JP2013144352A - Method for manufacturing saw wire and manufacturing apparatus therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and apparatus for manufacturing a diamond saw wire capable of fixing diamond to a saw wire strand at desired density (concentration) and in a dispersion state by a reliable and simple step.SOLUTION: A method of manufacturing a saw wire includes: forming an atmosphere in which diamond abrasive grains to which a material attracted to a magnet adheres are floated in gas or suspended in liquid; passing a saw wire strand of a magnetizable material that is magnetized in spots through the atmosphere and causing the diamond abrasive grains to be attracted to the magnetization region by magnetic force so that the diamond abrasive grains are dispersed and attached; and coating and forming plating metal on the saw wire strand after the dispersion attachment step or simultaneously with the dispersion attachment step to thereby manufacture the saw wire in which the plating metal is coated on the surface and the diamond abrasive grains are fixed to the plating metal.

Description

  The present invention relates to a saw wire used for slicing, for example, photovoltaic power generation, semiconductor crystalline silicon, sapphire, crystal, etc., in particular a diamond saw wire manufacturing method, a manufacturing apparatus therefor, and a saw wire manufactured by this method.

  Conventionally, brass-plated piano wires have been used exclusively for slices such as silicon wafers. Recently, the demand for silicon wafers used for solar power generation has increased rapidly. However, conventional brass-plated piano wires have a problem of low processing speed and low productivity.

  In order to solve this problem, diamond saw wire has attracted attention in recent years.

  The following patent documents disclose a diamond saw wire manufacturing method and apparatus.

  In Patent Document 1, in order to obtain a long-life, high-productivity fixed-abrasive wire saw, the wire is continuously passed through a crucible for a metal material such as a brazing material or a crucible for diamond, and the wire is fed with a brazing material or the like. A method and apparatus for manufacturing a saw wire in which diamond is fixed through a metal layer is disclosed.

  In Patent Document 2, in a fixed-abrasive wire saw, a multilayer coating is applied to the outer periphery of the wire via a brazing material so that stainless steel can be used as a wire element by improving the bonding structure of diamond and wire. The first layer of the coated diamond contains a transition metal such as Ti and is chemically bonded to the diamond wire, and the second layer is a wettability improving layer for the brazing material. A method of manufacturing a wire saw, which is a stainless steel material that is provided with a third layer for a wetting improvement layer and that does not cause a substantial decrease in strength during heat treatment when the wire is fixed to the coating diamond by a brazing material, and An apparatus is disclosed.

  Patent Document 3 discloses a method for shortening the melting time of a metal material at the time of manufacture, preventing the deterioration of the metal material, further reducing the production equipment, and performing various adjustments and replacement / replenishment operations easily. A storage container in which a liquid adhesive for temporary drying and a large number of superabrasive grains are mixed to be dried at a temperature equal to or lower than the melting temperature is provided, and a wire is passed through the adhesive liquid in the storage container in the axial direction. Disclosed is a method and an apparatus for manufacturing a wire saw, in which superabrasive grains are temporarily attached to an outer surface of a wire, and then the metal material is heated and melted to braze the superabrasive grains to the outer periphery of the wire.

  Patent Document 4 reliably adjusts the adhesion amount and adhesion density of fine superabrasive grains, stably supplies a high-quality wire saw having excellent cutting workability, and shortens the melting time of the metal material during production. In order to prevent the metal material from degrading, and without making a large manufacturing facility, various adjustments, replacements, and replenishment operations can be performed easily, so that the outer surface of the wire is dried at a temperature below the melting temperature of the metal material. The adhesive is attached to a plurality of regions at intervals, and the superabrasive grains are temporarily attached to each region with the adhesive, and then the metal material is heated and melted, and the superabrasive grains are brazed to the outer periphery of the wire. Discloses a method and apparatus for manufacturing a wire saw.

  Patent Document 5 discloses a wire layer in which a buffer layer mainly composed of a resin is provided around a core wire made of a piano wire or the like, and an abrasive layer in which abrasive particles are fixed by metal plating on the outer periphery of the buffer layer. A wire saw has been disclosed that has improved surface accuracy during saw processing and maintains abrasive grain holding power while increasing the flexibility of the wire saw and having excellent cutting performance.

  Patent Document 6 improves the biting of abrasive grains while maintaining flexibility by forming an abrasive grain layer in which abrasive grains are fixed with a resin bond made of an ultraviolet curable resin around a core wire made of a piano wire or the like. A resin bond wire saw that can be cut with high accuracy and high efficiency is disclosed.

  Some of the inventions described in these documents disclose a method in which abrasive grains (diamond grains) are temporarily attached and then brazed. However, it is easy to cause displacement or diamond grains to fall off due to contact with equipment or vibration, and it is difficult to fix them stably and reliably by the tacking methods described in these documents.

  Patent Documents 7 to 9 disclose techniques for magnetizing a wire and attaching the abrasive grains to the magnetized wire. In these Patent Documents, except for a part of Patent Document 8, a saw wire element is passed through a coil to form a magnetic field line on the surface of the saw wire element, that is, in a direction perpendicular to the coil. Discloses a method of magnetizing the surface of the film. However, the present inventors have conducted experiments to examine the method of magnetizing the saw wire by passing it through the coil, and as a result, there are many problems to be overcome in order to implement it in actual operation. I understood.

  For example, on the surface of a saw wire magnetized by this magnetizing method, so-called “powder” is formed, in which diamond abrasive grains harden and adhere like a dumpling, or the concentration and distribution of abrasive grains become uneven. I found it easier. Therefore, it has been difficult to efficiently obtain a diamond saw wire in which diamond abrasive grains are uniformly fixed at a desired concentration.

JP 2006-123024 A JP 2008-221406 A JP 2010-583 JP 2010-584 A JP 2006-231479 A JP 2007-253268 A JP-A-53-14489 Japanese Patent Laid-Open No. 2004-50301 Japanese Patent Laid-Open No. 2004-9238

  In the conventional method of magnetizing a saw wire by passing it through a coil, the entire surface of the surface is considered in view of the phenomenon that abrasive grains (diamond abrasive grains) are undesirably and non-uniformly adhered to the saw wire. By reversing the conventional idea of uniformly magnetizing a wire with a coil and magnetizing (magnetizing) at a desired interval in a spot manner, so-called “powder” is not formed, and diamond abrasive grains are desired on the surface of the saw wire It was found that it was possible to uniformly disperse and adhere with the distribution (concentration).

  The present invention has been made on the basis of this finding, and by adhering the saw wire strands in a spot manner, the abrasive grains (diamond abrasive grains) are uniformly dispersed and adhered in a desired distribution (concentration) and fixed. A method, an apparatus, and a saw wire are provided.

  The present invention has been made to solve this problem, and includes a step of spot-magnetizing a saw wire element of a magnetizable material to form a magnetization region (magnetization region) on the surface of the saw wire element. The step of forming an atmosphere in which the abrasive particles adhering the adsorbing material to the magnet are suspended in the gas or suspended in the liquid, and the magnetized through the saw wire in which the magnetized region is formed in the atmosphere. A process of adsorbing abrasive grains to a region with a magnetic force to disperse and adhere abrasive grains to the surface of the saw wire, and after the dispersion adhering process or simultaneously with the dispersion adhering process, coating the plated metal on the saw wire A method of manufacturing a saw wire having a surface coated with a plating metal and having the abrasive particles fixed to the plating metal, an apparatus for performing the method, and the method so It is a saw wire.

  According to the present invention, there is an effect that abrasive grains (diamond abrasive grains) can be uniformly dispersed and deposited with a desired distribution (concentration) without causing so-called “powdery” on the saw wire. By magnetizing (magnetizing) in a spot manner, the magnetization region fluctuates with a fluctuation range of a predetermined magnetization intensity and a predetermined periodic fluctuation interval, and such a magnetization region uniformly distributes abrasive grains to a desired distribution ( The inventor speculates that this is one of the causes of dispersion adhesion in terms of concentration.

  As a result, according to the present invention, there is an effect that diamond abrasive grains can be more accurately and effectively fixed to the saw wire.

  Furthermore, according to this invention, an installation can be simplified and a manufacturing process can be simplified.

  Furthermore, according to the present invention, diamond abrasive grains can be fixed securely and efficiently even when the traveling speed of the saw wire is increased, and the productivity (the length of saw wire manufactured per unit time) is greatly increased. can do.

FIG. 1 is a schematic view of a diamond saw wire manufacturing process showing an embodiment of the present invention. FIG. 2 is a schematic diagram showing an example of an underwater diamond adhesion unit applied to the present invention. FIG. 3 is a schematic diagram showing an example of a magnetizing unit (magnetizing means) for spot magnetizing a saw wire element, which is applied to the present invention. FIG. 4 is a schematic diagram showing an example of a process in which diamond abrasive grains are suspended in a spraying manner in a dispersion adhesion tank, and a magnetized wire is passed through the diamond abrasive grains to adsorb the diamond abrasive grains on the surface thereof. is there. FIG. 5 is a diagram showing the relationship between the concentration of diamond abrasive grains in water and the number of diamond abrasive grains deposited per unit length (length: 1200 μm: number per 1.20 mm) when nickel plating is used as the fixed plating. FIG. 6 is a diagram showing the relationship between the concentration of diamond abrasive grains in water and the number of diamond abrasive grains deposited per unit length (length: 1200 μm: number per 1.20 mm) when the fixed plating is silver plating.

  Hereinafter, an embodiment of the present invention will be described in detail.

  FIG. 1 shows an embodiment of a diamond saw wire manufacturing apparatus and manufacturing process according to the present invention, and FIG. 2 shows an example of a diamond adhesion unit. The apparatus shown in FIG. 1 includes a wire unwinding device (10), a magnetizing device (20), a diamond adsorbing device (30), a temporary nickel wire, in order from the bottom of the drawing along the processing steps of the diamond saw wire W. The fixing electroplating device (40), the water washing device (50), the nickel or silver fixing electroplating device (60), the water washing device (70), the hot water washing device (80), and the winding device (90) are arranged in this order. Yes.

In this embodiment, first, a metal-plated saw wire element W is prepared.
This saw wire is obtained by, for example, a steel bus bar having a predetermined metal plating or a predetermined metal plating on the steel bus bar and then drawing to a desired wire diameter. The material of the saw wire may be any material that can be magnetized, but conventionally known magnetizable steel, such as JIS G 3502, JIS G 3506, can be effectively applied, and particularly preferably contains carbon. amount: 0.70 ⁺ or more JIS G 3522 piano wire (high strength strength ^{3000 N / m 2 ~3500 N /} m 2). The wire diameter of the saw wire is, for example, about 0.1 mmφ to 0.2 mmφ. The material of the metal plating is not particularly limited, but brass, copper, nickel, etc. are common. It is sufficient that the thickness of the metal plating layer is 0.5 μm, and it is not particularly necessary to specify it.

  Next, the saw wire element W is passed through a magnetizing device (20), and the saw wire element is spot-magnetized to form a magnetized region on the surface of the saw wire element. Spot-like magnetization refers to spot formation of a magnetized region (magnetized region) on the surface of a saw wire, and diamond abrasive grains are magnetically attached to this magnetized region in a later step, thereby producing diamond. It is intended that the abrasive grains are uniformly dispersed at a desired density, enabling effective and efficient fixing without causing so-called “dust accumulation”. The distance between the spot magnetization in the circumferential direction and the axial direction of the saw wire, the magnetization area, the magnetic strength, etc. are the density, degree of dispersion, number of abrasive grains fixed to the saw wire, and the diamond abrasive grains that occupy the surface area of the saw wire. It adjusts by setting suitably according to the objective saw wire, such as the ratio of.

  Those skilled in the art who understand the technical meaning of spot-magnetization can devise, present and implement various devices and mechanisms for spot-magnetization. it can. Such an apparatus and mechanism are both included in the spot magnetizing means of the present invention.

  FIG. 3 is an apparatus conceptually showing an example of the magnetization unit (21) constituting the means for magnetizing in a spot manner. In this apparatus, a pair of spot-like magnetizing means arranged vertically and a pair of spot-like magnetizing means arranged on the left and right are alternately arranged at regular intervals along the surface of the traveling saw wire. Thus, the surface of the saw wire is spot-magnetized at a desired density. In this case, by changing the magnet array distance (span between magnets), changing the size (area), shape and strength of the magnet, and changing the timing of contact with the magnet, it is spot-magnetized. In addition, the number, appearance, adsorption range, and the like of diamond abrasive grains adsorbed on the surface of the saw wire strand in the subsequent process can be appropriately changed.

  The spot-magnetizing means of the present invention is not limited to the example shown in FIG. 3, but a pair of spot-like magnetizing means arranged opposite to each other are alternately arranged at a constant interval in the longitudinal direction. (For example, only one of a pair of spot-like magnetizing means arranged up and down or a pair of spot-like magnetizing means arranged on the left and right) may be used, or arranged in two directions, up and down and left and right as shown in FIG. It may be arranged in three or more directions. Furthermore, if the spot magnetizing means (magnetizing device) itself is magnetized while rotating along the surface of the traveling wire, a helical magnetized region can be formed.

  In the present invention, the above-described various methods can be applied and further combined to form a spot-like magnetization region such as a desired magnetic force, area, and spacing on the surface of the saw wire.

  The magnetization strength is appropriately selected depending on the manufacturing conditions such as the concentration (density) of diamond abrasive grains in the plating bath, the current density, and the traveling speed of the saw wire in the plating bath. Gauss or higher is preferred.

  Further, not only magnetizing with a permanent magnet but also an apparatus that uses an electromagnet to control the electromagnet at ON / OFF at a desired interval can constitute the magnetized region forming means of the present invention.

  FIG. 2 shows an example of the magnetizing device (20) shown in FIG. 1 and a unit (diamond adsorption device: 30) for adhering diamond abrasive grains in water in the next step.

  This device communicates with a magnetizing device (31), a front portion of an underwater adsorption device (33) communicating with a pump (32), and a water tank (34) containing (suspended) diamond abrasive grains. The underwater adsorbing device (33) is arranged in sequence with the latter part, and the saw wire passes through these devices in order. The pump (32) and the water tank (34) communicate with each other at the lower part. The underwater adsorption device is a device corresponding to a dispersion adhesion tank.

  Diamond abrasive grains serve as abrasive grains for saw wires and have a diameter of about 10 to 30 μm. A material that can be adsorbed by magnetic force is attached to the diamond abrasive grains, and as this material, for example, nickel can be suitably applied. An electroless plating method can be effectively applied as a method for attaching nickel to the diamond abrasive grains. Such nickel-plated diamond abrasive grains can be obtained as commercial products from Tomei Diamond Industries (for example, product name IRV-NP), Irjin Japan, and the like. Generally, the amount of nickel or the like that adheres to the diamond abrasive grains is not particularly limited, but the above-mentioned commercially available products include those having a nickel adhesion amount of 30% by mass and those having 55% by mass, Either can be used effectively.

    The density of the diamond abrasive particles mixed in the water is appropriately selected depending on the magnetic force applied to the saw wire, the traveling speed of the saw wire, the current density, and the like, but preferably 50 g / l or more, for example. The saw wire is spot-magnetized through the magnetizing device (31), and forms a magnetized region in a distributed manner on the surface. Next, the saw wire passes through the underwater adsorption device (33), passes through the water in which the diamond abrasive grains in the water tank (34) are suspended, and is sent from the pump (32) to the magnetized region. Diamond abrasive grains are deposited.

  FIG. 2 shows an example of a unit for adhering diamond abrasive grains in water. However, as shown in FIG. 4, the unit can be attached in gas (for example, in air). In this case, air is blown into a tank through which the saw wire is inserted to float the diamond abrasive grains.

  Further, FIG. 2 shows diamond abrasive grains adhered and temporarily fixed and fixed by plating in a later step. However, if the inside of the water tank is electroplated as a plating bath composition, the diamond abrasive grains are The diamond abrasive grains pass through the suspended plating bath, and at the same time, the diamond abrasive grains adhere to the magnetized region. At the same time, a plated layer is formed on the surface of the saw wire, and the diamond abrasive grains adhering to the magnetized region are removed. It is also possible to adopt a method of fixing (or temporarily fixing) with a plating layer. Even when temporary fixing is performed at the same time, a fixing process (electroplating process) in a subsequent process is required. The plating bath composition such as plating performed simultaneously with adsorption, provisional plating, and main plating can be selected from known bath compositions based on the metal type of the plating layer to be formed, but forms a silver or nickel plating layer. Those having a desired bath composition are preferred. The silver or nickel plating layer preferably has a layer thickness of 5 to 10 μm in the main fixing in order to firmly fix the diamond abrasive grains.

  Returning to FIG. The above process (the wire to which the abrasive grains are attached is nickel-plated in a temporary fixing electroplating tank, the abrasive grains are temporarily fixed, and after washing with water, nickel or silver plating is performed in the fixing electroplating tank. After the surface of the saw wire having diamond abrasive grains fixed by the plating layer is cleaned by the water washing device (70) and the hot water washing device (80), the winding device (90) is obtained. The saw wire to which the diamond abrasive grains according to the present invention are fixed is produced.

  Although the diamond abrasive grains have been described here, the same applies to other abrasive grains.

  The overall image of the present invention has been described above in various embodiments. Hereinafter, a more preferable method for adhering (adsorbing) diamond abrasive grains will be described in detail.

(Air adsorption method)
FIG. 4 shows a unit for depositing diamond abrasive grains in air.

  In this unit, diamond abrasive grains (for example, 10 to 40 μm) float in the dispersion adhesion tank, and a saw wire strand (for example, 0.10 to 0.12 mmφ) dispersed and magnetized in a specific magnetization region on this surface. Pass through. Diamond abrasive grains adhere to the magnetization region of the saw wire. A saw wire strand (for example, 0.12 to 0.14 mmφ) to which diamond abrasive grains are attached is formed.

(Underwater adsorption method)
The diamond abrasive grains are suspended in water, and the saw wire is passed through the diamond abrasive grains to adsorb the diamond abrasive grains on the surface thereof. In this case, the state of the diamond abrasive particles adsorbed (attached) on the surface varies depending on the concentration (g / l) of diamond abrasive particles suspended in water, the particle size, the magnetization strength of the surface of the saw wire, the aspect of magnetization, and the like.

  The greatest feature of the underwater adsorption method is that water has a pH of 7 and is neutral, so that the plating layer on the surface of the abrasive grains does not dissolve. That is, when the solution is acidic, the plating layer on the abrasive grain surface is attacked by the acid and dissolves in the liquid and disappears from the abrasive grain surface. As a result, the abrasive grains have a weak adsorption force on the surface of the saw wire. Or the phenomenon that it is not adsorbed occurs, and the yield of abrasive grains decreases. On the other hand, since such a phenomenon does not occur in the underwater adsorption method, the yield of abrasive grains is improved. In the experiments by the inventors, it has been confirmed that the yield of abrasive grains is 95% or more.

(Plating solution adsorption method: adsorption and eutectoid occur simultaneously)
When diamond abrasive grains are suspended in a plating solution and a magnetized wire is passed through the solution, the abrasive grains adhere (adsorb) to the surface. At this time, the metal (nickel or silver) in the solution also precipitates by performing electroplating simultaneously. That is, eutectoid of diamond abrasive grains and metal is performed, and diamond abrasive grains on the surface of the strands increase. However, as described in the “underwater adsorption method” column, the metal layer coated with abrasive grains (for example, nickel) is subjected to an acid attack. According to the experiments of the present inventors, nickel coated on the abrasive grains dissolves in about 10 hours after being put into the plating bath, and completely dissolves and disappears in about 30 hours. For this reason, when the plating solution adsorption method is applied, it is necessary to supply diamond abrasive grains coated with a metal layer (for example, nickel) every 10 hours, for example. For this reason, there is a problem that the yield of abrasive grains is poor as compared with the underwater adsorption method.

(Use of neutral silver plating bath)
As described above, the “plating solution adsorption method” has a problem such as a decrease in the yield of abrasive grains, but this problem can be solved by using a neutral silver plating bath described below. That is, a non-cyan silver plating bath is used as the plating bath. The plating bath composition is neutral at pH 7. If this silver plating bath is used, the metal coated on the diamond abrasive grains is not dissolved and removed, so that a diamond saw wire can be manufactured stably for a long time.

Moreover, since the adhesion of the abrasive grains and the eutectoid are simultaneously performed, the advantage of the in-plating solution adsorption method can be maintained as it is.

(Utilization of silver plating deposition rate)
Silver has the fastest electroplating deposition rate (thickness deposited per minute at a current of 1 A / dm2), 0.63 μm / min, three times that of nickel. For example, it is said that nickel must be 7 μm thick in order to fix diamond abrasive grains to a strand. If plating is performed at a current density of 5 A / dm 2, an immersion time of about 7.0 minutes is required to deposit a thickness of 7 μm. This is a case where nickel is simply deposited, and at least 15 minutes or more is required to eutect the required number of diamond abrasive grains. In order to immerse in an effective plating tank length of 50 m for 15 minutes, the wire speed can only be 3.3 m / min. On the other hand, in the case of silver plating, the speed is 10 m / min, which is three times that in the case of nickel. As a result, productivity is improved and the raw material costs for silver plating are sufficiently covered, and as a result, production can be performed at a lower cost.

(Excellent lubricity of silver plating)
Nickel is generally said to have less frictional resistance. Silver has a lower frictional resistance than nickel. According to the inventor's experiment, it has been confirmed that silver has a coefficient of friction that is about 25% lower than that of nickel.

  Friction varies depending on the object to be contacted, and cannot be generally stated. However, in the case of a diamond saw wire, the object to be cut is silicon or sapphire, and the accuracy of the cut surface is regarded as a problem. Hard nickel is said to have a high cutting speed but a rough finish. On the other hand, although silver is softer than nickel, it is suitable for applications in which the accuracy of the target cut surface is a problem. Moreover, since silver is excellent in lubricity, it is also suitable for applications in which cutting speed is important. That is, it has a characteristic that can be applied to both a nickel fixing material for silicon cutting and a registration bond fixing material for sapphire.

  Using the process line of FIG. 1 (however, diamond adsorption in water), in Example 1, dispersion magnetization on diamond saw wire, adsorption of diamond abrasive grains in water, temporary fixation (electronickel plating), fixation (electronickel plating) ) To produce a diamond saw wire. In Example 2, a diamond saw wire was manufactured by fixing (electrosilver plating plating) instead of fixing (electronickel plating) in Example 1.

  The manufacturing conditions are as follows.

Used wire
JIS G 3522, SWP-B, 0.12mmφ, Brass plating 0.5μm
Magnetization conditions
Magnet strength 370m Tesla, 200m Tesla
Magnet dimensions Diameter 1mm
Magnet arrangement interval 5mm interval (interval between magnets)
Magnet arrangement Unidirectional
Diamond abrasive adsorption
Underwater adsorption
Abrasive grain concentration 10,30,50,70
Abrasive grain size: 10-30 μm,
Abrasive surface: nickel coating
Temporarily fixed electroplating
Nickel plating bath composition: Nickel chloride 240g / l Hydrochloric acid 120g / l
Nickel plating conditions: Current density 10A / dm2 Line speed 20m / min
Nickel plating thickness: 1μm
Fixed electroplating (in the case of Example 1)
Nickel plating bath composition: nickel sulfamate 400g / l, nickel chloride 30g / l, boric acid 40g / l
Nickel plating conditions: Current density 10A / dm2
Nickel plating thickness: 7μm
Fixed electrosilver plating (in the case of Example 2)
Silver plating bath composition: KF-A 500g / l KE-B 125g / l KE-C 25g / l
Silver plating conditions: current density 3.3A / dm2, liquid temperature 60 ℃
Silver plating thickness: 7μm
Note: Since the linear velocity was 20 m / min, the current density was 3.3 A / dm2, and the silver plating thickness was 7 μm.

(Test results)
The measurement was carried out with a 200 × microscope at 10 × 0.12 mmφ, ie, 1200 μm. 5 and 6 show the results (however, the numerical values are average values of n = 5).
In the case of Example 1 in which nickel plating was performed as the fixed metal, the number of diamond abrasive grains deposited per unit has a correlation with the concentration in water, and if it is 70 g / l or more, the target 120 ± 30 can be achieved. The stronger the magnetic force, the greater the number of abrasive grains.
Further, when the surface of the obtained saw wire was observed, there was no so-called “powder”, and diamond abrasive grains were fixed uniformly in the magnetized region.
In the case of Example 2 in which silver plating was performed as the fixed metal, there was almost no difference from Example 1. That is, it can be said that the number of diamond abrasive grains is determined by the number of adhering at the time of underwater adsorption and is hardly affected by the plating solution apparatus.
Except that the magnetized coil was used to form the magnetized region, the saw wire was manufactured under the same manufacturing conditions as in the above example, and the surface was observed. It was observed that the diamond abrasive grains were uniformly fixed.

DESCRIPTION OF SYMBOLS 10 ... Wire unwinding device, 20 ... Magnetizing device, 21 ... Magnetizing unit, 30 ... Diamond adsorption device, 31 ... Magnetizing device, 32 ... Pump, 33 ... Underwater adsorption device, 34 ... Water tank, 40 ... Nickel temporary fixation Electroplating device 50 ... Washing device 60 ... Stick electroplating device with nickel or silver 70 ... Washing device 80 ... Washing device 90 ... Winding device W ... Saw wire

Claims (20)

Magnetizing a saw wire element of a magnetizable material in a spot manner to form a magnetized region on the surface of the saw wire element;
Forming an atmosphere in which the abrasive grains adhering the adsorbent material to the magnet are suspended in the liquid or in the liquid;
In the atmosphere, through the saw wire strand in which the magnetized region is formed, the step of adsorbing the abrasive particles to the magnetized region with a magnetic force to disperse and attach the abrasive particles;
A step of fixing the abrasive grains by coating a plated metal on a saw wire, which is performed after the dispersion adhesion step or simultaneously with the dispersion adhesion step.
A method for producing a saw wire, the surface of which is coated with a plating metal, and the abrasive particles are fixed to the plating metal.   The method of claim 1, wherein the abrasive is a diamond abrasive. The step of coating the plated metal is performed after the dispersion adhesion step.
The method according to claim 2, wherein a saw wire having a surface coated with a plating metal and diamond abrasive grains fixed to the plating metal is manufactured.   The method according to claim 3, wherein the atmosphere is an atmosphere in which abrasive grains are suspended in a liquid, and the liquid is neutral.   The method according to claim 3, wherein the atmosphere is an atmosphere in which abrasive grains are suspended in a gas. The atmosphere is an atmosphere in which diamond abrasive grains adhering a material adsorbing to a magnet are suspended in a liquid, and the liquid is a plating bath containing a plating solution composition. Diamond abrasive grains adhering adsorbing material are suspended,
Performing simultaneously with the step of passing the saw wire through the plating bath, adsorbing diamond abrasive grains to the saw wire by magnetic force, and dispersing and adhering to the saw wire.
The method according to claim 2, wherein a saw wire having a surface coated with a plating metal and diamond abrasive grains fixed to the plating metal is manufactured.   The method according to claim 6, wherein the plating solution in the plating bath is a neutral silver plating solution.   The method according to any one of claims 1 to 7, wherein the saw wire is a steel wire coated with a component selected from the group consisting of copper, brass, and nickel or an alloy containing this component.   The method according to claim 1, wherein the material adsorbed on the magnet attached to the abrasive grains is nickel or a nickel alloy. Means for spot-magnetizing a saw wire element of a magnetizable material and dispersing and forming a magnetized region on the surface of the saw wire element;
A dispersion adherence tank that forms an atmosphere in which abrasive particles adhering an adsorbing material to a magnet are suspended in a gas or suspended in a liquid;
Means for passing and adhering abrasive grains to the magnetized region of the surface of the saw wire through the saw wire in the atmosphere in the dispersion adhering tank, and dispersing and adhering;
In the subsequent stage of the dispersion adhesion tank, or in the dispersion adhesion tank, provided with means for covering the saw wire with a plating metal to fix the abrasive grains,
An apparatus for manufacturing a saw wire, the surface of which is coated with a plating metal, and the abrasive particles are fixed to the plating metal.   The apparatus of claim 10 for producing a diamond saw wire, wherein the abrasive grains are diamond abrasive grains. The means for coating the plating metal is installed in the subsequent stage of the dispersion deposition tank,
The apparatus according to claim 11, wherein a saw wire having a surface coated with a plating metal and diamond abrasive grains fixed to the plating metal is manufactured. The atmosphere of the dispersion adhesion tank is an atmosphere in which diamond abrasive grains adhering a material adsorbing to a magnet are suspended in a neutral liquid,
Passing the saw wire into the neutral liquid, and adhering the diamond abrasive grains to the magnetized region of the surface of the saw wire by a magnetic force, and adhering to the magnetized region.
13. The apparatus according to claim 12, wherein a saw wire having a surface coated with a plating metal and diamond abrasive grains fixed to the plating metal is manufactured. The atmosphere of the dispersion adhesion tank is an atmosphere in which diamond abrasive grains adhering a material adsorbing to a magnet are suspended in a liquid containing a plating solution composition,
Simultaneously with the step of passing the saw wire through the plating bath and adhering the diamond abrasive grains to the magnetized region of the surface of the saw wire by magnetic force and dispersing and adhering them,
The apparatus according to claim 11, wherein a saw wire having a surface coated with a plating metal and diamond abrasive grains fixed to the plating metal is manufactured.   The apparatus according to any one of claims 10 to 14, wherein the saw wire is coated on a steel wire with a component selected from the group consisting of copper, brass, and nickel or an alloy containing this component.   The apparatus according to any one of claims 10 to 15, wherein the material adsorbed on the magnet attached to the abrasive grains is nickel or a nickel alloy.   The means for spot-magnetizing the saw wire is arranged such that magnets are arranged at predetermined intervals in the passage region of the saw wire, and the magnet region is formed on the surface of the saw wire by passing the saw wire through the magnetized portion. The apparatus according to claim 10, which is formed in a spot shape.   The means for spot-magnetizing the saw wire has an electromagnet arranged in a passing region of the saw wire and a control means for turning on / off the electromagnet, and the saw wire has a place for arranging the magnetizing means. The apparatus according to any one of claims 10 to 16, wherein the magnetized region is spot-formed on the surface of the saw wire by passing.   A saw wire manufactured by the method according to claim 1.   20. The saw wire according to claim 19, wherein diamond abrasive grains are dispersed and fixed on the surface of the saw wire, and the metal fixing the abrasive grains is nickel or silver.

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