JP2016087735A - Abrasive cloth dresser and manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an abrasive cloth dresser with an excellent pad grinding rate and pad flatness.SOLUTION: An abrasive cloth dresser with a plurality of abrasive grains anchored on a resin layer to project individual grains from the resin layer is characterized in that a dresser reference surface of the resin layer forms a plurality of anchorage surfaces projected in projecting directions of grains to keep individual grains anchored with a part buried in the anchorage surface. Where a height of the anchorage surface is H, a width between a grain end in a horizontal direction orthogonal to a projecting direction and a grain end in the horizontal direction of the anchorage surface with this grain anchored is L, an interval between grains adjacent with each other is L, and the height of a grain in the projecting direction based on the dresser reference surface is H, the condition of 0.2≤L/L≤0.4, 0.4≤H/H≤0.7 is to be satisfied.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a dresser used for grinding a polishing cloth in a process of chemical mechanical planarization (hereinafter abbreviated as CMP) and a method for manufacturing the same.

  Equipment for polishing the surface of semiconductor wafers, equipment for flattening the surface of wiring and insulating layers in the process of manufacturing integrated circuits, equipment for flattening the surface of Al plates and glass plates used for magnetic hard disk substrates, etc. Then, CMP polishing is used. CMP polishing is, for example, a method of flattening a surface to be polished by pressing the surface to be polished while supplying a slurry liquid containing fine abrasive grains to a rotating substrate to which a urethane polishing pad is attached. It is. As a matter of course, the polishing ability of the polishing pad decreases with the use time.

  Therefore, in order to suppress the decrease in the polishing ability, a grinding process for grinding the surface layer of the polishing pad is performed at regular intervals. Thereby, a new surface of the polishing pad can always be brought out on the surface, and the flatness of the polishing pad is maintained. This grinding is called dressing, and a part called a dresser is used for this dressing. The dresser is generally configured by bonding abrasive grains to a metal substrate by electrodeposition or brazing.

  A dresser is conventionally required not to scratch the polishing pad. More recently, there has been a need to suppress the metal eluted from the dresser components as much as possible due to a decrease in the depth of focus of the pattern exposure apparatus due to the extremely narrow line / space of the integrated circuit or an increase in the recording capacity of the magnetic hard disk. It's getting higher. This is because the metal component in the dresser elutes into the slurry during dressing and adheres to the semiconductor wafer or the like through the polishing pad.

The following are disclosed as dressers aimed at suppressing the eluted metal. Patent Document 1 discloses a dresser in which one diamond abrasive grain is temporarily fixed to an inversion type diamond abrasive fixed surface by electrodeposition and then embedded and fixed with metal or resin. Patent Document 2 discloses a dresser in which a plate having diamond abrasive grains fixed to the surface of an MgO—SiO ₂ sintered body is attached to a resin substrate. Patent Document 3 discloses a dresser in which diamond abrasive grains are fixed to a resin substrate.

Patent Document 4 discloses a dresser in which diamond abrasive grains fixed to a W, Si, SiO ₂ powder sintered body are bonded to a resin, ceramics, or stainless steel plate. Patent Document 5 discloses a dresser in which a convex portion is provided on the surface of a ceramic such as silicon carbide. Patent Document 6 discloses a dresser in which diamond abrasive grains fixedly bonded to glass and a ceramic powder composite are attached to a support material. Patent Document 7 discloses a dresser in which a metal layer is present between abrasive grains and a resin, the bonding strength with the resin is increased by the uneven portions on the surface of the metal layer, and the falling off of the abrasive grains is suppressed.

  On the other hand, Patent Document 8 proposes cutting a silicon wafer with a wire saw made of a core wire in which diamond abrasive grains are held by a resin undercoat layer. In particular, Patent Document 1 is to improve the pad flatness by aligning the height of the most protruding part of diamond abrasive grains, and Reference 5 is composed of uneven ceramics on which a diamond film is formed. The edge of the convex part is used as a cutting edge, and diamond abrasive grains are not used. In Cited Document 7, the surface of the resin is formed flat. Therefore, these documents do not realize excellent pad grinding rate and excellent flatness by controlling the holding and discharging of the slurry between the resin portion on the dresser surface and the pad.

Japanese Patent Laid-Open No. 9-225827 JP 2008-132573 A JP 2001-25957 A JP 2001-179638 A JP 2004-291129 A International Publication No. 2008/062846 JP 2012-232388 A JP 2009-285791 A

  As described above, in order to suppress metal elution, a dresser using a ceramic sintered body other than metal or a resin as a member constituting the dresser has been disclosed. However, when diamond abrasive grains are fixed to the ceramic sintered body, there is a problem that the diamond abrasive grains deteriorate due to the reaction between the diamond abrasive grains and the sintered powder.

  On the other hand, in a dresser in which diamond abrasive grains are fixed to a resin support material, there is a limit to maintaining high pad flatness while maintaining the pad grinding rate. In order to increase the pad flatness, the pad grinding rate must be reduced, and the dressing time in the CMP process has not been shortened and productivity has not been improved.

  The first object of the present invention is to provide a dresser for polishing cloth having excellent pad grinding rate and pad flatness. The second object of the present invention is to suppress metal elution from the dresser for polishing cloth.

  The gist of the present invention is as follows. (1) A dresser for polishing cloth in which a plurality of abrasive grains are fixed to a resin layer, and each abrasive grain protrudes from the resin layer. The dresser reference surface of the resin layer faces the protruding direction of the abrasive grains. A plurality of sticking surfaces protruding in this manner are formed, and each abrasive grain is fixed to each of the sticking surfaces in a partially buried state.

(2) In the configuration of (1), the height of the fixing surface with respect to the dresser reference surface is H, the end of the abrasive grain in the horizontal direction perpendicular to the protruding direction, and the abrasive grain The width of the fixed surface of the fixed surface with the end in the horizontal direction is L, the interval between adjacent abrasive particles is L ₀ , and the height of the abrasive particles in the protruding direction with respect to the dresser reference surface is H _0. In this case, it is preferable to satisfy the conditions of 0.2 ≦ L / L ₀ ≦ 0.4 and 0.4 ≦ H / H ₀ ≦ 0.7. According to the configuration of (2), the pad flatness and the pad grinding rate can be maintained at a higher level.

  (3) In the configuration of (1) or (2), the average grain size of the abrasive grains can be 50 μm to 300 μm.

  (4) In the configurations of (1) to (3) above, diamond abrasive grains can be used as the abrasive grains.

  (5) In the configuration of (4), the resin layer can be formed on the surface of a metal support material.

  (6) In the configuration of (5) above, the resin layer can be made of a thermoplastic resin.

  (7) In the configuration of (5) or (6), the support material may be made of carbon steel or stainless steel.

  (8) a first temporary fixing step of temporarily fixing a patterned mesh on which a plurality of openings corresponding to the arrangement pattern of the abrasive grains are formed to the substrate, and each abrasive on the inside of each opening on the substrate. A second temporary fixing step of temporarily fixing the grains, a molding step of forming the resin layer by allowing a resin to flow into a predetermined position in the opening spaced apart from the temporary fixing surface of the abrasive grains, and from the resin layer, And a peeling step for peeling the patterned mesh. The method for producing a dresser for polishing cloth according to (1) above, comprising: a peeling step.

  According to the present invention, since a part of the abrasive grains is fixed to the fixing surface protruding from the dresser reference surface of the resin layer in a state of being embedded, the dresser for polishing cloth having excellent pad grinding rate and pad flatness Can be provided. If the dresser of the present invention is applied to a CMP polishing pad conditioner, the quality of the product substrate can be improved and the dressing time can be shortened, so that high productivity can be maintained. Furthermore, since the abrasive grains are fixed to the resin layer, it is possible to suppress the metal from eluting into the CMP slurry.

It is a cross-sectional schematic diagram of the dresser for polishing cloth which is one Embodiment of this invention. It is the figure which showed the effect of flatness and the grinding rate. It is a cross-sectional model drawing of the dresser by which the abrasive grain was fixed to resin by the conventional method. It is the schematic diagram which showed the manufacturing method of the dresser typically.

  Depending on the area of one dresser surface, several to tens of thousands of single crystal abrasive grains (for example, diamond abrasive grains, preferably artificial diamond abrasive grains) are usually fixed. These individual abrasive grains are pressed against the polishing pad, and the polishing pad is ground by moving the abrasive grains and the polishing pad relative to each other. This dressing operation is usually performed while flowing slurry or water (hereinafter abbreviated as slurry or the like). Conventionally, when the abrasive grains are fixed with resin, the surface of the resin is formed in a flat shape as schematically shown in FIG. In this conventional configuration, if the abrasive grain protrusion height is increased to increase the pad grinding rate, the pad flatness is reduced. On the other hand, if the abrasive grain protrusion height is decreased to increase the pad flatness, the pad grinding rate is reduced. There was a problem that decreased.

  The inventors of the present invention can polish the pad flatness while maintaining an excellent pad grinding rate by covering only the periphery of each abrasive grain with a resin having a predetermined width and height. The inventors have found a cloth dresser and have completed the present invention.

  FIG. 1 schematically shows a cross section of an abrasive cloth dresser according to an embodiment of the present invention. The dresser for polishing cloth includes abrasive grains 1, a resin layer 2, and a support material 3. The resin layer 2 is formed on the surface of the support material 3. A plurality of abrasive grains 1 are provided, and each abrasive grain 1 protrudes from the resin layer 2. In addition, in FIG. 1, the protrusion direction of the abrasive grain 1 is shown by the arrow. A reference surface (corresponding to a dresser reference surface) 2 a is formed on the surface of the resin layer 2 opposite to the surface in contact with the support member 3. A plurality of fixing surfaces 2b protruding in the protruding direction of the abrasive grains 1 are formed on the reference surface 2a. Each abrasive grain 1 is fixed in a state where a part thereof is buried in each fixing surface 2b. That is, a plurality of groove portions 20 including the reference surface 2 a are formed on the surface of the resin layer 2, and each abrasive grain 1 is fixed to a convex fixing surface 2 b that avoids these groove portions 20.

  Here, the adhering surface 2b becomes a portion closest to the polishing pad during dressing, and slurry or the like is held between the adhering surface 2b and the polishing pad. The present inventors have found that when the polishing pad is ground by the abrasive grains 1, the retained slurry and the like are efficiently and stably supplied to the grinding site.

With this stable supply of slurry or the like, stable grinding of the polishing pad by the abrasive grains 1 is realized. As a result, the flatness of the polishing pad after grinding is improved. Here, in this specification, the height of the fixing surface 2b with respect to the reference surface 2a is H, and the end portion of the abrasive grain 1 in the horizontal direction orthogonal to the protruding direction (hereinafter referred to as the abrasive end portion 1a). ) And the width of the fixing surface 2b to which the abrasive grains 1 are fixed in the horizontal direction (hereinafter referred to as fixing surface end 2b1) is L, and the interval between the adjacent abrasive grains 1 (minimum separation distance). ) Is defined as L ₀ , and the height (projection height) in the protruding direction of the abrasive grain 1 with respect to the reference surface 2 a is defined as H ₀ .

The larger L / L ₀ is, the larger the area that can hold the slurry and the like, and the slurry and the like can be stably held. Further, as H / H ₀ is increased, the distance between the fixing surface 2b and the polishing pad is narrowed, so that the holding of the slurry or the like becomes more stable. That is, the greater the L / L ₀ or the greater the H / H ₀ , the better the pad flatness.

The present inventors have also found that the groove 20 formed in the resin layer 2 has an effect as a discharge path for discharging a scrap such as a polishing pad to the outside. That is, by using the groove 20 as a discharge path and efficiently removing scraps, new slurry or the like is easily supplied between the abrasive grains 1 and the polishing pad. As a result, stable grinding of the polishing pad by the abrasive grains 1 is realized. If the defective removal of the scraps is caused, the scraps are likely to be aggregated around the abrasive grains 1 and the grinding ability of the abrasive grains 1 is reduced. The larger L / L ₀ is, the smaller the passage area of the groove portion 20 is, so that the ability to discharge the shavings is reduced, and the larger H / H ₀ is, the smaller the distance between the fixing surface 2b and the polishing pad is. The waste discharge capacity is reduced. That is, as L / L ₀ is larger or H / H ₀ is larger, the pad grinding rate is lowered.

Therefore, in order to maintain the pad flatness and the pad grinding rate at a higher level, it is necessary to satisfy the following conditional expressions (1) and (2).
0.2 ≦ L / L ₀ ≦ 0.4 (1)
0.4 ≦ H / H ₀ ≦ 0.7 (2)
H ₀ The protrusion height of the abrasive grains 1 is preferably 50% or less of the abrasive grain size. This is because when H ₀ is larger than 50%, the fixing force of the resin layer 2 to which the abrasive grains 1 are fixed may be reduced, and the abrasive grains 1 may be dropped off. If the protruding height H ₀ of the abrasive grains 1 is 40% or less of the abrasive grain diameter, the fixing force of the abrasive grains 1 is further stabilized, which is more preferable. Here, FIG. 1 shows a finite length L ′ generated by the shape of the abrasive grain 1, but a single crystal artificial diamond usually used as the abrasive grain 1 has a tetrahedral octahedron shape, Since it has a close blocky shape, L ′ is shorter than L and negligible.

When L / L ₀ is less than 0.2, slurry or the like is hardly held between the fixing surface 2b to which the abrasive grains 1 are fixed and the polishing pad. As a result, the pad flatness is not even better. When L / L ₀ is more than 0.4, the chip removal rate decreases, so the pad grinding rate decreases. In particular, this tendency becomes more prominent as H / H ₀ is larger. Therefore, when L / L ₀ is less than 0.2 or when L / L ₀ is more than 0.4, both better pad grinding rate and better pad flatness can be realized at the same time. I can't.

Further, when H / H ₀ is less than 0.4, it is difficult to hold slurry or the like between the fixing surface 2b to which the abrasive grains 1 are fixed and the polishing pad. As a result, the pad flatness is not even better. When H / H ₀ is more than 0.7, the gap between the fixed surface 2b to which the abrasive grains 1 are fixed and the polishing pad is narrowed, and the ability to discharge the grinding residue is lowered, and the pad grinding rate is lowered. Therefore, if the H / H ₀ is less than 0.4, or when H / H ₀ is greater than 0.7 may be realized better pad grinding rate and better both putting flatness simultaneously I can't. FIG. 2 shows the relationship between the values of L / L ₀ and H / H ₀ and the superiority or inferiority of the pad grinding rate and pad flatness. The horizontal axis corresponds to L / L ₀ and the vertical axis corresponds to H / H ₀ .

As L / L ₀ increases, the pad flatness tends to be excellent, but the pad grinding rate tends to decrease. In particular, this tendency becomes more prominent as H / H ₀ increases. The reason why the pad grinding rate decreases as L / L ₀ increases is that the width of the groove 20 formed between the adjacent abrasive grains 1 becomes narrower, and it is difficult to remove the scraps and the like of the polishing pad to the outside. It is.

As H / H ₀ increases, pad flatness tends to be excellent, but pad grinding rate tends to decrease. In particular, this tendency becomes prominent when L / L ₀ increases. As H / H ₀ increases, the flatness of the pad is excellent because the slurry and the like are easily held between the fixed surface 2b to which the abrasive grains 1 are fixed and the polishing pad, and the polishing pad is ground by the abrasive grains 1. This is because the retained slurry or the like is efficiently supplied to the grinding site. As H / H ₀ increases, the grinding rate decreases because the distance between the fixed surface 2b to which the abrasive grains 1 are fixed and the polishing pad is narrowed, and the scraps and the like of the polishing pad are hardly discharged to the outside. Because.

According to the above-described configuration, sufficient slurry or the like can be secured between the fixing surface 2b to which the abrasive grains 1 are fixed and the polishing pad, and the polishing pad or the like is formed by the groove 20 formed between the adjacent abrasive grains 1. It is possible to sufficiently discharge the shavings. L / L ₀ and H / H ₀ can satisfy the above-described conditional expressions (1) and (2) by the manufacturing method described later.

Here, as a conventional dresser, a configuration in which abrasive grains are fixed to a metal substrate by electrodeposition or brazing is known. On the other hand, since the abrasive grain 1 of the present invention is fixed to the resin layer 2, it is possible to reduce metal elution into the CMP slurry.

  FIG. 3 shows a schematic diagram of a conventional resin substrate dresser as a comparative example. In this case, the pad grinding rate is excellent, but since the distance between the resin layer 2 and the polishing pad is increased, it becomes difficult to efficiently supply slurry or the like to the grinding part, and the pad flatness is lowered. If the protruding height of the abrasive grains 1 is lowered in order to improve the pad flatness, the discharging ability for discharging the pad scraps and the like is lowered, and the pad grinding rate is lowered. Thus, the conventional resin dresser has not been able to improve the pad flatness and the pad grinding rate at the same time.

  The average particle size of the abrasive grains 1 is preferably 50 μm or more and 300 μm or less. The average particle size should be expressed as a 50% integrated value in the particle size distribution determined by the laser diffraction / scattering method, or as an intermediate value between the sizes of the two sieve meshes. Can do. If the average grain size of the abrasive grains 1 is less than 50 μm, the pad flatness is excellent but the pad grinding rate is lowered. If it exceeds 300 μm, the pad grinding rate is excellent but the pad flatness is lowered. Because it ends up. The size of the abrasive grain 1 is appropriately selected according to the object to be polished by CMP.

  The abrasive grain 1 used in the dresser for polishing cloth of the present embodiment may be a single crystal grain abrasive grain having grinding ability. As the single crystal particles, for example, diamond, cubic boron nitride, boron carbide, silicon carbide, aluminum oxide, or the like can be used. Among these abrasive grains, diamond abrasive grains have a high grinding ability.

When the number of abrasive grains per unit area (abrasive density) is increased under the same dressing load, the force applied to each abrasive grain 1 is reduced, and the function of each abrasive grain 1 is weakened. On the contrary, when the abrasive density is small, the force applied to each abrasive grain 1 is increased, and the action of each abrasive grain 1 is strengthened. The abrasive grain density is preferably 1 piece / mm ² to 200 pieces / mm ² . In the case of 2 pieces / mm ² to 70 pieces / mm ² , the pad flatness and the pad grinding rate are further improved.

  In the case of CMP polishing of a semiconductor integrated circuit, a blocky type which is a relatively large single crystal diamond abrasive grain and whose diamond surface is a crystal wall surface is used. On the other hand, in the case of CMP polishing of a magnetic hard disk substrate such as Al or glass, relatively small single crystal diamond abrasive grains are used.

  In the case of diamond abrasive grains, abrasive grains 1 plated with at least one metal of Ti, Ni, and Cu can also be used. The plating abrasive grains can be produced by a known method. In the case of using these plated abrasive grains, if the irregularities are formed on the surface of the plated metal layer by etching or the like, the anchoring effect of the abrasive grains 1 becomes stronger due to the anchor effect of the resin that has entered the irregularities. . Chemical etching suitable for each metal, electrolytic etching, or the like can be used as a method for imparting irregularities to the plated metal layer on the surface of the abrasive grains.

  The shape of the support material 3 is not particularly limited, and may be a polygonal shape such as an octagon or an icosahedron. Usually, in grinding of a polishing pad using a dresser for polishing cloth, the polishing pad is ground while the support material 3 itself rotates. Therefore, in order to ensure uniform grindability, the shape of the support material 3 is preferably a disk shape.

  When the metal support material 3 is used, the resin layer 2 is formed on the abrasive grain fixing surface 3 a of the support material 3. The thickness of the resin layer 2 (thickness in the protruding direction) may be at least about half the average particle size of the abrasive grains 1. Here, the thickness of the resin layer 2 is the thickness from the abrasive grain fixing surface 3a to the reference surface 2a. Thereby, the adhering force of the abrasive grains 1 and the adhesion force with the metal support 3 are sufficient. When the thickness of the resin layer 2 is thinner than about half of the average particle diameter of the abrasive grains 1, the volume of the abrasive grains 1 that are buried deeper than the reference surface 2a is reduced, so that the fixing force of the abrasive grains 1 is reduced. The upper limit of the thickness of the resin layer 2 is not particularly limited, and the thickness can be changed according to the shape of the dresser set in the CMP apparatus.

  The material used for the resin layer 2 is not particularly limited, but a thermoplastic resin that has fluidity at a warm temperature and is solidified at room temperature is suitable.

  The CMP dresser is used in an acidic or alkaline slurry. Therefore, the resin layer 2 preferably has acid resistance and alkali resistance. Examples of such resins include super engineering plastics such as polyphenylene sulfide (PPS), liquid crystal polymer (LCP), polyamide (PA), polycarbonate (PC), polybutylene terephthalate (PBT), and polyethylene terephthalate (PET), and general-purpose engineering. Plastic and general-purpose plastic can be applied.

  The resin layer 2 may contain silica particles, alumina particles, alumina fibers, SiC fibers, carbon fibers, and glass fibers. By containing these particles or fibers, the rigidity of the resin layer 2 can be increased, and the deformation of the dresser with respect to the external force can be further reduced.

  The metal may be exposed on the surface of the metal support 3 opposite to the abrasive grain fixing surface 3a. Even in this case, the metal elution is suppressed to less than half compared to the case where the metal is exposed on both surfaces of the metal support 3. Further, by covering the metal on the surface opposite to the abrasive grain fixing surface 3a with a normal resin coating, a DLC (Diamond Like Coating) coating or the like, the amount of eluted metal can be greatly suppressed.

  When the metal support material 3 is used as the dresser for the polishing cloth of the present invention, the fixing force with the resin layer 2 can be obtained by forming an uneven portion on the abrasive grain fixing surface 3a of the metal support material 3. Can be strengthened. The uneven portion can be formed by etching or the like.

  Examples of the material of the metal support material 3 in the dresser for polishing cloth include carbon steel and aluminum alloy. However, since a material having acid resistance or alkali resistance is preferable, Ni plating is applied to the surface of a normal carbon steel material. Metal members and stainless steel that have been treated with Cr plating or the like to improve acid resistance or alkali resistance are preferred.

  In the above-described configuration, the resin layer 2 is formed on the abrasive grain fixing surface 3a of the support material 3, but the support material 3 may be omitted.

  Next, the dresser manufacturing method of the present embodiment will be described separately when the support material 3 is omitted and when the support material 3 is not omitted. First, a manufacturing method when the support material 3 is omitted will be described with reference to FIG. FIG. 4 schematically shows a dresser manufacturing method, and the inflowing resin is indicated by hatching. In the step of fixing the abrasive grains 1 to the resin layer 2, the molding of the resin layer 2 and the fixation of the abrasive grains 1 to the resin layer 2 can be performed simultaneously.

  For example, the resin layer 2 can be formed by bringing a resin having fluidity into contact with the abrasive grains 1 and applying pressure to make the resin layer 2 adhere. In this shaping | molding, the circumference | surroundings of the abrasive grain 1 can be enclosed with resin with the method shown below. More specifically, circular holes, that is, openings are formed in the same arrangement pattern as the abrasive grains 1 arranged on a thin plate such as stainless steel with an actual dresser (hereinafter referred to as a patterned mesh 50). The patterned mesh 50 is a positioning member for arranging the abrasive grains 1 at a predetermined position, and the holes 50a are arranged at random, square or polygonal vertex positions, spirals, concentric circles. Also good. If the shape of the hole 50a is circular or polygonal, it is preferable because the abrasive grains 1 can be easily inserted. The patterned mesh 50 is temporarily fixed on the substrate 51 using a double-sided tape 52. As the substrate 51 used at this time, a dresser-shaped resin, a metal plate, or the like can be used.

  Each abrasive grain 1 accommodated in the hole 50 a of the patterned mesh 50 is temporarily fixed by adhering to the double-sided tape 52. In this case, the surface of the double-sided tape 52 on the side in contact with the abrasive grains 1 is a temporarily fixed surface. However, the means for temporarily fixing the abrasive grains 1 is not limited to the double-sided tape 52. For example, the abrasive grains 1 and the patterned mesh 50 may be temporarily fixed by forming positioning grooves on the substrate 51. By bringing the heated fluid resin into contact with the temporarily fixed abrasive grains 1, the resin also flows into the gaps between the holes 50 a of the patterned mesh 50 and the abrasive grains 1, and the resin around the abrasive grains 1. It becomes possible to cover with. In this step, the process of fixing the abrasive grains 1 to the resin and the process of forming the resin layer 2 are performed simultaneously. That is, the reference surface 2 a of the resin layer 2 is formed, and the fixing surface 2 b that protrudes in the protruding direction from the reference surface 2 a is formed by the resin that flows into the gap between the patterned mesh 50 and the abrasive grains 1.

  When the resin flowing into the gap between the patterned mesh 50 and the abrasive grain 1 fills up the entire gap of the entire thickness of the patterned mesh 50, the resin that covers the abrasive grain tip and the abrasive grain 1 has substantially the same height. Then, the tip of the abrasive grains is buried in the resin layer 2, which is not preferable. By making the resin inflow amount smaller than the plate thickness equivalent amount of the patterned mesh 50, the tip of the abrasive grain can be protruded from the resin. That is, only a part of the abrasive grains 1 can be buried in the fixing surface 2b protruding in the protruding direction from the reference surface 2a. That is, the resin layer 2 having the reference surface 2a and the fixing surface 2b can be formed by allowing the resin to flow into a predetermined position in the hole 50a separated from the temporarily fixed surface of the abrasive grain 1.

  Thereafter, the patterned mesh 50 is peeled off from the resin layer 2 to obtain the dresser of the present invention in which the abrasive grains are fixed to the resin layer 2. Since the end of the patterned mesh side is temporarily fixed with a double-sided tape or the like and the resin layer 2 side is fixed with a sufficient fixing force, the abrasive grains are peeled off from the patterned mesh 50. All the subsequent abrasive grains are integrated with the resin layer 2.

  In order to fix the abrasive grains 1 with resin, an injection molding method and a warm die pressing method are suitable. In particular, the injection molding method is preferable because of its excellent productivity. The shape of the resin layer 2 can be determined by the inner shape of the mold into which the resin flows.

  Next, a manufacturing method when the support material 3 is not omitted, that is, when the metal support material 3 is used will be described. In order to fix the abrasive grains 1 to the metal support 3, first, the patterned mesh is temporarily fixed on the substrate using a double-sided tape or the like. As the substrate used at this time, a resin in the form of a dresser, a metal plate, or the like can be used. Thereafter, the substrate on which the abrasive grains 1 are temporarily fixed is placed on the mold, and the metal support 3 is placed at a position facing the substrate.

  By bringing the fluid resin heated under high pressure conditions into inflow contact between the temporarily fixed abrasive grain 1 and the metal support material 3 installed at the position facing the metal support material 3 At the same time as forming the resin layer 2 on 3, the abrasive grains 1 can be covered and fixed with resin. By carrying out this step, the metal support 3 and the resin are fixed and integrated. At this time, by forming irregularities on the surface of the metallic support member 3, the fixing force becomes stronger.

  The bonding between the abrasive grains 1 and the resin is the same as when the support material 3 is omitted. Thereafter, the patterned mesh is peeled off from the resin layer 2, whereby the resin layer 2 is formed on the metal support 3, and the dresser of the present embodiment in which the abrasive grains 1 are fixed to the resin layer 2 is obtained.

  When the metal-plated abrasive grains 1 are fixed with a resin, the abrasive grain portions protruding from the resin layer 2 are also covered with the metal layer. In this case, it is possible to dissolve and remove only the metal layer at the protruding abrasive grain portion with a wet etching solution corresponding to the metal layer covering the abrasive grain 1. In addition, by integrating the abrasive grains 1 coated with the metal layer and the resin and then performing dummy dressing, only the plated metal layer at the protruding abrasive grain portion can be removed. By performing this dummy dressing while flowing a slurry such as colloidal silica, the metal layer can be efficiently removed.

  Thus, the pad grinding rate is improved by removing the metal layer covering the abrasive grain 1 at the portion protruding from the resin layer 2. Moreover, it can suppress that a metal component elutes at the time of pad grinding.

  The pattern in which the abrasive grains 1 are arranged may be random or regular. In the case of regular arrangement, the abrasive grains 1 may be arranged at each vertex of a matrix such as a triangle, quadrangle, pentagon, or hexagon. Moreover, it is possible to arrange the abrasive grains 1 in various pattern areas.

The resin layer 2 satisfying the above conditional expressions (1) and (2), that is, 0.2 ≦ L / L ₀ ≦ 0.4 and 0.4 ≦ H / H ₀ ≦ 0.7 is obtained by the following method. Can be manufactured.

  First, circular holes are formed in the same arrangement pattern as the abrasive grains 1 arranged with an actual dresser on a thin plate having a thickness t made of stainless steel (patterned mesh). After temporarily fixing this patterned mesh on the substrate with a double-sided tape or the like, each abrasive grain 1 housed in the hole of the patterned mesh is temporarily fixed. As the substrate used at this time, a resin in the form of a dresser, a metal plate, or the like can be used.

When the diameter of the circular hole of the patterned mesh is d, the distance between the centers of the holes closest to each other is w, and the average particle diameter of the abrasive grain 1 is D ₀ , d = D ₀ + 2L and w = D ₀ + L ₀ is satisfied. That is, L = (d−D ₀ ) / 2, L ₀ = w−D ₀ , and L can be controlled by the diameter d of the holes and the average particle diameter D _{0 of the} abrasive grains 1. L ₀ can be controlled by the distance w between the centers of the holes and the average grain size D _{0 of the} abrasive grains.

If the plate thickness of the patterned mesh is t, t = H _0, and H ₀ (the protruding height of the abrasive grains 1) can be controlled by the plate thickness t. H (height of the fixing surface 2b) can be controlled by the volume of the resin flowing into the space between the periphery of the hole and the abrasive grain 1 when one abrasive grain 1 is in one hole. . In the case of using injection molding, if the inflow pressure of the resin is increased, H increases, and conversely, if the inflow pressure of the resin is decreased, H decreases. Further, if the holding temperature of the inflowing resin is raised, the time until the resin is solidified becomes long, so that H becomes large. Conversely, if the holding temperature is lowered, H becomes small. Thus, H can be controlled by the inflow pressure of the resin and the holding temperature of the resin.

Hereinafter, based on an Example, this invention is demonstrated in detail.
Example 1
The dresser which is one embodiment of the present invention was manufactured using single crystal artificial diamond abrasive grains having an average grain diameter D ₀ of 160 μm. First, the patterned mesh shown below was produced. A circular hole was formed by etching at a predetermined position of a SUS304 stainless steel disc having a diameter of 100 mm and a thickness t of 80 μm. Specifically, a plurality of holes were formed in a ring-shaped region between a circle with a radius of 25 mm and a circle with a radius of 48 mm from the center of the SUS304 stainless steel disc. The holes were arranged at the apexes of the square matrix, the distance w between the centers of the holes was 400 μm, and the hole diameter d was 200 μm, 220 μm, 240 μm, 260 μm, 320 μm, 340 μm, and 380 μm. By changing the hole diameter, L (the width between the abrasive grain end 1a and the fixing surface end 2b1) can be controlled. However, the ring-shaped region is divided into four arc-shaped regions at an equal angle (90 °), a gap of 2 mm width is provided between adjacent arc-shaped regions, and no diamond abrasive grains are disposed in the gap. It was.

Next, a heat-resistant double-sided tape is affixed on a SUS304 disc having a diameter of 100 mm and a thickness of 2 mm, and the patterned mesh having a diameter of 100 mm is affixed on the double-sided tape so that the outer peripheral position is not displaced. It was. The average particle diameter D ₀ is approximately the center of the single-crystal synthetic diamond abrasive grains patterned mesh holes of 160 .mu.m, were arranged so that one of the diamond abrasive grains into the one hole. When the hole diameter is 320 μm or more, two diamond abrasive grains may enter one hole. In that case, one diamond abrasive grain was removed with tweezers. In this state, the diamond abrasive grains in the hole are temporarily fixed with a double-sided tape.

  The laminated body of diamond abrasive grains, patterned mesh, double-sided tape, and stainless steel disc produced in this way was set on the bottom of the mold of an injection molding machine so that the diamond abrasive grains face the resin inflow side. The diameter of the bottom surface of the mold was 100 mm, and the inner shape of the mold was a cylinder. The resin is a polyphenylene sulfide (PPS) resin composition (a resin composition containing 35% by mass of glass fiber as a filling material and having a melt viscosity of 160 Pa · s at a shear rate of 1000 / sec measured at a temperature of 310 ° C.). used. The mold temperature was set to 120 ° C., the cylinder temperature of the injection molding machine was set to 300 to 340 ° C., the injection pressure was set to 40 to 98 MPa, and the resin was introduced to integrate the abrasive grains 1 and the resin. The amount of resin inflow in one shot was adjusted so that the thickness of the resin layer 2 was 3 mm. H could be controlled by changing the cylinder temperature and injection pressure.

  After the resin has solidified, the laminate of the resin, diamond abrasive grains, patterned mesh, double-sided tape and stainless steel disc is removed from the mold and peeled between the resin and the patterned mesh. And a laminate comprising a patterned mesh, a double-sided tape and a stainless steel disc. All of the diamond abrasive grains temporarily fixed to the double-sided tape adhered to the peeled resin. By this method, a dresser for polishing cloth was obtained in which diamond abrasive grains were arranged at predetermined positions on the surface of the resin layer 2 having a diameter of 100 mm and a thickness of 3 mm.

The geometric state of the diamond abrasive grains of the obtained dressing cloth dresser and the resin around the abrasive grains was determined by measuring a three-dimensional profile with a laser microscope. For one dresser, 10 abrasive grains adjacent to one arc-shaped region were arbitrarily selected, and the geometric state was measured for four arc-shaped regions. The number of measured abrasive grains was 40. By this measurement, L, L ₀ , H, and H ₀ were obtained. Each value was an average value of 40 abrasive grains. However, when obtaining the L of the resin covering the periphery of one abrasive grain, since the value of L may vary depending on the location around the abrasive grain, several points around the abrasive grain are measured, The average value was taken. In addition, since the grain size of the abrasive grains having an average grain size D ₀ has a grain size distribution, L may actually deviate from the value calculated from L = (d−D ₀ ) / 2. Similarly, L ₀ may deviate from the value calculated from L ₀ = w−D ₀ .

  In order to evaluate the pad grinding rate and the flatness of the pad after pad grinding, the polishing pad was ground using the prepared dressing cloth. The ground polishing pad was made of foamed polyurethane having a diameter of 250 mm, and this polishing pad was affixed on a polishing board. The dresser for polishing cloth obtained by the above method is fixed to an apparatus having a rotating mechanism and a polishing pad radial swing mechanism, and a pressure of 2.0 kg is applied to the polishing pad and pressed against the polishing pad. It was. The center of the dresser for polishing cloth was rocked in the radial direction within a range of 30 mm to 90 mm from the center of the polishing pad. The rotational speed of the polishing pad was 90 rpm, the dresser rotational speed was 80 rpm, and the oscillation was 10 reciprocations / minute. The rotation direction of the polishing pad and the rotation direction of the dresser were the same. Water was supplied to such an extent that the entire ground surface was covered with a water film.

  After 5 minutes from the start of grinding, the grinding was interrupted once, and the polishing pad thickness was measured. The polishing pad thickness was measured with a micrometer along two diameters perpendicular to each other. One diameter was equally divided into 10 parts at equal intervals, and the average of the thickness measurement values at 20 points near the center of the equally divided part was determined and used as the polishing pad thickness. Grinding was continued again, and the thickness of the polishing pad was measured in the same manner when 10 hours had elapsed from the start of grinding.

The polishing rate of the polishing pad was determined from the decrease in polishing pad thickness between 5 minutes and 10 hours later. The pad flatness was evaluated as a value obtained by subtracting the minimum value from the maximum value among the 20 polishing pad thickness values measured after grinding for 10 hours.
The results are shown in Table 1.
As can be seen from Table 1, in the dresser according to the present invention, an excellent pad grinding rate of 2.9 μm / min or more and an excellent pad flatness of 2.5 μm or less were obtained at the same time. As can be seen from the results of Invention Examples 4, 11 to 13 and 20, more preferably 0.2 ≦ L / L ₀ ≦ 0.4 and 0.4 ≦ H / H ₀ ≦ 0.7 are satisfied. As a result, a further excellent pad grinding rate of 4.0 μm / min or more and a further excellent pad flatness of 1.8 μm or less were obtained at the same time.

For example, in the case of Invention Example 3, H / H ₀ is 0.675, which is in a more preferable range of the present invention, but L / L ₀ is 0.175, less than 0.2, and is more preferable in the present invention. Since it is out of the range, the value of the pad grinding rate is 4.0 μm / min or more. However, since the width L on the fixing surface 2b is small, the slurry is not sufficiently held, and as a result, the pad flatness is 2.1 μm. Thus, a further excellent value of 1.8 μm or less cannot be obtained. In the case of Invention Example 14, H / H ₀ is 0.650, which is a more preferable range of the present invention, but L / L ₀ is 0.456, more than 0.4, which is outside the further preferable range of the present invention. Therefore, although a further excellent value of the pad flatness of 1.6 μm can be obtained, the pad grinding rate becomes 3.8 μm / min, and a further excellent value of 4.0 μm / min or more cannot be obtained.

In the case of Invention Example 6, L / L ₀ is 0.376, which is in a more preferable range of the present invention, but H / H ₀ is 0.738, which exceeds 0.7, and from the more preferable range of the present invention. The pad flatness can be further improved to 1.8 μm or less, but the gap between the upper end surface of the resin surrounding the abrasive grains and the polishing pad is narrowed, so that the amount of scrap waste is reduced and the pad is consequently reduced. The grinding rate becomes 3.1 μm / min, and a further excellent value of 4.0 μm / min or more cannot be obtained. In the case of Inventive Example 19, L / L ₀ is 0.338, which is in a more preferable range of the present invention, but H / H ₀ is 0.375, which is less than 0.4, from the further preferable range of the present invention. Therefore, the pad grinding rate can be further improved to 4.0 μm / min or more. However, since the distance between the fixing surface 2b and the polishing pad is separated, the slurry is not sufficiently held, and the flatness of the pad is consequently reduced. It becomes 2.2 μm, and a further excellent value of 1.8 μm or less cannot be obtained.

The same applies to other examples of the invention. If L / L ₀ and H / H ₀ do not satisfy the further preferable range of the present invention at the same time, a better pad grinding rate of 4.0 μm / min or more and 1. Further excellent pad flatness of 8 μm or less cannot be obtained at the same time.

(Example 2)
The dresser which is one embodiment of the present invention was manufactured using single crystal artificial diamond abrasive grains having an average grain diameter D ₀ of 160 μm. First, the patterned mesh shown below was produced. A circular hole was formed by etching at a predetermined position of a SUS304 stainless steel disc having a diameter of 100 mm and a plate thickness t of 40 μm. Specifically, a plurality of holes were formed in a ring-shaped region between a circle with a radius of 25 mm and a circle with a radius of 48 mm from the center of the SUS304 stainless steel disc. The holes were arranged at the vertices of the square matrix, the distance w between the centers of the holes was 380 μm, and the hole diameter d was 200 μm, 220 μm, 240 μm, 260 μm, 320 μm, 340 μm, and 380 μm.

Hereinafter, to produce no Dresser a metal support member 3 in the same manner as in Example 1 to obtain L, L 0, _H, and H _0. The pad grinding rate and the pad flatness were also measured in the same manner as in Example 1. However, the cylinder temperature of the injection molding machine was set to 300 ° C. and 320 ° C., and the injection pressure was set to 40 MPa and 50 MPa. The results are shown in Table 2.
As can be seen from Table 2, in the dresser according to the example of the present invention, an excellent pad grinding rate of 2.7 μm / min or more and an excellent pad flatness of 2.5 μm or less were obtained at the same time.

As can be seen from the results of Invention Examples 32, 33, 39, and 40, by controlling 0.2 ≦ L / L ₀ ≦ 0.4 and 0.4 ≦ H / H ₀ ≦ 0.7, A further excellent pad grinding rate of 4.0 μm / min or more and a further excellent pad flatness of 1.8 μm or less were obtained at the same time.

For example, in the case of Invention Example 38, both H / H ₀ and L / L ₀ become values less than the lower limit value of the further preferable range of the present invention and deviate from the further preferable range of the present invention. Although a further excellent value of 4.0 μm / min or more can be obtained for the rate, the flatness of the pad becomes 2.2 μm, and a further excellent value of 1.8 μm or less cannot be obtained.

In the case of Invention Example 41, H / H ₀ is in a more preferable range of the present invention, but L / L ₀ is more than 0.4 and deviates from the more preferable range of the present invention. However, the pad grinding rate becomes 3.8 μm / min, and a further excellent value of 4.0 μm / min or more cannot be obtained. The same applies to other examples of the invention. If L / L ₀ and H / H ₀ do not satisfy the further preferable range of the present invention at the same time, a better pad grinding rate of 4.0 μm / min or more and 1. Further excellent pad flatness of 8 μm or less cannot be obtained at the same time.

(Example 3)
A dresser according to an embodiment of the present invention was manufactured using single crystal artificial diamond abrasive grains having an average grain size D ₀ of 45 μm, 55 μm, 90 μm, 150 μm, 210 μm, 290 μm, and 320 μm. First, the patterned mesh shown below was produced. The diameter is 100 mm, and the plate thickness t corresponds to the average grain size of the abrasive grains, using 20 μm, 20 μm, 40 μm, 60 μm, 80 μm, 120 μm, and 120 μm SUS304 stainless steel discs in order. A circular hole was opened by etching. Specifically, a plurality of holes were formed in a ring-shaped region between a circle with a radius of 25 mm and a circle with a radius of 48 mm from the center of the SUS304 stainless steel disc. The holes are arranged at the apexes of the square matrix, and the mesh hole diameter d is 75 μm, 95 μm, 150 μm, 250 μm, 350 μm, 490 μm, 540 μm in order corresponding to the average particle diameter of the abrasive grains. The distance w was set to 95 μm, 120 μm, 190 μm, 330 μm, 430 μm, 610 μm, and 710 μm in order corresponding to the average particle diameter of the abrasive grains.

Hereinafter, to produce no Dresser a metal support member 3 in the same manner as in Example 1 to obtain L, L 0, _H, and H _0. The pad grinding rate and the pad flatness were also measured in the same manner as in Example 1. However, the cylinder temperature of the injection molding machine was 300 to 340 ° C., and the injection pressure was 40 to 75 MPa. The results are shown in Table 3.
As can be seen from the results of Invention Examples 43 to 49 in Table 3, by controlling 0.2 ≦ L / L ₀ ≦ 0.4 and 0.4 ≦ H / H ₀ ≦ 0.7, 3 A pad grinding rate of 0.8 μm / min or more and a pad flatness of 2.4 μm or less were obtained at the same time. In particular, when the average grain size of the abrasive grains is in the range of 50 μm to 300 μm, a further excellent pad grinding rate of 4.0 μm / min or more and a further excellent pad flatness of 1.8 μm or less were obtained at the same time. .

Example 4
A dresser according to an embodiment of the present invention including a metal support 3 made of SUS304 was manufactured by the following method. As the abrasive grains, single crystal artificial diamond abrasive grains having an average grain diameter D ₀ of 160 μm were used. First, the patterned mesh shown below was produced. A circular hole was formed by etching at a predetermined position of a SUS304 stainless steel disc having a diameter of 100 mm and a thickness t of 80 μm. Specifically, a plurality of holes were formed in a ring-shaped region between a circle with a radius of 25 mm and a circle with a radius of 48 mm from the center of the SUS304 stainless steel disc. The holes are arranged at the apexes of the square matrix, the distance w between the centers of the holes is 400 μm, and the hole diameter d is 260 μm, 320 μm, and 340 μm. However, the ring-shaped region is divided into four arc-shaped regions at an equal angle (90 °), a gap of 2 mm width is provided between adjacent arc-shaped regions, and no diamond abrasive grains are disposed in the gap. It was.

Next, a heat-resistant double-sided tape is affixed on a SUS304 disc having a diameter of 100 mm and a thickness of 2 mm, and the patterned mesh having a diameter of 100 mm is affixed on the double-sided tape so that the outer peripheral position is not displaced. It was. The average particle diameter D ₀ is approximately the center of the single-crystal synthetic diamond abrasive grains patterned mesh holes of 160 .mu.m, were arranged so that one of the diamond abrasive grains into the one hole. When the hole diameter is 320 μm or more, two diamond abrasive grains may enter one hole. In that case, one diamond abrasive grain was removed with tweezers. In this state, the diamond abrasive grains in the hole are temporarily fixed with a double-sided tape.

  The laminate made of diamond abrasive grains, patterned mesh, double-sided tape and stainless steel disc thus prepared was set on the bottom of the mold of the injection molding machine so that the diamond abrasive grains face the resin inflow side. . Furthermore, a SUS304 disc (corresponding to the support material 3) having a diameter of 100 mm and a plate thickness of 1.5 mm was prepared, and one side of the surface was etched using a known aqueous ferric chloride solution to make the surface uneven. did. The uneven surface was set in the mold so as to face the temporarily fixed diamond abrasive grain surface. The distance between the faces facing each other was 2.5 mm. The inner shape of the mold was a cylinder.

  Next, the resin was allowed to flow into the gaps at intervals of 2.5 mm. The resin includes a polyphenylene sulfide (PPS) resin composition (a resin composition containing 35% by mass of glass fiber as a filling material and having a melt viscosity of 160 Pa · s at a shear rate of 1000 / sec measured at a temperature of 310 ° C. )It was used. Mold temperature is set to 120 ° C, injection molding machine cylinder temperature is set to 320, 340 ° C, injection pressure is set to 50 to 75MPa, and the abrasive, resin, and 1.5mm thick SUS disk are integrated. I let you. It was possible to control the height H of the fixing surface 2b by changing the cylinder temperature and the injection pressure.

  After the resin has solidified, the 1.5 mm-thick SUS disk and resin, diamond abrasive grains, patterned mesh, double-sided tape, and a laminated body of stainless steel disks are removed from the mold, and between the resin and the patterned mesh. When peeled, it was separated into two parts: a 1.5 mm thick SUS disk, a laminate composed of resin and diamond abrasive grains, and a laminate composed of a patterned mesh, a double-sided tape and a stainless steel disk. All the diamond abrasive grains temporarily fixed to the double-sided tape were fixed to the peeled resin. The 1.5 mm thick SUS disk and the resin were firmly fixed. By this method, a dresser for a polishing cloth having a 2.5 mm resin layer on a SUS disk having a diameter of 100 mm and a thickness of 1.5 mm, and diamond abrasive grains fixed to the resin layer in a predetermined position is obtained. It was.

Thereafter, dressers were produced in the same manner as in Example 1, and L, L ₀ , H, and H ₀ were obtained. The pad grinding rate and the pad flatness were also measured in the same manner as in Example 1. The results are shown in Table 4.
As can be seen from the results of Invention Examples 50 to 54 in Table 4, by controlling 0.2 ≦ L / L ₀ ≦ 0.4 and 0.4 ≦ H / H ₀ ≦ 0.7, 4 A further excellent pad grinding rate of 0.0 μm / min or more and a further excellent pad flatness of 1.8 μm or less were obtained at the same time.

(Example 5)
The average particle diameter D ₀ is abrasive surface of the single-crystal synthetic diamond abrasive grains of 160 .mu.m, were coated with Ni metal 2μm thickness by electroless plating. The Ni electroless plating bath contained nickel chloride: 50 g / L, sodium hypophosphite: 10 g / L, sodium citrate: 10 g / L, pH 4 and bath temperature 90 ° C. The plating bath was stirred with a stirrer. The Ni-plated diamond abrasive grains thus produced were immersed in an etching solution obtained by diluting a solution of nitric acid: glacial acetic acid = 1: 1 with distilled water to form uneven portions of the Ni plating layer.

  Thereafter, in the same manner as in Example 4, a dresser in which Ni-plated diamond abrasive grains were fixed to one surface of the metal support 3 made of SUS304 via a resin was obtained. The Ni plating layer covering the surface of the diamond abrasive grains exposed from the resin was removed by dipping in a solution of nitric acid: 40% hydrofluoric acid = 80: 3.

Hereinafter, to produce a dresser comprising a metallic supporting member 3 in the same manner as in Example 1 to obtain L, L 0, _H, and H _0. The pad grinding rate and the pad flatness were also measured in the same manner as in Example 1. The results are shown in Table 5.
As can be seen from the results of Invention Examples 55 to 59 in Table 5, by controlling 0.2 ≦ L / L ₀ ≦ 0.4 and 0.4 ≦ H / H ₀ ≦ 0.7, 4 A further excellent pad grinding rate of 0.0 μm / min or more and a further excellent pad flatness of 1.8 μm or less were obtained at the same time.

(Example 6)
The metal elution amount of the dresser of Invention Example 1 to Invention Example 59 into the slurry for CMP was measured. The prepared dressers are immersed for 5 days in 1000 mL of a solution in which 4% hydrogen peroxide water is mixed with commercially available W2000 (Cabot, slurry for tungsten), and then the metal elements, Ti, Ni, Al, Cu, Zn, and Cr were measured by ICP emission spectroscopy. In all the dressers of Invention Examples 1 to 59, the total amount of these metal elements was less than 0.05 mg / L, and it was confirmed that metal elution was suppressed. That is, in the example of the present invention, since the abrasive grains 1 are fixed to the resin layer 2, metal elution can be suppressed as compared with the conventional configuration in which the abrasive grains are fixed to the metal plate by electrodeposition or the like. Moreover, in the invention examples 55-59, since the metal layer of the abrasive grain surface is removed, the metal elution suppression effect is enhanced.

(Comparative Example 1 and Comparative Example 2)
The dresser shown in FIG. 3 shown as a comparative example was produced, and the pad grinding rate and the pad flatness were evaluated. The abrasive grain average particle diameter D ₀ using a single crystal synthetic diamond abrasive grains 160 .mu.m. First, a copper disk having a diameter of 100 mm and a plate thickness of 2 mm was prepared, and an organic flux was applied in a dot shape by screen printing in order to temporarily attach abrasive grains to one surface of the copper plate. Each dot was 100 μm in size, and was printed in the same arrangement as the dresser abrasive grain arrangement pattern. Screen printing used the usual well-known method.

  The organic flux is arranged in a ring-like region between a circle with a radius of 25 mm and a circle with a radius of 48 mm from the center of one side of the copper disk, and the center-to-center distance w of each dot. Was 400 μm. Next, in order to temporarily attach one abrasive grain to one dot of the organic flux, the abrasive grains were sprayed in small amounts so as to spread over the entire surface of the copper disk. Abrasive grains that contact the dots of the organic flux are temporarily attached to the dots, but abrasive grains that are not in contact with the dots can be easily removed. Through the above steps, the abrasive grains are temporarily attached to the copper disk in the dresser arrangement pattern.

Next, a resin disk having a diameter of 100 mm and a thickness of 3 mm (as a resin, a PPS resin composition (containing 35% by mass of glass fiber as a filling material, measured at a temperature of 310 ° C., at a shear rate of 1000 / second) A resin composition having a melt viscosity of 160 Pa · s was used.) Was prepared, and the abrasive grains were transferred to the resin disk. Specifically, a copper disk with abrasive grains temporarily placed on a hot plate heated to 295 ° C. was placed, and the copper disk and the abrasive grains were heated to the same temperature. In this state, a force of 80 kg and 120 kg was applied from above the abrasive grains to press the resin disk, and the abrasive grains were pushed into the resin. The pressing time was about 40 seconds. The copper disk and the resin disk were removed from the hot plate and cooled to room temperature. When the resin disk was peeled from the copper disk, all the abrasive grains temporarily attached to the copper disk were transferred to the resin disk. The protruding height of the abrasive grains was 80 μm when the pressing force was 80 kg, and 10 μm when 120 kg. The pad grinding rate and the pad flatness were measured in the same manner as in Example 1. The results are shown in Table 6.
Since the protrusion height of the abrasive grains in Comparative Example 1 is 80 μm, H ₀ = 80 μm, H = 0, and D ₀ = 160 μm, w = 400 μm when compared with the case of the present invention in FIG. This corresponds to L ₀ = 240 μm and L = 0. In this case, since the distance between the resin surface and the polishing pad is large, the removal of scraps and the like is high, and the pad grinding rate is an excellent value of 4.8 μm / min, but the retention of the slurry and the like is not sufficient. As a result, the pad flatness is greatly deteriorated to 2.7 μm.

Since the protrusion height of the abrasive grains in Comparative Example 2 is 40 μm, it corresponds to H ₀ = 10 μm, H = 0, and L ₀ = 240 μm, L = 0 when compared with the case of the present invention in FIG. . In this case, the distance between the resin surface and the polishing pad is small, and the retention of the slurry and the like is sufficiently maintained, so the pad flatness is an excellent value of 1.4 μm. The grinding rate is 2.4 μm / min and is greatly deteriorated.

  From the above, in the case of the comparative example shown in FIG. 3, it is impossible to achieve sufficient discharge of shavings etc. and sufficient retention of slurry etc. at the same time, so excellent pad grinding rate and excellent pad flatness Cannot be realized at the same time.

  The dresser for polishing cloth of the present invention is a dresser in which metal elution is suppressed, and it is possible to increase the pad flatness and the pad grinding rate at the same time. Therefore, the dresser of the present invention is applied to the pad conditioner for CMP polishing. If applied, the quality of the product substrate can be improved and the dressing time can be shortened, so that high productivity can be maintained. Therefore, the dresser for polishing cloth of the present invention can be applied to dressing polishing pads of various polishing apparatuses.

DESCRIPTION OF SYMBOLS 1 Abrasive grain 2 Resin layer 2a Reference surface 2b Adhering surface 3 Support material 20 Groove part

Claims (8)

A plurality of abrasive grains are fixed to the resin layer, and each abrasive grain protrudes from the resin layer.
On the dresser reference surface of the resin layer, a plurality of fixing surfaces protruding in the protruding direction of the abrasive grains are formed,
An abrasive cloth dresser, wherein each abrasive grain is fixed to each of the fixing surfaces in a partially embedded state. The height of the fixing surface relative to the dresser reference surface is H, the edge of the abrasive grain in the horizontal direction perpendicular to the protruding direction, and the horizontal direction of the fixing surface to which the abrasive grain is fixed Conditional expression (1) and L0 when the width between the ends is L, the interval between adjacent abrasive grains is L ₀ , and the height of the abrasive grains in the protruding direction with respect to the dresser reference surface is H _0. The dresser for abrasive cloth according to claim 1, which satisfies (2).
0.2 ≦ L / L ₀ ≦ 0.4 (1)
0.4 ≦ H / H ₀ ≦ 0.7 (2)   The dresser for polishing cloth according to claim 1 or 2, wherein the average grain size of the abrasive grains is 50 µm to 300 µm.   The abrasive cloth dresser according to any one of claims 1 to 3, wherein the abrasive grains are diamond abrasive grains.   The dresser for abrasive cloth according to claim 4, wherein the resin layer is formed on a surface of a metal support material.   The dresser for polishing cloth according to claim 5, wherein the resin layer is made of a thermoplastic resin.   The dresser for polishing cloth according to claim 5 or 6, wherein the support material is made of carbon steel or stainless steel. A first temporary fixing step of temporarily fixing a patterned mesh formed with a plurality of openings corresponding to the arrangement pattern of the abrasive grains to the substrate;
A second temporary fixing step of temporarily fixing each abrasive grain inside each opening in the substrate;
A molding step of forming the resin layer by allowing resin to flow into a predetermined position in the opening that is separated from the temporarily fixed surface of the abrasive grains,
A peeling step of peeling the patterned mesh from the resin layer;
The manufacturing method of the dresser for abrasive cloths of Claim 1 characterized by the above-mentioned.