JPH09225827A - Dresser and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent dropping off of diamond abrasive particles to thereby prevent damage on the surface of wafer in dressing a polishing mat in a dresser in which a diamond abrasive particle layer surface is pependicular to a rotation shaft by arranging the most protruding part of each diamond abrasive particle in the same plane with a specified flatness. SOLUTION: A diamond abrasive particle layer 1 to be connected to a base 5 through a connection layer 4 is composed of a fixed layer 3 in which diamond abrasive particles 2 are embeded, and a most protruding part 6 of each abrasive particle 2 is arranged in the same plane. The flatness of the plane in which the part 6 exists should be 30μm or below, desirably 5μm or bellow, thereby providing an excellent flatness at the application to the dressing of a polishing mat. Such a layer 1 is formed by temporalily fixing one layer of abrasive particle onto the diamond abrasive particle fixed surface of inverted type by electrodeposition. and thereafter by fixing it with metal or resin in a burried manner.

Description

Detailed Description of the Invention

[0001]

[0001] The present invention relates to a dresser and a method of manufacturing the dresser. More specifically, the present invention relates to a dresser that can perform dressing of a polishing mat for polishing a semiconductor wafer in a short time, does not drop abrasive grains, and does not damage the wafer surface, and a method of manufacturing the dresser.

[0002]

2. Description of the Related Art Generally, in a wafer processing apparatus for polishing the surface of a semiconductor wafer, a polishing mat is attached on a disk-shaped surface plate, and one or more wafers are placed on the surface of the surface plate. While forcibly rotating by a carrier on the polishing mat, supply fine polishing particles and polishing liquid between the polishing mat and the wafer,
Polishing is performed by the chemical and mechanical action of the interface. As the polishing mat, a velor type mat in which a polyester nonwoven fabric is impregnated with a polyurethane resin, a suede type mat in which a polyurethane foam layer is formed on a polyester nonwoven fabric substrate, or a foamed polyurethane mat having closed cells is used. ing. Further, as abrasive particles, Fe ₂ O ₃ , Al ₂ O ₃ , B
aCO ₃ , colloidal silica, or the like is used, and KOH, dilute hydrochloric acid, or the like is used as the polishing liquid depending on the case. While such polishing of the wafer is repeated, the chips of the work material, the polishing material, etc. enter into the fine holes of the polishing mat to cause clogging, and the chemical reaction heat between the polishing particles and the polishing solution causes the surface of the polishing mat. Becomes a mirror surface and the polishing rate decreases. Therefore, it is necessary to dress the polishing mat constantly or regularly. Diamond abrasive grains are an excellent dressing material, and dressing of polishing mats for polishing semiconductor wafers has been studied. For example, JP-A-64
JP-A-71661 discloses that diamond abrasive grains and alloy powder are mixed and heated and sintered, and diamond pellets are attached to the end faces, or diamond abrasive grains are placed on the end faces so as to be evenly distributed and electrodeposited. Using a ring,
A method has been proposed in which the surface of the polishing mat is ground to increase the flatness by moving the polishing mat and the correction ring relatively. However, the diamond pellets sintered using the alloy powder may elute the alloy during dressing and contaminate the wafer when polishing the wafer. Also, in both the case of attaching diamond pellets and the case of electrodepositing diamond abrasive grains, the diamond abrasive grains to be used have a fine grain size of # 400 to # 3.
000 is preferable, and the diamond abrasive is #
If the roughness is larger than 400, the surface roughness of the polishing mat increases. Since it is necessary to use such fine diamond abrasive grains, polishing takes a long time. Further, Japanese Patent Laid-Open No. 4-364730 proposes a method of using pellets obtained by electrodepositing diamond abrasive grains on an epoxy resin for dressing a polishing mat attached to a surface plate of a wafer polishing apparatus. However, in the dresser that holds diamond abrasive grains by the conventional electrodeposition method, the diamond abrasive grains are not a single layer, but there is always a second layer of diamond abrasive grains sandwiched between the diamond abrasive grains. There is a problem that it remains on the mat and damages the wafer surface. Further, when the pellet is a metal bond, the metal is dissolved by the grinding liquid and remains on the semiconductor wafer, which adversely affects the semiconductor wafer. In particular, copper, which is generally used as a main component of a metal bond, has a significant adverse effect.

[0003]

According to the present invention, dressing of a polishing mat can be carried out in a short time, there is no fear that diamond abrasive grains will fall off, and the polishing mat can be provided with excellent flatness. The purpose of the present invention is to provide a dresser with high accuracy and a method for manufacturing the dresser.

[0004]

As a result of intensive studies to solve the above problems, the present inventors found that a dresser having the most protruding portions of each diamond abrasive grain on the same plane has excellent dressing performance. Further, by reverse electrocasting method, the diamond abrasive grains are firmly fixed without the risk of falling off, and it is found that the most protruding portion of each diamond abrasive grain can obtain a dresser on the same plane,
Based on this finding, the present invention has been completed. That is, the present invention is characterized in that (1) in a dresser in which the diamond abrasive grain layer surface is orthogonal to the rotation axis of the dresser, the most protruding portions of each diamond abrasive grain are on the same plane having a flatness of 30 μm or less. Dresser, (2) the diamond abrasive grain layer surface is formed in an annular portion surrounded by two concentric circles, (3) the most protruding portion of each diamond abrasive grain is present Flatness of plane is 5 μm
The dresser according to the following (1) or (2),
(4) The dresser according to item (1), (2) or (3), wherein the diamond abrasive grain layer is divided in a discontinuous manner.
(5) Dresser used in dressing a polishing mat for polishing a semiconductor wafer, described in (1), (2), (3) or (4), and (6) inverted diamond abrasive grains. A layer of diamond abrasive grains is temporarily fixed to the fixed surface by electrodeposition, the temporarily fixed diamond abrasive grains are embedded with metal or resin and fixed to form a diamond abrasive grain layer, and a base metal is bonded to the diamond abrasive grain layer. Then, the inversion type is removed, and the dresser manufacturing method according to item (1), (2), (3) or (5), and (7) the inversion type By providing masking on the diamond abrasive grain fixed surface, a part where the diamond abrasive grain does not adhere is provided, and one layer of diamond abrasive grain is temporarily fixed by electrodeposition, and the temporarily fixed diamond abrasive grain is embedded and fixed with metal or resin. By the diamond A method of manufacturing a dresser according to item (4) or (5), characterized in that a diamond abrasive grain layer is formed, a base metal is bonded to the diamond abrasive grain layer, and the reversal type is removed. It is a thing.

[0005]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. FIG. 1 is a partial sectional view of a diamond abrasive grain layer of a dresser of the present invention. The diamond abrasive grain layer 1 is
It comprises a diamond abrasive grain 2 and a fixed layer 3 in which the diamond abrasive grain is embedded and fixed. The diamond abrasive layer is bonded to the base metal 5 via the bonding layer 4. In the diamond abrasive grain layer, the most protruding portions 6 of each diamond abrasive grain are present on the same plane. In this drawing, the plane where the most protruding portion of the diamond abrasive grains exists is indicated by a broken line for easy understanding. In the dresser of the present invention, the flatness of the plane in which the most protruding portion of each diamond abrasive grain is present is 3
It is 0 μm or less, preferably 15 μm or less, and more preferably 5 μm or less. The flatness of the plane in which the most protruding portion of each diamond abrasive grain exists can be measured by a roundness measuring machine. If the flatness of the plane in which the most protruding portion of each diamond abrasive grain is present exceeds 30 μm, the surface roughness of the dressed polishing mat increases, which may result in poor flatness. FIG. 2 is a partial cross-sectional view of a diamond abrasive grain layer of a conventional dresser.
In a conventional dresser, two layers of diamond abrasive grains are temporarily fixed to a base metal 5 by electrodeposition, and then electroforming is continued to form a fixing layer 3 to fix the diamond abrasive grains. Therefore, the position of the most protruding portion of the diamond abrasive grains is different on the basis of the difference in size of the individual diamond abrasive grains and does not exist on the same plane. Further, it is difficult to completely remove the diamond abrasive grains, that is, so-called floating stones 7, which are not completely adhered to the diamond abrasive grain layer 1, by a method of temporarily fixing by electrodeposition and then electroforming.

The dresser of the present invention can provide the polishing mat with excellent flatness when used for dressing the polishing mat because the most protruding portions of the respective diamond abrasive grains are on the same plane. In a conventional dressing dresser for a polishing mat, diamond abrasive grains used are # 400 to # 300.
The range of 0 is preferable, the range of # 800 to # 1000 is more preferable, and the diamond abrasive grains are #
When the roughness was more than 400, the surface roughness of the polishing mat was large. Since such fine diamond abrasive grains are used, it took a long time to dress the polishing mat. In the dresser of the present invention, the grain size of the diamond abrasive grains used is preferably # 20 to # 120, and more preferably # 60 to # 90. If the grain size of the diamond abrasive grains exceeds # 20 and becomes coarse, the abrasive grains become extremely expensive, and also in the dresser of the present invention, the flatness of the dressed polishing mat may deteriorate. When the grain size of diamond abrasive grains exceeds # 120 and becomes fine, it is not possible to secure a sufficient protrusion amount of the abrasive grains, and the flatness of the dressed polishing mat is improved with the fineness of the grain size. No, it only unnecessarily lengthens the dressing time. In the dressing dresser of the conventional polishing mat, the presence of floating stones was unavoidable, so the diamond abrasive grains that were floating stones during dressing fell off and remained on the polishing mat. There was a risk of scratching the surface. In the dresser of the present invention, since all the diamond abrasive grains are embedded in the fixing layer and completely fixed, there is no possibility that the diamond abrasive grains fall off during dressing and damage the wafer surface during polishing of the wafer.

Next, a method of manufacturing a dresser according to the present invention will be described. FIG. 3 is an explanatory view of one mode of forming the diamond abrasive grain layer, and FIG. 4 is an inverted perspective view. In the method of the present invention, a reversal mold 8 is produced, and as shown in FIG. 3A, a masking 10 made of an insulating material is applied to surround the diamond abrasive grain fixing surface 9. Although not shown, it is preferable to mask the metal portion other than the diamond abrasive grain fixing surface by a method such as coating with a suitable insulating material. Immerse the reversal type in the plating bath, and on the diamond abrasive grain fixed surface surrounded by masking,
Electroplating is performed by filling diamond abrasive grains, connecting the cathode to the reversal type, and connecting the anode to the plating solution. The metal to be plated is not particularly limited as long as it can temporarily fix the diamond abrasive grains, and for example, nickel, chromium and the like can be preferably used. When one layer of diamond abrasive grains is temporarily fixed and does not fall off from the diamond abrasive grain fixed surface, surplus diamond abrasive grains are removed from the diamond abrasive grain fixed surface. FIG. 3B shows a state in which two layers of diamond abrasive grains are temporarily fixed to the diamond abrasive grain fixing surface.

The diamond abrasive grains temporarily fixed on the diamond abrasive grain fixing surface are then fixed by embedding it in metal or resin. As a method for embedding and fixing the diamond abrasive grains with a metal, an electroforming method and a permeation method can be suitably used. A resin molding method can be preferably used as a method for embedding diamond abrasive grains with a resin and fixing them. When using the electroforming method, the inversion type in which the surplus diamond abrasive grains were removed leaving the temporarily fixed diamond abrasive grains for one layer, dip it again in the plating bath, connect the cathode to the inversion type, and perform plating. The anode is connected to the liquid to form the fixing layer 3 and the electroplating is continued until the diamond abrasive grains are completely embedded and fixed. The metal to be plated is not particularly limited as long as it can fix diamond abrasive grains, for example, nickel,
Copper, chromium and the like can be preferably used. Diamond abrasive grains temporarily fixed on the diamond abrasive grain fixed surface,
In the case of embedding and fixing by the infiltration method, particles such as tungsten are filled in the gaps of the diamond abrasive grains to obtain a green compact, and a metal for permeation such as copper-tin system or copper-silver system is formed in the gap of the green compact. To make a dense sintered body. Diamond abrasive grains temporarily fixed on the diamond abrasive grain fixed surface,
When embedding and fixing by resin molding method, the diamond abrasive grains that are surrounded by masking are rinsed after removing the excess diamond abrasive grains by leaving the temporarily fixed diamond abrasive grains for one layer and then drying. On the fixed surface,
A three-dimensional cross-linking type resin is poured, diamond abrasive grains are embedded, and the resin is cured to form the fixing layer 3. As for masking, the masking used for electrodeposition can be discarded as needed and a masking having good releasability from the resin can be newly used. The three-dimensional cross-linking resin is not particularly limited as long as it can fix the diamond abrasive grains with sufficient strength, and for example, epoxy resin, polyimide resin, phenol resin, etc. can be preferably used. FIG. 3C shows a state in which diamond abrasive grains are embedded and fixed by the fixing layer.

By forming the fixed layer 3, the diamond abrasive grains 2 are embedded and fixed, and the diamond abrasive layer 1 is formed.
After forming, the masking is removed from the reversal mold 8.
FIG. 3D shows an inverted type in which diamond abrasive grains are embedded and fixed, and the masking is removed. The surface of the diamond abrasive grain layer on the reversal type, prior to joining with the base metal,
In this state, it is preferable to work flat. FIG. 5: is explanatory drawing of one aspect which joins a diamond abrasive grain layer to a base metal. An adhesive is applied to the diamond abrasive grain layer 1 on the reversal type or the diamond abrasive grain layer joining surface of the base metal 5 or both, and the diamond abrasive grain layer and the diamond abrasive grain layer joining surface are fixed together to form a joining layer. By forming 4, the diamond abrasive grain layer is bonded to the base metal. The adhesive used is
The dresser is not particularly limited as long as it has sufficient strength for use, and for example, an epoxy adhesive or the like can be preferably used. If necessary, the adhesive may be mixed with an inorganic filler such as aluminum powder. FIG. 5A shows a state in which the diamond abrasive grain layer is bonded to the base metal. After the diamond abrasive grain layer 1 is bonded to the base metal 5, the reversal mold 8 is removed. The method of removing the inverted mold is not particularly limited, and examples thereof include lathe processing and milling machine processing, and lathe processing can be particularly preferably used. FIG. 5B shows a state in which the diamond abrasive grain layer is bonded to the base metal and the reversal type is removed. The base metal can be further subjected to necessary machining such as a fitting hole for the rotary shaft.

The surface of the diamond abrasive grain layer bonded to the base metal is
If necessary, stone cutting and lapping can be performed. The stone protrusion processing exposes the most protruding portion of the diamond abrasive grains, and the state shown in FIG. 1 is obtained. Stone removal processing can be performed, for example, by dressing with a general grindstone, dressing with free abrasive grains such as silicon carbide or alumina on a surface plate such as cast iron, shot blasting, chemical etching with a metal release material, electrolytic etching, etc. it can. The chemical etching treatment is performed by immersing the base metal and the diamond abrasive grain layer in a chemical that dissolves only the fixed layer. Examples of such agents include Enstrip NP [manufactured by Meltex Co.] when the fixing layer is nickel, and Enstrip CR-5 [Meltex] when the fixing layer is chromium.
Commercially available drugs such as the following can be used. The lapping process is to cut the tip of the protruding diamond abrasive grains using a diamond grindstone.
By performing lapping and lapping, the dresser can exhibit stable and excellent performance from the beginning of use. The dresser produced by the method of the present invention, when temporarily fixing the diamond abrasive grains, the diamond abrasive grains are fixed in contact with the reversal type diamond abrasive grain fixing surface, and when the diamond abrasive grain layer is bonded to the base metal, diamond Since the most prominent portion of the abrasive grains is the portion in contact with the inversion type diamond abrasive grain fixing surface, the most prominent portion of each diamond abrasive grain is in the same plane in the dresser. In addition, the transfer accuracy of the diamond abrasive grain layer surface is several μm due to the transfer of the reference surface after joining the diamond abrasive grain layer and the base metal. When diamond abrasive grains are fixed by electroforming of nickel, when nickel sulfamate bath containing an additive is used, the hardness of nickel becomes HV400-600, the elongation rate becomes 1-5%, and the nickel fixing layer has sufficient toughness. Have. Therefore, the dressing of the polishing mat can be performed accurately and efficiently, and the diamond abrasive grains do not fall off for a long period of time.

In the method of the present invention, the reversal type diamond abrasive grain fixing surface is radially masked from the central axis to provide a portion where the diamond abrasive grains do not adhere, and the diamond abrasive grain layer is not covered by the radial grooves. It can be continuously divided. FIG. 6 is a perspective view of one embodiment of a reversal type for producing a divided diamond abrasive grain layer surface.
In this inverted type, eight inverted grooves are provided radially from the central axis on the inverted diamond abrasive grain fixing surface 9 of FIG. 4, and a masking block 11 is fitted in the grooves. By using such an inversion type, since the diamond abrasive grain layer is not formed at the position of the masking block, radial grooves are formed in the annular portion surrounded by the two concentric circles, and the diamond abrasive grain layer is formed. It is divided non-continuously. FIG. 7 is a perspective view of a dresser having a diamond abrasive grain layer divided by radial grooves. The dresser shown in the figure has eight diamond abrasive grain layers 1 divided by eight grooves 12 on a base metal 5. By dividing the diamond abrasive grain layer and providing the grooves in this manner, it becomes easier for the polishing agent to flow in and out and polishing debris to be discharged during dressing of the polishing mat, and the dressing speed and accuracy can be further improved. it can. In the dresser of the present invention, the diamond abrasive grain layer surface may have any shape. FIG.
FIG. 3 is a plan view of a diamond abrasive grain layer surface of the dresser of the present invention. FIG. 8A shows a circular diamond abrasive grain layer surface,
8 (b) shows the elliptical diamond abrasive grain layer surface as shown in FIG.
FIG. 8C shows a square diamond abrasive grain layer surface as shown in FIG. 8D.
Indicate the surfaces of the annular diamond abrasive grain layers, respectively. Further, grooves can be provided on the surface of the diamond abrasive grain layer to divide the diamond abrasive grain layer. FIG. 8 (e) shows a grid-shaped groove, and FIG. 8 (f) shows a radial groove. By providing the grooves in this way, it becomes easy for the polishing agent to flow in and out and polishing debris to be discharged during dressing of the polishing mat, and the dressing speed and accuracy can be further improved.

[0012]

EXAMPLES The present invention will be described in more detail with reference to the following Examples, which should not be construed as limiting the present invention. Example 1 With the shape shown in FIG. 4, the dimensions are 300D-6W-20T-1.
A 40H reversing mold (S45C) was made by lathing. The diamond abrasive grain fixed surface was surrounded by a masking tape as shown in FIG. 3 (a), and the masking treatment was performed on other diamond abrasive grain layer non-formed portions. After the alkaline degreasing treatment, the reversal type was immersed in a nickel sulfamate bath containing additives for controlling plating stress and hardness, and diamond abrasive grains having a grain size of # 60/80 were added. After plating for 2 hours at a current density of 1 A / dm ² to temporarily fix the diamond abrasive grains, remove excess diamond abrasive grains, and then perform plating for 96 hours at a current density of 2 A / dm ² and a thickness of 3 mm. A nickel fixing layer of No. 3 was formed. Then
The surface of the nickel fixing layer on the inverted mold was flattened by lathing. A base metal (SUS304) having dimensions 286D-12W-35T-160H was produced by lathe processing. 2
10 parts by weight of the liquid epoxy adhesive was mixed with 5 parts by weight of aluminum powder, and the mixture was applied and bonded to the nickel fixing layer surface on the reversing mold and the diamond abrasive grain layer bonding portion of the base metal. After the bonding layer was sufficiently hardened, the reversal type was made positive with a lathe and the back surface of the base metal was cut to transfer the reference surface. Further, the base metal was held on a lathe and the inverted mold was cut off. After that, nickel stripping agent Enstrip NP [manufactured by Meltex Co., Ltd.] was used to dissolve and remove about 30 μm of nickel on the surface of the diamond abrasive grain layer, and stone removal processing was performed. I got the dresser of the invention. The flatness of the plane where the most protruding portions of each diamond abrasive grain of this dresser are present is a roundness measuring device [Tokyo Seimitsu Co., Ltd., Roncom 30B
It was 0.7 μm. Using this dresser, a suede type polishing mat having a polyester nonwoven fabric as a base material and a polyurethane foam layer formed thereon was dressed. Dressing with excellent flatness could be performed efficiently. Example 2 Inversion type having a shape shown in FIG. 6 having a size of 300D-6W-20T-140H and 8 slits each having a width of 6 mm and a depth of 3 mm at 45 degree intervals radially from the central axis (S45
C) was prepared. A masking block made of acrylic resin was fitted in the groove portion, and masking treatment was performed on other portions where the diamond abrasive grain layer was not formed. After alkaline degreasing treatment, the reversal type is submerged in a nickel sulfamate bath containing additives to control plating stress and hardness,
60/80 diamond abrasive grains were added. Current density 1
After plating with A / dm ² for 2 hours to temporarily fix the diamond abrasive grains, remove excess diamond abrasive grains,
Furthermore, plating is performed at a current density of 2 A / dm ² for 96 hours and then 3 m
A nickel fixing layer having a thickness of m was formed. After removing the acrylic resin masking block, the surface of the nickel fixing layer on the reverse mold was flattened by lathe processing.
Base metal of size 286D-12W-35T-160H (SU
S304) was produced by lathe processing. 10 parts by weight of a two-pack type epoxy adhesive was mixed with 5 parts by weight of aluminum powder, and the mixture was applied and bonded to the nickel fixing layer surface on the reversing mold and the diamond abrasive layer adhering part of the base metal. After the bonding layer was sufficiently hardened, the reversal type was made positive with a lathe and the back surface of the base metal was cut to transfer the reference surface. Further, the base metal was held on a lathe and the inverted mold was cut off. After that, nickel stripping agent Enstrip NP [manufactured by Meltex Co., Ltd.] was used to dissolve and remove about 30 μm of nickel on the surface of the diamond abrasive grain layer, and stone removal processing was performed. A dresser having the shape shown in FIG. 7 was obtained. The flatness of the plane where the most protruding portions of each diamond abrasive grain of this dresser are present is a roundness measuring device [Tokyo Seimitsu Co., Ltd., Roncom 30B
It was 0.8 μm. Using this dresser, a velour-type polishing mat in which a polyester nonwoven fabric was impregnated with a polyurethane resin was dressed. The polishing liquid flowed in and out of the groove portion and the polishing dust was smoothly discharged, and the dressing excellent in flatness could be efficiently performed.

[0013]

The dresser of the present invention has the most prominent portion of each diamond abrasive grain on the same plane, so that even if the dressing speed is increased by using a diamond abrasive grain having a large particle diameter, the flatness is excellent. Dressing of polished mats can be performed. Furthermore, since the diamond abrasive grains are securely embedded and fixed in the fixing layer, the diamond abrasive grains do not fall off and there is no risk of damaging the wafer surface.

[Brief description of drawings]

FIG. 1 is a partial sectional view of a diamond abrasive grain layer of a dresser of the present invention.

FIG. 2 is a partial cross-sectional view of a diamond abrasive grain layer of a conventional dresser.

FIG. 3 is an explanatory view of one mode of forming a diamond abrasive grain layer.

FIG. 4 is a perspective view of an embodiment of an inverted type.

FIG. 5 is an explanatory view of one mode of joining a diamond abrasive grain layer to a base metal.

FIG. 6 is a perspective view of another inversion type embodiment.

FIG. 7 is a perspective view of one embodiment of a dresser of the present invention.

FIG. 8 is a plan view of a diamond abrasive grain layer surface of the dresser of the present invention.

[Explanation of symbols]

 1 Diamond Abrasive Grain Layer 2 Diamond Abrasive Grains 3 Fixing Layer 4 Bonding Layer 5 Base Metal 6 Most Protruding Part of Diamond Abrasive Grains 7 Floating Stone 8 Inversion Type 9 Diamond Abrasive Grain Fixing Surface 10 Masking 11 Masking Block 12 Groove 12

Claims (7)

[Claims] 1. A dresser in which a diamond abrasive grain layer surface is orthogonal to a rotation axis of the dresser, wherein the most protruding portions of each diamond abrasive grain are on the same plane with a flatness of 30 μm or less. 2. The dresser according to claim 1, wherein the diamond abrasive grain layer surface is formed in an annular portion surrounded by two concentric circles. 3. The flatness of the plane in which the most protruding portion of each diamond abrasive grain is present is 5 μm or less.
Dresser described. 4. The dresser according to claim 1, wherein the diamond abrasive grain layer is divided in a discontinuous manner. 5. The dresser according to claim 1, 2, 3, or 4 used for dressing a polishing mat for polishing a semiconductor wafer. 6. A diamond abrasive grain layer is formed by temporarily fixing one layer of diamond abrasive grains on a reversal type diamond abrasive grain fixing surface by electrodeposition, and embedding the temporarily fixed diamond abrasive grains with metal or resin and fixing them. Then, a base metal is bonded to the diamond abrasive grain layer to remove the inverted mold, and the method for manufacturing a dresser according to claim 1, claim 2, claim 3, or claim 5. 7. A reversal type diamond abrasive grain fixed surface is masked to provide a portion where the diamond abrasive grains are not attached, and one layer of the diamond abrasive grains is temporarily fixed by electrodeposition. 6. The dresser according to claim 4 or 5, wherein a diamond abrasive grain layer is formed by embedding and fixing with a metal or a resin, and a base metal is joined to the diamond abrasive grain layer to remove the reversal type. Production method.