TW201722588A - Fastening method for abrasive particle of diamond saw wire further shortens time of electroplating and cladding operation and enhances adhesion of abrasive particles - Google Patents

Abstract

A fastening method for abrasive particle of diamond saw wire comprises steps: firstly enabling a surface of an abrasive particle to form a conductive surface layer capable of being melted or light-cured or thermally cured, uniformly sucking abrasive particle on core surface through electrifying or magnetic manners, then imposing short-time heating and welding, or light-(or thermal-)curing manner to temporarily fasten the abrasive particle on a core at better attaching force, and finally imposing electroplating cladding to completely and permanently fasten the abrasive particle on the core at stronger attaching force so as to finish production of diamond saw wire. With the foregoing steps of heating welding or light-curing, the force of attaching the abrasive particle on the core can be enhanced during electroplating cladding operation so that occurrence of peeling the abrasive particle off can be greatly reduced or prevented during electroplating cladding operation. It can further improve production speed to produce diamond saw wire of abrasive particle having high retention, obvious protrusion and chip discharge space in the shortest time.

Description

Method for fixing abrasive grains of diamond saw wire

The invention relates to a method for fixing superhard abrasive grains on a wire core, which is characterized in that after the surface of the abrasive grain is formed on the surface of the conductive particles, the abrasive particles can be adhered to the wire core through electrical or magnetic properties, and then Temporarily fixed on the wire core by heating welding in a short time or curing by light or heat to make the abrasive grains have high adhesion, so that the plating coating operation can be performed at a higher production speed, and the abrasive grains are obviously convex and abrasive. The production of a diamond line with a chip space.

In the entire semiconductor germanium wafer processing process, from the initial crystal growth, to slicing, grinding, polishing, cleaning, etc., mainly in the cutting of the wafer, the cost and quality of the relative process occupy an absolutely important key factor. The most important thing is that in the process of cutting the wafer into wafers, the first determines the number of wafers produced, which directly affects the output of the semiconductor chip. Therefore, the cutting technology of diamond sawing wire has been used. It can meet the needs of current industrial use. The wire saw cutting method is cheaper to apply, and unlike the inner circular saw, it takes into account the radius of the circular saw blade and the diameter of the wafer, and the loss of the wafer can be reduced. The smallest, shortest sawing time and the machined surface that is sawed have better processing quality than the sawing method.

The so-called diamond sawing wire is formed by attaching superhard abrasive grains to the surface of a core of a steel material. The bonding technique of fixing the abrasive grains to the wire core is to make a diamond by using a metal bonding agent or a resin bonding agent or the like. The saw wire, depending on the bonding agent used and the manner of preparation, can be roughly divided into the core of the hard abrasive by means of sintering, electroplating, or brazing. Above, wherein: the diamond saw wire sintered by the resin is as shown in FIG. 1 , which has the advantages of low manufacturing cost, high production speed, and can reduce the wire diameter to increase the material extraction rate, but the abrasive grain 2 is attached to the wire core 1 The strength is too small, and it is easy to peel off, even if copper metal is added to the binder of the resin layer 3, although the diamond wear condition may be relatively reduced, or the carbonized ruthenium creation void may be added to facilitate sawing chip removal, no matter what is added The adhesion of the additives into the resin binder is still limited to the improvement of the adhesion of the super-hard abrasive grains. Once the processing rate of the saw wire is increased, the degree of the super-hard abrasive diamonds is still prominent, and the formation of the resin is sintered. The method is that after the abrasive particles are mixed with the coating layer material, the overall coating is applied, and the abrasive particles are dispersed in the coating layer, and the abrasive grains are mostly more than three-quarters of the volume, and are buried in the resin layer, and Between the abrasive grains and the abrasive grains, there is a continuous resin layer, which cannot produce an effective chip evacuation space, thereby affecting the sharpness of the sawing, the speed of sawing and the sawing effect.

In addition, the diamond saw wire made by electroplating method is as shown in FIG. 2, and the method for fixing the super-hard abrasive grain 2 to the wire core 1 is to put the nickel-containing plating solution into the super-hard abrasive grain by using electroplating. In the manner of nickel plating on the surface of the core, the superhard abrasive particles are adsorbed on the surface of the core, and the electroplated coating 4 is continuously formed by electroplating, thereby achieving the function of abrasive grain fixing. The granules are well-defined, clearly protruding from the core surface plating layer, and the surface metal plating thickness is small, so that the bonding force between the abrasive grains and the core is sufficient for most cutting applications, and there is With sufficient enough chip space, the abrasive particles can fully express the bump cutting characteristics, and the cutting efficiency and cutting life can be greatly improved. Although it is better than the resin sintering method, the adhesion is attached when the abrasive grains are temporarily attached to the wire core at the initial stage. Very weak, any fluid or solid touch may change the distribution or adhesion of the abrasive particles, but the plating process inevitably requires fluid and mechanical contact. In order to reduce the production speed, the abrasive particles and the bus bar carrier have sufficient bonding time, and then enter the subsequent reinforcement and strengthen the plating, so the plating speed is slow, it takes a long time, and the production cost is high.

Furthermore, brazing is performed by welding a special nickel alloy as a binder and superhard abrasive grains, wherein the nickel alloy contains chromium, and the chromium alloy forms chromium carbide and carbon on the surface of the abrasive grain, so that the nickel alloy The interface between the abrasive particles and the abrasive particles can be reduced, so that the force of the abrasive particles being grasped is large and not easy to fall off, but the process requires high-temperature brazing after a period of time (the brazing temperature is about 1050 ° C, and the holding temperature is about 10 to 30). Minutes), the abrasive particles can be fixed on the wire core, but it is also easy to cause the steel wire core to deteriorate and embrittle, thereby reducing its rigidity and even causing the core to break. At the same time, most of the processing steps are first to harden the abrasive grains. Soldering on the sleeve and soldering to the core, it is not easy to reduce the wire diameter of the hard-welded diamond saw wire.

In addition, the organic resin layer is also changed to directly coat the soft metal layer, and the abrasive grains are fixed by direct fusion welding, but the super hard abrasive grains are still buried in the continuous coating, or the abrasive grains and the abrasive grains have no obvious chip removal. Space, and the entire contact surface of the coating layer and the core substrate is a low melting point, or a soft metal, and the joint characteristics are smaller than the wear resistant metal layer is also a major disadvantage.

Secondly, there is a layer of soft metal directly coated on the surface of the core, and then the abrasive grains are pressed into the metal layer. If the thickness of the plating layer is similar to the particle size of the abrasive grain, the cutting line with the super-hard abrasive resin has The same missing defects are embedded in the continuous coating layer. If the thickness of the plating layer is insufficient, the abrasive grains are fine particles. Due to the actual size difference, uneven bonding or poor bonding between the abrasive particles and the coating layer is likely to occur during the pressing process. The phenomenon.

The reason is that in order to improve the aforementioned different methods of fixing the abrasive particles on the wire core, The invention has the problems that the surface is easy to fall off and the chip evacuation space is small, or the process takes time, or the core is susceptible to the high temperature and embrittlement of the welded solid particles, and the present invention provides a grinding machine for forming a conductive surface layer on the surface. After the particles are attached to the wire core by electrical or magnetic means, and then applied for a short time of heating or illumination, the abrasive grains are welded or solidified and temporarily fixed on the wire core, thereby producing the abrasive grains obtained by the process. The large temporary adhesion allows the subsequent plating and coating operation to greatly reduce or even avoid the resistance of the plating solution or the mechanical guiding mechanism, resulting in the occurrence of abrasive falling off, thereby enabling the lifting The speed of electroplating and coating work produces a diamond saw wire with excellent quality and performance.

The technical solution adopted by the present invention to solve the technical problem is that the super-hard abrasive grains are fixed on the wire core through electroplating, by first forming a conductive surface layer on the surface of the super-hard abrasive grains, and transmitting electricity. Or magnetically causes the abrasive particles to be adsorbed on the wire core, and the conductive surface layer of the abrasive particles is temporarily combined with the wire core, and finally the abrasive grains are fixed by electroplating coating.

In the above solution, the conductive surface layer of the abrasive particles may be a surface layer of copper, silver, tin, palladium, nickel, or a low melting point metal that can be welded, so that the welding and the core are applied for a short time. Temporarily combined.

In the above solution, the surface layer of the abrasive particles is a conductive photocurable or heat-curable surface layer, such that light or heat is applied to cause a curing reaction to temporarily bond the abrasive particles to the core.

Therefore, the conductive surface layer having a weldability or a light (or heat) curable property formed on the surface of the abrasive grain of the present invention is applied to the wire core through an electrical or magnetic method, and then applied. Short-time heating or light, so that the abrasive particles are temporarily fixed on the wire core, and then the abrasive particles are permanently fixed on the wire core through the plating coating method, so that the plating coating operation process In the middle, the plating solution or the guiding mechanism minimizes the influence of the resistance of the abrasive particles falling off, or even avoids it, thereby shortening the time course of the plating coating operation and increasing the adhesion rate of the abrasive grains.

1‧‧‧core

2‧‧‧ abrasive grain

21‧‧‧ Conductive surface layer

4‧‧‧Electroplating

The invention will now be further described with reference to the drawings and embodiments.

Fig. 1 is a schematic view showing the construction of a diamond saw wire prepared by sintering a fixed abrasive grain by a conventional resin.

2 is a schematic view showing the construction of a diamond saw wire prepared by electroplating fixed abrasive grains.

Fig. 3 is a schematic view showing the method of fixing the abrasive grains on the wire core of the present invention.

Referring to FIG. 3, the present invention is a method for manufacturing a superabrasive fixed wire core of a diamond saw wire by first forming a conductive conductive surface layer 21 on the surface of the abrasive grain 2. The conductive surface layer 21 may be copper, silver, tin, palladium, nickel, or a low melting point metal, and may be heated to be welded to a surface layer, or may be electrically conductive and capable of being irradiated or heated. A surface layer that is cured.

Further, through the electrical or magnetic means, the abrasive grains 2 can be uniformly distributed on the surface of the wire core 1 and then heated for a short time, so that the conductive surface layer 21 of the abrasive grains 2 is welded to the wire core 1 Or applying light or heat to allow the conductive surface layer 21 to be cured to bond with the core 1, i.e., to create a temporary bond between the abrasive particles 2 and the core 1 with sufficient adhesion for subsequent operations.

Further, the operation of plating the coating 4 is performed, and the abrasive grains 2 are permanently fixed to the core 1 to complete the operation of the diamond sawing.

Therefore, a conductive surface layer 21 is formed on the surface of the abrasive grain 2 of the present invention by the above-mentioned invention, and in addition to allowing the abrasive particles to be adsorbed on the core 1, a temporary bonding action with the core 1 is provided, and In combination with the welding method of the abrasive grain 2 and one of the cores 1, since the heating time is short, Therefore, it will not cause embrittlement or deterioration of the core 1, or combine the light curing method of the abrasive grain 2 and the core 1 and also has no adverse effect on the core 1 material, and the wire can be maintained. In addition to the excellent strength of the core, the abrasive grain 2 is further provided with a good adhesion, and is temporarily fixed on the wire core 1 for the purpose of allowing the wire to be temporarily adhered during the subsequent plating and coating operation. The core 1, the fluid resistance during the transfer in the plating solution, and the mechanical resistance during the mechanical mechanism transfer can be obtained by heat fusion welding or light (or heat) curing of the abrasive particles 2 Strong adhesion, so that the abrasive particles 2 are not easy to fall off, or even avoid falling off, so that the abrasive core 2 can maintain a uniform distribution of the core 1, and the production speed of the plating coating operation can be greatly increased, thereby increasing the production capacity, and finally A diamond saw wire having a high adhesion and clearly protruding abrasive grains 2, and a sufficient chip evacuation space between the abrasive grains 2 and the abrasive grains 2.

1‧‧‧core

2‧‧‧ abrasive grain

21‧‧‧ Conductive surface layer

4‧‧‧Electroplating

Claims (3)

A method for fixing abrasive grains of a diamond saw wire is to fix the super-hard abrasive grains on the wire core by electroplating, by first forming a conductive surface layer on the surface of the abrasive grains to make the electrical or magnetic properties transparent. The abrasive particles are adsorbed on the wire core, and the conductive surface layer of the abrasive particles is temporarily combined with the wire core, and finally the abrasive grains are fixed by electroplating coating. The method for fixing abrasive grains of a diamond saw wire according to claim 1, wherein the conductive surface layer of the abrasive particles is copper, silver, tin, palladium, nickel, or a low melting point metal, so that a short time heating welding is performed. The temporary combination of the abrasive particles and the core is combined. The method for fixing abrasive grains of a diamond saw wire according to claim 1, wherein the conductive surface layer of the abrasive particles is a conductive conductive UV adhesive or a conductive silver paste, which causes a curing reaction by applying light or heat. The abrasive particles are temporarily combined with the core.