JP2013500172A - Diamond wire saw - Google Patents

Diamond wire saw Download PDF

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JP2013500172A
JP2013500172A JP2012522773A JP2012522773A JP2013500172A JP 2013500172 A JP2013500172 A JP 2013500172A JP 2012522773 A JP2012522773 A JP 2012522773A JP 2012522773 A JP2012522773 A JP 2012522773A JP 2013500172 A JP2013500172 A JP 2013500172A
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wire
diamond
diamond particles
binder
wire saw
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チョン，ヨンファ
イ，ヒョンユン
リュ，ミンホ
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イルジン・ダイヤモンド・カンパニー・リミテッド
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0607—Wires

Abstract

本発明は、太陽光用シリコンインゴット（ｓｉｌｉｃｏｎ ｉｎｇｏｔ）を切断するのに適したダイヤモンドワイヤーソーに関し、特に、ワイヤー−ニッケル電着層−ダイヤモンド粒子の寸法の相関関係を最適化したダイヤモンドワイヤーソーに関する。The present invention relates to a diamond wire saw suitable for cutting a silicon ingot for sunlight, and more particularly, to a diamond wire saw optimized for a wire-nickel electrodeposition layer-diamond particle size correlation.

Description

本発明は、太陽光用シリコンインゴット（ｓｉｌｉｃｏｎ ｉｎｇｏｔ）を切断するのに適したダイヤモンドワイヤーソーに関し、特に、ワイヤー−ニッケル電着層−ダイヤモンド粒子の寸法の相関関係を最適化したダイヤモンドワイヤーソーに関する。   The present invention relates to a diamond wire saw suitable for cutting a silicon ingot for sunlight, and more particularly, to a diamond wire saw optimized for a wire-nickel electrodeposition layer-diamond particle size correlation.

従来のダイヤモンドワイヤーソーとしては、例えば、特許文献１に開示されたものが提案されている。   As a conventional diamond wire saw, for example, one disclosed in Patent Document 1 has been proposed.

従来のダイヤモンドワイヤーソーは、図２に示したように、ワイヤー１０と、結合剤１６を使用してワイヤー１０に付着された複数の個別コーティングされたダイヤモンド粒子１４から成る超研磨層１２とを有している。   A conventional diamond wire saw has a wire 10 and a superabrasive layer 12 composed of a plurality of individually coated diamond particles 14 attached to the wire 10 using a binder 16 as shown in FIG. is doing.

また、結合剤１６の表面とダイヤモンド粒子１４の最大の平均直径（平均直径）との間には、チップポケットが形成され、切断時に生じるチップ（切削屑）を外部に排出する通路として用いられる。   Further, a chip pocket is formed between the surface of the binder 16 and the maximum average diameter (average diameter) of the diamond particles 14, and is used as a passage for discharging chips (cutting chips) generated during cutting to the outside.

結合剤１６がニッケル電着層で具現される場合、ワイヤー１０に（−）、ニッケルイオン板に（＋）の電流を印加して、ニッケルが電着される時、ダイヤモンド粒子を引いてきて付着させる機能をする。   When the binder 16 is embodied by a nickel electrodeposition layer, a current of (−) is applied to the wire 10 and a (+) current is applied to the nickel ion plate, and when nickel is electrodeposited, diamond particles are attracted and adhered. The function to let you.

上記のようなワイヤーの直径ｗと、ダイヤモンド粒子の平均直径Ｄとの相関関係は、ニッケル電着時のダイヤモンド粒子を引いてくる力の強弱に影響を及ぼす。   The correlation between the diameter w of the wire as described above and the average diameter D of the diamond particles affects the strength of the force for pulling the diamond particles during nickel electrodeposition.

また、ダイヤモンド粒子の平均直径Ｄと、ニッケル電着層の表面の高さｘとの相関関係は、ニッケル電着層の結合度に影響を及ぼす。   In addition, the correlation between the average diameter D of the diamond particles and the height x of the surface of the nickel electrodeposition layer affects the degree of bonding of the nickel electrodeposition layer.

韓国公開特許第２００６-０１１８３９２号公報Korean Published Patent No. 2006-0118392

しかし、従来のダイヤモンドワイヤーソーにおいては、このようなｗ−Ｄ−ｘの寸法の相関関係の最適範囲は考慮されていなかった。   However, in the conventional diamond wire saw, such an optimal range of the correlation of the dimensions of wDx has not been considered.

本発明は、上記の問題を解決するために案出されたものであり、ワイヤー−ニッケル電着層−ダイヤモンド粒子の間の最適な相関関係を定立し、切削性能が向上されたダイヤモンドワイヤーソーを提供することに、その目的がある。   The present invention has been devised in order to solve the above-mentioned problems, and establishes an optimum correlation between wire-nickel electrodeposited layer-diamond particles, and provides a diamond wire saw with improved cutting performance. The purpose is to provide.

上記の目的を果たすべく、本発明の請求項１に記載したダイヤモンドワイヤーソーは、
ワイヤーと、前記ワイヤーの表面に形成される結合剤と、前記結合剤に付着される多数のダイヤモンド粒子とを有し、
前記ワイヤーの直径ｗ、結合剤の表面の高さｘおよびダイヤモンド粒子の平均直径Ｄの相関関係は、
０.１８ｗ≦Ｄ≦０.３ｗ、
０.４Ｄ≦ｘ≦０.７Ｄ
を満たすことが好ましい。 To achieve the above object, a diamond wire saw according to claim 1 of the present invention is provided.
A wire, a binder formed on the surface of the wire, and a number of diamond particles attached to the binder;
The correlation between the diameter w of the wire, the height x of the surface of the binder and the average diameter D of the diamond particles is
0.18w ≦ D ≦ 0.3w,
0.4D ≦ x ≦ 0.7D
It is preferable to satisfy.

本発明の請求項２に記載のダイヤモンドワイヤーソーにおいて、前記結合剤は、ニッケル電着層であることが好ましい。   In the diamond wire saw according to claim 2 of the present invention, the binder is preferably a nickel electrodeposition layer.

以上の説明から明らかなように、本発明の好ましい実施例によれば、下記のような効果を奏することができる。   As is apparent from the above description, according to a preferred embodiment of the present invention, the following effects can be obtained.

上記ワイヤーの直径ｗ、結合剤の表面の高さｘおよびダイヤモンド粒子の平均直径Ｄの相関関係で０.１８ｗ≦Ｄ≦０.３ｗの範囲内とし、ダイヤモンド粒子の均一な分布と電着速度およびワイヤーとダイヤモンド粒子の接着部分の接着強度を満たすことができる。   The relationship between the diameter w of the wire, the height x of the surface of the binder, and the average diameter D of the diamond particles is within the range of 0.18 w ≦ D ≦ 0.3 w. The bonding strength of the bonded portion of the wire and diamond particles can be satisfied.

また、０.４Ｄ≦ｘ≦０.７Ｄの範囲内とし、ソーイングの時、ダイヤモンド粒子の脱落を最大限に抑制させながらチップポケットの良好な機能で切削速度を高めることができる。   Further, the cutting speed can be increased with a good function of the chip pocket while suppressing the falling of the diamond particles to the maximum at the time of sawing, within the range of 0.4D ≦ x ≦ 0.7D.

本発明の好ましい実施例によるワイヤー−ニッケル電着層−ダイヤモンド粒子の寸法の相関関係を説明するダイヤモンドワイヤーソーを示す縦断面図である。It is a longitudinal cross-sectional view which shows the diamond wire saw explaining the correlation of the dimension of the wire-nickel electrodeposition layer-diamond particle | grains by the preferable Example of this invention. 従来のダイヤモンドワイヤーソーを示す縦断面図である。It is a longitudinal cross-sectional view which shows the conventional diamond wire saw.

以下、本発明の好ましい実施例を、添付の図面により説明するが、従来と同一部分については同じ参照符号を付け、詳細な説明は省略する。   Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. The same reference numerals are given to the same parts as those in the prior art, and detailed description thereof will be omitted.

図１は、本発明の好ましい実施例によるワイヤー−ニッケル電着層−ダイヤモンド粒子の寸法の相関関係を説明するダイヤモンドワイヤーソーを示す縦断面図である。   FIG. 1 is a longitudinal sectional view showing a diamond wire saw illustrating the correlation of wire-nickel electrodeposition layer-diamond particle size according to a preferred embodiment of the present invention.

図１に示したように、本発明の実施例によるワイヤーソーは、従来と同様に、所定の長さを有するワイヤー１０と、多数のダイヤモンド粒子１４と、ワイヤー１０にダイヤモンド粒子１４を結合支持する結合剤１６とで構成されている。   As shown in FIG. 1, the wire saw according to the embodiment of the present invention binds and supports the wire 10 having a predetermined length, a large number of diamond particles 14, and the diamond particles 14 bonded to the wire 10 as in the conventional case. It is composed of a binder 16.

ここで、結合剤１６は、ダイヤモンド粒子１４とダイヤモンド粒子１４との間にチップポケットが形成される高さが維持されるように、ニッケル電着層１６で具現されることが好ましい。   Here, the binder 16 is preferably implemented by the nickel electrodeposition layer 16 so that the height at which the chip pocket is formed between the diamond particles 14 is maintained.

上記のようなワイヤー１０、ニッケル電着層１６およびダイヤモンド粒子１４の間の寸法の相関関係により、耐久性と切削性能に影響を及ぼされる。   Durability and cutting performance are affected by the dimensional correlation between the wire 10, the nickel electrodeposition layer 16, and the diamond particles 14 as described above.

即ち、ワイヤーの直径ｗ、電着層の表面の高さｘおよびダイヤモンド粒子の平均直径Ｄの相関関係は、
０.１８ｗ≦Ｄ≦０.３ｗ
０.４Ｄ≦ｘ≦０.７Ｄ
に定立される場合、ダイヤモンドワイヤーソーの耐久性と切削性能をいずれも満たすことが確認された。 That is, the correlation between the diameter w of the wire, the height x of the surface of the electrodeposition layer, and the average diameter D of the diamond particles is
0.18w ≦ D ≦ 0.3w
0.4D ≦ x ≦ 0.7D
It was confirmed that both the durability and cutting performance of the diamond wire saw were satisfied.

１）ダイヤモンド粒子の平均直径Ｄとワイヤーの直径ｗとの相関関係
（ａ）Ｄ＜０.１８ｗの場合
電流密度がダイヤモンド粒子の重さよりも非常に大きい場合であり、ニッケルイオンがダイヤモンド粒子を引いてくる力が強いため、多くのダイヤモンド粒子を引いてきて、多数のダイヤモンド粒子が凝集する現象が生じ、製品としての機能を失う。 1) Correlation between the average diameter D of the diamond particles and the diameter w of the wire (a) When D <0.18w This is the case where the current density is much larger than the weight of the diamond particles, and nickel ions pull the diamond particles. Due to the strong force, many diamond particles are pulled, causing a phenomenon in which many diamond particles aggregate, resulting in loss of product function.

（ｂ）Ｄ＞０.３ｗの場合
電流密度がダイヤモンド粒子の重さよりも非常に弱い場合であり、ニッケルイオンがダイヤモンド粒子を引いてくる力が弱くなるため、電着速度が遅くなり、ダイヤモンド粒子とワイヤーの間の接触部分の接着強度が弱くなる問題がある。 (B) When D> 0.3w This is a case where the current density is much weaker than the weight of the diamond particles, and the force with which nickel ions pull the diamond particles becomes weak, so that the electrodeposition rate becomes slow, and the diamond particles There is a problem that the adhesive strength of the contact portion between the wire and the wire becomes weak.

したがって、０.１８ｗ≦Ｄ≦０.３ｗで具現すれば、ダイヤモンド粒子の凝集、遅い電着速度と弱い接着強度の問題などを相互に補って耐久性と切削性能が釣り合うようにする。   Therefore, if 0.18w ≦ D ≦ 0.3w, the durability and cutting performance are balanced by compensating for the problems of agglomeration of diamond particles, the problem of slow electrodeposition speed and weak adhesive strength.

２）ニッケル電着層１６の表面の高さｘとダイヤモンド粒子の平均直径Ｄとの相関関係
（ａ）ｘ＜０.４Ｄの場合
ニッケル電着層１６の表面の高さｘがワイヤー１０の直径ｗに近い薄い場合であり、ニッケル電着層１６に対するダイヤモンド粒子１４の結合力（維持力）に劣り、ソーイングの時（切断の時）に脱落しやすい。 2) Correlation between the surface height x of the nickel electrodeposition layer 16 and the average diameter D of the diamond particles (a) When x <0.4D The surface height x of the nickel electrodeposition layer 16 is the diameter of the wire 10 This is a thin case close to w, which is inferior in the bonding force (maintenance force) of the diamond particles 14 to the nickel electrodeposition layer 16 and easily drops off during sawing (cutting).

（ｂ）ｘ＞０.７Ｄの場合
ニッケル電着層１６の表面の高さｘがダイヤモンド粒子１４の平均直径Ｄに近い非常に厚い場合であり、ダイヤモンド粒子Ｄの表面を覆う形態を取っていて刃物が鈍くなるため、切削速度が低くなり、チップポケット（チップの排出流動性）の機能が顕著に低下する。 (B) When x> 0.7D This is a case where the surface height x of the nickel electrodeposition layer 16 is very thick, close to the average diameter D of the diamond particles 14, and the surface of the diamond particles D is covered. Since the blade becomes dull, the cutting speed is lowered, and the function of the tip pocket (tip discharge fluidity) is significantly reduced.

したがって、０.４Ｄ≦ｘ≦０.７Ｄで具現すれば、切削時のダイヤモンド粒子１４の脱落を最大限に抑制しながらダイヤモンド粒子１４の十分な鋭さを確保できるため、チップポケットの機能も円滑になる。   Therefore, if 0.4D ≦ x ≦ 0.7D, it is possible to ensure sufficient sharpness of the diamond particles 14 while maximizing the dropout of the diamond particles 14 at the time of cutting, so that the function of the chip pocket is also smooth. Become.

ワイヤー１０は、柔軟性および引張強度といった、ワイヤーソーの使用状況に耐えられる材料で形成することができる。本願発明で使用するのに好適なワイヤーは、例えば、高炭素鋼鉄、タングステン、銅などを含む鋼鉄のような金属ワイヤーである。ポリマー、炭素ナノチューブ、複合物、およびその他の材料のように現在公知であるか、開発途上であるその他の材料が使用されることもあった。   The wire 10 can be formed of a material that can withstand the use situation of the wire saw, such as flexibility and tensile strength. Suitable wires for use in the present invention are metal wires such as steel including, for example, high carbon steel, tungsten, copper and the like. Other materials that are currently known or are under development have been used, such as polymers, carbon nanotubes, composites, and other materials.

結合剤１６は、ワイヤーの表面に取り囲まれてダイヤモンドを固着支持するボンド（ｂｏｎｄ）であり、金属結合剤と、樹脂結合剤とに大別される。   The binder 16 is a bond that is surrounded by the surface of the wire and firmly supports diamond, and is roughly divided into a metal binder and a resin binder.

金属結合剤は、本実施例であるニッケル等の電着用であり、結束力に優れているが、製造時間が遅く、樹脂結合剤は、ダイヤモンド粒子を付着した樹脂（ｒｅｓｉｎ）であり、製造時間は早いが、結束力が弱い。   The metal binder is electrodeposition such as nickel in this example and has excellent binding power, but the production time is slow, and the resin binder is a resin (resin) with diamond particles attached, and the production time. Is fast, but the cohesion is weak.

上述したように、本発明の好ましい実施例を参照して説明したが、本発明の特許請求範囲に記載した思想および領域から脱しない範囲内で本発明を多様に変更または変形して実施することができることは、該当技術分野の当業者にとって自明なことである。   As described above, the present invention has been described with reference to the preferred embodiments thereof, but the present invention can be variously modified or modified without departing from the spirit and scope described in the claims of the present invention. It is obvious to those skilled in the relevant technical field that this can be done.

本発明は、ダイヤモンド粒子を用いて切断するワイヤーソーであれば、種々のワイヤーソーに適用可能である。   The present invention is applicable to various wire saws as long as the wire saw is cut using diamond particles.

１０ ワイヤー（芯線）
１４ ダイヤモンド粒子
１６ 結合剤
ｗ ワイヤーの直径
ｘ ニッケル電着層の表面の高さ
Ｄ ダイヤモンド粒子の平均直径 10 Wire (core wire)
14 Diamond particles 16 Binder w Wire diameter x Nickel electrodeposition surface height D Average diameter of diamond particles

Claims (2)

ワイヤーと、前記ワイヤーの表面に形成される結合剤と、前記結合剤に付着される多数のダイヤモンド粒子とを有し、
前記ワイヤーの直径ｗ、結合剤の表面の高さｘおよびダイヤモンド粒子の平均直径Ｄの相関関係は、
０.１８ｗ≦Ｄ≦０.３ｗ、
０.４Ｄ≦ｘ≦０.７Ｄ
を満たすことを特徴とするダイヤモンドワイヤーソー。 A wire, a binder formed on the surface of the wire, and a number of diamond particles attached to the binder;
The correlation between the diameter w of the wire, the height x of the surface of the binder and the average diameter D of the diamond particles is
0.18w ≦ D ≦ 0.3w,
0.4D ≦ x ≦ 0.7D
A diamond wire saw characterized by satisfying 前記結合剤は、ニッケル電着層である請求項１に記載のダイヤモンドワイヤーソー。   The diamond wire saw according to claim 1, wherein the binder is a nickel electrodeposition layer.
JP2012522773A 2009-11-03 2010-09-13 Diamond wire saw Pending JP2013500172A (en)

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KR1020090105331A KR20110048660A (en) 2009-11-03 2009-11-03 Diamond wire saw
KR10-2009-0105331 2009-11-03
PCT/KR2010/006211 WO2011055903A2 (en) 2009-11-03 2010-09-13 Diamond wire saw

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