CN104526497A - Sapphire sheet edge polishing method - Google Patents

Sapphire sheet edge polishing method Download PDF

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Publication number
CN104526497A
CN104526497A CN201410750443.2A CN201410750443A CN104526497A CN 104526497 A CN104526497 A CN 104526497A CN 201410750443 A CN201410750443 A CN 201410750443A CN 104526497 A CN104526497 A CN 104526497A
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CN
China
Prior art keywords
sapphire sheet
diamond
sapphire
polishing wheel
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410750443.2A
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Chinese (zh)
Other versions
CN104526497B (en
Inventor
邹余耀
尹玉龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NANJING SANCHAO DIAMOND TOOLS CO Ltd
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NANJING SANCHAO DIAMOND TOOLS CO Ltd
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Priority to CN201410750443.2A priority Critical patent/CN104526497B/en
Publication of CN104526497A publication Critical patent/CN104526497A/en
Application granted granted Critical
Publication of CN104526497B publication Critical patent/CN104526497B/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/16Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention relates to a sapphire sheet edge polishing method. The method polishes sapphire sheet edges through a diamond polishing wheel comprising a diamond wire lock and a base in the steps of Step one: stacking and fixing 50-100 square sapphire in the thickness of 0.2 mm-0.3 mm together; Step two: mounting the diamond polishing wheel on a shaft of a device, wherein the diamond polishing wheel is driven by the rotating shaft of the device to rotate at the speed not less than 2800 turns/minute; Step three: pouring cooling fluid water to sapphire sheet portions to be polished; Step four: slowly moving the shaft of the device to enable the diamond polishing wheel to perform profiling grinding on sapphire sheet edges along the shape tracks of sapphire sheets. The sapphire sheet edge polishing method can be used for grinding to eliminate burrs, dark spots and the like of the sapphire sheets, thereby achieving a very good polishing effect. The water coolant is directly used for removing grindings, so that the economical and environment friendly effects are obtained. Additionally, the method can polish multiple sapphire edges simultaneously, thereby greatly improving the polishing efficiency.

Description

A kind of sapphire sheet edge finishing method
Technical field
The present invention relates to mechanical grinding field, particularly relate to a kind of sapphire sheet edge finishing method.
Background technology
Along with global electronic consumer products high speed development, take Apple as some electronic product enterprises of representative, constantly release has innovation, leads the product of human lives's new paragon.The design of these products is produced, and make a lot of material obtain new application, such as sapphire material is with its high hardness and superior Electronic Performance, is used in mobile phone faceplate, Home key, cam lens protection screen etc.
Sapphire material hardness is high, fragility large, and sapphire ingot is still bottleneck to the polishing technology at sapphire sheet edge after cutting into circular or square thin slice.If adopt normal diamond grinding tool can apply larger grinding force to sapphire edge to sapphire edge, sapphire sheet is easy to cracked; According to abrasive pastes polishing fluid etc. because grinding force is little, do not reach ideal effect, efficiency is also very low.
Therefore design and a kind ofly can seem particularly important to the finishing method that sapphire sheet edge carries out efficient polishing.
Summary of the invention
The technical problem to be solved in the present invention is design a kind of sapphire sheet edge finishing method, realizes the burr to sapphire sheet edge, dim spot plays good polishing effect, improve polishing efficiency simultaneously.
For solving the problems of the technologies described above, sapphire sheet edge of the present invention finishing method, adopt diamond polishing wheel to carry out polishing to sapphire sheet edge, diamond polishing wheel comprises diamond wire tuft and matrix, and concrete steps are:
Step one: the square sapphire sheet being 0.2 ~ 0.3mm by 50 ~ 100 thickness is superimposed and fixes;
Step 2: diamond polishing wheel is assemblied in equipment axis, drive along with the rotation of equipment axis diamond polishing to take turns and rotate, the rotating speed of equipment axis is not less than 2800 revs/min;
Step 3: in sapphire sheet grinding position water flowing cooling fluid, abrasive dust is also discharged in cooling grinding position;
Step 4: slowly mobile device axle makes diamond polishing wheel carry out profile copy grinding along sapphire sheet shape track to edge.
Further, diamond polishing wheel excircle is evenly arranged diamond wire tuft, diamond wire tuft one end is fixed on matrix excircle and edge and its lateral surface vertical direction, the loose free shape length of the other end 30 ~ 80mm, get rid of abrasive dust in time when gap between diamond wire tuft is beneficial to grinding sapphire sheet, improve quality of finish.
Further, matrix is by nylon or other plastics, the middle circulus having axis hole of metal material processing one-tenth.
Further, diamond wire tuft fixedly forms by after the consistent integrated tuft of diamond wire of 10 ~ 20 length.
Further, diamond wire is that diamond particle is evenly fixed on steel wire by electroless nickel layer.
Further, diamond particles is the diamond single crystal particle of particle diameter 4 ~ 40 μm through surface metalation, and steel wire is diameter is the high-tensile B alloy wire of 0.08 ~ 0.5mm.
Further, equipment axis can clockwise and counterclockwise Double-directional rotary.
Further, this finishing method also comprises the steps:
Step 5: inching equipment axis moves and regulates diamond polishing wheel position, moves, make the complete grinding in sapphire sheet edge with the speed of 1mm/s along grinding track;
Step 6: rotate polishing sapphire sheet after one week at diamond polishing wheel, is set to inhour mutually by diamond polishing wheel and rotates polishing sapphire sheet one week.
Further, the step 4 in said method can substitute by following steps: sapphire sheet slowly moved to diamond polishing wheel and rotate with 100 revs/min of profilings.
Time in working order, diamond polishing is taken turns by peg-in-hole assembly in equipment axis, diamond polishing wheel is driven to rotate with the rotating speed being not less than 2800 revs/min by equipment axis, the diamond wire tuft of diamond polishing wheel cylindrical contacts with the edge of sapphire sheet, diamond wire tuft plates attached diamond particle and does grinding to sapphire sheet edge, and diamond wire tuft and sapphire sheet edge realize profile copy grinding.
Beneficial effect of the present invention: after adopting such finishing method, grinding can eliminate sapphire sheet edge burr, dim spot etc., play good polishing effect, holding surface shape is consistent, improves the quality of products, solves a difficult problem for sapphire sheet edge polishing.Direct water coolant gets rid of abrasive dust, economic environmental protection.In addition, can realize during the work of diamond polishing wheel doing polishing to multi-disc sapphire edge simultaneously, improve polishing efficiency more than 3 times than oil-soluble abradant polishing solution.
Accompanying drawing explanation
Below in conjunction with accompanying drawing the specific embodiment of the present invention done and illustrate further.
Fig. 1 is sapphire sheet edge of the present invention polishing schematic diagram.
Fig. 2 is the top view of diamond polishing wheel.
Fig. 3 is the B-B sectional view of Fig. 2.
Fig. 4 is the structural representation of diamond wire.
Detailed description of the invention
Composition graphs 1, Fig. 2, Fig. 3 and Fig. 4, the present embodiment employing external diameter is the diamond polishing wheel 1 of 180mm, and axis hole 6 diameter is 30mm.Diamond wire by a diameter be 0.12mm steel wire 8 on electroless nickel layer 7 diamond particle 4 of fixing the surface metalation of particle diameter 5 μm form, 10 diamond wires are assembled the diamond wire tuft 3 that one end is arranged in the loose free shape that matrix 5 excircle is fixed, the other end keeps 35mm long.
In the present embodiment, following steps are taked to carry out polishing to sapphire sheet 2 edge:
Step one: the square sapphire sheet 2 being 0.3mm by 70 thickness is superimposed and fixes;
Step 2: diamond polishing wheel 1 is assemblied in equipment axis 9, and the rotating speed of set device axle 9 is 2850 revs/min, diamond polishing wheel 1 rotates under the drive of equipment axis 9;
Step 3: in sapphire sheet 2 grinding position water flowing cooling fluid;
Step 4: by equipment axis 9 to the sapphire sheet 2 edge slowly movement be fixed on fixture, the diamond wire tuft 3 that diamond polishing takes turns 1 excircle arrangement contacts sapphire sheet 2 and does profile copy grinding, diamond particle on diamond wire tuft 34 pairs of sapphire sheet 2 edges do polishing action, and in grinding process, water coolant gets rid of abrasive dust;
Step 5: inching equipment axis 9 moves takes turns 1 position to diamond polishing and regulate, and moves, make the complete grinding in sapphire sheet 2 edge with the speed of 1mm/s along grinding track.
Step 6: diamond polishing wheel 1 turned clockwise polishing sapphire sheet after 2 one weeks, diamond polishing wheel 1 is rotated counterclockwise polishing sapphire sheet 2 one weeks, exits polishing wheel 1 and shuts down.
Certainly, in the present embodiment, step 4 following steps substitute and also can reach identical polishing effect: sapphire sheet 2 is slowly mobile and rotate with 100 revs/min of profilings to diamond polishing wheel 1.
After polishing, sapphire sheet 2 edge roughness is 0.4 μm, and the polishing time used is 10 minutes.

Claims (9)

1. a sapphire sheet edge finishing method, adopts diamond polishing wheel (1) to carry out polishing to sapphire sheet (2) edge, and described diamond polishing wheel (1) comprises diamond wire tuft (3) and matrix (5), and concrete steps are:
Step one: be that the square sapphire sheet (2) of 0.2 ~ 0.3mm is superimposed and fixes by 50 ~ 100 thickness;
Step 2: diamond polishing is taken turns (1) and is assemblied in equipment axis (9), drive along with the rotation of equipment axis (9) diamond polishing to take turns (1) and rotate, the rotating speed of equipment axis (9) is not less than 2800 revs/min;
Step 3: in sapphire sheet (2) grinding position water flowing cooling fluid, cooling grinding position is side by side except abrasive dust;
Step 4: slowly mobile device axle (9) makes diamond polishing wheel (1) carry out profile copy grinding along sapphire sheet (2) shape track to edge.
2. sapphire sheet edge according to claim 1 finishing method, it is characterized in that: described diamond polishing wheel (1) excircle is evenly arranged diamond wire tuft (3), described diamond wire tuft (3) one end is fixed on matrix (5) excircle and edge and its lateral surface vertical direction, the loose free shape length of the other end 30 ~ 80mm.
3. sapphire sheet edge according to claim 1 and 2 finishing method, is characterized in that: described matrix (5) is by nylon or other plastics, the middle circulus having axis hole (6) of metal material processing one-tenth.
4. sapphire sheet edge according to claim 1 and 2 finishing method, is characterized in that: described diamond wire tuft (3) fixedly forms by after the consistent integrated tuft of diamond wire of 10 ~ 20 length.
5. sapphire sheet edge according to claim 4 finishing method, is characterized in that: described diamond wire is that diamond particle (4) is evenly fixed on steel wire (8) by electroless nickel layer (7).
6. sapphire sheet edge according to claim 5 finishing method, it is characterized in that: described diamond particles (4) is the diamond single crystal particle of particle diameter 4 ~ 40 μm through surface metalation, described steel wire (8) is diameter is the high-tensile B alloy wire of 0.08 ~ 0.5mm.
7. sapphire sheet edge according to claim 1 finishing method, is characterized in that: described equipment axis (9) can clockwise and counterclockwise Double-directional rotary.
8. according to claim 1,2, sapphire sheet edge finishing method according to any one of 5-7, it is characterized in that: also comprise the steps:
Step 5: inching equipment axis (9) is mobile to be regulated diamond polishing wheel (1) position, moves, make the complete grinding in sapphire sheet (2) edge with the speed of 1mm/s along grinding track;
Step 6: rotate polishing sapphire sheet after (2) one weeks at diamond polishing wheel (1), is set to inhour mutually and rotates polishing sapphire sheet (2) one weeks by diamond polishing wheel (1).
9. sapphire sheet edge according to claim 8 finishing method, is characterized in that: described step 4 can substitute by such as under type: sapphire sheet (2) slowly moved to diamond polishing wheel (1) and rotate with 100 revs/min of profilings.
CN201410750443.2A 2014-12-10 2014-12-10 Sapphire sheet edge polishing method Active CN104526497B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410750443.2A CN104526497B (en) 2014-12-10 2014-12-10 Sapphire sheet edge polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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CN104526497B CN104526497B (en) 2017-01-25

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106271942A (en) * 2015-05-20 2017-01-04 蓝思科技股份有限公司 The contour processing method of sapphire substrate and the emery wheel containing boart boart
CN111805307A (en) * 2020-06-23 2020-10-23 深圳莱宝高科技股份有限公司 Substrate edge-scanning process and substrate processing method

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5274959A (en) * 1991-06-05 1994-01-04 Texas Instruments Incorporated Method for polishing semiconductor wafer edges
JP2009178785A (en) * 2008-01-30 2009-08-13 Seiko Instruments Inc Method and apparatus of polishing crystal wafer
CN201659472U (en) * 2010-03-08 2010-12-01 淮安圣科智能机械制造有限公司 Grinding and polishing wheel water spraying device for hydraulic drill grinding and polishing machine
CN201989010U (en) * 2011-01-18 2011-09-28 廊坊市北方天宇机电技术有限公司 Inner thread surface treatment device
CN102806501A (en) * 2012-07-23 2012-12-05 郑春晓 Grinding tool for end face grinding and multi-piece mirror glass laminating processing method thereof
CN103158060A (en) * 2011-12-16 2013-06-19 旭硝子株式会社 Grinding brush, grinding method of end surface of glass substrate, production method of glass substrate
CN203527216U (en) * 2013-09-18 2014-04-09 睿志达光电(成都)有限公司 Automatic polishing device for hole site of glass panel

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5274959A (en) * 1991-06-05 1994-01-04 Texas Instruments Incorporated Method for polishing semiconductor wafer edges
JP2009178785A (en) * 2008-01-30 2009-08-13 Seiko Instruments Inc Method and apparatus of polishing crystal wafer
CN201659472U (en) * 2010-03-08 2010-12-01 淮安圣科智能机械制造有限公司 Grinding and polishing wheel water spraying device for hydraulic drill grinding and polishing machine
CN201989010U (en) * 2011-01-18 2011-09-28 廊坊市北方天宇机电技术有限公司 Inner thread surface treatment device
CN103158060A (en) * 2011-12-16 2013-06-19 旭硝子株式会社 Grinding brush, grinding method of end surface of glass substrate, production method of glass substrate
CN102806501A (en) * 2012-07-23 2012-12-05 郑春晓 Grinding tool for end face grinding and multi-piece mirror glass laminating processing method thereof
CN203527216U (en) * 2013-09-18 2014-04-09 睿志达光电(成都)有限公司 Automatic polishing device for hole site of glass panel

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106271942A (en) * 2015-05-20 2017-01-04 蓝思科技股份有限公司 The contour processing method of sapphire substrate and the emery wheel containing boart boart
CN111805307A (en) * 2020-06-23 2020-10-23 深圳莱宝高科技股份有限公司 Substrate edge-scanning process and substrate processing method
CN111805307B (en) * 2020-06-23 2021-12-10 深圳莱宝高科技股份有限公司 Substrate edge-scanning process and substrate processing method

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Address after: 211124, Jiangning Road, Chunhua District, Jiangsu City, Nanjing Province, Ze Cheng Road, No. 77

Applicant after: NANJING SANCHAO ADVANCED MATERIALS CO., LTD.

Address before: 211124 tea hillock, Tu Town, Jiangning District, Jiangsu, Nanjing

Applicant before: Nanjing Sanchao Diamond Tools Co., Ltd.

COR Change of bibliographic data

Free format text: CORRECT: APPLICANT; FROM: NANJING SANCHAO DIAMOND TOOLS CO., LTD. TO: NANJING SANCHAO ADVANCED MATERIALS CO., LTD.

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