JP2002036091A - Super-abrasive grain wire saw and manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a super-abrasive grain wire saw capable of preventing peeling of a binding material caused by falling of a super-abrasive grain, effectively conducting slicing processing at high accuracy and having a long service life for a fixed abrasive grain type super-abrasive grain wire saw. SOLUTION: In this super-abrasive grain wire saw P, the super-abrasive grain D is fixed on a surface of a core wire W with the binding material R. A ratio of a projected area of the super-abrasive grain D to a surface area of the core wife W is 5% or more and 55% or less. By changing a mixture ratio of the super-abrasive grain D and the binding material R, the ratio of the projected area of the super-abrasive grain D to the surface area of the core wire W is controlled to 5% or more and 55% or less.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to cutting of a silicon wafer from a silicon ingot, optical glass,
The present invention relates to a fixed-grain superabrasive wire saw used for cutting ceramics, quartz, ferrite, neodymium magnets, and the like, and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, in order to obtain a silicon wafer by slicing a silicon ingot, a diamond inner peripheral blade has been mainly used. However, as the diameter of the silicon ingot has increased, it has become difficult to slice the silicon ingot using the diamond inner peripheral blade. Further, in the slicing process of a silicon ingot, it has been required to improve the yield, improve the productivity, and reduce the damaged layer. For this reason, a slicing process called a multi-wire saw method, which supplies a slurry in which free abrasive grains and a grinding fluid are mixed to a wire, has come to be used in many cases.

This multi-wire saw system can be applied to slicing of a silicon ingot having a large diameter by adjusting the interval between grooved main rollers which are guides for wires. The multi-wire saw method is a method capable of slicing 200 or more wafers at a time. However, in the multi-wire saw method, since a slurry is used, there is a problem that the processing speed is lower than that of the diamond inner peripheral blade. In addition, in the multi-wire saw method, a large amount of sludge, which is a mixture of slurry and cutting powder, is generated.
There is a problem that the wafer needs to be cleaned and the manufacturing cost increases. Further, there is a problem that the sludge contaminates the machine and its surroundings, and significantly impairs the working environment.

In order to solve these problems, it has been proposed to slicing a silicon ingot using a diamond wire saw of a fixed abrasive type in which diamond abrasive grains are fixed to a core wire. This diamond wire saw has extremely good sharpness, does not require a slurry, and can use a water-soluble or water-insoluble grinding fluid, so that contamination of the machine and its surroundings can be reduced, and the working environment can be reduced. It has the advantage that it can be improved. In addition, since a long diamond wire saw of several hundred meters or several tens km or more can be manufactured, a large number of wafers can be sliced at one time. It is possible to obtain a cutting speed several times higher.

A fixed abrasive type diamond wire saw has been proposed in Japanese Patent Application Laid-Open No. 8-126953.
This diamond wire saw is made of a material made of polyethylene, nylon, polyester, or the like, or a material reinforced with glass fiber or carbon fiber as a core wire, and diamond abrasive grains are applied around the core wire with a synthetic resin adhesive or electrodeposition. It is stuck.

[0006] Another diamond wire saw has been proposed in Japanese Patent Application Laid-Open No. 9-155631. This diamond wire saw has a monofilament or multifilament such as carbon fiber, aramid fiber, alumina fiber, boron fiber, silicon carbide fiber, or silicon-titanium-carbon-oxygen-based inorganic fiber as a core wire,
Diamond abrasive grains are fixed to the outer periphery of the core wire by plating or a synthetic resin binder.

[0007]

However, when a silicon ingot is sliced using a fixed abrasive type diamond wire saw proposed in the above-mentioned publication, the diamond abrasive grains fall off, and finally the binder is peeled off. There was a problem of doing. Due to the peeling of the binder, there is a problem that the cutting speed in the slicing process is sharply reduced and the life of the diamond wire saw is shortened.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a long-life super-abrasive grain which prevents slicing with high accuracy and high efficiency by preventing separation of a binder due to falling off of super-abrasive grains such as diamond abrasive grains. It is to provide a wire saw.

[0009]

A super-abrasive wire saw according to the present invention is a super-abrasive wire saw in which super-abrasive grains are fixed to a surface of a core wire with a bonding material. Is 5% or more and 55% or less.

[0010] In the superabrasive wire saw of the present invention, the ratio of the projected area of the superabrasive grains to the surface area of the core wire is preferably 10% or more and 50% or less.

Further, in the superabrasive wire saw of the present invention, the superabrasive grains preferably have a particle size of 5 μm or more and 200 μm or less.

In the superabrasive wire saw of the present invention, the binder is preferably a resin bond, and the superabrasive is preferably a diamond abrasive or a cubic boron nitride abrasive.

In the superabrasive wire saw according to the present invention, the core wire is any one of a steel wire, a copper-plated steel wire, and a brass-plated steel wire, or a carbon fiber, an aramid fiber, a boron fiber, or Preferably, it consists of any single or stranded wire of glass fibers.

In the superabrasive wire saw of the present invention, the binder contains at least one kind of particles of diamond, cubic boron nitride, silicon carbide, silicon nitride, or cemented carbide having a particle size of 1 μm to 10 μm. Is preferred.

[0015] A method of manufacturing a superabrasive wire saw according to the present invention is directed to a method of manufacturing a superabrasive wire saw in which superabrasive grains are fixed to the surface of a core wire with a binder, wherein the mixing ratio of the superabrasive grains and the binder is adjusted. By changing the ratio, the ratio of the projected area of the superabrasive grains to the surface area of the core wire is controlled to 5% or more and 55% or less.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION The feature of the superabrasive wire saw of the present invention is that the ratio of the projected area of the superabrasive grains to the surface area of the core wire (hereinafter referred to as “superabrasive grain projected area occupation ratio”) is 5% or more and 55%. % Or less.

If the occupation ratio of the superabrasive grain projected area is less than 5%, the life of the superabrasive wire saw is remarkably shortened because the binder is peeled off. This is because the number of working abrasive grains decreases and the grinding resistance per superabrasive grain increases, so that the superabrasive grains fall off and eventually the binder is peeled off.
Also, if the super-abrasive grain projected area occupation ratio is less than 5%, the exposed area of the binder becomes large, so that the binder comes into contact with the workpiece during the slicing process, whereby the binder retreats quickly. And eventually causes a phenomenon that the binder is peeled off.

When the projected area occupation ratio of the superabrasive grains is less than 5%, it is expected that peeling of the binder will occur at a cumulative length of 3% or more of the length of the superabrasive wire saw. When the peeling of the binder occurs at a cumulative length of 3% or more with respect to the length of the superabrasive wire saw, the peeling of the binder proceeds rapidly, the sharpness is reduced, and finally, the superabrasive wire saw is Reach life.

When the super-abrasive grain projected area occupancy is 5% or more and less than 10%, it is expected that peeling of the binder will occur at a cumulative length of about 1% with respect to the length of the super-abrasive wire saw. This degree of binder release has little effect on the performance of the superabrasive wire saw. Further, not only is there no decrease in sharpness, but also the peeling of the binder does not proceed.

If the projected area occupation ratio of the superabrasive grains exceeds 55%, the peeling of the binder does not occur, but the number of working abrasive grains is too large, and clogging of cutting chips is liable to occur.
Processing efficiency is significantly reduced.

In consideration of the life and sharpness of the superabrasive wire saw, the superabrasive grain projected area occupancy is preferably 10% or more and 50% or less, more preferably 10% or more and 40% or less.

One embodiment of the superabrasive wire saw of the present invention will be described with reference to FIGS. Figure 1
Is a schematic partial longitudinal sectional view of a superabrasive wire saw P in a longitudinal direction. FIG. 2 is a schematic cross-sectional view of a superabrasive wire saw. FIG. 3 is an enlarged schematic diagram of FIG. 1B. Figure 1
As shown in FIG. 3, a large number of superabrasive grains D are fixed on the outer peripheral surface of a core wire W having a diameter d by a binder R. The binder R includes a filler F.

Next, the definition of the super-abrasive grain projected area occupancy will be described with reference to FIG. In FIG. 1, on the outer peripheral surface of the core wire W having the diameter d, the unit length L of the superabrasive wire saw P is
n superabrasive grains D are fixed. Assuming that the projected area of each superabrasive grain D is A1, A2, A3,..., An, the superabrasive grain projected area occupancy C is expressed by the following equation.

[0024]

(Equation 1)

In practice, the super-abrasive grain projected area occupancy represented by the above equation is measured as follows.

First, the number n of superabrasive grains D fixed per unit length L of the superabrasive wire saw P is examined using an optical microscope. The superabrasive D is regarded as a sphere having an average particle diameter d ₀ , and the ratio of the projected area of the sphere to the surface area of the core wire W is defined as the superabrasive projected area occupancy. The super abrasive grains D projected on the surface of the core wire W are elliptical, but are calculated assuming them as circles.

That is, in the calculation of the actual super-abrasive grain projected area occupancy, n super-abrasive grains D equal to the average particle diameter d ₀ are calculated.
Is assumed to be fixed on the outer peripheral surface of the core wire W, and the total projected area of the n superabrasive grains D is calculated by the following equation.

[0028]

(Equation 2)

By substituting the value of equation (2) into equation (1), the super-abrasive grain projected area occupancy C is calculated.

The projected area occupation ratio of the superabrasive grains can be basically controlled by changing the mixing ratio of the superabrasive grains and the binder.

The superabrasive wire saw of the present invention can be used for a cutting device shown in FIG. 4 as an example. The superabrasive wire saw cutting device is an apparatus for slicing a large number of workpieces at once while pressing a large number of superabrasive wire saws against the workpiece and reciprocating the superabrasive wire saw. Attempts have been made to use a superabrasive wire saw cutter for slicing a silicon wafer from a large diameter silicon ingot, cutting magnetic materials such as ferrite and neodymium magnets, cutting optical glass, and the like.

More specifically, as shown in FIG. 4, grooves are provided on the outer peripheral surfaces of the main rollers 5 and 6 according to the cut dimensions of the workpiece. The superabrasive wire saw 1 is wound around the outer peripheral surfaces of the reels 2 and 9. Super abrasive wire saw 1 taken out from one reel 2 via guide rollers 3 and 4
Is sequentially wound around the grooves of the main rollers 5 and 6, and is wound on the other reel 9 via the guide rollers 7 and 8. The tension of the superabrasive wire saw 1 is set to a predetermined value by the torque of the main rollers 5 and 6 arranged on the left and right. While the superabrasive wire saw 1 reciprocates between the reels 2 and 9, a large number of superabrasive wire saws 1 are pressed against the workpiece 10, and the workpiece 10 is sliced into a large number of pieces at once. At this time, the grinding fluid is supplied to the grooves of the main rollers 5 and 6 from the nozzles 11 and 12.

As the superabrasive, any superabrasive having any particle size can be used. In particular, when using a superabrasive wire saw for precision cutting of silicon ingots, optical glass, ceramics, quartz, ferrite, neodymium magnets, etc., it is preferable to use superabrasive grains having a particle size of 5 μm to 200 μm, preferably 10 μm or more. It is more preferable to use superabrasive grains of 150 μm or less.

It is preferable to use a resin bond as the binder. Resins that can be used as a resin bond include alkyd resins, phenolic resins, formalin resins, in terms of elastic modulus, softening temperature, moldability, and physical properties.
Polyurethane resin, polyester resin, polyimide resin, epoxy resin, melamine resin, urea resin, unsaturated polyester resin, acrylic resin, polyesterimide resin, polyamideimide resin, polyester urethane resin, bismaleimide resin, bismaleimide triazine resin, cyanate ester Preferred are resin, polyetherimide, polyparabanic acid, aromatic polyamide and the like.

As the core wire, any one of a steel wire, a copper-plated steel wire, and a brass-plated steel wire can be used.

As the steel wire, a piano wire which can be easily formed into a fine wire and has high strength is most preferable. The piano wire can be used as it is, but in order to facilitate storage and improve the adhesion of the resin bond and increase the holding power of the superabrasive grains, the piano wire must be coated with copper or brass. Preferably, a treatment is applied.

As the core wire of other materials, carbon fiber,
Any one of aramid fiber, boron fiber, and glass fiber may be used as a single wire or a stranded wire. Alternatively, a stranded wire obtained by mixing two or more kinds of carbon fibers, aramid fibers, boron fibers, and glass fibers can be used. Furthermore, a stranded wire obtained by adding a steel wire to these stranded wires can be used as the core wire.

In the superabrasive wire saw of the present invention, the binder is one or more of diamond, cubic boron nitride, silicon carbide, silicon nitride, and cemented carbide having a particle size of 1 μm to 10 μm. It is preferred to contain particles of

For the purpose of improving the strength and wear resistance of the binder layer and improving the life, processing efficiency and cutting performance of the superabrasive wire saw, it is extremely effective to include these particles (fillers). is there. Among these particles, the harder the particles, the larger the effect is, and the binder preferably contains diamond and cubic boron nitride, and most preferably contains diamond.

[0040]

(Example 1) A phenolic resin paint (manufactured by Showa Kogaku Co., Ltd., a paint obtained by dissolving BRP-5417 in cresol) and a diamond filler having an average particle diameter of 2.6 μm (IRM, manufactured by Tomei Diamond Co., Ltd.) , Particle size 40 ~
60 μm (average particle size: 42 μm) nickel-coated diamond abrasive (IRM-NP, manufactured by Tomei Diamond Co., Ltd.)
And a solid content ratio of 60% by volume, 5% by volume,
The mixture was uniformly mixed so as to be 35% by volume. Further, a solvent, cresol, was added to this mixture to adjust the amount of the solvent in the abrasive grains to 50% by volume.

Next, this abrasive grain dispersion solution was added to an outer diameter of 0.18.
mm of copper-plated piano wire, and passing the coated copper-plated piano wire through a die having an inner diameter of 0.28 mm.
The diamond wire saw was manufactured by baking and hardening in a baking furnace having a furnace temperature of 300 ° C. The outer diameter of the obtained diamond wire saw is 0.24 mm, and the thickness of the resin bond layer formed by baking hardening is about 20 μm.
Met.

Photomicrographs at a magnification of 100 were taken at arbitrary 50 points of the obtained diamond wire saw, and the average number of fixed diamond abrasive grains was investigated.
The projected area occupancy of the superabrasive grains was calculated according to (2) and (2), and was 47.3%.

The diamond wire saw was attached to the cutting device shown in FIG. 4, and the silicon ingot was sliced, and its performance was examined. The main rollers 5 and 6 of the cutting device have an outer diameter of 200 mm and a width of 180 mm, and are provided with 123 grooves on the outer peripheral surface at a groove pitch of 1.21 mm. 0.6mm on reels 2 and 9
Is wound at a winding pitch of 50 km for a length of 50 km. The slicing conditions were as follows: the linear speed of the diamond wire saw was 1200 mm / min, the cutting speed was 4 mm / min, the tension was 29 N, and the supply of the water-insoluble grinding fluid was 30 liter / min.

With respect to an arbitrary length of 140 m of the diamond wire saw after the slicing process, the peeled length of the resin bond was examined with an optical microscope, and the total length was defined as the peeled length. As a result, no peeling was confirmed.

(Example 2) A phenol resin paint (manufactured by Showa Kobunshi Co., Ltd., a paint obtained by dissolving BRP-5417 in cresol), a diamond filler having an average particle size of 2.6 μm (IRM, manufactured by Tomei Diamond Co., Ltd.) Particle size 40 ~
60 μm (average particle size: 42 μm) nickel-coated diamond abrasive (IRM-NP, manufactured by Tomei Diamond Co., Ltd.)
Was uniformly mixed such that the respective solid content ratios became 60% by volume, 20% by volume, and 20% by volume. further,
A solvent, cresol, was added to the mixture to make the amount of the solvent in the coating material 50% by volume.

A diamond wire saw was manufactured in the same manner as in Example 1, and the projected area occupancy of the superabrasive grains was examined. As a result, it was 24.7%. In addition, the same performance investigation as in Example 1 was conducted, but no peeling of the resin bond was observed.

(Example 3) A phenol resin paint (manufactured by Showa Kobunshi Co., Ltd., a paint obtained by dissolving BRP-5417 in cresol) and a diamond filler having an average particle size of 2.6 μm (IRM, manufactured by Tomei Diamond Co., Ltd.) Particle size 40 ~
60 μm (average particle size: 42 μm) nickel-coated diamond abrasive (IRM-NP, manufactured by Tomei Diamond Co., Ltd.)
Were uniformly mixed such that the respective solid content ratios became 60% by volume, 22% by volume, and 18% by volume. further,
A solvent, cresol, was added to the mixture to make the amount of the solvent in the coating material 50% by volume.

A diamond wire saw was manufactured in the same manner as in Example 1, and the projected area occupancy of the superabrasive grains was investigated. As a result, it was 14.5%. In addition, the same performance investigation as in Example 1 was conducted, but no peeling of the resin bond was observed.

(Example 4) A phenol resin paint (manufactured by Showa Kobunshi Co., Ltd., a paint obtained by dissolving BRP-5417 in cresol), a diamond filler having an average particle size of 2.6 μm (manufactured by Tomei Diamond Co., Ltd., IRM) Particle size 40 ~
60 μm (average particle size: 42 μm) nickel-coated diamond abrasive (IRM-NP, manufactured by Tomei Diamond Co., Ltd.)
Were uniformly mixed such that the respective solid content ratios became 60% by volume, 24% by volume, and 16% by volume. further,
A solvent, cresol, was added to the mixture to make the amount of the solvent in the coating material 50% by volume.

A diamond wire saw was manufactured in the same manner as in Example 1, and the projected area occupation ratio of the superabrasives was 9.8%. In addition, when a performance test similar to that of Example 1 was performed, the cumulative peel length of the resin bond was 0.5 m.

(Example 5) A phenol resin paint (manufactured by Showa Kobunshi Co., Ltd., BRP-5417 dissolved in cresol) and a diamond filler having an average particle diameter of 2.6 μm (IRM, manufactured by Tomei Diamond Co., Ltd.) Particle size 40 ~
60 μm (average particle size: 42 μm) nickel-coated diamond abrasive (IRM-NP, manufactured by Tomei Diamond Co., Ltd.)
Were uniformly mixed such that the respective solid content ratios became 60% by volume, 26% by volume, and 14% by volume. further,
A solvent, cresol, was added to the mixture to make the amount of the solvent in the coating material 50% by volume.

A diamond wire saw was manufactured in the same manner as in Example 1, and the projected area occupancy of the superabrasive grains was investigated. The result was 6.2%. In addition, when the same performance investigation as in Example 1 was conducted, the cumulative peel length of the resin bond was 1.3 m.

(Comparative Example 1) A phenolic resin paint (manufactured by Showa Kobunshi Co., Ltd. in which BRP-5417 was dissolved in cresol) and a diamond filler having an average particle size of 2.6 μm (IRM, manufactured by Tomei Diamond Co., Ltd.) Particle size 40 ~
60 μm (average particle size: 42 μm) nickel-coated diamond abrasive (IRM-NP, manufactured by Tomei Diamond Co., Ltd.)
Were uniformly mixed such that the respective solid content ratios became 60% by volume, 30% by volume, and 10% by volume. further,
A solvent, cresol, was added to the mixture to make the amount of the solvent in the coating material 50% by volume.

A diamond wire saw was manufactured in the same manner as in Example 1, and the projected area occupancy of the superabrasive grains was examined. The result was 4.8%. In addition, when the same performance investigation was performed as in Example 1, the cumulative peel length of the resin bond was 4.7 m.

Table 1 shows the results of Examples 1 to 5 and Comparative Example 1.

[0056]

[Table 1]

(Example 6) A phenol resin paint (manufactured by Showa Kobunshi Co., Ltd., a paint obtained by dissolving BRP-5417 in cresol), a diamond filler having an average particle size of 2.6 μm (IRM, manufactured by Tomei Diamond Co., Ltd.) Particle size 30 ~
40 μm (average particle size 32 μm) nickel-coated diamond abrasive grains (IRM-NP, manufactured by Tomei Diamond Co., Ltd.)
And the respective solid content ratios are 60% by volume, 6% by volume,
The mixture was uniformly mixed so as to be 34% by volume. Further, a solvent, cresol, was added to this mixture to make the amount of the solvent in the coating material 50% by volume.

Next, this abrasive grain dispersion solution was added to an outer diameter of 0.18.
mm of copper-plated piano wire, and passing the coated copper-plated piano wire through a die having an inner diameter of 0.26 mm.
The diamond wire saw was manufactured by baking and hardening in a baking furnace having a furnace temperature of 300 ° C. The outer diameter of the obtained diamond wire saw is 0.22 mm, and the thickness of the resin bond layer formed by baking hardening is about 15 μm.
Met.

In the same manner as in Example 1, a magnification of 100 was applied to arbitrary 50 positions of the obtained diamond wire saw.
A microphotograph at × 2 magnification was taken to investigate the average number of adhered diamond abrasive grains, and the projected area occupancy of the superabrasive grains was calculated according to formulas (1) and (2), and was 48.9%.

The diamond wire saw was attached to the cutting device shown in FIG. 4, and the silicon ingot was sliced, and its performance was examined. The main rollers 5 and 6 of the cutting device have an outer diameter of 200 mm and a width of 180 mm, and are provided with 123 grooves on the outer peripheral surface at a groove pitch of 1.21 mm. 0.6mm on reels 2 and 9
Is wound at a winding pitch of 50 km for a length of 50 km. The slicing conditions were as follows: the linear speed of the diamond wire saw was 1200 mm / min, the cutting speed was 3 m / min, the tension was 29 N, and the supply of the water-insoluble grinding fluid was 3 mm.
0 liter / min.

An arbitrary 140 m length of the diamond wire saw after slicing was examined with an optical microscope to determine whether or not the resin bond had separated, but no separation could be confirmed.

(Example 7) A phenol resin paint (manufactured by Showa Kobunshi Co., Ltd., a paint obtained by dissolving BRP-5417 in cresol) and a diamond filler having an average particle size of 2.6 μm (IRM, manufactured by Tomei Diamond Co., Ltd.) Particle size 30 ~
40 μm (average particle size 32 μm) nickel-coated diamond abrasive grains (IRM-NP, manufactured by Tomei Diamond Co., Ltd.)
Was uniformly mixed such that the respective solid content ratios became 60% by volume, 20% by volume, and 20% by volume. further,
A solvent, cresol, was added to the mixture to make the amount of the solvent in the coating material 50% by volume.

A diamond wire saw was manufactured in the same manner as in Example 6, and the projected area occupancy of the superabrasive grains was determined to be 26.4%. In addition, a performance test similar to that of Example 6 was performed, but no peeling of the resin bond was observed.

(Example 8) A phenolic resin paint (manufactured by Showa Kobunshi Co., Ltd., in which BRP-5417 was dissolved in cresol) and a diamond filler having an average particle size of 2.6 μm (IRM, manufactured by Tomei Diamond Co., Ltd.) Particle size 30 ~
40 μm (average particle size 32 μm) nickel-coated diamond abrasive grains (IRM-NP, manufactured by Tomei Diamond Co., Ltd.)
Were uniformly mixed such that the respective solid content ratios became 60% by volume, 22% by volume, and 18% by volume. further,
A solvent, cresol, was added to the mixture to make the amount of the solvent in the coating material 50% by volume.

A diamond wire saw was manufactured in the same manner as in Example 6, and the projected area occupancy of the superabrasive grains was investigated. The result was 12.1%. In addition, a performance test similar to that of Example 6 was performed, but no peeling of the resin bond was observed.

(Example 9) A phenolic resin paint (manufactured by Showa Kobunshi Co., Ltd. in which BRP-5417 was dissolved in cresol) and a diamond filler having an average particle size of 2.6 μm (IRM, manufactured by Tomei Diamond Co., Ltd.) Particle size 30 ~
40 μm (average particle size 32 μm) nickel-coated diamond abrasive grains (IRM-NP, manufactured by Tomei Diamond Co., Ltd.)
Were uniformly mixed such that the respective solid content ratios became 60% by volume, 24% by volume, and 16% by volume. further,
A solvent, cresol, was added to the mixture to make the amount of the solvent in the coating material 50% by volume.

A diamond wire saw was manufactured in the same manner as in Example 6 and the projected area occupation ratio of the superabrasive grains was 8.5%. In addition, when a performance test similar to that of Example 6 was performed, the cumulative peel length of the resin bond was 0.2 m.

(Example 10) A phenolic resin paint (manufactured by Showa Kobunshi Co., Ltd., a paint obtained by dissolving BRP-5417 in cresol), a diamond filler having an average particle size of 2.6 µm (IRM, manufactured by Tomei Diamond Co., Ltd.) Particle size 30 ~
40 μm (average particle size 32 μm) nickel-coated diamond abrasive grains (IRM-NP, manufactured by Tomei Diamond Co., Ltd.)
Were uniformly mixed such that the respective solid content ratios became 60% by volume, 26% by volume, and 14% by volume. further,
A solvent, cresol, was added to the mixture to make the amount of the solvent in the coating material 50% by volume.

A diamond wire saw was manufactured in the same manner as in Example 6, and the super-abrasive grain projected area occupancy was determined to be 5.4%. In addition, when a performance test similar to that of Example 6 was performed, the cumulative peel length of the resin bond was 1.2 m.

(Comparative Example 2) A phenolic resin paint (manufactured by Showa Kobunshi Co., Ltd. in which BRP-5417 was dissolved in cresol) and a diamond filler having an average particle size of 2.6 μm (IRM, manufactured by Tomei Diamond Co., Ltd.) Particle size 30 ~
40 μm (average particle size 32 μm) nickel-coated diamond abrasive grains (IRM-NP, manufactured by Tomei Diamond Co., Ltd.)
Were uniformly mixed such that the respective solid content ratios became 60% by volume, 30% by volume, and 10% by volume. further,
A solvent, cresol, was added to the mixture to make the amount of the solvent in the coating material 50% by volume.

A diamond wire saw was manufactured in the same manner as in Example 6, and the projected area occupancy of the superabrasive grains was 3.8%. In addition, when the same performance investigation as in Example 6 was performed, the cumulative peel length of the resin bond was 1
0.7 m.

Table 2 shows the results of Examples 6 to 10 and Comparative Example 2.

[0073]

[Table 2]

(Examples 11 to 15 and Comparative Example 3) A phenol resin paint (manufactured by Showa Polymer Co., Ltd., abrasive grains obtained by dissolving BRP-5417 in cresol) and a diamond filler having an average particle size of 2.6 μm (Tomei Diamond Co., Ltd.) Made by company, IR
M) and nickel-coated diamond abrasive grains (IRM-NP, manufactured by Tomei Diamond Co., Ltd.) having a particle size of 65 to 85 μm (particle size # 200; average particle size of 76 μm) are adjusted to have various solid content ratios. And mixed uniformly. Further, cresol as a solvent was added to the mixture containing the nickel-coated diamond abrasive grains at various volume percentages, so that the amount of the solvent in the paint was 50 volume%.

In the same manner as in Example 1, a diamond wire saw was produced by applying this abrasive grain dispersion and solution to a copper-plated piano wire having an outer diameter of 0.36 mm, and the resulting superabrasive grains of each diamond wire saw were obtained. The projected area occupancy was calculated. Further, each diamond wire saw was attached to the cutting device shown in FIG. 4, the optical glass was cut, and the performance was investigated in the same manner as in Example 1. Table 3 shows the results.

[0076]

[Table 3]

The embodiments and examples disclosed above are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the embodiments or examples described above, and includes all modifications and variations within the scope and meaning equivalent to the terms of the claims.

[0078]

As described above, since the superabrasive wire saw of the present invention does not cause the peeling of the binder due to the drop of the superabrasive grains, it exhibits excellent sharpness over a long period of time, and is capable of multi-slicing of silicon ingots and the like. Processing can be performed with high efficiency and high accuracy.

[Brief description of the drawings]

FIG. 1 is a schematic partial longitudinal sectional view of a superabrasive wire saw according to one embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view of a superabrasive wire saw according to one embodiment of the present invention.

FIG. 3 is an enlarged schematic diagram of a portion B in FIG. 1;

FIG. 4 is a schematic perspective view showing the structure of one embodiment of a cutting device configured using the superabrasive wire saw of the present invention.

[Explanation of symbols]

P: superabrasive wire saw, D: superabrasive, W: core wire, R: binder, F: filler, d: core wire diameter, 1: superabrasive wire saw, 2, 9: reel, 3, 4, 7 , 8: guide roller, 5, 6: main roller, 10: workpiece, 11, 1
2: Nozzle

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (Reference) B24D 11/00 B24D 11/00 Q (72) Inventor Masanori Nakai 2-80 Hokita-cho, Sakai-shi, Osaka Allied Co., Ltd. Material Osaka Works (72) Inventor Nobuo Urakawa 2-80, Hokita-cho, Sakai-shi, Osaka Allied Materials Osaka Works F-term (reference) 3C058 AA05 AA09 CA01 CA04 CA05 CA06 CB01 CB03 CB10 DA03 3C063 AA08 AB09 BA24 BB02 BC03 BD01 BG01 BG03 BG22 EE31 FF23

Claims (8)

[Claims] 1. A super-abrasive wire saw in which super-abrasive grains are fixed to a surface of a core wire with a binder, wherein a ratio of a projected area of the super-abrasive grains to a surface area of the core wire is 5% or more and 55% or less. A superabrasive wire saw. 2. The superabrasive wire saw according to claim 1, wherein a ratio of a projected area of the superabrasive grains to a surface area of the core wire is 10% or more and 50% or less. 3. The superabrasive having a particle size of 5 μm or more and 200 μm or more.
The superabrasive wire saw according to claim 1 or 2, wherein m is equal to or less than m. 4. The method according to claim 1, wherein the binder is a resin bond, and the superabrasive is a diamond abrasive or a cubic boron nitride abrasive. The superabrasive wire saw according to 1. 5. The method according to claim 1, wherein the core wire is selected from the group consisting of a steel wire, a copper-plated steel wire, and a brass-plated steel wire. Item 5. The superabrasive wire saw according to any one of Items 4 to 4. 6. The core wire is made of carbon fiber, aramid fiber,
It is characterized by consisting of any single wire or stranded wire selected from the group consisting of boron fiber and glass fiber,
The superabrasive wire saw according to any one of claims 1 to 4. 7. The binder has a particle size of 1 μm or more and 10 μm or more.
m or less, wherein at least one kind of particles selected from the group consisting of diamond, cubic boron nitride, silicon carbide, silicon nitride, and cemented carbide is contained. 2. The superabrasive wire saw according to claim 1. 8. A method for manufacturing a superabrasive wire saw in which superabrasive grains are fixed to the surface of a core wire with a binder, wherein the superabrasive grains are projected by changing a mixing ratio of the superabrasive grains and the binder. A method for manufacturing a superabrasive wire saw, wherein the ratio of the area to the surface area of the core wire is controlled to 5% or more and 55% or less.