JP2020157421A - Manufacturing method of dresser for abrasive cloth and dresser for abrasive cloth - Google Patents

Abstract

To provide a manufacturing method of dresser for abrasive cloth and the dresser which suppresses elution of a metal element, reduces variation of protrusion height of abrasive grains and provides excellent pad grinding speed and pad flatness at the same time.SOLUTION: A manufacturing method of a dresser for abrasive cloth includes a process of preparing a ceramics raw material composition, a process of arranging abrasive grains on a bottom surface of a forming die, a process of providing such a molding that the abrasive grains are embedded into the ceramics raw material composition and a process of sintering the molding and providing a grinding part which contains the abrasive grains directly fixed to a sintered ceramics host phase. Further, the dresser for abrasive cloth includes a grinding part which contains a sintered ceramics host phase 32 and single crystal abrasive particles directly fixed to one surface of the host phase. Therein, an average value of protrusion height p of abrasive grains 31 is 2 to 300 μm.SELECTED DRAWING: Figure 1

Description

The present invention relates to a method for manufacturing a dresser for polishing cloth and a dresser for polishing cloth.

Equipment for polishing the surface of semiconductor wafers, equipment for flattening the surface of wiring and insulating layers in the process of manufacturing integrated circuits, equipment for flattening the surface of Al plates and glass plates used for magnetic hard disk substrates, etc. In, chemical and mechanical surface polishing (Chemical Mechanical Planning, hereinafter abbreviated as "CMP polishing") is used. In this CMP polishing, for example, the surface to be polished is pressed against a rotating substrate to which a polishing pad made of urethane is attached while supplying a slurry liquid containing fine abrasive grains to flatten the surface to be polished. The method. As a matter of course, the polishing ability of the polishing pad, etc. decreases with the usage time, but in order to suppress this decrease, the surface layer of the polishing pad is ground at regular intervals to maintain the flatness of the polishing pad. However, I always dress so that a new side comes out. The parts used for this dressing are called dressers for abrasive cloth (hereinafter, often abbreviated as "dressers").

Recently, scratch scratches generated on the surface to be polished have been eliminated due to the shallow depth of focus of pattern exposure equipment due to the extremely narrowing of integrated circuit lines / spaces, or the increase in recording capacity of magnetic hard disks. In addition to the demand for flatness, the demand for flatness is increasing, such as reducing the waviness of the surface to be polished. In order to meet these demands, it is required to uniformly grind the pad surface by dressing to maintain the flatness of the pad. Furthermore, dressing is also required to have a pad grinding speed that can quickly clear pad clogging and foreign matter.

Conventional dressers are those in which artificial diamond abrasive grains are brazed and bonded onto a metal substrate (for example, Patent Document 1), and those in which artificial diamond abrasive grains are nickel electrodeposition-plated and bonded onto a metal substrate (for example, Patent Document 1). For example, it was Patent Document 2).

Further, instead of using a metal substrate, artificial diamond abrasive grains are bonded to a resin substrate with an organic adhesive (for example, Patent Document 3), or a ceramic dresser in which the substrate and protrusions are formed of ceramics (for example). , Patent Documents 4 and 5) are also known. Patent Documents 4 and 5 disclose a ceramic dresser in which the shape of a mold for powder molding ceramics is made uneven so that protrusions are formed on the sintered body.

Japanese Unexamined Patent Publication No. 2005-262341 Japanese Unexamined Patent Publication No. 2013-111707 Japanese Unexamined Patent Publication No. 2001-25957 Special Table 2015-524358 Japanese Patent Application Laid-Open No. 2015-530265

Conventionally, it has been desired to suppress deterioration of the pad grinding speed over time to extend the life of the dresser, and to improve the pad flatness while maintaining the pad grinding speed in a high state. For example, if the variation in the height of the protruding portion of the abrasive grains is suppressed, the number of abrasive grains functioning at the time of dressing can be increased, so that the deterioration of the pad grinding speed with time can be suppressed. Further, the flatness of the pad can be improved while maintaining the pad grinding speed in a high state.

However, in the case of a dresser in which diamond abrasive grains are bonded to a metal substrate as disclosed in Patent Documents 1 and 2, there is a limit in reducing the variation in the protrusion height of the abrasive grains. The variation in the protrusion height of the abrasive grains is proportional to the width of the particle size distribution of the abrasive grains, and the wider the particle size distribution, the larger the variation in the protrusion height. On the other hand, when the particle size distribution becomes narrower, the variation in the protrusion height becomes smaller, but there is a limit to narrowing the width of the particle size distribution of the abrasive grains. Therefore, the variation in the protrusion height of the dresser using the conventional brazing joint or nickel electrodeposition plating joint is about 40 μm to 60 μm when artificial diamond abrasive grains having a particle size of 100 to 200 μm are used. It is difficult to make it less than that.

Further, in the case of a dresser using a metal substrate, elution of metal elements that may occur during dressing in an acidic slurry becomes a problem. For example, an LSI circuit has a region having a line width of a dozen nm or less, and metal contamination is a problem in such a region. Therefore, a dresser that does not use a metal member is desired.

In a dresser in which artificial diamond abrasive grains are bonded to a resin substrate with an organic adhesive as disclosed in Patent Document 3, the abrasive grains can be pushed into the substrate to adjust the protrusion height. It is possible to reduce the variation in the protrusion height of the grains, and there is no problem of elution of metal elements. However, the bonding strength between the abrasive grains and the substrate is not sufficient, and the problem of abrasive grains falling off tends to occur.

Further, in the conventional ceramic dressers such as Patent Documents 4 and 5, the crystal grain size of the matrix ceramics is several μm to several tens of μm, and the size of the protrusion is about 10 μm to about 300 μm. It contains grain boundaries. Then, since this grain boundary tends to be a starting point of fracture of the protrusion, there is a problem of strength. In addition, it is difficult to form sharp edges such as diamond abrasive grains in the ceramic protrusions manufactured by the conventional ceramic manufacturing method, and there is a drawback that the pad grinding force is lowered.

In order to solve the above-mentioned problems, the present invention is a dresser that suppresses elution of metal elements, further reduces variation in the protrusion height of abrasive grains, and simultaneously realizes excellent pad grinding speed and pad flatness. The purpose is to provide the manufacturing method of the dresser and the dresser.

In view of the above problems, the first method of the present invention is the following method for manufacturing a dresser for polishing cloth.
[1] A method for manufacturing a dresser for abrasive cloth, which comprises a grinding portion including a matrix made of sintered ceramics and abrasive grains directly fixed to the matrix.
A process of preparing a ceramic raw material composition containing a ceramic raw material powder and a binder material,
The process of arranging the abrasive grains on the bottom surface of the molding die,
The ceramic raw material composition is filled in the cavity of the molding die, and the pressure is applied so that the arrangement of the abrasive grains does not change to obtain a molded product in which the abrasive grains are embedded in the ceramic raw material composition. Process and
The molded body is fired under the condition that the ceramic raw material composition is sintered, the ceramic raw material composition is sintered, and a part of the abrasive grains is projected onto the surface of the molded body to obtain a sintered ceramic matrix. A method for manufacturing a dresser for a polishing cloth, which comprises a step of obtaining a ground portion containing the abrasive grains directly fixed to the sintered ceramic matrix.
[2] The production method according to [1], wherein the firing is carried out at a temperature of 1200 ° C. or higher and 2300 ° C. or lower for a time of 1 hour or longer and 8 hours or shorter.
[3] The production method according to [1] or [2], wherein the binder material is a compound capable of chemically bonding to each of the ceramic raw material powder and the abrasive grains.
[4] The production method according to any one of [1] to [3], wherein the average particle size d3 of the abrasive grains is 20 μm or more and 3000 μm or less.
[5] The production method according to any one of [1] to [4], wherein the abrasive grains are single crystal abrasive grains.
[6] the single crystal grains is a SiC or _{B 4} C, the production method according to [5].
[7] The production method according to any one of [1] to [6], wherein the ceramic raw material powder is SiC, B ₄ C, or Si ₃ N ₄ .
[8] The production method according to any one of [1] to [7], wherein the protrusion height of the abrasive grains in the grinding portion has an average value of 2 μm or more and 300 μm or less.

The second of the present invention is the following dresser for polishing cloth.
[9] A dresser for polishing cloth produced by the method according to any one of [1] to [8].
[10] A dresser for a polishing cloth provided with a grinding portion containing a sintered ceramic matrix and abrasive grains fixed to one side of the sintered ceramic matrix.
The sintered ceramic matrix contains a ceramic raw material powder and a binder material.
The abrasive grains are single crystal abrasive grains and are directly fixed to the sintered ceramic matrix.
The average value of the protrusion height of the abrasive grains is 2 μm or more and 300 μm or less.
Dresser for abrasive cloth.
[11] The dresser for polishing cloth according to [10], wherein the average particle size d3 of the abrasive grains is 20 μm or more and 3000 μm or less.
[12] The abrasive grains are SiC or _{B 4} C, the dresser for a polishing cloth according to [10] or "11".
[13] The dresser for a polishing pad according to any one of [10] to [12], wherein the ceramic raw material powder is SiC, B ₄ C, or Si ₃ N ₄ .
[14] The polishing pad according to any one of [10] to [13], wherein the combination of the ceramic raw material powder, the abrasive grains, and the binder material is any one of the following (I) to (IV). Dresser for.
(I) is the ceramic raw material powder is SiC, said a abrasive grain SiC, the binder material is _B 4 C, BN, C, at least one selected from the group consisting of _Al 2 _{O 3} and rare earth oxides is there,
(II) The ceramic raw material powder is SiC, the abrasive grains are B ₄ C, and the binder material is at least one selected from the group consisting of Al ₂ O ₃ and rare earth oxides.
(III) The ceramic raw material powder is B ₄ C, the abrasive grains are SiC or B ₄ C, and the binder material is SiO ₂ , Al N, C, Si ₃ N ₄ and Si Al ₆ O ₂ N _6. At least one selected from the group,
(IV) The ceramic raw material powder is Si ₃ N ₄ , the abrasive grains are SiC or B ₄ C, and the binder is Al ₂ O ₃ , rare earth oxide, MgO, SiO ₂ , TiO ₂ , ZrO ₂ , It is at least one selected from the group consisting of HfO ₂ , TiSi ₂ , ZrSi ₂ , AlN and SiAl ₆ O ₂ N ₆ .
[15] The dresser for polishing cloth according to any one of [10] to [14], wherein the shape of the ground portion is circular or polygonal, and the diameter corresponding to the circle is 5 mm or more and 200 mm or less.
[16] The dresser for polishing cloth according to any one of [10] to [15], wherein the thickness of the ground portion is 1 mm or more and 20 mm or less.
[17] The polishing pad according to any one of [10] to [16], further comprising a substrate of the sintered ceramic matrix connected to a surface of the sintered ceramic matrix opposite to the surface to which the abrasive grains are fixed. Dresser for.
[18] The dresser for polishing cloth according to [17], wherein the shape of the substrate is circular or polygonal, and the diameter corresponding to the circle is 30 mm or more and 500 mm or less.
[19] The dresser for polishing cloth according to [17] or [18], wherein the thickness of the substrate is 5 mm or more and 30 mm or less.
[20] The dresser for a polishing cloth according to any one of [17] to [19], wherein at least the substrate is coated with chemical resistance.

According to the present invention, a method for manufacturing a dresser that suppresses elution of metal elements, further reduces variations in the protrusion height of abrasive grains, and simultaneously achieves excellent pad grinding speed and pad flatness, and the dresser. Is provided.

1A and 1B are schematic views showing a molded body before and after firing, in which FIG. 1A is a molded body before firing, and FIG. 1B is a sintered body after firing (showing only one abrasive grain in the grinding portion). .. 2A and 2B are schematic views showing one aspect of a pellet type dresser, where FIG. 2A is a plan view and FIG. 2B is a side view. 3A and 3B are schematic plan views showing one aspect of an integrated dresser, in which FIG. 3A is a fully convex abrasive grain type dresser, and FIG. 3B is a split convex abrasive grain type dresser.

When a ceramic material is sintered, it shrinks and its bulk density increases. In the manufacturing method of the present invention, we succeeded in manufacturing a dresser having a uniform protrusion height of abrasive grains by utilizing the shrinkage of ceramics during sintering. Specifically, the abrasive grains are placed on the bottom surface of the molding die, and the molded product obtained by filling the molded product with the ceramic raw material composition is fired, and the ceramic raw material composition is sintered and shrinks during firing. By doing so, the abrasive grains embedded in the ceramic raw material composition are projected. In this way, the edges of the abrasive grains are arranged so as to be aligned with the bottom surface of the mold, and the ceramic raw material composition is sintered to fix the abrasive grains while maintaining the arrangement, and the abrasive grains are projected to the surface. As a result, it was possible to obtain a ground portion with little variation in the protrusion height of the abrasive grains.

Further, in the production method of the present invention, the protrusion height of the abrasive grains is determined by the amount of shrinkage of the ceramic raw material composition forming the matrix during sintering, so that when abrasive grains having a large size on the order of millimeters are used. However, the protrusion height can be on the order of several tens of μm.
The present invention has been completed based on such findings.

1. 1. Method for Manufacturing Dresser for Abrasive Cloth A first aspect of the present invention is a method for manufacturing a dresser for abrasive cloth. The manufacturing method of this embodiment includes a step of preparing a ceramic raw material composition containing a ceramic raw material powder and a binder material, a step of arranging abrasive grains on the bottom surface of the molding mold, and a cavity of the molding mold. A step of filling the inside with the ceramic raw material composition and pressurizing so that the arrangement of the abrasive grains does not change to obtain a molded body in which the abrasive grains are embedded in the ceramic raw material composition, and the ceramic raw material composition. The molded body is fired under the condition that the material is sintered, the ceramic raw material composition is sintered, and a part of the abrasive grains is projected onto the surface of the molded body to obtain the sintered ceramic matrix and the firing. The step of obtaining a ground portion containing the abrasive grains directly fixed to the ceramic matrix is included.
Hereinafter, each step will be described in detail.

(1) Step of preparing a ceramic raw material composition First, a ceramic raw material composition containing a ceramic raw material powder and a binder material is prepared.

(Ceramic raw material powder)
The ceramic raw material powder used in the present invention is not particularly limited, and a general material can be used as a raw material for fired ceramics. Examples of the ceramic raw material powder include oxide-based ceramic raw materials such as Al ₂ O ₃ and ZrO ₂ , carbide-based ceramic raw materials such as SiC and B ₄ C, and silicon nitride-based ceramic raw materials such as Si ₃ N _4. .. SiC, B 4 C or Si ₃ N _4, is that shrinkage after firing is stable, also, from the viewpoint of sticking of the binder material and abrasive grain to be described later.

The average particle size d1 of the ceramic raw material powder is not particularly limited, but is usually preferably 0.1 μm or more and 3 μm or less, and more preferably 0.5 μm or more and 2 μm or less.

(Binder material)
The binder material used together with the ceramic raw material powder is not particularly limited as long as it is a compound that can be chemically bonded to each of the ceramic raw material powder and the abrasive grains, such as a covalent bond, a metal bond, and an ionic bond. By using such a binder material, the bonding between the ceramic raw material powders is promoted during firing, the sintered ceramics are densified to increase the strength, and the adhesiveness between the abrasive grains and the sintered ceramics is improved. Can be enhanced. An inorganic material that is generally used as a sintering aid or the like can be used as a binder material. The binder material of the inorganic-based, BN, nitrides such as AlN, C (carbon black), _{B 4} carbides such as _{C, Al 2 O 3, MgO,} SiO 2, TiO 2, ZrO 2, HfO Examples thereof include oxides such as ₂ and rare earth oxides, silicon compounds such as TiSi ₂ and ZrSi ₂ , and silicon nitride compounds such as Si ₃ N ₄ and Si Al ₆ O ₂ N ₆ . As the binder material, one or more kinds may be used, and usually two or three kinds are used in combination, but more (for example, four kinds) of binder materials can also be used.

The average particle size d2 of the binder material is not particularly limited, but is usually preferably 10 nm or more and 5 μm or less, and more preferably 20 nm or more and 2 μm or less.

The binder material can be selected according to the ceramic material used and the type of abrasive grains. In order to fix the ceramic raw material powders to each other during firing to obtain a dense ceramic matrix, the binder material is preferably a compound different from the ceramic raw material powder.

Further, the ceramic raw material composition may usually contain an additive that can be added to the ceramic raw material as long as the characteristics of the present invention are not impaired. Examples of other additives include organic binders, antifoaming agents, surfactants and the like.

The ceramic raw material composition can be obtained by mixing the ceramic raw material powder and the binder material. The amount of the binder material used is usually preferably 0.3% by mass or more and 15% by mass or less, and more preferably 0.6% by mass or more and 10% by mass or less with respect to the mass of the ceramic raw material powder. .. When using a plurality of types of binder materials, it is preferable that the total amount thereof is within the above range.

The method of mixing the ceramic raw material powder and the binder material is not particularly limited, but for example, the ceramic raw material powder and the binder material can be mixed using a mixer such as a ball mill in the presence of a solvent such as ethanol or water. it can. Since the mixture thus obtained is in the form of a slurry, the slurry is then dried and then pulverized. The pulverization may be carried out by crushing using a mortar or the like, but the slurry can be dried and granulated at the same time by a spray-drying method.

The average particle size of the ceramic raw material composition thus obtained is not particularly limited, but is usually preferably 3 μm or more and 70 μm or less, and when the spray-dry method is used, it is 40 μm or more and 70 μm or less. It is preferable because a ceramic raw material composition having a nearly spherical shape and good fluidity can be obtained and productivity is improved.

(2) Step of arranging abrasive grains Next, the abrasive grains are arranged on the bottom surface of the molding die.

(Mold)
The molding die used here is not particularly limited as long as it has a structure capable of filling the die with the ceramic raw material composition and pressurizing the mold without moving the abrasive grains arranged in the subsequent step of obtaining the molded body. .. One example is a molding die including a die, a fixed lower punch, and a movable upper punch, as used in Examples described later. Further, the shape and size of the mold are not particularly limited, and the design can be performed according to the shape and size of the final ground portion and / or dresser. The shape and size of the ground portion will be described later in relation to the shape and size of the dresser.

(Abrasive grain)
The abrasive grains can exist stably in the original state at the sintering temperature of the ceramics used as the matrix in the grinding part, are stable against the slurry touched during dressing, and have a hardness capable of grinding the pad. As long as it is a thing, there is no particular limitation. In addition, "can exist stably in the original state" means that the overall shape change does not occur, which is accompanied by a substantial size change of the abrasive grains, and the change is such that the protrusion is rounded. Is considered to be in its original state. Such abrasive grains, common abrasives for dresser can be used, for example, diamond abrasive grains, SiC abrasive grains, c-BN abrasive grains and B _{4 C} grains, and the like. From the viewpoint of the fixation of the ceramic matrix, the abrasive grains is preferably a compound containing an element in common with the ceramic raw material powder, SiC abrasive grains and B _{4 C} grains is more preferable.

The abrasive grains may be single crystal abrasive grains or polycrystalline abrasive grains, but single crystal abrasive grains are preferable from the viewpoint of strength.

The average particle size d3 of the abrasive grains is not particularly limited, but is usually preferably 20 μm or more and 3000 μm or less, and more preferably 50 μm or more and 1500 μm or less. In the manufacturing method of the present embodiment, if the average particle size d3 of the abrasive grains is 20 μm or more, it is possible to achieve an abrasive grain protrusion height sufficient to achieve an excellent grinding speed. Further, if the thickness is 3000 μm or less, a sufficient number of protruding portions can be formed in the ground portion, so that deterioration of the pad grinding speed with time can be suppressed.

In the manufacturing method of this embodiment, abrasive grains having a large size on the order of millimeters can also be used. In a dresser in which abrasive grains are fixed by conventional brazing joining or Ni electrodeposition plating joining, the protrusion height of the abrasive grains is about half of the abrasive grain size, but in the manufacturing method of this embodiment, the abrasive grains are This is because the protrusion height is determined by the amount of shrinkage of the matrix ceramic during sintering, and the protrusion height can be on the order of several tens of μm regardless of the size of the abrasive grains. Therefore, even if a large abrasive grain is used, excellent flatness of the pad can be maintained. Further, in the case of large abrasive grains, the edge portion of each abrasive grain becomes long, and the pad grinding force is improved. Therefore, it is possible to achieve both a large grinding speed and excellent pad flatness by using a large size abrasive grain.

Further, it is preferable to use abrasive grains having a narrow particle size distribution to reduce the particle size difference between the maximum abrasive grains and the minimum abrasive grains existing in one dresser. The smaller the particle size difference, the smaller the variation in the protrusion height of the abrasive grains. Specifically, the particle size difference is preferably 200 μm or less, more preferably 150 μm or less, and even more preferably 100 μm or less.

The average particle size d1 of the ceramic raw material powder, the average particle size d2 of the binder material, the average particle size d3 of the abrasive grains, and the average particle size of the ceramic raw material composition are determined by a sieve classification method, a laser diffraction method, a centrifugal sedimentation method, and scanning. It can be measured by a direct observation method including a scanning electron microscope (SEM). In the present invention, the particle size of the abrasive grains is a value measured by the sieve classification method. A JIS Z8801 sieve is used as the sieve. However, since the minimum opening size of the sieve of JIS Z 8801 is 20 μm, the following sieve was prepared and used when abrasive grains having a size of 20 μm or less were contained. A foil made by laser-processing square through holes corresponding to 15 μm and 10 μm in a 20 μm-thick SUS304 stainless steel foil is formed into a circular JIS sieve mesh so that the arrangement of the sieve openings is similar to that of the stainless steel foil. It was cut to the size of 1 and placed on a mesh of a sieve having a mesh opening of 1 mm to prepare a sieve in which the surrounding gap was closed with an epoxy resin. The distance between the centers of the adjacent holes of the squares formed by laser processing was 30 μm when the opening was 15 μm, and 20 μm when the opening was 10 μm.

The method of sieving the abrasive grains is performed according to the sieving test method of JIS Z 8815. After sieving the abrasive grains by such a method, the classified abrasive grains remain on each sieve. The mass of the abrasive grains remaining on each sieve is measured, and the mass% of the abrasive grains remaining on each sieve is determined with the total as 100%. The particle size of the abrasive grains remaining on each sieve is an intermediate value between the size of the mesh size of the sieve and the size of the mesh size of the sieve placed on the sieve. A graph of the cumulative distribution was drawn in 1 and the median diameter at which the cumulative distribution was 50% was taken as the average particle size of the abrasive grains. However, the particle size of the abrasive grains that passed through the sieve having a mesh size of 10 μm was set to 5 μm.

The particle size of the raw material powder and the binder is preferably a laser diffraction method (for example, HORIBA, Ltd., type LA-960). When pure water is used as a solvent and the powder easily aggregates, the aggregation can be prevented by a dispersant or ultrasonic treatment. It is preferable to use the median diameter as the average particle size.

Further, in the ceramic dresser, the strength of the dresser (specifically, the strength of the ceramic matrix and the ease with which the abrasive grains fall off) may be affected by the combination of the ceramic raw material powder, the abrasive grains and the binder material. .. From the viewpoint of increasing the adhesiveness between the ceramic raw material powder constituting the matrix and the abrasive grains and increasing the strength of the dresser, the ceramic raw material powder, the abrasive grains and the binder material are a combination of the following combinations (I) to (IV). It is preferable to select so as to satisfy any one of them.

(I) is the ceramic raw material powder is SiC, said a abrasive grain SiC, the binder material is _B 4 C, BN, C, at least one selected from the group consisting of _Al 2 _{O 3} and rare earth oxides is there,
(II) The ceramic raw material powder is SiC, the abrasive grains are B ₄ C, and the binder material is at least one selected from the group consisting of Al ₂ O ₃ and rare earth oxides.
(III) The ceramic raw material powder is B ₄ C, the abrasive grains are SiC or B ₄ C, and the binder material is SiO ₂ , Al N, C, Si ₃ N ₄ and Si Al ₆ O ₂ N _6. At least one selected from the group,
(IV) The ceramic raw material powder is Si ₃ N ₄ , the abrasive grains are SiC or B ₄ C, and the binder is Al ₂ O ₃ , rare earth oxide, MgO, SiO ₂ , TiO ₂ , ZrO ₂ , It is at least one selected from the group consisting of HfO ₂ , TiSi ₂ , ZrSi ₂ , AlN and SiAl ₆ O ₂ N ₆ .

As described above, several kinds of binder materials can be used in combination. In that case, it is preferable that all of the binder materials used are selected from the materials listed in each combination of (I) to (IV). However, as long as at least one of the binder materials is selected from a specific combination and the effects of the present invention are not impaired, it is possible to use other binder materials not listed in each combination.

(Arrangement of abrasive grains)
When arranging the abrasive grains on the bottom surface of the molding die, use double-sided tape or adhesive with adhesive strength that allows the abrasive grains to be peeled off so that the positions of the abrasive grains do not shift in the process of producing the next molded product. Therefore, it is preferable to arrange the abrasive grains on the bottom surface of the mold. The abrasive grains may be arranged randomly or may be arranged regularly. Examples of the regular arrangement include a square arrangement in which abrasive grains are arranged at the vertices of a square, and a triangular arrangement as well.

As a method of regularly arranging the abrasive grains, for example, a perforated stainless steel plate having through holes having a size that allows only one abrasive grain to enter is prepared in a predetermined arrangement, and the perforated stainless steel plate is used. It can be used to place abrasive grains on the bottom surface of the lower punch of the mold. At this time, it is preferable that the abrasive grains are not arranged in the region near the outermost circumference of the lower punch (for example, the region 1 mm inward from the outermost circumference).

Further, from the viewpoint of increasing the grinding speed in the range of the average particle size d3 of the abrasive grains, it is preferable that 70% or more of the number of abrasive grains of the entire dresser satisfies the following relationship.
d3 ≤ L <5 x d3
In the above formula, L is the distance between the centers of adjacent abrasive grains. By reducing the distance between the abrasive grains so as to satisfy this relationship, it is possible to increase the grinding speed and improve the flatness of the pad.

(3) Step of Obtaining a Molded Body Next, the cavity of the mold in which the abrasive grains are arranged is filled with the ceramic raw material composition and pressed to obtain a molded body in which the abrasive grains are embedded in the ceramic raw material composition. In the method of the present embodiment, since the ceramic raw material composition is filled from above with the abrasive grains arranged on the bottom surface of the mold to obtain a molded body, the tips of the abrasive grains are aligned with the surface layer portion of the molded body. ing. By sintering such a molded body, it is possible to obtain a ground portion with little variation in the protrusion height of the abrasive grains.

The amount of the ceramic raw material composition to be filled in the mold is sufficient to completely fill the abrasive grains in the ceramic raw material composition after pressurization and to retain the abrasive grains even after shrinkage of the ceramic raw material composition by firing. The amount is not particularly limited as long as the thickness of the ceramic matrix is formed.

Next, the filled ceramic raw material composition is pressed to obtain a molded product. Although there is no particular limitation on the degree of pressure, typically, 500 kgf / cm ² or more 5000 kgf / cm ² or less, preferably 1000 kgf / cm ² or more 3000 kgf / cm ² or less. Further, it is preferable to apply pressure so that the bulk density of the molded product after pressurization (that is, the molded product before firing) is 40% or more and 90% or less with respect to the bulk density after firing.
The bulk density is a value calculated by measuring the height, diameter, and weight of the molded product, respectively.

In the present invention, the ceramic raw material composition is sintered and shrunk in the next firing step, so that the abrasive grains embedded in the ceramic raw material composition protrude. The final protrusion height of the abrasive grains is determined by the size of the abrasive grains and the change in the bulk density of the ceramic raw material composition due to firing. Therefore, the protrusion height of the abrasive grains can also be controlled by controlling the bulk density of the molded product in this step.

In the schematic diagram shown in FIG. 1, the difference between the height H1 of the ceramic matrix 32 around the abrasive grains 31 and the height h1 of the ceramic matrix 32 around the abrasive grains 31 in the sintered body (H1- h1) is the protrusion height of the abrasive grains. Further, the shrinkage of the molded product due to sintering has a constant height reduction rate at any portion in the height direction. Therefore, the ratio (h2 / H2) of the height h2 of the corresponding portion in the sintered body to the height H2 of the ceramic material composition occupying the portion below the abrasive grains (above the abrasive grains when preparing the molded product) is. Equal to h1 / H1 and (h1 + h2) / (H1 + H2).

The change in bulk density after sintering differs depending on the type and average particle size of the ceramic raw material powder and binder material used, and the firing conditions, but when the same raw material is used, the bulk of the molded product before sintering The higher the density, the smaller the rate of increase in bulk density after sintering, that is, the lower the shrinkage rate. Therefore, the protruding height of the abrasive grains tends to be low. Further, if the bulk density of the molded product before sintering is low, the rate of increase in bulk density after sintering is large, that is, the shrinkage rate is high, so that the protrusion height of the abrasive grains tends to be high. In this way, by adjusting the bulk density of the molded product and the bulk density after sintering, the protrusion height of the abrasive grains can be adjusted.

In order to achieve an appropriate protrusion height of abrasive grains in consideration of the shrinkage rate of the ceramic raw material composition after firing, the bulk density of the molded product before firing is 40 with respect to the bulk density after firing. It is preferably% or more and 90% or less, and more preferably 60% or more and 80% or less.

(4) Firing step The molded product obtained above is fired under the condition that the ceramic raw material composition is sintered. The ceramic raw material composition is sintered by firing, and a part of the abrasive grains is projected onto the surface of the molded product to contain the sintered ceramic matrix and the abrasive grains directly fixed to the sintered ceramic matrix. Obtain a grinding part. In addition, "directly fixed" does not mean that the abrasive grains are fixed to the ceramic matrix through a brazing material or adhesion, but through a phase in which the abrasive grains and the ceramic matrix react with the binder material. It means that they are fixed in contact with each other.

The firing conditions are not particularly limited as long as the ceramic raw material composition used is sintered, and varies depending on the material and particle size of the ceramic raw material powder used. The firing can be carried out under normal pressure or under pressure, but the firing conditions are usually 1 hour or more and 8 hours or less at a temperature of 1200 ° C. or higher and 2300 ° C. or lower under normal pressure. Specifically, when the ceramic raw material powder is silicon nitride, it is preferably 1500 ° C. or higher and 1750 ° C. or lower, when it is silicon carbide, it is preferably 1750 ° C. or higher and 2300 ° C. or lower, and when it is boron carbide, it is preferably 1800 ° C. or higher and 2200 ° C. or lower. .. The preferred range of sintering time is 1 hour or more and 8 hours or less, and more preferably 3 hours or more and 5 hours or less.
By the above firing, the bulk density after firing is preferably 90% or more and 100% or less with respect to the true density (the density of the sintered body in which the molded body is completely sintered and has no voids). More preferably, it is% or more and 99% or less.
The bulk density is a value calculated by measuring the height, diameter, and weight of the molded product, respectively.

As described above, when the ceramic raw material composition is sintered in the firing step, the abrasive grains that did not protrude from the surface of the molded body before firing due to the shrinkage (increased bulk density) of the ceramic raw material composition appear on the surface. Stick out. The average value of the protrusion height of the abrasive grains is preferably 2 μm or more and 300 μm or less, more preferably 5 μm or more and 250 μm or less, and further preferably 10 μm or more and 120 μm or less. When the average value of the protrusion heights of the abrasive grains is 2 μm or more, a sufficient pad grinding speed can be obtained, and when it is 300 μm or less, the pad flatness is good. Further, the pad flatness tends to be improved when the protrusion height of the abrasive grains is 70 μm or less.

Further, the smaller the variation in the protrusion height of the abrasive grains, the more preferable, and usually, it is preferably 30 μm or less, more preferably 20 μm or less, and further preferably 10 μm or less. When the variation in the protrusion height of the abrasive grains is 30 μm or less, high pad flatness can be obtained. In addition, deterioration of the pad grinding speed when used for a long time can be suppressed.

The average value and variation of the protrusion height of the abrasive grains are measured by the following method.
Twenty abrasive grains were evenly selected from the abrasive grains on the surface of the sintered body, and for each of the selected abrasive grains, a length measuring microscope was used to determine the height of the matrix around the abrasive grains and the apex of the abrasive grains. Find the height, and use the difference as the protruding height. The minimum value, the maximum value, and the average value are obtained for the protrusion heights of the 20 abrasive grains, and the value obtained by subtracting the minimum value from the maximum value is defined as the variation in the protrusion height.

(5) Preparation of Dresser By the above steps (1) to (4), a ground portion containing a matrix made of sintered ceramics and abrasive grains directly fixed to the matrix can be obtained. The obtained grinding part can be used as an integrated dresser (see FIG. 3) in which the substrate and the grinding part are integrated. Further, one or a plurality of grinding parts may be attached to the substrate to form a pellet type dresser (see FIG. 2).

(Pellet type dresser)
A pellet-type dresser in which one or more grinding portions are attached to a substrate can have a large area as a dresser, so that it is possible to handle a putt having a larger area. For example, in the dresser of FIG. 2, six circular grinding portions are attached to the circular substrate 20 ((a) of FIG. 2).

As the material of the substrate to which the grinding portion is connected, ceramics; stainless steel; a steel plate coated with DLC, resin, TiN or the like with chemical resistance; resin or the like can be used. Although the substrate does not come into direct contact with the polishing pad during dressing, it comes into contact with the acidic slurry, so a material that does not cause metal elution is more preferable. For example, stainless steel is a material with less metal elution than ordinary steel sheets, but when it is necessary to substantially eliminate metal elution, stainless steel or ordinary steel sheets with DLC coating, resin coating, etc. are used. preferable.

The substrate is used in connection with a CMP apparatus, and the substrate itself rotates and revolves on the pad during dressing. Therefore, the shape of the substrate is preferably a circle having good symmetry when viewed from the center of the substrate, or a polygon such as a pentagon, a hexagon, or an octagon.

The size of the substrate is preferably 30 mm or more and 500 mm or less in diameter equivalent to a circle, and the thickness is preferably 5 mm or more and 30 mm or less. When the diameter equivalent to a circle is 30 mm or more, the flatness of the pad is less likely to deteriorate after grinding, which is preferable. Further, if the diameter equivalent to the circle is 500 mm or less, the weight of the dresser does not become heavy and the handleability does not deteriorate. When the thickness is 5 mm or more, the rigidity of the substrate itself is sufficient, and warpage is unlikely to occur, which is preferable. The thickness is 30 mm, and the required rigidity is obtained. As the thickness increases, the weight becomes heavier and the handleability deteriorates. Therefore, 30 mm or less is preferable.

In the pellet type dresser, the shape of the grinding portion connected to the substrate is preferably a shape having good symmetry when viewed from the center of the grinding portion, that is, a circular shape or a polygonal shape such as a pentagon, a hexagon, or an octagon.

The size of the ground portion is preferably 5 mm or more and 200 mm or less in diameter equivalent to a circle, and the thickness is preferably 1 mm or more and 20 mm or less. When the circle-equivalent diameter is 5 mm or more, the dresser can be manufactured with less work without requiring too many grinding parts when connected to the substrate to form a dresser. Further, if the diameter equivalent to the circle is 200 mm or less, the sintered body is warped, and the apparent variation in the protrusion height of the abrasive grains is unlikely to be large. If the thickness is 1 mm or more, the strength of the sintered body itself is sufficient and there is little risk of cracking. Further, if the thickness exceeds 20 mm, the raw material cost of the ceramic powder increases without any significant advantage, so 20 mm or less is preferable. The thickness of the ground portion is indicated by p + h1 + h2 in FIG. 1, p can be measured with a length measuring microscope, and h1 + h2 can be measured with a caliper or a micrometer.

Examples of the method of connecting the ground portion to the substrate include a method of attaching using an organic adhesive, a method of fastening with screws and the like. For example, if the grinding portion is fixed to the substrate with a screw from the side opposite to the connecting portion, the screw itself does not come into contact with the acidic slurry. Therefore, metal screws can also be used. Of course, ceramic or resin screws can also be used.

When connecting a plurality of grinding parts to one substrate, it is important that the distances from the back surface of the substrate fixed to the CMP device to the apex of the protruding portion of the abrasive grains after the connection are multiple. It is to adjust so that they are equidistant in the grinding part of. By aligning all the heights of the grinding parts to be used, it is possible to suppress the deterioration of the pad grinding speed over time, and it is possible to grind the pad flat while maintaining the pad grinding speed in a high state, and the pad flatness Can also be improved.

When connecting a plurality of grinding parts to one substrate, the number of connecting parts is preferably 3 or more. When the number of grinding portions is two, the balance becomes unbalanced when the substrate rotates and revolves on the pad, and stable grinding may be difficult. In multiple grinding parts, the center position of each grinding part is on a concentric circle equidistant from the center of the substrate, and when the center of each grinding part and the center of the substrate are connected by a straight line, the angles of the adjacent straight lines become equidistant. By arranging in such a manner, stable grinding becomes possible. Further, if the radii of the concentric circles are set to two or more, the grinding portions are arranged on two or more concentric circles, so that the pad uniformity is further improved.

(Integrated dresser)
The ground portion containing the ceramic matrix and abrasive grains can be used as it is as an integrated dresser. Since the integrated dresser does not need to use a metal substrate, metal elution during dressing can be completely prevented.

The size of the grinding portion used as the integrated ceramic dresser is not particularly limited, but the diameter equivalent to a circle is preferably 30 mm or more and 200 mm or less, and the thickness is preferably 5 mm or more and 20 mm or less. When the diameter equivalent to a circle is 30 mm or more, the flatness of the pad is less likely to deteriorate, which is preferable. Further, if the diameter equivalent to the circle is 200 mm or less, the sintered body is warped, and the apparent variation in the protrusion height of the abrasive grains is unlikely to be large. When the thickness is 5 mm or more, it is less likely to crack due to insufficient strength when attaching / detaching to / from the CMP apparatus, which is preferable. Further, even if the thickness exceeds 20 mm, the raw material cost of the ceramic powder increases and there is no significant advantage, so 20 mm or less is preferable. The thickness of the ground portion is indicated by p + h1 + h2 in FIG. 1, p can be measured with a length measuring microscope, and h1 + h2 can be measured with a caliper or a micrometer.

The integrated ceramic dresser can be a fully convex abrasive grain type dresser as shown in FIG. 3A, which has an abrasive grain portion 33 in which abrasive grains are arranged on the entire surface thereof. Alternatively, a split convex abrasive grain type as shown in FIG. 3B, in which the abrasive grains are partially arranged and the abrasive grain portion 33 is divided by a region where the abrasive grains do not exist (that is, the ceramic matrix 32). It can also be used as a dresser. In the split convex abrasive grain type dresser, the region where the abrasive grains are arranged can be divided into four or six in an arc shape ((b) in FIG. 3 is divided into four). Dividing the region where the abrasive grains are present in this way is preferable because the circulation of the slurry contained between the dresser grinding portion and the pad surface during dressing is improved.

2. 2. Dresser for Abrasive Cloth A second aspect of the present invention is a dresser for abrasive cloth. The dresser of this embodiment can be manufactured by the manufacturing method of this embodiment described above.

In the dresser preferable in this embodiment, the sintered ceramic matrix contains a ceramic raw material powder and a binder material, the abrasive grains are single crystal abrasive grains, and the sintered ceramic matrix is directly fixed to the sintered ceramic matrix, and further abrasive. The average value of the protrusion height of the grains is 2 μm or more and 300 μm or less.

Further, the abrasive grains used in the dresser preferably have an average particle size d3 of 20 μm or more and 3000 μm or less, and more preferably 50 μm or more and 1500 μm or less. When the average particle size d3 of the abrasive grains is 20 μm or more, it is easy to obtain a sufficient abrasive grain protrusion height to achieve an excellent grinding speed, and when it is 3000 μm or less, a sufficient number for the grinding portion. The protruding part is likely to be formed. The average particle size of the abrasive grains used in the dresser can be determined as follows. In the ground portion of the dresser, a part of the abrasive grains is projected, but the abrasive grains are cut in the thickness direction of the ground portion, and the size of each abrasive grain can be confirmed from the cross section. Specifically, 20 abrasive grains are selected without bias from the vicinity of the center of the grinding portion, the vicinity of the periphery, and the vicinity of the middle between the center portion and the peripheral portion. Each abrasive grain is cut in the thickness direction of the ground portion at approximately the center position of the abrasive grain, and the maximum value of the length of the abrasive grain cross section visible on the cut surface in the grind portion thickness direction and the direction perpendicular to the thickness direction of the grind portion The maximum value of the length was measured, and the average value of both was taken as the size of the abrasive grains. For cutting, it is preferable to use CP (Cross Section Policeher) processing. A digital microscoop or an SEM (scanning microscope) may be used for observing the cross section. After that, if the median diameter of the confirmed abrasive grain size is obtained, the average particle size of the abrasive grains can be obtained.

The dresser includes a grinding unit containing a sintered ceramic matrix and abrasive grains fixed to one side of the sintered ceramic matrix. The sintered ceramic matrix contains a ceramic raw material powder and a binder material. The ceramic raw material powder and the binder material are not particularly limited, and are as described in detail in relation to the production method.

The abrasive grains directly fixed to one side of the sintered ceramic matrix are single crystal abrasive grains. The types and sizes of single crystal abrasive grains are as described in detail in relation to the manufacturing method.

In the dresser more preferable in this embodiment, the combination of the ceramic raw material powder, the abrasive grains and the binder material is any one of the following (I) to (IV).
(I) is the ceramic raw material powder is SiC, said a abrasive grain SiC, the binder material is _B 4 C, BN, C, at least one selected from the group consisting of _Al 2 _{O 3} and rare earth oxides is there,
(II) The ceramic raw material powder is SiC, the abrasive grains are B ₄ C, and the binder material is at least one selected from the group consisting of Al ₂ O ₃ and rare earth oxides.
(III) The ceramic raw material powder is B ₄ C, the abrasive grains are SiC or B ₄ C, and the binder material is SiO ₂ , Al N, C, Si ₃ N ₄ and Si Al ₆ O ₂ N _6. At least one selected from the group,
(IV) The ceramic raw material powder is Si ₃ N ₄ , the abrasive grains are SiC or B ₄ C, and the binder is Al ₂ O ₃ , rare earth oxide, MgO, SiO ₂ , TiO ₂ , ZrO ₂ , It is at least one selected from the group consisting of HfO ₂ , TiSi ₂ , ZrSi ₂ , AlN and SiAl ₆ O ₂ N ₆ .

Conventionally, when a foreign substance having a shrinkage rate different from that of the ceramic raw material is added to the ceramic raw material and sintered, stress is concentrated at the interface between the foreign substance and the ceramic, and cracks are generated from the foreign matter to generate the strength of the ceramic. Is believed to decrease. Further, since the change in bulk density before and after sintering differs between the ceramic raw material and the foreign matter, it is considered that peeling is likely to occur at the interface between the ceramic and the foreign matter.

In the dresser of the present embodiment, such a problem is unlikely to occur, but especially when any one of the above combinations (I) to (IV) is used, the possibility that the above problem occurs is very low. .. The reason is not clear, but by using a binder material that has a high affinity for both the ceramic raw material powder that constitutes the matrix and the abrasive grains that correspond to foreign substances for the ceramic raw material powder, the ceramic raw material powder and the abrasive grains are used. It is considered that this is because the adhesiveness with and is improved.

As described above in relation to the manufacturing method, several kinds of binder materials can be used in combination. In that case, it is preferable that all of the binder materials used are selected from the materials listed in each combination of (I) to (IV). However, as long as at least one of the binder materials is selected from a specific combination and the effects of the present invention are not impaired, it is possible to use other binder materials not listed in each combination.

In the dresser of the present embodiment, the average value of the protrusion height of the abrasive grains is preferably 2 μm or more and 300 μm or less, more preferably 5 μm or more and 250 μm or less, and further preferably 10 μm or more and 120 μm or less. .. When the average value of the protrusion heights of the abrasive grains is 2 μm or more, a sufficient pad grinding speed can be obtained, and when it is 300 μm or less, the pad flatness is good. Further, the pad flatness tends to be improved when the protrusion height of the abrasive grains is 70 μm or less.

Further, the smaller the variation in the protrusion height of the abrasive grains, the more preferable, and usually, it is preferably 30 μm or less, more preferably 20 μm or less, and further preferably 10 μm or less. When the variation in the protrusion height of the abrasive grains is 30 μm or less, high pad flatness can be obtained. In addition, deterioration of the pad grinding speed when used for a long time can be suppressed.

The method for measuring the average value and the variation in the protrusion height of the abrasive grains is as described above.

The dresser of the present embodiment is not particularly limited as long as it has the above-mentioned specific grinding portion. The shape of the ground portion is preferably circular or polygonal, the diameter corresponding to the circle is 5 mm or more and 200 mm or less, and the thickness thereof is 1 mm or more and 20 mm or less. The shape and size of the ground portion are as described in detail in relation to the manufacturing method.

Further, the dresser may further include a substrate connected to a surface opposite to the surface on which the abrasive grains of the sintered ceramic matrix are fixed. A dresser including a substrate in this way is called a pellet-type dresser. A pellet-type dresser is preferable because it is easy to increase the area of the dresser and it is possible to handle a putt having a larger area.

The shape of the substrate is circular or polygonal, and the diameter corresponding to the circle is preferably 30 mm or more and 500 mm or less, and the thickness is preferably 5 mm or more and 30 mm or less. The shape and size of the substrate are as described in detail in relation to the manufacturing method.

In particular, when the substrate is made of metal, the substrate is preferably coated with chemical resistance in order to prevent elution of metal elements from the substrate. The coating of the substrate is as described in detail in relation to the manufacturing method.

Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited thereto. Although the display of "%" is used in the examples, it represents "mass%" unless otherwise specified.

(Example 1: Dressers 1 to 10)
1. 1. Manufacture of grinding parts <Preparation of ceramic raw material composition>
Silicon carbide (SiC) was used as a ceramic raw material powder to prepare a ceramic raw material composition as a raw material for the matrix of the grinding unit.
With respect to the average particle diameter 0.8μm of alpha-SiC powder, a binder material, the average particle diameter of 0.3 percent at 0.8μm of _{B 4} C and B terms, 21R-sialon powder having an average particle diameter of 1 [mu] m (SiAl ₆ 0.5% of O ₂ N ₆ ) was added in terms of Al, and 2.0% of carbon black having an average particle size of 20 nm was added. Further, an organic binder and a dispersant were added, water was added as a solvent, and the mixture was mixed with a ball mill to obtain a slurry. From the slurry obtained by the spray-drying method, a granulated product made of a ceramic raw material composition having an average particle size of 65 μm was obtained.

<Abrasive grains>
Single crystal SiC was prepared as the abrasive grains.
The particle size of the abrasive grains was adjusted using a JIS Z8801 sieve and a sieve prepared by the method described below.
The sieves of JIS Z8801 have an opening size of 20 μm, 25 μm, 45 μm, 53 μm, 106 μm, 125 μm, 180 μm, 212 μm, 425 μm, 500 μm, 850 μm, 1000 μm, 2000 μm, and 2360 μm.
Further, a sieve having a plurality of holes corresponding to sieves having a mesh size of 950 μm, 1800 μm, and 2050 μm was prepared on a 100 μm stainless steel foil by a known etching method.

Using the above sieve, abrasive grains having 10 kinds of particle diameters in the following opening size range were prepared. 20 to 25 μm, 45 to 53 μm, 106 to 125 μm, 180 to 212 μm, 425 to 500 μm, 850 to 1000 μm, 950 to 1000 μm, 1800 to 2000 μm, 2000 to 2050 μm, 2000 to 2360 μm.
In addition, the difference between the maximum particle size and the minimum particle size of the abrasive grains used was determined.

<Arrangement of abrasive grains>
A molding die composed of a die having an outer diameter of 60 mm, an inner diameter of 27 mm and a height of 50 mm, a lower punch (fixed) having an outer diameter of 27 mm and a height of 8 mm, and an upper punch (movable) having an outer diameter of 27 mm and a height of 70 mm was prepared.

Abrasive grains were placed on the lower punch. The abrasive grains were arranged as follows.
A resin-based double-sided tape was attached on the lower punch, and the abrasive grains were placed on the resin so that the abrasive grains were located at the apex of the square. For example, when the abrasive particle size is 180 to 212 μm, a through hole having a diameter of 250 μm, which is a size for inserting only one abrasive grain, is formed in a 100 μm-thick stainless steel plate. The through hole was arranged so as to be located at the apex of the square where the length of one side of the square is 625 μm, which corresponds to 2.5 times the diameter of the through hole (250 μm). The abrasive grains were placed on the double-sided tape using the perforated stainless steel plate thus prepared. The same was performed for other abrasive grain sizes. However, when the abrasive particle size was 20 to 25 μm and 45 to 53 μm, a stainless plate having a thickness of 30 μm was used. The diameter of the through hole formed in the stainless steel plate is 30 μm for an abrasive particle size of 20 to 25 μm, 70 μm for an abrasive particle size of 45 to 53 μm, 150 μm for an abrasive particle size of 106 to 125 μm, and 600 μm for an abrasive particle size of 425 to 500 μm. The abrasive particle size of 850 to 1000 μm and 950 to 1000 μm is 1200 μm, the abrasive particle size of 1800 to 2000 μm is 2200 μm, the abrasive particle size of 2000 to 2050 μm is 2300 μm, and the abrasive particle size of 2000 to 2360 μm is 2500 μm. It was 2.5 times that of. However, the abrasive grains were not arranged in the region 1 mm inward from the outermost circumference of the lower punch having a diameter of 27 mm.

<Making a molded product>
Next, 9.2 g of a granulated product made of the ceramic raw material composition prepared above was inserted into the die from above the abrasive grains so that the arrangement of the abrasive grains did not shift. Then, an upper punch was inserted from above the die, and a pressure of 1500 kgf / cm ² was applied to prepare a molded product in which abrasive grains were further embedded in the surface layer portion of the molded product.
The height, diameter, and weight of the obtained molded product were measured to determine the bulk density of the molded product.

<Sintering>
The molded product prepared above was set in a sintering furnace so that the surface in which the abrasive grains were embedded was on the upper side, and sintered in an Ar atmosphere at 2150 ° C. for 4 hours to obtain a sintered ceramic matrix. A sintered body to be a grinding part was obtained, which contained abrasive grains directly fixed to the sintered ceramic matrix.
The height, diameter, and weight of the obtained sintered body were measured to determine the bulk density of the sintered body. However, the height is the height of only the matrix measured for the portion without abrasive grains.

2. 2. Measurement of the protrusion height of the abrasive grains The protrusion height of the abrasive grains in the sintered body was measured as follows.
From the abrasive grains on the surface of the sintered body, 20 abrasive grains were selected without bias. For each of the selected abrasive grains, a length measuring microscope was used to determine the height of the matrix around the abrasive grains and the height of the highest apex of the abrasive grains, and the difference was used as the protruding height. The minimum value, the maximum value, and the average value were obtained for the protrusion heights of the 20 abrasive grains, and the value obtained by subtracting the minimum value from the maximum value was obtained as the variation in the protrusion height.

3. 3. Manufacture of dresser Prepare a substrate made of SiC ceramics with a diameter of 100 mm and a thickness of 7 mm, draw 6 straight lines at intervals of 60 ° in the radial direction from the center, and make the center of the sintered body 32 mm from the center. The six sintered bodies were bonded together. Specifically, six pieces are arranged at predetermined positions so that the abrasive grain surface of the sintered body faces downward on a flat surface, and a thick adhesive is applied to the upper surface of each sintered body. did. After setting the SiC ceramic substrate so that the plate surface was parallel to the surface on which the sintered body was placed, the SiC ceramic substrate was gradually moved downward and brought into contact with the adhesives on the upper side of the six sintered bodies. By the way, the movement was stopped and the adhesive was cured at that position. By this step, one dresser as shown in FIG. 2 was obtained in which six sintered bodies (grinding portions) were provided on the SiC ceramic disk and the heights of all the abrasive grains were uniform.

4. Evaluation of dressers Each dresser was evaluated according to the following method.
<Pad grinding speed and pad flatness>
The pads were actually ground using each dresser. The pad used was made of foamed polyurethane having a diameter of 250 mm. This pad was attached on the polishing machine. The dresser is fixed to a device having a rotating mechanism and a mechanism for swinging the pad in the radial direction, and a load of 0.87 kgf (equivalent to 25.5 gf / cm ^{2 in} the surface pressure of the dresser) is applied by the pressurizing mechanism. I pressed it against the pad. While aligning the center of the dresser with the center of the pad, the dresser was swung in the radial direction within a range of 30 mm to 93 mm from the center of the pad. The pad rotation speed was 95 rpm, the dresser rotation speed was 85 rpm, and the swing was 12 reciprocations / minute. The direction of rotation of the pad and the direction of rotation of the dresser were the same. At the time of grinding, water was supplied to the extent that the entire surface of the grinding was covered with a film of water.

When 5 minutes had passed from the start of grinding, the grinding was interrupted once and the thickness of the pad was measured. Draw two straight lines orthogonal to each other along the diameter on the pad, divide one straight line into 10 equal parts at equal intervals, and measure the thickness of 20 points near the center of the equally divided part with a micrometer. The average of the measured values was taken as the pad thickness. Then, grinding was continued again, and the pad thickness was measured in the same manner after 1 hour, 9 hours, and 10 hours.

The grinding speed of the pad was determined from the amount of decrease in pad thickness in the period of 5 minutes to 1 hour after the start of grinding and 9 hours to 10 hours after the start of grinding. The higher the pad grinding speed, the larger the amount of pads that can be ground in one minute.

Further, the pad flatness was evaluated as a value obtained by subtracting the minimum value from the maximum value among the values of the pad thickness at 20 points measured after grinding for 10 hours. Therefore, the smaller this value is, the smaller the variation in grinding is, which is preferable.

<Metal element elution amount>
A solution prepared by mixing 4% hydrogen peroxide solution with a commercially available slurry for tungsten (W2000 manufactured by Cabot) was prepared, and the prepared dressers were immersed in the solution one by one for 5 days. Then, the metal elements in the slurry, Si, B, Ti, Ni, Al, Cu, Zn and Cr, were analyzed by ICP emission spectroscopy. The total amount of these elements was defined as the amount of metal element eluted.

The above evaluation results are shown in Table 1 together with the particle size and particle size difference of the abrasive grains used and the bulk density of the ceramic matrix.

As is clear from Table 1 above, dressers 1 to 10 having a ground portion containing a sintered ceramic matrix and single crystal abrasive grains directly fixed to the sintered ceramic matrix are manufactured by the manufacturing method of the present invention. We were able to. Further, it was confirmed that the dressers 1 to 10 had a metal element elution amount of less than 0.05 mg / L, and that there was no risk of metal elution during dressing.

The protrusion height of the dressers 2 to 8 in which the abrasive particle size is 30 to 2000 μm and the particle size difference of the abrasive grains in one dresser (hereinafter, abbreviated as “abrasive particle size difference”) is 200 μm or less. The average value of the commode was 250 μm or less, the variation in the protrusion height was 30 μm or less, the pad grinding speed was 1.5 μm / min or more, and the flatness was 2.5 μm or less. Further, in the dressers 2 to 6 having an abrasive particle size of 30 to 1000 μm and a particle size difference of 150 μm or less, the average value of the protrusion height is 120 μm or less, the variation of the protrusion height is 20 μm or less, and 2.3 μm or less. Even better flatness was obtained. Further, the dressers 3 to 5 having an abrasive particle size of 100 to 500 μm and a particle size difference of 15 to 80 μm have an average protrusion height of 70 μm or less and a variation in protrusion height of 10 μm or less, which is 2.0 μm / min or more. Even better results such as pad grinding speed and pad flatness of 2.2 μm or less could be achieved.

Comparing the dresser 6 and the dresser 7, the abrasive particle size was in the same range, but the particle size difference was as narrow as 50 μm for the dresser 7 compared to 150 μm for the dresser 6. Therefore, the variation in the protrusion height of the abrasive grains was as small as 7.6 μm in the dresser 7 while the dresser 6 was 18.9 μm according to the difference. Therefore, the pad flatness of the dresser 7 was better.

When the dresser 9 and the dresser 10 were compared, they both used abrasive grains having a particle size of 2000 μm, but the particle size difference was 50 μm for the dresser 9 and 360 μm for the dresser 10. The variation in the protrusion height of the abrasive grains according to this difference in particle size was smaller in the dresser 9 than in the dresser 10, and the flatness of the dresser 9 was improved. Further, according to the difference in the particle size of the abrasive grains, the variation in the protrusion height of the dresser 10 became large as 45.9 μm, and the pad grinding speed decreased by 13% from 13.2 μm / min to 11.5 μm / min. On the other hand, with the dresser 9, the decrease was only 8.5% from 12.8 μm / min to 11.7 μm / min. Since the variation in the protrusion height of the dressers 1 to 8 was within 30 μm, the deterioration of the pad grinding speed was kept within 10%.

In addition, when the surface of the dresser was observed with a stereomicroscope 10 hours after the start of grinding of the pad for any of the dressers, no chipping or falling off of abrasive grains was observed.

(Example 2: Dressers 11 to 20)
1. 1. Manufacture of grinding parts <Preparation of ceramic raw material composition>
Silicon carbide (SiC) was used as a ceramic raw material powder to prepare a ceramic raw material composition as a raw material for the matrix of the grinding unit.
As a binder material, 0.3% of Y ₂ O ₃ having an average particle size of 0.3 μm and Mg O ・ Al ₂ O ₃ having an average particle size of 0.3 μm are used as a binder material for α-SiC powder having an average particle size of 0.5 μm. Spinel) was added in an amount of 0.3%. Ethanol was further added as a solvent, and the mixture was stirred and mixed with a ball mill. After stirring and mixing the powder, it was crushed in a mortar to obtain a powder to be a ceramic raw material composition.

<Abrasive grains>
Single crystal B ₄ C was prepared as the abrasive grains.
The particle size of the abrasive grains is the same as in Example 1.

<Arrangement of abrasive grains, preparation of molded body>
The above abrasive grains were used, and the abrasive grains were arranged in a mold in the same manner as in Example 1. Next, a molded product was produced in the same manner as in Example 1 except that the above-mentioned ceramic raw material composition was used and the molding pressure was changed to 3000 kgf / cm ² .
The height, diameter, and weight of the obtained molded product were measured to determine the bulk density of the molded product.

<Sintering>
A molded product was sintered in the same manner as in Example 1 except that the sintering conditions were changed to 2100 ° C. and 3 hours in an Ar atmosphere to obtain a sintered body to be a ground portion.
The height, diameter, and weight of the obtained sintered body were measured to determine the bulk density of the molded product.

2. 2. Measurement of Abrasive Grain Protrusion Height The protrusion height of the abrasive grains in the sintered body was measured in the same manner as in Example 1.

3. 3. Manufacture of dresser A dresser was manufactured in the same manner as in Example 1 using the above sintered body.

4. Evaluation of dressers For each of the manufactured dressers, the pad grinding speed, pad flatness, and metal element elution amount were evaluated in the same manner as in Example 1.
The above evaluation results are shown in Table 2 together with the particle size and particle size difference of the abrasive grains used and the bulk density of the ceramic matrix.

As is clear from Table 2 above, dressers 11 to 20 having a grinding portion including a sintered ceramic matrix and single crystal abrasive grains directly fixed to the sintered ceramic matrix are manufactured by the manufacturing method of the present invention. We were able to. Further, it was confirmed that the dressers 11 to 20 had a metal element elution amount of less than 0.05 mg / L, and that there was no risk of metal elution during dressing.

For dressers 12 to 18 having an abrasive particle size of 30 to 2000 μm and a particle size difference of 200 μm or less, the average value of the protrusion height is 250 μm or less, the variation in the protrusion height is 30 μm or less, and the pad grinding speed is 1. Excellent performance of .5 μm / min or more and flatness of 2.5 μm or less was obtained. Further, for dressers 12 to 16 having an abrasive particle size of 30 to 1000 μm and a particle size difference of 150 μm or less, the average value of the protrusion height is 120 μm or less, the variation of the protrusion height is 20 μm or less, and 2.3 μm or less. Even better flatness was obtained. Further, the dressers 13 to 15 having an abrasive particle size of 100 to 500 μm and a particle size difference of 15 to 80 μm have an average protrusion height of 70 μm or less and a variation in protrusion height of 10 μm or less, which is 2.0 μm / min or more. Even better results such as pad grinding speed and pad flatness of 2.2 μm or less could be achieved.

Comparing the dresser 16 and the dresser 17, the abrasive particle size was in the same range, but the particle size difference was as narrow as 50 μm for the dresser 17 compared to 150 μm for the dresser 16. Therefore, the variation in the protrusion height of the abrasive grains was 18.2 μm in the dresser 16 and 7.0 μm in the dresser 17 according to the difference. Therefore, the pad flatness of the dresser 17 was better.

Comparing the dresser 19 and the dresser 20, both used abrasive grains having a particle size of 2000 μm, but the particle size difference was 50 μm for the dresser 19 and 360 μm for the dresser 20. The variation in the protrusion height of the abrasive grains according to this difference in particle size was smaller in the dresser 19 than in the dresser 20, and the flatness of the dresser 19 was improved. Further, in the dresser 20, the variation in the protrusion height increased to 44.7 μm according to the difference in the particle size of the abrasive grains, and the pad grinding speed decreased by 15% from 13.9 μm / min to 11.8 μm / min. On the other hand, with the dresser 19, the decrease was only 6.2% from 12.9 μm / min to 12.1 μm / min. Since the variation in the protrusion height of the dressers 11 to 18 was within 30 μm, the deterioration of the pad grinding speed was kept within 10%.

In addition, when the surface of the dresser was observed with a stereomicroscope 10 hours after the start of grinding of the pad for any of the dressers, no chipping or falling off of abrasive grains was observed.

(Example 3: Dresser 21-30)
1. 1. Manufacture of grinding parts <Preparation of ceramic raw material composition>
Boron carbide (B 4 _C) was used as the ceramic raw material powder to prepare a ceramic material composition as the raw material of the matrix phase of the grinding unit.
To the boron carbide powder having an average particle size of 1.9 μm, 3% of 21R type Sialon powder (SiAl ₆ O ₂ N ₆ ) having an average particle size of 1 μm and 1% of carbon black having an average particle size of 1 μm were added as binder materials. .. Further, a binder and a dispersant were added, water was added as a solvent, and the mixture was mixed with a ball mill to obtain a obtained slurry. From the slurry obtained by the spray-drying method, a granule having an average particle size of 60 μm and made of a ceramic raw material composition was obtained.

<Abrasive grains>
The same single crystal B4C abrasive grains as in Example 2 were used.

<Arrangement of abrasive grains, preparation of molded body>
The above abrasive grains were used, and the abrasive grains were arranged in a mold in the same manner as in Example 1. Next, 7.0 g of the above ceramic raw material composition was used to prepare a molded product in the same manner as in Example 1.
The height, diameter, and weight of the obtained molded product were measured to determine the bulk density of the molded product.

<Sintering>
A molded product was sintered in the same manner as in Example 1 except that the sintering conditions were changed to 2200 ° C. and 4 hours in an Ar atmosphere to obtain a sintered body to be a ground portion.
The height, diameter, and weight of the obtained sintered body were measured to determine the bulk density of the molded product.

2. 2. Measurement of Abrasive Grain Protrusion Height The protrusion height of the abrasive grains in the sintered body was measured in the same manner as in Example 1.

3. 3. Manufacture of dresser A dresser was manufactured in the same manner as in Example 1 using the above sintered body.

4. Evaluation of dressers For each of the manufactured dressers, the pad grinding speed, pad flatness, and metal element elution amount were evaluated in the same manner as in Example 1.
The above evaluation results are shown in Table 3 together with the particle size and particle size difference of the abrasive grains used and the bulk density of the ceramic matrix.

As is clear from Table 3 above, dressers 21 to 30 having a grinding portion containing a sintered ceramic matrix and single crystal abrasive grains directly fixed to the sintered ceramic matrix are manufactured by the manufacturing method of the present invention. We were able to. Further, it was confirmed that the dressers 21 to 30 had an elution amount of the metal element of less than 0.05 mg / L, and that there was no risk of metal elution during dressing.

For dressers 22 to 28 having an abrasive particle size of 30 to 2000 μm and a particle size difference of 150 μm or less, the average value of the protrusion height is 250 μm or less, the variation of the protrusion height is 30 μm or less, and the pad grinding speed is 1. Excellent performance of .5 μm / min or more and flatness of 2.5 μm or less was obtained. Further, in the dressers 22 to 26 having an abrasive particle size of 30 to 1000 μm and a particle size difference of 150 μm or less, the average value of the protrusion height is 120 μm or less, the variation of the protrusion height is 20 μm or less, and 2.3 μm or less. Even better flatness was obtained. Further, the dressers 23 to 25 having an abrasive particle size of 100 to 500 μm and a particle size difference of 15 to 80 μm have an average protrusion height of 70 μm or less and a variation in protrusion height of 10 μm or less, which is 2.0 μm / min or more. Even better results such as pad grinding speed and pad flatness of 2.2 μm or less could be achieved.

Comparing the dresser 26 and the dresser 27, the abrasive particle size was in the same range, but the particle size difference was as narrow as 50 μm for the dresser 27 compared to 150 μm for the dresser 26. Therefore, the variation in the protrusion height of the abrasive grains was as small as 6.8 μm in the dresser 27, while it was 18.9 μm in the dresser 26 according to the difference. Therefore, the pad flatness of the dresser 27 was better.

Comparing the dresser 29 and the dresser 30, both used abrasive grains having a particle size of 2000 μm, but the particle size difference was 50 μm for the dresser 29 and 360 μm for the dresser 30. According to this difference in particle size, the variation in the protrusion height of the abrasive grains was smaller in the dresser 29 than in the dresser 30, and the flatness of the dresser 29 was improved. Further, according to the difference in particle size of the abrasive grains, the variation in the protrusion height of the dresser 30 became large as 47.4 μm, and the pad grinding speed decreased by 14% from 14.2 μm / min to 12.2 μm / min. On the other hand, with the dresser 29, the decrease was only 6% from 13.2 μm / min to 12.4 μm / min. Since the variation in the protrusion height was within 30 μm in the dressers 21 to 28, the deterioration of the pad grinding speed was limited to 10% or less.

In addition, when the surface of the dresser was observed with a stereomicroscope 10 hours after the start of grinding of the pad for any of the dressers, no chipping or falling off of abrasive grains was observed.

(Example 4: Dresser 31-40)
1. 1. Manufacture of grinding parts <Preparation of ceramic raw material composition>
Boron carbide (B 4 _C) was used as the ceramic raw material powder to prepare a ceramic material composition as the raw material of the matrix phase of the same grinding unit as in Example 3.

<Abrasive grains>
The same single crystal SiC abrasive grains as in Example 1 were used.

<Arrangement of abrasive grains, preparation of molded body>
The above abrasive grains were used, and the abrasive grains were arranged in a mold in the same manner as in Example 3. Next, using the ceramic raw material composition, a molded product was produced in the same manner as in Example 3.
The height, diameter, and weight of the obtained molded product were measured to determine the bulk density of the molded product.

<Sintering>
In the same manner as in Example 3, the molded body was sintered to obtain a sintered body to be a grinding portion.
The height, diameter, and weight of the obtained sintered body were measured to determine the bulk density of the molded product.

2. 2. Measurement of Abrasive Grain Protrusion Height The protrusion height of the abrasive grains in the sintered body was measured in the same manner as in Example 1.

3. 3. Manufacture of dresser A dresser was manufactured in the same manner as in Example 1 using the above sintered body.

4. Evaluation of dressers For each of the manufactured dressers, the pad grinding speed, pad flatness, and metal element elution amount were evaluated in the same manner as in Example 1.
The above evaluation results are shown in Table 4 together with the particle size and particle size difference of the abrasive grains used and the bulk density of the ceramic matrix.

As is clear from Table 4 above, dressers 31 to 40 having a ground portion containing a sintered ceramic matrix and single crystal abrasive grains directly fixed to the sintered ceramic matrix are manufactured by the manufacturing method of the present invention. We were able to. Further, it was confirmed that the dressers 31 to 40 had a metal element elution amount of less than 0.05 mg / L, and that there was no risk of metal elution during dressing.

For dressers 32 to 38 having an abrasive particle size of 30 to 2000 μm and a particle size difference of 200 μm or less, the average value of the protrusion height is 250 μm or less, the variation in the protrusion height is 30 μm or less, and the pad grinding speed is 1. Excellent performance of .5 μm / min or more and flatness of 2.5 μm or less was obtained. Further, in the dressers 32 to 36 having an abrasive particle size of 30 to 1000 μm and a particle size difference of 150 μm or less, the average value of the protrusion height is 120 μm or less, the variation of the protrusion height is 20 μm or less, and 2.3 μm or less. Even better flatness was obtained. Further, the dressers 33 to 35 having an abrasive particle size of 100 to 500 μm and a particle size difference of 15 to 80 μm have an average protrusion height of 70 μm or less and a variation in protrusion height of 10 μm or less, which is 2.0 μm / min or more. Even better results such as pad grinding speed and pad flatness of 2.2 μm or less could be achieved.

Comparing the dresser 36 and the dresser 37, the abrasive particle size was in the same range, but the particle size difference was as narrow as 50 μm for the dresser 37 compared to 150 μm for the dresser 36. Therefore, the variation in the protrusion height of the abrasive grains was as small as 6.5 μm in the dresser 37, while it was 18.3 μm in the dresser 36 according to the difference. Therefore, the pad flatness of the dresser 37 was better.

Comparing the dresser 39 and the dresser 40, both used abrasive grains having a particle size of 2000 μm, but the particle size difference was 50 μm for the dresser 39 and 360 μm for the dresser 40. The variation in the protrusion height of the abrasive grains according to this difference in particle size was smaller in the dresser 39 than in the dresser 40, and the flatness of the dresser 39 was improved. Further, in the dresser 40, the variation in the protrusion height became large as 48.3 μm according to the difference in the particle size of the abrasive grains, and the pad grinding speed decreased by 14% from 13.9 μm / min to 11.9 μm / min. On the other hand, with the dresser 39, the decrease was only 6.9% from 13.0 μm / min to 12.1 μm / min. Even in the dressers 31 to 38, the variation in the protrusion height was within 30 μm, so that the deterioration of the pad grinding speed was within 10%.

In addition, when the surface of the dresser was observed with a stereomicroscope 10 hours after the start of grinding of the pad for any of the dressers, no chipping or falling off of abrasive grains was observed.

(Example 5: Dresser 41-50)
1. 1. Manufacture of grinding parts <Preparation of ceramic raw material composition>
Silicon nitride (Si ₃ N ₄ powder) was used as a ceramic raw material powder to prepare a ceramic raw material composition as a raw material for the matrix of the grinding part.
5. 3.9% Y ₂ O ₃ powder with an average particle size of 1 μm and Mg (OH) ₂ powder with an average particle size of 0.5 μm as binder material in α-type silicon nitride powder with an average particle size of 0.6 μm. 0.3% of TiSi ₂ powder having an average particle size of 1 μm and 0.3% of 21R type Sialon powder having an average particle size of 1 μm (SiAl ₆ O ₂ N ₆ ) was added. Further, a binder and a dispersant were added, and water was used as a solvent and mixed with a ball mill to obtain a slurry. From the slurry obtained by the spray-drying method, a granulated product composed of a ceramic raw material composition having an average particle size of 58 μm was obtained.

<Abrasive grains>
Using the same single crystal B _{4 C} grains as in Example 2.

<Arrangement of abrasive grains, preparation of molded body>
The above abrasive grains were used, and the abrasive grains were arranged in a mold in the same manner as in Example 1. Next, 9.4 g of the above ceramic raw material composition was used to prepare a molded product in the same manner as in Example 1.
The height, diameter, and weight of the obtained molded product were measured to determine the bulk density of the molded product.

<Sintering>
The molded product was sintered in the same manner as in Example 1 except that the sintering conditions were changed to 1600 ° C. and N ₂ atmosphere for 4 hours to obtain a sintered body to be a ground portion.
The height, diameter, and weight of the obtained sintered body were measured to determine the bulk density of the molded product.

2. 2. Measurement of Abrasive Grain Protrusion Height The protrusion height of the abrasive grains in the sintered body was measured in the same manner as in Example 1.

3. 3. Manufacture of dresser A dresser was manufactured in the same manner as in Example 1 using the above sintered body.

4. Evaluation of dressers For each of the manufactured dressers, the pad grinding speed, pad flatness, and metal element elution amount were evaluated in the same manner as in Example 1.
The above evaluation results are shown in Table 5 together with the particle size and particle size difference of the abrasive grains used and the bulk density of the ceramic matrix.

As is clear from Table 5 above, dressers 41 to 50 having a ground portion containing a sintered ceramic matrix and single crystal abrasive grains directly fixed to the sintered ceramic matrix are manufactured by the manufacturing method of the present invention. We were able to. Further, it was confirmed that the dressers 41 to 50 had an elution amount of the metal element of less than 0.05 mg / L, and there was no risk of metal elution during dressing.

For dressers 42 to 48 having an abrasive particle size of 30 to 2000 μm and a particle size difference of 200 μm or less, the average value of the protrusion height is 250 μm or less, the variation of the protrusion height is 30 μm or less, and the pad grinding speed is 1. Excellent performance of .5 μm / min or more and flatness of 2.5 μm or less was obtained. Further, in the dressers 42 to 46 having an abrasive particle size of 30 to 1000 μm and a particle size difference of 150 μm or less, the average value of the protrusion height is 120 μm or less, the variation of the protrusion height is 20 μm or less, and 2.3 μm or less. Even better flatness was obtained. Further, the dressers 43 to 45 having an abrasive particle size of 100 to 500 μm and a particle size difference of 15 to 80 μm have an average protrusion height of 70 μm or less and a variation in protrusion height of 10 μm or less, which is 2.0 μm / min or more. Even better results such as pad grinding speed and pad flatness of 2.2 μm or less could be achieved.

Comparing the dresser 46 and the dresser 47, the abrasive particle size was in the same range, but the particle size difference was as narrow as 50 μm for the dresser 47 compared to 150 μm for the dresser 46. Therefore, the variation in the protrusion height of the abrasive grains was as small as 5.1 μm in the dresser 47, while it was 19.5 μm in the dresser 46 according to the difference. Therefore, the pad flatness of the dresser 47 was better.

Comparing the dresser 49 and the dresser 50, both used abrasive grains having a particle size of 2000 μm, but the particle size difference was 50 μm for the dresser 49 and 360 μm for the dresser 50. The variation in the protrusion height of the abrasive grains according to this difference in particle size was smaller in the dresser 49 than in the dresser 50, and the flatness of the dresser 49 was improved. Further, in the dresser 50, the variation in the protrusion height became large as 40.6 μm according to the difference in the particle size of the abrasive grains, and the pad grinding speed decreased from 14.1 μm / min to 12.0 μm / min by 14% or more. On the other hand, with the dresser 49, the decrease was only 7.6% from 13.1 μm / min to 12.1 μm / min. Since the variation in the protrusion height was within 30 μm in the dressers 41 to 48, the deterioration of the pad grinding speed was limited to 10% or less.

In addition, when the surface of the dresser was observed with a stereomicroscope 10 hours after the start of grinding of the pad for any of the dressers, no chipping or falling off of abrasive grains was observed.

(Example 6: Dresser 51-60)
1. 1. Manufacture of grinding parts <Preparation of ceramic raw material composition>
Using silicon nitride (Si ₃ N ₄ ) as a ceramic raw material powder, a ceramic raw material composition as a raw material for the matrix of the grinding portion was prepared in the same manner as in Example 5.

<Abrasive grains>
The same single crystal SiC abrasive grains as in Example 1 were used.

<Arrangement of abrasive grains, preparation of molded body>
The above abrasive grains were used, and the abrasive grains were arranged in a mold in the same manner as in Example 5. Next, using the ceramic raw material composition, a molded product was produced in the same manner as in Example 5.
The height, diameter, and weight of the obtained molded product were measured to determine the bulk density of the molded product.

<Sintering>
In the same manner as in Example 5, the molded body was sintered to obtain a sintered body to be a grinding portion.
The height, diameter, and weight of the obtained sintered body were measured to determine the bulk density of the molded product.

2. 2. Measurement of Abrasive Grain Protrusion Height The protrusion height of the abrasive grains in the sintered body was measured in the same manner as in Example 1.

3. 3. Manufacture of dresser A dresser was manufactured in the same manner as in Example 1 using the above sintered body.

4. Evaluation of dressers For each of the manufactured dressers, the pad grinding speed, pad flatness, and metal element elution amount were evaluated in the same manner as in Example 1.
The above evaluation results are shown in Table 6 together with the particle size and particle size difference of the abrasive grains used and the bulk density of the ceramic matrix.

As is clear from Table 6 above, dressers 51 to 60 having a ground portion containing a sintered ceramic matrix and single crystal abrasive grains directly fixed to the sintered ceramic matrix are manufactured by the manufacturing method of the present invention. We were able to. Further, it was confirmed that the dressers 51 to 60 had an elution amount of the metal element of less than 0.05 mg / L, and there was no risk of metal elution during dressing.

For dressers 52 to 58 having an abrasive particle size of 30 to 2000 μm and a particle size difference of 200 μm or less, the average value of the protrusion height is 250 μm or less, the variation of the protrusion height is 30 μm or less, and the pad grinding speed is 1. Excellent performance of .5 μm / min or more and flatness of 2.5 μm or less was obtained. Further, in the dressers 52 to 56 having an abrasive particle size of 30 to 1000 μm and a particle size difference of 150 μm or less, the average value of the protrusion height is 120 μm or less, the variation of the protrusion height is 20 μm or less, and 2.3 μm or less. Even better flatness was obtained. Further, the dressers 53 to 55 having an abrasive particle size of 100 to 500 μm and a particle size difference of 15 to 80 μm have an average protrusion height of 70 μm or less and a variation in protrusion height of 10 μm or less, which is 2.0 μm / min or more. Even better results such as pad grinding speed and pad flatness of 2.2 μm or less could be achieved.

Comparing the dresser 56 and the dresser 57, the abrasive particle sizes were in the same range, but the particle size difference was as narrow as 50 μm for the dresser 57 compared to 150 μm for the dresser 56. Therefore, the variation in the protrusion height of the abrasive grains was as small as 6.8 μm in the dresser 57, while it was 19.3 μm in the dresser 56 according to the difference. Therefore, the pad flatness of the dresser 57 was better.

Comparing the dresser 59 and the dresser 60, both used abrasive grains having a particle size of 2000 μm, but the particle size difference was 50 μm for the dresser 59 and 360 μm for the dresser 60. According to this difference in particle size, the variation in the protrusion height of the abrasive grains was smaller in the dresser 59 than in the dresser 60, and the flatness of the dresser 59 was improved. Further, according to the difference in the particle size of the abrasive grains, the variation in the protrusion height of the dresser 60 became large as 48.2 μm, and the pad grinding speed decreased by 13% from 13.7 μm / min to 11.9 μm / min. On the other hand, with the dresser 59, the decrease was only 5.4% from 12.9 μm / min to 12.2 μm / min. Since the variation in the protrusion height was within 30 μm in the dressers 51 to 58, the deterioration of the pad grinding speed was limited to 10% or less.

In addition, when the surface of the dresser was observed with a stereomicroscope 10 hours after the start of grinding of the pad for any of the dressers, no chipping or falling off of abrasive grains was observed.

(Example 7: Dresser 61-63)
1. 1. Manufacture of grinding parts <Preparation of ceramic raw material composition>
Silicon carbide (SiC) was used as a ceramic raw material powder to prepare a ceramic raw material composition as a raw material for the matrix of the grinding unit in the same manner as in Example 1.

<Abrasive grains>
Polycrystalline SiC abrasive grains were produced.
A ceramic sintered body was produced in the same manner as in the matrix of Example 1 except that abrasive grains were not used. The produced ceramics sintered body was cut to a thickness of about 1 mm with a diamond cutter, and the thinly cut ceramics were pulverized using an agate mortar.
Using a sieve in the same manner as in Example 1, three types of abrasive grains having particle sizes of 106 to 125 μm, 180 to 212 μm, and 425 to 500 μm were obtained.

<Arrangement of abrasive grains, preparation of molded body>
The above abrasive grains were used, and the abrasive grains were arranged in a mold in the same manner as in Example 1. Next, using the ceramic raw material composition, a molded product was produced in the same manner as in Example 1.
The height, diameter, and weight of the obtained molded product were measured to determine the bulk density of the molded product.

<Sintering>
In the same manner as in Example 1, the molded body was sintered to obtain a sintered body to be a grinding portion.
The height, diameter, and weight of the obtained sintered body were measured to determine the bulk density of the molded product.

2. 2. Measurement of Abrasive Grain Protrusion Height The protrusion height of the abrasive grains in the sintered body was measured in the same manner as in Example 1.

3. 3. Manufacture of dresser A dresser was manufactured in the same manner as in Example 1 using the above sintered body.

4. Evaluation of dressers For each of the manufactured dressers, the pad grinding speed, pad flatness, and metal element elution amount were evaluated in the same manner as in Example 1.
The above evaluation results are shown in Table 7 together with the particle size and particle size difference of the abrasive grains used and the bulk density of the ceramic matrix.

As is clear from Table 7 above, even if polycrystalline abrasive grains are used, a grinding unit containing a sintered ceramic matrix and abrasive grains directly fixed to the sintered ceramic matrix by the production method of the present invention. It was possible to manufacture dressers 61 to 63 having the above. Further, it was confirmed that the dressers 61 to 63 had an elution amount of the metal element of less than 0.05 mg / L, and there was no risk of metal elution during dressing.

The polycrystalline abrasive grains used in the dressers 61 to 63 are abrasive grains having the same particle size and made of the same compound (SiC) as the single crystal abrasive grains of the dressers 3 to 5. The pad grinding speed of the dressers 61 to 63 after 5 minutes to 1 hour was as good as 2.1 μm / min, but was lower than that of the dressers 3 to 5. Specifically, the comparison between the dresser 61 and the dresser 3 was 16%, the comparison between the dresser 62 and the dresser 4 was 19%, and the comparison between the dresser 63 and the dresser 5 was 18%. Further, the deterioration of the pad grinding speed was also larger in the polycrystalline one than in the case of the single crystal SiC abrasive grains, which was 24% in the dresser 61, 23% in the dresser 62, and 22% in the dresser 63.

It is probable that the grinding force of the abrasive grains decreased, but the pad flatness also tended to deteriorate slightly as compared with the dresser using the single crystal abrasive grains. However, when the surface of the dresser was observed with a stereomicroscope 10 hours after the start of grinding, no abrasive grains were chipped or dropped.

(Example 8: Dresser 64-66)
1. 1. Manufacture of grinding parts <Preparation of ceramic raw material composition>
Using silicon carbide (SiC) as a ceramic raw material powder, a ceramic raw material composition used as a raw material for the matrix of the grinding portion was prepared in the same manner as in Example 1.

<Abrasive grains>
The same single crystal SiC abrasive grains as in Example 1 having a particle size of 425 to 500 μm were used.

<Arrangement of abrasive grains, preparation of molded body>
The above abrasive grains were used, and the abrasive grains were arranged in a mold in the same manner as in Example 1. Next, using the ceramic raw material composition, a molded product was produced in the same manner as in Example 1.
The height, diameter, and weight of the obtained molded product were measured to determine the bulk density of the molded product.

<Sintering>
The molded product was sintered in the same manner as in Example 1 except that the firing conditions were changed to 1000 ° C., 1500 ° C., or 1950 ° C. in an Ar atmosphere for 4 hours to obtain a sintered body to be a grinding portion. ..
The height, diameter, and weight of the obtained sintered body were measured to determine the bulk density of the molded product.

2. 2. Measurement of Abrasive Grain Protrusion Height The protrusion height of the abrasive grains in the sintered body was measured in the same manner as in Example 1.

3. 3. Manufacture of dresser A dresser was manufactured in the same manner as in Example 1 using the above sintered body.

4. Evaluation of dressers For each of the manufactured dressers, the pad grinding speed, pad flatness, and metal element elution amount were evaluated in the same manner as in Example 1.
The above evaluation results are shown in Table 8 together with the particle size and particle size difference of the abrasive grains used and the bulk density of the ceramic matrix.

In the dresser 64 and the dresser 65, which were sintered at a temperature (1000 ° C. and 1450 ° C.) at which the used ceramic raw material composition could not be sintered, the sintering of the matrix SiC did not proceed, and the volume shrinkage of the matrix was performed. Did not occur. Therefore, the abrasive grains did not protrude, and the dresser of the present invention could not be obtained. Therefore, the subsequent evaluation was stopped.

On the other hand, in the dresser 66 obtained by sintering at a temperature (1950 ° C.) at which the ceramic raw material composition can be sintered, the matrix SiC was sintered and the volume shrinkage of the matrix occurred. Therefore, it was possible to obtain the dresser of the present invention in which the abrasive grains protruded. Further, it was confirmed that the dresser 66 had an elution amount of the metal element of less than 0.05 mg / L, and there was no risk of metal elution during dressing.

Comparing the dresser 66 with the dresser 5 using the same ceramic raw material composition and abrasive grains, the dresser 66 has a sintering temperature set to be 200 ° C. lower than that of the dresser 5, so that the bulk density after sintering is higher than that of the dresser 5. with respect to 3.09g / cm ^3, it was 2.97g / cm ^3. As described above, in the dresser 66, the volume shrinkage due to sintering was reduced, and the average value of the abrasive grain protrusion height was also reduced to 51.3 μm as compared with 61.5 μm of the dresser 5.

In the dresser 66, the deterioration of the pad grinding speed remained within 10%, and the pad flatness was excellent at 2.2 μm. Further, 10 hours after the start of grinding, the surface of the dresser was observed with a stereomicroscope, and no abrasive grains were chipped or dropped.

(Example 9: Integrated dresser 67)
1. 1. Manufacture of grinding parts <Preparation of ceramic raw material composition>
Boron carbide (B 4 _C) was used as the ceramic raw material powder, as in Example 3, to prepare a ceramic material composition as the raw material of the matrix phase of the grinding unit.

<Abrasive grains>
Particle size 425～500Myuemu, was prepared the same single crystal boron carbide _(B 4 C) abrasive grain of Example 2.

<Molding>
A molded product was produced using a die having an outer diameter of 150 mm, an inner diameter of 100 mm, and a height of 70 mm, a lower punch (fixed) having an outer diameter of 100 mm and a height of 10 mm, and an upper punch (movable) having an outer diameter of 100 mm and a height of 80 mm.

Abrasive grains were placed on the lower punch. The abrasive grains were arranged as follows.
A resin-based double-sided tape was attached on the lower punch, and the abrasive grains were placed on the resin so that the abrasive grains were located at the apex of the square. Specifically, since the abrasive particle size is 425 to 500 μm, a through hole having a diameter of 600 μm is formed in a 100 μm-thick stainless steel plate so that only one abrasive grain can be inserted. The arrangement of the through holes was such that the length of one side of the square was located at the apex of the square at an interval of 1500 μm, which corresponds to 2.5 times the diameter of the through hole of 600 μm. The abrasive grains were placed on the double-sided tape using the perforated stainless steel plate thus prepared. However, the abrasive grains were not arranged in the region 3 mm inward from the outermost circumference of the lower punch having a diameter of 100 mm.

<Making a molded product>
Next, 150 g of a granulated product made of the ceramic raw material composition prepared above was inserted into the die from above the abrasive grains so that the arrangement of the abrasive grains was not displaced. Then, the upper punch was put into the die from above, and a pressure of 250 kgf / cm ² was applied to prepare a molded product in which abrasive grains were further embedded in the surface layer portion of the molded product. Further, cold isotropic pressure (CIP) was applied to the molded product to apply a pressure of 1500 kgf / cm ² to obtain a molded product for sintering.
The height, diameter, and weight of the obtained molded product were measured to determine the bulk density of the molded product.

<Sintering>
The molded body was sintered in the same manner as in Example 3 to obtain a dresser in which the substrate and the ground portion were integrated.
The height, diameter, and weight of the obtained sintered body were measured to determine the bulk density of the molded product.

2. 2. Measurement of Abrasive Grain Protrusion Height The protrusion height of the abrasive grains in the sintered body was measured in the same manner as in Example 1.

3. 3. Evaluation of Dresser The pad grinding speed, pad flatness, and metal element elution amount of the manufactured integrated dresser were evaluated in the same manner as in Example 1.
However, in the evaluation of pad grinding speed and flatness, the load by the pressurizing mechanism was set to 2 kg (equivalent to 25.5 g / cm ^{2 in} the surface pressure of the dresser).
The above evaluation results are shown in Table 9 together with the particle size and particle size difference of the abrasive grains used and the bulk density of the ceramic matrix.

As is clear from Table 9 above, according to the manufacturing method of the present invention, the dresser 67 of the present invention in which the substrate and the ground portion are integrated and the abrasive grains are projected from the ceramic matrix and substrate can be manufactured. .. It was confirmed that the dresser 67 had an elution amount of the metal element of less than 0.05 mg / L, and there was no risk of metal elution during dressing.

The average value of the protrusion height of the abrasive grains was 70 μm or less, the variation of the protrusion height was 10 μm or less, and a fast pad grinding speed of 2.0 μm / min or more and excellent pad flatness of 2.2 μm or less were obtained. Moreover, the deterioration of the pad grinding speed remained within 10%.
The surface of the dresser was observed with a stereomicroscope 10 hours after the start of grinding, but no abrasive grains were chipped or dropped.

(Example 10: Dresser 68-70)
1. 1. Manufacture of grinding parts <Preparation of ceramic raw material composition>
Aluminum nitride (AlN) was used as a ceramic raw material powder to prepare a ceramic raw material composition as a raw material for the matrix of the grinding part.
Added to aluminum nitride powder having an average particle size of 1.3 .mu.m, a binder material was added _Y 2 _{O 3} powder having an average particle diameter of 0.3 [mu] m 5%. Further, an organic binder and ethanol were added as a solvent, and the mixture was stirred and mixed with a ball mill to obtain a slurry. Using the spray-drying method, a granulated product made of a ceramic raw material composition having an average particle size of 61 μm was obtained from the obtained slurry.

<Abrasive grains>
Particle size 106～125Myuemu, was used 180～212Myuemu, the 425～500Myuemu, the same single crystal _{B 4} C grains as in Example 2.

<Arrangement of abrasive grains, preparation of molded body>
The above abrasive grains were used, and the abrasive grains were arranged in a mold in the same manner as in Example 1. Next, a molded product was produced in the same manner as in Example 1 except that 9.4 g of the ceramic raw material composition was used.
The height, diameter, and weight of the obtained molded product were measured to determine the bulk density of the molded product.

<Sintering>
The molded product was sintered in the same manner as in Example 1 except that the sintering conditions were changed to 1800 ° C. and N ₂ atmosphere for 5 hours to obtain a sintered body to be a ground portion.
The height, diameter, and weight of the obtained sintered body were measured to determine the bulk density of the molded product.

2. 2. Measurement of Abrasive Grain Protrusion Height The protrusion height of the abrasive grains in the sintered body was measured in the same manner as in Example 1.
3. 3. Manufacture of dresser A dresser was manufactured in the same manner as in Example 1 using the above sintered body.

4. Evaluation of dressers For each of the manufactured dressers, the pad grinding speed, pad flatness, and metal element elution amount were evaluated in the same manner as in Example 1.
The above evaluation results are shown in Table 10 together with the particle size and particle size difference of the abrasive grains used and the bulk density of the ceramic matrix.

As is clear from Table 10 above, dressers 68 to 70 having a grinding portion including a sintered ceramic matrix and single crystal abrasive grains directly fixed to the sintered ceramic matrix are manufactured by the manufacturing method of the present invention. We were able to. Further, it was confirmed that the dressers 68 to 70 had an elution amount of the metal element of less than 0.05 mg / L, and there was no risk of metal elution during dressing.

Dressers 68 to 70 having an abrasive particle size of 100 to 500 μm and a particle size difference of 15 to 80 μm have an average protrusion height of 70 μm or less, a variation in protrusion height of 10 μm or less, and a pad of 2.0 μm / min or more. Excellent results such as grinding speed and pad flatness of 2.2 μm or less could be achieved.

When the surface of the dresser was observed with a stereomicroscope 10 hours after the start of grinding of the pad for each dresser, three abrasive grains were found to fall off, but the level did not immediately affect the practical use. This is a material in which aluminum nitride used as a ceramic raw material powder has a lower fracture toughness value than silicon carbide, boron carbide, and silicon nitride, and Y ₂ O ₃ used as a binder material is B ₄ which is an abrasive grain. Since the compound has a slightly low bondability with C, cracks are likely to occur in the vicinity of the abrasive grains of the ceramic matrix during use, and it is considered that the abrasive grains fall off when the force applied to the abrasive grains is large. However, even with such a combination of ceramic raw material powder, binder material and abrasive grains, a practical dresser could be produced.

(Reference example: Dresser 71-73)
1. 1. Manufacture of grinding parts <Preparation of ceramic raw material composition>
Aluminum nitride (AlN) was used as a ceramic raw material powder to prepare a ceramic raw material composition as a raw material for the matrix of the grinding part.
To the aluminum nitride powder having an average particle size of 0.6 μm, 0.08% of CaO powder having an average particle size of 5 μm and 3.8% of NiO powder having an average particle size of 1 μm were added as binder materials. Further, an organic binder and ethanol were added as a solvent, and the mixture was stirred and mixed with a ball mill to obtain a slurry. Using the spray-drying method, a granulated product made of a ceramic raw material composition having an average particle size of 57 μm was obtained from the obtained slurry.

<Abrasive grains>
The same single crystal SiC abrasive grains as in Example 1 having a particle size of 106 to 125 μm, 180 to 212 μm, and 425 to 500 μm were used.

<Arrangement of abrasive grains, preparation of molded body>
Using the above-mentioned abrasive grains, the abrasive grains were arranged in a mold in the same manner as in Example 10, and a molded product was produced in the same manner as in Example 10.
The height, diameter, and weight of the obtained molded product were measured to determine the bulk density of the molded product.

<Sintering>
The molded product was sintered in the same manner as in Example 1 except that the sintering conditions were changed to 1800 ° C. and N ₂ atmosphere for 3 hours to obtain a sintered body to be a ground portion.
The height, diameter, and weight of the obtained sintered body were measured to determine the bulk density of the molded product.

2. 2. Measurement of Abrasive Grain Protrusion Height The protrusion height of the abrasive grains in the sintered body was measured in the same manner as in Example 1.

3. 3. Manufacture of dresser A dresser was manufactured in the same manner as in Example 1 using the above sintered body.

4. Evaluation of dressers For each of the manufactured dressers, the pad grinding speed, pad flatness, and metal element elution amount were evaluated in the same manner as in Example 1.
The above evaluation results are shown in Table 11 together with the particle size and particle size difference of the abrasive grains used and the bulk density of the ceramic matrix.

As is clear from Table 11 above, dressers 71 to 73 having a grinding portion including a sintered ceramic matrix and single crystal abrasive grains directly fixed to the sintered ceramic matrix are manufactured by the manufacturing method of the present invention. We were able to. Further, it was confirmed that the dressers 71 to 73 all had an elution amount of the metal element of less than 0.05 mg / L, and there was no risk of metal elution during dressing. In addition, the dressers 71 to 73 having an abrasive particle size of 100 to 500 μm and a particle size difference of 15 to 80 μm have an average protrusion height of 70 μm or less and a variation in protrusion height of 10 μm or less, which is 2.0 μm / min or more. We were able to achieve the pad grinding speed of.

For each dresser, the pad could be ground without any problem for 1 hour from the start of pad grinding. However, since an abnormality was observed in the contact between the dresser and the pad about 2 hours after the start of grinding, the dresser was stopped halfway and the surface of the dresser was observed with a stereomicroscope. As a result, many abrasive grains were dropped off, so the evaluation was discontinued. This is because aluminum nitride used as a ceramic raw material powder has a lower fracture toughness value than silicon carbide, boron carbide, and silicon nitride, and CaO and NiO used as binder materials have a strong bonding force with SiC abrasive grains. It is probable that there was almost no abrasive grains and the abrasive grains were simply held by the anchor effect.

INDUSTRIAL APPLICABILITY According to the present invention, a method for manufacturing a dresser that suppresses elution of metal elements, further reduces variation in the protrusion height of abrasive grains, and simultaneously realizes excellent pad grinding speed and pad flatness, and the dresser provides the dresser. Will be done. The dresser according to the present invention can be applied to dressing of polishing pads of various polishing devices.

20 Substrate 30 Grinding part 31 Abrasive grain 32 Ceramic matrix 33 Abrasive grain part H1, H2 Height of ceramic matrix of molded body before firing h1, h2 Height of ceramic matrix of sintered body after firing p Abrasive grains Overhang height

Claims (20)

A method for manufacturing a dresser for abrasive cloth, which comprises a grinding portion including a matrix made of sintered ceramics and abrasive grains directly fixed to the matrix.
A process of preparing a ceramic raw material composition containing a ceramic raw material powder and a binder material,
The process of arranging the abrasive grains on the bottom surface of the molding die,
The ceramic raw material composition is filled in the cavity of the molding die, and the pressure is applied so that the arrangement of the abrasive grains does not change to obtain a molded product in which the abrasive grains are embedded in the ceramic raw material composition. Process and
The molded body is fired under the condition that the ceramic raw material composition is sintered, the ceramic raw material composition is sintered, and a part of the abrasive grains is projected onto the surface of the molded body to obtain a sintered ceramic matrix. And a step of obtaining a ground portion containing the abrasive grains directly fixed to the sintered ceramic matrix.
A method for manufacturing a dresser for abrasive cloth. The production method according to claim 1, wherein the firing is carried out at a temperature of 1200 ° C. or higher and 2300 ° C. or lower for a time of 1 hour or more and 8 hours or less. The production method according to claim 1 or 2, wherein the binder material is a compound that can be chemically bonded to each of the ceramic raw material powder and the abrasive grains. The production method according to any one of claims 1 to 3, wherein the average particle size d3 of the abrasive grains is 20 μm or more and 3000 μm or less. The production method according to any one of claims 1 to 4, wherein the abrasive grains are single crystal abrasive grains. The monocrystalline abrasive grains are SiC or B _{4 C,} The method according to claim 5. The production method according to any one of claims 1 to 6, wherein the ceramic raw material powder is SiC, B ₄ C, or Si ₃ N ₄ . The manufacturing method according to any one of claims 1 to 7, wherein the protrusion height of the abrasive grains in the grinding portion has an average value of 2 μm or more and 300 μm or less. A dresser for abrasive cloth manufactured by the method according to any one of claims 1 to 8. A dresser for polishing cloth provided with a grinding portion containing a sintered ceramic matrix and abrasive grains fixed to one side of the sintered ceramic matrix.
The sintered ceramic matrix contains a ceramic raw material powder and a binder material.
The abrasive grains are single crystal abrasive grains and are directly fixed to the sintered ceramic matrix.
The average value of the protrusion height of the abrasive grains is 2 μm or more and 300 μm or less.
Dresser for abrasive cloth. The dresser for polishing cloth according to claim 10, wherein the average particle size d3 of the abrasive grains is 20 μm or more and 3000 μm or less. The dresser for a polishing cloth according to claim 10 or 11, wherein the abrasive grains are SiC or B ₄ C. The dresser for a polishing pad according to any one of claims 10 to 12, wherein the ceramic raw material powder is SiC, B ₄ C, or Si ₃ N ₄ . The dresser for a polishing cloth according to any one of claims 10 to 13, wherein the combination of the ceramic raw material powder, the abrasive grains, and the binder material is any one of the following (I) to (IV).
(I) is the ceramic raw material powder is SiC, said a abrasive grain SiC, the binder material is _B 4 C, BN, C, at least one selected from the group consisting of _Al 2 _{O 3} and rare earth oxides is there,
(II) The ceramic raw material powder is SiC, the abrasive grains are B ₄ C, and the binder material is at least one selected from the group consisting of Al ₂ O ₃ and rare earth oxides.
(III) The ceramic raw material powder is B ₄ C, the abrasive grains are SiC or B ₄ C, and the binder material is SiO ₂ , Al N, C, Si ₃ N ₄ and Si Al ₆ O ₂ N _6. At least one selected from the group,
(IV) The ceramic raw material powder is Si ₃ N ₄ , the abrasive grains are SiC or B ₄ C, and the binder is Al ₂ O ₃ , rare earth oxide, MgO, SiO ₂ , TiO ₂ , ZrO ₂ , It is at least one selected from the group consisting of HfO ₂ , TiSi ₂ , ZrSi ₂ , AlN and SiAl ₆ O ₂ N ₆ . The dresser for polishing cloth according to any one of claims 10 to 14, wherein the shape of the ground portion is circular or polygonal, and the diameter corresponding to the circle is 5 mm or more and 200 mm or less. The dresser for polishing cloth according to any one of claims 10 to 15, wherein the thickness of the ground portion is 1 mm or more and 20 mm or less. The dresser for a polishing cloth according to any one of claims 10 to 16, further comprising a substrate of the sintered ceramic matrix connected to a surface opposite to the surface on which the abrasive grains are fixed. The dresser for polishing cloth according to claim 17, wherein the shape of the substrate is circular or polygonal, and the diameter corresponding to the circle is 30 mm or more and 500 mm or less. The dresser for polishing cloth according to claim 17 or 18, wherein the thickness of the substrate is 5 mm or more and 30 mm or less. The dresser for a polishing cloth according to any one of claims 17 to 19, wherein at least the substrate is coated with chemical resistance.