TW201938302A - Abrasive wire and method and system for forming abrasive wire - Google Patents

Abstract

The present invention provides a method and system for forming an abrasive wire, in which an electrically induced magnetic field is generated on a wire material transported toward a moving direction so as to form a plurality of induced magnetic area spaced apart by a specific distance whereby each induced magnetic area attracts abrasives after passing through an abrasives supplying area, and the wire material having abrasives attracted thereon passes through a film-coating area so that a coating film is formed on the wire material to enhance attachment effect between the abrasives and wire material. According to the method and system in the present invention, the abrasives can be regularly formed or with a specific pattern on the wire material through a position arrangement of the electrically induced magnets as well as a controllable electrically induced magnetic field generated therefrom.

Description

Manufacturing method and system of secant line with abrasive particles and secant line manufactured by using this method

The present invention relates to a technique for grinding secant lines, in particular to a method and system for manufacturing a secant line with abrasive particles that controls the position and pattern of abrasive particles formed through an induced magnetic field, and a secant line manufactured using the method.

The use of secant (or wire saw) cutting methods to cut semiconductors, crystals, various single crystals, magnetic materials, precision ceramics, and other hard and brittle materials has been in various industries for many years. Slicing lines with abrasive particles (such as diamonds) have in recent years occupied an important place in the semiconductor wafer cutting industry.

In conventional technology, there are many ways to make a secant. For example, the Republic of China Patent Publication No. I461249 teaches a wire saw and a method for manufacturing the same. The method for manufacturing a wire saw of the present invention includes: providing a bare wire; coating an intermediate layer on the bare wire, and embedding a plurality of abrasives in the intermediate layer; and plating a metal protective layer to cover the abrasives. According to this, the present invention can solve the problem of agglomeration of abrasives in the conventional plating solution during plating deposition, so as to improve the cutting quality and accuracy. The material of the intermediate layer is one or a combination selected from the group consisting of a viscous material, a solvent, and a solution.

The Republic of China Patent Bulletin No. I510314 teaches a wire saw and its manufacturing method including the following steps: 1. Provide an abrasive component, the abrasive component includes a plurality of composite abrasive particles, each composite abrasive particle has an abrasive body, and a package A metal coating layer bonded to the outer surface of the abrasive body, the particle size of the abrasive body of the composite abrasive particles is 10 μm to 200 μm, and a metal coating layer bonded to the outer surface of the abrasive body of each composite abrasive particle; The thickness is 0.1 μm to 19 μm, and the average weight of the metal coating layer of each composite abrasive particle is 10% to 60% of the average weight of a single composite abrasive particle; 2. Provide a metal wire; 3. Make the abrasive component The composite abrasive particles are uniformly distributed in a plating solution to be prepared as a sanding plating solution, and then a rapid pressure spraying method is applied in combination with an applied current to cause the sanding plating solution to form a combination of the composite abrasive particles on the surface of the wire substrate. Sand metal plating to make the composite abrasive particles initially fixed on the surface of the wire; and 4. electroplating the wire that has been initially fixed with the composite abrasive particles to A thicker metal plating layer is formed on the sanded metal plating layer, so that a part of the average particle diameter of the composite abrasive particles of 1/3 to 2/3 is buried in the metal plating layer, and a highly wear-resistant wire saw can be obtained. In the product, the film thickness of the metal plating layer is substantially equal, and the average film thickness of the metal plating layer is 1/3 to 2/3 of the average particle diameter of the composite abrasive particles.

In the traditional process, the method of coating the patterned insulating adhesive film is used to control the wear distribution, but this does not directly improve the sanding effect and the improvement of the life of the nickel film in the plating solution. The addition of special ingredients to the nickel film to increase its service life in the plating solution will inevitably increase the cost of the original coating, and it will not help the sanding effect.

To sum up, there is a need for a manufacturing method and system for a secant line with abrasive particles, and a secant line manufactured using the method to solve the shortcomings of conventional technology.

The invention provides a manufacturing method and system for a secant line with abrasive particles, and a secant line manufactured by using the method, which can control the grinding and discharging to simultaneously solve the problem that the grinding distribution cannot be uniformly controlled, the sanding effect is poor, and the plating solution is ground There are many problems such as short life of nickel film.

The present invention provides a method for controlling the distribution of friction. There is an induced magnetic field caused by the instantaneous change in magnetic flux generated by a "pulse-type electromagnetic pump." Dipole (magnetic moment), magnetization intensity, describes the process by which a substance is magnetized. A pulse-type (數 microsecond ~) power source is used to drive the coils on the core, and the magnetic field is guided along the direction of the core structure by the instantaneous induced magnetic field (magnetic coils) to focus the magnetic coils on the end surface (with a sharp outer diameter). The tip of the iron core (ten micrometers ~) can limit the size of the magnetized area of the shrinking steel wire. The castration line has a controllable diamond grinding and discharging technology. This method can also produce a multilayer 3D structured diamond with a grinding coating. Cut lines to improve grinding and service life.

In one embodiment, the present invention provides a method for manufacturing a secant line with abrasive particles, which includes the following steps: First, a line substrate is provided and the line substrate is conveyed in a direction. Next, the wire substrate is passed through a magnetically sensitive area, and the magnetically sensitive area has at least a pair of electromagnets respectively disposed on both sides of the wire substrate. When the wire substrate passes the magnetically sensitive area, the pair The electromagnet applies a pulse-type induction magnetic field to the wire substrate, so that the wire substrate has a plurality of induction magnetic regions at a specific distance from each other. Then, the wire substrate having the plurality of inductive magnetic regions is passed through an abrasive particle region, so that at least one abrasive particle is adsorbed on each of the inductive magnetic regions. Finally, the wire substrate having the abrasive particles is passed through a coating area to form a coating layer on the wire substrate.

In one embodiment, the present invention provides a secant manufacturing system with abrasive particles, which includes a conveying device, at least a pair of electromagnets, a sanding module, and a coating device. The conveying device is used for conveying a line of substrates in one direction. The at least one pair of electromagnets are disposed on one side of the conveying device, and the pair of electromagnets are respectively disposed on two sides of the wire substrate. When the wire substrate passes the at least one pair of electromagnets, the at least one pair The electromagnet applies a pulse-type induction magnetic field to the wire substrate, so that the wire substrate has a plurality of induction magnetic regions at a specific distance from each other. The sand-up module is disposed on one side of the at least one pair of electromagnets, and the sand-up module makes at least one abrasive particle be adsorbed on each induction magnetic zone when the wire substrate passes through. The coating device is disposed on one side of the sand-up module, and the coating device is used to form a coating layer on the wire substrate.

In one embodiment, the present invention provides a secant line with abrasive particles, which includes a line substrate, an abrasive particle layer, and a coating layer. The wire substrate has a plurality of first magnetizing regions in an orderly manner at a first interval along the axial direction, and a plurality of first magnetizing regions corresponding to the plurality of first magnetizing regions and spaced apart from each other by a first radius. A second magnetizing region, the first magnetizing region is opposite in magnetic polarity to the second magnetizing region. The abrasive particle layer is formed on the plurality of first and second magnetizing regions. The coating layer is formed on the surface of the wire substrate, and is used to grind the adhesion with the wire substrate.

Various exemplary embodiments may be described more fully hereinafter with reference to the accompanying drawings, in which some exemplary embodiments are shown. However, the inventive concept may be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, these exemplary embodiments are provided so that this invention will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art. Similar numbers always indicate similar components. The method and system for manufacturing the secant line with abrasive particles and the secant line manufactured using the method will be described with various embodiments and drawings in the following. However, the following embodiments are not intended to limit the present invention.

Please refer to FIG. 1, which is a schematic diagram of an embodiment of a manufacturing method flow of a secant line with abrasive particles according to the present invention. The method includes the following steps: First, step 20 is performed to provide a line substrate and convey the line substrate in a direction. The wire substrate can be piano steel wire, stranded wire or stainless steel wire, or coated wire, such as: brass-plated stainless steel wire, brass-plated piano steel wire, nickel-plated stainless steel wire, and nickel-plated piano steel wire For example, it is possible to select an appropriate thread type as the thread base material used in step 20 according to requirements. In an embodiment, the wire diameter of the wire substrate is between 150 μm and 250 μm, but the range is not limited. The user can select the required wire diameter according to the spirit of the present invention.

Next, step 21 is performed to pass the wire substrate through a magnetic sensing region, the magnetic sensing region having at least one electromagnet, which is respectively disposed on both sides of the wire substrate, and when the wire substrate passes through the magnetic sensing region, The at least one electromagnet applies a pulse-type induction magnetic field to the wire substrate, so that the wire substrate has a plurality of inductive magnetic regions spaced apart from a specific distance. In one embodiment, the size of the corresponding magnetically sensitive region on the wire substrate can be controlled through the end structure design of the electromagnet close to the wire substrate. As shown in FIG. 2A, this figure is a schematic diagram of an induction cross section of an electromagnet and a wire substrate. In this embodiment, a pair of electromagnets 31 are used for description. The end structure 310 of each electromagnet 311 and 312 may have a tip structure. Therefore, when a power source drives the electromagnets 311 and 312 to generate an induced magnetic field, the magnetic field lines are Guide the end structure 310 toward the tip, so that the electromagnets 311 and 312 can focus the magnetic field line on the end structure 310, thereby forming a small induction magnetic area MA with NS polarity as shown in FIG. 2B.

In FIG. 2B, the paired end structures 310 are disposed on both sides of the center of the cross-section direction of the line substrate so that the induced magnetic field generated by the end structure passes through the center of the cross-section direction of the line substrate 90, thereby generating the induction magnetic area MA, Its size and strength will be affected by the 螺 line 圏 electric line I, the 螺 line 圏 turn 數 N, the tip diameter of the end structure 310, and the cone 及 θ on the electromagnet. In one embodiment, the diameter of the end structure 310 is about ten micrometers, so the size of the magnetized area of the shrinkage substrate 90 can be limited. As shown in FIG. 2C, a pair of electromagnets may be provided with two pairs of electromagnets on two sides corresponding to the central axis of the line substrate 90. The figure shows three pairs of electromagnets 31, 31a, and 31b, so that the three pairs of electromagnets 31, 31a and 31b may be arranged radially along the center of the line substrate 90. It should be noted that although the foregoing embodiments are implemented with paired electromagnets, they are not limited to a paired configuration. A single electromagnet or a plurality of single electromagnets are not paired or partially paired. Combinations of configurations and partially unpaired configurations can also be implemented.

In addition, as shown in FIG. 2D, in this embodiment, it is basically similar to FIG. 2B, except that the end structures 310 and 310 ′ of the electromagnets 311 and 312 independently generate respective induced magnetic fields, and the end structure 310 The induced magnetic field generated with 310 ′ does not pass through the center of the wire substrate 90, and forms the induced magnetic regions MA and MA ′. It should be noted that although in this embodiment, the induction magnetic areas MA and MA 'correspond to each other, in another embodiment, the induction magnetic areas MA and MA' may not correspond to each other, which is based on the needs of users It depends.

As shown in FIG. 3A and FIG. 3B, the figures are schematic diagrams of different embodiments of the induction magnetic regions formed on the wire substrate of the present invention, respectively. In FIG. 3A, FIG. 3A (a) shows a schematic side view of a wire substrate after magnetic induction, and FIG. 3A (b) shows a schematic radial sectional view of the wire substrate. It can be seen from the embodiment shown in FIG. 3A that there are a plurality of pairs (NS) of induction magnetic regions MA ~ MA3 on the same cross section on the wire substrate 90, which have a certain angular interval in the radial direction. In each section, the number of the induction magnetic regions MA ~ MA3 is the same. In addition, there is a first distance d0 and a second distance d1 between each inductive magnetic area MA ~ MA3 and an adjacent inductive magnetic area MA ~ MA3. The first distance d0 can be controlled by the number and arrangement of the electromagnets. The greater the number of electromagnets, the smaller the distance d0, and the second distance d1 can pass through the moving speed of the wire substrate 90 or the on-off time of the pulsed current that controls the electromagnet operation, and the duty cycle (duty- cycle).

3B (a) and 3B (b) are schematic diagrams of the line substrate 90 having a single induction magnetic region MA and MA2 at each cross-section position and different directions of the induction magnetic fields of adjacent cross-sections. FIG. 3B (a) is a schematic partial side view of the wire substrate after undergoing magnetic induction. For example, the number of inductive magnetic regions is one at the position P0 and the number of inductive magnetic regions at position P1 is one, but the directions of the induced magnetic fields are different. Similarly, there is a first distance d0 and a second distance d1 between each inductive magnetic area MA and an adjacent inductive magnetic area MA2. The first distance d0 can be controlled by the number and arrangement of the pair of electromagnets. The second distance d1 can be determined by the moving speed of the wire substrate or the on-off time of the pulsed current that controls the electromagnet operation, and the duty-cycle. It should be noted that according to the spirit of FIG. 3A and FIG. 3B, the user can also form different numbers of induction magnetic regions on the radial section of the wire base at different positions through the configuration of the electromagnet at different positions.

In addition, as shown in FIGS. 3C and 3D, the figure is a schematic diagram of an embodiment of the arrangement of the induction magnetic regions of the present invention. In this embodiment, it is basically an extension of the embodiment shown in FIG. 2D, that is, a plurality of paired magnetic field polarities (N and S) are formed on a radial cross section of the wire substrate 90, and the magnetic field polarities are along the The induction magnetic region of the threaded substrate 90 is arranged radially. In the embodiment of FIG. 3C, it can be seen that a cross section of the wire substrate 90 has an induction magnetic region (MA, MA '), and the induction magnetic region (MA1, MA1') is in combination with the induction magnetic region (MA, MA). ') Not on the same radial section. In this embodiment, the inductive magnetic region (MA, MA ') and the inductive magnetic region (MA1, MA1') are separated from the second direction by a second distance d1 in the axial direction of the line substrate 90. It should be noted that although in this embodiment, the inductive magnetic area (MA, MA ') and the inductive magnetic area (MA1, MA1') are arranged in pairs, in another embodiment, they may not be arranged in pairs. , That is, the induction magnetic regions MA and MA 'have a certain distance in the axial direction. As shown in FIG. 3D, in the present embodiment, the wire substrate 90 has a plurality of pairs of induction magnetic regions (MA, MA '), (MA1, MA1'), (MA2, MA2 '), and ( MA3, MA3 ').

In addition, as shown in FIGS. 3E and 3F, the figures are schematic diagrams of one embodiment of the arrangement of the induction magnetic regions of the present invention, respectively. In this embodiment, it is basically an extension of FIG. 2D, but the difference lies in the different directions of the magnetic field polarities in FIGS. 3E and 3F. In the embodiment of FIG. 3E, the magnetic field directions of each of the induction magnetic regions (MAa, MAa '), (MA1a, MA1a), (MA2a MA2a'), and (MA3a, MA3a ') are along the circumference of the line substrate 90. Orientation. In FIG. 3F, the magnetic field directions of each of the induction magnetic regions (MAb, MAb '), (MA1b, MA1b), (MA2b MA2b'), and (MA3b, MA3b ') are along the axial direction of the line substrate 90. arrangement.

Returning to FIG. 1 again, step 22 is followed by passing the wire substrate having the plurality of inductive magnetic regions through an abrasive particle region, so that at least one abrasive particle is adsorbed on each of the inductive magnetic regions. Because the wire substrate has a plurality of induction magnetic regions, when the abrasive particles are loaded, because the abrasive particles still have a magnetically permeable material, the abrasive particles will be absorbed by the induction of the wire substrate when the wire substrate passes through the abrasive particle area. Magnetic domain. In this step, the abrasive particles can be attached to the wire substrate by spraying or freely falling. In one embodiment, the abrasive particles have a particle diameter of 20 to 40 μm, and the particle diameter of this embodiment is about 30 μm. The particle size of the abrasive particles is not limited by the foregoing embodiment, and a user may select an appropriate abrasive particle size according to requirements. The material of the abrasive particles may be a material containing diamond, cubic boron nitride, silicon carbide, or tungsten carbide.

Since the electromagnet of the present invention uses pulsed current generation to cause the electromagnet to generate periodic states of induction magnetic field and non-induced magnetic field alternately, as the wire substrate moves at a specific speed, the wire substrate can be regularly on-line. A neatly arranged induction magnetic area is formed on the top. In an embodiment, as shown in FIG. 4A to FIG. 4B, FIG. 4A is a schematic diagram of a conventional abrasive particle arrangement, and FIG. 4B is a schematic diagram of a regular method for adsorbing a plurality of abrasive particles in the present invention. In conventional technology, as shown in FIG. 4A, the random arrangement method of randomly attached abrasive particles 320a is used. The abrasive particles 320a are only distributed uniformly, and the abrasive particles 320a at the same location are also different. Since the abrasive particles fall off during grinding and castration, it is one of the factors that affect the life of the castration line. With the method of the present invention, the size of the induction magnetic field can be controlled by, for example, as shown in FIG. The induction magnetic area of each abrasive particle 320b is 2 × 2 in size in this embodiment, and can absorb four abrasive particles 320b. It should be noted that since the size of the abrasive particles 320b is known, this embodiment has an abrasive particle 320b with a particle size of about 30 μm, and the size of the induction magnetic region and the 螺 line 螺 electricity 圏, 螺 line 圏 turn on the electromagnet數 N, the diameter of the tip structure and the cone 度 θ of the tip structure, so it is possible to adsorb a specific number of abrasive particles by controlling the size of the magnetic induction zone. Comparing FIG. 4A and FIG. 4B, since the abrasive particles 320a in FIG. 4A are randomly distributed, multiple regions are in the state of a single abrasive particle 320a, and the structure of the grinding force with the two abrasive particles 320b is weaker than the former. The latter can provide multiple abrasive particles 320b arranged in parallel, so the support force is strong and the capacity is allowed to fall off, which is expected to greatly increase the service life.

As shown in FIG. 1 again, after step 22, the wire substrate with abrasive particles is coated in step 23 to enhance the fixing effect of the abrasive particles on the wire substrate. In an embodiment, a coating layer of a desired thickness may be directly plated, or as shown in FIG. 5A, an initial coating layer 340 is first pre-coated on the substrate 90, and then the required coating thickness is further plated. To form a coating layer 341 as shown in FIG. 5B. In one embodiment, the material of the coating layer is nickel, but not limited thereto. After step 23, the secant line 4 with the abrasive particles 320 is completed, which can be used to cut silicon crystals, such as wafers, quartz crystals, various stone materials, gems, glass, ceramics, rare earth magnetic materials, and hard alloys. Although FIGS. 5A and 5B use the induction magnetic region formed by the center of the magnetic line of force through the substrate 90 as shown in FIG. 2B to describe the coating process, in another embodiment, as shown in FIGS. 5C and 5D, it can also be used. As shown in FIG. 3D, the induction magnetic field that does not pass through the center of the wire substrate 90, and the induced magnetic field distribution state is formed to perform the coating process of step 23. In addition, the wire substrate of the induction magnetic zone distribution state shown in FIGS. 3E and 3F may also be subjected to a coating process according to step 23.

Please refer to FIG. 6A, which is a schematic diagram of another embodiment of a manufacturing method flow of a secant line with abrasive particles according to the present invention. In this embodiment, it is basically similar to the process of FIG. 1, except that the difference between step 22 and step 23 further includes the step of controlling the thickness of the abrasive particles on the surface of the wire substrate in step 22 a. After the wire substrate is magnetized in step 21, the grinding pad is scattered on the wire. At this time, the grinding pad will be adsorbed on the NS end of the magnetized area to complete the step of sanding, that is, the grinding particles. If the magnetization is properly controlled, there should be only one layer of grindstone absorbed after dusting, but if there are multiple layers of grindstone absorbed after sanding, as shown in Figure 7A, it is necessary to level and level the multi-layered grindstone. A layer of grinding. In an embodiment of step 22a, a mold for passing the wire substrate with the abrasive particles may be provided between the abrasive particle region and the coating region. The mold has a film hole to allow the wire substrate with the abrasive particles to pass through. After the mold, a layer of abrasive particles having a uniform thickness is formed on the surface of the substrate. As shown in FIGS. 7A to 7C, in FIG. 7A, a wire substrate 90 having a multilayer polishing pad 320 is formed after step 22. 7B shows that the wire substrate 90 passes through the mold 33, and only one layer of abrasive particles 320 remains on the surface of the wire substrate 90 passing through the mold 33. Finally, as shown in FIG. 6A and FIG. 7C, the wire base material 90 with abrasive particles is coated in step 23, and a coating layer 341 is plated to strengthen the attachment of the abrasive particles 320 to the wire base material 90. effect. In another embodiment, the distribution of the induction magnetic region in the wire substrate 90 is not limited by the embodiment shown in FIGS. 7A to 7C. In another embodiment, as shown in FIGS. 7D to 7F, it is a step of controlling the thickness of the abrasive particles on the surface of the wire substrate by performing step 22a with a wire substrate having a magnetic field distribution as shown in FIG. 3D. It should be noted that, in addition to performing the step 22a with the line substrate with the induction magnetic field distribution shown in FIG. 3D, other types of line substrate with the induction magnetic field distribution, for example, as shown in FIGS. Control the thickness of the abrasive particles on the surface of the wire substrate.

As shown in FIG. 6B, this figure is a schematic diagram of another embodiment of a manufacturing method flow of a secant line with abrasive particles according to the present invention. This embodiment is basically similar to FIG. 6A. The difference is that after step 23, a degaussing step 24 is further included. Due to the cutting line of the abrasive grain with induction magnetic zone, it is possible to adsorb cuttings during grinding and cutting, such as: Silicon, Sapphire, Silicon Carbide, etc. These cuttings may cause cutting resistance or prevent cutting. The physical properties of materials, such as wafers, have an effect, so demagnetization is performed through step 24, so that the cutting line 4 does not attract chips during processing and cutting. It should be noted that, due to the strong magnetization required for magnetization in step 21, it is only necessary to adsorb abrasive particles with a diameter of 30 μm on a wire substrate with a diameter of 150 to 250 μm, and in the process of sanding in step 22, there will be no other external force to make these abrasives. The particles fall off, so the magnetic force on the finished abrasive grain secant line is extremely weak, and it should not be easy to attract dust. However, if you want to avoid the suspicion of attracting dust, you can use this embodiment to degauss the abrasive grain secant formed in step 23. In one embodiment, the method of demagnetizing can add an electromagnetic line to the abrasive grain secant formed in step 23 to apply a cross signal to demagnetize it instantly. It should be noted that although step 24 is described by using the flow shown in FIG. 6A for further embodiments, in another embodiment, the flow of step 24 may also be applied to the flow shown in FIG. 1.

Please refer to FIG. 6C, which is a schematic diagram of another embodiment of a manufacturing method flow of a secant line with abrasive particles according to the present invention. In this embodiment, it is basically similar to the process shown in FIG. 6B. The difference is that, in this embodiment, before step 21, a step 20a is further included to pass the wire substrate through an initial magnetic sensing area to perform a Magnetizing action. The initial magnetically sensitive region performs an initial magnetization process on the wire substrate. It should be noted that although step 20a is described by using the flow shown in FIG. 6B for further embodiments, in another embodiment, the flow of step 24 may also be applied to the flow shown in FIG. 1 or 6A. .

Please refer to FIG. 8, which is a schematic diagram of an embodiment of a manufacturing system with a cutting line with abrasive particles according to the present invention. In this embodiment, the system 3 includes a conveying device 30, a pair of electromagnets 31, a sand loading module 32, and a coating device 34. The conveying device 30 is used for conveying a line of substrate 90 in a direction. In one embodiment, the wire base material 90 is from a bundle of metal wires 9, and the material of the metal wires 9 can be, for example, piano steel wires, stranded wires, or stainless steel wires, or coated wires, such as: Brass stainless steel wire, brass-plated piano wire, nickel-plated stainless steel wire, and nickel-plated piano steel wire. This embodiment is a piano steel wire. The bundle of metal wires 9 is provided on the input device 30. The conveying device 30 may be a combination of a rotating disk and a roller. The technology of conveying wires is well known to those skilled in the art, and details are not described herein.

The first stage of the manufacturing process in the system 3 is an inductive magnetizing zone, which is a magnetizing zone formed by the pair of electromagnets 31. In this embodiment, an initial magnetizing unit 35 is further provided in front of the pair of electromagnets 31, and a procedure for pre-magnetizing the wire substrate 90 is performed first. The initial magnetization unit 35 may use an electromagnet or a permanent magnet to magnetize the wire substrate 90. It should be noted that the initial magnetizing unit 35 is not an essential element for implementing the present invention, and can be set according to requirements. The pair of electromagnets 31 is disposed on one side of the conveying device 30, and includes electromagnets 311 and 312, which are respectively disposed on two sides of the wire substrate 90. It should be noted that the electromagnet is not limited to a pair of implementations. For example, a plurality of pairs, as shown in FIG. 2C or an odd number, can be implemented in the spirit of the present invention. The electromagnet 311 includes a cymbal coil 311a and an iron core 311b. Similarly, the electromagnet 312 includes a cymbal coil 312a and an iron core 312b. The ends of the iron cores 311a and 312a have an end structure 310, which is a pointed structure. When the wire substrate 90 passes through the pair of electromagnets 31, the pair of electromagnets 31 applies a pulsed induction magnetic field to the wire substrate 90, so that the wire substrate 90 has a plurality of induction magnetic regions MA at a certain distance from each other. . The manner of forming the induction magnetic area MA is as described above, and will not be repeated here.

9A to 9E are schematic diagrams of different embodiments of magnetic lines generated by an electromagnet in a manufacturing system with a secant line of abrasive particles according to the present invention. In FIG. 9A, the iron cores 311b and 312b of the electromagnets 311 and 312 of this embodiment have a C-shaped or sigmoid-shaped structure. Since the electromagnets 311 and 312 have a tip end structure 310, the paired electromagnetic The arrangement of the irons 311 and 312 can generate a magnetic field B1 in the radial direction of the wire base material 90, and therefore, it is possible to generate induction magnetic regions MA4 and MA5 of opposite polarities in the radial direction of the same cross section. It should be noted that the number of the ㄇ -shaped electromagnet structure is not limited to the configuration in pairs. In another embodiment, it can be a single electromagnet, or multiple electromagnets, but not paired. Sides of the wood.

In another embodiment, as shown in FIG. 9B, it is a schematic diagram of an embodiment that generates an induction magnetic region for another electromagnet induction wire substrate. In this embodiment, the electromagnet 313 is an electromagnet with a C-shaped or cymbal-shaped iron core 313b, and the opening is downward. Therefore, when the coil 313a on the electromagnet 313 is energized to generate a magnetic field, it will be on the wire substrate. Inductive regions MA6 and MA7 of opposite polarities are generated in the axial direction of 90. It should be noted that although one description of the electromagnets 313 in this embodiment is provided, the number of the electromagnets 313 is not limited to one, and a configuration position or a pair configuration may be selected according to requirements. In addition, in another embodiment, the magnetic polarity of the induction magnetic regions MA6 and MA7 can be changed by changing the direction of the current. Furthermore, the distance and position of the induction magnetic section can be determined by the number and position of the C-type electromagnets 313, the opening distance of the C-type electromagnets 313, and the moving speed of the wire substrate. For example, as shown in FIG. 9C, the cross section at one position of the wire substrate is intended. In this embodiment, it is basically similar to FIG. 9B, except that the direction of the magnetic field and the wire substrate of the opening of the electromagnet 313 are different. The axial direction of 90 is vertical.

In another embodiment, as shown in FIG. 9D, in this implementation, the electromagnet 314 has a structure of a C-shaped or a sigma-shaped iron core 314b, and has a coil 314a thereon. The iron core 314b has two pointed end structures 314c, which are respectively provided at the two ends of the wire substrate 90 with respect to the center of its section. The induced magnetic field B generated by the two end structures 314c passes through the center of the radial section of the wire substrate 90, and A magnetic induction region is formed as shown in FIG. 2B. The electromagnet 315 shown in FIG. 9E has a structure having a C-shaped or a U-shaped iron core 315b, and has a coil 315a thereon. The iron core 315b has two tip end structures 315c, which are disposed on the same side of the wire substrate 90. The induced magnetic field B generated by the two end structures 315c does not pass through the center of the radial section of the wire substrate 90, and is formed as shown in FIG. 3C. To the 3F induction magnetic regions, this embodiment is illustrated by the induction magnetic regions MA8 and MA9. It should be noted that only one of the electromagnets shown in FIGS. 9B to 9E is used as an example. Actually, the number of the electromagnets can be determined according to the number, interval and position of the modified magnetic fields.

Returning to FIG. 8 again, in order to control the position or azimuth of the electromagnet 31 relative to the wire substrate 90, in this embodiment, each electromagnet 31 is disposed on a precision moving platform 37, and each electromagnet 31 The three-axis displacement movement and rotation movement can be performed through the precision moving platform 37. The minimum resolution can reach 1 μm to adjust the position or orientation of the electromagnet. The sand-up module 32 is disposed on one side of the pair of electromagnets 31. When the wire-up module 32 passes through the wire substrate 90, the sand-up module 32 adsorbs at least one abrasive particle 320 on each of the induction magnetic regions MA. In this embodiment, the sand loading module has a sand supply unit 321 and a sand receiving unit 322. The sand supplying portion 321 is used to spray the abrasive particles 320 on the passing wire substrate 90 so that the abrasive particles 320 can be attached to the induction magnetic area MA, and the excess abrasive particles are received by the sand receiving portion 322. The characteristics of the abrasive particles are as described above, and will not be repeated here.

In this embodiment, in order to control the height of the abrasive particles attached to the induction magnetic region of the wire substrate, in one embodiment, a mold 33 is further provided between the sanding module 32 and the coating device 34. In order to control the height of the abrasive particles 320 attached to the wire substrate 90. In one embodiment, the mold 33 has a mold hole 330 for passing the line substrate 90. The size of the mold hole 330 is determined by the height or number of layers of the abrasive particles 320, as long as the center of the mold hole 330 and the line substrate are provided. Corresponding to the central axis of 90, the number of layers of abrasive particles can be precisely controlled. In one embodiment, a laser pointer and an optical image can be used to correct the alignment of the die hole 330 with the center position of the wire substrate 90. It should be noted that, the mold 33 in this embodiment is not an essential component, and it can be selected whether to be set according to requirements. After the thickness of the abrasive particles is adjusted by the mold 33, the coating device 34 is provided on one side of the mold 33. The coating device 34 is used to form a coating layer 341 on the wire substrate to strengthen the attachment of the abrasive particles 320 to Effect of the wire substrate 90. The material of the coating layer 341 is as described above, and is not repeated here.

It should be noted that during the coating process of the coating device 34, there is no need to put floating diamond abrasive particles in the plating solution 343, so the present invention can solve the problem of abrasive particles aging caused by erosion of the abrasive particles by the plating solution of the conventional technology. In addition, since there is no need to place abrasive particles in the plating solution, the cost required for the abrasive particles is reduced. In addition, since the present invention uses the induction magnetic area and the sanding module 32 to make the wire substrate 90 adsorb the abrasive particles 320, it is necessary to use the technique of using a plating solution to form a secant line where the abrasive particles randomly adhere through the weak electrophoresis. This can significantly reduce the main disadvantages of the current process. In addition, during the sand loading process, it is necessary to add electrical density to improve the adhesion of abrasive particles. Therefore, the nickel plating layer bonded to the wire substrate 90 has a relatively low residual tensile stress, which can even reach a residual compressive stress. Adhesion between the pellets and the wire substrate, so that the abrasive grains can fall off during grinding and cutting to increase the service life of the cut.

Please refer to FIG. 10, which is a schematic diagram of another embodiment of a manufacturing system having a cutting line with abrasive particles according to the present invention. In this embodiment, it is basically similar to FIG. 8. The difference is that in this embodiment, a degaussing unit 36 is provided on the side after passing through the coating device 34 to degauss the secant line 4 output by the coating device 34. In one embodiment, the degaussing unit 36 is an electromagnetic coil to which a cross signal is applied, so that the scoring line 4 formed by the coating device 34 can pass through the degaussing unit 36 to demagnetize the scoring line 4 instantly. Avoid the problem that the cutting line may attract dust when cutting the workpiece.

The above description only describes the preferred implementations or embodiments of the technical means adopted by the present invention to solve the problem, and is not intended to limit the scope of patent implementation of the present invention. That is, all changes and modifications that are consistent with the meaning of the scope of patent application of the present invention, or made according to the scope of patent of the present invention, are covered by the scope of patent of the present invention.

2‧‧‧ Manufacturing method of secant line with abrasive particles

20 ~ 24‧‧‧step

20a‧‧‧step

22a‧‧‧step

3‧‧‧Manufacturing System

30‧‧‧ Conveying device

31, 31a, 31b‧‧‧ electromagnet pair

310, 310’‧‧‧ end structure

311, 312, 313, 314, 315‧‧‧ electromagnets

32‧‧‧Sand loading module

311a, 312a, 313a, 314a, 315a

311b, 312b, 313b, 314b, 315b‧‧‧ iron core

320, 320a, 320b ‧‧‧ Abrasive particles

321‧‧‧Sand Supply Department

322‧‧‧ Sand Receiving Department

33‧‧‧Mould

330‧‧‧die hole

34‧‧‧Coating device

340‧‧‧Initial coating

341‧‧‧ Coating

35‧‧‧ initial magnetization unit

36‧‧‧Degaussing unit

37‧‧‧mobile platform

4‧‧‧ secant

9‧‧‧ metal wire

90‧‧‧line substrate

B‧‧‧ Magnetic Field

N, S‧‧‧ magnetic pole

MA ~ MA9, MA ’, MA1’ ~ MA3 ’, MA1a ~ MA3a, MA1a’ ~ MA3a’‧‧‧Induction magnetic zone

FIG. 1 is a schematic diagram of an embodiment of a manufacturing method flow of a secant line with abrasive particles according to the present invention. 2A to 2D are schematic cross-sectional views of various aspects of an electromagnet forming an induction magnetic region on a wire substrate. 3A to 3F are schematic diagrams of different embodiments of an induction magnetic region formed on a wire substrate of the present invention. FIG. 4A is a schematic diagram of a conventional abrasive particle arrangement. FIG. 4B is a schematic diagram of an embodiment of the present invention to regularly adsorb a plurality of abrasive particles. 5A and 5B are schematic diagrams of an embodiment of a coating step according to the present invention. 5C and 5D are schematic diagrams of another embodiment of the coating step of the present invention. FIG. 6A is a schematic diagram of another embodiment of a manufacturing method flow of a secant line with abrasive particles according to the present invention. FIG. 6B is a schematic view of another embodiment of a manufacturing method flow of a secant line with abrasive particles according to the present invention. FIG. 6C is a schematic diagram of another embodiment of a manufacturing method flow of a secant line with abrasive particles according to the present invention. FIG. 7A is a schematic diagram of an embodiment of forming a wire substrate having a multi-layer abrasive torch after step 22 of the present invention. FIG. 7B is a schematic diagram of an embodiment in which only one layer of abrasive particles is left on the rear surface of the wire substrate through the mold according to the present invention. 7C is a schematic cross-sectional view of an embodiment of a secant line having abrasive particles and a coating layer. 7D to 7F are schematic cross-sectional views of another embodiment of a secant line formed with abrasive particles and a coating layer. FIG. 8 is a schematic diagram of an embodiment of a manufacturing system of a secant line with abrasive particles according to the present invention. 9A to 9E are schematic diagrams of different embodiments of magnetic field lines generated by an electromagnet of a manufacturing system with a secant line of abrasive particles according to the present invention. FIG. 10 is a schematic diagram of another embodiment of a manufacturing system with a secant line of abrasive particles according to the present invention.

Claims (10)

A method for manufacturing a secant line with abrasive particles includes the following steps: providing a line substrate and conveying the line substrate in a direction; passing the line substrate through a magnetically sensitive region, the magnetically sensitive region having at least An electromagnet is respectively disposed on one side of the wire base material. When the wire base material passes through the magnetic sensing area, the at least one electromagnet applies a pulse induction magnetic field to the wire base material, so that the wire base material is Forming a plurality of inductive magnetic regions at a specific distance; passing a wire substrate having the plurality of inductive magnetic regions through an abrasive particle region, thereby causing at least one abrasive particle to be adsorbed on each inductive magnetic region; and having the abrasive particles The wire substrate passes through a coating area to form a coating layer on the wire substrate. The method for manufacturing a secant line with abrasive particles according to item 1 of the scope of the patent application, wherein between the abrasive particle area and the coating area, a wire substrate having the abrasive particles is passed through a mold to control the line base. The thickness of the abrasive particles on the surface of the wood. According to the method for manufacturing a secant line with abrasive particles according to item 1 of the scope of the patent application, wherein each electromagnet has a pair of tips for gathering magnetic lines of force to magnetize the line substrate, the outer diameter of the tip can be used for Controls the size of the magnetized area. The method for manufacturing a secant line with abrasive particles according to item 1 of the patent application scope further includes a degaussing step to demagnetize the line substrate. A manufacturing system for cutting lines with abrasive particles includes: a conveying device for conveying a line of substrates in one direction; at least one electromagnet disposed on one side of the conveying device, the at least one electromagnet respectively It is arranged on one side of the wire base material. When the wire base material passes the at least one electromagnet, the at least one electromagnet applies a pulse induction magnetic field to the wire base material, so that a plurality of wire base materials are formed on the wire base material. Inductive magnetic areas at a specific distance; a sand-up module is disposed on one side of the at least one electromagnet, and the sand-up module makes at least one abrasive particle adsorbed on each of the induction magnetic areas when the line substrate passes through And a coating device is disposed on one side of the sand-up module, the coating device is used to form a coating layer on the wire substrate. According to the manufacturing system of the secant line with abrasive particles according to item 5 of the scope of the patent application, each electromagnet has a pair of tips for gathering magnetic lines of force to magnetize the line substrate, and the outer diameter of the tip can be used for Controls the size of the magnetized area. According to the manufacturing system of the secant line with abrasive particles according to item 5 of the scope of the patent application, a mold is further provided between the sanding module and the coating device to allow the line substrate to pass through, and the mold is used to control the The thickness of the abrasive particles on the surface of the wire substrate. According to the manufacturing system of a secant line with abrasive particles as described in item 5 of the patent application scope, the degaussing unit demagnetizes the line substrate. A secant line with abrasive particles includes: a linear substrate having a plurality of abrasive regions periodically arranged in an axial direction thereof; an abrasive particle layer formed on the plurality of abrasive regions, and each abrasive The abrasive particle layer on the area has at least one abrasive particle; and a coating layer, which is formed on the surface of the wire base material for adding friction to the wire base material. The secant line with abrasive particles according to item 9 of the scope of the patent application, wherein each grinding zone has a magnetic polarity to adsorb at least one abrasive particle on the grinding zone.