CN102328352A - Cutting line for silicon wafer cutting - Google Patents
Cutting line for silicon wafer cutting Download PDFInfo
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- CN102328352A CN102328352A CN201110166586A CN201110166586A CN102328352A CN 102328352 A CN102328352 A CN 102328352A CN 201110166586 A CN201110166586 A CN 201110166586A CN 201110166586 A CN201110166586 A CN 201110166586A CN 102328352 A CN102328352 A CN 102328352A
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- line
- cutting
- cutting line
- cut
- silicon chip
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Abstract
The invention provides a cutting line for silicon wafer cutting, and the cutting line comprises a line body, wherein the peripheral surface of the line body is wrapped with a wear-resisting layer. In the invention, because the peripheral surface of the line body is wrapped with the wear-resisting layer, the occurrence of a situation that the line body is worn or part of the line body is worn is avoided; the cutting line provided by the invention can simultaneously cut a plurality of silicon wafers, the productive rate is high, the surface quality of a cut silicon wafer is higher, and the phenomenon of wafer disintegrating is uneasy to occur, thereby not only solving the problem of silicon-wafer material waste, but also solving the problems that the cutting line is easy to wear and short in service life; the cutting line provided by the invention facilitates the cooling of a cooling solution and can be used for avoiding the pollution to the environment caused by mortars, thereby improving the environmental performance; and the service life of the cutting line provided by the invention is prolonged.
Description
Technical field
The present invention relates to a kind of line of cut, particularly cut the line of cut that silicon chip is used, belong to the technical field of silicon chip cutting equipment.
Background technology
Along with the development of society, the maturation of photovoltaic industry, the use of silicon chip is more and more.Because silicon chip belongs to hard material, its cutting technique occupies very important position in processing technology.The mode of steel disc cutting is adopted in the cutting of traditional silicon chip, defectives such as this cutting mode exists that joint-cutting broad, volume recovery are low, surface figure accuracy difference and surface damage layer depth.In order to address the above problem, the line cutting has appearred recently, have the mortar of abrasive material through the line of cut supply; Realize the cutting of silicon chip through the abrasive wear principle between abrasive material, line of cut and the silicon crystal; This mode can realize the cutting of multi-disc silicon chip, and cutting efficiency is high, and the silicon chip surface quality is good; But owing to be between abrasive material and the cutting silk more friction to be arranged, the service life of cutting silk is shorter.
Summary of the invention
Technical problem to be solved by this invention provides the line of cut of a kind of long service life, cutting silicon chip simple in structure.
In order to solve the problems of the technologies described above, a kind of line of cut that cuts silicon chip of the present invention comprises the line body, and wherein, the external side face of said line coats wearing layer.
Above-mentioned a kind of line of cut that cuts silicon chip, wherein, the thickness of said wearing layer is 1-3um.
Above-mentioned a kind of line of cut that cuts silicon chip, wherein, said wearing layer is the wear-resistant ceramic layer.
The present invention is because the external side face of said line coats wearing layer, avoids the line body to be worn or part is worn, and the present invention can cut the multi-disc silicon chip simultaneously; Yield rate is high, and the silicon chip surface quality is higher, is not easy to occur the phenomenon of disintegrating tablet; The waste problem of the silicon sheet material that not only solves, and solved the line of cut easy abrasion, the problem that service life is short; And the present invention makes things convenient for the cooling of cooling fluid, avoids mortar that environment is polluted, and has improved environmental-protecting performance; Prolonged service life of the present invention.
Description of drawings
Fig. 1 is a structural representation of the present invention.
The specific embodiment
Below in conjunction with accompanying drawing the present invention is described further.
As shown in the figure, in order to solve the problems of the technologies described above a kind of line of cut that is used for the silicon chip cutting of the present invention; Comprise line body 1, said line body 1 outer peripheral face coats wearing layer 2, and wearing layer 2 is unrestricted; Can form by the wear-resistant paint coating, also can process by wearable ceramic coat.Wearable ceramic coat is a kind of nonmetal Binder Materials, and it is a kind of powdery ceramic material that adopts acidproof and alkaline-resisting artificial-synthetic material to process through strict process proportioning and advanced inorganic polymerization technique.At the construction field (site), special liquid inorganic glue water is added this material, adopt manual work or mechanical system to smear online body 1 surface; Through a series of chemical reaction, reach the bond strength and the hardness of pottery at normal temperatures behind the 3d, its main abrasive aggregates of wear-resistant paint, ultrafine powder and inorganic polymer dispersion liquid combine; Form behind the paint solidification, the present invention is because said line body 1 outer peripheral face coats wearing layer 2, avoids line body 1 to be worn or part is worn; The present invention can cut the multi-disc silicon chip simultaneously, and yield rate is high, and the silicon chip surface quality is higher; Be not easy to occur the phenomenon of disintegrating tablet, the waste problem of the silicon sheet material that not only solves, and solved the line of cut easy abrasion; The problem that service life is short, the thickness of said wearing layer 2 is unrestricted, and preferred wearing layer 2 thickness are 1-3um in the present embodiment.
Those of ordinary skill in the art will be appreciated that; Above embodiment is used for explaining the object of the invention; And be not with opposing qualification of the present invention; As long as in essential scope of the present invention, all will drop in the scope of claim of the present invention variation, the modification of the above embodiment.
Claims (3)
1. a line of cut that cuts silicon chip comprises the line body, it is characterized in that, the external side face of said line coats wearing layer.
2. a kind of according to claim 1 line of cut that cuts silicon chip is characterized in that the thickness of said wearing layer is 1-3um.
3. a kind of according to claim 1 line of cut that cuts silicon chip is characterized in that said wearing layer is the wear-resistant ceramic layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110166586A CN102328352A (en) | 2011-06-20 | 2011-06-20 | Cutting line for silicon wafer cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110166586A CN102328352A (en) | 2011-06-20 | 2011-06-20 | Cutting line for silicon wafer cutting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102328352A true CN102328352A (en) | 2012-01-25 |
Family
ID=45480450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110166586A Pending CN102328352A (en) | 2011-06-20 | 2011-06-20 | Cutting line for silicon wafer cutting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102328352A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH048660A (en) * | 1990-04-25 | 1992-01-13 | Hitachi Ltd | Air conditioner for vehicle |
| JPH10118938A (en) * | 1996-10-17 | 1998-05-12 | Osaka Diamond Ind Co Ltd | Super abrasive grain grinding wheel |
| JP2004174680A (en) * | 2002-11-28 | 2004-06-24 | Kanai Hiroaki | Fixed abrasive grain type saw wire and its abrasive grain fixing method |
| JP2006123024A (en) * | 2004-10-26 | 2006-05-18 | Nakamura Choko:Kk | Fixed abrasive grain type wire saw and its manufacturing method |
| JP2011098407A (en) * | 2009-11-05 | 2011-05-19 | Nakamura Choko:Kk | Wire saw and manufacturing method of wire saw |
| JP4703448B2 (en) * | 2006-03-22 | 2011-06-15 | 株式会社ノリタケスーパーアブレーシブ | Resin bond wire saw |
-
2011
- 2011-06-20 CN CN201110166586A patent/CN102328352A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH048660A (en) * | 1990-04-25 | 1992-01-13 | Hitachi Ltd | Air conditioner for vehicle |
| JPH10118938A (en) * | 1996-10-17 | 1998-05-12 | Osaka Diamond Ind Co Ltd | Super abrasive grain grinding wheel |
| JP2004174680A (en) * | 2002-11-28 | 2004-06-24 | Kanai Hiroaki | Fixed abrasive grain type saw wire and its abrasive grain fixing method |
| JP2006123024A (en) * | 2004-10-26 | 2006-05-18 | Nakamura Choko:Kk | Fixed abrasive grain type wire saw and its manufacturing method |
| JP4703448B2 (en) * | 2006-03-22 | 2011-06-15 | 株式会社ノリタケスーパーアブレーシブ | Resin bond wire saw |
| JP2011098407A (en) * | 2009-11-05 | 2011-05-19 | Nakamura Choko:Kk | Wire saw and manufacturing method of wire saw |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120125 |