CN106493635A - A kind of surface has the diadust grinding block of trench structure and processing method - Google Patents
A kind of surface has the diadust grinding block of trench structure and processing method Download PDFInfo
- Publication number
- CN106493635A CN106493635A CN201611028624.XA CN201611028624A CN106493635A CN 106493635 A CN106493635 A CN 106493635A CN 201611028624 A CN201611028624 A CN 201611028624A CN 106493635 A CN106493635 A CN 106493635A
- Authority
- CN
- China
- Prior art keywords
- diadust
- trench structure
- grinding block
- matrix
- metallic bond
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
Abstract
The invention discloses a kind of surface has the diadust grinding block of trench structure and processing method.The diadust grinding block includes matrix, diadust abrasive particle and metallic bond；The surface of described matrix has trench structure, and the surface of the matrix is divided into several coating zones by the trench structure；The diadust abrasive particle is brazed in the coating zone by the metallic bond.The invention provides a kind of surface has the diadust grinding block of trench structure and processing method, the processing characteristics of diadust grinding block is improved, also improve the surface quality of institute's grinding work-piece, improve the service life of diadust grinding block.
Description
Technical field
The present invention relates to a kind of diamond lap block, more particularly to a kind of surface has the diadust of trench structure
Grinding block and processing method.
Background technology
With information technology and the development of photoelectric technology, the demand to semi-conducting material, LED substrate materials is increasing.
And the method efficiently planarized as wafer surface in semi-conducting material and the processing of LED substrate materials is ground, with irreplaceable
Effect.Diamond abrasive grain has the premium properties such as hardness is high, intensity is high, heat stability is good, chemical stability is good.Diamond pricker
There is chemical fusion due to metallic bond and matrix, metallic bond and diamond abrasive in welding tool, make solder layer to Buddha's warrior attendant
The hold of stone is big, and Grain protruding height is big, and in process, abrasive particle is difficult for drop-off, therefore, diamond brazing milling tool
Become the indispensable effective tool of the various hard brittle materials of processing, semi-conducting material and LED materials.
With the fast development of semiconductor technology, the surface quality of photoelectric semiconductor material, wafer size are required also to get over
Come higher.In order to improve the surface quality of photoelectric semiconductor material, the diamond grinding tool of smaller particle size need to be selected.However,
Between fine-granularity diamond grinding block abrasive particle, chip space is little, and surface coolant flow is not smooth, and uneven.Produced in process of lapping
The raw bits liquid band that can not be cooled in time of grinding is walked, it is easy to is deposited between micropowder diamond abrasive, is caused micropowder diamond lap
Block surface blocks, and reduces the processing characteristics of micropowder diamond lap block and the surface quality of workpiece, while reducing micropowder diamond
The service life of grinding block.
This is based on, the invention provides a kind of surface has the diadust grinding block of trench structure.
Content of the invention
It is an object of the invention to overcoming the deficiency of prior art, there is provided a kind of surface has the diamond of trench structure micro-
Chip can quickly be discharged, be improved diamond by powder grinding block and processing method, the grooved raceway groove that is set up by matrix surface
The processing characteristics of micropowder grinding block, also improves the surface quality of institute's grinding work-piece, improves making for diadust grinding block
Use the life-span.
The present invention solve the technical scheme that adopted of its technical problem underlying for：
A kind of surface has the diadust grinding block of trench structure, it is characterised in that：Including matrix, diadust
Abrasive particle and metallic bond；The surface of described matrix has trench structure, and draws the surface of the matrix by the trench structure
It is divided into several coating zones；The diadust abrasive particle is brazed in the coating zone by the metallic bond.
As one kind preferably, it is mesh shape, radiation wire shaped or helix shape that the trench structure is.
As one kind preferably, the diamond abrasive grain is single-crystal diamond abrasive particle, and its particle diameter is W0.5～W40.
As one kind preferably, the grinding block matrix material is 45 steel or 0Cr18Ni9 rustless steels.
As one kind preferably, the end face of described matrix is circular, square or positive six deformations.
As one kind preferably, the metallic bond is Ni-Cr-B-Si metallic bonds, Ni-Cr-B-Si metals knot
The component ratio of mixture is：Ni 82%, Cr 8%, B 3.5%, Si 6.5%.
The present invention solve the technical scheme that adopted of its secondary technical problem for：
The processing method that a kind of surface has the diadust grinding block of trench structure, comprises the following steps：
(1) will be pasted onto on matrix with PVAL glue with mesh-structured mesh sheet template；
(2) after PVAL glue air-dry after, by metallic bond inject matrix surface mesh sheet template mesh-structured in；
(3) after metallic bond is air-dried, mesh sheet template is removed the surface obtained with metallic bond there is grooved
The matrix of structure；
(4) described matrix is carried out high-frequency induction heating, melts metallic bond and combined with matrix；
(5) metallic bond layer is polished, and diadust abrasive particle is combined with metal by electrodeposition technology soldering
The surface of agent；
(6) matrix by surface with diadust abrasive particle carries out high-frequency induction heating again, makes metallic bond
Combined with diamond abrasive grain surface, and obtained the diadust grinding block that surface has trench structure.
As one kind preferably, in step (5), it is 35 μm～45 μm that metallic bond polishes the thickness after processing.
As one kind preferably, the thickness of the mesh sheet template is 1mm, and described matrix is height 8mm, end face diameter is 15mm
Cylindrical shape.
As one kind preferably, the heating temperature for high-frequency induction for being used is 950 DEG C～1050 DEG C.
As one kind preferably, the particle diameter of the diadust abrasive particle is W40.
The invention has the beneficial effects as follows：
1st, by being additionally arranged trench structure in matrix surface, the chip produced by process of lapping can pass through trench structure
Exclude with coolant；Chip will not be stopped and is deposited between diamond abrasive, cause micropowder diamond lap block surface to block.Change
It has been apt to the processing characteristics of diadust grinding block, has also improved the surface quality of institute's grinding work-piece, improve diadust
The service life of grinding block.
2nd, diadust abrasive particle is brazed in matrix surface by metallic bond.Improve matrix surface micro- to diamond
The hold of grinding grain, and metal grinding agent passes through chemical fusion with diadust abrasive particle, bond strength is big.
3rd, the trench structure of matrix surface is mesh shape, radiation wire shaped or helix shape, it is easy to which chip is entered should
Trench structure, and quickly discharge the surface of matrix.
The present invention is described in further detail below in conjunction with drawings and Examples；But a kind of surface of the present invention has groove
The diadust grinding block of type structure and processing method are not limited to embodiment.
Description of the drawings
Fig. 1 is the top view of the diadust soldering grinding block of the present invention；
Fig. 2 is the side view of the diadust soldering grinding block of the present invention.
Wherein, 1, matrix, 11, trench structure, 12, coating zone；2nd, diadust abrasive particle；3rd, metallic bond.
Specific embodiment
Embodiment one：
Referring to shown in Fig. 1 and Fig. 2, a kind of surface of the present invention has the diadust grinding block of trench structure, and which is special
Levy and be：Including matrix, diadust abrasive particle and metallic bond；The surface of described matrix has trench structure, and passes through
The surface of the matrix is divided into several coating zones by the trench structure；The diadust abrasive particle is tied by the metal
Mixture is brazed in the coating zone.
It is mesh shape, radiation wire shaped or helix shape that the trench structure is.
The diamond abrasive grain is single-crystal diamond abrasive particle, and its particle diameter is W0.5～W40.
The grinding block matrix material is 45 steel or 0Cr18Ni9 rustless steels.
The end face of described matrix is circular, square or positive six deformations.
In the present embodiment, cylinder is taken with matrix, and as a example by trench structure takes mesh shape.
The metallic bond be Ni-Cr-B-Si metallic bonds, the component ratio of the Ni-Cr-B-Si metallic bonds
For：Ni 82%, Cr 8%, B 3.5%, Si 6.5%.
The diadust grinding block that the surface has trench structure can be processed by following processing method, processing step
Suddenly include：
(1) will be pasted onto on matrix with PVAL glue with mesh-structured mesh sheet template.
(2) after PVAL glue air-dry after, by metallic bond inject matrix surface mesh sheet template mesh-structured in.
(3) after metallic bond is air-dried, mesh sheet template is removed the surface obtained with metallic bond there is grooved
The matrix of structure.
(4) described matrix is carried out high-frequency induction heating, melts metallic bond and combined with matrix.
(5) metallic bond layer is polished, and diadust abrasive particle is combined with metal by electrodeposition technology soldering
The surface of agent；It is 35 μm～45 μm that metallic bond polishes the thickness after processing.In the present embodiment, processing thickness takes 40 μm.
(6) matrix by surface with diadust abrasive particle carries out high-frequency induction heating again, makes metallic bond
Combined with diamond abrasive grain surface, and obtained the diadust grinding block that surface has trench structure.
The heating temperature for high-frequency induction for being used is 950 DEG C～1050 DEG C.In the present embodiment, heating-up temperature takes 1020 DEG C.
The thickness of the mesh sheet template be 1mm, described matrix be height 8mm, end face diameter for 15mm cylindrical shape.
The particle diameter of the diadust abrasive particle is W40.
The technique that diadust abrasive particle is combined in metallic bond, needs the grain according to diadust abrasive particle
The type of degree metallic bond (solder) is being selected.Under conditions of the present embodiment, electrodeposition technology is used
It is processed.
The diadust that above-described embodiment only has trench structure for further illustrating a kind of surface of the present invention grinds
Abrading block and processing method, but embodiment is the invention is not limited in, every technical spirit according to the present invention is to above example
Any simple modification, equivalent variations and the modification that is made, each falls within the protection domain of technical solution of the present invention.
Claims (10)
1. a kind of surface has the diadust grinding block of trench structure, it is characterised in that：Grind including matrix, diadust
Grain and metallic bond；The surface of described matrix has trench structure, and divides the surface of the matrix by the trench structure
For several coating zones；The diadust abrasive particle is brazed in the coating zone by the metallic bond.
2. a kind of surface according to claim 1 has the diadust grinding block of trench structure, it is characterised in that：Institute
State trench structure to be is mesh shape, radiation wire shaped or helix shape.
3. a kind of surface according to claim 1 has the diadust grinding block of trench structure, it is characterised in that：Institute
Diamond abrasive grain is stated for single-crystal diamond abrasive particle, its particle diameter is W0.5～W40.
4. a kind of surface according to claim 1 has the diadust grinding block of trench structure, it is characterised in that：Institute
It is 45 steel or 0Cr18Ni9 rustless steels to state grinding block matrix material.
5. a kind of surface according to claim 1 has the diadust grinding block of trench structure, it is characterised in that：Institute
The end face for stating matrix is circular, square or positive six deformations.
6. a kind of surface according to claim 1 has the diadust grinding block of trench structure, it is characterised in that：Institute
Metallic bond is stated for Ni-Cr-B-Si metallic bonds, the component ratio of the Ni-Cr-B-Si metallic bonds is：Ni
82%, Cr 8%, B 3.5%, Si 6.5%.
7. the processing method that a kind of surface has the diadust grinding block of trench structure, it is characterised in that：Including following step
Suddenly：
(1) will be pasted onto on matrix with PVAL glue with mesh-structured mesh sheet template；
(2) after PVAL glue air-dry after, by metallic bond inject matrix surface mesh sheet template mesh-structured in；
(3) after metallic bond is air-dried, mesh sheet template is removed the surface obtained with metallic bond there is trench structure
Matrix；
(4) described matrix is carried out high-frequency induction heating, melts metallic bond and combined with matrix；
(5) metallic bond layer is polished, and by diadust abrasive particle by electrodeposition technology soldering and metallic bond
Surface；
(6) matrix by surface with diadust abrasive particle carries out high-frequency induction heating again, makes metallic bond with gold
Hard rock grain surface is combined, and obtains the diadust grinding block that surface has trench structure.
8. the processing method that a kind of surface according to claim 7 has the diadust grinding block of trench structure, its
It is characterised by：In step (5), it is 35 μm～45 μm that metallic bond polishes the thickness after processing.
9. the processing method that a kind of surface according to claim 7 has the diadust grinding block of trench structure, its
It is characterised by：The thickness of the mesh sheet template be 1mm, described matrix be height 8mm, end face diameter for 15mm cylindrical shape.
10. the processing method that a kind of surface according to claim 7 has the diadust grinding block of trench structure, its
It is characterised by：The heating temperature for high-frequency induction for being used is 950 DEG C～1050 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611028624.XA CN106493635A (en) | 2016-11-22 | 2016-11-22 | A kind of surface has the diadust grinding block of trench structure and processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611028624.XA CN106493635A (en) | 2016-11-22 | 2016-11-22 | A kind of surface has the diadust grinding block of trench structure and processing method |
Publications (1)
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|---|---|
| CN106493635A true CN106493635A (en) | 2017-03-15 |
Family
ID=58327688
Family Applications (1)
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| CN201611028624.XA Pending CN106493635A (en) | 2016-11-22 | 2016-11-22 | A kind of surface has the diadust grinding block of trench structure and processing method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107175593A (en) * | 2017-07-17 | 2017-09-19 | 鄂州市金锋超硬材料有限公司 | The preparation method of diamond-impregnated wheel without pure copper powder |
| CN107520770A (en) * | 2017-05-04 | 2017-12-29 | 漳州职业技术学院 | A kind of wear-resisting skive preparation method of abrasive particle crystal orientation distribution |
| CN109226920A (en) * | 2018-11-15 | 2019-01-18 | 蚌埠学院 | A kind of preparation method of brazed diamond tool |
| CN114714264A (en) * | 2022-04-22 | 2022-07-08 | 昆山耐信金刚石工具有限公司 | Superhard CBN (cubic boron nitride) ceramic grinding wheel and preparation method thereof |
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| CN1124480A (en) * | 1993-05-25 | 1996-06-12 | 顶点研磨料系统责任有限公司 | Patterned abrasive material and method |
| US20010011004A1 (en) * | 2000-01-28 | 2001-08-02 | Takakazu Yamaguchi | Grinding wheel and production process therefor |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107520770A (en) * | 2017-05-04 | 2017-12-29 | 漳州职业技术学院 | A kind of wear-resisting skive preparation method of abrasive particle crystal orientation distribution |
| CN107175593A (en) * | 2017-07-17 | 2017-09-19 | 鄂州市金锋超硬材料有限公司 | The preparation method of diamond-impregnated wheel without pure copper powder |
| CN107175593B (en) * | 2017-07-17 | 2019-01-04 | 鄂州市金锋超硬材料有限公司 | The production method of diamond-impregnated wheel without pure copper powder |
| CN109226920A (en) * | 2018-11-15 | 2019-01-18 | 蚌埠学院 | A kind of preparation method of brazed diamond tool |
| CN114714264A (en) * | 2022-04-22 | 2022-07-08 | 昆山耐信金刚石工具有限公司 | Superhard CBN (cubic boron nitride) ceramic grinding wheel and preparation method thereof |
| CN114714264B (en) * | 2022-04-22 | 2024-03-19 | 昆山耐信金刚石工具有限公司 | Superhard CBN ceramic grinding wheel and preparation method thereof |
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Application publication date: 20170315 |
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