CN204604125U - Plating hub type saw blade - Google Patents
Plating hub type saw blade Download PDFInfo
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- CN204604125U CN204604125U CN201520233621.4U CN201520233621U CN204604125U CN 204604125 U CN204604125 U CN 204604125U CN 201520233621 U CN201520233621 U CN 201520233621U CN 204604125 U CN204604125 U CN 204604125U
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- saw blade
- plating
- type saw
- hub type
- utility
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Abstract
The utility model provides a kind of plating hub type saw blade, has the flange matrix of Precision Aluminum alloy, flange matrix outer rim electroplated diamond abrasive material; Relative to prior art, the utility model has high tenacity, high accuracy, ultra-thin, long-life, the feature such as easy to use; Highly difficult chamfering cutting and ladder cutting processing can be carried out: operation is convenient, significantly reduces more allowing blade replacement and the time needed for plant maintenance; Many sizes abrasive particle and various bonding agent combine, and can meet different processing needs.
Description
Technical field
The utility model relates to a kind of scribing cutter of electronic applications, is specifically related to a kind of scribing cutter of electroplated diamond abrasive material.
Background technology
Along with the fast development of electron trade, the progressively raising of processing precision of products, process more and more becomes more meticulous, and product quality requires also more and more higher.
After Silicon Wafer preparation, need, after the series of process such as peroxidating, diffusion, photoetching, deposition, burn into detection, grinding, just can make regularly arranged IC-components.In order to the integrated circuit cutting and separating that arrangement is gathered, need to carry out scribing process, by device cutting and separating, encapsulate for wire bonding.Silicon wafer is cut into slices after crystal-pulling by polysilicon to form, and crystal silicon belongs to hard brittle material, poor ductility, so cutting processing easily occurs manufacturing deficiency.The scribing of silicon wafer belongs to Precision Machining scope, must ensure that otch is neat, impulse-free robustness, flawless after scribing.After integrated circuit is made, its value is quite high, if the technique imperfection of scribing, it is fatal for hitting the profit of manufacturer.So, study the scribing process of a kind of good dicing technique and scribing tool and high-quality and high-efficiency, very important great function is played to the development of integrated circuit.
Due to the crisp hard feature of silicon chip, so utilize the finishing that diamond is abrasive material, desirable scribing effect can be obtained.From manufacturing process aspect, silicon chip wafer cutting piece made from diamond mainly contains resinoid bond cutting blade, brazed abrasive wheel cutting blade, sintering cutoff wheel, plating electroforming cutting blade etc.The manufacturing process of resinoid bond cutting blade is by diamond abrasive grain and mixed with resin, and carry out attrition process with after pressure sintering sintering and heat cure, this kind of cutting blade hardness is lower, and thickness is large, makes it easily occur the phenomenon of beat and large groove width when cutting silicon crystal circle.For metallic bond cutting blade, the methods such as composite electrochemical deposition, high temperature brazing, sintering can be utilized to be combined into together with metal by diamond.High temperature brazing is main at present only adopts high temperature brazing manufacture for larger particles abrasive grinding wheel, for the manufacture that abrasive material is the precision of micro mist or super fine, superfine grinding and polishing grinding tool, because of be subject to high temperature brazing manufacturing process itself restriction, still have many technical barriers needing to solve; Utilizing and sintering the saw blade made is generally the film that O.1mm thickness be about greater than, the same with resinoid bond cutting blade, and the groove width that Silicon Wafer is arranged between integrated circuit is restricted.
Traditional cutting piece made from diamond is soft cutter, is to use the method for electroforming or sintering to imbed in metallic matrix by diamond, and carry out cutting-up after utilizing wheel hub clamping during cutting, the thickness of soft cutter is generally about 100pm, and after cutting-up, notch width is larger.
Summary of the invention
The utility model provides a kind of plating hub type saw blade, solves the excessive and soft cutter of diamond of existing diamond scribing cutter notch width and is difficult to fix, inconvenient problem with use.
The utility model realizes in the following manner:
Plating hub type saw blade, has the flange matrix of Precision Aluminum alloy, flange matrix outer rim electroplated diamond abrasive material.
Electroplated diamond abrasive thickness is 0.02 ~ 0.05mm.
Relative to prior art, the utility model has high tenacity, high accuracy, ultra-thin, long-life, the feature such as easy to use; Highly difficult chamfering cutting and ladder cutting processing can be carried out: operation is convenient, significantly reduces more allowing blade replacement and the time needed for plant maintenance; Many sizes abrasive particle and various bonding agent combine, and can meet different processing needs.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of plating hub type saw blade.
Wherein, 1 is matrix, 2 diamond abrasives.
Detailed description of the invention
Plating hub type saw blade as shown in drawings, has the flange matrix 1 of Precision Aluminum alloy, flange matrix 1 outer rim electroplated diamond abrasive material 2.Electroplated diamond abrasive material 2 thickness is 0.02 ~ 0.05mm.
During use, do not need to utilize wheel hub clamping saw blade, eliminate and operation is clamped to blade, significantly reduce more allowing blade replacement and the time needed for service equipment; This blade scribing thickness is little, decreases groove width, has saved Silicon Wafer cost.
Above-described is only preferred embodiment of the present utility model; should be understood that; for a person skilled in the art; do not departing under the utility model general idea prerequisite; some changes and improvements can also be made; these also should be considered as protection domain of the present utility model, and these all can not affect effect and the practical applicability of the utility model enforcement.
Claims (2)
1. electroplate hub type saw blade, it is characterized in that there is the flange matrix (1) of Precision Aluminum alloy, described flange matrix (1) outer rim electroplated diamond abrasive material (2).
2. plating hub type saw blade as claimed in claim 1, it is characterized in that, described electroplated diamond abrasive material (2) thickness is 0.02 ~ 0.05mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520233621.4U CN204604125U (en) | 2015-04-17 | 2015-04-17 | Plating hub type saw blade |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520233621.4U CN204604125U (en) | 2015-04-17 | 2015-04-17 | Plating hub type saw blade |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204604125U true CN204604125U (en) | 2015-09-02 |
Family
ID=53956707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520233621.4U Expired - Fee Related CN204604125U (en) | 2015-04-17 | 2015-04-17 | Plating hub type saw blade |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204604125U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108411355A (en) * | 2018-03-30 | 2018-08-17 | 郑州磨料磨具磨削研究所有限公司 | A kind of blade of hub type plating superthin diamond cutting blade puts the first edge on a knife or a pair of scissors method |
| CN108581865A (en) * | 2018-03-30 | 2018-09-28 | 郑州磨料磨具磨削研究所有限公司 | A kind of blade exposure method of hub type plating superthin diamond cutting blade |
| CN110216598A (en) * | 2019-06-24 | 2019-09-10 | 中山市思考电子科技有限公司 | Scribing cutter for semiconductor and processing technology thereof |
| CN111451952A (en) * | 2020-06-15 | 2020-07-28 | 郑州磨料磨具磨削研究所有限公司 | Manufacturing method of electroplating grinding wheel with micro-size cold water tank |
| CN114871954A (en) * | 2022-04-15 | 2022-08-09 | 郑州磨料磨具磨削研究所有限公司 | Special scribing cutter for ultrathin IC wafer and manufacturing method thereof |
-
2015
- 2015-04-17 CN CN201520233621.4U patent/CN204604125U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108411355A (en) * | 2018-03-30 | 2018-08-17 | 郑州磨料磨具磨削研究所有限公司 | A kind of blade of hub type plating superthin diamond cutting blade puts the first edge on a knife or a pair of scissors method |
| CN108581865A (en) * | 2018-03-30 | 2018-09-28 | 郑州磨料磨具磨削研究所有限公司 | A kind of blade exposure method of hub type plating superthin diamond cutting blade |
| CN108411355B (en) * | 2018-03-30 | 2020-04-03 | 郑州磨料磨具磨削研究所有限公司 | Blade edging method for hub-type electroplated ultrathin diamond cutting blade |
| CN110216598A (en) * | 2019-06-24 | 2019-09-10 | 中山市思考电子科技有限公司 | Scribing cutter for semiconductor and processing technology thereof |
| CN110216598B (en) * | 2019-06-24 | 2021-06-15 | 中山市思考电子科技有限公司 | Scribing cutter for semiconductor and processing technology thereof |
| CN111451952A (en) * | 2020-06-15 | 2020-07-28 | 郑州磨料磨具磨削研究所有限公司 | Manufacturing method of electroplating grinding wheel with micro-size cold water tank |
| CN111451952B (en) * | 2020-06-15 | 2021-11-05 | 郑州磨料磨具磨削研究所有限公司 | Manufacturing method of electroplating grinding wheel with micro-size cold water tank |
| CN114871954A (en) * | 2022-04-15 | 2022-08-09 | 郑州磨料磨具磨削研究所有限公司 | Special scribing cutter for ultrathin IC wafer and manufacturing method thereof |
| CN114871954B (en) * | 2022-04-15 | 2024-02-06 | 郑州磨料磨具磨削研究所有限公司 | Special dicing blade for ultrathin IC wafer and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150902 Termination date: 20190417 |