがって、ソーワイヤの高い切削性能が確保される。
【0012】
【実施例】
次いで、図面を参照しつつ実施例を説明する。
ソーワイヤの仕様は使用目的によって、その線径が0.02〜0.50mm、砥粒の平均粒径が5〜300μmである等、様々であるが、この実施例は、0.20mmのSUS304ワイヤを厚さ20μmの銅(Cu)メッキ層で被覆し、これに平均粒径30μmのCBN砥粒を固着したものである。
製造装置は、CBN砥粒供給用のホッパー1、加圧用の環状溝付きローラ2、ダイス3を縦に配置したものである。
ホッパー1の上流側と溝付きローラ2の下流側に給電ブラシ4,4があり、銅メッキ層で被覆した0.20mmのSUSワイヤ(以下これをSUSワイヤ又はワイヤという)wが、上流側の給電ブラシ4、ホッパー1、加圧用の環状溝付きローラ2、下流側の給電ブラシ4、ダイス3を順次通過して上から下方に向けて走行する。
なお、上記実施例のワイヤの材質はSUS304であるが、これに限定されるものではなく、硬鋼線やピアノ線等の炭素鋼線も採用できる。
【0013】
また、SUSワイヤwが給電加熱されている時間を可能な限り長くすることが望ましいので、給電ブラシ4,4間の間隔が長くなるように、この例では給電ブラシはホッパー1の上流側と溝付きローラ2の下流側に配置している。
下流側の給電ブラシ4は非導電性のCBN砥粒が突出しているワイヤ表面に接触するが、ワイヤ表面からのCBN砥粒の突出高さは平均10μmであるから、給電ブラシ4がワイヤ表面(銅メッキ層)に十分接触する。したがって、下流側の給電ブラシ4からワイヤwへの給電は支障なくなされる。
【0014】
ところで、ワイヤwがローラ(フリーローラ)2,2間を通過する時点では、ローラ2,2で加圧されて砥粒Dがメッキ層cにスムーズに押し込まれ、押し込まれた砥粒表面にメッキ被覆cが馴染んで密着することが必要である。そのために、メッキ被覆が軟化することが必要である。他方、メッキ層cは厚さが均等に可及的に保たれなければならず、そのために保形性が確保されなければならないので、上記加熱温度はメッキ層cが流動化しない温度である必要がある。以上から、加熱温度は、銅の場合で200〜800℃、亜鉛の場合で200〜500℃の範囲が好ましい。
【0015】
ローラ2の外周に断面半円形の環状溝2gがあり、この環状溝の半径は、ワイヤwの被覆層の半径120μm(ワイヤ半径100μm+メッキ厚さ20μm)よりも10μm大きい130μmである。CBN砥粒の平均粒径30μmであるから、ローラ2,2間を通過した段階で、砥粒Dはその2/3がメッキ層cに埋設され、10μmほどメッキ層cから突出した状態になる(図3参照)。
ワイヤwはローラ2,2を通過した後、孔形状が図4に示す断面形状のダイス3を通過する。
ローラ2,2を通過した時点ではメッキ層cの外形は歪んでおり、したがって砥粒先端の仮想円Sの外形は真円ではないが、ダイス3を通すことで、ほぼ真円に整形され、その後冷却されて銅メッキ層cが収縮、硬化して砥粒Dが銅メッキ層cにしっかりと固着され、ソーワイヤWとなる。
【0016】
【発明の効果】
以上のとおり、この発明は適宜の方法で製造した、銅、亜鉛、ニッケル、アルミニュウム、真鍮のメッキ層で被覆した金属線を抵抗加熱して上記メッキ層を軟化させ、これに砥粒を付着させ、付着した砥粒を加圧手段で加圧してその一部をメッキ層に食い込ませ、上記メッキ層が冷却、熱収縮して硬化することによる固着力を利用して砥粒をメッキ層に固着、保持させるものであるから、ソーワイヤの製造方法が簡単になり、また、ソーワイヤの製造工程での線速を高速にして生産性を向上させることができるので、ソーワイヤの製造コストを低下させることができる。
また、この発明の製造方法によるソーワイヤにおいては、砥粒が硬化したメッキ層に食い込んだ状態で固着、保持されるので、砥粒に対する保持力が強く、砥粒の脱落がなく、長期にわたって優れた切削性能が保持される。
また、金属線に通電して直接これを抵抗加熱して、そのメッキ層を軟化させ、これに砥粒を押し付けて食い込ませるものであるから、生産設備が極めて単純であり、したがって設備コストが廉価である。
砥粒を樹脂やメッキで固定する場合に比して、金属線材の線速度を著しく高めることができるので、生産性が極めて高い。
【図面の簡単な説明】
【図1】実施例の模式図である。
【図2】環状溝付きローラの側面図である。
【図3】実施例で製造されたソーワイヤの断面図である。
【図4】ダイスの断面図である。
【符号の説明】
1・・・CBN砥粒のホッパ
2・・・環状溝付きローラ
2g・・環状溝
3・・・ダイス
4・・・給電ブラシ
D・・・ダイヤモンド又はCBN砥粒(砥粒)
w・・・銅メッキ層で被覆したSUSワイヤ(SUSワイヤ又はワイヤ)
c・・・銅メッキ層(メッキ層又はメッキ被覆)
W・・・ソーワイヤ
[0001]
[Industrial applications]
The present invention relates to a method of manufacturing a saw wire used for cutting expensive materials such as silicon crystal, which is a base material of a semiconductor wafer, artificial quartz, cemented carbide, and ceramics, and improves the productivity. As a result, the production cost can be reduced.
[0002]
[Prior art]
In recent years, fixed abrasive type saw wires in which fine abrasive grains such as diamond are fixed to the surface of a thin metal wire have begun to be used. In this conventional fixed-abrasive saw wire, for example, a resin wire (thermosetting resin) is laminated on a metal wire whose diameter has been reduced by wire drawing, and the surface of the resin wire is densely diamond-bonded by the resin bond layer. Hard particles (hereinafter referred to as abrasive particles) such as particles, CBN abrasive particles, and hard fine fibers are fixed, or abrasive particles are fixed by embedding the abrasive particles in a plating layer. The former method of manufacturing a fixed abrasive type saw wire is a method in which a resin bond mixed with abrasive grains is attached to the surface by passing the wire through a resin bond mixed with abrasive grains, and this is cooled and hardened. The latter method of manufacturing a fixed abrasive type saw wire is a method in which abrasive grains are suspended in a plating solution so that the abrasive grains adhere to a plating layer during plating (electroplating). Note that the above “CBN” is an abbreviation for cubic boron nitride.
[0003]
In the former case, if the distribution of the mixed abrasive grains in the resin bond is non-uniform, and in the latter case, if the distribution of the abrasive grains in the plating solution is non-uniform, the distribution of the abrasive grains adhered to the saw wire surface is reduced. In the former case, the abrasive grains fall off during use and their distribution becomes coarse because the adhesive strength of the abrasive grains to the metal wire surface is not always sufficient, resulting in poor saw wire cutting performance. There is a problem of lowering.
[0004]
In the latter case, the bonding strength of the abrasive grains to the metal wire surface is sufficient, and therefore, the cutting performance is maintained for a long time. However, it is necessary to fix and hold the abrasive grains with a sufficient bonding force. A plating layer must be formed to a thickness. In this plating process, a thin metal wire is passed through the plating solution at a very low speed, and the plating layer is grown to a required thickness during the plating process. In addition, there is a problem that the wire speed of the wire for plating is low, so that the productivity of the saw wire is low and the production cost is high.
[0005]
[Problems to be solved by the invention]
The present invention is fundamentally different from any of the conventional saw wire manufacturing methods, and has a new manufacturing method capable of improving the productivity by increasing the wire speed of the wire rod in the manufacturing process with a high bonding force to the abrasive grains and increasing the wire speed in the manufacturing process. The idea is to devise it.
[0006]
[Means for Solving the Problems]
The manufacturing method for solving the above-mentioned problem is constituted by the following (a) to (e).
(A) Metal wire is coated with copper, zinc, nickel, aluminum or brass of required thickness,
(B) A metal wire coated with copper, zinc, nickel, aluminum or brass is run while being in contact with a power supply member arranged at a predetermined interval, and the coating layer of the metal wire is softened by resistance heating,
(C) supplying abrasive grains to the metal wire whose coating layer has been heated and softened before passing through the abrasive grain pressing means;
(D) pressing the abrasive grains adhered to the softened coating surface into the softened coating layer by applying pressure by the abrasive grain pressing means;
(E) cooling and curing the coating layer to fix the abrasive grains to the coating layer;
[0007]
[Action]
In a state where the coating layer obtained in the step (b) is heated and softened in the step (b), the abrasive grains are softened by passing through the abrasive grain pressing means together with the abrasive grains adhered in the step (c). Pressed into the coating layer. Since the softened coating layer contracts when cooled and hardened, the abrasive grains are extremely firmly fixed while being pressed into the coating layer.
The copper, zinc, nickel, aluminum or brass coating layer of the metal wire is heated and softened instantaneously while passing between the power supply members, and the abrasive grains are softened and coated when passing through the abrasive pressing means. The abrasive grains are pressed into the layer and the abrasive grains are fixed by cooling and hardening of the coating layer.
Since the steps (b) to (d) are instantaneous, it is possible to increase the linear velocity of the traveling metal wire.
[0008]
Embodiment 1
In the first embodiment, as a solution means (means for solving the above-mentioned problem), the abrasive grain pressing means is a pair of annular grooved rollers (free rollers), and the abrasive grains are formed by the pair of annular grooved rollers. Pressing and pressing into the softening coating layer.
[Action]
Since the abrasive particles attached to the softening coating layer of the metal wire pass through the circular hole between the pair of pressure rollers formed by the annular groove, the height of the tip of the abrasive particles protruding from the surface of the metal wire from the coating layer is increased. Is provided by the circular hole.
[0009]
Embodiment 2
In a second embodiment, a solution is to pass the pair of pressure rollers and then pass the forming die.
[Action]
The outer diameter of the saw wire is adjusted to the inner diameter of the die by passing the coating layer through the forming die while the abrasive layer is pressed into the coating layer in a softened state.
[0010]
Embodiment 3
Embodiment 3 is that the coating of requirement (A) of the solution is a plating layer.
The plating can be electroplating or hot-dip plating.
[0011]
Embodiment 4
Embodiment 4 is that the thickness of the coating layer in the solving means is 2〜 to / of the average diameter of the abrasive grains.
[Action]
The depth at which the abrasive grains are embedded in the coating layer is substantially equal to the thickness of the coating layer. If the burying depth is 1/2 or more of the abrasive grain size, the holding force of the coating layer against the abrasive grains is stably secured. If the burying depth does not significantly exceed 2/3 of the abrasive grain size, The protrusion height of the grains from the surface of the coating layer is sufficiently ensured, and therefore, high cutting performance of the saw wire is ensured.
[0012]
【Example】
Next, embodiments will be described with reference to the drawings.
The specifications of the saw wire vary depending on the purpose of use, such as a wire diameter of 0.02 to 0.50 mm and an average grain size of abrasive grains of 5 to 300 μm. In this embodiment, the SUS304 wire of 0.20 mm is used. Is coated with a copper (Cu) plating layer having a thickness of 20 μm, and CBN abrasive grains having an average particle diameter of 30 μm are fixed thereto.
The manufacturing apparatus has a vertically arranged hopper 1 for supplying CBN abrasive grains, a roller 2 having an annular groove for pressurization, and a die 3.
Power supply brushes 4 and 4 are provided on the upstream side of the hopper 1 and on the downstream side of the grooved roller 2, and a 0.20 mm SUS wire (hereinafter referred to as a SUS wire or a wire) w covered with a copper plating layer is provided on the upstream side. It passes through the power supply brush 4, the hopper 1, the roller 2 with the annular groove for pressurization, the power supply brush 4 on the downstream side, and the die 3 in order, and travels from top to bottom.
The material of the wire in the above embodiment is SUS304, but is not limited thereto, and a carbon steel wire such as a hard steel wire or a piano wire can also be used.
[0013]
In addition, since it is desirable to make the time during which the SUS wire w is heated for feeding as long as possible, in this example, the feeding brush is connected to the upstream side of the hopper 1 and the groove so that the interval between the feeding brushes 4 and 4 becomes long. It is arranged downstream of the attaching roller 2.
Although the power supply brush 4 on the downstream side contacts the wire surface on which the non-conductive CBN abrasive grains protrude, the projecting height of the CBN abrasive grains from the wire surface is 10 μm on average. (Copper plating layer). Therefore, power supply from the power supply brush 4 on the downstream side to the wire w is performed without any trouble.
[0014]
By the way, when the wire w passes between the rollers (free rollers) 2, 2, the abrasive grains D are pressed by the rollers 2, 2 to be smoothly pushed into the plating layer c, and the surface of the pushed abrasive grains is plated. It is necessary that the coating c is familiar and adheres. For that purpose, the plating coating needs to be softened. On the other hand, the thickness of the plating layer c must be kept as uniform as possible, and the shape retention must be ensured. Therefore, the heating temperature must be a temperature at which the plating layer c does not flow. There is. From the above, the heating temperature is preferably in the range of 200 to 800 ° C. for copper and 200 to 500 ° C. for zinc.
[0015]
The outer circumference of the roller 2 has an annular groove 2g having a semicircular cross section, and the radius of the annular groove is 130 μm, which is 10 μm larger than the radius 120 μm (wire radius 100 μm + plating thickness 20 μm) of the coating layer of the wire w. Since the average particle diameter of the CBN abrasive grains is 30 μm, when the abrasive grains D pass between the rollers 2, 2/3 of the abrasive grains D are buried in the plating layer c, and the abrasive grains D project from the plating layer c by about 10 μm. (See FIG. 3).
After passing through the rollers 2 and 2, the wire w passes through a die 3 having a cross-sectional shape shown in FIG. 4.
When passing through the rollers 2, 2, the outer shape of the plating layer c is distorted, and therefore, the outer shape of the virtual circle S at the tip of the abrasive grain is not a perfect circle. After cooling, the copper plating layer c shrinks and hardens, and the abrasive grains D are firmly fixed to the copper plating layer c to form the saw wire W.
[0016]
【The invention's effect】
As described above, the present invention is manufactured by an appropriate method, copper, zinc, nickel, aluminum, a metal wire coated with a plating layer of brass is resistance-heated to soften the plating layer, and abrasive grains are attached thereto. Attaching the abrasive grains to the plating layer by pressurizing the adhered abrasive grains with a pressurizing means, and fixing the abrasive grains to the plating layer by using the adhesive force caused by cooling, heat shrinkage, and hardening of the plating layer. , The saw wire manufacturing method is simplified, and the productivity can be improved by increasing the linear speed in the saw wire manufacturing process, so that the saw wire manufacturing cost can be reduced. it can.
Further, in the saw wire according to the manufacturing method of the present invention, since the abrasive grains are fixed and held in a state of biting into the hardened plating layer, the holding force against the abrasive grains is strong, and the abrasive grains do not fall off, and are excellent for a long time. Cutting performance is maintained.
Also, since the metal wire is energized and heated directly by resistance, the plating layer is softened, and the abrasive grains are pressed into the metal layer, causing the production equipment to be extremely simple. It is.
Since the linear velocity of the metal wire can be significantly increased as compared with the case where the abrasive grains are fixed by resin or plating, the productivity is extremely high.
[Brief description of the drawings]
FIG. 1 is a schematic diagram of an embodiment.
FIG. 2 is a side view of an annular grooved roller.
FIG. 3 is a cross-sectional view of a saw wire manufactured in an example.
FIG. 4 is a sectional view of a die.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... CBN abrasive hopper 2 ... Roller with an annular groove 2g ... Annular groove 3 ... Die 4 ... Power supply brush D ... Diamond or CBN abrasive (abrasive)
w ... SUS wire covered with copper plating layer (SUS wire or wire)
c: Copper plating layer (plating layer or plating coating)
W: Saw wire

Claims (6)

金属ワイヤに所要厚さの銅、亜鉛、ニッケル、アルミニュウム又は真鍮を被覆し、
銅、亜鉛、ニッケル、アルミニュウム又は真鍮を被覆した金属ワイヤを、所定間隔で配置した給電部材に接触させながら走行させて、上記金属ワイヤの被覆層を抵抗加熱して軟化させ、
被覆層が加熱軟化された金属ワイヤに、砥粒圧着手段を通過させる前に砥粒を供給し、
軟化被覆表面に付着した上記砥粒を上記砥粒圧着手段によって加圧して軟化被覆層に押し込み、
上記被覆層を冷却硬化させて上記砥粒を上記被覆層に固着させるソーワイヤ製造方法。
Cover metal wire with required thickness of copper, zinc, nickel, aluminum or brass,
A metal wire coated with copper, zinc, nickel, aluminum or brass is run while being in contact with a power supply member arranged at a predetermined interval, and the coating layer of the metal wire is softened by resistance heating,
The coating layer is supplied with abrasive grains before passing through the abrasive grain pressure bonding means to the heat-softened metal wire,
The abrasive grains adhered to the softening coating surface are pressed into the softening coating layer by applying pressure by the abrasive pressing means,
A saw wire manufacturing method in which the coating layer is cooled and hardened to fix the abrasive grains to the coating layer.
上記砥粒圧着手段を通過させてから、引き続き成形ダイスを通過せるようにした請求項1記載のソーワイヤ製造方法。2. The saw wire manufacturing method according to claim 1, wherein after passing through said abrasive grain pressing means, the forming die is continuously passed through. 上記砥粒圧着手段が、一対の環状溝付きローラである請求項1記載のソーワイヤ製造方法。2. The saw wire manufacturing method according to claim 1, wherein said abrasive grain pressing means is a pair of annular grooved rollers. 上記砥粒が、ダイヤモンド又はCBNである請求項1記載のソーワイヤ製造方法。2. The saw wire manufacturing method according to claim 1, wherein the abrasive grains are diamond or CBN. 銅、亜鉛、ニッケル、アルミニュウム又は真鍮の被覆がメッキ層である請求項1記載のソーワイヤ製造方法。The method according to claim 1, wherein the coating of copper, zinc, nickel, aluminum or brass is a plating layer. 平均砥粒径の1/2〜2/3が上記被覆層に埋設されている、請求項1記載のソーワイヤ製造方法によって製造されたソーワイヤ。The saw wire manufactured by the saw wire manufacturing method according to claim 1, wherein 1/2 to 2/3 of the average abrasive grain size is embedded in the coating layer.
JP2002216212A 2002-07-25 2002-07-25 Saw wire manufacturing method and saw wire Pending JP2004058169A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007152486A (en) * 2005-12-05 2007-06-21 Kanai Hiroaki Manufacturing method of saw wire
US20110308371A1 (en) * 2008-12-18 2011-12-22 Nippon Steel Materials Co., Ltd. Saw wire and method of manufacturing saw wire
JP2012056042A (en) * 2010-09-10 2012-03-22 Yuichiro Niizaki Method for manufacturing brush bristle material
JP2015030071A (en) * 2013-08-05 2015-02-16 新日鐵住金株式会社 Saw wire and core wire

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007152486A (en) * 2005-12-05 2007-06-21 Kanai Hiroaki Manufacturing method of saw wire
US20110308371A1 (en) * 2008-12-18 2011-12-22 Nippon Steel Materials Co., Ltd. Saw wire and method of manufacturing saw wire
JP2012056042A (en) * 2010-09-10 2012-03-22 Yuichiro Niizaki Method for manufacturing brush bristle material
JP2015030071A (en) * 2013-08-05 2015-02-16 新日鐵住金株式会社 Saw wire and core wire

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