TWI355986B - Superhard cutters and associated methods - Google Patents

Description

1355986 IX. Description of the Invention: [Technical Field] The present invention relates to an ultra-hard cutting device which is used for removing materials on workpieces formed of various materials (for example, p-ane, fine Smooth, polish and dress, etc.). Accordingly, the present invention relates to the fields of chemistry, physics, and materials science. [Prior Art] It is estimated that the semiconductor industry currently spends more than $100 million annually to fabricate wafers having a very flat and smooth surface. Code (4), Chemical Mechanical Polishing (CMP) is used in the fabrication of semiconductor devices to obtain smooth wafers. In conventional processes, the wafer to be polished is typically mounted on a carrier that is positioned over a polishing pad attached to a rotating platform. When a polishing liquid is applied to the polishing pad and pressure is applied to the carrier, the carrier is moved relative to the rotating platform to polish the wafer. Although this known process has been successfully used for many years, it still encounters several questions. For example, the conventional process is relatively expensive and not always efficient, since the wafer may not be uniform in thickness after the process is completed, and may not be smooth enough. In addition to being overexpressed by solvents, the 'wavy' dream wafer surface may have a lack of σ due to the individual abrasive particles used in process t. In addition, if the productivity is to be increased by accelerating the removal rate, it is necessary to increase the size of the abrasive particles on the polishing crucible, which leads to an increased risk of injury or fragrant wearing of the expensive crystal. In addition, since the surface gap may be discontinuous, the process productivity becomes very low, and the wafer surface preparation measures of the current technical process are generally expensive and slow. 5 1355986

In addition to the above considerations, the line width (e.g., node) of a circuit on a semiconductor currently reaches a viral size range (e.g., 1 〇 1 〇〇 nm). In addition, more layers of circuitry are currently being fabricated to meet the increased demand for advanced logic designs. In order to provide a multilayer structure for fabricating nano-sized structures, the layers must be extremely flat and smooth during semiconductor assembly. While diamond particle reticle trimmers have been used effectively to refurbish CMp polishing pads used to polish the aforementioned integrated circuit designs, these refractory devices are not suitable for fabricating edge trimming devices having nodes less than 65 nm. This is because, when reducing the copper wire size, the uneven thickness caused by rough polishing or excessive polishing will dramatically change the conductivity H. Due to the dielectric layer, the fragile structure must pass through the extremely gentle polishing. To avoid fragmentation Y, the pressure used in the CMP process must be greatly reduced.

To this end, new CMp processes such as copper electrolysis (Applied Materials' EcMp) or gas film pad slab wafers (Semitsu, Japan) reduce the polishing force of the contact points between the polishing pad and the wafer. However, the result of the light polishing operation will result in a decrease in the polishing rate of the wafer. In order to compensate for the loss of productivity, the entire surface of the wafer must be polished at the same time. For this reason, the contact point of the polishing pad to the wafer must be smaller in area, but it must be more in number. This practice is contrary to the practice of CMP with a relatively large contact area and a relatively small number of contact points. ...so that in order to make the fragile wafers more and more gentle, it is necessary to reduce the coarse sugar portion of the CMP polishing crucible. However, in order to avoid polishing rate: drop, more contact points must be created. Inevitably, the rough portion of the polishing pad must be finer in size and more in number. However, the finer the polishing process is, the higher the risk of damage to the surface of the wafer. To avoid the risk of scratching, the highest tip of all rough parts must be completely equal. Otherwise, a few prominent "killer roughs" will damage the polished wafer. v [Summary] The present invention provides a cutting device comprising a base comprising a plurality of independent polycrystalline (P()|ycrystamne) cutting elements, the independent polycrystalline cutting elements are fixed in a solid organic On the material layer. Each individual polycrystalline cutting element can comprise a uniform geometry.

In another aspect, the invention provides a cutting device comprising a base, the base is provided with a layer of solid organic material, and a plurality of independent polycrystalline cutting elements are sighed on the solid organic material, and each individual polycrystalline cutting The cutting tip of the element comprising at least one cutting tip m cutting element is aligned on a common plane. Another aspect of the present invention provides a method of forming a cutting device comprising: obtaining a substrate &; disposing a plurality of monolithic polycrystalline cutting elements on the substrate in an unhardened organic material, each independently The polycrystalline cutting element has a substantially uniform geometry that is hardened to form a layer of solid organic material such that each individual polycrystalline cutting element is secured within the layer of solid organic material. The various features of the present invention are generally described herein, and thus, the detailed description of the present invention will be more readily apparent, so that the present invention will be more fully understood. Other features of the present invention will become more apparent from the detailed description of the appended claims. 7 1355986 [Embodiment] Before the present invention is disclosed and described, it is understood that the invention is not limited to the specific structures, process steps or materials disclosed hereinafter, but may be extended to those skilled in the related art. Equals as understood by the person. It should also be understood that the techniques used herein are for purposes of describing particular embodiments only and are not intended to be limiting.

It must be noted that the articles "a" and "the" are used in the specification and the scope of the appended claims, unless the meaning For example, "a cutting element" includes one or more such elements. Definitions In describing and requesting the present invention, the following terms are used in accordance with the definitions set forth below:

All mesh sizes used herein are U.S. meshes unless otherwise indicated. In addition, because the particle size in a particular "mesh size" may actually differ in size by a small size distribution range, the mesh size generally understood refers to the particle size of the particle. Average mesh size. A section comprising a section 'where the base is aligned. For example, the "general plane" used in the section, the wavy profile, and the convex section means that the flat surface of the base surface or the specific surface of the base is a peak or tip of the cutting element. In this case, a planar section surface, a concave section, a multi-step surface, and the like may be included. As used herein, "edge" means a portion of a cutting element whose package 8 1355986 contains a measurable width contact across the portion and eliminates a workpiece i, which is used for the tool There is a visit to the figure shown as 'a typical pair-piece yaw and 4, the knife can cut the "edge" from the workpiece:::: or " under the material 'by this cut and fixed Cut: "tip" means - the part of the cutting element that has the greatest distance from the one, for example, it is the first part of a (four)-piece, ♦ too double t Danma cuts the field of the field. The monthly items are in use. When, a workpiece.可 Μ θ θ This part touches 1 dry 』 It is understood that a cut "Φ -g-.-,, 鸲" contains a plane 'a cutting element to contact a workpiece (four) = beef surface, pointed surface Or the edge is the f set & The clamp (the cutting device to which the cutting element is attached is intended to remove material from the workpiece). As used herein, "burning, after 4t human °', S is connected to two two or more independent particles to form a continuous solid state to at least partially eliminate...: the process involves bonding the voids of the particles. Sintering It can occur between carbonaceous particles such as metal or diamonds. The sintering of metal particles occurs at various temperatures depending on the composition of the material. The sintering of diamond particles generally requires super-pressure and carbon as an aid to diamond sintering. Solvents, which are discussed in more detail below. Sintering aids usually appear in the sintering process' and there are - part of the auxiliary residues may be in the final product. The "superhard" used herein can be used to mean any Mohs hardness (_0 Hardys) up to about 8 or higher crystalline material, polycrystalline material or a mixture of such materials. In some aspects, Mohs hardness can be up to about 9 5 or higher. Such materials include, but are not limited to, diamonds, polycrystalline diamonds 9 1355986 (P〇lyC "ySta丨丨丨ne Diam〇nd, PCD", cubic nitride butterfly (cub丨cB〇"〇n, Nitride, cBN) Polycrystalline cubic boron nitride (pcBN) and superhard materials well known to those skilled in the art. Superhard materials can be integrated into the moon in different forms. The form of the sea contains particles (partjc丨es). Sand shovel (called (8),

Films, layer structures (丨ayers), and the like. However, in most of the examples, the superhard material of the present invention is in the form of a polycrystalline superhard material such as pcD and PcBN materials. Importantly, it is worth noting that the disclosure reveals the difference between traditional superhard sand and polycrystalline superhard materials.

As used herein, "geometry" refers to a shape that is described by mathematical terms that are easily understood and cognitive. Examples of shapes that make up "geometry" include, without limitation, cuboids, polyhedral shapes (including regular polyhedrons), triangles (including equilateral triangles, and equilateral triangles (|s〇sce|es ding" plus handsome and three-dimensional triangles ), pyramid, sphere, rectangle, "Pie Shape", wedge, octagon, and circle, and so on.

As used herein, "organic material" means a semi-solid or solid composite amorphous mixture of organic compounds. Therefore, the "organic material layer" and the "organic material matrix" may be used interchangeably, and refer to a layer structure or a bulk of a semi-composite amorphous mixture of organic compounds. Preferably, the oxime is a polymer or a ruthenium osmium molecular polymer (c〇p〇|ymer) formed by polymerization of one or more monomers. As used herein, "metal" and "metal-containing" are used interchangeably and refer to either a metal or two or sigma. Those skilled in the art of the present invention can understand the metal ... copper, chromium, iron, steel, stainless:: type 'net steel, titanium, crane, zinc, wrong, turn 10 and its alloys or compounds. As used herein, "hetero j"' is used to refer to a superabrasive material and refers to particles of such materials. The particle system of A or the like may have various shapes such as a shape, an ellipse, a square, a self-shape (Euhedra), and the like, and a mesh size of a specific number. As is well known in the art, "mesh", in the case of mesh in the United States, refers to the number of holes per unit area. The "particles" and "gravel" referred to herein may be used interchangeably. Here, the "cut π piece" describes various configurations of material that can be removed (cut down) from a workpiece. - The cutting element can be a body that can include cutting ends, cutting ridges, and cutting surfaces on or in which the back number is formed. It may be noted that the cutting end points, the cutting ridges, and the cutting table may be formed by a plurality of roughness or projections of the block. The cutting element can comprise - independent particles which can comprise only one of the cutting end points, the cutting ridges and the cutting table formed thereon. The term "grid" as used herein refers to a pattern formed by a plurality of rows of squares. As used herein, "mechanical force" refers to any physical force that impinges on an object to produce - mechanical stresses in or around the t body. The example of mechanical = can be Frictiona (Force) or resistance (1) is called "ce". Therefore, the terms "friction" and "resistance" can be used interchangeably, and refer to the machine that impacts on the object as described above. force. As used herein, "mechanical stress" refers to the resistance against a mechanical force per unit area when there is an impact mechanical force intended to compress, separate or slide-object. Here, (4) "Pr〇fj|e" means a 1355986 profile on the surface of an organic material layer intended to highlight a plurality of superhard abrasive particles. As used herein, "mechanical bond" and ")" are used interchangeably and refer to a bonding interface formed by friction between two objects or a wide structure. In some instances, 彳 increases the friction between the bonded objects by expanding the surface area of contact between the objects and adding other specific geometric structures, such as wrapping the object around the other object. ▲ "About" as used herein refers to a complete or near-complete range of effects, characteristics, properties, and state mu results or processes. For example, an object is "substantially" covered, meaning it is completely The ground is covered 'either completely or completely. The degree of deviation that is allowed to differ from the absolute degree of completeness may, in some cases, depend on the text of the specification. However, in general, the results obtained when approaching complete will be the same as those obtained when absolutely and completely complete. As usual. When "substantially" is used to describe a complete or near complete lack of an action, feature, sex 2, state, structure, article or result, the mode of use is equally applied as previously described. For example, - "substantially does not contain" the composition of the particles can be completely devoid of particles, or nearly completely lacking particles to the extent that they are completely lacking particles. In other words, as long as the composition of the "substantially included" original, the bucket or the 7C piece does not have the effect of being able to be measured, the composition of the sea can actually contain these materials or components. As used herein, "about" means that the value given to the endpoint elasticity of the range of values can be a little higher or lower than the endpoint. 12 I355986 The plural items, structural elements, group members and/or materials used herein may be presented in a general list for convenience. However, such lists should be interpreted as: Each member of the list is considered to be a separate and distinct member. Therefore, members based on this list appear in the same group without other negative instructions, and each member of this list should not be interpreted as being the same as any other member in the same list.

Concentrations, amounts, and other numerical data can be expressed or presented in a range. It is to be understood that the scope of the present invention is to be construed as being limited in the scope of the Subrange. Therefore, independent numerical values such as 2, 3, and 4, sub-ranges such as 彳_3, 2·4, and the like, and 1, 2, 3, 4, and 5 are included in the numerical range. A single number of large values should be applied as the minimum or maximum value. Moreover, the extent of the described range or feature is a useful explanation. The present invention provides a cutting apparatus and a method for re-correlation of the same, which can be used to cut or affect a workpiece to remove material from the workpiece and to remove material. Is the workpiece completely smooth and/or worn? Gentleman 4 ~ surface. Cutting of the invention

The arrangement can be used beneficially, for example as -r- , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Μ 1 and as a polishing apparatus in the first embodiment of the present invention, a 13 丄 355 986 cutting device (1Ga) (for example, a disk) having a package-containing base (12a) The pedestal (123) may comprise a layer of machine material (FIG. nB (14)) that is disposed, attached or attached to the susceptor (12a). A plurality of individual polycrystalline cutting elements (i6a) may be attached to the solid organic material layer. Each of the individual polycrystalline cutting parts can have or exhibit - substantially the same geometry, for example the geometry of the cutting element can be substantially identical to the geometry of the other cutting elements - the implementation shown in Figure -B In the example, each of the individual polycrystalline cutting pieces (10) has a substantially cuboidal geometry. In the embodiment shown in the figure: the individual polycrystalline cutting element (16^ has a geometric structure, which may be a three-dimensional triangular structure. As shown in the first-second and second-order diagrams, in the present invention In one aspect, the 3b), the cutting tips of the 70 pieces can be aligned in a common plane (2〇a) (20bU. In this example, the common plane is a flat surface and has a - 纟 solid state The preset height of the organic material substrate is high. Therefore, the independent polycrystalline (four) element can be fixed in the organic material layer by the precise method of the material so that the cutting elements contact the guard (not shown in the figure) The individual cutting elements can be removed from the workpiece at substantially the same depth. In this way, when the cutting device is moved relative to a workpiece, each of the individual cutting members substantially suffers the same degree of resistance. This can advantageously limit the early detachment of the individual cutting elements, which may result in ugly tool life and/or damage to the workpiece being machined. The independent cutting element (16a) (16b) can be formed from a variety of materials, consistently applied In the case, it can contain Material or superhard polycrystalline material. Although not limited to 14 1355986, the superhard polycrystalline material can be polycrystalline diamond (p〇|yc "ysta丨丨丨μ Diamond, PCD) dense structure or polycrystalline Polycrystalline cubic Bo", Nitrjde (PcBN) dense structure. The PCD or PcBN sensitive structure can be formed by various methods as detailed below" by forming a separate cutting element with a polycrystalline material, and will be independent (4) The components are individually attached to the cutting device, and the advantageous properties of the polycrystalline cutting element can be achieved without the need for the polycrystalline material (4) to be used in the cutting device that is not used for cutting. Therefore, considerable cost savings can be achieved. The cutting device of the present invention can be used in a variety of applications, and in an invention, it is particularly well-suited for flat and fragile and fragile materials, such as the stone wafer and the glass metal used for flattening for recycling.矽 wafer, ^ panel (LCD) glass, light-emitting diode _) substrate carbon (Silicon Carbide \ 曰, , ) Japanese yen, quartz wafer, nitride lithium and oxidation = = traditional sand wafer process technology The wafer to be polished is disposed on a polishing crucible that is placed on the polishing crucible under pressure and polished. Thus, the relative motion of the wafer grinds the wafer or It is polished and the V-circle is basically subjected to a very fine abrasive material to the first to reach a fairly smooth surface. Feeding ==; Some grinding work in the circle, in the material fragments of the wafer, etc. Often produced from the material body torn off or at least one of the results - Qiu, & less than expected completion of the work. This node (tip from the grinding process (four) on the grinding material on the tip of the point Each other does not localize the pressure at a level of 15 1355986 to cause the abrasive to remove material from a workpiece. The PCD or pCBN 4:773⁄4丨-BN cutting sub-assembly of the present invention is generally a super-hard material, which causes the cutting element to be pressed against a wafer and the crucible is not easily deformed. Since the hardness is a measure of the concentration of energy, for example, the energy of the retention potential, such as the mother's early volume, the PCD or PcBN dense structure of the present invention can be θ. Volume without damage. Because of the ability of the ancestors to find the edge with very few atoms, these materials maintain a sharp cutting edge.

It is not necessarily the case that the individual polycrystalline cutting elements (16a) may be arranged in the form of a grid pattern, such as a square pattern, in the organic material layer or in the embodiment of the invention as shown in the drawings. Inside or above the pedestal. The cutting elements can be evenly spaced from one another to have a spacing (4) of from about 1 〇〇 to about 800 微米. In one aspect of the invention, the individual polycrystalline cutting elements can be evenly spaced from each other to have a spacing (d) of about 5 Å. In the embodiment shown in Figure 2A, the individual polycrystalline elements (16a) may be disposed in or on the organic material layer or pedestal in a plurality of 'u circles. In the above embodiments, the individual cutting elements may be evenly spaced from one another to have a spacing (d) from a large A 〇〇 to about 8 〇〇 microns. In one aspect of the invention, the individual polycrystalline cutting elements can be evenly spaced from one another to have a spacing (d) of about 500 microns. By evenly spacing the individual cutting elements from each other, the resistance applied to the cutting elements during the cutting process can be evenly distributed in each of the cutting elements, which eliminates or reduces the risk of one or more of the individual cutting elements coming off early. . Early premature detachment of one or more independent cutting elements can result in severe damage to the workpiece being processed. Each of the eight: eight independent plastic wafer cutting elements is placed in - the organic material is 2 strokes in any independent polycrystalline cutting element. =枓: To:: enter the independent cutting element to remain in the organic: 2 to keep the work carefully handled on the solid organic material layer. j疋 right to two

A variety of configurations and configurations can be considered to minimize the mechanical stress acting on the grinder: for the spacing described above, the := one:: parameter can include the relative height at which the component protrudes from the layer of organic material. Cutting elements that are large and significantly higher than other cutting elements will (iv) impact mechanical forces, and therefore are more prone to self-solidification from the solid state: :. Therefore, an abrasive tool having a uniform height-distributed cutting element can act to more effectively maintain the integrity of the abrasive tool than in the case of a cutting element having no uniform height distribution.

In one aspect, substantially all of the individual cutting elements can be highlighted on the layer of solid organic material « ^ ^ ~, the dog is out of the default. While any useful preset height for a grinder or cutter would be considered in the context of the present invention, in two specific aspects, when used to grind a workpiece, the predetermined height can produce a less than about 20 microns. Cutting depth. In another particular aspect, the predetermined height produces a depth of cut from about 彳 to about 2 〇 micrometers when used to grind a workpiece. In yet another particular aspect, the predetermined height produces a depth of cut from about 1 〇 to about 2 〇 microns when used in a grinding-work. In yet another particular aspect, the predetermined height produces a depth of cut that is at or above 17 1355986 50 or 100 microns. It should be noted that the individual cutting elements are flattened at a predetermined height = depending on the spacing of the cutting elements. In other words, the impact of the impact forces on the cutting elements between the cutting elements is greater. The pattern of the centroid spacing can be benefited from small changes in the preset height.切割 The cutting element protrudes from the layer of solid organic material up to a number of different heights, and this height is good for Gotha. The specified profile can be achieved in accordance with this and can be achieved in a variety of configurations. In the flat section on the one hand = the specific use of the tool, all the cut-off-/sections can be a plane. In the flat. Weight (iv) θ J : The highest point of the piece is expected to be approximately 疋, although these points are preferably aligned with the - specified section, allowing some height deviation between the cutting elements. In addition to the flat profile produced by the limitation of ^ itself, the present invention - slope. Work with a bevel and can 'have a profile with elements that impact the force on the tool for more evenly spread through the cut or... Polishing 塾 Renovation: Mo:: Upper =: Comparison of the disc type sander The large downward force can resist the machine=rotation speed of the cutting element provided at the central portion of the relatively central portion, thereby reducing the continuous centering point of the tool to the circumferential point. Since then it only appears in the part of the tool;; or in a discontinuous state, or a complex slope. In some aspects, the second: ground:: tool can have a single edge tilted, or its ^/Q can be measured from a central point to an oblique. , σ 耆 peripheral point to the central point of the direction of inclination 18 1355986 Consider various slopes beneficial to the solid organic material layer tool. The scope of the patent application is not intended to be limited to certain specific slopes, so

可以 There are various slopes in different tools. In a certain aspect, a CMP ^塾 refurbisher can have money with a slope from center to periphery, with an average of 1/1000. Needle - When a variant of the tool has a slope, in some respects, the finger 2 can have a H-shaped tool-like hemisphere ...ome tool. This curved profile acts like a bevel. Guards can include such curved profiles in order to efficiently distribute the friction between all the pieces: thus reducing the failure of the individual particles and prolonging the tool's life 0 d, end % = As noted herein, although it is intended to limit the large/zero alignment of the cutting elements, some degree of deviation can still occur. These deviations are the result of the tooling process. Depending on the application, the shape and size of the tool can be varied widely, so these depend on the specific application. Furthermore, when referring to a given section, the u-tip is intended to contain the highest point of the cutting element, whether the point is a vertex, edge or face. Directional positioning, tip leveling, :: Other techniques for manipulating superabrasive particles are disclosed in US Patent Application No. 1 1/223,786, filed on September 9, 2nd, and April 10, 007 _ The US No. 1 patent application for the milk number, both of which are incorporated herein by reference. For its part, on the one hand, the cutting elements are mostly configured such that the cutting element tip deviates from the designated profile, with a degree of deviation from about 135 burs to about 19 135 598b. In the "one aspect two" the cutting elements are configured such that their tip deviations are designated as 丨& j faces' and the degree of deviation is from about 5 to about 100

Micron. At the other end, the cut 70 pieces are configured such that their tips are offset from the finger face by a degree from about 1 〇 to about 75 microns. In addition, the cutting pairs 7L are configured such that their tips deviate from the designated profile, and the deviation is from about 1 大约 to about 50 microns. In another aspect, the cutting elements are configured such that their '1, by #你>> *丨1 A 7's large deviation from the specified profile, and the degree of deviation is from about 50 to about 1 5 q μ 本Νβ Ί bU micro water. In another aspect, the cutting elements are configured such that their tips are offset from the finger, and the degree of deviation is from about 20 to about 00 microns. In yet another aspect, the cutting elements are configured such that their tips deviate from the designated profile with a degree of deviation from about 2 〇 to about 50 microns. In another aspect, the cutting elements are configured such that their tips deviate from the zigzag profile with a degree of deviation from about 2 〇 to about 4 〇 microns. Moreover, in another aspect, the cutting elements are configured such that their tips deviate from the designated profile with a degree of deviation of less than about 2 microns. In the other aspect, the cutting elements are configured such that their tips deviate from the designated section ' with a degree of deviation of less than about 10 microns. In yet another aspect, the cutting elements are configured such that their tips are offset from the designated profile by less than about 5 microns. In yet another aspect, the cutting elements are configured such that their tips are offset from the designated profile by less than about 1 micrometer. On the other hand, most of the cutting elements are configured such that their tips deviate from the specified profile with a degree of deviation that is approximately less than 10% of the average size of the cutting elements. 20 1355986 The distance at which the tip of the cutting element extends from the organic fixture is determined by the extent to which the length of the cutting element extends upwardly from the fixture to the depth below which the cutting element sinks below the surface of the fixture. In the embodiment shown in Figures 'A and B', the ratio of the amount of each cutting element (16a) protruding above the fixture to the amount below the sinking conjugate is about 4 to 1. In the embodiment of Figs. 2A and 2B, the cutting means (16b) of the cutting device (1b) sinks by about 2/3 and protrudes by about 1/3. Other ratios may range from 2 〇 to 1 to about 0 · 2 to 1, and also include the intermediate range.

The relatively large portion of the individual element (16a) (16b) can be submerged under the organic fixture. In this way, the area that provides the largest cross-section to bond the fixture material is "buried" under the maximum amount of material. The feature of the invention is that the widest part of the particle (the largest section of the cutting element) is closer to the end of the particle, so that the wider end can be placed below the soiled surface, compared to the conventional Diamond, artificial diamond or stone

The dish's provide great retention benefits, and the 隹y is close to the midpoint of the disc, and the maximum cross section of the second is fixed (4). The widest portion of the present invention can be at or near the end of the surface (e.g., the cutting end) as far as the end (the cutting end) is near the cutting element, and the shape of the cutting element shown in the drawing, / in the example In the present invention - the embodiment is a pyramidal shape (Golden Car: This type of structure has various advantages. For example, the inventor has a volume/quality | a chamfered cutting element ensures cutting The components can be concentrated on the lowest part of the cutting element, and u can be more firmly fixed to the base of any form (Example 21 1355986 ^, gold, 驭 is connected to the base. In addition, the wrong cone Formed with a triangular base, the support substrate on the pyramid can be thicker relative to the tip and sharper the tip (eg, 60 degrees) without breaking or breaking when the CMP phosphor is being refurbished. In general, sharper Cut to 70 tips to polish the polishing pad

Quick cutting to reduce the total renovation time. In addition, the roughness on the polished enamel is sharper and denser. These roughnesses can be polished round and/or more quickly refurbished without causing undesired wafer misalignment. Alternatively, a square pyramid can be used for lower cutting rates, and the tip angle of the square pyramid can be larger (e.g., 9 degrees). Therefore, the square pyramid has a wider (four) path. The (four) path has greater resistance and a lower cutting rate. However, the square PCD cutter can be sharper than conventional single crystal diamond discs with different tip angles from 9 to 125 degrees. Because of the cone: polycrystalline material is generally a more efficient cutter, while the pyramidal (with three sides) polycrystalline material is particularly efficient. In addition, the cutting elements of the present invention can be fabricated with a very tightly controlled geometry. The polycrystalline cutting elements are less likely to tear when to cut the polishing pad. pad. In addition, an additional second cut is formed on the main cutting element: the cutting element is better represented. In other words, the cutting action of the cut surface of the cut surface. Conversely, the single crystal sand disc-like: the "fragment" that was cut. It should be noted that the polycrystalline cutting element == surface additionally enhances the retention of the organic material layer (fixed path U regular irregular surface allows the organic material to "catch" the cutting element 22 to a greater extent The surface of the single crystal cutting element is strong. Second, the polishing 塾 refiner is often in the process of arranging the arranging unevenly distributed on the cutting element 7 to be negative, usually must be performed too, ,, and the edge of the cutting element is the same as the cymbal The inner π piece does not suffer from the phase stress. One method of the present invention in response to this problem is a cutting element, such as PCD sand _ "I fine" / 磲 (for example, 'sin close cutting or finishing work

Dripping... y is further knives, and/or the inner cutting element peptide is slightly oriented (e.g., about 1 〇 〇, & y ^ - spoon 10 胄 water) outer cutting element. The outer cuts can be placed on the j Dan at a greater density, for example, they can be more sinful to each other's and are positioned at a lower height. In this design, the j-piece can be divided into a lattice-like form, and can include a plurality of concentric circles that are radially symmetrical.

In the present invention-embodiment, a larger base relative to the cutting tip can be formed on the outer members (on the one hand the outer member can have a triangular base i' the outer member can have an edge formed on the cutting tip without ^ Only one end point. In addition, the outermost cutting element may have a small mesa (5 micron) formed on the cutting tip instead of just having a straight edge or an end point. In one embodiment of the invention, the cutting elements may be asymmetrical pyramids. For example, since the cutting force generally acts from the "outside from the inside", the pyramid design may have a relatively steep slope. To face the outer circumference of the cutting device, and to have a relatively gentle slope to face the tail side (ten degrees from the horizontal plane). In other words, the top surface of the tip of the pyramid may not be horizontal, but may be slightly inward" Tilting to make the pieces easier to fall off. The 23 sides of this invention are different from the diamond grit cutting or cutting force... the ancient traditional cutting 塾 has a negative angle so that it is crowded Compressive Force. In this embodiment of the invention, the spit, _ _ ^ „ 丨 不会 不会 不会 伴随 伴随 伴随 伴随 伴随 伴随 大量 大量 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' 。 。 。 。 。 。 。 。 。 The energy consumption of the number of eves #7 is on the cutting, not the plastic deformation. By ^ 褙田 forms a vertical wall on the pyramid and makes the vertical wall of the pyramid slightly less than 90 degrees (you 丨 & 'About 8 degrees' to improve the above excellent

point. In this example, the top surface of the corner η - any of the sides can be sharper, similar to an inverted pyramid. Therefore, the structure of the cutting pad can improve the cutting efficiency of the cutting pad, which is due to the slashing of the gentleman, the Ding knife. The procedure 'is similar to the way of shaving with a razor. This design is not possible for this private early-crystal diamond design, because the cutting edge associated with this design, county rush: A > w negative angle. The pyramidal cutting element of the present invention can provide a t-cut edge' due to the positive cutting edge to form a sloping sloping wall on the trailing side of the cutting interface (e.g., 'asymmetry of the pyramidal cone') to support the structure of the cutting edge. ,] edge; ^θ > side will not prematurely lapse failure. On the one hand, such a

The asymmetrical structure can be formed by wire-cut electrical discharge machining (Wjre Japan "^丨discharge Machjng, Wjre E_, and it can form a pyramid. The tip end of the 7-corner cone has an end point, an edge or a mesa. In addition, the cut-off: the part When it is a separate particle or grit, the particle or grit may have an asymmetrical structure comprising the above-described mold having a suitable shape for processing the pct particle. 2 In an embodiment of the invention, 'adjustable The equiangular cones are spaced to adjust the contact pressure of the end points, edges or mesas. Generally, the pyramids are spaced apart from each other, and the contact pressure between the pyramids and the polishing pad is greater. Therefore, the less the tip is supported by 24庳力,久,,, - The deeper the penetration of each big scorpion, the larger the roughness formed on the polished sturdy. A boat __ .^ enters the 饫 吕, the polishing rate of the wafer is large The size and number of the rough part. The denser and smaller coarse wheel part has a relatively polishing rate with the coarser thick part. However, the former is more uniform, and the excessive force of the non-production 2 causes the fragile wafer to produce uneven hooks. Injury, infringement or Also bad. When applied to copper less than 90 90 not (nm) and with low dielectric (Low-K) and greater than 20 〇 / ha, d, 2 〇 / 〇 pores (P 〇 When the dielectric quality of e), the above-mentioned ^, the roughness of the street is more effective. The independent polycrystalline cutting elements can be in various ways known to those skilled in the relevant art and each " ^ ^ In the aspect of the invention, the special cutting element is a bismuth/carbonization, and a polycrystalline diamond cube is formed into a matrix. Each cube contains about 9 electric 1] yU/o volume. The percentage of diamonds (particle size is about 1 〇 micron), and the balance is adjacent to eight, and the boring tool is Shi Xi or 疋 carbonized stone eve. A very small amount of titanium can be used to facilitate the sintering process. A graphite is pressed in and the length of each side of the cube can be. Although the above examples have proven to be particularly effective, it should be understood that the present invention can use a polycrystalline material of various dimensions and structure. By using a superhard polycrystalline material for the cat Retain _ ^丄Λ. ^ ^ ^ Independent early formation of cutting elements in the definition of 4 In the shape, the component can be cut more easily. Since the definition (4) (four) is precisely arranged, the cutting shape can be copied from one cutting element to another, and each cutting element can be positioned fairly consistently. The surface of the cutting device, and thus the stress impinging on the cutting elements, can also be distributed fairly uniformly over the surface of the ramming device. For the prior art abrasive grit, for example, the overall shape and size of the 荨 sand 襟25 1355986 There may be considerable differences between a gravel and another gravel, which makes it difficult to accurately arrange the gravel. The material used in the organic material layer (14> can vary considerably. Those skilled in the art are aware of a variety of organic materials that can be used very effectively in embodiments of the present invention, and are discussed herein. The organic material layer may be any hardenable (Cluab|e) resin material, resin or polymer having sufficient strength to fix the individual polycrystalline cutting elements of the present invention. It is beneficial to use a harder layer of organic material to maintain a flat surface with less bending or deformation. This makes the grinding tool at least partially complete. Non-hanging small individual polycrystalline cutting elements into the grinding tool and maintaining these small cutting elements at a fairly flat and uniform height. In addition, a variety of organic materials can act to absorb the impact in the organic material in the abrasive IS mechanical force, and the mechanical force is dispersed and evenly distributed throughout the art. Those skilled in the art will know that any change in the organic material layer is made; Machine = 2 method of material layer 'the phase of the organic material layer comes. Hardening = less soft and tortuous state to rigid radiation (such as UV is limited to exposure of organic materials to heat, electromagnetic such as electron beam), *, "outside line and microwave radiation", particle bombardment (such as dry, organic Catalyst, inorganic catalyst or other hardening methods known to those skilled in the art. Non-tea Μ In the present invention, the thermoplastic material can be "the organic material layer can be a thermoplastic material and soften 1 The hardening and reheating of the organic material may be a thermosetting material. 26 1355986 The thermosetting material cannot be reversibly hardened or softened like a thermoplastic material. In other words, once hardening occurs, the process is substantially irreversible.

The organic materials useful in the embodiments of the present invention may include, but are not limited to: amino res ins (including alkylated urea-formaldehyde resins, melamine-formaldehyde resins, "Alkylated benzoguanamine-formaldehyde resins" 'acrylate resins (including vinyl acrylates, acrylated epoxies, acrylonitrile) Acid acrylated urethanes, acrylated polyesters, acrylated acrylics, acrylated polyethers, vinyl ethers , aery丨ated oi丨s, acrylated silicons and related methacrylates, alkyd resins (eg amino acid urethanes) Alkyd resins)), polyester resins, polyamide resins, polyamidene resins (polyim) Ide resins), reactive varute resins, polyurethane resins, phenolic resins (eg, resole resins and novolac resins), Phenolic/latex resins, epoxy resins (such as bisphenol epoxy resins), isocyanate resins, isocyan urate resins, Polysilicate resins (including alkylalkoxysilane resins), reactive vinyl resins, resins under the trade name Bakelite (including polyethylene) Polyethylene resins, polypropylene resins, epoxy resins, phenolic resins, polystyrene resins, phenoxy resins, flowers Tetraphthalic acid dianhydride resin (pery|ene resins), polysulfone resins, ethylene copolymer resin (ethylene

Copolymer resins), acrylonitrile-butadiene.-sty "ABS" resins, acrylic resins and vinyl resins (Viny| resjns) , acrylic resins, polycarbonate resins (po丨yca "b〇nate resins", and mixtures and compositions thereof. In one aspect of the invention, the organic material may be an epoxy resin. The organic material may be a polyamidamide resin. In another aspect, the organic material may be a polyurethane resin. The organic material may include various additives to enhance the usability thereof. For example, an additional addition may be used. The bonding agent and the filler are used to enhance the hardening property of the organic material layer. Further, a solvent may be used to improve the properties of the organic material layer f in a softened state. Further, a strengthening may be provided in the hardened organic material layer. The reinforcing material acts to increase the strength of the organic material layer and further enhance the retention of the individual polycrystalline cutting elements on the organic material layer. In one aspect, the reinforcing material Contains pottery, metal or its constituents. Examples of ceramics include alumina (eight...), aluminum carbide, silica gel (Si|ica), carbonized stone eve 28 1355986 enslavement Zirconium (Silicon Carbide), oxidized Carbide, and mixtures thereof.

The outer layer may, on the one hand, be on the surface of each superabrasive particle: or the retention of the organometallic compound on the substrate of the organic material in a manner that enhances the chemical bonding of the superabrasive. A wide variety of organic and organometallic compounds are known and used by those skilled in the art. The organometallic binder can form a chemical bond 'θ between the superabrasive particles and the organic material matrix to increase the retention of the particles in the matrix of the organic material. In this way, the β-organic metal bond acts as a bridge to form an organic material matrix. A junction with the surface of the superabrasive particles. In one aspect of the invention, the organometallic binder can be titanate, zirconate, silane, and mixtures thereof. Specific, but non-limiting, decanes suitable for use in the present invention include: 3-g|ycidoxypropyltrimethoxy silane (available from Dow Corning's model z-6040 decane) , γ-methacryloxy propyltrimethoxy silane (by Union Carbide Chemicals)

Company's model as A-1 74 decane obtained), β-(3,4-epoxycyclohexane)ethyltrimethoxy silane, γ-aminopropyl Γ-am inop ropy Itri ethoxy silane, Ν-(β·aminoethyl)- Y-aminopropyl decyl dimethoxy decane (N-(P-aminoethyl)-Y -aminopropylmethyldimethoxy silane) (available from Union Carbide, Shin-etsu Kagaku Kogyo KK, et al., 29 1 355 986), and other suitable decanes disclosed in U.S. Patent Nos. 4,795,678, 4,390,647, and 5,038,555. Binding agents are incorporated herein by reference. Specific but non-limiting titanate binders may comprise: isopropyl triisostearoyl titanate, bis(isopropyl nepheline carbonate) oxyacetic acid Di(cumylphenylate) oxyacetate titanate, 4-aminobenzenesulfonyldodecylbenzenesulfonyl titanate, tetraoctylbis(ditridecylphosphite) titanate (tetratrimylbis (ditridecylphosphite) ) titanate), isopropyl tris(--ethylamino-ethylamino) titanate (|50卩"0卩乂丨1"丨((^-6化7丨31111.110- ethylamino) titanate ) (Kenrich Petrochemicals Obtained by the company, neoalkyoxy titanates (such as LICA-01, LICA-09, LICA-28, LICA-44, and LICA-97, also available from Kenrich), etc. The non-limiting binding agent comprises acetoalkoxy aluminum diisopropylate (available from Ajinomoto KK), etc. Specific, but not limiting, sulphate binders include: neoalkoxy zirconates, LZ-01 LZ-09 LZ-1, LZ-38, LZ-44, LZ-97 (all available from Kenrich Petrochemicals, Inc.), etc. Other known organometallic binders, such as Thiololate compounds, can be used It is within the scope of the invention and is included in the scope of the invention 30 1 355 986. The amount of organometallic binder depends on the surface area of the binder and the individual polycrystalline cutting elements. In general, the layer of organic material contains 〇〇 5% to 1 〇% weight a: a percentage of the organometallic binder is sufficient. δ青 Referring to the second diagram, in one aspect of the invention, the individual polycrystalline cutting elements of the cutting device 〇〇c) may be a polycrystalline body of material (p Formed and/or obtained by 〇丨ycrysta丨丨丨ne Blank). Figure 3A shows a blank of this material (3〇) comprising a polycrystalline compact formed into a disk shape having a diameter of about 3 〇. Mm and thickness can be from about 0.2 to 2 mm. The disc (30) can be divided into a plurality of polycrystalline individual cutting elements in various ways known to those skilled in the art, including but not limited to electro-chemical processing, Laser cutting, plasma etching, oxygen (formation of oxidized or deuterated carbon monoxide gas), hydrogenation (formation of methane gas), and the like. A laser beam with a longer wavelength (for example, yttrium aluminum garnet (7)...(1)...(1)-

Doped Yttrium Aluminium Garnet (ND:YAG)) is used to efficiently form a cutting groove on a PCD. A shorter wavelength laser beam (such as an Excimer) can be used to cut out the top of the main cutting element. The second cutting element is as shown in the third B. Although the latter is slower to cut, the use of shorter wavelengths usually makes it more accurate. In addition, higher frequency energy can cause less surface damage. This laser beam is used for the operation of scraping or flattening the wafer of the present invention. In one aspect of the invention, the electrical discharge machining method (Electrical)

Discharge Machining, EDM) removes material from PCD or pcBN polymers. In this regard, the EDM process can use one or more electrodes having a drill 31 1355986 stone. For example, the cathode used in the EDM process can be a boron-doped diamond material, and the anode used in the process can be pcD (in this case, the PCD generally requires at least a portion of the conductivity). When a current is applied to the boron doped diamond material', the material on the pcD can be carefully and controllably removed to form various cutting elements on the PCD.

It is understood that the disc (30) is divided into eight wedge-shaped blocks (32) of the same shape and size. In the present invention - embodiment t, the mold block (which may be disposed on the base (12b) in the manner of the solid organic material layer described above. In the present invention as shown in FIG. 3A, the wedge block (32) Radially distributed on the surface of the cutting device and/or the base or the substrate. In this way, the wedge block (4) can be configured such that each wedge block (32) is used to grind or process a workpiece (not shown). , subject to substantially the same force (each wedge block (32) is substantially properly secured in the organic matrix). It is not necessary, however, that in an embodiment of the invention 'PCD up (30) may have about 3 The diameter of the facet, and the base (1 can have a diameter of about 1 〇 Qmm. A superhard material of only about 3 大 large pcD can form a cutting device with a diameter of about 1 〇〇 cm. As shown in the fourth figure No, in one aspect of the invention, the longitudinal axis of each of the polycrystalline individual cutting elements (e.g., wedge blocks (32)) of the cutting device (i〇d) is aligned along the radius (R) of the cutting device. In this embodiment, The polycrystalline individual cutting elements are distributed in the opposite direction to the cutting device in the opposite direction (adjacent independent poly The cutting element is placed in the opposite direction of the crucible. The method of arranging the cutting element on the surface of the base or the substrate (12b) can be changed according to the specific application. Since the shape and size of the individual polycrystalline element 7 are the same, 'the setting is on the base and It is easy to change the configuration for a specific application and it can be accurately performed for 32 1355986. By using the workpiece γ ^ θ ± compared to the machining bucket (the figure is not shown) The susceptor (12b) of the susceptor (12b) can be used to reduce the amount of the t-crystalline material used, thereby saving considerable cost. The inventors have found that the polycrystalline material (for example, a disk (3 Å)) can be reduced in number. The performance of the cutting device of the present invention is equivalent to or similar to the performance of a "comprehensive" conventional cutting device with a polycrystalline cutting or grinding tool. The polycrystalline crystal of the third drawing can be divided into 8 equal parts. However, if the fifth to 篦+-read α _ eleventh figure does not, the disk (3〇b) (3〇c) (3 points

Don't be divided into 12 copper phase wings γ B such as phase (ie wedge block (32b)), 16 = (ie wedge 2C)) In this way, the present invention provides sufficient flexibility to create and configure independence The polycrystalline cutting element is on the tool. It is possible to examine various other possibilities - not to limit the independent cutting elements with different sizes and shapes. The Japanese Knife please refer to the third B circle. In the aspect of the present invention, each individual polycrystalline cutting... The cattle (32) may comprise a plurality of second cutting elements (4〇) formed on the face of the individual polycrystalline cutting elements. The second cutting element can be configured such that the polycrystalline individual cutting element maintains a sharpness when the cutting device is in use. ^ Two cutting reads can have different shapes and can include rectangular cutting elements: shaped cutting elements as well as triangular cutting elements and the like. The second cutting element is in the form of a truncated pyramid (a runcated (4) (not shown). By using a second cutting element on the main cutting element, the total cutting edge length of the piece can be increased by up to 10, 〇 According to another aspect, the present invention provides a method of manufacturing a cutting device, the package 33 1355986 comprising: acquiring a substrate; and arranging a plurality of independent polycrystalline cutting elements on the substrate, the individual polycrystalline elements comprising the same And the fixed polycrystalline cutting element is secured to the substrate by a layer of solid barrier material. The method can include aligning at least all of the ends of the individual polycrystalline cutting elements to a common plane. EXAMPLES The following examples are provided to provide various methods of manufacturing the cutting device of the present invention. These examples are for illustrative purposes only and are not intended to limit the invention. Example 1 A single sintered diamond cube based on a stone/ceramic crucible is used as a cutting element to form CMP pad repairer. Each cube contains approximately 90% by volume of diamonds (particle size is approximately 1 〇 micro 1 ' and the remainder矽 or tantalum carbide. A very small amount of titanium can be used to promote the baking process. The cube is pressed into a graphite mold with a length of about 1 mm on each side. A plurality of holes are formed in the % oxide mold to accommodate p C 〇 The tip of the cube. An interface layer is placed on the top surface of the mold. Next, another epoxide is vacuum cast onto it. After hardening, the mold is removed to expose the tips of the cubes. The cutting tip of the polishing pad dresser. The disk of the sintered polycrystalline diamond based on bismuth/carbonized tantalum is divided into a plurality of wedge blocks having substantially the same volume. The wedge blocks are used as cutting elements to form a CMP polishing pad. Renovator. Each wedge block contains approximately 34 a^5986 90 °/〇 volume percent diamond (particle size approximately 10 μm) and the remainder is niobium or tantalum carbide. A very small amount of titanium can be used to facilitate the sintering process.

- A plurality of holes are formed in the epoxide mold to accommodate the PCD wedge block. An interface layer is provided on the top surface of the mold. Next, another epoxide is cast onto it in a vacuum. After hardening, the mold is removed to expose the surface of each of the shaped blocks. The surface of the wedge block (including the edges on the surface) becomes the cutting element of a polishing pad conditioner. Example 3 Both sides of a PCD blank pressed by a Cubic Press were cut to remove a Refractory metal container (e.g., Tanta|um, Ta). The outer diameter of the polycrystalline crystal is removed. The PcD blank is bonded to a tungsten carbide (Wo|fram Carbide, wc) substrate, and the pcD layer is edm processed to form a plurality of pyramids distributed in a predetermined pattern. The PCD blank is then divided into a plurality of wedge-shaped cut blocks, and the cut blocks are placed on a flat mold and the cut blocks are flush with the mold. The mold is placed in a vacuum chamber and the epoxide is poured on top of it. Finally, a stainless steel plate is placed over the flowing epoxide and the stainless steel plate is pressed against the PCD until a thin layer of epoxide is formed between the back of the PCD and the steel substrate. After the epoxide is hardened, the PCD cutting tool is cleaned and a mounting structure (such as a hole) is formed on the back surface of the steel substrate. The pct cutting block can be disposed on the stainless steel plate in a circular pattern, a circular plate, a square, or the like. These graphics can be optimized for use in special-to-work CMP applications. 35 1355986 Readers should be aware that the above is only for the purpose of illustrating the principles of the invention of Taitian y π ▲ i. Without departing from the scope and spirit of the present invention, those skilled in the art can make various modifications and configurations, and the scope of the patent application attached is intended to cover this difference. With a different configuration. Therefore, the details of the apricot embodiment which is currently considered to be the most practical and preferred in the 4 inventions have been disclosed as above, and are mussels for those skilled in the art. It is based on the concepts and principles presented in this article without limitation: many: including changes in size, material, shape, form, function, operation' and use. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a partially enlarged view of a cutting device in the present invention - in the embodiment, a plan view of a cutting device. Figure 2A is another side view of the present invention. The top view of the exhaust-cutting device is flat. The second B-picture is the second A FH rk X. • Third A: A partially enlarged view of the cutting device. Figure 1 is a perspective view of a polycrystalline b丨ank in the embodiment of the present invention; a plan view of a thousand-sided plan, wherein one of the individual polycrystalline cutting elements is included in the field. Formed.

The third map is a partially enlarged cross-sectional view of the cut along the B_B line of the second map. The fourth figure is a polycrystalline far-reaching I & in the embodiment of the present invention, wherein the -cutting device comprises a relief of a thousand-faced crystal chain formation. The independent polycrystalline cutting element of 3 is an embodiment of the invention. The polycrystalline billet is cut into a plurality of independent cutting elements by a plan view plane of the day and day. Figure 6 is a plan view of the present invention in accordance with another embodiment, the cutting device comprising a top view of a separate polycrystalline cutting element of the device. The seventh figure is formed according to another embodiment of the present invention, and the cutting device comprises a plurality of independent polycrystalline cutting elements. The eighth embodiment of the present invention is a further embodiment of the present invention, which is divided into a series of independent cutting elements by a plan view plane of the A day. The ninth drawing is a diagram of another embodiment of the present invention, the cutting apparatus comprising a planar planar polycrystalline cutting element of the device. The tenth figure formed by the day blank is a plan view of another embodiment of the present invention, and the top view of the cutting device includes a plurality of independent polycrystalline cutting elements. The eleventh figure formed by the present invention is another figure of an embodiment of the present invention, which is divided into a pair of independent cutting elements by a plan view of the day blank. Fig. 12 is a plan view showing another embodiment of the present invention, which comprises a plurality of independent flat polycrystalline cutting elements in a plan view of the cutting device. The formation of polycrystalline silicon is understandable, and the above figures are only for the purpose of use. In addition, Figure # - Understanding the display of the present invention Particle size and other aspects are often exaggerated = so, the size 'large u can make the view clearer 37 1355986, Chu. Thus, in making the cutting apparatus of the present invention, it is possible to violate the particular dimensions and other aspects exhibited in the drawings. [Description of main component symbols] (10a) (10b) (10c) (10e) (10d) (10f) (10h) Cutting device (12a) (12b) Base (14) Solid organic material layer (16a) (16b) Independent polycrystalline cutting element (18a) (18b) cutting tip # (20a) (20b) plane (30) (30b) (30c) (30d) disc (32) (32b) (32c) (32d) wedge block ( 40) second cutting element (R) radius 38

Claims (1)

Patent application scope: Amendment of November 8th, 1. An ultra-hard cutting device, comprising: a base, a Bucharest, a solid organic material layer; and an i-poly Ba cutting π-piece system In the solid state machine material layer structure; the independent poly-sa cutting 70 pieces have a substantially uniform geometric knot /, the I independent poly-cutting element comprises a plurality of second cutting elements formed on the surface of the independent poly-element The second cutting elements are distinguished by two polycrystalline separate cutting elements in the superhard cutting device. The superhard cutting device of the first aspect of the invention is characterized in that the element and the jaw cutting member comprise at least a cutting tip, the tips of the cutting members being aligned in a common plane. In the superhard cutting device according to Item 1, the polycrystalline cutting device is a polycrystalline (four) segment of a material. An ultra-hard cutting device as described in claim 3, which is a divided portion of the disk. And each of the individual polycrystalline cutting elements 5, the ultra-hard cutting device as described in claim 4, is a homogeneous portion of the disk, and the homing portions are equal to each other. 6. The superhard cutting device of claim 4, wherein each of the individual polycrystalline cutting elements is substantially wedge shaped. 7. The super-hard cutting device according to item 4 of the patent application scope, 39, 2011, 1T^8, is the replacement page of the independent polycrystalline cutting q-unit strain a --^―. The τ ο pieces are distributed radially on the surface of the superhard cutting device. ° 4 8. The ultra-hard cutting device according to claim 7 of the patent application, wherein the ', ' longitudinal axis of each of the individual polycrystalline cutting elements is along the radius of the cutting element, such as the patent of the moon. * The superhard cutting device of the eighth item, wherein the independent polycrystalline cuts are arranged in the opposite direction on the superhard cutting device. The superhard cutting device of claim 1, wherein the individual polycrystalline cutting element comprises a superhard polycrystalline cutting element. 11, such as the scope of patent application! In the item 0, wherein the superhard polycrystalline cutting elements comprise superhard polycrystalline particles. 2: An ultra-hard cutting device 'includes: a plurality of independent polycrystalline cutting: 彳 element::! Provided in a layer of solid organic material, each of the individual polycrystals cuts less - the cutting tip, the hexagonal ends of the individual polycrystalline cutting elements are aligned to a common plane; which allows each of the individual polycrystalline cutting elements to contain M + cattle A plurality of constitutings formed on the surface of the individual celestial cutting 7C member are arranged such that the respective polycrystalline crystals are juxtaposed: the second cutting elements are sharpened. The pieces are kept in use when the super-hard cutting device is used, and the super-hard cutting device described in claim 12 of the patent scope is approximately 4, and the independent polycrystalline cutting elements are arranged to uniformly distribute the resistance to each of the individual gatherings. On the crystal cutting element. 1 4, as described in the patent scope of item 12, the super-hard cutting 1355986 2〇11-year correction replacement page I, in which most of the independent polycrystalline cutting elements protrude on the solid organic material layer to a preset height. The superhard cutting device of claim 4, wherein the predetermined south degree produces a cutting depth of less than about 2 μm when the superhard cutting device is used to grind a workpiece. . 16. The superhard cutting device of claim i, wherein each of the individual polycrystalline cutting elements has a substantially uniform structure. 1. The super-hard cutting device according to claim 2, wherein each of the independent polycrystalline cutting elements is a super-hard cutting device according to item 7 of the material polycrystalline description. The independent polycrystalline cut 18 is as set forth in the patent application scope, wherein the polycrystalline billet is a disc-shaped cutting element which is a divided portion of the disc. 9. The superhard cutting device as described in claim 8 wherein each of the individual polycrystalline cutting elements is an equal portion of the disk. 20. The superhard cutting device of claim 18, wherein each of the individual polycrystalline cutting elements is substantially wedge shaped. The ultra-hardness of the patent range 帛i 8 item, wherein the independent hips are on the surface of the layer. 0曰_ is distributed along the radial direction in the organic; 2, as in the patent application, the superhard cutting device according to Item 12, wherein the independent-clothing day 70 pieces are substantially the same size and The same shape. 々祁 1355986 1st, 11th, 8th, 倏 巻 巻 2 2 3, as claimed in the first section 'where the independent polycrystalline cutting elements are configured in a lattice shape. The superhard cutting device of claim 2, wherein the individual polycrystalline cutting elements are evenly spaced from each other and have a pitch of from about 100 to about 800 microns. The superhard cutting device of claim 24, wherein the individual polycrystalline cutting elements are evenly spaced apart to have a pitch of about 500 microns. 2. The ultra-hard cutting device according to claim 1 or claim 2, wherein the solid organic material layer comprises a material selected from the group consisting of amino resins and acrylate resins (acry).丨ate resins), alkyd resins, polyester resins (p〇|yester resins), polyamide resins, polyim 丨de resins, polyurethane resins ), phenolic resins, phenol/latex resins, epoxy resins, isocyanate resins, isocyanurate resins, polysiloxanes Resins), reactive vinyl resins, polyethylene resins, polypropylene resins, polystyrene resins, phenoxy resins Perylene resins, poly; polysulfone resins, acrylic acid-butadiene-styrene (ABS) resin (acrylonitrile-butadiene- Styrene (ABS) resins), acrylic tree 42 1355986 November 8, 2011 amendments to acrylic resins, polycarbonate resins (p〇丨yCarb〇nate resins), and mixtures and combinations thereof The superhard cutting device of the invention of claim 26, wherein the solid organic material layer is an epoxide resin. 2. The superhard cutting device of claim 26, wherein the solid organic material layer is a polyurethane resin. 2. The superhard cutting device as described in claim 26, wherein the solid organic material layer is a polyamidamide resin. 30. The superhard cutting device of claim 26, further comprising a reinforcing material disposed within at least a portion of the solid organic material layer. The superhard cutting device of claim 3, wherein the reinforcing material is selected from the group consisting of ceramic, metal or a composition thereof. 3, a method for manufacturing an ultra-hard cutting device, comprising: obtaining a substrate; and arranging a plurality of independent polycrystalline cutting elements on the substrate, each of the individual polycrystalline cutting elements having a substantially uniform geometric structure; and a solid organic a layer of material securing the individual polycrystalline cutting elements to the substrate; wherein each of the individual polycrystalline cutting elements comprises a plurality of second cutting elements formed on a surface of the individual polycrystalline cutting elements, the second cuts being configured to Each polycrystalline individual cutting element maintains a sharpness when used in an ultra-hard cutting device. , 43 1 ^Ηττ^δ日3 3, as described in the patent scope of item 32, the superhard cutting device - common ^ each of the individual polycrystalline cutting elements at least - the cutting tip is aligned with the superhard cutting A portion 34 of the device material polycrystalline blank, as in the method of claim 32, wherein each of the individual polycrystalline cutting elements is a cut portion. Method 1 2^ towel = please refer to the ultra-hard cutting device of the scope of claim 34, the independent polycrystalline cutting element is in the shape of a dish, and the individual polycrystalline cutting elements in the basin are the divided parts of the disk. In the law 31: Shen. The superhard cutting device of claim 35, wherein each of the individual polycrystalline cutting elements is a mutual equalization process of the disk. For example, in the case of the above-mentioned patent scope, the super-', each of the individual polycrystalline (four) elements, is substantially wedge-shaped. [2] The superhard cutting device of claim 35, wherein the phase of the polycrystalline cutting device is radially distributed on the substrate, and the superhard cutting device of the substrate is substantially There are the same size and 40 method, the 4 1 method, which, as in the ultra-hard cutting device described in the third paragraph of the patent application, is configured as a grid of 70 pieces of independent polycrystalline cutting. shape. The ultra-hard cutting device as described in the scope of the patent application _ the independent polycrystalline cutting spears 4 are evenly spaced from each other and 44 1 9 , as in the patent scope 2 method, wherein the independent polycrystals Cut 3 the same shape. 1355986 P011 "月" has a hardness of about 100 to about 800 micrometers. - 4, 2, the method of superhard cutting device according to the third aspect of the patent, wherein the polycrystalline cutting element comprises superhard polycrystalline U. The method of superhard cutting device according to claim 42, wherein the superhard polycrystalline cutting element comprises superhard polycrystalline particles. 44, as claimed in claim 42 The superhard cutting device method of the invention wherein the superhard polycrystalline cutting elements are selected from the group consisting of polycrystalline diamond and polycrystalline cubic boron nitride. Next page 45