JPS58186569A - Electrodeposited grindstone - Google Patents
Electrodeposited grindstoneInfo
- Publication number
- JPS58186569A JPS58186569A JP6816282A JP6816282A JPS58186569A JP S58186569 A JPS58186569 A JP S58186569A JP 6816282 A JP6816282 A JP 6816282A JP 6816282 A JP6816282 A JP 6816282A JP S58186569 A JPS58186569 A JP S58186569A
- Authority
- JP
- Japan
- Prior art keywords
- abrasive grains
- metal film
- coated
- nickel
- grindstone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006061 abrasive grain Substances 0.000 claims abstract description 61
- 239000002184 metal Substances 0.000 claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 29
- 238000002156 mixing Methods 0.000 claims abstract description 12
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 10
- 239000010432 diamond Substances 0.000 claims abstract description 10
- 238000004070 electrodeposition Methods 0.000 claims abstract description 9
- 238000009713 electroplating Methods 0.000 claims abstract description 6
- 238000000227 grinding Methods 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 52
- 229910052759 nickel Inorganic materials 0.000 abstract description 25
- 239000011248 coating agent Substances 0.000 abstract description 8
- 238000000576 coating method Methods 0.000 abstract description 8
- 239000007788 liquid Substances 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000003287 optical effect Effects 0.000 abstract 1
- 239000002245 particle Substances 0.000 description 9
- 238000005520 cutting process Methods 0.000 description 7
- 239000000956 alloy Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010953 base metal Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000011536 re-plating Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RUQACMGBLIBRPP-UHFFFAOYSA-N [Zn][Pb][Sn] Chemical compound [Zn][Pb][Sn] RUQACMGBLIBRPP-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- QNDQILQPPKQROV-UHFFFAOYSA-N dizinc Chemical compound [Zn]=[Zn] QNDQILQPPKQROV-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、金ＩＩＩＩ！ｓを被覆した砥粒と、金属膜を
被参しない砥粒とを混合したものを電着成長した電Ｎ砥
石に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention provides gold III! The present invention relates to an electro-N grindstone in which a mixture of abrasive grains coated with S and abrasive grains not coated with a metal film is grown by electrodeposition.
従来より、ダイヤモンドやボラゾン等の超砥粒を電気メ
ツキ法によりニンケルボンドしてなる電層砥石は檀々存
在していたｏ’に＊砥石は、結合度が高く硬いため切味
、耐摩耗性にすぐれ、特にμｍ単位の薄い砥石を形成し
、硬質の材料を研削、切削するのに好適である。ところ
が、この電層砥石は、結合度があま妙−＜硬いと一部の
材料では欠け、割れなどの原因となり、折角の電着砥石
の特黴を生かし切れない欠点があっ九。Conventionally, there have been many electric layered grinding wheels made by bonding super abrasive grains such as diamond or borazone using electroplating method. It is particularly suitable for forming thin grindstones on the order of μm and for grinding and cutting hard materials. However, this electroplated whetstone has the disadvantage that the degree of bonding is not so good, and if it is hard, it may cause chipping or cracking with some materials, making it impossible to take advantage of the special properties of the electroplated whetstone.
本発明は、上述の欠点を解消し、任意の結合度の′＃Ｌ
７１１砥石を得ることを目的としてなされたもので、予
め表面に金属膜を被覆し九砥粒と、金属膜を被覆しない
砥粒とを目的に応じて任意に混合したもの會鬼気メッキ
液中で同時に電着成長せしめてなるものである。このよ
うに構成すれば、配合割合いによって任意の結合度が得
られ、電着砥わの一層の特徴を生かすことができる。し
かも、金＠膜を被覆した砥粒は、導電性を有するので、
析出成長が速やかになされ、長さが長く、厚さの厚い砥
石が蝮時間で形成で舞る。The present invention solves the above-mentioned drawbacks and solves the above-mentioned drawbacks.
This was made for the purpose of obtaining a 711 whetstone, and the abrasive grains coated with a metal film on the surface and abrasive grains without a metal film were arbitrarily mixed according to the purpose. At the same time, it is grown by electrodeposition. With this configuration, an arbitrary degree of bonding can be obtained by adjusting the blending ratio, and further characteristics of the electrodeposited grinder can be utilized. Moreover, since the abrasive grains coated with gold@ film have electrical conductivity,
Precipitate growth occurs rapidly, and a long, thick grindstone is formed in a short time.
以下、本発明による電着砥石の製造骨法を図面に基づい
て悦明する。Hereinafter, the manufacturing method of the electrodeposited grindstone according to the present invention will be explained based on the drawings.
（１） 混合すべき砥粒（１）（２）として、例えば
ダイヤモンド砥粒、立方晶窒化ホウＬ（ｌｌｋ粒、アラ
ンタム砥粒、ホワイトアランダム砥粒、カーボランダム
砥粒、グリーンカーボランダム砥粒等の中から、庚ボの
粒度のものを１棟また社２楕以上を電増峨わの１史用目
的に応じて選択する。(1) As the abrasive grains (1) and (2) to be mixed, for example, diamond abrasive grains, cubic boron nitride L (llk grains, arantum abrasive grains, white alundum abrasive grains, carborundum abrasive grains, green carborundum abrasive grains) From among these, select one building with the grain size of Kobo, and one building with a size of 2 or more buildings, depending on the historical purpose.
（２） 選択された砥粒（１） （２１のうちいずれ
かの砥粒（１）の外−肉に金属膜（３）、例えばニッケ
ルを被覆する◇具体的には、ニッケルの無電解メッキ液
中に所定の粒度の砥粒（１１を入れて所定の温度を保ち
なから振鯛を与えることによって、砥粒（１）の外表面
にニッケルの被［１（３１が被覆される。このニッケル
被膜（３）の厚さも結合度に影曽するので、目的に応じ
た厚さに１１６１する。結合度の低い砥石とするときは
ニッケル被膜（３）を薄く被覆し、結合度の高い砥石と
するときはニッケル被ｐＩＡ＋３１を厚く被覆する。(2) Selected abrasive grains (1) (Covering the outer surface of any of the abrasive grains (1) of 21 with a metal film (3), for example, nickel ◇Specifically, electroless plating of nickel By putting abrasive grains (11) of a predetermined particle size in a liquid and applying shaking while maintaining a predetermined temperature, the outer surface of the abrasive grains (1) is coated with nickel [1 (31). The thickness of the nickel coating (3) also affects the degree of bonding, so the thickness should be set to 1161 depending on the purpose.When creating a whetstone with a low degree of bonding, apply a thin layer of nickel coating (3) to create a whetstone with a high degree of bonding. In this case, a thick layer of nickel pIA+31 is applied.
（３１′）ｔ４’に、無電解メブキによりニッケル被膜
（３）の被覆された砥粒ｔ１）と被覆されていない砥粒
（２）とを混合して第３図に示すようなメッキ槽（４）
内のニッケルメッキｇ ＋５＋中に混入する。(31') At t4', the abrasive grains t1) coated with the nickel coating (3) and the uncoated abrasive grains (2) by electroless coating are mixed to form a plating bath (as shown in FIG. 3). 4)
It gets mixed into the nickel plating inside g +5+.
この場合において、形成された電着砥石（６）の硬さと
結合度をＯＪｆする賛祢はつきの通りでおる。In this case, it is obvious that the hardness and bonding degree of the formed electrodeposited grindstone (6) are OJf.
（Ａ） ａ粒の撞＃ｉ：軟質の砥粒の混合割合いを多
くすると、結合１ｔｔｉ褒らないが★實的に軟質砥石と
なる。(A) Grinding of a grain #i: If the mixing ratio of soft abrasive grains is increased, it actually becomes a soft whetstone, although it does not improve the bond.
（ｂ） 粒度：粒子の細かい砥粒の混合割合いを多く
すると、結合度が大となる。(b) Particle size: As the mixing ratio of fine abrasive grains increases, the degree of bonding increases.
（Ｃ） 金属膜を被覆した微粒と被覆していない砥粒
の混合割合：金稿換を被覆した砥粒の混合割合いが多く
なると結合度は小さくなる。(C) Mixing ratio of abrasive grains coated with metal film and abrasive grains not coated: As the mixing ratio of abrasive grains coated with metal film increases, the degree of bonding decreases.
（ｄＪ 金ＭＩＩの厚さ：被覆した金属膜の厚さが増
すと結合度が大となる。(dJ Thickness of gold MII: As the thickness of the coated metal film increases, the degree of bonding increases.
（＋３） 金Ｒ＠膜の種類：被横する金属膜のＷｉ類
（例えばニッケル、銅、銀、錫その他の単一金属または
嗣−亜鉛、鉛−錫、参鉛−錫、その他の合金）により結
合度が異なる。(+3) Gold R@ Film type: Wi type of the overlying metal film (for example, nickel, copper, silver, tin, and other single metals, or zinc-zinc, lead-tin, zinc-lead-tin, and other alloys) The degree of bonding differs depending on the
以上の各１！素（鳳）Φ） （ｅ） ＠） （ｅ）は、
砥石の使用目的（例えば研削用、切削用、切断用、荒研
用、仕上研削等）とか、研削または切削すべき材料等に
応じて率−快素または２種以上の要素の組合せがなされ
る０
以上のようにして混合割合いが決定されてｍｔＭｆｌ）
（２１が混入されたメッキ槽（４）内の絶縁性台板（
７）ＦＫｔ−ｊ、砥石の母型として合金（８）が載せら
れる。この合金（８）は、予め電着砥石（６）を形成す
る端部（９）たけを残して他は絶縁性被膜＋１（１（１
（１で＃１榎するＯｕυαυはニッケル棒、ａａＦｉ直
流電源である。このような状態において、
（リ メッキ槽（４）内を攪拌し、混合砥粒子１１ （
２）を浮遊させた後、電伽輪を入れる。すると、合金（
８）の！ ｍ ＋９１のみ通電するのでこの端部（９１
に接触したニッケル膜（３＋を４＆後した砥粒子ｉ＋が
、析出されたニッケルＱ１によってまずｌＪ！１１層す
る。Each of the above! Element (Pho) Φ) (e) @) (e) is
Depending on the purpose of use of the whetstone (e.g., grinding, cutting, cutting, rough grinding, finish grinding, etc.), the material to be ground or cut, etc., a combination of two or more elements is used. 0 The mixing ratio is determined as above (mtMfl)
(The insulating base plate in the plating tank (4) containing 21 (
7) FKt-j, alloy (8) is placed as a master mold of the grinding wheel. This alloy (8) was coated with an insulating coating +1 (1 (1
(Ouυαυ used in #1 is a nickel rod and an aaFi DC power supply. In this state, (Re-plating tank (4) is stirred and the mixed abrasive particles 11 (
2) After floating, insert the electric ring. Then, the alloy (
8) No! Since only m+91 is energized, this end (91
The abrasive particles i+, which are in contact with the nickel film (3+ after 4&), are first formed into a lJ!11 layer by the precipitated nickel Q1.
■ この砥粒（１）が固層するとともにニッケルａ３が
さらに析出されると、ニッケル膜のない砥粒（２）もそ
のニッケルα湯で固層される。この固層された砥粒（３
）にも通電するので、つぎに落下した砥粒（１１ま九は
（２）がすでに固層している砥粒（ｔｌまたは（２）と
接触するとｒぐに通′−シて固層シ２、以下つぎつぎと
幡）してきた金Ｊｌｌｌ農伝堕した砥わ（１）と蔽珈し
ていない砥粒（２）が固層して多くの理想的な空隙α４
をもった電ｙＩＩ歓石（６）が形成される（第２図）。(2) When the abrasive grains (1) are solidified and nickel a3 is further precipitated, the abrasive grains (2) without a nickel film are also solidified with the nickel α hot water. This solidified abrasive grain (3
) is also energized, so when the next falling abrasive grain (11 or The abrasive grains (1) and the abrasive grains (2) that have not been covered are solidified to form many ideal voids α4.
Electron yII Kanseki (6) is formed (Fig. 2).
■ 台金（８）のｙｓ部（９）から台＆（７）の端部ま
での長さＶ）だけＭＬＭ繊石（６）が成長したとき１癩
電を停止する。この台板（７）の突出長さく４によって
電着砥石（６）の艇さを設定する。なお、結合か不充分
な場合は、□・砥粒の入ってないニッケル液中で再メッ
キする。■ When the MLM fine stone (6) has grown by the length V) from the ys part (9) of the base metal (8) to the end of the base & (7), stop one electrolysis. The height of the electrodeposited grindstone (6) is determined by the protruding length 4 of the base plate (7). If the bond is insufficient, re-plating in a nickel solution without abrasives.
■ 電層終了後に、形成された電着砥石（６）の外周、
側面等の成形、研摩をして第１図（１１（２１のような
電ｍ砥石ｔ６１ ＋６）を舟る。■ The outer periphery of the electrodeposited grindstone (6) formed after the electrodeposition is completed,
Shape and polish the side surfaces, etc., and then use the electric grindstone t61 +6 shown in Figure 1 (11 (21)).
このような方法で侮られ九電着砥石（６）は、砥粒（１
） （２１の混合割合いや粒度にもよるが、長さＶ）が
０．５〜１０ｇ、厚さくｔ）が数μｍ〜数ＭＩｍまでの
ものが従来の金Ｊ１！膜を有しない砥粒のみによる場合
よりも丁〜上の電着時間で形成可能であった０
０
前記実施例では、第４図（１１ａｌに示すような円板状
の砥石を電着成形する場合について説明したがこれ以外
には第４図（２）〜輪、αη〜（至）に示すような檀々
の砥石形状に形成できるし、また、これに限定されずさ
らに任意の形状に形成できる。The nine-electrodeposited grindstone (6), which has been neglected in this way, has abrasive grains (1
) (Depending on the mixing ratio and particle size of 21, conventional gold J1 has a length V) of 0.5 to 10 g and a thickness t) of several μm to several MIm! In the above example, a disc-shaped grindstone as shown in FIG. Although the case has been explained, in addition to this, the whetstone can be formed into any number of shapes as shown in Figure 4 (2) to ring and αη to (to), and is not limited to this, and can be formed into any arbitrary shape. can.
ちなみに、ニッケル被膜ダイヤモンド砥粒（粒度４００
０番）と被膜のないダイヤモンド砥粒（粒度４０００番
）を２＝１の割合いで混合し、カップ状台金（８）に電
着砥石（６）を電着し、第５図に示すようなカップホイ
ールを形成し、このカップホイールで半導体素子材料の
シリコンウエノ１を研摩したところ、向粗さがｆｉ、ｒ
ａａｘ Ｏ，０５μｍであった（通常はＢｗａａｘ （
１２／ｊ鱗である）。このカップホイールは適度の自生
作用があって、従未必賛とされていたドレッシングは不
賛となり、安定した研削面が優られ九〇このような結果
は、従来の電着砥石ではなかったことで、この檀シリコ
ンウェハの研削には結合度が−すぎたためである。By the way, nickel-coated diamond abrasive grains (particle size 400
0) and uncoated diamond abrasive grains (particle size: 4000) in a ratio of 2=1, an electrodeposited grindstone (6) was electrodeposited on a cup-shaped base metal (8), and as shown in Figure 5. When a silicon wafer 1, which is a semiconductor element material, was polished with this cup wheel, the roughness was fi, r.
aax O, 05 μm (usually Bwaax (
12/j scales). This cup wheel has a moderate self-sharpening effect, and the dressing, which was previously considered a must-have, has become unpopular, and the stable grinding surface has been superior. This is because the degree of bonding was too low for grinding this sandal silicon wafer.
また、ニッケル被層ダイヤモンド砥粒（粒度４０００喬
）と被膜していないダイヤモンド砥粒（粒度４０００＊
）とを混合して第６図に示すような台金のない電着物の
みの円板状砥石（６）を電着形成し、この砥石（８）で
フェライトの単結晶に切断速度１０ＩＪＩ／ ｌｅｅ
ｓ Ｑさ３００ｆｉｍで隣人れを有った場合、チッピン
グを１μ属以下に押えることができた（従来は切断速度
３ｍ／ｓ＠ｃでも２０μｍ機友のチンピングが発生する
）。In addition, nickel-coated diamond abrasive grains (particle size 4000*) and uncoated diamond abrasive grains (particle size 4000 *
) is electrodeposited to form a disc-shaped grindstone (6) with no base metal and only electrodeposited material as shown in Fig. 6, and this grindstone (8) is used to cut a ferrite single crystal at a cutting speed of 10 IJI/lee.
If there was a chipping at a cutting speed of 300fim, it was possible to suppress chipping to less than 1μ (conventionally, even at a cutting speed of 3m/s@c, chipping of 20μm would occur).
さらに、前記実施例では砥粒に金属膜を被榎する手段と
して、無電解メッキ法の場合を説明したがこの他に、電
解メッキ法、蒸層法、スパッタリング法などのうちのい
ずれか１つかまたは２つ以上でもよい。２つ以上の場合
は上記方法のいずれか２以上の組合せでもよい。Furthermore, in the above embodiments, the electroless plating method was explained as a means for coating the abrasive grains with a metal film, but in addition to this, any one of the electrolytic plating method, the evaporation method, the sputtering method, etc. Alternatively, there may be two or more. In the case of two or more methods, a combination of any two or more of the above methods may be used.
本発明は上述のように、金属膜を被０し九砥粒とＷｅし
ない砥粒とを混合して電着砥石を形成したので、電着砥
石の特長である切味、耐摩耗性を維持しながら、使用目
的に応じた任意の結合度のｘｔ４を石が優られ、砥石の
使用範目を大巾に拡大できる。また、金属膜の被膜した
砥粒を混入することにより短時間の電着で、任意の形状
、安定した研Ｆｉ１１ 、切削特性の砥石を得ることが
できる。As described above, the present invention forms an electrodeposited grindstone by mixing nine abrasive grains coated with a metal film and non-we abrasive grains, thereby maintaining the sharpness and abrasion resistance that are the characteristics of an electrodeposition grindstone. However, the stone can have an arbitrary degree of bonding xt4 depending on the purpose of use, and the scope of use of the grindstone can be greatly expanded. Further, by mixing abrasive grains coated with a metal film, a grindstone having an arbitrary shape, stable sharpening Fi11, and cutting characteristics can be obtained by electrodeposition in a short time.
第１図（１１（２）は本発明による電着砥石の一実施俤
］を示す部分断面図、第２図は同上拡大断面図、第３図
は本発明による電着砥石を製造する電潰装置の説明図、
第４図（１）〜（ロ）、第５図および第６図は本発明の
電着砥石の断面図である。
（１）・−金属膜を液種した砥粒、（２）・・・金属膜
を液種しない砥粒、（３）・金属膜、（４）・・・メッ
キ槽、（５） メッキ液、（６） 電着砥石、（７
）絶縁性台板、（８）母型としての合金、（９）・・端
部、顛・・絶縁性被膜、ｔＵ＋・ニッケル棒、（１ａ
崗繍電［株］、０ 析出したニッケル、■ 空隙。
第 １ 図
（＋） （２）第 ２
図
１４２３ ＋
第３図
：１゛５図
第６図
６ （
図FIG. 1 is a partial cross-sectional view showing one implementation of the electrodeposited grindstone according to the present invention; FIG. 2 is an enlarged cross-sectional view of the same; FIG. An explanatory diagram of the device,
FIGS. 4(1) to 4(b), FIGS. 5 and 6 are cross-sectional views of the electrodeposited grindstone of the present invention. (1) - Abrasive grains containing a metal film, (2) - Abrasive grains not containing a metal film, (3) - Metal film, (4) - Plating tank, (5) Plating solution , (6) Electroplated grindstone, (7
) Insulating base plate, (8) Alloy as mother mold, (9) Ends, fabric, insulating coating, tU+ nickel rod, (1a
Gangshuden Co., Ltd., 0 Deposited nickel, ■ Voids. Figure 1 (+) (2) 2nd
Figure 1423 + Figure 3: 1゛5 Figure 6 Figure 6 (Figure
Claims (1)
を被覆しない砥粒とを混合したものを電気メツキ液中で
同時に電着成長してなる電着砥石。 （２） 金属膜を被覆する砥粒と金属膜を被覆しない
砥粒とはともにダイヤモンド砥粒からなる特許請求の範
囲第１項記載の電着砥石。 （３）金属膜を被覆する砥粒はダイヤモンド砥粒からな
り、金属膜を被覆しない砥粒はダイヤモンド以外の砥粒
からなる特許請求の範囲第１項記載の電着砥石。 （４） 金属膜を被覆し九硬質の砥粒と、金属膜を被
・しない軟質の砥粒との混合割合いによって曽度を調整
し、てなる特許請求の範囲第１項記載の電着砥石。 （５）金属膜を被覆した砥粒と、金属膜を被Ｏしない砥
粒との混合割合いによって結合度を調整してなる％ｆｆ
請求の範囲第１項６己載の電着砥石。 ｔｅｌ ’ｊ電層砥石厚さを数μｍから数Ｉｍまでの
範囲に形成した％ｔ！ｆｍ求の範囲第１墳に、賊の電着
砥石。 （７） 亀着砥ね全中心孔のある片金の周縁端面に形
成し九時許−求の範囲第１墳ｍｌ畝の電層砥石０（８）
電着砥石のみで中心孔のある円板状に形成し九％許
ｄ求の範囲第１項記載の電着砥石。[Claims] +11 An electrodeposited grindstone formed by simultaneously growing a mixture of abrasive grains whose surfaces are coated with a metal film and abrasive grains whose surfaces are not coated with a metal film by electrodeposition in an electroplating solution. (2) The electrodeposited grindstone according to claim 1, wherein both the abrasive grains covering the metal film and the abrasive grains not covering the metal film are diamond abrasive grains. (3) The electroplated grindstone according to claim 1, wherein the abrasive grains covering the metal film are made of diamond abrasive grains, and the abrasive grains not covering the metal film are abrasive grains other than diamond. (4) Electrodeposition according to claim 1, in which the solenoid degree is adjusted by adjusting the mixing ratio of hard abrasive grains coated with a metal film and soft abrasive grains not covered with a metal film. Whetstone. (5) %ff obtained by adjusting the degree of bonding by adjusting the mixing ratio of abrasive grains coated with a metal film and abrasive grains not covered with a metal film
An electrodeposited grindstone as described in claim 1, paragraph 6. tel 'j Electric layer grinding wheel thickness formed in the range from several μm to several Im! The thief's electrodeposited whetstone is in the first tomb in the range of fm request. (7) Electric layer grinding wheel 0 (8) formed on the peripheral end face of a piece of metal with a hole in the center of the entire center hole and in the area of 9 o'clock permission required in the first mound ml ridge.
The electrodeposited grindstone according to item 1, which is formed into a disk shape with a center hole using only the electrodeposition grindstone and has a tolerance of 9%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6816282A JPS58186569A (en) | 1982-04-23 | 1982-04-23 | Electrodeposited grindstone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6816282A JPS58186569A (en) | 1982-04-23 | 1982-04-23 | Electrodeposited grindstone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58186569A true JPS58186569A (en) | 1983-10-31 |
Family
ID=13365782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6816282A Pending JPS58186569A (en) | 1982-04-23 | 1982-04-23 | Electrodeposited grindstone |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58186569A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6190876A (en) * | 1984-10-08 | 1986-05-09 | Hiroshi Ishizuka | Super abrasive grain electrodeposition circular saw |
| JPS642871A (en) * | 1987-02-27 | 1989-01-06 | Tone Boring Co | Diamond cutter for casting |
| JPH02166412A (en) * | 1988-12-20 | 1990-06-27 | Fujikura Ltd | Optical switch |
| JPH02252505A (en) * | 1989-03-28 | 1990-10-11 | Disco Abrasive Syst Ltd | Precise groove processing method |
| WO1996023630A1 (en) * | 1995-02-01 | 1996-08-08 | Hiroshi Ishizuka | Superabrasive electroplated cutting edge and method of manufacturing the same |
| WO2006070534A1 (en) * | 2004-12-28 | 2006-07-06 | Asahi Diamond Industrial Co., Ltd. | Electrodeposition wire tool |
| EP1755840A1 (en) * | 2004-02-26 | 2007-02-28 | Kennametal, Inc. | Cutting tool for rough and finish milling |
| JP2015229197A (en) * | 2014-06-03 | 2015-12-21 | 株式会社ジェイテクト | Method of manufacturing vitrified bond grindstone and the vitrified bond grindstone |
| JP2017024105A (en) * | 2015-07-21 | 2017-02-02 | 株式会社東京精密 | Cutting blade and manufacturing method of the same |
| CN111451952A (en) * | 2020-06-15 | 2020-07-28 | 郑州磨料磨具磨削研究所有限公司 | Manufacturing method of electroplating grinding wheel with micro-size cold water tank |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4869193A (en) * | 1971-12-23 | 1973-09-20 |
-
1982
- 1982-04-23 JP JP6816282A patent/JPS58186569A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4869193A (en) * | 1971-12-23 | 1973-09-20 |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6190876A (en) * | 1984-10-08 | 1986-05-09 | Hiroshi Ishizuka | Super abrasive grain electrodeposition circular saw |
| JPS642871A (en) * | 1987-02-27 | 1989-01-06 | Tone Boring Co | Diamond cutter for casting |
| JPH02166412A (en) * | 1988-12-20 | 1990-06-27 | Fujikura Ltd | Optical switch |
| JPH02252505A (en) * | 1989-03-28 | 1990-10-11 | Disco Abrasive Syst Ltd | Precise groove processing method |
| WO1996023630A1 (en) * | 1995-02-01 | 1996-08-08 | Hiroshi Ishizuka | Superabrasive electroplated cutting edge and method of manufacturing the same |
| US6098609A (en) * | 1995-02-01 | 2000-08-08 | Ishizuka; Hiroshi | Superabrasive electrodeposited cutting edge and method of manufacturing the same |
| EP1755840B1 (en) * | 2004-02-26 | 2012-11-14 | Kennametal, Inc. | Cutting tool for rough and finish milling |
| EP1755840A1 (en) * | 2004-02-26 | 2007-02-28 | Kennametal, Inc. | Cutting tool for rough and finish milling |
| US7704127B2 (en) | 2004-12-28 | 2010-04-27 | Asahi Diamond Industrial Co., Ltd. | Electrodeposited wire tool |
| WO2006070534A1 (en) * | 2004-12-28 | 2006-07-06 | Asahi Diamond Industrial Co., Ltd. | Electrodeposition wire tool |
| JP2015229197A (en) * | 2014-06-03 | 2015-12-21 | 株式会社ジェイテクト | Method of manufacturing vitrified bond grindstone and the vitrified bond grindstone |
| JP2017024105A (en) * | 2015-07-21 | 2017-02-02 | 株式会社東京精密 | Cutting blade and manufacturing method of the same |
| CN111451952A (en) * | 2020-06-15 | 2020-07-28 | 郑州磨料磨具磨削研究所有限公司 | Manufacturing method of electroplating grinding wheel with micro-size cold water tank |
| CN111451952B (en) * | 2020-06-15 | 2021-11-05 | 郑州磨料磨具磨削研究所有限公司 | Manufacturing method of electroplating grinding wheel with micro-size cold water tank |
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