TWI655044B - Abrasive wire and method and system for forming abrasive wire - Google Patents

Abstract

The invention provides a manufacturing method and system for a secant of abrasive particles, which is to inductively magnetize a wire substrate conveyed in one direction, so that the wire substrate has a plurality of sensing magnetic regions separated by a certain distance, and then The wire substrate having the plurality of inductive magnetic regions passes through an abrasive grain region, thereby adsorbing at least one abrasive particle on each of the inductive magnetic regions, and finally passing the wire substrate having the abrasive particles through a coating region to be in the line A coating layer is formed on the substrate. Through the positional arrangement of the inductive magnetizing means and the control of the inductive magnetization, a magnetic zone having a specific pattern or regularity can be formed on the wire substrate, so that the formation and arrangement of the abrasive grains can be controlled.

Description

Manufacturing method and system having secant of abrasive particles and secant manufactured using the same

The present invention is a technique for grinding a secant, and more particularly to a method and system for producing a secant of abrasive particles by controlling the position and pattern of abrasive particles formed by an induced magnetic field, and a secant produced using the method.

The use of secant (or wire saw) cutting methods to cut semiconductors, crystals, various single crystals, magnetic materials, precision ceramics, and other hard and brittle materials has been in the industry for many years. The secant with abrasive particles (such as diamonds) has occupied an important place in the cutting industry of semiconductor wafers in recent years.

In the conventional technique, there are many methods for the secant method, for example, the Republic of China Patent Publication No. I461249 teaches a wire saw and a method of manufacturing the same. The wire saw manufacturing method of the present invention comprises: providing a bare wire; coating an intermediate layer on the bare wire, and embedding a plurality of abrasives in the intermediate layer; and plating a metal protective layer to cover the abrasive. Accordingly, the present invention can solve the problem of aggregation of the abrasive in the conventional plating solution during electroplating deposition to improve the cutting quality and precision. The material of the intermediate layer is selected from one or a combination of groups of viscous materials, solvents, and solutions.

The Republic of China Patent Publication No. I510314 teaches a wire saw and a method of manufacturing the same comprising the steps of: providing an abrasive component comprising a plurality of composite abrasive particles, each composite abrasive particle having an abrasive body, and a package a metal coating layer bonded to an outer surface of the abrasive body, wherein the abrasive body of the composite abrasive particles has a particle diameter of 10 μm to 200 μm, and is coated with a metal coating layer bonded to an outer surface of the abrasive body of each composite abrasive particle. The thickness is from 0.1 μm to 19 μm, and the average weight of the metal coating layer of each composite abrasive particle is 10% to 60% of the average weight of the single composite abrasive particle; second, providing a metal wire; and third, making the abrasive component The composite abrasive particles are uniformly distributed in a plating solution to prepare an upper sand plating solution, and then the rapid application of the current is applied to the surface of the wire substrate to form a composite abrasive particle. Sanding metal plating layer, the composite abrasive particles are initially fixed on the surface of the wire; and fourth, the wire material which has been initially fixed with the composite abrasive particles is subjected to a plating treatment to A thick metal plating layer is formed on the sanding metal plating layer so that 1/3 to 2/3 of the average particle diameter of the composite abrasive grains is buried in the metal plating layer, thereby obtaining a high wear-resistant wire saw. The product wherein the film thickness of the metal plating layer is substantially equal, and the average film thickness of the metal plating layer is 1/3 to 2/3 of the average particle diameter of the composite abrasive particles.

The conventional process utilizes a method of coating the patterned insulating film to control the distribution of the abrasive particles, but this has no direct benefit to the improvement of the sanding efficiency and the life of the abrasive nickel film in the plating solution. The addition of special ingredients to the nickel film to increase the service life of the plating solution inevitably increases the cost of the raw material and also does not contribute to the sanding efficiency.

In summary, there is a need for a manufacturing method and system having a secant of abrasive particles, and a secant produced using the method, to address the deficiencies of conventional techniques.

The invention provides a manufacturing method and system with a secant of abrasive particles, and a secant manufactured by using the method, which can control the arrangement of the abrasive grains to simultaneously solve the problem that the abrasive grain distribution cannot be uniformly controlled, the sanding efficiency is poor, and the plating liquid is ground. The short life of the granular nickel film is a problem.

The invention provides a method for controlling the distribution of abrasive particles, which has an induced magnetic field by a magnetic flux change instantaneously generated by a "pulsed electromagnetic enthalpy". When an external magnetic field is applied to a substance, the inside of the substance is magnetized, and a lot of minute magnetic waves appear. Dipole (magnetic moment), the magnetization describes the extent to which a substance is magnetized. Using a pulsed (數 microsecond ~) power supply to drive the wire on the core, the induced magnetic field (magnetic line) generated in an instant, guided along the direction of the core structure to the end face (with the outer diameter of the tip) to focus the magnetic field lines The tip of the iron core (ten 數 micron ~) can limit the size of the magnetized area of the shrinking steel wire, and the cutting line has a controllable diamond abrasive grain arranging technology. The method can also produce a multi-layer abrasive grained 3D structure diamond. The cutting line increases the grinding force and service life.

In one embodiment, the present invention provides a method of making a secant of abrasive particles comprising the steps of first providing a line of substrate and transporting the line substrate in one direction. Then, the wire substrate is passed through a magnetic sensitive region, and the magnetic sensitive region has at least one pair of electromagnets respectively disposed on opposite sides of the wire substrate. When the wire substrate passes through the magnetic sensitive region, the pair The electromagnet applies a pulsed induced magnetic field to the wire substrate such that the wire substrate has a plurality of inductive magnetic regions at a specific distance apart. The wire substrate having the plurality of inductive magnetic regions is then passed through an abrasive grain region to adsorb at least one abrasive particle on each of the inductive magnetic regions. Finally, the wire substrate having the abrasive particles is passed through a coating zone to form a coating layer on the wire substrate.

In one embodiment, the present invention provides a manufacturing system having a secant of abrasive particles comprising a delivery device, at least one pair of electromagnets, a sanding module, and a coating device. The conveying device is configured to convey a line of substrates in one direction. The at least one pair of electromagnets are disposed on one side of the conveying device, and the pair of electromagnets are respectively disposed on two sides of the wire substrate, and when the wire substrate passes the at least one pair of electromagnets, the at least one pair The electromagnet applies a pulsed induced magnetic field to the wire substrate such that the wire substrate has a plurality of inductive magnetic regions at a specific distance apart. The sanding module is disposed on one side of the at least one pair of electromagnets, and the sanding module adsorbs at least one abrasive grain on each of the inductive magnetic regions when the wire substrate passes. The coating device is disposed on one side of the sanding module, and the coating device is configured to form a coating layer on the wire substrate.

In one embodiment, the present invention provides a secant having abrasive particles comprising a wire substrate, an abrasive grain layer, and a coating layer. The wire substrate has a plurality of first magnetization regions in an orderly manner along the axial direction thereof and corresponding to the plurality of first magnetization regions and a plurality of first diameters And a second magnetization zone, wherein the first magnetization zone and the second magnetization zone have opposite magnetic polarities. The abrasive grain layer is formed on the plurality of first and second magnetization regions. The coating layer is formed on the surface of the wire substrate for adding adhesion of the abrasive particles to the wire substrate.

Various illustrative embodiments may be described more fully hereinafter with reference to the accompanying drawings. However, the inventive concept may be embodied in many different forms and should not be construed as being limited to the illustrative embodiments set forth herein. Rather, these exemplary embodiments are provided so that this invention will be in the Similar numbers always indicate similar components. The manufacturing method and system for the secant having abrasive particles and the secant produced using the method will be described below in conjunction with the various embodiments, however, the following examples are not intended to limit the invention.

Please refer to FIG. 1 , which is a schematic diagram of an embodiment of a process for manufacturing a secant of abrasive particles according to the present invention. The method includes the steps of first performing step 20, providing a line of substrate, and transporting the line substrate in one direction. The wire substrate may be a piano wire, a stranded wire or a stainless steel wire, or a coated wire such as a brass plated stainless steel wire, a brass plated steel wire, a nickel plated stainless steel wire, and a nickel plated steel wire. Etc., it is possible to select a suitable wire type as the wire substrate used in the step 20 according to the demand. In one embodiment, the wire substrate has a wire diameter of between about 150 μm and 250 μm, but is not limited by this range. The user can select the desired wire diameter according to the spirit of the present invention.

And then proceeding to step 21, the line substrate is passed through a magnetic sensitive region, and the magnetic sensitive region has at least one electromagnet respectively disposed on opposite sides of the line substrate, when the line substrate passes through the magnetic sensitive region. The at least one electromagnet applies a pulsed induced magnetic field to the wire substrate such that the wire substrate has a plurality of inductive magnetic regions separated by a specific distance. In one embodiment, the size of the corresponding magnetically sensitive region on the wire substrate can be controlled by the end structure design of the electromagnet near the wire substrate. As shown in FIG. 2A, the figure is a schematic cross-sectional view of an electromagnet and a wire substrate. In the present embodiment, a pair of electromagnets 31 are illustrated. The end structure 310 of each of the electromagnets 311 and 312 may have a tip end structure. Therefore, when the power source drives the electromagnets 311 and 312 to generate an induced magnetic field, the magnetic lines of force are The end structure 310 leading to the tip is directed such that the electromagnets 311 and 312 can focus the magnetic lines of force onto the end structure 310, thereby forming a small induced magnetic field MA having a NS polarity as shown in FIG. 2B.

In FIG. 2B, the paired end structures 310 are disposed on both sides of the center of the cross-sectional direction of the substrate, so that the induced magnetic field generated by the end structure passes through the center of the cross-sectional direction of the line substrate 90, thereby generating the inductive magnetic region MA. The size and strength will be affected by the spiral current I of the electromagnet, the helical turns N, the diameter of the tip end of the end structure 310, and the taper θ. In one embodiment, the end structure 310 has a diameter of about ten micrometers, and thus can limit the size of the area in which the shrinkage substrate 90 is magnetized. As shown in FIG. 2C, a pair of electromagnets may be provided with a plurality of pairs of electromagnets on opposite sides of the central axis of the substrate 90, in the figure, three pairs of electromagnets 31, 31a and 31b, such that the three pairs of electromagnets 31, 31a and 31b may be arranged radially along the center of the line substrate 90. It should be noted that the foregoing embodiments are implemented by a pair of electromagnets, but are not limited by a pair arrangement, and a single electromagnet or a plurality of single electromagnets are not paired, or partially paired. Combinations of configurations and partial unpaired configurations can also be implemented.

In addition, as shown in FIG. 2D, in this embodiment, substantially similar to FIG. 2B, the difference is that the end structures 310 and 310' of the electromagnets 311 and 312 independently generate respective induced magnetic fields, and the end structure 310 The induced magnetic field generated by 310' does not pass through the center of the line substrate 90, but forms the induced magnetic regions MA and MA'. It should be noted that, in the embodiment, the inductive magnetic regions MA and MA' correspond to each other, but in another embodiment, the inductive magnetic regions MA and MA' may not correspond to each other, which is based on the needs of the user. And set.

As shown in FIG. 3A and FIG. 3B, the drawings are respectively schematic views of different embodiments of the induced magnetic regions formed on the wire substrate of the present invention. In Fig. 3A, Fig. 3A(a) shows a side view of the wire substrate after magnetic induction, and Fig. 3A(b) shows a schematic view of a radial cross section of the wire substrate. It can be seen from the embodiment shown in FIG. 3A that the plurality of pairs of (NS) inductive magnetic regions MA~MA3 on the same section of the line substrate 90 have a certain angular interval in the radial direction. The number of the induced magnetic regions MA~MA3 at each cross-sectional position is the same. In addition, each of the inductive magnetic regions MA~MA3 and the adjacent inductive magnetic regions MA~MA3 have a first distance d0 and a second distance d1, wherein the first distance d0 can be controlled by the number and arrangement positions of the electromagnets. The greater the number of electromagnets, the smaller the distance d0, and the second distance d1 can be transmitted through the speed of the wire substrate 90 or the on-off time of the pulsed current that controls the electromagnet actuation, and the duty cycle (duty- Depending on the cycle).

3B(a) and 3B(b) are schematic diagrams in which the in-line substrate 90 has a single inductive magnetic region MA and MA2 at each cross-sectional position and the direction of the induced magnetic field of the adjacent cross-section is different. Fig. 3B(a) is a partial side elevational view of the wire substrate after magnetic induction. For example, the number of induced magnetic regions in the region of the position P0 is one, and the number of induced magnetic regions at the position P1 is one, but the direction of the induced magnetic field is different. Similarly, each of the inductive magnetic regions MA and the adjacent inductive magnetic regions MA2 has a first distance d0 and a second distance d1, wherein the first distance d0 can be controlled by the number and arrangement positions of the pair of electromagnets. The second distance d1 can be determined by the moving speed of the wire substrate or the on-off time of the pulsed current that controls the actuation of the electromagnet, and the duty-cycle. It should be noted that, according to the spirit of FIG. 3A and FIG. 3B, the user can also form different numbers of inductive magnetic regions on the radial cross sections of different positions on the substrate through the arrangement of different positions of the electromagnets.

In addition, as shown in FIGS. 3C and 3D, the figure is a schematic diagram of one embodiment of the inductive magnetic field arrangement of the present invention. In this embodiment, it is basically an extension of the embodiment shown in FIG. 2D, that is, a plurality of pairs of magnetic field polarities (N and S) are formed on the radial section of the linear substrate 90, and the magnetic field polarity is along An inductive magnetic zone in which the wire substrate 90 is radially disposed. In the embodiment of Fig. 3C, it can be seen that the line substrate 90 has an inductive magnetic region (MA, MA') on one section, and an inductive magnetic region (MA1, MA1'), and an inductive magnetic region (MA, MA). ') is not on the same radial section. In the present embodiment, the induced magnetic region (MA, MA') and the induced magnetic region (MA1, MA1') are spaced apart from each other in the axial direction of the second substrate d1 by a second distance d1. It should be noted that, in this embodiment, the inductive magnetic region (MA, MA') and the inductive magnetic region (MA1, MA1') are in a paired configuration, and in another embodiment, they may not be arranged in a pairwise manner. That is, the inductive magnetic regions MA and MA' have a certain distance in the axial direction. As further shown in FIG. 3D, in the present embodiment, the wire substrate 90 has a plurality of pairs of inductive magnetic regions (MA, MA'), (MA1, MA1'), (MA2, MA2'), and MA3, MA3').

In addition, as shown in FIGS. 3E and 3F, the figure is a schematic diagram of one embodiment of the inductive magnetic field arrangement of the present invention. In the present embodiment, it is basically the extension of FIG. 2D, but the difference is the difference in the polarities of the magnetic fields of FIGS. 3E and 3F. In the embodiment of FIG. 3E, the magnetic field directions of each of the inductive magnetic regions (MAa, MAa'), (MA1a, MA1a), (MA2a MA2a'), and (MA3a, MA3a') are along the circumference of the line substrate 90. Arrange in the direction. In FIG. 3F, the magnetic field directions of each of the inductive magnetic regions (MAb, MAb'), (MA1b, MA1b), (MA2b MA2b'), and (MA3b, MA3b') are along the axial direction of the line substrate 90. arrangement.

Returning to Figure 1, step 22 is followed to pass the line substrate having the plurality of inductive magnetic regions through an abrasive grain region, thereby adsorbing at least one abrasive particle on each of the inductive magnetic regions. Since there are a plurality of inductive magnetic regions on the wire substrate, since the abrasive grains have a magnetic conductive material in the upper abrasive grains, the abrasive grains are adsorbed to the in-line substrate when the wire substrate passes through the abrasive grain region. On the magnetic zone. In this step, the abrasive particles can be attached to the in-line substrate by spraying or free fall. The abrasive grains, in one embodiment, have a particle diameter of 20 to 40 μm, and the particle diameter of the present embodiment is about 30 μm. The particle size of the abrasive particles is not limited by the foregoing examples, and the user can select an appropriate abrasive particle size according to requirements. The material of the abrasive particles may be a material containing diamond, cubic boron nitride, tantalum carbide or tungsten carbide.

Since the electromagnet of the present invention uses a pulsed current to cause the electromagnet to generate a periodic induced magnetic field and a non-inductive magnetic field alternately, the linear substrate can be regularly moved as the wire substrate moves at a specific speed. A well-arranged inductive magnetic region is formed thereon. In an embodiment, as shown in FIG. 4A to FIG. 4B, FIG. 4A is a schematic view of a conventional arrangement of abrasive grains, and FIG. 4B is a schematic view of a rule for adsorbing a plurality of abrasive grains. In the conventional technique, as shown in Fig. 4A, in the disordered arrangement of the randomly attached abrasive grains 320a, the abrasive grains 320a are not only unevenly distributed, but also the amount of the abrasive grains 320a at the same position is different. Since the detachment of the abrasive grains is one of the causes of the life of the dicing line during the cutting, the size of the induced magnetic domain can be controlled by the method of the present invention. As shown in FIG. 4B, since the induced magnetic region is large, it can be adsorbed more. The inductive magnetic region of the abrasive particles 320b, which is 2X2 in this embodiment, can adsorb 4 abrasive particles 320b. It should be noted that since the size of the abrasive grains 320b is known, the present embodiment is about the abrasive grain 320b having a particle diameter of 30 μm, and the size of the induced magnetic domain and the spiral current I on the electromagnet, the spiral enthalpy數N, the diameter of the tip structure and the taper θ of the tip structure, so that a certain amount of abrasive particles can be adsorbed by controlling the size of the magnetic induction zone. 4A and 4B, since the abrasive grains 320a in FIG. 4A are randomly distributed, the plurality of regions are in the state of a single abrasive grain 320a, and the structure in which the two abrasive grains 320b are ground and stressed is weaker than the former. The latter can provide a plurality of abrasive grains 320b arranged in parallel, so that the support force is not easy to fall off, and it is expected to greatly increase the service life.

Returning to Fig. 1, after step 22, the wire substrate having the abrasive grains is subjected to a plating treatment in step 23 to enhance the anchoring effect of the abrasive grains adhering to the wire substrate. In one embodiment, a coating layer of a desired thickness may be directly plated, or as shown in FIG. 5A, a pre-lined substrate 90 is coated with an initial coating layer 340, and then the desired plating thickness is continued. To form a plating layer 341 as shown in FIG. 5B. In an embodiment, the material of the coating layer is nickel, but is not limited thereto. After step 23, the secant 4 having the abrasive particles 320 is completed, which can be used to cut germanium crystals, such as wafers, quartz crystals, various stone materials, gemstones, glass, ceramics, rare earth magnetic materials, and hard alloys. 5A and 5B illustrate the procedure of the coating process by using the magnetic field formed by the magnetic flux in the center of the substrate 90 as shown in FIG. 2B. In another embodiment, as shown in FIG. 5C and FIG. 5D, As shown in Fig. 3D, the induction magnetic field at the center of the line substrate 90 is not passed, and the state of the induced magnetic field distribution is formed to carry out the procedure of the step 23 coating treatment. Further, the line substrate of the induced magnetic domain distribution as shown in FIGS. 3E and 3F can also be subjected to the coating process in accordance with step 23.

Please refer to FIG. 6A, which is a schematic view of another embodiment of a process for manufacturing a secant having abrasive particles according to the present invention. In the present embodiment, substantially similar to the flow of Fig. 1, the difference is between step 22 and step 23, and further includes the step of controlling the thickness of the abrasive particles on the surface of the wire substrate in step 22a. When the wire substrate is magnetized in step 21, the abrasive particles are sprinkled on the wire, and at this time, the abrasive particles are adsorbed on the NS end of the magnetization zone to complete the step of sanding, that is, grinding the particles. If the magnetization is properly controlled, only one layer of abrasive particles should be adsorbed after the abrasive particles are sprinkled. However, if multiple layers of abrasive particles are adsorbed after sanding, as shown in Fig. 7A, leveling is required to level the multilayer abrasive grains. A layer of abrasive particles. In an embodiment of the step 22a, a mold for passing the wire substrate having the abrasive grains may be disposed between the abrasive grain region and the coating region, and the mold has a film hole, and the wire substrate having the abrasive grains can be passed through After the mold, an abrasive grain layer having a uniform thickness is formed on the surface of the substrate. As shown in FIGS. 7A to 7C, in FIG. 7A, a line substrate 90 having a plurality of layers of abrasive grains 320 is formed after step 22. 7B, the wire substrate 90 is passed through the mold 33, and only one layer of the abrasive grain layer 320 remains on the surface of the wire substrate 90 passing through the mold 33. Finally, as shown in FIG. 6A and FIG. 7C, the wire substrate 90 having the abrasive grains is subjected to a plating treatment in step 23, and a plating layer 341 is plated to strengthen the adhesion of the abrasive particles 320 to the wire substrate 90. effect. In another embodiment, the distribution of induced magnetic domains within the wire substrate 90 is not limited by the embodiment illustrated in Figures 7A-7C. In another embodiment, as shown in Figures 7D through 7F, the step of controlling the thickness of the abrasive particles of the surface of the wire substrate is carried out in step 22a with a wire substrate having a distribution of induced magnetic regions as in Figure 3D. It should be noted that, in addition to the foregoing step 22a of the line substrate distributed with the induced magnetic domain of FIG. 3D, other line substrates of the induced magnetic domain distribution, as shown in FIGS. 3E and 3F, may also be step 22a. The thickness of the abrasive particles on the surface of the wire substrate is controlled.

As shown in FIG. 6B, the figure is a schematic view of still another embodiment of the flow of the manufacturing method of the secant of abrasive particles of the present invention. This embodiment is substantially similar to FIG. 6A, with the difference that after step 23, a degaussing step 24 is included. Due to the abrasive grain secant with inductive magnetic zone, it is possible to adsorb chips during grinding and cutting, such as: Silicon, Sapphire, Silicon Carbide, etc. These chips can cause cutting obstruction or cutting The physical properties of the material, such as the wafer, have an effect, so degaussing through step 24, so that the secant 4 does not adsorb the chips during processing and cutting. It should be noted that, due to the strength required for magnetization in step 21, it is only necessary to adsorb the abrasive grains having a diameter of 30 μm on the wire substrate having a diameter of 150 to 250 μm, and in the sanding process of the step 22, there is no other external force to cause the grinding. The particles fall off, so the magnetic force on the finished abrasive grain cutting line is extremely weak, and the adsorption of the chips should not occur easily. However, if the doubt of the adsorption of the chips is to be avoided, the abrasive grain secant formed in the step 23 can be demagnetized by the present embodiment. In one embodiment, the degaussing method may be applied to the abrasive secant line formed in step 23 by applying a magnet wire and an alternating current signal to instantaneously demagnetize. It is to be noted that although step 24 is illustrated by the flow shown in FIG. 6A as a further embodiment, in another embodiment, the flow of step 24 can also be applied to the flow shown in FIG. 1.

Please refer to FIG. 6C, which is a schematic view showing still another embodiment of the flow of the manufacturing method of the secant of abrasive particles of the present invention. In this embodiment, substantially similar to the flow shown in FIG. 6B, the difference is that, in this embodiment, before step 21, a step 20a is further included to pass the line substrate through an initial magnetic sensitive region to perform a Magnetization action. The initial magnetically sensitive region performs a process of initial magnetization of the wire substrate. It should be noted that although step 20a is illustrated by the flow shown in FIG. 6B as a further embodiment, in another embodiment, the flow of step 24 may also be applied in the flow shown in FIG. 1 or FIG. 6A. .

Please refer to FIG. 8, which is a schematic view of an embodiment of a manufacturing system having a secant of abrasive particles according to the present invention. In the present embodiment, the system 3 includes a transport device 30, a pair of electromagnets 31, an upper sand module 32, and a coating device 34. The conveying device 30 is configured to convey a line of the substrate 90 in one direction. In one embodiment, the wire substrate 90 is derived from a bundle of metal wires 9, and the material of the metal wires 9 may be, for example, a steel wire, a stranded wire or a stainless steel wire, or a coated wire, such as: plated. Brass stainless steel wire, brass plated steel wire, nickel plated stainless steel wire, and nickel plated steel wire. This embodiment is a piano steel wire. The bundle of metal wires 9 is disposed on the input device 30. The conveying device 30 can be a combination of a rotating disc and a roller. The technique of conveying the wire is well known to those skilled in the art and will not be described herein.

The first stage of fabrication in the system 3 is an inductive magnetization zone that is a magnetization zone formed by the pair of electromagnets 31. In this embodiment, an initial magnetizing unit 35 is further provided in the preceding stage of the pair of electromagnets 31, and the line substrate 90 is pre-charged. The initial magnetizing unit 35 can magnetize the wire substrate 90 using an electromagnet or a permanent magnet. It should be noted that the initial magnetizing unit 35 is not an essential component for implementing the present invention and can be set as needed. The pair of electromagnets 31 are disposed on one side of the transport device 30, and include electromagnets 311 and 312 respectively disposed on opposite sides of the line substrate 90. It should be noted that the electromagnet is not limited by a pair of implementations, for example, a complex pair, as shown in Fig. 2C or an odd number, can be implemented in the spirit of the present invention. The electromagnet 311 has a solenoid 311a and an iron core 311b. Similarly, the electromagnet 312 has a solenoid 312a and an iron core 312b. The ends of the cores 311a and 312a have an end structure 310 which is a pointed structure. When the wire substrate 90 passes the pair of electromagnets 31, the pair of electromagnets 31 applies a pulsed induced magnetic field to the wire substrate 90, so that the wire substrate 90 has a plurality of inductive magnetic regions MA separated by a certain distance. . The manner of forming the induced magnetic domain MA is as described above, and will not be described herein.

9A to 9E are schematic views showing different embodiments of magnetic lines generated by electromagnets of a manufacturing system having a secant of abrasive particles according to the present invention. In FIG. 9A, the cores 311b and 312b of the electromagnets 311 and 312 of the present embodiment are of a C-shaped or U-shaped structure, and since the electromagnets 311 and 312 have a pointed end structure 310, they are paired electromagnetic The irons 311 and 312 are configured to generate a magnetic field B1 radially in the line substrate 90, so that the inductive magnetic regions MA4 and MA5 of opposite polarities can be generated in the radial direction of the same cross section. It should be noted that the number of electro-magnet structures of the U-shaped type is not limited by the pair configuration. In another embodiment, it may be a single electromagnet or a plurality of electromagnets but not arranged in pairs. Each side of the material.

In another embodiment, as shown in FIG. 9B, it is a schematic diagram of an embodiment in which another electromagnet sensing line substrate generates an inductive magnetic region. In this embodiment, the electromagnet 313 is an electromagnet of a C-type or U-shaped core 313b, and the opening is downward. Therefore, when the coil 313a on the electromagnet 313 is energized to generate a magnetic field, it is applied to the wire substrate. The opposite polarity induced magnetic regions MA6 and MA7 are generated in the axial direction of 90. It should be noted that although the electromagnet 313 of the present embodiment is described as an example, the number thereof is not limited to one, and the configured position or the pair configuration may be selected according to requirements. Further, in another embodiment, the magnetic polarity of the induced magnetic regions MA6 and MA7 can be changed by changing the direction of the current. Further, the distance and the position of the induced magnetic section can be determined by the number of the C-type electromagnets 313, the position of the arrangement, the opening pitch of the C-shaped electromagnet 313, and the moving speed of the wire substrate. For example, as shown in FIG. 9C, the cross section at one position of the line substrate is intended. In the present embodiment, it is substantially similar to FIG. 9B, and the difference is the direction of the magnetic field and the line substrate which are open for the electromagnet 313. The axial direction of 90 is vertical.

In another embodiment, as shown in FIG. 9D, in the present embodiment, the electromagnet 314 has a C-shaped or U-shaped core 314b having a coil 314a thereon. The core 314b has two pointed end structures 314c respectively disposed at opposite ends of the line substrate 90 with respect to the center of the section thereof, and the induced magnetic field B generated by the both end structures 314c passes through the center of the radial section of the line substrate 90, and An induced magnetic domain as shown in Fig. 2B is formed. The electromagnet 315 shown in Fig. 9E has a structure having a C-shaped or U-shaped iron core 315b, and has a coil 315a thereon. The iron core 315b has two pointed end structures 315c disposed on the same side of the wire substrate 90. The induced magnetic field B generated by the two end structures 315c does not pass through the center of the radial section of the wire substrate 90, and is formed as shown in FIG. 3C. To the induced magnetic region of 3F, this embodiment is illustrated by the inductive magnetic regions MA8 and MA9. It should be noted that the electromagnets of FIGS. 9B to 9E are only illustrated by one. In fact, the number of electromagnets may be set according to the number of formation magnetic regions, the distance and position of the modified magnetic regions.

Returning to FIG. 8, in order to control the position or azimuth angle of the electromagnet 31 with respect to the wire substrate 90, in the present embodiment, each of the electromagnets 31 is disposed on the precision moving platform 37, each of which is provided. The three-axis displacement motion and the rotational motion can be performed through the precision moving platform 37, and the minimum resolution can be up to 1 μm to adjust the position or orientation of the electromagnet. The sanding module 32 is disposed on one side of the pair of electromagnets 31. When the wire substrate 120 passes through the wire substrate 90, at least one abrasive grain 320 is adsorbed on each of the inductive magnetic regions MA. In this embodiment, the sanding module has a sand supply portion 321 and a sand receiving portion 322. The sand supply portion 321 is for sprinkling the abrasive grains 320 on the passing wire substrate 90 so that the abrasive particles 320 can be attached to the induction magnetic region MA, and the excess abrasive particles are received by the sand receiving portion 322. The characteristics of the abrasive particles are as described above and will not be described herein.

In this embodiment, in order to control the height of the abrasive particles attached to the inductive magnetic field of the in-line substrate, in an embodiment, a mold 33 is further disposed between the sanding module 32 and the coating device 34. To control the height at which the abrasive particles 320 are attached to the in-line substrate 90. In one embodiment, the mold 33 has a die hole 330 for providing the wire substrate 90. The size of the die hole 330 depends on the height or the number of layers of the abrasive grain 320, as long as the die hole 330 center and the wire substrate are allowed. The central axis of 90 corresponds to the precise control of the number of layers of abrasive particles. In one embodiment, the laser pointer and optical image can be used to correct alignment of the die hole 330 with the center of the wire substrate 90. It should be noted that, in the embodiment, the mold 33 is not an essential component, and it can be selected according to requirements. After the thickness of the abrasive grains is adjusted by the mold 33, the coating device 34 is disposed on the mold 33 side, and the coating device 34 is configured to form a plating layer 341 on the wire substrate for reinforcing the adhesion of the abrasive particles 320 to The effect of the wire substrate 90. The material of the plating layer 341 is as described above, and will not be described herein.

It should be noted that in the plating process of the coating device 34, the plating solution 343 is completely free from the floating diamond abrasive grains. Therefore, the present invention can solve the problem that the polishing solution etches the abrasive grains by the conventional plating solution. In addition, since it is not necessary to place abrasive grains in the plating solution, the cost required for the abrasive grains is lowered. In addition, since the present invention utilizes the inductive magnetic region and the sanding module 32 to cause the wire substrate 90 to adsorb the abrasive particles 320, it is not necessary to adopt a technique using a plating solution to form a secant randomly attached to the abrasive particles by weakly evaporating the electrophoresis. As a result, the main shortcomings of the current process can be greatly reduced. Moreover, since the current density is not required to increase the adhesion rate of the abrasive grains during the sanding process, the nickel plating layer bonded to the wire substrate 90 has a relatively low residual tensile stress, so that the residual compressive stress can be achieved, so it is expected to be grinded. The adhesion of the granules to the substrate of the wire can further prevent the abrasive particles from falling off during the grinding and cutting, so as to increase the service life of the secant.

Please refer to FIG. 10, which is a schematic view of another embodiment of a manufacturing system having a secant of abrasive particles according to the present invention. In the present embodiment, substantially similar to FIG. 8, the difference is that the degaussing unit 36 is disposed on one side after passing through the coating device 34 for degaussing the secant 4 output from the coating device 34. In one embodiment, the degaussing unit 36 is an electromagnetic coil that applies an alternating current signal, so that the secant line 4 formed by the coating device 34 can pass through the degaussing unit 36, and the secant line 4 is instantaneously demagnetized. Avoid the problem of swarf picking during the process of cutting the workpiece.

The above description is only intended to describe the preferred embodiments or embodiments of the present invention, which are not intended to limit the scope of the invention. That is, the equivalent changes and modifications made in accordance with the scope of the patent application of the present invention or the scope of the invention are covered by the scope of the invention.

2‧‧‧Manufacturing method for secant of abrasive particles

20~24‧‧‧Steps

20a‧‧‧Steps

22a‧‧‧Steps

3‧‧‧ Manufacturing System

30‧‧‧Conveyor

31, 31a, 31b‧‧‧ electromagnet pair

310, 310'‧‧‧ end structure

311, 312, 313, 314, 315‧‧‧ electromagnet

32‧‧‧ sanding module

311a, 312a, 313a, 314a, 315a‧‧‧ spiral

311b, 312b, 313b, 314b, 315b‧‧‧ iron core

320, 320a, 320b‧‧‧ abrasive grains

321‧‧‧Sand Supply Department

322‧‧‧ Sanding Department

33‧‧‧Mold

330‧‧‧Mold hole

34‧‧‧ Coating device

340‧‧‧Initial coating

341‧‧‧ coating layer

35‧‧‧Initial magnetization unit

36‧‧‧ Degaussing unit

37‧‧‧Mobile platform

4‧‧‧ secant

9‧‧‧Metal wire

90‧‧‧Wire substrate

B‧‧‧ Magnetic field

N, S‧‧‧ magnetic pole

MA~MA9, MA', MA1'~MA3', MA1a~MA3a, MA1a'~MA3a'‧‧‧Induction magnetic zone

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing an embodiment of a process for producing a secant of abrasive particles according to the present invention. 2A-2D are schematic cross-sectional views showing various aspects of an electromagnet forming an inductive magnetic region on a wire substrate. 3A to 3F are respectively schematic views showing different embodiments of the induced magnetic domains formed on the wire substrate of the present invention. Fig. 4A is a schematic view showing the arrangement of conventional abrasive grains. Figure 4B is a schematic illustration of one embodiment of a conventional method for adsorbing a plurality of abrasive particles. 5A and 5B are schematic views showing an embodiment of a coating step of the present invention. 5C and 5D are schematic views showing another embodiment of the coating step of the present invention. 6A is a schematic view showing another embodiment of a flow of a manufacturing method of a secant having abrasive particles according to the present invention. 6B is a schematic view showing still another embodiment of the flow of the manufacturing method of the secant having abrasive particles of the present invention. Fig. 6C is a schematic view showing still another embodiment of the flow of the manufacturing method of the secant of abrasive particles of the present invention. Figure 7A is a schematic illustration of one embodiment of a wire substrate having multiple layers of abrasive particles formed after step 22 of the present invention. Fig. 7B is a schematic view showing an embodiment of the invention in which only one layer of abrasive grains is left on the back surface of the mold through the mold. Figure 7C is a schematic cross-sectional view of one embodiment of a secant having abrasive particles and a coating layer. 7D to 7F are schematic cross-sectional views showing another embodiment of a secant formed with abrasive grains and a coating layer. Figure 8 is a schematic illustration of one embodiment of a manufacturing system having a secant of abrasive particles of the present invention. 9A to 9E are schematic views showing different embodiments of magnetic lines of force generated by electromagnets of a manufacturing system having a secant of abrasive particles according to the present invention. Figure 10 is a schematic illustration of another embodiment of a manufacturing system having a secant of abrasive particles of the present invention.

Claims (10)

A manufacturing method having a secant of abrasive particles, comprising the steps of: providing a wire substrate and conveying the wire substrate in one direction; passing the wire substrate through a magnetic sensitive region having at least An electromagnet, each electromagnet is disposed on one side of the wire substrate, and when the wire substrate passes through the magnetic sensitive region, the at least one electromagnet applies a pulsed induced magnetic field to the wire substrate to make the wire Forming a plurality of inductive magnetic regions at a specific distance from the substrate; passing the wire substrate having the plurality of inductive magnetic regions through an abrasive grain region, thereby adsorbing at least one abrasive particle on each of the inductive magnetic regions; The wire substrate of the abrasive particles passes through a coating zone to form a coating layer on the wire substrate. The manufacturing method of the secant of abrasive particles according to claim 1, wherein the wire substrate having the abrasive grains is passed through a die between the abrasive grain zone and the coating zone to control the wire base. The thickness of the abrasive particles on the surface of the material. The manufacturing method of the secant having abrasive particles according to claim 1, wherein each electromagnet has a pair of tips for concentrating magnetic lines of force to magnetize the wire substrate, and the outer diameter of the tip can be used for Control the size of the magnetized area. The manufacturing method of the secant having abrasive particles according to claim 1, further comprising a degaussing step of demagnetizing the wire substrate. A manufacturing system having a secant of abrasive particles, comprising: a conveying device for conveying a line of substrate in one direction; at least one electromagnet disposed on one side of the conveying device, each electromagnet being disposed on One side of the wire substrate, when the wire substrate passes through the at least one electromagnet, the at least one electromagnet applies to the wire substrate a pulsed induced magnetic field is formed on the line substrate with a plurality of sensing magnetic regions separated by a specific distance; an upper sand module is disposed on one side of the at least one electromagnet, and the sanding module is on the line base When the material passes, at least one abrasive particle is adsorbed on each of the inductive magnetic regions; and a coating device is disposed on one side of the sanding module, and the coating device is configured to form a coating layer on the wire substrate. A manufacturing system having a secant of abrasive particles according to claim 5, wherein each electromagnet has a pair of tips for concentrating magnetic lines of force to magnetize the wire substrate, and the outer diameter of the tip can be used for Control the size of the magnetized area. A manufacturing system having a secant of abrasive particles according to claim 5, wherein a mold is further provided between the sanding module and the coating device to provide passage of the wire substrate, wherein the die is used to control the The thickness of the abrasive particles on the surface of the wire substrate. A manufacturing system having a secant of abrasive particles according to claim 5, wherein the degaussing unit demagnetizes the wire substrate. A secant having abrasive particles, comprising: a wire substrate having a plurality of polishing zones periodically arranged in an axial direction; and an abrasive grain layer formed on the plurality of polishing zones, each of the grinding The abrasive grain layer on the zone has at least one abrasive grain; and a coating layer formed on the surface of the wire substrate for adding adhesion of the abrasive grain to the wire substrate. A secant having abrasive particles according to claim 9 wherein each of the abrasive zones has a magnetic polarity to adsorb at least one abrasive particle on the abrasive zone.