TW200911462A - Superhard cutters and associated methods - Google Patents

Abstract

A cutting device comprises a base having a solidified organic material layer disposed thereon. A plurality of individual polycrystalline cutting elements are secured in the solidified organic material layer. Each of the plurality of individual polycrystalline cutting elements has a substantially matching geometric configuration.

Description

200911462 IX. INSTRUCTIONS: [Technical jaw region to which the invention pertains] The present invention relates to an ultra-hard cutting device for removing material on a workpiece formed of various materials (for example, planer (p|ane), Know the smooth, polish and dress, etc.). Accordingly, the present invention relates to the fields of chemistry, physics, and materials science. [Prior Art] It is estimated that the semiconductor industry currently spends more than $100 million annually to fabricate wafers having a very flat and smooth surface. Typically, chemical mechanical polishing (CMP) is used in the fabrication of semiconductor devices to obtain smooth wafers. In conventional process orders, the wafer to be polished is typically attached to a carrier that is positioned over a polishing pad attached to a rotating platform. When a polishing liquid is applied to the polishing pad and pressure is applied to the carrier, the transmission tool is moved relative to the rotating platform to polish the wafer. Although this known process has been successfully used for many years, it still suffers from several problems. For example, this conventional process is relatively expensive and not always efficient' because after the process is completed, the wafer may be uneven in thickness and may not be smooth enough. Risk τ诎沴卞, 7

5

I 200911462 In addition to the above considerations, the line width (eg, node) of a circuit on a semiconductor currently reaches a viral size range (eg, 1〇_1〇〇nm). In addition, more layers of circuits are being fabricated to meet the increased demand for advanced logic designs. In order to provide a multilayer structure for fabricating nano-sized structures, the layers must be extremely flat and smooth during semiconductor assembly. While diamond particle reticle trimmers have been used efficiently to refurbish the CMP pad used to polish the aforementioned integrated circuit design, these refiners are not suitable for fabricating trimming devices having nodes less than 65 nm. This is because, when reducing the copper wire size, the uneven thickness caused by rough polishing or excessive polishing will dramatically change the conductivity. In addition, this fragile structure must pass through extremely gentle polishing to avoid chipping due to the dielectric layer of the butterfly. Therefore, the pressure used in the CMP process must be greatly reduced. To this end, new CMP processes such as copper electrolysis (Applied Materials' EcMp) or helium film-supported wafers (Semitsu, Sakamoto) reduce the polishing pressure of the contact points between the polishing pad and the wafer. However, the result of a lighter polishing operation will result in a lower polishing rate of the wafer. In order to compensate for the loss of productivity, the entire surface of the wafer must be polished at the same time. For this reason, the contact point of the polishing pad to the wafer must be smaller in area, but it must be more in number. This practice is contrary to the practice of CMp with a relatively large contact area and a relatively small number of contact points. Therefore, in order to perform more and more gentle polishing on fragile wafers, it is necessary to reduce the number of CMP polishing defects. However, in order to avoid a drop in polishing rate, more contact points must be created. Inevitably, the roughness of the polishing pad must be finer in size and more in number. However, the finer the polishing process is, the higher the risk of scratching the surface of the wafer. To avoid the risk of scratching, the top tips of all the rough parts must be completely equal. Otherwise, a few prominent "killer roughs" will damage the polished wafer. SUMMARY OF THE INVENTION The present invention provides a cutting device that includes a pedestal that includes a plurality of individual polycrystalline (p0|yCrysta丨丨ine) cutting elements that are fixed in a solid state On the organic material layer. Each individual polycrystalline cutting element can comprise a uniform geometry. In another aspect, the present invention provides a cutting device comprising a base, a solid organic material layer is disposed on the base of the crucible, and a plurality of independent polycrystalline cutting elements are fixed on the solid organic material, and each individual polycrystalline cutting is performed. The component includes at least one cutting tip. The cutting tips of the cutting elements are aligned on a common plane. Another aspect of the present invention provides a method of forming a cutting device, comprising: obtaining a substrate; placing a plurality of independent polycrystalline cutting elements on the substrate in an uncured organic material, each of which is individually shaped and cut Element L has a substantially uniform geometry that hardens the organic material to form a layer of solid organic material such that each individual polycrystalline cutting element is secured within the layer of solid organic material. The various features of the present invention are generally described herein. Therefore, the detailed description of the present invention will be more readily understood, so that the contribution of the present invention to the technical field will be more fully understood. Further features of the present invention will become apparent from the following detailed description of the exemplary embodiments of the invention. β 200911462 [Embodiment] In the disclosure and description of the present invention, it is not limited to the specific construction, process steps disclosed later, or extended to those skilled in the relevant art. Equals? It should also be understood that the techniques used herein are for purposes of describing particular embodiments only and are not intended to be limiting. The text and the scope of the appended claims are intended to cover the singular singular singular singular singular singular singular singular singular singular singular singular singular singular One or more such elements are defined by the following terms when describing and requesting the present invention. All mesh sizes (Mesh) of mt are made according to the following proposed definitions, unless ^曰In addition, because the size of the particles in the "mesh size" can be more than a small size distribution range, the average mesh of the illusion ruler size.舻丞 祖 在 在 在 在 在 在 在 在 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系...'The base has limited conditions...jin aligned. For example, the profile does not include a planar profile, a concave profile, a multi-step profile, and the like. The convex section is used herein as part of the "total 4t" core-cutting element, the package 200911462 contains a measurable width across the: part, & is used to contact and eliminate one The material on the workpiece. As shown in an exemplary embodiment, a blood knife has a cutting jaw extending longitudinally on the knife, the blade being yawable relative to a workpiece from the workpiece μ 丨 + ^ 丨 - T * 丄 1 曰忑 workpiece The material is scraped or shaved to remove material from the workpiece by cutting the "edge".

As used herein, the term "tip" as used herein refers to a portion of the cutting element that has a maximum distance from the -fixing tool, for example, which is the first portion of all calcium components, when the article of the invention is in use, The ground-part contact: workpiece. It can be understood that the cutting "tip" can comprise a plane, a face or an edge, and the plane, the pointed surface or the edge of the cutting element is

The cutting element contacts a workpiece of Chu-Li L Qian's brother. Clamping (cutting with cutting elements attached)

The device is intended to remove material from the workpiece). D. &Sintering" as used herein refers to joining two or more separate particles to form a continuous solid block. The sintering process involves combining particles to at least partially eliminate voids between the particles. Sintering can occur between metal particles or carbonaceous particles such as diamonds. The sintering of the metal particles occurs at various temperatures depending on the material formation. Sintering of diamond particles generally requires ultra-high pressures and carbon solvents as an aid to diamond sintering, as discussed in more detail below. Sintering aids usually occur in the sintering process and some of the auxiliary residues may be in the final product. As used herein, "superhard" can be used to mean any crystalline material, polycrystalline material, or a mixture of such materials having a M?hr's Hardness of about 8 or greater. In some aspects, Mohs hardness can be up to about 9.5 or higher. Such materials include, but are not limited to, diamonds, polycrystalline diamonds 200911462 cubic nitriding butterfly (cubicB〇, > β, CBN) polyfluorene cubic nitride collar (pcBN) and are well known to those skilled in the art. Super hard material is inclined. And the super-hard material of the village can be integrated into the invention in different forms. 'This form is self-contained, 匕3 has a pull (partiC|es), gravel (grjts), film, layer structure (丨Avprt5\堃黎再1ayers)荨等. However, in most of the examples, the superhard material of the present invention is

And \dayday superhard material forms, such as PCD and P c B N materials. Cao specializes and succumbs to 3, + stand 1 and the value of attention is that the content of this disclosure describes the difference between the traditional super hard sand drum polycrystalline superhard material. As used herein, chalk geometry refers to a shape that is described by mathematical terms that are easily understood and cognitive. Examples of shapes that make up "geometry" include, without limitation, cuboids, polyhedral shapes (including regular polyhedrons), triangles (including equilateral triangles, and equilateral triangles (丨s〇sceies)

Triangles) and three-dimensional triangles, gold ‘ 念·子, spherical, rectangular, “Pie Shape”, wedge, human and round, and so on. As used herein, "organic material is detained 1" is a semi-solid or solid composite amorphous mixture of organic compounds. Therefore, the "organic material layer" and the "organic material substrate __" may be used interchangeably, and refer to a layered chess "V / f," Ό structure or block of a semi-solid or solid composite amorphous mixture of organic compounds. Preferably, the organic material may be a polymer formed by polymerization of - or a plurality of monomers or a heterogeneous molecular polymer ("metal" used in "Copolymer" and "winter eight s ancient metal". Alternately used, and refers to a metal or one or more gold® eight in 4^^=: „J氙 alloy. Those skilled in the art to understand the art can understand metal or contain + Li S rabbit 枓A wide variety of types, such as aluminum, copper 'chromium, iron 'steel, stainless steel, titanium, tungsten, zinc, zirconium, molybdenum, etc. 10 200911462 and its alloys or compounds. / "particles" used here, when with - super abrasive Material connection refers to particles of such materials. These particle systems may have various examples of rounded, square, and self-shaped ("etc., two: mesh size of summer." The mesh is well known in the art. Words, refers to the number of holes per unit area." The "particles" and "sand discs" referred to herein in the United States can be used interchangeably. The term "cutting elements" as used herein is described as being removable from the workpiece. (cutting the various materials of the underlying material - a cutting element can It may include (4) end points formed on or in the complex number, cutting planes, etc. The θ _ ° knives can be injected into the surface. 11 cutting ends, cutting ridges and cutting to the lumps A plurality of rough portions or protrusions are formed. Further, the 'a cutting element may include _ independent particles, and the particles may include only one of the cutting end points, the cutting ridges, and the cutting table formed thereon. The pattern formed by the square shape. The "mechanical force" used in the shackle refers to the impact on the object - an example of the force generated by the machine inside or around the object may be grinding: force - this means the impact as described above. Mechanical force on the object. "Use, when used #"Mechanical stress" or when sliding-impact mechanical force of the object: The resistance of the mechanical force. In the "..." maternal area against the sound "hib(p_e)" refers to the 11 200911462 rim on the surface of an organic material layer having a plurality of superhard abrasive particles. "Mechanical bonding" and "mechanical bonding" as used herein. )" can be used interchangeably and refers to a bonding interface formed by friction between objects or layer structures. In some instances, the surface area of contact between the bonded objects can be extended and other specific geometric and physical structures can be added, such as wrapping the object around another Around the object, to increase the friction between the bonded objects. The term "substantially" as used herein refers to the complete or near-complete extent or extent of an action, feature, property, state, structure, article or result. In the sense that 'an object is "substantially" coated, it means completely covered or completely covered. The difference from the absolute degree of completeness allows the degree of deviation, in some cases It depends on the text of the specification. However, in general, the results obtained when approaching complete will be the same as the results obtained when absolutely and completely complete. t "substantially" is used to describe a complete or near-complete lack of action, characteristics, sexuality, state, structure, or result, which is also applied in the same manner as described above. "Substantially does not contain" the particle two composition, which can be completely lacking in private labor.. θ, lack of pull, or almost completely lack of particles to reach the extent that it completely lacks particles. In other words, as long as - "substantially does not contain" the composition of the material or component does not have an effect that can be measured. The composition may actually contain these materials or components. "Factory used herein" means giving a value to the end of the range of values. The value given can be higher or lower than the end point. ... 夕 12 200911462 The plural items, knots or materials used herein may be presented in a general list for convenience and the f list shall be interpreted as: the members of the list are solely

Unique member. Therefore, based on the fact that this list has the opposite, none of the members in this list are; * is _ the same as any other member in the same list. The skin interpretation shows that the concentration and other data can be expressed in the form of range. Because of ST, this range is only for convenience and simplicity. Therefore, the form should be flexibly interpreted as not limited to the scope. The numerical values also include the numerical values and sub-ranges in the range. For this reason, the numbers ^, such as 2, 3, and 4, sub-ranges, examples: =, etc., and 1, 2, 3, 4, and 5. The principle of the sameness of the temple: is applied to the single-number 4 as the minimum or maximum value, regardless of the extent of the described range or feature. The present invention is directed to a cutting apparatus and associated method for cutting or influencing a workpiece to remove a smooth and/or flat surface from the workpiece. The cutting blade of the present invention is used, for example, as a flattening device for self-working materials, as a refurbishing device to refurbish various work to polish various workpieces.彳...for polishing in the embodiment shown in Figures 1A and B of the present invention, there is provided a cutting device (10a) (e.g., a disk) having a base (12a), the package optionally comprising a base (12a), The pedestal (12a) may include a layer of solid organic material disposed (attached to or attached to the susceptor (12a) ((14) of Figures B and B). In the solid state, a plurality of individual polycrystalline cutting elements (16a) may be fixed to the material layer. Each of the individual water day cutting elements can have or exhibit - a substantially uniform geometry, such as the geometry of the Hei 10 knife A 4 cow, substantially conforming to the geometry of the other cutting elements. In the embodiment shown in Figure BB, each individual polycrystalline cutting element (16a) has a substantially cuboidal geometry. In the embodiment shown in Fig. B, the individual polycrystalline cutting element 〇 6b) has a geometric structure which may be a three-dimensional triangular structure. As shown in Figure B, in one aspect of the invention, the individual polycrystalline cutting elements (16a) (16b) may comprise at least one cutting tip (18a) (18b) 'The cutting tips of the cutting elements are aligned On a common plane (2〇a) (20b). In this example, the common plane is a flat surface having a predetermined height on the solid organic material substrate. Thus, the individual polycrystalline cutting elements are affixed to the solid organic material layer by a "precise method" such that the cutting elements contact a workpiece (not shown) such that the cutting elements can be substantially the same depth The material is removed from the workpiece. In this manner, each of the individual polycrystalline cutting elements substantially suffers the same degree of resistance as the cutting device moves relative to a workpiece. This feature of the present invention advantageously limits the early cutting of the individual cutting elements. There may be problems with the life of the shrinkage I and/or damage to the workpiece being machined. The separate cutting element (16a) (16b) may be formed from a variety of materials, in one embodiment, may comprise a polycrystalline material or a superhard poly Crystal material. Although not limited to 14 200911462, the superhard polycrystalline material can be a dense crystal of polycrystalline diamond (PCD) or a polycrystalline cubic boron nitride (Polycrystamne cubic Boron, N_e, PcBN). Dense structure. The PCD or PcBN dense structure can be formed as follows. By forming a separate cutting element in a polycrystalline material, and independently cutting the component ^ Attached to the cutting means may not be required to polycrystalline material ^

The cutting device is not used in the part of the cuttings and a part of the service for cutting, and the advantageous characteristics of the polycrystalline cutting device are achieved. Therefore, considerable savings can be achieved. The cutting device of the present invention can be used in various applications, and in one invention, the special 7 is well-suited for flat and fragile and fragile materials, such as Shi Xi wafer, glass, base metal, and used for flattening. Time (four) wafer, two: plate (LC.D) glass, light-emitting diode (led) substrate, carbon carbide, etc. η in: curry) wafer, quartz wafer, nitrogen cutting and oxidation solid = = Wafer technology in the wafer process technology: The carrier is placed on a polishing pad attached to a rotating platform. When the polishing liquid is disposed on the polishing crucible and the pair: :r is force, the wafer is ground by the relative movement of the carrier and the rotating platform or: the light::: circle is substantially subjected to the extremely fine abrasive material: The second time throws first to reach a rather smooth surface. Tian has succeeded in the grinding of one of the abrasives of the Yuancheng wafer. When the main fire is made, the scraps of the wafers and the like are held, which results in less work done... (2 = use of the grinding process) The sharp points on the abrasive material are not at the level relative to each other to localize the pressure to 15 200911462 to cause the abrasive to remove material from a workpiece.

The PCD or p DM knife sub-component of the present invention is generally a super-hard material, which makes the cutting element less prone to deformation when pressed against a 3 曰圄 μ + 曰隹 + #曰 。. Since the hardness is the unit of the concentration of the enthalpy, and the energy per unit volume, the dense structure of the PCD or PcBN of the present invention is re-lined to a very small volume in the T wood without any knowledge. . Since the 箄 is very good, the n-material has the ability to form an edge with few atoms. Therefore, the S-material is a virgin, J, and a very sharp cutting edge. It is not necessary to do so, but in an embodiment of the invention shown in the figure __ ί, the independent polycrystalline cutting 亓 Μ Μ β ^ pieces (16 in the form of a grid pattern, such as a square figure > 'is disposed within or on the organic material layer or pedestal. The cutting elements can be spaced apart from one another to have a range of from about 100 to about 800 microns. The door. ...) spacing (d). In one aspect of the invention, the individual water day cutting elements can be evenly spaced to have a spacing (d) of about 500 k meters. : In the embodiment shown in Figure 2A, the individual polycrystalline elements are disposed in or on the organic material layer or pedestal in the form of concentric circles. In the above embodiment, her independent cutting elements can be evenly spaced apart from each other to have a female 丨丄y having a pitch of about 1 〇〇 to about 800 μm. In the aspect of the present invention, The individual polycrystalline cutting elements can be spaced apart from one another and have a spacing (4) of about 5 microns. By uniformly cutting the elements to each other' the resistance applied to the cutting element in the cutting process can be evenly distributed in each of the female cuttings 70, which eliminates or reduces one or more of the individual cutting elements from falling off early. risks of. Premature shedding of one or more independent cutting elements can result in severe damage to the workpiece being processed. By arranging the -individual poly-wafer cutting element in the most mechanical stress of any individual polycrystalline cutting element, the a-frame enhances the process of retaining the independent cutting element on the organic material layer: a large reduction in impact The pressure on the individual cutting elements, alone: is retained on the solid organic material layer, especially for operations that require careful handling. I can consider a variety of structures and configurations to minimize the mechanical stresses acting on the grinding workpiece. Furthermore, the parameters for the above-mentioned off = may include the relative height at which the elements protrude from the layer of organic material. - Cutting elements that protrude significantly above the other cutting elements will:: damaging mechanical forces' and thus easier to self-solid organic material layers: . Thus, under the abrasive tool of a cutting element that does not have a uniform height distribution, an abrasive tool having a uniform height-distributed cutting element can act to more effectively maintain the integrity of the abrasive tool. In one aspect, substantially all of the individual cutting elements can be raised to a predetermined height on the solid state layer. Although any preset height useful for the grinding or cutter 2 will be considered in the context of the present invention, the preset height can produce a less than about 20 in a special aspect. Micron cutting depth. In another particular aspect, the predetermined height produces a knife from about 1 to about 2 inches when used for grinding a workpiece.丨 / clothing. In yet another particular aspect, when used to grind a workpiece, the /pre-degree can produce a depth of cut from about 10 to about 20 microns. In yet another particular aspect, the predetermined height can produce a reach or It is higher than 17 200911462 50 or 100 μm of cutting depth 1 v / and depending on the degree of visible cutting elements. In other words, the farther apart the cutting elements are, the greater the impact of the impact forces on each cutting element. Therefore, the pattern of increasing the spacing of the cutting elements can benefit from small variations in the preset height.

The cutting elements are of a different height from the solid organic material and this height is beneficial. The specified profile is versatile and has a variety of configurations. In a flat profile on the one hand, all cutting elements are flat. It is important that although this side allows for some height deviation between the cutting elements. The profile is projected to a predetermined height or a profile of the day, which can also be achieved according to the particular use of the abrasive tool, which can be a plane. The highest point of the feature is expected to be approximately aligned with the slope of the specified profile due to the limitations of the process itself. The work with the bevel is "曰m, with components striking the tool::: force for f evenly spread through the cutting I or CMP polishing 塾 dresser which is larger for the disc type sander The downward force can offset the cut-off element provided by the central part of the weekly record. At the position, the center point of the tool is connected to the peripheral point: therefore, the slope of the s-hai can be self-existing. Now part of the tool is in a discontinuous state, - or a complex slope. In some respects, the door can be tilted in the direction of a single edge, or it can be along the slope from the center to the circumference. σ The circumference of the rim is inclined to the center point. 18 200911462 Various types of solid organic material layer tools can be considered for patent application. It is not intended to be limited to certain slopes, so it can be used in different tools. There are various slopes. The polishing pad dresser can advantageously have a slope of ρ ^ ^. , μλ from the center to the circumference, and the slope + is 1/1000. = A variant of the tool has a slope In some respects, the finger can be /, has a curved shape. A particular embodiment of the shape is a hemisphere: (〇me) tool. This arc profile acts like a bevel. The tool can include: an arc opening v aj face in order to distribute friction more efficiently across all cut m Between cattle thus reducing the decay of the individual particles has a lifetime. As already described herein, although it is intended to limit the alignment of the tip of the cutting element along a specified profile, some degree of deviation can still occur. As a result of the tooling process, since the shape and size of the cutting elements that may be used on the tool are widely varied, these deviations can be highly dependent on the particular application. Note that "tip" - the word intent contains the highest point of a knife cutting element, not the β point is a vertex, edge or face. Directional Positioning, Tip Flatness, and "The Department of Technology for Manipulating Super Abrasive Particles is further disclosed in the US Patent No. 1/23,786 filed on September 9, 2005 and in April 2007. U.S. Patent Application Serial No. 1/733,325, the entire disclosure of which is incorporated herein by reference. The specified profile, with a degree of deviation from approximately 1 to a large 19 200911462. On the other hand, the cutting elements are configured to "make it two: = specify a sword face, and the degree of deviation is from about 5 to about 1 〇. The face cutting elements are configured to bias their tips: and the degree of deviation is from about 10 to about 75 microns. In addition, the cutting elements are configured such that their tips deviate from the specified degree by about 10 to About 50 microns. On the other side, the cutting elements are 妯 Λ , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Their tips deviate from the specified section The face, and the degree of deviation is about two to a few micrometers. In yet another aspect, the cutting element is offset from the designated end of the center of the two cores by a degree of deviation from about to about 50 microns. The cutting elements are configured such that their tips deviate from the designated profile 'with a degree of deviation from about 2 〇 to about 4 〇 microns. Further, in other aspects, the cutting elements are configured such that their tips are offset from the designated profile, The degree of deviation is less than about 2 microns. In another aspect, the cutting elements are configured such that their tips are offset from the designated profile by less than about 10 microns. In yet another aspect, the cutting elements are Arranged such that their tips deviate from the specified profile with a degree of deviation of less than about 5 mm. In yet another aspect, the cutting elements are configured such that their tips are offset from the designated profile by less than about 1 micron. In other aspects, most of the cutting elements are configured such that their tips are offset from the designated profile by about 10% less than the average size of the cutting elements. 00911462

The determination of the distance the tip of the cutting element extends from the organic fixture takes into account the extent to which the length of the cutting element extends upwardly from the fixture to the depth below which the cutting element sinks below the surface of the fixture. In the first embodiment shown by the first A-R, the ratio of the amount of each cutting element (16a) protruding above the fixture to the amount below the sinking conjugate is about 4 to 1. In the embodiment of Figs. 2A and 2B, about 2/3 of each cutting element (i6b) of the cutting device (10b) sinks by about 1/3. Other ratios may range from 2 〇 to 1 to about 0 · 2 to 1 ' and also include the intermediate range.

Ji Tian will be a v π hurricane type, and a relatively large portion of the cutting element (16a) (16b) can sink under the organic fixture. In this way, the largest cross-section is provided to bond the area of the fixture material under the "buried" maximum amount of fixture. The feature of the invention is that the widest portion 16 of the particle (the largest section of the cutting element) is closer to the particle: the end is farther from the other end, and the wider end can be placed below the surface of the machine base 'Compared to traditional diamonds, artificial diamonds or candies, it can provide great retention benefits. The maximum cross-section of traditional sand discs is close to the midpoint of the gravel' & therefore, it is set at: The wide portion can be at or near the end that is the farthest from the == (for example, the cutting end). The cutting element example t shown on the drawing is in the embodiment of the present invention, and the d-shaped part is a pyramidal opening j (golden word 1 and found such a structure i ^). The inventor will be volume/quality Once the beta-corner-shaped cutting element ensures the lowering of the cutting element, the piece can be more securely fastened to any form of base (Example 21 200911462, for example, a cutting tool) that supplies the jaws, jaws. Coupling, integrating or joining: by forming a triangular base on the pyramid, the supporting substrate on the pyramid can be thicker than the tip, and the ends are sharper (for example, 60 phantoms are not performed in CMP polishing) Damage or breakage during refurbishment. In general, a sharper cut (4) tip can make the polished 更 faster = in order to reduce the total refurbishment time. In addition, the thick plate on the hull is also more sharp and @ | ϋ日 U 匕等粗 (4) Polishable crystal f round '/ or faster refining polishing 塾 without causing unintended wafer unevenness. Or 'square pyramid can be used for lower cutting rate, square with pyramid The tip angle can be larger (for example 90 degrees). Therefore, the square pyramid creates a wider cutting path with greater resistance and lower = cutting rate. However, the square PCD cutter can be different from 9 to 125 degrees compared to the conventional one. The sharp-shaped hand-shaped "heart" angle of the early crystal diamond gravel is more so, the pyramidal polycrystalline material - generally speaking for a more efficient cutting, while the pyramidal (with three sides) polycrystalline material In particular, the cutting element of the invention can be manufactured in a very tightly controlled geometry, the polycrystalline cutting element being less tearable when cutting the polishing pad: a light pad. In addition, an additional number is formed on the main cutting element. ==Parts: Better performance. In other words, the mineral tooth I on the cutting surface can improve the cutting action of the cutting element. In other words, the single crystal sandstone t is often smooth, so it will cause a large plastic deformation of the polishing crucible. Tear; the "fragment" that has been cut. It should be noted that the surface of the "mouth J 7G piece additionally enhances the retention of the organic material layer (the fixed surface of the solid surface allows the organic material to a large extent " The second cut element = 22 200911462 is stronger than the single-crystal cutting element with a smooth surface. In addition, the polishing pad dresser often distributes the polishing pad unevenly on the cutting element when refinishing the polishing pad. The cutting element of the edge usually has to perform most of the cutting work, and the inner element does not suffer the same degree of stress. One method of the present invention in response to this problem is to make the "outer side" cutting element 'for example PCD grit (for example, #近切The outer cutting element is more robust and/or cut slightly above (eg, about 10 microns higher). The outer side: the cutting element can be placed on the cutting tool at a greater density. For example, they may be closer to each other and/or positioned at a lower height. In this design, the cutting element may not be divided in a lattice form, but may comprise a plurality of: a radially symmetric concentric circle. In the present invention - an embodiment may be formed on the outer members with a larger base relative to the cutting tip (on the one hand the outer member may have a triangular illusion and the outer member may have an edge formed on the cutting tip) No: only one end point. Furthermore, the 'outermost cutting element can have a small mesa (5Q micron) formed on the cutting tip instead of just the __ straight edge or end point, which can have its edge Cutting the polishing pad. In the present invention-embodiment, the cutting elements may be asymmetrical pyramids. For example, 'the cutting force generally acts from the outer side to the inner side, and the pyramid design may have a relatively steep mountain. The oblique wall of the shaws faces the 1 circumference of the cutting device and has a relatively gentle slope to face the tail (10 degrees from the horizontal plane π). The top surface of the tip of the pyramid is not horizontal. , and can be slightly "slanted" inward, x makes the fragments easier to fall off. The side of the invention 23 200911462 is different from the diamond gravel cut treasure dJ pad, the traditional cutting pad has a negative angle of the right: "

, s*, /v 〇g ^ ^ only /Λ. 3^Χ yJV tearing or cutting force in the ligament σ ancient 4卞ρ l private Μ strength (C〇mpressjve Force). In this embodiment of the invention, the 7-knife cut-off is not accompanied by a large amount of squeezing force, so that it is easier to remove the "shards" on the polishing pad. In other words, the present invention makes it possible to spend energy on the cutting, rather than the plastic deformation. The sergeant + & error is formed by forming a vertical wall on the pyramid and making the vertical wall of the pyramid slightly smaller than 90 yan, for example, about 8 )). In this example, the corner residual #月 cone can be sharper on the top surface of the $face, similar to an inverted pyramid. This surname, this, α structure can improve the cutting efficiency of the cutting pad, which is due to the positive angle of the horn; ^ thousand free 丨 & + J buckle order, similar to shaving with a razor

the way. This kind of design is impossible to broadcast the „D b wood with the early diamond design, because with this design

The relevant cutting edge is always used #L you. I know that I use a negative angle. The pyramidal cutting element of the present invention can provide a positive cutting edge, since the positive piece is relatively flat to form a more +. on the tail side of the cutting interface (for example, ^ ^ ^ ^ ^ of the pyramid) The nickname) supports the structure of the cutting edge, so the cutting edge does not fail prematurely. The ° asymmetric structure can be % t k

, formed by wire-cut electrical discharge machining (W丨>e E丨ectN, object 9, balance e-_), and 1 can be made to have a tip, edge or mesa at the tip end of the pyramid. In addition, when the element is made of independent particles, the meteorite is less than the Japanese car, the double knives: 3⁄4 V noise, the structure of the particle or sand, including the above-mentioned machine, is used, and the m phase is expected. Injury creates an asymmetrical structure formed by a suitable tool for processing pcT particles. In an embodiment of the present invention, the i77 ί, Ι ^ Wb inch month dimension 3 can be adjusted to adjust the contact pressure of the point of view, the edge or the table surface, and the farther apart, the contact pressure between the pyramid and the corner The bigger. Cause::P:24 200911462 f The less the tip is to support the stress, the deeper the depth of the tip penetration, and the larger the roughness formed on the polished file. In general, the polishing rate of a wafer depends on the size and number of the roughness. The denser and smallerer roughness has a comparable polishing rate to the more sparsely roughened portion. However, the former is more uniform and does not generate excessive power, causing problems such as uneven hooking, scratching, money intrusion or embarrassment on fragile wafers. The aforementioned smaller and denser roughness is applied to steels of less than 9 nanometers (nm) and dielectrics having a low dielectric constant (Low-K) and greater than 20% pores (p〇re). The effect is more significant and true. The individual polycrystalline cutting elements can be formed in a variety of ways and in a variety of materials known to those skilled in the relevant art. In one aspect of the invention, the cutting elements are formed of a tantalum/cerium carbide sintered polycrystalline diamond cube to form a matrix. Each cube contains approximately 9Q% by volume of lock stone (particle size of approximately 10 microns) and the remainder may be either Shi Xi or Carbonized Fossil. A very small amount of titanium can be used to facilitate the sintering process. The cubes can be pressed into a graphite mold' and the sides of the cube can be 1 mm long. Although the cubes in the above examples have proven to be particularly effective, it should be understood that the present invention can use polycrystalline materials of various sizes and configurations. By forming the cutting element in a separate shape in the shape of a superhard polycrystalline material, it is easier to configure the cutting in a very precise manner. Since the defined geometry can be replicated quite accurately from one cutting element, each cutting element can be placed on the surface of the cutting device in question, as the stress on the cutting elements of the Hiroshima-cho can also be Quite - the ground sanding butterfly that spreads throughout the surface of the cutting device's example. · r 'The overall shape of the sand discs and: inch 25 200911462 can be a month b in the stone) butterfly and another sand disc The difference 'this makes it difficult to arrange these sands accurately.材料 The material used in the organic material layer (1 4 ) 户 / 由 α α α ) can vary considerably. The field of the case has a familiar skill. The 种 种 ^ species can be used very effectively in the organic materials of the invention example, * α 土 &, you do not consider discussing these organic materials here.兮 The organic material layer can be any sturdy (Curab丨e) resin material, resin bite. It has enough strength to be used as a separate polycrystalline cutting element of the present invention. The use of a harder organic material layer shape or no bending deformation is to have a thousand tanned surface and less f-bend changes. This allows the abrasive tool to at least partially blend very small individual polycrystalline cuts to open i small cutting elements at fairly flat and consistent heights. The organic material of the smear, the second, and the outer layer can act to absorb the mechanical force of the cleavage element in the organic material, because of the grinding tool. ...the skilled artisan will be aware of any method for causing the organic material layer to harden the organic material layer in a phase in which the mechanical force is dispersed and evenly spread. The organic material layer 1:" is at least soft and tortuous to the rigid skin. Radiation (such as Lai! Exposure of organic materials to heat, electromagnetics such as electron beams), organic catalysts, and hardening methods known to those skilled in the art. 疋 Others in the field of the present invention are familiar with certain aspects of the present invention. They can be individually:: 疋-thermoplastic materialized and softened. Reversible hardness in s ^ heat. On the other hand, the organic material can be a thermosetting material. 26 200911462 • Thermosetting materials cannot be reversibly like thermoplastic materials Hardening or softening. In other words, once hardening occurs, the process is substantially irreversible. The organic materials useful in the present invention may include, without limitation: amino resins (including alkyl urea furfural resins ( a|ky|ated urea-formaldehyde resins), melamine-formaldehyde resins, alkyl benzoguanamines Alkened benzoguanamine-formaldehyde resins, acrylate resins (including viny acrylates, acry|ated epoxies' acrylate amides (acrylated urethanes), acrylic acrylated polyesters, acry|ateci acrylics, acrylate polyether polyols (acry|atecj p〇|yethers), vinyl ethers, acrylic acid Acry|ated oils, acrylated silicons and related methacrylates, alkyd resins (eg urethane alkyd resins) Polyester resins, polyamides, polyimide resins, polyimide resins, reactive urethane resins, and polyurethanes Polyurethane resins, phenolic resins (such as liquid resole resins and novolac resins), phenol/latex resin (p Henolic/latex resins), epoxy resins (such as bisphenol epoxy resins), isocyanate resins, isocyanurate resins, poly-stone oxywatt trees 27 200911462 Polysiloxane resins (including alkylalkoxysilane resins), reactive vinyl resins, resins under the trade name Bakelite (including polyethylene resins, polypropylene resins) Polypropylene resins, epoxy resins, phenolic resins, polystyrene resins, phenoxy resins, tetradecanoic dianhydride resins (pery|ene) Resjns),

Polysulfone resins, ethylene copolymer resins, acrylonitrile-butadiene-styrene (ABS) resins, acrylic resins And vinyl resin (viny丨resins), acrylic resin (ac "ync resins", polycarbonate resin (p〇|ycarb〇nate nickname resi ns), and mixtures and compositions thereof. In the machine material of the present invention The organic material may be a poly-branched amine resin. In another aspect, the organic material may be a polyurethane resin. The organic material may contain various additives to enhance its use. For example, additional cross-linking agents and fillers may be used to enhance the hardening characteristics of the organic material layer. In addition, it is possible to use the bath agent to penetrate the organic material layer. In addition, it can be in the hardened organic material layer to the U-strength material of the J-knife. This reinforcing material can act to increase the strength of the machine material layer and further enhance the independent polycrystalline cutting. The retention of the component on the machine material layer. In one aspect, the (four) chemical material may comprise a genus or a composition thereof. Examples of ceramics include oxidized _na), 匕绍 (A 丨 round _ (10) coffee) ,: oxidized Hica), carbonized stone eve 28 200911462 Zirconium (Silicon Carbide), zirconia (仏(3) heart) Carbide) and mixtures thereof. In addition, in the aspect, it can be coated on the surface of each superabrasive particle. A bond or an organometallic compound promotes retention of the superabrasive particles by chemical bonding on the substrate of the organic material. A wide variety of organic and organometallic compounds are known and used by those skilled in the art. The mixture can form a chemical bond between the superabrasive particles and the organic material matrix to increase the retention of the particles in the matrix of the organic material. In this way, the organometallic binder acts as a bridge to form an organic material matrix and a link between the surfaces of the superabrasive particles. In one aspect of the invention, the organometallic binder can be a titanate (Titanate), a misacid salt (Z Irconate), silane, and mixtures thereof. Specific, but not limited to, decanes suitable for use in the present invention include: 3-g|ycidoxypropyltrimethoxy silane ( Y-methacryloxy propyltrimethoxy silane (available from Dow Corning's model Z-6040 decane) (available from Union Carbide Chemicals)

Company's model as A-1 74 decane, (3-(3,4-epoxy cyclohexyl)ethyl trim ethoxy silane), Γ-amipropyl triethoxy silane, Ν-(β-aminoethyl)-Y-aminopropylmethyldimethoxy decane (b (-3111 〇0)讣71)-丫-aminopropylmethyldimethoxy silane) (available from Union Carbide, Shin-etsu Kagaku Kogyo, 公司·公司, etc. 29 200911462), and other US Patent Nos. 4,795,678, 4,390,647 and 5,038,555 Suitable decane binders disclosed in the patents are incorporated herein by reference. The specific, non-limiting titanate binder may comprise: tris(isooctadecanoic acid-0) (2-propoxy) Isopropyl tri isos tea royl titanate, di(cumylphenylate)oxyacetate titanate, 4-aminobenzene benzene continued ten-benzate (4 - aminobenzenesulfonyldodecyl benzenesulfonyl titanate), tetraoctyl double (double thirteen Phosphite) titanate (ditridecylphosphite) titanate, isopropyl tris(N-ethylamino-ethylamino) titanate (|5〇口|*0卩丫|忭丨(|^-6出7丨3011门0· ethylamino) titanate ) (available from Kenrich Petrochemicals. Inc.), neoalkyoxy titanates (eg LICA-01, LICA-09, UCA-28, LICA-44 and UCA-97, also available from Ken Rich, etc. Special, but not limiting, binders include acetoalkoxy aluminum diisopropylate (available from Ajinomoto KK), etc. Specific, but not limited, sulphate binders include : neoalkoxy zirconates, LZ-01, LZ-09, LZ-12, LZ-38, LZ-44, LZ-97 (all available from Kenrich Petrochemicals, lnc_) and the like. Other known organometallic binders, such as Thiololate compounds, can be used in the present invention and are included in the scope of the present invention 30 200911462. The amount of organometallic agent used depends on the surface area of the binder and the individual polycrystals. In general, an organic material layer containing 〇 5% to 〇 by weight of the organic metal binder is sufficient. . "After the month", the first A picture, in one aspect of the invention, the independent polycrystalline (four) element of the cutting device (i〇c) can be gathered by the material & (p〇丨^" handsome heart Blank Formed and/or obtained. Figure 3A shows such a material (10)), which is packaged as a disc-shaped polycrystalline compact having a diameter of about 3 〇 and a thickness of from about 0 2 to 2 m ητ. The disk (30) can be divided into a plurality of polycrystalline individual cutting elements in various ways known to those skilled in the art, including but not limited to electrochemical processing, laser cutting, plasma etching, Oxidation (formation of carbon dioxide or carbon monoxide gas), hydrogenation (formation of a gas), etc. Laser beam with a longer wavelength (for example, Neodymium-Doped Yttrium A|uminium Garnet, ND: YAG)) is used to efficiently form a cutting groove on a PCD, and a shorter wavelength laser beam (such as a laser (EXcimer)) can be used to cut a second cutting element on top of the main cutting element, such as Figure 3 shows the latter. Although the latter cuts slowly, it uses The wavelength is usually more precise, and the higher frequency energy can cause less surface damage. This laser beam is used for the shaving or planing of the 7 wafers of the present invention. EDM process (E|ectrica丨

Discharge Machining, EDM) removes material from PCD or PcBN polymers. In this regard, the EDM process can use one or more with drills 31 200911462

Stone electrode. For example, t, eD diamond material, and EDM f " use: the cathode can be mixed with the collar, PCD ^, Wang use the risk can be PCD (in this case, PCD generally needs at least one Qiu Bamu + For shed diamond material, it can be accompanied by tool conductivity). When a current is applied to cut the material on the PCD in a PCD cut, various cutting elements are opened. As can be appreciated, the disc (30) is divided into eight = shaped blocks. In the present invention, the wedge-shaped solid organic material layer is disposed on the susceptor (10). ==本发:中' The wedge block (4) is distributed radially on the surface of the substrate; In this manner, the wedge blocks (32) are configured such that each wedge block (32) undergoes substantially the same force when grinding or processing a workpiece (the following is not:: each wedge block (32) is substantially prepared/also It is not necessarily the case, but in the present invention, the 'PCD note (3.) may have a diameter of about 3 inches, and the * base may have a diameter of about i00 mm. A material of about 3 mm in size (10) can form a cutting device having a diameter of about 1 cm. ° As shown in the fourth figure, in one aspect of the invention, the cutting device (1〇d) each of the polycrystalline individual cutting elements The longitudinal axis of the wedge block (32) is aligned along the radius (R) of the cut: In this embodiment, the polycrystalline individual cutting elements are staggered at 4: = on the cutting device (adjacent The independent polycrystalline cutting element 1 is in the opposite direction. The method of arranging the cutting piece on the surface of the base or the substrate (12b) can be changed according to the specific application. Since the independent polycrystalline element == shape and size are the same, The setting and configuration of the cutting element on the pedestal is easy. Therefore, it changes for specific applications. This can be done quite easily and by 32 200911462. By using a small amount of polycrystalline material (such as a disk) compared to the pedestal (12b) of the workpiece (not shown) (30)), which can greatly reduce the amount of polycrystalline material used, and save considerable cost. The inventors have found that the performance of the cutting device of the present invention is equivalent to or similar to "comprehensive", with polycrystalline cutting or grinding. The work of the traditional Chinese cutting device, the performance of the traditional cutting device of the cookware. The polycrystalline crystal of the third A picture can be divided into equal parts. However, as the fifth to the fifth - the broken --, the younger brother The figure is not, the disc (3 (^) (30〇) (30〇1) can be divided into 12 2 phase qiu Qiuguang 4 ^ 卩 ( (that is, (four) block (32b)), 16 equal Part (ie wedge block I, / n > 4 ghost (32C)) and 2 equal parts (32d)), etc.., Shigu-^ 押本本明明 provides sufficient flexibility to create and configure independent poly The crystal cutting element is on the tool. Considering various other possible structures, it includes and is not limited to independent polycrystalline cutting with different sizes and shapes. In accordance with a third aspect of the invention, in the aspect of the invention, each individual polycrystalline cutting member () may comprise a plurality of second cutting elements (4〇) formed on a table of the individual polycrystalline cutting elements. The two cutting elements can be configured such that each "曰 separate cutting element can have a different shape when the cutting device is in use, and can include rectangular cutting elements, pyramidal cutting elements, and triangular knives. The cutting element can also be tapered (Truncated py "am丨'dal Shape" (the second cutting element is not used in the main cutting element, the length of the cutting edge can be increased by up to 1 〇, 〇〇 〇 times. According to another aspect, the present invention provides a method of manufacturing a cutting device, the package 33 200911462 comprising 'acquiring a substrate; and the plurality of independent polycrystalline cutting elements disposed on the substrate; each of the individual polycrystalline elements comprising a geometric structure; A layer of solid energy, organic material secures the individual polycrystalline cutting elements to the substrate. The method can include aligning the cut ends of the individual polycrystalline cutting elements with a common plane. EXAMPLES The following examples are provided to illustrate various methods of making the cutting apparatus of the present invention. The two examples are for illustrative purposes only and are not intended to limit the invention. Example 1 - item ... > 〇 The system is used as a cutting element to form a CMP pad repairer. Each cube contains: 90% by volume of diamond (particle size is about 1 inch), and the remaining part is broken or carbon cut. A small amount of titanium can be used to promote: the bonding process. The cube is pressed into a graphite mold with a length of 1 mm on each side. A plurality of holes are formed in the clothing oxide cookware to accommodate the tip end of the pCD cube. An interface layer is provided on the top surface of the mold. Next, another = compound is applied to it in a vacuum. After hardening, the mold is removed and the tip of each cube is blasted. These tips become the cutting tips of a polishing pad conditioner. The discs of the sintered polycrystalline diamonds of ILtLi, Xi/&11 are divided into: ", a plurality of wedge-shaped blocks having substantially the same volume. These wedge-shaped blocks are used as cutting-cut CMP polishing 塾 dressers. Each wedge block contains approximately 34 200911462 * 90% by volume diamond (particle size approximately 10 microns) and the remainder is tantalum or tantalum carbide. A very small amount of titanium can be used to facilitate the sintering process. A plurality of holes are formed thereon to accommodate the PCD wedge block. An interface layer is disposed on the top surface of the mold. Then, another epoxide is vacuum-cast thereon. After hardening, the mold is removed to expose the wedge blocks. The surface of the wedge block (including the edge on the surface) becomes the cutting element of a polishing pad conditioner. Example 3 Both sides of a PCD blank pressed by a Cubic Press are cut to remove fire resistance. (Refractory) metal container (for example, giant (butyl (1) (7), D)). The outer diameter of the polycrystalline silicon is removed. The pep slab is bonded to a Wolfram Carbide (WC) substrate, and the pCD layer Conduct edm A plurality of pyramids are formed in a predetermined pattern. The PC[) blank is then divided into a plurality of wedge-shaped cutting blocks, and the cutting blocks are placed on a flat mold and the cutting blocks are flush with the mold. The mold is placed in a vacuum chamber and the epoxide is poured on top of it. Finally, a stainless steel plate is placed on the flowing epoxide and the stainless steel plate is pressed against the PCD until the back of the pCD is bonded to the steel substrate. A thin layer of epoxy is formed. After the epoxy is hardened, the PCD cutting tool is cleaned and a mounting structure (such as a hole) is formed on the back side of the steel substrate. The PCT cutting block can be in the form of a circular pattern, a circular plate, a square, or the like. Configured on stainless steel plates. These graphics can be optimized for specific CMP applications. 35 200911462 Readers should be aware that the above is for use only. This technique is familiar to those who do not violate the principles of the invention. #者可=The premise of the spirit, the patent application method attached to the case belongs to the second application, and depends on it. Therefore, the apricot solid dish & some modifications and different configurations, this invention It is currently considered to be exposed as above, for the concept and principle of _ items to be made without limitation to a variety of a 3 ί size, material, and

And changes in use. ~, work -, operation method, assembly [Simplified description of the drawings] - Figure A is a plan view of the cutting device in the present invention - an embodiment. A partial enlarged view of the cutting device in the first-B diagram and the first-A diagram. Figure _A is a plan view of a cutting device in another embodiment of the present invention

Figure 2B is a partially enlarged view of the cutting device in Figure A. The first A is a top plan view of a polycrystalline blank in an embodiment of the invention, wherein the individual polycrystalline cutting elements included in the cutting device are formed from the polycrystalline blank. The third B diagram is a partially enlarged perspective view of the cutting element presented along line B_B of the third a diagram. Figure 4 is a top plan view of a polycrystalline body in accordance with another embodiment of the present invention in which a separate polycrystalline cutting element comprised by a cutting device is formed from the polycrystalline body. 36 200911462 The fifth figure is another polycrystalline pattern of the present invention - an embodiment, the polycrystalline chain being divided into a plurality of individual cutting elements. The sixth plan view of the present invention is a plan view of another embodiment of the present invention, the cutting device comprising a complex & The seventh figure formed by the day # is a plan view according to another embodiment, the cutting device comprises a plurality of independent polycrystalline cutting elements formed by the fifth figure. a jin opening 第八 The eighth figure is another collecting view of an embodiment of the present invention, which is divided into a series of independent cutting elements. The ninth diagram of the present invention is another embodiment of the present invention - a cutting device comprising a plurality of + faceted polycrystalline cutting elements.独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独 独The t-th image is a top plan view of another polycrystalline film according to an embodiment of the present invention, and the germanium polycrystalline body is divided into a pair of independent cutting elements. Fig. 12 is a top plan view of the cutting device of the other embodiment of the present invention. The device comprises a plurality of the tenth polycrystalline cutting elements of the tenth. It is to be understood that the above drawings are only for further understanding of the display use of the present invention. In addition, the schema is not based on actual scales, so size, particle size, and other aspects are often exaggerated to make the view clearer. Thus, in making the cutting apparatus of the present invention, it is possible to violate the particular dimensions and other aspects exhibited in the drawings. [Description of main component symbols] (10a) (10b) (10c) (10e) (10d) (10f) (10h) Cutting device (12a) (12b) Base (14) Solid organic material layer (16a) (16b) Independent polycrystalline cutting element (18a) (18b) cutting tip (20a) (20b) plane (30) (30b) (30c) (30d) disc (32) (32b) (32c) (32d) wedge block (40 ) second cutting element (R) radius 38

Claims (1)

200911462 X. Patent application scope: 1 super-hard cutting device, which comprises: a pedestal, gan L, ” s and a layer of solid organic material; and a plurality of independent: 3⁄43⁄4 B i crystal cutting components, fixed In the layer of the solid-state machine material, each of the θ ♦ 曰 a cutting elements has a substantially uniform geometry. 2 , as in the main A, the ultra-hard cutting device described in claim 1 of the patent scope, wherein Each of the individual Η ... ... ... 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Wherein each of the independent polycrystalline b-d pieces is a divided part of a material polycrystal. For example, the ultra-hard cutting device described in claim 3, wherein the far polycrystalline transmission ^ _ ή π_ is a dish shape And wherein each of the individual polycrystalline cutting elements is a divided portion of the disk. The ultra-hard cutting device according to claim 4, : each individual polycrystalline cutting element is an equal part of the disk; and the equal parts are equal to each other. The superhard cutting device according to item 4 of the above-mentioned Japanese Patent Application No. 4, wherein each of the independent crystal cutting elements is substantially wedge-shaped. 7 The super-positive polycrystalline cutting element according to item 4 of the claimed patent scope is distributed in the radial direction in the super-hard cutting device described in the ultra-two-position: the patent scope f 7; ~ ~ VT knife cutting device, another γ each of the individual polycrystalline cutting elements of the longitudinal 糸 / σ D Hai cut,] the radius of the component sound 39 200911462 Qi. The superhard cutting device according to the eighth aspect of the invention, wherein the independent polycrystalline cutting element distribution is staggered in the opposite direction on the superhard cutting device. 10, the ultra-hard cutting device according to the application of the scope of the patent application, the independent polycrystalline cutting element comprises a plurality of second cutting chambers formed on the surface of the independent polycrystalline cutting element &> There are 13, 70 Japanese knives, and the second cutting elements are configured to maintain a sharpness in the use of the super-hard cutting device. Bao, J Kaidu plant superhard cutting attack, which consists of: a plurality of independent polycrystalline cutting elements, which are fixed in the layer of organic materials, each of which has 70 pieces of independent polycrystalline cutting containing at least _ + knives The tip, the hole of the individual polycrystalline cutting elements is paired with a super-hard cutting device as described in item 11 of the common plane 0 of the patent application, wherein the individual polycrystalline cutting elements are configured uniformly The resistance is distributed throughout substantially the individual polycrystalline cutting elements. The super-hard cutting device described in item 11 of the patent scope of the Japanese patent, the independent polycrystalline cutting element of the middle and large latitudes protrudes from the solid state to a predetermined height. A superhard cutting device as described in the 'Scope of Claims' wherein when the superhard cutting device is used to grind a workpiece, the predetermined height produces a cutting depth of less than about 20 microns. The superhard cutting device of claim 1 wherein each of the individual polycrystalline cutting elements has a substantially uniform geometry 200911462 structure. The superhard cutting device according to claim 11, wherein each of the individual polycrystalline cutting elements is a dividing portion of the material polycrystalline blank, as described in claim 16 of the patent application. The ultra-hard cutting farm, wherein the polycrystalline body is in the shape of a dish, and wherein each of the individual cutting elements is a divided part of the disk. 18. The superhard cutting device of the superhard cutting device according to claim 17 of the patent application is an equal division of the discs. The superhard cutting device of claim 17, wherein each of the individual polycrystalline cutting elements is substantially wedge shaped. The superhard cutting action of claim 17, wherein the individual polycrystalline cutting elements are radially distributed on a surface of the organic material layer. 2 1. The superhard cutting split according to claim 11, wherein the individual polycrystalline cutting elements have substantially the same size and the same shape. 2 2 The superhard cutting device according to the above-mentioned item of the patent application, wherein the individual polycrystalline cutting elements such as 忒 are configured in a lattice shape. The superhard cutting device of claim 2, wherein the individual polycrystalline cutting elements are evenly spaced from each other and have a pitch of from about 100 to about 800 microns. [24] The ultra-hard cutting device 41 200911462 according to claim 23, wherein the individual polycrystalline cutting elements are evenly spaced and have a pitch of about 500 microns. The superhard cutting device of item 1 or 11, wherein the solid organic material layer comprises a material selected from the group consisting of amino resins, acrylate resins, alkyd resins ( Alkyd resins), polyester resins, polyamide resins, polyimide resins, polyurethane resins, phenolic resins, phenol/latex resins (phen0|ic/|atex resins), epoxy resins, isocyanate resins, isocyanurate resins, polysiloxane resins, reactive viny|resins , polyethylene resins, polypropylene resins, polystyrene resins (p〇|ystyrene resins), phenoxy resins ( Phenoxy resins), perylene resins, p〇|ysulfone resins, acrylonitrile-butadiene- styrene (ABS) resins , acrylic "esins", P〇丨ycarbonate resins, and mixtures thereof and groups of people. 2 6. Ultra-hard cutting device as described in claim 25 of the patent application. The solid organic material layer is an epoxide resin. 2 7. The ultra-hard cutting device according to claim 25, wherein the layer of the organic material is a polyurethane resin. 42 200911462 2 8 The superhard cutting device of claim 25, wherein the solid organic material layer is a polyamidene resin. 2. The ultra-hard cutting as described in claim 25 The device 'further includes a reinforced material disposed in at least a portion of the history of the layer of solid material. The superhard cutting device of claim 29, wherein the reinforcing material is selected from the group consisting of , the The group consisting of ceramic, metal, or is a composition composed. 3 1. A method of superhard cutting device, comprising: obtaining a substrate; and arranging a plurality of independent polycrystalline cutting elements on the substrate, each of the independent a chopping elements having a substantially one-to-under geometric structure; A layer of solid organic material cuts the individual polycrystals onto the substrate. 1 Dry mouth 肀 肀 肀 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利^ Aligned with the system, as described in claim 31, the superhard centroid method, in which each is independent of θ. Break the cut section. 34 two pieces are a material polycrystalline * 1 mu 巧 专利 专利 专利 专利 专利 专利 专利 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中A separate portion f of the disc is "and", as described in claim 34, the independent "cutting element" is the portion of the disc that is equal to each other 43 200911462. 3 6. For example, in the third method of patent application, the super-hard cutting device method described in each of the following paragraphs is the wedge-shaped element. 3 7. If the scope of patent application is 3 4Bie's super hard cut treasure t|爹詈 method, in which the independent polycrystalline cut 彳 _ J shovel 曰 疋 分布 分布 分布 分布 分布 分布 分布 分布 分布 分布 分布 分布 分布 分布 分布 分布 分布 分布 分布 分布 分布 分布 分布 分布 分布 分布 分布 分布 分布 分布Superhard cutting device The method of the method ~, the medium polycrystalline cutting element system, has substantially the same size and the same shape. The superhard cutting device method of claim 31, wherein the individual polycrystalline cutting elements are configured in a lattice shape. The superhard cutting device method of claim 39, wherein the individual polycrystalline cutting elements are evenly spaced from one another and have a pitch of from about 1 大约 to about 800 microns. The superhard cutting device of claim 1 or 11, wherein the individual polycrystalline cutting element comprises a superhard polycrystalline cutting element. 4. The superhard cutting device of claim 41, wherein the superhard polycrystalline cutting elements comprise superhard polycrystalline particles. The method of superhard cutting device according to claim 31, wherein the polycrystalline cutting element comprises a superhard polycrystalline cutting element. 4. The method of superhard cutting device according to claim 4, wherein the superhard polycrystalline cutting elements comprise superhard polycrystalline particles. 4. The method of superhard cutting device according to claim 4, wherein the superhard polycrystalline cutting elements are selected from the group consisting of polycrystalline diamonds and polycrystalline cubes. Made up of boron nitride. XI. Schema: as the next page a. I 45