JP2004216553A - Manufacturing method for super-abrasive grain wire saw - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To supply a long-life super-abrasive grain wire saw that prevents a bonding material from stripping caused by a drop of super-abrasive grains to enable high-accuracy and high-efficiency slicing of the fixed super-abrasive grain wire saw. <P>SOLUTION: The projected area of the super-abrasive grains D occupies more than 5% and less than 55% of the surface area of a core wire W of the super-abrasive grain wire saw P where the super-abrasive grains D are fixed on the core wire W by the bonding material R. The projected area of the super-abrasive grains D is controlled to occupy more than 5% and less than 55% of the surface area of the core wire W by changing the mixture ratio of the super-abrasive grains D and the bonding material R. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

  The present invention relates to a fixed-grain type superabrasive wire saw used for cutting a silicon wafer from a silicon ingot and for cutting optical glass, ceramics, quartz, ferrite, neodymium magnets, and the like, and a method of manufacturing the same.

  Conventionally, in order to obtain a silicon wafer by slicing a silicon ingot, a diamond inner peripheral blade has been mainly used. However, as the diameter of the silicon ingot has increased, it has become difficult to slice the silicon ingot using the diamond inner peripheral blade. Further, in the slicing process of the silicon ingot, it has been required to improve the yield, improve the productivity, and reduce the damaged layer. For this reason, a slicing process called a multi-wire saw method for supplying a slurry in which free abrasive grains and a grinding fluid are mixed to a wire has come to be used frequently.

  The multi-wire saw method can be applied to slicing of a large-diameter silicon ingot by adjusting the interval between the grooved main rollers serving as wire guides. The multi-wire saw method is a method capable of slicing 200 or more wafers at a time. However, in the multi-wire saw method, since a slurry is used, there is a problem that the processing speed is lower than that of the diamond inner peripheral blade. Further, in the multi-wire saw method, since a large amount of sludge, which is a mixture of slurry and cutting powder, is generated, there is a problem that the wafer needs to be cleaned, which increases the manufacturing cost. Further, there is a problem that the sludge contaminates the machine and its surroundings, and significantly impairs the working environment.

  In order to solve these problems, it has been proposed to slicing a silicon ingot using a fixed abrasive type diamond wire saw in which diamond abrasive grains are fixed to a core wire. This diamond wire saw has extremely good sharpness, does not require a slurry, and can use a water-soluble or water-insoluble grinding fluid, so that contamination of the machine and its surroundings can be reduced, and the working environment can be reduced. It has the advantage that it can be improved. In addition, since a long diamond wire saw having a length of several hundred meters or several tens km can be manufactured, a large number of wafers can be sliced at a time. Thus, a cutting speed several times or more can be obtained.

  A fixed abrasive type diamond wire saw has been proposed in Japanese Patent Application Laid-Open No. 8-126953. This diamond wire saw is made of a material made of polyethylene, nylon, polyester, or the like, or a material reinforced with glass fiber or carbon fiber as a core wire, and diamond abrasive grains are applied around the core wire with a synthetic resin adhesive or electrodeposition. It is stuck.

Further, another diamond wire saw has been proposed in Japanese Patent Application Laid-Open No. 9-155631. This diamond wire saw has a monofilament or a multifilament such as carbon fiber, aramid fiber, alumina fiber, boron fiber, silicon carbide fiber, or silicon-titanium-carbon-oxygen inorganic fiber as a core wire, and has a diamond abrasive grain around the core wire. Is fixed by plating or a synthetic resin binder.
JP-A-8-126953 JP-A-9-155563

  However, when slicing a silicon ingot using a fixed abrasive type diamond wire saw proposed in the above-mentioned publication, there is a problem that the diamond abrasive particles fall off and finally the binder is peeled off. Due to the peeling of the binder, the cutting speed in the slicing process is sharply reduced, and the life of the diamond wire saw is shortened.

  Therefore, an object of the present invention is to provide a long-life super-abrasive wire saw that prevents slicing with high accuracy and high efficiency by preventing separation of a binder due to the drop of super-abrasive grains such as diamond abrasive grains. It is to be.

  The method of manufacturing a superabrasive wire saw according to the present invention includes a step of producing a superabrasive wire saw in which superabrasive grains are fixed to a surface of a core material with a bonding material; If the ratio of the projected area of the super-abrasive grains to the surface area of the core material is within a predetermined range, the super-abrasive wire saw is determined to be non-defective, and the projected area of the super-abrasive grains is the surface area of the core material. And determining that the superabrasive wire saw is defective if the proportion of the wire saw is out of a predetermined range.

  The method of manufacturing a superabrasive wire saw according to the present invention includes a step of producing a superabrasive wire saw in which superabrasive grains are fixed to a surface of a core material with a bonding material; The step of measuring the area, and if the ratio of the projected area of the superabrasive grains to the surface area of the core material is 5% or more and 55% or less, the superabrasive wire saw is determined to be good, and the projected area of the superabrasive grains is Determining that the superabrasive wire saw is defective if the proportion of the surface area is less than 5% or more than 55%.

  According to the superabrasive wire saw according to the present invention, in a superabrasive wire saw in which superabrasive grains are fixed to the surface of a core wire with a binder, the ratio of the projected area of the superabrasive grains to the surface area of the core wire is 5% or more and 55%. It is characterized by the following.

  In the superabrasive wire saw of the present invention, the ratio of the projected area of the superabrasive grains to the surface area of the core wire is preferably 10% or more and 50% or less.

  Further, in the superabrasive wire saw of the present invention, the particle diameter of the superabrasive grains is preferably 5 μm or more and 200 μm or less.

  In the superabrasive wire saw of the present invention, the binder is preferably a resin bond, and the superabrasive is preferably a diamond abrasive or a cubic boron nitride abrasive.

  In the superabrasive wire saw of the present invention, the core wire is a steel wire, one of a copper-plated steel wire or a brass-plated steel wire, or a carbon fiber, an aramid fiber, a boron fiber, or a glass fiber. Preferably, it is made of any single wire or stranded wire.

  In the superabrasive wire saw of the present invention, the binder preferably contains at least one kind of particle of diamond, cubic boron nitride, silicon carbide, silicon nitride, or cemented carbide having a particle size of 1 μm or more and 10 μm or less.

  The method of manufacturing a superabrasive wire saw according to the present invention is a method of manufacturing a superabrasive wire saw in which superabrasive grains are fixed to a surface of a core wire with a binder, by changing a mixing ratio of the superabrasive grains and the binder. The ratio of the projected area of the superabrasive grains to the surface area of the core wire is controlled to 5% or more and 55% or less.

  As described above, since the superabrasive wire saw of the present invention does not cause peeling of the binder due to the superabrasive grains falling off, it exhibits good sharpness over a long period of time, and can efficiently perform multi-slicing processing of a silicon ingot or the like. It can be performed with high precision.

  A feature of the superabrasive wire saw of the present invention is that the ratio of the projected area of the superabrasive grains to the surface area of the core wire (hereinafter referred to as “superabrasive grain projected area occupancy”) is 5% or more and 55% or less. .

  If the superabrasive grain projected area occupancy is less than 5%, the binder is peeled off, and the life of the superabrasive wire saw is significantly shortened. This is because the number of working abrasive grains decreases and the grinding resistance per superabrasive grain increases, so that the superabrasive grains fall off and eventually the binder is peeled off. Also, if the super-abrasive projected area occupation ratio is less than 5%, the exposed area of the binder increases, so that the binder comes into contact with the workpiece during slicing, whereby the binder recedes quickly. And eventually causes a phenomenon that the binder is peeled off.

  If the super-abrasive grain projected area occupancy is less than 5%, it is expected that peeling of the binder will occur at a cumulative length of 3% or more of the length of the super-abrasive wire saw. When the peeling of the binder occurs at a cumulative length of 3% or more with respect to the length of the superabrasive wire saw, the peeling of the binder proceeds rapidly, the sharpness decreases, and finally, the superabrasive wire saw is Reach life.

  When the superabrasive grain projected area occupancy is 5% or more and less than 10%, it is expected that the binder will be peeled off at a cumulative length of about 1% with respect to the length of the superabrasive wire saw. This degree of binder release has little effect on the performance of the superabrasive wire saw. In addition, not only does the sharpness not decrease, but also the peeling of the binder does not proceed.

  If the superabrasive grain projected area occupancy exceeds 55%, the peeling of the bonding material does not occur, but the number of working abrasive grains is too large, clogging of cutting powder is likely to occur, and the processing efficiency is remarkable. descend.

  In consideration of the life and sharpness of the superabrasive wire saw, the superabrasive grain projected area occupancy is preferably 10% or more and 50% or less, more preferably 10% or more and 40% or less.

  One embodiment of the superabrasive wire saw of the present invention will be described with reference to FIGS. FIG. 1 is a schematic partial longitudinal sectional view of a superabrasive wire saw P in a longitudinal direction. FIG. 2 is a schematic cross-sectional view of a superabrasive wire saw. FIG. 3 is an enlarged schematic diagram of FIG. 1B. As shown in FIGS. 1 to 3, a large number of superabrasive grains D are fixed by a bonding material R on the outer peripheral surface of a core wire W having a diameter d. The binder R includes a filler F.

  Next, the definition of the super-abrasive grain projected area occupancy will be described with reference to FIG. In FIG. 1, n superabrasive grains D are fixed on the outer peripheral surface of a core wire W having a diameter d per unit length L of the superabrasive wire saw P. Assuming that the projected area of each superabrasive grain D is A1, A2, A3,..., An, the superabrasive grain projected area occupancy C is represented by the following equation.

  In practice, the super-abrasive grain projected area occupancy represented by the above equation is measured as follows.

  First, the number n of superabrasive grains D fixed per unit length L of the superabrasive wire saw P is examined using an optical microscope. The superabrasive D is regarded as a sphere having an average particle diameter d0, and the ratio of the projected area of the sphere to the surface area of the core wire W is defined as the superabrasive projected area occupancy. The super abrasive grains D projected on the surface of the core wire W are elliptical, but are calculated assuming that they are circular.

  That is, in the actual calculation of the super-abrasive grain projected area occupancy, it is assumed that n super-abrasive grains D equal to the average particle diameter d0 are fixed on the outer peripheral surface of the core wire W, and the n The total projected area of the grains D is calculated by the following equation.

  By substituting the value of equation (2) into equation (1), the superabrasive grain projected area occupancy C is calculated.

  In addition, the super-abrasive grain projected area occupancy can be basically controlled by changing the mixing ratio of the super-abrasive and the binder.

  The superabrasive wire saw of the present invention can be used for a cutting device shown in FIG. 4 as an example. The superabrasive wire saw cutting device is an apparatus for slicing a workpiece into a large number of pieces at a time while pressing a number of superabrasive wire saws against the workpiece and reciprocating the superabrasive wire saw. Attempts have been made to use a superabrasive wire saw cutting device for slicing a silicon wafer from a large diameter silicon ingot, cutting magnetic materials such as ferrite and neodymium magnets, and cutting optical glass.

  More specifically, as shown in FIG. 4, grooves are provided on the outer peripheral surfaces of the main rollers 5 and 6 according to the cut dimensions of the workpiece. The superabrasive wire saw 1 is wound around the outer peripheral surfaces of the reels 2 and 9. The superabrasive wire saw 1 taken out from one of the reels 2 via the guide rollers 3 and 4 is sequentially wound around the grooves of the main rollers 5 and 6, and passed through the guide rollers 7 and 8 to the other reel 9. It is wound up. The tension of the superabrasive wire saw 1 is set to a predetermined value by the torque of the main rollers 5 and 6 arranged on the left and right. While the superabrasive wire saw 1 reciprocates between the reels 2 and 9, a large number of superabrasive wire saws 1 are pressed against the workpiece 10 to perform slicing of the workpiece 10 into a large number of pieces at a time. At this time, the grinding fluid is supplied to the grooves of the main rollers 5 and 6 from the nozzles 11 and 12.

  As the superabrasive grains, it is possible to apply superabrasive grains of any particle size. In particular, when using a superabrasive wire saw for precision cutting of silicon ingots, optical glass, ceramics, quartz, ferrite, neodymium magnets, etc., it is preferable to use superabrasive grains having a particle size of 5 μm or more and 200 μm or less, preferably 10 μm or more. It is more preferable to use superabrasive grains of 150 μm or less.

  It is preferable to use a resin bond as the binder. Resins that can be used as a resin bond include alkyd resins, phenol resins, formalin resins, polyurethane resins, polyester resins, polyimide resins, epoxy resins, melamine resins, and urea from the viewpoints of elastic modulus, softening temperature, moldability, and physical properties. Resins, unsaturated polyester resins, acrylic resins, polyester imide resins, polyamide imide resins, polyester urethane resins, bismaleimide resins, bismaleimide triazine resins, cyanatoester resins, polyetherimides, polyparabanic acids, aromatic polyamides and the like are preferred.

  As the core wire, any one of a steel wire, a copper-plated steel wire, and a brass-plated steel wire can be used.

  As a steel wire, a piano wire which can be easily formed into a fine wire and has high strength is most preferable. The piano wire can be used as it is, but in order to facilitate storage and improve the adhesion of the resin bond and increase the holding power of superabrasives, the surface of the piano wire must be plated with copper or brass. Preferably, a treatment is applied.

  As the core wire of another material, any one kind of single wire or stranded wire of carbon fiber, aramid fiber, boron fiber, and glass fiber can be used. Alternatively, a stranded wire obtained by mixing two or more fibers among carbon fibers, aramid fibers, boron fibers, and glass fibers can be used. Further, a stranded wire obtained by adding a steel wire to these stranded wires can be used as the core wire.

  In the superabrasive wire saw of the present invention, the bonding material is one or two or more particles of diamond, cubic boron nitride, silicon carbide, silicon nitride, or a cemented carbide having a particle size of 1 μm or more and 10 μm or less. It is preferred to contain.

  It is extremely effective to include these particles (fillers) for the purpose of improving the strength and wear resistance of the binder layer and improving the life, processing efficiency and cutting performance of the superabrasive wire saw. Among these particles, the harder the particles, the greater the effect, and the binder preferably contains diamond and cubic boron nitride, and most preferably contains diamond.

(Example 1)
A phenolic resin paint (manufactured by Showa Kobunshi Co., Ltd. in which BRP-5417 was dissolved in cresol), a diamond filler having an average particle size of 2.6 μm (manufactured by Tomei Diamond Co., IRM), and a particle size of 40 to 60 μm (average particle size) Nickel-coated diamond abrasive grains (42 μm in diameter, manufactured by Tomei Diamond Co., Ltd., IRM-NP) were uniformly mixed so that the respective solid content ratios became 60% by volume, 5% by volume, and 35% by volume. Further, a solvent, cresol, was added to this mixture to adjust the amount of the solvent in the abrasive grains to 50% by volume.

  Next, this abrasive grain dispersion solution was applied to a copper-plated piano wire having an outer diameter of 0.18 mm, and the coated copper-plated piano wire was passed through a die having an inner diameter of 0.28 mm. The diamond wire saw was manufactured by baking and hardening in a baking furnace. The outer diameter of the obtained diamond wire saw was 0.24 mm, and the thickness of the resin bond layer formed by baking hardening was about 20 μm.

  At any 50 locations of the obtained diamond wire saw, a microphotograph at a magnification of 100 was taken to investigate the average number of fixed diamond abrasive grains, and the projected area occupancy of the superabrasive grains was determined according to the equations (1) and (2). The calculated value was 47.3%.

  This diamond wire saw was attached to a cutting device shown in FIG. 4, and a silicon ingot was sliced to perform a performance investigation. The main rollers 5 and 6 of the cutting device have an outer diameter of 200 mm and a width of 180 mm, and are provided with 123 grooves on the outer peripheral surface at a groove pitch of 1.21 mm. A diamond wire saw is wound on the reels 2 and 9 at a winding pitch of 0.6 mm for a length of 50 km. The slicing conditions were as follows: the linear speed of the diamond wire saw was 1200 mm / min, the cutting speed was 4 mm / min, the tension was 29 N, and the supply of the water-insoluble grinding fluid was 30 liter / min.

  With respect to an arbitrary length of 140 m of the diamond wire saw after the slicing process, the peeled length of the resin bond was examined with an optical microscope, and the total length was defined as the peeled length. As a result, no peeling could be confirmed.

(Example 2)
A phenolic resin paint (manufactured by Showa Kobunshi Co., Ltd. in which BRP-5417 was dissolved in cresol), a diamond filler having an average particle size of 2.6 μm (manufactured by Tomei Diamond Co., IRM), and a particle size of 40 to 60 μm (average particle size) Nickel-coated diamond abrasive particles (diameter: 42 μm) (manufactured by Tomei Diamond Co., Ltd., IRM-NP) were uniformly mixed so that the solid content ratio was 60% by volume, 20% by volume, and 20% by volume, respectively. Further, a solvent, cresol, was added to this mixture to make the amount of the solvent in the coating material 50% by volume.

  A diamond wire saw was manufactured in the same manner as in Example 1, and the projected area occupancy of the superabrasive grains was investigated. As a result, it was 24.7%. In addition, the same performance test as in Example 1 was performed, but no peeling of the resin bond was observed.

(Example 3)
A phenolic resin paint (manufactured by Showa Kobunshi Co., Ltd. in which BRP-5417 was dissolved in cresol), a diamond filler having an average particle size of 2.6 μm (manufactured by Tomei Diamond Co., IRM), and a particle size of 40 to 60 μm (average particle size) Nickel-coated diamond abrasive grains (42 μm in diameter, IRM-NP, manufactured by Tomei Diamond Co., Ltd.) were uniformly mixed so that the respective solid content ratios became 60% by volume, 22% by volume, and 18% by volume. Further, a solvent, cresol, was added to this mixture to make the amount of the solvent in the coating material 50% by volume.

  A diamond wire saw was manufactured in the same manner as in Example 1, and the projected area occupancy of the superabrasive grains was investigated. As a result, it was 14.5%. In addition, the same performance test as in Example 1 was performed, but no peeling of the resin bond was observed.

(Example 4)
A phenolic resin paint (manufactured by Showa Kobunshi Co., Ltd. in which BRP-5417 was dissolved in cresol), a diamond filler having an average particle size of 2.6 μm (manufactured by Tomei Diamond Co., IRM), and a particle size of 40 to 60 μm (average particle size) Nickel-coated diamond abrasive grains (42 μm in diameter, IRM-NP, manufactured by Tomei Diamond Co., Ltd.) were uniformly mixed so that the respective solid content ratios became 60% by volume, 24% by volume, and 16% by volume. Further, a solvent, cresol, was added to this mixture to make the amount of the solvent in the coating material 50% by volume.

  A diamond wire saw was manufactured in the same manner as in Example 1, and the projected area occupancy of the superabrasive grains was examined. As a result, it was 9.8%. In addition, when a performance test similar to that of Example 1 was performed, the cumulative peel length of the resin bond was 0.5 m.

(Example 5)
A phenolic resin paint (manufactured by Showa Kobunshi Co., Ltd. in which BRP-5417 was dissolved in cresol), a diamond filler having an average particle size of 2.6 μm (manufactured by Tomei Diamond Co., IRM), and a particle size of 40 to 60 μm (average particle size) Nickel-coated diamond abrasive particles (42 μm in diameter, manufactured by Tomei Diamond Co., Ltd., IRM-NP) were uniformly mixed such that the solid content ratio was 60% by volume, 26% by volume, and 14% by volume, respectively. Further, a solvent, cresol, was added to this mixture to make the amount of the solvent in the coating material 50% by volume.

  A diamond wire saw was manufactured in the same manner as in Example 1, and the projected area occupancy of the superabrasive grains was investigated. The result was 6.2%. In addition, when the same performance investigation as in Example 1 was performed, the cumulative peel length of the resin bond was 1.3 m.

(Comparative Example 1)
A phenolic resin paint (manufactured by Showa Kobunshi Co., Ltd. in which BRP-5417 was dissolved in cresol), a diamond filler having an average particle size of 2.6 μm (manufactured by Tomei Diamond Co., IRM), and a particle size of 40 to 60 μm (average particle size) Nickel-coated diamond abrasive grains (42 μm in diameter, IRM-NP, manufactured by Tomei Diamond Co., Ltd.) were uniformly mixed so that the respective solid content ratios became 60% by volume, 30% by volume, and 10% by volume. Further, a solvent, cresol, was added to this mixture to make the amount of the solvent in the coating material 50% by volume.

  A diamond wire saw was manufactured in the same manner as in Example 1, and the projected area occupancy of the superabrasive grains was examined. As a result, it was 4.8%. In addition, when a performance test similar to that of Example 1 was performed, the cumulative peel length of the resin bond was 4.7 m.

  Table 1 shows the results of Examples 1 to 5 and Comparative Example 1.

(Example 6)
A phenolic resin paint (manufactured by Showa Kobunshi Co., Ltd. in which BRP-5417 was dissolved in cresol), a diamond filler having an average particle size of 2.6 μm (manufactured by Tomei Diamond Co., IRM), and a particle size of 30 to 40 μm (average particle size) Nickel-coated diamond abrasive particles (diameter: 32 μm) (manufactured by Tomei Diamond Co., Ltd., IRM-NP) were uniformly mixed so that the respective solid content ratios became 60% by volume, 6% by volume, and 34% by volume. Further, a solvent, cresol, was added to this mixture to make the amount of the solvent in the coating material 50% by volume.

  Next, the abrasive dispersion liquid was applied to a copper-plated piano wire having an outer diameter of 0.18 mm, and the coated copper-plated piano wire was passed through a die having an inner diameter of 0.26 mm. The diamond wire saw was manufactured by baking and hardening in a baking furnace. The outer diameter of the obtained diamond wire saw was 0.22 mm, and the thickness of the resin bond layer formed by baking hardening was about 15 μm.

  In the same manner as in Example 1, photomicrographs at a magnification of 100 were taken at arbitrary 50 locations of the obtained diamond wire saw to investigate the average number of diamond abrasive grains fixed, and according to the equations (1) and (2). The calculated super-abrasive grain projected area occupancy was 48.9%.

  This diamond wire saw was attached to a cutting device shown in FIG. 4, and a silicon ingot was sliced to perform a performance investigation. The main rollers 5 and 6 of the cutting device have an outer diameter of 200 mm and a width of 180 mm, and are provided with 123 grooves on the outer peripheral surface at a groove pitch of 1.21 mm. A diamond wire saw is wound on the reels 2 and 9 at a winding pitch of 0.6 mm for a length of 50 km. The slicing conditions were as follows: the linear speed of the diamond wire saw was 1200 mm / min, the cutting speed was 3 m / min, the tension was 29 N, and the supply of the water-insoluble grinding fluid was 30 liter / min.

  An optical microscope was used to examine the surface state of any 140 m length of the slicing diamond wire saw for resin resin peeling, but no peeling was observed.

(Example 7)
A phenolic resin paint (manufactured by Showa Kobunshi Co., Ltd. in which BRP-5417 was dissolved in cresol), a diamond filler having an average particle size of 2.6 μm (manufactured by Tomei Diamond Co., IRM), and a particle size of 30 to 40 μm (average particle size) Nickel-coated diamond abrasive grains (diameter: 32 μm) (manufactured by Tomei Diamond Co., Ltd., IRM-NP) were uniformly mixed such that the solid content ratio was 60% by volume, 20% by volume, and 20% by volume, respectively. Further, a solvent, cresol, was added to this mixture to make the amount of the solvent in the coating material 50% by volume.

  When a diamond wire saw was manufactured in the same manner as in Example 6, and the super-abrasive grain projected area occupancy was investigated, it was 26.4%. In addition, a performance test similar to that in Example 6 was performed, but no peeling of the resin bond was observed.

(Example 8)
A phenolic resin paint (manufactured by Showa Kobunshi Co., Ltd. in which BRP-5417 was dissolved in cresol), a diamond filler having an average particle size of 2.6 μm (manufactured by Tomei Diamond Co., IRM), and a particle size of 30 to 40 μm (average particle size) Nickel-coated diamond abrasive grains (diameter: 32 μm) (manufactured by Tomei Diamond Co., Ltd., IRM-NP) were uniformly mixed so that the respective solid content ratios became 60% by volume, 22% by volume, and 18% by volume. Further, a solvent, cresol, was added to this mixture to make the amount of the solvent in the coating material 50% by volume.

  A diamond wire saw was manufactured in the same manner as in Example 6, and the projected area occupancy of the superabrasive grains was investigated. As a result, it was 12.1%. In addition, a performance test similar to that in Example 6 was performed, but no peeling of the resin bond was observed.

(Example 9)
A phenolic resin paint (manufactured by Showa Kobunshi Co., Ltd. in which BRP-5417 was dissolved in cresol), a diamond filler having an average particle size of 2.6 μm (manufactured by Tomei Diamond Co., IRM), and a particle size of 30 to 40 μm (average particle size) Nickel-coated diamond abrasive grains (diameter: 32 μm) (manufactured by Tomei Diamond Co., Ltd., IRM-NP) were uniformly mixed so that the respective solid contents became 60% by volume, 24% by volume, and 16% by volume. Further, a solvent, cresol, was added to this mixture to make the amount of the solvent in the coating material 50% by volume.

  A diamond wire saw was manufactured in the same manner as in Example 6, and the projected area occupancy ratio of the superabrasive grains was 8.5%. In addition, when a performance test similar to that of Example 6 was performed, the cumulative peel length of the resin bond was 0.2 m.

(Example 10)
A phenolic resin paint (manufactured by Showa Kobunshi Co., Ltd. in which BRP-5417 was dissolved in cresol), a diamond filler having an average particle size of 2.6 μm (manufactured by Tomei Diamond Co., IRM), and a particle size of 30 to 40 μm (average particle size) Nickel-coated diamond abrasive grains having a diameter of 32 μm (IRM-NP, manufactured by Tomei Diamond Co., Ltd.) were uniformly mixed so that the respective solid content ratios became 60% by volume, 26% by volume, and 14% by volume. Further, a solvent, cresol, was added to this mixture to make the amount of the solvent in the coating material 50% by volume.

  A diamond wire saw was manufactured in the same manner as in Example 6, and the projected area occupancy of the superabrasive grains was examined. As a result, it was 5.4%. In addition, when the same performance investigation as in Example 6 was performed, the cumulative peel length of the resin bond was 1.2 m.

(Comparative Example 2)
A phenolic resin paint (manufactured by Showa Kobunshi Co., Ltd. in which BRP-5417 was dissolved in cresol), a diamond filler having an average particle size of 2.6 μm (manufactured by Tomei Diamond Co., IRM), and a particle size of 30 to 40 μm (average particle size) Nickel-coated diamond abrasive grains (IRM-NP, manufactured by Tomei Diamond Co., Ltd.) having a diameter of 32 μm) were uniformly mixed such that the solid content ratio was 60% by volume, 30% by volume, and 10% by volume, respectively. Further, a solvent, cresol, was added to this mixture to make the amount of the solvent in the coating material 50% by volume.

  When a diamond wire saw was manufactured in the same manner as in Example 6, and the superabrasive grain projected area occupancy was investigated, it was 3.8%. In addition, when a performance test similar to that of Example 6 was performed, the cumulative peel length of the resin bond was 10.7 m.

  Table 2 shows the results of Examples 6 to 10 and Comparative Example 2.

(Examples 11 to 15 and Comparative Example 3)
A phenolic resin paint (manufactured by Showa Polymer Co., Ltd., abrasive grains obtained by dissolving BRP-5417 in cresol), a diamond filler having an average particle size of 2.6 μm (manufactured by Tomei Diamond Co., IRM), and a particle size of 65 to 85 μm (particle size # 200; nickel-coated diamond abrasive grains (average particle size: 76 μm) (IRM-NP, manufactured by Tomei Diamond Co., Ltd.) were mixed uniformly with their respective solid content ratios adjusted to various ratios. Further, the solvent containing cresol was added to the mixture containing the nickel-coated diamond abrasive grains at various volume percentages, so that the amount of the solvent in the paint was 50 volume%.

  In the same manner as in Example 1, a diamond wire saw was manufactured by applying this abrasive grain dispersion and solution to a copper-plated piano wire having an outer diameter of 0.36 mm, and the obtained diamond wire saw occupied the superabrasive grain projected area. The rate was calculated. Further, each of the diamond wire saws was attached to the cutting device shown in FIG. 4, and the optical glass was cut, and the performance was investigated in the same manner as in Example 1. Table 3 shows the results.

  The embodiments and examples disclosed above are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the embodiments or examples described above, and includes all modifications and variations within the scope and meaning equivalent to the terms of the claims.

1 is a schematic partial longitudinal sectional view of a superabrasive wire saw according to one embodiment of the present invention. 1 is a schematic cross-sectional view of a superabrasive wire saw according to one embodiment of the present invention. FIG. 2 is an enlarged schematic diagram of a portion B in FIG. 1. BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic perspective view which shows the structure of one Embodiment of the cutting device comprised using the superabrasive wire saw of this invention.

Explanation of reference numerals

  P: superabrasive wire saw, D: superabrasive, W: core wire, R: binder, F: filler, d: core wire diameter, 1: superabrasive wire saw, 2, 9: reel, 3, 4, 7 , 8: guide roller, 5, 6: main roller, 10: workpiece, 11, 12: nozzle.

Claims (2)

A step of creating a superabrasive wire saw in which superabrasive grains are fixed to a surface of a core material with a binder,
In the superabrasive wire saw, a step of measuring a projected area of the superabrasive,
If the ratio of the projected area of the superabrasive grains to the surface area of the core material is within a predetermined range, the superabrasive wire saw is determined to be good, and the projected area of the superabrasive grains occupies the surface area of the core material. A step of determining that the superabrasive wire saw is defective if the ratio is outside the predetermined range. A step of creating a superabrasive wire saw in which superabrasive grains are fixed to a surface of a core material with a binder,
In the superabrasive wire saw, a step of measuring a projected area of the superabrasive,
If the ratio of the projected area of the superabrasive grains to the surface area of the core material is 5% or more and 55% or less, the superabrasive wire saw is determined to be good, and the projected area of the superabrasive grains is determined as the surface area of the core material. Determining that the superabrasive wire saw is defective if the proportion of the superabrasive wire saw is less than 5% or more than 55%.

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