JP2015009325A - Fixed abrasive grain wire and wire processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an abrasive grain wire capable of improving sharpness and reducing a processing cost when an alloy containing iron of 45% or more such as an alnico alloy, a ferritic alloy, a samarium-cobalt alloy, a neodymium alloy and the like is cut and to provide a wire processing method using the same.SOLUTION: In an abrasive grain wire 2 using for cutting an alloy containing iron of 45% or more,: abrasive grains fixed on a wire 6 include both of diamond abrasive grains 7 and CBN abrasive grains 8; and an including ratio of the diamond abrasive grains 7 to the CBN abrasive grains 8 is 20:80-70:30.

Description

  The present invention relates to a fixed abrasive wire used for cutting an alloy containing 45% or more of iron such as an alnico alloy, a ferrite alloy, a samarium cobalt (Samacoba) alloy, or a neodymium alloy, and a wire processing method using the same.

  A fixed abrasive wire used for slicing a crystalline material such as a solar cell, semiconductor silicon, a magnetic material, sapphire, or SiC is known. In the fixed abrasive wire, abrasive grains such as diamond and cubic boron nitride (CBN) are fixed on a wire core wire through a binder (see, for example, Patent Document 1).

  In particular, CBN is one of the molecular structures of boron nitride, and is a boron compound of nitrogen. It has almost the same hardness as diamond, but has excellent heat resistance, and has a thermal reaction. Since it can reduce, it is suitable for the cutting | disconnection of the metal block of a hard and difficult-to-work-process neodymium alloy (for example, refer patent document 2).

JP2012-152830A JP 2011-121161 A

  However, since CBN abrasive grains are more expensive than diamond abrasive grains, processing costs are increased. On the other hand, diamond abrasive grains have a Knoop hardness of about 1.7 times that of CBN abrasive grains and have a good sharpness, but alloys containing 45% or more of iron, such as alnico alloys, ferrite alloys, samacoba alloys and neodymium alloys. When used for cutting, a chemical reaction occurs during cutting and diamond wear is accelerated, so that the sharpness is rapidly reduced.

  Therefore, in the present invention, when cutting an alloy containing 45% or more of iron such as an alnico alloy, a ferrite alloy, a samakoba alloy, a neodymium alloy, etc., a fixed abrasive wire that can improve sharpness and reduce processing costs, It aims at providing the wire processing method using this.

  The fixed abrasive wire of the present invention is a fixed abrasive wire used for cutting an alloy containing 45% or more of iron, in which the abrasive grains are fixed on the wire, and the abrasive grains are diamond abrasive grains and CBN abrasive grains. These are fixed abrasive wires in which the content ratio of diamond abrasive grains and CBN abrasive grains is 20:80 to 70:30.

  According to the fixed abrasive wire of the present invention, the sharpness is improved by including diamond abrasive grains having a hardness higher than that of the conventional fixed abrasive wire including only CBN abrasive grains, and the fixing of only the conventional diamond abrasive grains is performed. Since there are fewer diamond abrasive grains that cause a chemical reaction during cutting than the abrasive wire, wear of the diamond abrasive grains is suppressed, and the reduction in sharpness is delayed. Therefore, the fixed abrasive wire of the present invention can be used by running at a linear speed of 500 to 1200 m / min, and is sharper than the conventional fixed abrasive wire of only diamond abrasive grains or CBN abrasive grains. The index is improved. The sharpness index is the reciprocal of the time required to round up the work material.

  In addition, the content ratio of diamond abrasive grains and CBN abrasive grains is more preferably 30:70 to 60:40. In this case, a fixed abrasive wire having a sharpness index improved by 20% or more as compared with a conventional fixed abrasive wire made only of diamond abrasive grains can be obtained.

  According to the fixed abrasive wire of the present invention, the sharpness at the time of cutting an alloy containing 45% or more of iron such as an alnico alloy, a ferrite alloy, a samakoba alloy or a neodymium alloy is improved. Moreover, since there are few CBN abrasive grains than the conventional fixed abrasive wire only of CBN abrasive grains, an inexpensive fixed abrasive wire can be obtained and processing cost can be reduced.

It is a schematic block diagram of the wire saw apparatus in embodiment of this invention. It is a longitudinal cross-sectional view of the fixed abrasive wire of FIG. It is a figure which shows the relationship between the content ratio of a DIA abrasive grain and a CBN abrasive grain, and a sharpness index. It is a figure which shows the relationship between a rocking | fluctuation angle and a sharpness index | exponent.

  FIG. 1 is a schematic configuration diagram of a wire saw device according to an embodiment of the present invention, and FIG. 2 is a plan view of the fixed abrasive wire of FIG.

  In FIG. 1, a wire saw device 1 according to an embodiment of the present invention moves a plurality of fixed abrasive wires 2 arranged at a predetermined interval in the depth direction of the drawing at high speed between main rollers 3a and 3b. The workpiece 4 is pressed against the traveling fixed abrasive wire 2 and cut. The main rollers 3a and 3b are configured to swing within a swing angle 2θ (± θ from the horizontal) by a swing mechanism (not shown). The work material 4 is an alloy containing 45% or more of iron, such as an alnico alloy, a ferrite alloy, a samakoba alloy, or a neodymium alloy, and is held on a slice table 5.

  The fixed abrasive wire 2 has a plurality of diamond (hereinafter referred to as “DIA”) abrasives by electrodeposition on the outer peripheral surface of a wire 6 on which a base (base layer) by metal plating such as Ni is applied on a wire core wire. The grains 7 and the CBN abrasive grains 8 are fixed. In addition, in the fixed abrasive wire 2 in this embodiment, although the content ratio of the DIA abrasive grain 7 and the CBN abrasive grain 8 is 20: 80-70: 30, More preferably, it is set to 30: 70-60: 40. .

  The wire core wire is a wire such as a piano wire or an aramid fiber wire, and the wire diameter (core wire diameter) d is φ60 μm to φ300 μm. The size (average particle diameter) of the DIA abrasive grains 7 and the CBN abrasive grains 8 is 15% or more and 30% or less of the core wire diameter d. In this embodiment, the measurement of the average particle diameter of the DIA abrasive grains 7 and the CBN abrasive grains 8 uses a measuring instrument using the laser diffraction principle. In addition, in this embodiment, although the cross-sectional shape of a wire core wire is circular, it can also be made into a polygon.

  The DIA abrasive grains 7 and the CBN abrasive grains 8 are coated (coated) with a conductive metal such as Ni in order to electrodeposit DIA and CBN which are non-conductors. In addition to Ni, it is possible to use one or more of Cu, Cr, Ti, Fe, Zn, or Al. Moreover, in this embodiment, although the DIA abrasive grain 7 and the CBN abrasive grain 8 are fixed by electrodeposition, it can be fixed by a resin adhesive such as resin bond.

  In the wire processing method by the wire saw device 1 having the above configuration, the fixed abrasive wire 2 includes both the DIA abrasive grain 7 and the CBN abrasive grain 8, and the content ratio of the DIA abrasive grain 7 and the CBN abrasive grain 8 is 20:80. Since it is ˜70: 30, the DIA abrasive grains 7 having higher hardness than the conventional fixed abrasive wire with only the CBN abrasive grains 8 are included, so that the cutting when cutting an alloy containing 45% or more of iron is performed. As the taste improves, since there are fewer DIA abrasive grains 7 that cause a chemical reaction during cutting than the conventional fixed abrasive wire of only DIA abrasive grains 7, the wear of DIA abrasive grains 7 is suppressed, and the sharpness is reduced. Become slow.

  Therefore, the fixed abrasive wire 2 in the present embodiment can be used while being run at a linear speed of 500 to 1200 m / min by the wire saw device 1, and only the conventional DIA abrasive grains 7 or only the CBN abrasive grains 8 are used. The sharpness index is improved as compared with the fixed abrasive wire. Moreover, since there are few CBN abrasive grains 8 rather than the conventional fixed abrasive wire only of CBN abrasive grains 8, the cheap fixed abrasive wire 2 is obtained and the processing cost can be reduced.

  A neodymium cutting test was performed with the wire saw device 1 having the above-described configuration. In this example, the core wire diameter d is 0.18 mm, and the size (average particle diameter) of the DIA abrasive grains 7 and the CBN abrasive grains 8 is 30 to 40 μm (16.7 to 22.2% with respect to the core wire diameter d) ( Using an electrodeposition fixing wire with Ni coating), the content ratio of DIA abrasive grains 7 and CBN abrasive grains 8 was changed and tested. The test results are shown in FIG. 3 and FIG.

  FIG. 3 shows the relationship between the content ratio of the DIA abrasive grains 7 and the CBN abrasive grains 8 and the sharpness index. The sharpness index was 100% when the CBN abrasive grains 8 were cut at a linear speed of 300 to 500 m / min with a fixed abrasive wire. As can be seen from FIG. 3, when the content ratio of DIA abrasive grains 7 and CBN abrasive grains 8 is 20:80 to 70:30, it is used at a linear speed of 500 to 1200 m / min, and only conventional CBN abrasive grains are fixed. The sharpness index is improved compared to the abrasive wire. In particular, when it is used at a linear speed of 700 to 1200 m / min, the content ratio is improved by 20% or more at 30:70 to 60:40, which is improved by 30% at the maximum.

  FIG. 4 shows the relationship between the swing angle and the sharpness index when the main rollers 3a and 3b are swung at the swing angle θ. In addition, the content ratio of the DIA abrasive grains 7 and the CBN abrasive grains 8 is 50:50 at which the maximum sharpness index is obtained in FIG. As can be seen from FIG. 4, by cutting the work material 4 while swinging the main rollers 3a and 3b, the contact arc with the work material 4 is reduced, so that the sharpness index is improved by up to 30%. Therefore, when combined with the effect shown in FIG. 3, the sharpness can be improved by up to 60%.

  The fixed abrasive wire and the wire processing method of the present invention are useful for cutting alloys containing 45% or more of iron such as alnico alloys, ferrite alloys, samarium cobalt alloys and neodymium alloys.

DESCRIPTION OF SYMBOLS 1 Wire saw apparatus 2 Fixed abrasive wire 3a, 3b Main roller 4 Work material 5 Slice stand 6 Wire 7 Diamond (DIA) abrasive grain 8 CBN abrasive grain

Claims (4)

Abrasive grains are fixed on the wire and are fixed abrasive wires used for cutting alloys containing 45% or more of iron,
The abrasive grains include both diamond abrasive grains and CBN abrasive grains,
The fixed abrasive wire whose content ratio of the said diamond abrasive grain and the said CBN abrasive grain is 20: 80-70: 30.   The fixed abrasive wire according to claim 1, wherein the fixed abrasive wire is used while being run at a linear speed of 500 to 1200 m / min.   A fixed abrasive wire used for cutting an alloy containing 45% or more of iron, in which abrasive grains are fixed on the wire, wherein the abrasive grains include both diamond abrasive grains and CBN abrasive grains, and the diamond abrasive A wire processing method in which a fixed abrasive wire having a content ratio of grains and the CBN abrasive grains of 20:80 to 70:30 is run at a linear speed of 500 to 1200 m / min to cut the work material.   The wire processing method according to claim 3, wherein the workpiece is cut by swinging the fixed abrasive wire.

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