JP4703448B2 - Resin bond wire saw - Google Patents

Resin bond wire saw Download PDF

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JP4703448B2
JP4703448B2 JP2006079269A JP2006079269A JP4703448B2 JP 4703448 B2 JP4703448 B2 JP 4703448B2 JP 2006079269 A JP2006079269 A JP 2006079269A JP 2006079269 A JP2006079269 A JP 2006079269A JP 4703448 B2 JP4703448 B2 JP 4703448B2
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resin bond
conductive particles
abrasive grains
resin
metal layer
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JP2007253268A (en
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大介 井手
直樹 峠
智寛 松木
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Noritake Co Ltd
Noritake Super Abrasive Co Ltd
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Noritake Co Ltd
Noritake Super Abrasive Co Ltd
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Description

本発明は、マルチ切断加工に用いられるレジンボンドワイヤソーに関する。   The present invention relates to a resin bond wire saw used for multi-cutting.

固定砥粒ワイヤソーを用いた、サファイア、炭化珪素、セラミックス等の硬質被削材のマルチ切断加工において、高能率で精度良く切断するためには，砥粒と被削材表面での滑りを発生させずに被削材にいかに砥粒を食い込ませるかが重要である。
しかし、レジンボンドワイヤソーでは、被削材が硬いと砥粒がボンド中に沈み込みやすいため，食い込みが充分でない。また、研削時に被削材と砥粒との間で発生した摩擦熱によってレジンボンドが軟化してしまい、さらに砥粒が沈み込みやすくなる。 In the multi-cutting of hard work materials such as sapphire, silicon carbide, ceramics, etc. using a fixed abrasive wire saw, in order to cut with high efficiency and accuracy, slip between the abrasive grains and the work surface is generated. It is important how the abrasive grains are made to penetrate into the work material.
However, in a resin bond wire saw, if the work material is hard, the abrasive grains are likely to sink into the bond, so that the bite is not sufficient. Further, the resin bond is softened by the frictional heat generated between the work material and the abrasive grains during grinding, and the abrasive grains are more likely to sink.

砥粒の食い込みを向上させるための手段としては、砥粒の固定力を高めて砥粒の沈み込みを抑制することが考えられる。そのため、このような硬質材料の切断においては，砥粒をニッケルなどのメッキで砥粒を固定した電着ワイヤソーが使用されている。
しかし，この電着ワイヤソーは砥粒を適度に分散させて固定することが困難であり、かつ砥粒粒径の５０％程度のメッキ層を形成する必要があるため製造速度が遅い。このため、品質安定が困難で、工具コストが高く、またワイヤーの柔軟性が低いために切断精度が悪く、加工時の断線発生率が高い。
砥粒の固定力を高めることを目的とした技術の一例が特許文献１、特許文献２、特許文献３、特許文献４に記載されている。 As a means for improving the biting of the abrasive grains, it is conceivable to increase the fixing force of the abrasive grains and suppress the sinking of the abrasive grains. For this reason, in the cutting of such a hard material, an electrodeposited wire saw in which the abrasive grains are fixed by plating such as nickel is used.
However, this electrodeposited wire saw is difficult to disperse and fix abrasive grains appropriately, and it is necessary to form a plating layer of about 50% of the grain size of the abrasive grains, so that the production rate is slow. For this reason, it is difficult to stabilize the quality, the tool cost is high, and the flexibility of the wire is low, so the cutting accuracy is poor, and the occurrence rate of disconnection during processing is high.
An example of a technique aimed at increasing the fixing force of abrasive grains is described in Patent Document 1, Patent Document 2, Patent Document 3, and Patent Document 4.

特開２００４−５０３０１号公報JP 2004-50301 A 特開２０００−２２５６１３号公報JP 2000-225613 A 特開平１１−２０７５９８号公報Japanese Patent Laid-Open No. 11-207598 特開２０００−２４６５４２号公報JP 2000-246542 A

特許文献１には、ワイヤソーの外周面を鍍金層で覆い、その鍍金層を樹脂層で覆ったものが記載されている。また、特許文献２、特許文献３には、金属粒子や無機粉末を樹脂層に含有させたワイヤソーが記載されている。また、特許文献４には、金属被覆砥粒を用いたレジンボンドワイヤソーが記載されている。
しかし、特許文献１に記載のものでは、電着により砥粒を固定するため砥粒を適度に分散させて固定することが困難であり、製造速度も上げることが困難であるという問題点がある。特許文献２、特許文献３に記載のものでは、金属粒子や無機粉末により樹脂強度を向上することはできるものの、硬質被削材切断において格段に砥粒固定力を高める効果はない。また、特許文献４に記載のものでは、金属被覆した超砥粒を用いることで砥粒と樹脂との接着強度を向上させることはできるものの、砥粒固定力を高める効果はない。 Patent Document 1 describes a wire saw in which the outer peripheral surface is covered with a plating layer and the plating layer is covered with a resin layer. Patent Documents 2 and 3 describe wire saws in which metal particles and inorganic powder are contained in a resin layer. Patent Document 4 describes a resin bond wire saw using metal-coated abrasive grains.
However, in the thing of patent document 1, in order to fix an abrasive grain by electrodeposition, there exists a problem that it is difficult to disperse | distribute an abrasive grain moderately and to fix, and it is difficult to raise a manufacturing speed. . In the materials described in Patent Document 2 and Patent Document 3, although the resin strength can be improved by metal particles or inorganic powder, there is no effect of significantly increasing the abrasive fixing force in cutting a hard work material. Moreover, in the thing of patent document 4, although the adhesive strength of an abrasive grain and resin can be improved by using the metal-coated superabrasive grain, there is no effect which raises an abrasive grain fixing force.

本発明は、以上の問題点を解決するためになされたもので、砥粒の食い込みを良くして、高精度、高能率での切断が可能なレジンボンドワイヤソーを提供することを目的とする。   The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a resin bond wire saw that improves the biting of abrasive grains and can be cut with high accuracy and high efficiency.

以上の課題を解決するために、本発明のレジンボンドワイヤソーは、砥粒を樹脂で結合した砥粒層が芯線の周囲に設けられたレジンボンドワイヤソーにおいて、レジンボンド表面からの砥粒突出し量が平均砥粒粒径の１０％以上４０％以下であり、レジンボンド表面に前記砥粒突出し量の１０％以上４０％以下の厚みで金属層が被覆されていることを特徴とする。   In order to solve the above-mentioned problems, the resin bond wire saw of the present invention is a resin bond wire saw in which an abrasive grain layer in which abrasive grains are bonded with a resin is provided around a core wire. The average abrasive grain diameter is 10% or more and 40% or less, and the resin layer surface is coated with a metal layer with a thickness of 10% or more and 40% or less of the abrasive grain protrusion amount.

レジンボンド表面に砥粒突出し量の１０％以上４０％以下の厚みで金属層が被覆されていることによって、砥粒の固定力が高まり、研削の際の被削材への砥粒の食い込みが良くなり、高精度、かつ高能率での切断が可能となる。しかも、レジンボンドで砥粒を固定するため、品質が安定し製造速度を高速にすることができる。   The resin bond surface is coated with a metal layer with a thickness of 10% or more and 40% or less of the protruding amount of abrasive grains, so that the fixing force of the abrasive grains is increased, and the abrasive grains bite into the work material during grinding. It becomes better, and cutting with high accuracy and high efficiency becomes possible. Moreover, since the abrasive grains are fixed with resin bonds, the quality is stable and the production speed can be increased.

砥粒突出し量が平均砥粒粒径の１０％未満では切れ味が悪く、４０％を超えると砥粒保持力が小さくなり脱落が発生しやすい。また、金属層の厚みが砥粒突出し量の１０％未満では金属層を設けた効果が低く、４０％を超えると砥粒の突出し量が小さくなるため、切れ味が低下し、ワイヤソーの柔軟性も低下して断線率が高くなる。   When the abrasive protrusion is less than 10% of the average abrasive grain size, the sharpness is poor, and when it exceeds 40%, the abrasive holding force is reduced and the falling off tends to occur. Moreover, if the thickness of the metal layer is less than 10% of the protruding amount of the abrasive grains, the effect of providing the metal layer is low. Decreases and the disconnection rate increases.

本発明においては、金属層の厚みが５μｍ以下であることを特徴とする。
金属層の厚みが５μｍ以下であれば金属層を設けたことによる捻回強度の低下量が小さい。金属層の厚みが５μｍを超えると、捻回強度の低下量が大きくなって切断時の断線率が高くなり好ましくない。 In the present invention, the thickness of the metal layer is 5 μm or less.
When the thickness of the metal layer is 5 μm or less, the amount of decrease in twisting strength due to the provision of the metal layer is small. When the thickness of the metal layer exceeds 5 μm, the amount of decrease in the twisting strength is increased, and the disconnection rate at the time of cutting is increased, which is not preferable.

本発明においては、前記レジンボンド中に導電性粒子が含有されていることを特徴とする。
レジンボンド中に導電性粒子が含有されていることにより、砥粒の固定力をさらに高めることができる。導電性粒子として、銀、グラファイト、銅、ニッケル等の金属被覆を施したダイヤモンド砥粒などを用いることができる。導電性粒子を含有させることでワイヤソーが導電性を持ち、電解メッキにより金属層を形成することができる。このため、金属層と樹脂との接着強度を高めることができる。 The present invention is characterized in that conductive particles are contained in the resin bond.
By containing conductive particles in the resin bond, the fixing force of the abrasive grains can be further increased. As the conductive particles, diamond abrasive grains coated with a metal such as silver, graphite, copper, or nickel can be used. By including conductive particles, the wire saw has conductivity, and a metal layer can be formed by electrolytic plating. For this reason, the adhesive strength between the metal layer and the resin can be increased.

本発明においては、前記レジンボンド中に含有された導電性粒子の含有率が、レジンボンドと導電性粒子の合計体積の２体積％以上３０体積％以下であり、かつ前記導電性粒子の平均粒径が砥粒平均粒径の３０％以下であることを特徴とする。
砥粒固定力を上げるためには、導電性粒子はレジンボンド表面の砥粒周囲に存在することが重要であり、かつ、導電性粒子の存在によってレジンボンドが脆くなることを防止する必要がある。このためには、導電性粒子の含有量は３０体積％以下であり、かつ導電性粒子の平均粒径が砥粒平均粒径の３０％以下であることが好ましい。導電性粒子の含有量が２体積％未満であると、導電性が低く電解メッキにより均一に被覆できないため好ましくなく、３０体積％を超えると砥粒数が多くなりレジンボンドが脆くなるため、ボンド強度が低下し、ワイヤソーの柔軟性を低下する。また、導電性粒子の平均粒径が粒径の平均粒径の３０％を超えると、全体の砥粒数が減るため砥粒周囲に存在する粒子数が減少し、砥粒固定力効果が低下する。 In the present invention, the content of the conductive particles contained in the resin bond is 2% by volume to 30% by volume of the total volume of the resin bond and the conductive particles, and the average particle size of the conductive particles The diameter is 30% or less of the average grain size of the abrasive grains.
In order to increase the abrasive fixing force, it is important that the conductive particles exist around the abrasive grains on the surface of the resin bond, and it is necessary to prevent the resin bond from becoming brittle due to the presence of the conductive particles. . For this purpose, the content of the conductive particles is preferably 30% by volume or less, and the average particle size of the conductive particles is preferably 30% or less of the average particle size of the abrasive grains. If the content of the conductive particles is less than 2% by volume, it is not preferable because the conductivity is low and cannot be uniformly coated by electrolytic plating, and if it exceeds 30% by volume, the number of abrasive grains increases and the resin bond becomes brittle. The strength decreases and the flexibility of the wire saw decreases. Also, if the average particle size of the conductive particles exceeds 30% of the average particle size of the particle size, the total number of abrasive grains is reduced, so the number of particles existing around the abrasive grains is reduced, and the effect of fixing the abrasive grains is reduced. To do.

本発明においては、前記レジンボンド中に含有された導電性粒子の含有率が、レジンボンドと導電性粒子の合計体積の２体積％以上３０体積％以下であり、かつ前記導電性粒子の平均粒径が砥粒平均粒径の６０％以上９０％以下であって、前記導電性粒子は前記レジンボンドの表面に露出しており、この導電性粒子に対して金属層が形成されていることを特徴とする。
これにより、金属層はレジンボンドの表面に島状に形成されることになり、レジンボンドの柔軟性が損なわれにくい。
導電性粒子の平均粒径が砥粒平均粒径の６０％未満であると、レジンボンド中に埋没して好ましくなく、９０％を超えると加工時に作用して抵抗が大きくなって好ましくない。 In the present invention, the content of the conductive particles contained in the resin bond is 2% by volume to 30% by volume of the total volume of the resin bond and the conductive particles, and the average particle size of the conductive particles The diameter is 60% or more and 90% or less of the average grain size of the abrasive grains, and the conductive particles are exposed on the surface of the resin bond, and a metal layer is formed on the conductive particles. Features.
As a result, the metal layer is formed in an island shape on the surface of the resin bond, and the flexibility of the resin bond is not easily lost.
When the average particle diameter of the conductive particles is less than 60% of the average particle diameter of the abrasive grains, it is not preferable because it is buried in the resin bond, and when it exceeds 90%, it is not preferable because it acts during processing and increases resistance.

本発明によると、柔軟性を維持しつつ、砥粒の食い込みを良くして、高精度、高能率での切断が可能なレジンボンドワイヤソーを実現することができる。   According to the present invention, it is possible to realize a resin bond wire saw capable of cutting with high accuracy and high efficiency by improving the biting of abrasive grains while maintaining flexibility.

以下に、本発明をその実施形態に基づいて説明する。
図１に、本発明の実施形態に係るレジンボンドワイヤソーを示す。
レジンボンドワイヤソー１は、ピアノ線等からなる芯線２の周囲に、砥粒３を紫外線硬化樹脂等からなるレジンボンド４で固定した砥粒層５を形成してなるものである。レジンボンド４の表面上には金属層６が無電解めっきにより形成されている。 Below, this invention is demonstrated based on the embodiment.
FIG. 1 shows a resin bond wire saw according to an embodiment of the present invention.
The resin bond wire saw 1 is formed by forming an abrasive grain layer 5 in which abrasive grains 3 are fixed with a resin bond 4 made of an ultraviolet curable resin or the like around a core wire 2 made of a piano wire or the like. A metal layer 6 is formed on the surface of the resin bond 4 by electroless plating.

図２に、砥粒３の周囲の詳細を示す。
レジンボンド４の表面からの砥粒突出し量Ａは、平均砥粒粒径Ｄの１０％以上４０％以下であり、レジンボンド４の表面に被覆された金属層６の厚みＢは、砥粒突出し量Ａの１０％以上４０％以下としている。 FIG. 2 shows details around the abrasive grains 3.
The abrasive grain protrusion amount A from the surface of the resin bond 4 is 10% or more and 40% or less of the average abrasive grain diameter D, and the thickness B of the metal layer 6 coated on the surface of the resin bond 4 is the abrasive grain protrusion. The amount A is 10% or more and 40% or less.

図３（ａ）に、レジンボンド４中に導電性粒子１１が含有されている例を示す。
導電性粒子１１の含有率は、レジンボンド４と導電性粒子１１の合計体積の２体積％以上３０体積％以下であり、かつ導電性粒子１１の平均粒径は砥粒３の平均粒径の３０％以下としている。この例では、レジンボンド４の表面の全域に亘って金属層６が形成されている。 FIG. 3A shows an example in which the conductive particles 11 are contained in the resin bond 4.
The content of the conductive particles 11 is 2 volume% or more and 30 volume% or less of the total volume of the resin bond 4 and the conductive particles 11, and the average particle diameter of the conductive particles 11 is the average particle diameter of the abrasive grains 3. 30% or less. In this example, the metal layer 6 is formed over the entire surface of the resin bond 4.

図３（ｂ）に示すように、導電性粒子１１を、レジンボンド４の表面に露出させ、この露出された導電性粒子１１に対して金属層６を電解めっきにより形成してもよい。この場合には、導電性粒子１１の平均粒径は砥粒３の平均粒径の６０％以上９０％以下とするのが好ましい。   As shown in FIG. 3B, the conductive particles 11 may be exposed on the surface of the resin bond 4, and the metal layer 6 may be formed on the exposed conductive particles 11 by electrolytic plating. In this case, the average particle diameter of the conductive particles 11 is preferably 60% or more and 90% or less of the average particle diameter of the abrasive grains 3.

このようにして金属層６を形成すると、レジンボンド４の表面に金属層６が島状に形成されるようになる。そのため、レジンボンド４の柔軟性が損なわれることがなく、導電性粒子１１がアンカー効果を発揮するため金属層６が剥離しにくい。また、導電性粒子１１のみがレジンボンド４の表面に存在するものと比較して、強固な金属層６が形成されているため、耐摩耗性が向上する。   When the metal layer 6 is formed in this manner, the metal layer 6 is formed in an island shape on the surface of the resin bond 4. Therefore, the flexibility of the resin bond 4 is not impaired, and the conductive layer 11 exhibits an anchor effect, so that the metal layer 6 is hardly peeled off. Moreover, since the strong metal layer 6 is formed compared with the thing in which only the electroconductive particle 11 exists in the surface of the resin bond 4, abrasion resistance improves.

以下に試験例を示す。
砥粒の突き出し量を変えて切断試験を行った。試験条件は、以下の通りである（以下、この試験条件を「切断試験条件」という）。
レジンボンドワイヤソー：芯線：φ１８０μｍ、平均砥粒径 ４０μｍ
被削材：サファイア
ワイヤー線速：３５０ｍ／ｍｉｎ
研削液：水溶性 Test examples are shown below.
A cutting test was performed by changing the protruding amount of the abrasive grains. The test conditions are as follows (hereinafter, this test condition is referred to as “cut test condition”).
Resin bond wire saw: Core wire: φ180μm, Average abrasive grain size 40μm
Work material: Sapphire Wire speed: 350m / min
Grinding fluid: water-soluble

試験結果を図４に示す。
レジンボンド表面からの砥粒突出し量が平均砥粒粒径の１０％以上４０％以下のときに、安定した高い加工能率を示しており、２５％以上３５％以下のときに特に加工能率が良好となる。これに対し、砥粒突き出し量が１０％未満のときは加工能率の低下が顕著であり、また、砥粒突き出し量が４０％を超えると砥粒の脱落が発生し、加工能率が低下する。 The test results are shown in FIG.
When the protruding amount of the abrasive grains from the resin bond surface is 10% or more and 40% or less of the average abrasive grain diameter, stable high processing efficiency is shown, and when the amount is 25% or more and 35% or less, the processing efficiency is particularly good. It becomes. On the other hand, when the abrasive grain protrusion amount is less than 10%, the reduction of the processing efficiency is remarkable, and when the abrasive grain protrusion amount exceeds 40%, the abrasive grains fall off and the processing efficiency decreases.

次に、金属層の厚みを変えて、上述と同条件で切断試験を行った。また、図５に示す装置を用いて捻回強度試験も行った。
テンション２０Ｎでワイヤソー１８ｍｍ（芯線径の１００倍）を捻回し、ワイヤソーが破断するまでの捻回数で評価した（以下。この試験条件を「捻回試験条件」という）。ワイヤソーの芯線の径は１８０μｍ、突き出し量は砥粒径の３０％である。 Next, the thickness of the metal layer was changed and a cutting test was performed under the same conditions as described above. Further, a twisting strength test was also conducted using the apparatus shown in FIG.
A wire saw 18 mm (100 times the core wire diameter) was twisted with a tension of 20 N, and the number of twists until the wire saw broke was evaluated (hereinafter, this test condition is referred to as “twist test condition”). The diameter of the core wire of the wire saw is 180 μm, and the protrusion amount is 30% of the abrasive particle size.

図６に切断試験の試験結果を示す。金属層の厚みが砥粒突出し量の１０％未満のときは、砥粒の固定力が不足し、金属層を設けたことによる効果が小さいため加工能率が低い。金属層の厚みが砥粒突出し量の４０％を超えると、砥粒突出し量が少ないために加工能率が低下する。また、図７に捻回試験の試験結果を示す。この結果のように、金属層の厚みが５μｍ以下のときには強度低下も小さく安定した捻回強度を示している。
図８に、上述した切断試験条件で、導電性粒子の有無による切断性能の違いを調査した結果を示す。導電性粒子を含有することにより、電解メッキにより均一な金属層を形成しやすくなり、加工能率が高くなる。 FIG. 6 shows the test result of the cutting test. When the thickness of the metal layer is less than 10% of the protruding amount of the abrasive grains, the fixing force of the abrasive grains is insufficient, and the effect of providing the metal layer is small, so the processing efficiency is low. If the thickness of the metal layer exceeds 40% of the protruding amount of the abrasive grains, the processing efficiency decreases because the protruding amount of the abrasive grains is small. Moreover, the test result of a twist test is shown in FIG. As shown in this result, when the thickness of the metal layer is 5 μm or less, the strength decrease is small and a stable twisting strength is shown.
FIG. 8 shows the results of investigating the difference in cutting performance depending on the presence or absence of conductive particles under the cutting test conditions described above. By containing the conductive particles, it becomes easy to form a uniform metal layer by electrolytic plating, and the processing efficiency is increased.

図９に、上述した切断試験条件で、導電性粒子の含有量を変えたときの切断性能の違いを調査した結果を示す。レジンボンド中に含有された導電性粒子の含有率が、レジンボンドと導電性粒子の合計体積の２体積％未満のときは、導電性が低く均一な金属膜の形成が困難となる。また、３０％を超えると、レジンボンドが脆くなり、加工能率が低下する。   FIG. 9 shows the results of investigating the difference in cutting performance when the content of the conductive particles is changed under the cutting test conditions described above. When the content of the conductive particles contained in the resin bond is less than 2% by volume of the total volume of the resin bond and the conductive particles, it is difficult to form a uniform metal film with low conductivity. On the other hand, if it exceeds 30%, the resin bond becomes brittle and the processing efficiency is lowered.

図１０に、上述した切断試験条件で、導電性粒子の平均粒径を変えたときの切断性能の違いを調査した結果を示す。
導電性粒子の平均粒径が砥粒平均粒径の３０％を超えると、砥粒固定力が低下し、加工能率が低下するのに対して、３０％以下のときは、加工能率が良好である。 FIG. 10 shows the results of investigating the difference in cutting performance when the average particle diameter of the conductive particles is changed under the cutting test conditions described above.
When the average particle size of the conductive particles exceeds 30% of the average particle size of the abrasive grains, the abrasive fixing force decreases and the processing efficiency decreases, whereas when it is 30% or less, the processing efficiency is good. is there.

図１１に、金属層をレジンボンドの表面に島状に形成したときの捻回強度を、レジンボンドだけの場合と、レジンボンドの全面に金属層を設けた場合とを比較して示す。捻回試験条件は上述したものと同じである。島状に金属層を形成しても、捻回強度は低下しておらず、柔軟性を失っていないことがわかる。   FIG. 11 shows the twisting strength when the metal layer is formed in an island shape on the surface of the resin bond in a case where only the resin bond is provided and a case where the metal layer is provided on the entire surface of the resin bond. The twist test conditions are the same as described above. It can be seen that even when the metal layer is formed in an island shape, the twisting strength is not lowered and the flexibility is not lost.

図１２に、上述した切断試験条件で、金属層をレジンボンドの表面に島状に形成したときに、導電性粒子の含有率を変えたときの切断性能の違いを調査した結果を示し、図１３に、導電性粒子の平均粒径を変えたときの切断性能の違いを調査した結果を示す。
導電性粒子の含有率については、レジンボンドと導電性粒子の合計体積の２体積％以上３０体積％以下のときに加工能率が良好である。また、導電性粒子の平均粒径については、砥粒平均粒径の６０％以上９０％以下のときに加工能率が良好である。砥粒の平均粒径の９０％を超えると、導電性粒子が抵抗として作用するため、加工効率の低下が顕著となる。また、砥粒の平均粒径の６０％未満のときは島状に被覆することが困難となる。 FIG. 12 shows the results of investigating the difference in cutting performance when the content of the conductive particles is changed when the metal layer is formed in an island shape on the surface of the resin bond under the cutting test conditions described above. 13 shows the results of investigating the difference in cutting performance when the average particle size of the conductive particles is changed.
About the content rate of electroconductive particle, when it is 2 volume% or more and 30 volume% or less of the total volume of a resin bond and electroconductive particle, processing efficiency is favorable. Moreover, about the average particle diameter of electroconductive particle, processing efficiency is favorable when it is 60% or more and 90% or less of an abrasive grain average particle diameter. If it exceeds 90% of the average particle diameter of the abrasive grains, the conductive particles act as resistance, so that the processing efficiency is significantly reduced. Moreover, when it is less than 60% of the average grain size of the abrasive grains, it becomes difficult to coat the island shape.

本発明は、柔軟性を維持しつつ、砥粒の食い込みを良くして、高精度、高能率での切断が可能なレジンボンドワイヤソーとして利用することができる。   INDUSTRIAL APPLICABILITY The present invention can be used as a resin bond wire saw capable of cutting with high accuracy and high efficiency by improving the biting of abrasive grains while maintaining flexibility.

本発明の実施形態に係るレジンボンドワイヤソーを示す図である。It is a figure which shows the resin bond wire saw which concerns on embodiment of this invention. 砥粒の周囲の詳細を示す図である。It is a figure which shows the detail of the circumference | surroundings of an abrasive grain. レジンボンド中に導電性粒子を含有させた例を示す図である。It is a figure which shows the example which contained electroconductive particle in the resin bond. 砥粒の突き出し量を変えて切断試験を行った結果を示す図である。It is a figure which shows the result of having performed the cutting test by changing the protrusion amount of an abrasive grain. 捻回強度試験の試験装置を示す図である。It is a figure which shows the testing apparatus of a twist strength test. 金属層の厚みを変えて捻回強度試験を行った結果を示す図である。It is a figure which shows the result of having changed the thickness of the metal layer and performing the twisting strength test. 金属層の厚みを変えて捻回強度試験を行った結果を示す図である。It is a figure which shows the result of having changed the thickness of the metal layer and performing the twisting strength test. 導電性粒子の有無による切断性能の違いを調査した結果を示す図である。It is a figure which shows the result of having investigated the difference in the cutting performance by the presence or absence of electroconductive particle. 導電性粒子の含有量を変えたときの切断性能の違いを調査した結果を示す図である。It is a figure which shows the result of having investigated the difference in cutting performance when changing content of electroconductive particle. 導電性粒子の平均粒径を変えたときの切断性能の違いを調査した結果を示す図である。It is a figure which shows the result of having investigated the difference in cutting performance when changing the average particle diameter of electroconductive particle. 金属層をレジンボンドの表面に島状に形成したときの捻回強度を示す図である。It is a figure which shows the twist strength when forming a metal layer in the shape of an island on the surface of a resin bond. 金属層をレジンボンドの表面に島状に形成したときの、導電性粒子の含有率を変えたときの切断性能の違いを調査した結果を示す図である。It is a figure which shows the result of investigating the difference in the cutting performance when changing the content rate of electroconductive particle when forming a metal layer in the shape of an island on the surface of a resin bond. 金属層をレジンボンドの表面に島状に形成したときの、導電性粒子の平均粒径を変えたときの切断性能の違いを調査した結果を示す図である。It is a figure which shows the result of having investigated the difference in the cutting performance when changing the average particle diameter of electroconductive particle when forming a metal layer in the shape of an island on the surface of a resin bond.

符号の説明Explanation of symbols

１ レジンボンドワイヤソー
２ 芯線
３ 砥粒
４ レジンボンド
５ 砥粒層
６ 金属層
１１ 導電性粒子 DESCRIPTION OF SYMBOLS 1 Resin bond wire saw 2 Core wire 3 Abrasive grain 4 Resin bond 5 Abrasive grain layer 6 Metal layer 11 Conductive particle

Claims (1)

砥粒を樹脂で結合した砥粒層が芯線の周囲に設けられたレジンボンドワイヤソーにおいて、レジンボンド表面からの砥粒突出し量が平均砥粒粒径の１０％以上４０％以下であり、前記レジンボンド中に導電性粒子が含有され、前記レジンボンド中に含有された導電性粒子の含有率が、レジンボンドと導電性粒子の合計体積の２体積％以上３０体積％以下であり、かつ前記導電性粒子の平均粒径が砥粒平均粒径の６０％以上９０％以下であって、前記導電性粒子は前記レジンボンドの表面に露出しており、この導電性粒子に対して電解めっきにより金属層が形成されていることによって、前記レジンボンドの表面に前記金属層が島状に形成されて、レジンボンド表面に前記砥粒突出し量の１０％以上４０％以下の厚みで前記金属層が被覆されていることを特徴とするレジンボンドワイヤソー。 In a resin bond wire saw in which an abrasive layer in which abrasive grains are bonded with a resin is provided around the core wire, the amount of abrasive protrusion from the resin bond surface is 10% or more and 40% or less of the average abrasive grain size, and the resin Conductive particles are contained in the bond, and the content of the conductive particles contained in the resin bond is 2% by volume to 30% by volume of the total volume of the resin bond and the conductive particles, and the conductive The average particle diameter of the conductive particles is 60% or more and 90% or less of the average particle diameter of the abrasive grains, and the conductive particles are exposed on the surface of the resin bond. by that the layers are formed, the metal layer is formed in an island shape on the surface of the resin-bonded, the metal layer of 10% to 40% of the thickness of the abrasive grains projecting amount resin bond surface coating Been Resin bond wire saw according to claim Rukoto.
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