CN111451952A - Manufacturing method of electroplating grinding wheel with micro-size cold water tank - Google Patents
Manufacturing method of electroplating grinding wheel with micro-size cold water tank Download PDFInfo
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- CN111451952A CN111451952A CN202010542652.3A CN202010542652A CN111451952A CN 111451952 A CN111451952 A CN 111451952A CN 202010542652 A CN202010542652 A CN 202010542652A CN 111451952 A CN111451952 A CN 111451952A
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- cold water
- blade
- water tank
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- Materials Engineering (AREA)
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- Organic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses a method for manufacturing an electroplating grinding wheel with a micro-size cold water tank, which comprises the following steps: immersing a disc-shaped aluminum substrate into the electroplating solution, and forming a composite coating with the thickness of 10-50 mu m on the large end surface by shielding; removing the aluminum matrix behind the outer edge part of the composite coating, and then obtaining a disc-shaped blade with a blade edge with a specific length; moving the laser head to make the focal point of the laser head have a certain distance from the outer edge of the cutting edge, and adjusting the focal distance to make the laser head focus on the cutting edge; the base rotates to drive the blades to rotate, and the laser head processes cold water grooves which are arranged in a circumferential array on the blades; and the blade after laser processing is subjected to electrolytic polishing and knife grinding plate trimming. The non-contact processing mode ensures that the blade cannot be damaged in the manufacturing process of the cold water tank. On the basis of guaranteeing that the strength of the cutting edge is not obviously reduced, cold water tank structures are additionally arranged on two sides of the cutting edge, so that the cooling capacity and the chip removal capacity are enhanced, and glass, silicon carbide and thick silicon chips are well cut.
Description
Technical Field
The invention belongs to the technical field of electroplating superhard grinding tools, and particularly relates to a manufacturing method of an electroplating grinding wheel with a micro-size cold water tank.
Background
When the non-slotted electroplating scribing cutter is used for cutting materials such as glass, silicon carbide, thick silicon wafers and the like, great failures such as side breakage, back breakage and the like can be caused due to poor heat dissipation of the blade, poor chip removal conditions and the like. The manufacturing method proposed in patent publication No. CN108381411B can only manufacture electroplating soft knife with thickness of more than 50 μm, and the size of the groove is limited by the shielding fixture, and the groove with size of less than 1mm width is difficult to be manufactured. For the electroplated grinding wheel with the thickness less than 50 mu m, grooving cannot be carried out. The invention patent with publication number CN106521567A discloses a porous electroforming preparation method of a diamond ultrathin cutting blade, and the prepared electroplating soft knife has better chip removal performance, but only can be used for preparing the electroplating soft knife, cannot be used for preparing an electroplating grinding wheel, and cannot be used for preparing the electroplating grinding wheel with the thickness less than 50 mu m. The invention patent with publication number CN1718333A discloses a cutting insert and a manufacturing method thereof, which creatively makes alternate concentric circular grooves on both sides of a plating grinding wheel with the thickness below 50 um. But the thickness of the wafer can only be 30-50 um, and the cross section of the cutting edge is wavy, so that the groove-shaped side face of the cut wafer is also wavy and cannot be singly flattened. For applications requiring slot type, this solution blade cannot be applied. The patent publication No. CN106944940A discloses a method for manufacturing an electrodeposition grinding tool, wherein a grinding tool part with a porous structure is manufactured by a chemical method, the porous structure is used for improving the self-sharpening property of a blade, but the chip removal capability and the cooling capability are not obviously improved due to too small pore diameter. Because the randomness of chemical reaction can not guarantee to form uniform and stable holes, uniform distribution is difficult to achieve, and the strength of the cutting edge can be obviously reduced for the region with more concentrated holes, so that the risk of cutting is existed. In summary, in the prior art, for materials such as glass, silicon carbide, and thick silicon wafers, failure conditions such as large lateral collapse and back collapse occur due to poor heat dissipation of the blade and poor chip removal conditions.
Disclosure of Invention
The invention aims to provide a method for manufacturing an electroplating grinding wheel with a micro-size cold water tank, aiming at overcoming the defects of the prior art, and the method enhances the cooling capacity and the chip removal capacity of the electroplating grinding wheel.
In order to solve the technical problems, the invention adopts the technical scheme that:
a manufacturing method of an electroplating grinding wheel with a micro-size cold water tank comprises the following steps:
and 3, placing the exposed blade on a base, and positioning the exposed blade through a positioning column, wherein the outer diameter of the positioning column matched with the inner hole of the blade at the upper end of the base is 19.045-19.050 mm, and the base is made of 304 stainless steel. Moving the laser head to make the focal point of the laser head have a certain distance from the outer edge of the cutting edge, and adjusting the focal distance to make the laser head focus on the cutting edge;
4-1, processing a cold water tank positioned on the outer ring by the focal point of the laser head according to the set aperture;
4-2, moving the focal point of the laser head to an inner ring concentric circle, driving the blade to rotate by a set angle by the base, wherein the set distance enables the cold water groove position of the inner ring and the cold water groove position of the outer ring to be staggered by 1/2 steps, after an inner ring cold water groove is processed after positioning, returning the focal point of the laser head to the outer ring, and driving the blade to rotate by the base again by the set angle;
step 4-3, repeating the step 4-1 and the step 4-2 until the blade is finished at 360 degrees; if the selected cold water tank is a through hole, the cold water tank on the other side of the cutting edge does not need to be machined by turning the blade; if the selected cold water groove is a surface groove, the blade needs to be turned over to process the cold water groove on the other side of the cutting edge.
In the processing process, the focus of the laser head is processed on the blade in a jumping continuous mode, the processing mode can weaken the influence on the blade in the laser heating process, and the durability of the blade is prevented from being damaged by cold and hot impact.
The cold water tank is a surface groove with the size of 10-1000 mu m or a through hole with the aperture of 10-1000 mu m. The cold water tank is a circular or polygonal surface groove or through hole.
The cold water grooves are uniformly distributed on a plurality of concentric circles on the cutting edge, and the concentric circles and the outer circle of the cutting edge are concentric. The cold water grooves on two adjacent concentric circles are distributed in a staggered manner, so that the original strength of the cutting edge can be maintained to the maximum extent.
And 5, performing electrolytic polishing and trimming by a sharpening board on the blade subjected to laser processing to expose the diamond abrasive covered by the nickel bonding agent and remove residues caused by laser processing.
The invention has the beneficial effects that: the electroplating grinding wheel with the micro-size cold water tank processed by the manufacturing method has the advantages that both sides of the composite electroplated layer are processed in a laser head non-contact processing mode due to the fact that the electroplating grinding wheel with the micro-size cold water tank is provided with the micro-size cold water tank. The non-contact processing mode ensures that the blade cannot be damaged in the manufacturing process of the cold water tank. On the basis of ensuring that the strength of the cutting edge is not obviously reduced, cold water tank structures are additionally arranged on two sides of the cutting edge, so that the cooling capacity and the chip removal capacity are enhanced, and the cutting knife can be used for cutting glass, silicon carbide, thick silicon wafers and the like well.
Drawings
FIG. 1 is a schematic view of a structure of an electroplated grinding wheel;
FIG. 2 is a schematic view showing the distribution of cold water grooves on the surface of a blade;
fig. 3 is a schematic view of the cold water tank.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure.
As shown in fig. 1 to 3, a method for manufacturing an electroplated grinding wheel with a micro-sized cold water tank 4 includes:
And 3, placing the exposed blade of the blade 2 on a base 5 and positioning the exposed blade through a positioning column, wherein the outer diameter of the positioning column matched with the inner hole of the blade at the upper end of the base 5 is 19.045-19.050 mm, and the base 5 is made of 304 stainless steel. The laser head 6 is moved so that its focal point is at a distance from the outer edge of the blade 2 and is adjusted so that it focuses on the blade 2.
4-1, processing a cold water tank 4 positioned on the outer ring by the focal point of the laser head 6 according to the set aperture;
step 4-2, moving the focal point of the laser head 6 to an inner ring concentric circle, driving the blade to rotate by a set angle by the base 5, wherein the set distance enables the position of the cold water groove 4 of the inner ring and the position of the cold water groove 4 of the outer ring to be staggered by 1/2 steps, after the inner ring cold water groove 4 is processed after positioning, returning the focal point of the laser head 6 to the outer ring, and driving the blade to rotate by the set angle again by the base 5;
step 4-3, repeating the step 4-1 and the step 4-2 until the blade is finished at 360 degrees; if the selected cold water tank 4 is a through hole, the cold water tank 4 on the other side of the blade 2 is not required to be machined by turning over the blade; if the selected cold water groove 4 is a surface groove, the blade needs to be turned over to process the cold water groove 4 on the other side of the blade edge 2.
The cold water tank 4 is a surface groove with the size of 10-1000 mu m or a through hole with the aperture of 10-1000 mu m. The cold water tank 4 is a circular or polygonal surface groove or through hole.
The cooling water tanks 4 are uniformly distributed on the blade 2 on a plurality of concentric circles, and the concentric circles are concentric with the outer circle of the blade 2. The cold water grooves 4 on two adjacent concentric circles are distributed in a staggered way, so that the original strength of the blade 2 can be maintained to the maximum extent.
Step 5, exposing the grinding materials: the blade 2 after laser processing is subjected to electrolytic polishing and trimming by a sharpening plate, so that the diamond abrasive covered by the nickel bonding agent is exposed, and meanwhile, residues caused by laser processing can be removed.
The electroplating grinding wheels with the micro-size cold water tanks 4 processed by the manufacturing method have the micro-size cold water tanks 4. The non-contact processing mode ensures that the blade 2 is not damaged in the manufacturing process of the cold water tank 4. On the basis of ensuring that the strength of the cutting edge 2 is not obviously reduced, the cold water grooves 4 are additionally arranged on the two sides of the cutting edge 2, so that the cooling capacity and the chip removal capacity are enhanced, and the cutting tool can be used for cutting glass, silicon carbide, thick silicon wafers and the like well.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are given by way of illustration of the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. The scope of the invention is defined by the appended claims and equivalents.
In the description of the present invention, it is to be understood that the terms "front", "rear", "left", "right", "center", etc., indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the scope of the present invention.
Claims (5)
1. A manufacturing method of an electroplating grinding wheel with a micro-size cold water tank is characterized by comprising the following steps:
step 1, immersing a disc-shaped aluminum substrate into an electroplating solution, wherein the electroplating solution comprises diamond micro powder with the granularity of 2000# -5000 #, and a binding agent metallic nickel, and a composite coating with the thickness of 10-50 mu m is formed on a large end face through shielding;
step 2, removing the aluminum substrate behind the outer edge part of the composite plating layer to obtain a disc-shaped blade with a specific length of the blade edge, wherein one part of the composite plating layer exceeds the aluminum substrate and is called a blade edge;
step 3, placing the exposed blade on a base, positioning the exposed blade through a positioning column, moving a laser head to enable the focal point of the laser head to be away from the outer edge of the blade by a certain distance, and adjusting the focal distance to enable the laser head to be focused on the blade;
step 4, the base rotates to drive the blades to rotate, and the laser head processes cold water grooves which are arranged in a circumferential array on the blades;
and 5, exposing the diamond abrasive covered by the nickel bonding agent by the blade subjected to laser processing through electrolytic polishing and trimming by a sharpening board.
2. The method for manufacturing the electroplated grinding wheel with the micro-sized cold water tank as claimed in claim 1, wherein the electroplating process comprises the following steps: the cold water tank is a surface groove with the size of 10-1000 mu m or a through hole with the aperture of 10-1000 mu m.
3. The method for manufacturing the electroplated grinding wheel with the micro-sized cold water tank as claimed in claim 2, wherein the electroplating process comprises the following steps: the cold water tank is a circular or polygonal surface groove or through hole.
4. The method for manufacturing the electroplated grinding wheel with the micro-sized cold water tank as claimed in claim 3, wherein the step 4 comprises the following steps:
4-1, processing a cold water tank positioned on the outer ring by the focal point of the laser head according to the set aperture;
4-2, moving the focal point of the laser head to an inner ring concentric circle, driving the blade to rotate by a set angle by the base, wherein the set distance enables the cold water groove position of the inner ring and the cold water groove position of the outer ring to be staggered by 1/2 steps, after an inner ring cold water groove is processed after positioning, returning the focal point of the laser head to the outer ring, and driving the blade to rotate by the base again by the set angle;
step 4-3, repeating the step 4-1 and the step 4-2 until the blade is finished at 360 degrees; if the selected cold water tank is a through hole, the cold water tank on the other side of the cutting edge does not need to be machined by turning the blade; if the selected cold water groove is a surface groove, the blade needs to be turned over to process the cold water groove on the other side of the cutting edge.
5. The method for manufacturing an electroplated grinding wheel with a micro-size cold water tank according to any one of claims 1 to 4, characterized in that: the base is made of 304 stainless steel.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113172779A (en) * | 2021-04-01 | 2021-07-27 | 郑州磨料磨具磨削研究所有限公司 | High-strength scribing knife for semiconductor wafer step cutting and manufacturing method |
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2020
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113172779A (en) * | 2021-04-01 | 2021-07-27 | 郑州磨料磨具磨削研究所有限公司 | High-strength scribing knife for semiconductor wafer step cutting and manufacturing method |
CN113172779B (en) * | 2021-04-01 | 2022-06-03 | 郑州磨料磨具磨削研究所有限公司 | High-strength scribing knife for semiconductor wafer step cutting and manufacturing method |
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