TWI290337B - Pad conditioner for conditioning a CMP pad and method of making the same - Google Patents

Pad conditioner for conditioning a CMP pad and method of making the same Download PDF

Info

Publication number
TWI290337B
TWI290337B TW94126964A TW94126964A TWI290337B TW I290337 B TWI290337 B TW I290337B TW 94126964 A TW94126964 A TW 94126964A TW 94126964 A TW94126964 A TW 94126964A TW I290337 B TWI290337 B TW I290337B
Authority
TW
Taiwan
Prior art keywords
pad
cavities
conditioning
making
method
Prior art date
Application number
TW94126964A
Other versions
TW200707531A (en
Inventor
Ying-Che Shih
Original Assignee
Princo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Princo Corp filed Critical Princo Corp
Priority to TW94126964A priority Critical patent/TWI290337B/en
Publication of TW200707531A publication Critical patent/TW200707531A/en
Application granted granted Critical
Publication of TWI290337B publication Critical patent/TWI290337B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING, OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0027Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impregnation

Abstract

The invention provides a pad conditioner for conditioning a CMP pad. The pad conditioner comprises a substrate, a plurality of cavities exist thereon, a bonding agent filled in the cavities, and abrasive particles securely placed and fixed in the cavities. The cavities are arranged in a regular manner and each of their sizes can accommodate only one abrasive particle. The cavities may be bowl-shaped or other shaped. A method of making such a pad conditioner is also disclosed.
TW94126964A 2005-08-09 2005-08-09 Pad conditioner for conditioning a CMP pad and method of making the same TWI290337B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94126964A TWI290337B (en) 2005-08-09 2005-08-09 Pad conditioner for conditioning a CMP pad and method of making the same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
TW94126964A TWI290337B (en) 2005-08-09 2005-08-09 Pad conditioner for conditioning a CMP pad and method of making the same
US11/163,548 US20070037493A1 (en) 2005-08-09 2005-10-21 Pad conditioner for conditioning a cmp pad and method of making such a pad conditioner
JP2006038891A JP2007044863A (en) 2005-08-09 2006-02-16 Conditioner for wafer polishing pad and its manufacturing method

Publications (2)

Publication Number Publication Date
TW200707531A TW200707531A (en) 2007-02-16
TWI290337B true TWI290337B (en) 2007-11-21

Family

ID=37743129

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94126964A TWI290337B (en) 2005-08-09 2005-08-09 Pad conditioner for conditioning a CMP pad and method of making the same

Country Status (3)

Country Link
US (1) US20070037493A1 (en)
JP (1) JP2007044863A (en)
TW (1) TWI290337B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI451942B (en) * 2010-09-21 2014-09-11 Ritedia Corp Superabrasive tools having substantially leveled particle tips and associated methods

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US20110073094A1 (en) * 2009-09-28 2011-03-31 3M Innovative Properties Company Abrasive article with solid core and methods of making the same
US9254548B2 (en) 2012-04-25 2016-02-09 Taiwan Semiconductor Manufacturing Co., Ltd. Method of forming diamond conditioners for CMP process
CN203390712U (en) * 2013-04-08 2014-01-15 宋健民 Chemical mechanical polishing trimmer
EP2835220A1 (en) * 2013-08-07 2015-02-11 Reishauer AG Trimming tool, and method for manufacturing the same
TW201600242A (en) * 2014-06-18 2016-01-01 Kinik Co Polishing pad conditioner
US10259102B2 (en) 2014-10-21 2019-04-16 3M Innovative Properties Company Abrasive preforms, method of making an abrasive article, and bonded abrasive article
JP6453666B2 (en) * 2015-02-20 2019-01-16 東芝メモリ株式会社 A method for manufacturing a polishing pad dresser

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US4925457B1 (en) * 1989-01-30 1995-09-26 Ultimate Abrasive Syst Inc Method for making an abrasive tool
ZA9410384B (en) * 1994-04-08 1996-02-01 Ultimate Abrasive Syst Inc Method for making powder preform and abrasive articles made therefrom
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US6286498B1 (en) * 1997-04-04 2001-09-11 Chien-Min Sung Metal bond diamond tools that contain uniform or patterned distribution of diamond grits and method of manufacture thereof
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US6325709B1 (en) * 1999-11-18 2001-12-04 Chartered Semiconductor Manufacturing Ltd Rounded surface for the pad conditioner using high temperature brazing
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI451942B (en) * 2010-09-21 2014-09-11 Ritedia Corp Superabrasive tools having substantially leveled particle tips and associated methods

Also Published As

Publication number Publication date
US20070037493A1 (en) 2007-02-15
JP2007044863A (en) 2007-02-22
TW200707531A (en) 2007-02-16

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