CN107538360A - Cut grinding tool - Google Patents
Cut grinding tool Download PDFInfo
- Publication number
- CN107538360A CN107538360A CN201710397603.3A CN201710397603A CN107538360A CN 107538360 A CN107538360 A CN 107538360A CN 201710397603 A CN201710397603 A CN 201710397603A CN 107538360 A CN107538360 A CN 107538360A
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- Prior art keywords
- boron
- grinding tool
- average grain
- grain diameter
- cutting
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
- B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention provides the cutting grinding tool that can improve processing quality.Cutting grinding tool (1) is configured to include the boron compound (1B) for the average grain diameter for being less than boron-doped diamond (1A) as the boron-doped diamond (1A) of abrasive particle and possessed average grain diameter.
Description
Technical field
The present invention relates to the cutting grinding tool cut substrate.
Background technology
In order to cut the substrate being made up of hard-brittle material, the cutting grinding tool for including boron-doped diamond has been used
(with reference to patent document 1).Boron-doped diamond has solid lubricity, thus has and suppress to produce due to machining at processing stand
Raw heat release, suppress grinding tool consumption effect.
In addition, in existing cutting grinding tool, in order that caused processing heat effectively discharges from processing stand due to cutting
To cutter side, filler is used as using the good SiC of heat transfer (carborundum) or GC (green silicon carbide).
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2012-086291 publications
The content of the invention
Invent problem to be solved
But in the cutting grinding tool described in patent document 1, collapse damage (Chipping) aspect in substrate back in processing
There is room for improvement.In addition, for cutting grinding tool, also need to improve productivity ratio while processing quality is improved, for
For grinding tool, it is desirable to which work in-process keeps high-lubricity, suppresses the generation of heat.
The present invention be in view of such situation and complete, its object is to provide can improve processing quality cutting mill
Tool.
Means for solving the problems
In order to solve above-mentioned problem and reached purpose, cutting grinding tool of the invention is characterised by that it includes boron-doping Buddha's warrior attendant
Stone and boron compound, average grain diameter possessed by the boron compound are less than the average grain diameter of above-mentioned boron-doped diamond.
In above-mentioned cutting grinding tool, the average grain diameter of above-mentioned boron compound can relative to the average grain diameter of above-mentioned boron-doped diamond
Think less than more than 1/6 1.
In above-mentioned cutting grinding tool, the average grain diameter of above-mentioned boron compound can relative to the average grain diameter of above-mentioned boron-doped diamond
Think less than more than 2/9 8/9.
In above-mentioned cutting grinding tool, above-mentioned boron compound can be boron carbide (B4) or cubic boron nitride (cBN) C.
Invention effect
The cutting grinding tool of the present invention, which includes, is used as the abrasive particle performance boron-doped diamond of function and smaller than boron-doped diamond extremely
There is the boron compound of lubricity less, it is thus possible to which damage is collapsed in suppression, it is possible to increase processing quality.
Brief description of the drawings
Fig. 1 is the stereogram of the structure of the topping machanism for the cutting grinding tool for showing to possess embodiment.
Fig. 2 is the sectional view of one of the machined object of the cutting grinding tool of embodiment.
Fig. 3 is the stereogram for decomposing the cutting unit of the topping machanism shown in Fig. 1 to represent.
Fig. 4 is the sectional view to represent by the part amplification of the cutting grinding tool of embodiment.
Fig. 5 is to show boron-doped diamond and by B4The average grain diameter for the boron compound that C is formed is than different cutting grinding tools
Cut the figure of result.
Embodiment
The mode (embodiment) for implementing the present invention is described in detail referring to the drawings.The present invention is not by following
The restriction of content described in embodiment.In addition, following record structural element include those skilled in the art can
Structural element, substantially the same structural element being readily apparent that.In addition, following described structure can be combined as.
And various omissions, displacement or change can be carried out to structure in the range of main points of the present invention are not departed from.
[embodiment]
The cutting grinding tool to embodiment illustrates referring to the drawings.Fig. 1 is the cutting grinding tool for showing to possess embodiment
Topping machanism structure stereogram, Fig. 2 be embodiment cutting grinding tool machined object the sectional view of one, Fig. 3
It is the stereogram for decomposing the cutting unit of the topping machanism shown in Fig. 1 to represent.The pie graph 1 of cutting grinding tool 1 of embodiment
Shown topping machanism 100.
Topping machanism 100 carries out machining to machined object W, as shown in figure 1, consisting of comprising chuck table 10
With cutting unit 20.Topping machanism 100 is further equipped with：Box lift (not shown), it is loaded before and after receiving machining
Machined object W box 30, interim placement section 40, it temporarily loads the machined object W and cleaning part 50 before and after machining,
It is cleaned to the machined object W after machining.Topping machanism 100 is further equipped with：X-axis mobile unit (not shown),
Its make chuck table 10 and cutting unit 20 relatively moved along X-direction, Y-axis mobile unit (not shown), it makes chuck work
Make platform 10 and cutting unit 20 is relatively moved along Y direction and Z axis mobile unit (not shown), it makes chuck table 10
Relatively moved with cutting unit 20 along Z-direction.
Chuck table 10 is the holding station kept to machined object W.In chuck table 10, the portion on surface is formed
It is the disc-shape formed by porous ceramics etc. to divide, and is connected through vacuum suction path (not shown) with vacuum suction source (not shown)
Connect, the machined object W for being placed in surface is aspirated, thus machined object W is kept.Chuck table 10 is set
Into the machining area PR that taking out of near box 30 is moved near region TR and cutting unit 20 using X-axis mobile unit along X-axis
Move freely while be arranged to rotate freely around central axis (parallel with Z axis) using base station driving source (not shown) in direction.
Herein, machined object W is the processing object being processed using topping machanism 100, in the present embodiment, is added
Work thing W is using the semiconductor wafer as mother metal such as silicon, sapphire, SiC, gallium, CSP (chip size packages, Chip Size
Package) substrate, the plate-shaped member being made up of glass, resin etc..For machined object W, for example, will with formed with multiple
The back side of the opposite side in surface of the device-side of device is pasted onto on cutting belt T, and the cutting belt T after being pasted with machined object W is glued
It is attached on framework F, so as to which machined object W is fixed on into framework F.
The cutting grinding tool 1 of embodiment is to the base being made up of pyrex, ceramics or quartz as machined object W
It is suitable during plate progress machining.The cutting grinding tool 1 of embodiment enters to the machined object W of one as shown in Figure 2
Row machining is particularly suitable, and machined object W is substrate SB, is more than 0.1mm by thickness and is below 0.3mm boron
Silicate glasses are formed, and in one side formed with film FL.In machined object W shown in Fig. 2, due to substrate SB coefficient of thermal expansion with
Film FL coefficient of thermal expansion is mutually different, thus warpage increases, and when using the progress machining of grinding tool 1 is cut, easily occurs broken
Split and collapse damage.Machined object W can also form the coefficient of expansion film FL different from substrate SB on substrate SB two sides.Such case
Under, there is the trend that warpage further increases.The cutting grinding tool 1 of embodiment shows that the machined object W of one enters in Fig. 2
During row machining, it can suppress to rupture and collapse the generation of damage.
The machined object W that several pieces cleaved band T are pasted on framework F is accommodated in box 30.Box elevating mechanism lifts along Z-direction
The apparatus main body 2 of topping machanism 100 is arranged at freely.
Interim placement section 40 takes out the machined object W before a piece of machining from box 30, and by the quilt after machining
Machining object W is enclosed in box 30.Interim placement section 40 is configured to include：Take out of and move into unit 41, it is by the quilt before machining
Machining object W is taken out from box 30, and the machined object W after machining is inserted into box 30；And a pair of tracks 42, they
The temporarily machined object W before and after mounting machining.By taking out of the cutting moved into unit 41 and be temporarily positioned in a pair of tracks 42
Machined object W before processing is transported to chuck table 10 by the 1st transport unit 61.
The machined object W after machining is transported using the 2nd transport unit 62, cleaning part 50 adds to the cutting moved
Machined object W after work is cleaned.These the 1st and the 2nd transport unit 61,62 are respectively structured as example adsorbing framework F
Surface carry out lifting, together with framework F lifting machined object W and be transported to desired position.
Cutting unit 20 is arranged on the machining area PR located at apparatus main body 2, and to being held in chuck table 10
Machined object W carry out machining.Cutting unit 20 is arranged to using Z axis mobile unit relative to being maintained at chuck table
10 machined object W is moved freely along Z-direction, and is arranged to using Y-axis mobile unit relative to being maintained at chuck table
10 machined object W is moved freely along Y direction.
As shown in figure 3, cutting unit 20 is configured to comprising cutting grinding tool 1, main shaft 22 and main shaft shell 24.In addition, such as Fig. 3
Shown, cutting unit 20 is configured to comprising fixed flange 26, handling flange 25 and fixing nut 27.Cut grinding tool (cutting tool)
1 forms ring-type with reference to material bonded-abrasive, cuts and is held in the machined object W of chuck table 10 in the case where high speed rotates,
For cutting machined object W.
Main shaft 22 is rotatably supported by tubular main shaft shell 24, and with being linked to the rotation (not shown) of main shaft shell 24
Turn driving source link.Main shaft 22 carries out high speed rotation (thousands of rpm~tens thousand of under the revolving force effect as caused by rotary driving source
rpm)。
Fixed flange 26 is arranged on the front end of main shaft 22 using nut 28.Fixed flange 26 is arranged on the front end of main shaft 22,
And possess cutter base 26b, Yi Ji of the ring-type that outward appearance protrudes for columned convex portion 26a, from convex portion 26a outer peripheral face
The external screw thread 26c that convex portion 26a outer peripheral face is formed.Fixed flange 26 makes convex portion 26a be passed through in cutting grinding tool 1, and cutting is ground
Tool 1 is positioned on cutter base 26b.
Handling flange 25 is formed as ring-type, convex portion 26a is passed through in inner side, and cutting grinding tool 1 is clipped in into the handling flange 25
Between cutter base 26b.Fixing nut 27 is formed as ring-type, is screwed togather in inner peripheral surface formed with the external screw thread 26c with convex portion 26a
Internal thread 27a.The internal thread 27a and external screw thread 26c of fixing nut 27 are screwed togather, cutting grinding tool 1 be sandwiched in cutter base 26b with
Between loading and unloading flange 25, cutting grinding tool 1 and handling flange 25 are fixed on main shaft 22 in this condition.
Next, cutting grinding tool 1 is illustrated referring to the drawings.Fig. 4 is by a part for the cutting grinding tool of embodiment
The sectional view for amplifying to represent.As shown in figure 4, cutting grinding tool 1 includes the boron-doped diamond 1A and boron compound as abrasive particle
1B, boron-doped diamond 1A and boron compound 1B is kneaded and sintered using as the resinoid bond 1C with reference to material, carrys out structure
Into cutting grinding tool 1.
Boron-doped diamond 1A is the diamond abrasive grain doped with boron.Boron compound 1B is boron carbide (B4C) or cube nitridation
Boron (cBN).Average grain diameter possessed by boron compound 1B is less than boron-doped diamond 1A average grain diameter.In embodiments, boron
Compound 1B average grain diameter is more than 1/10 relative to boron-doped diamond 1A average grain diameter and is less than 2/3.Need to illustrate
, average grain diameter refers to the particle diameter at the integrated value 50% in the size distribution obtained using laser diffraction and scattering method.Integration
Particle diameter at value 50% refers to count granule number since the small particle of particle size, is reaching whole granule numbers
Particle diameter at 50%.Boron compound 1B is used as lubricant plays function not as abrasive particle.
Resinoid bond 1C is made up of phenolic resin, epoxy resin or polyimide resin.In addition, the cutting of embodiment
Grinding tool 1 adds the carbon as conductive material of several percentages to form.
Cutting grinding tool 1 for embodiment, relative to based on phenolic resin, epoxy resin or polyimide resin into
The resinoid bond 1C divided, it is mixed into peaceful using volume basis as the boron-doped diamond 1A that 10%~20% average grain diameter is 9 μm
Equal particle diameter is 3 μm by B4The boron compound 1B that C is formed is more than 180 DEG C and small for less than 200 DEG C of sintering temperature sintering 17
Up to 18 hours, cutting grinding tool 1 is formed using thickness as 150 μm.It should be noted that in the cutting grinding tool 1 of embodiment, it is expected
The volume ratio for making boron-doped diamond 1A and boron compound 1B is 2:1 to 1:8 scope.
In the topping machanism 100 of said structure, processing content information is registered in topping machanism 100 (not shown) by operator
Control unit in, have the processing action from operator start instruction in the case of, start processing action.It is dynamic in processing
In work, the machined object W before machining is moved into unit 41 and put temporarily by being taken out of in box 30 using taking out of by topping machanism 100
Portion 40 is put, is positioned in a pair of tracks 42 of interim placement section 40.Topping machanism 100 will be processed using the 1st transport unit 61
Thing W is transported to chuck table 10, and suction keeps being positioned in the machined object W on the surface of chuck table 10.Also, cut
Device 100 moves chuck table 10 using X-axis mobile unit, makes chuck table 10 around central shaft using base station driving source
Line is rotated, and moves cutting unit 20 using Y-axis mobile unit and Z axis mobile unit, and cutting is carried out to machined object W and is added
Work.
Machined object W after machining is transported to cleaning part 50 by topping machanism 100 using the 2nd transport unit 62, profit
After being cleaned with cleaning part 50, the machined object W after cleaning is positioned in interim placement section 40 using the 1st transport unit 61
In a pair of tracks 42.Machined object W after machining is moved into unit 41 and is contained in box 30 using taking out of by topping machanism 100
It is interior.
According to the cutting grinding tool 1 of embodiment, in addition to the boron-doped diamond 1A of function is played mainly as abrasive particle,
Also have in resinoid bond 1C average grain diameter of the average grain diameter less than boron-doped diamond 1A as lubricant plays function
Boron compound 1B, thus can suppress to apply to processed using boron compound 1B lubricity and heat resistance in machining
Thing W impact, it can suppress to produce in machined object W and collapse damage.More specifically, cut in grinding tool 1, due to resinoid bond
There is the boron compound 1B as lubricant plays function, it is thus possible to reduce as collapsing damage caused by bonding agent part in 1C.
As a result, the cutting grinding tool 1 of embodiment can improve machined object W processing quality.It should be noted that closed as boronation
The B that thing 1B is used4In C, due to there are 4 boron relative to 1 carbon, thus (solid) lubricity is relative increases, and and B4C is compared,
It is bigger compared to lubricity, heat resistance in cBN.Therefore, the cutting cut in the glass that damage is collapsed to being easier generation is ground
In tool 1, preferably using B4C is as boron compound 1B；In the cutting grinding tool 1 cut the ceramics such as aluminum oxide, preferably make
Boron compound 1B is used as by the use of cBN.
In addition, in the cutting grinding tool 1 of embodiment, the boron-doped diamond 1A that function is played as abrasive particle is by Buddha's warrior attendant
The boron of lubricity is doped with stone mill grain and is formed.Therefore, mixing for function can be played by being used as abrasive particle by cutting grinding tool 1
Boron diamond 1A itself lubricity and heat resistance come suppress apply to machined object W impact, it is possible to increase process velocity, energy
It is enough to suppress to collapse damage in machined object W generations, while the life-span of cutting grinding tool 1 can be extended.
In the cutting grinding tool 1 of embodiment, in addition to the boron-doped diamond 1A of function is played as abrasive particle, also have flat
The boron compound 1B as lubricant plays function of equal average grain diameter of the particle diameter less than boron-doped diamond 1A, can suppress in quilt
Machining object W, which is produced, collapses damage, thus even in being made up of shown in Fig. 2 substrate SB of the one side formed with film FL, easily produce and break
When splitting or collapse the machined object W progress machinings of damage, it can also suppress to produce in machined object W and collapse damage.
In addition, in the cutting grinding tool 1 of embodiment, because boron compound 1B average grain diameter is relative to boron-doped diamond 1A
Average grain diameter is more than 1/10 and is less than 2/3, thus boron-doped diamond 1A can be cut, and boron compound 1B energy
The function of lubricant is enough given play to.As a result, the cutting grinding tool 1 of embodiment, which can suppress to produce in machined object W, collapses damage.
In addition, in the cutting grinding tool 1 of embodiment, because boron compound 1B is boron carbide (B4) or cubic boron nitride C
(cBN), thus boron compound 1B can be used as lubricant plays function in machining.
Next, the effect of cutting grinding tool 1 of the present inventor for embodiment is confirmed.The present invention's
Inventor determines using boron-doped diamond 1A and by B first4The average grain diameter for the boron compound 1B that C is formed is than different cuttings
Damage size is collapsed when grinding tool 1 is cut the machined object W shown in Fig. 2.Measurement result is shown in Fig. 5.Fig. 5 is to show boron-doping
Diamond with by B4Figure of the average grain diameter for the boron compound that C is formed than the cutting result of different cutting grinding tools.
In the cutting grinding tool 1 used in Fig. 5, the average grain diameter for making boron-doped diamond 1A is 9 μm, and boron compound 1B's is averaged
Particle diameter is 1 μm, 3 μm, 6 μm and 9 μm.In the measure shown in Fig. 5, to the average value for collapsing damage size on machined object W surface
It is determined with the average value for collapsing damage size at the back side.It should be noted that machined object W surface is and machined object W
The opposed face of cutting grinding tool 1, the machined object W back side is the face of the inner side on surface.In Fig. 5, collapsing for surface is damaged into size
Average value is indicated by the solid line, and the average value for collapsing damage size at the back side is represented by dashed line.
According to Fig. 5, make boron-doped diamond 1A average grain diameter be 9 μm, boron compound 1B average grain diameter is 1 μm, 3 μ
M, under 6 μm and 9 μm of either case, the damage size that collapses that can make surface is less than 35 μm, it may thus be appreciated that by grinding cutting
Tool 1 is configured to include the boron compound 1B of the average grain diameter of boron-doped diamond 1A and average grain diameter less than boron-doped diamond 1A, energy
Enough suppress machined object W collapses damage.
In addition, according to Fig. 5, make boron-doped diamond 1A average grain diameter be 9 μm, boron compound 1B average grain diameter be 1 μ
M, under 3 μm, 6 μm and 9 μm of either case, the damage size that collapses that can make surface is less than 35 μm.In addition, according to Fig. 5, pass through
The average grain diameter for making boron compound 1B is more than 1/6 relative to boron-doped diamond 1A average grain diameter and is less than 1, can make the back of the body
The damage size that collapses in face is less than substantially 50 μm.Therefore, it can be seen from Fig. 5, cut in grinding tool 1, by making putting down for boron compound 1B
Particle diameter is more than 1/6 relative to boron-doped diamond 1A average grain diameter and is less than 1, and can suppress machined object W collapses damage.
In addition, according to Fig. 5, by making boron compound 1B average grain diameter relative to boron-doped diamond 1A average grain diameter be more than 2/9
And be less than 8/9, the damage size that collapses that can make the back side is less than substantially 40 μm.Therefore, it can be seen from Fig. 5, cut in grinding tool 1,
It is more than 2/9 relative to boron-doped diamond 1A average grain diameter and is less than 8/9 by the average grain diameter for making boron compound 1B, energy
Enough suppress machined object W collapses damage.
In addition, according to Fig. 5, make boron-doped diamond 1A average grain diameter be 9 μm, boron compound 1B average grain diameter be 3 μ
In the case of m and 6 μm, except make surface collapse damage size be less than 35 μm in addition to, additionally it is possible to make the back side collapse damage size be
Less than 35 μm, it may thus be appreciated that by making boron compound 1B average grain diameter relative to boron-doped diamond 1A average grain diameter be 1/3
Above and it is less than 2/3, can further suppress machined object W collapses damage.
Next, the present inventor is determined using the different cutting grinding tool 1 of abrasive particle to the machined object shown in Fig. 2
Damage size is collapsed when W is cut.Measurement result is listed in table 1.
【Table 1】
| Collapse the generation situation of damage | |
| Product 1 of the present invention | ◎ |
| Comparative example 1 | × |
| Comparative example 2 | × |
| Comparative example 3 | × |
In the product of the present invention 1 of table 1, the average grain diameter as the boron-doped diamond 1A of abrasive particle is 9 μm, by B4The boron that C is formed
Compound 1B average grain diameter is 3 μm.In comparative example 1, the average grain diameter as the diamond of abrasive particle is 9 μm, boronation is not used
Compound 1B.In comparative example 2, the average grain diameter as the diamond of abrasive particle is 9 μm, by B4The boron compound 1B's that C is formed is averaged
Particle diameter is 3 μm.In comparative example 3, the average grain diameter as the boron-doped diamond 1A of abrasive particle is 9 μm, boron compound 1B is not used.
According to the result of table 1, in comparative example 1, the damage size that collapses at surface and the back side is all higher than 100 μm, oversized, thus
It can not determine.In addition, in comparative example 1, in every machined object W of progress cutting, grinding tool wears 450 μm, as cutting
Grinding tool is not preferred.It can be seen from the result of table 1, in comparative example 2 and comparative example 3, the machined object W average value for collapsing damage size is equal
50 μm are approximately reached, can not suppress to collapse damage.According to the result of table 1, relative to comparative example 1 to comparative example 3, product 1 of the present invention can
The damage size that collapses for making surface is less than 35 μm, it may thus be appreciated that by making cutting grinding tool 1 be configured to comprising boron-doped diamond 1A peace
The boron compound 1B of equal average grain diameter of the particle diameter less than boron-doped diamond 1A, can suppress machined object W collapses damage.
Next, the present inventor is determined using cutting grinding tools 1 different boron compound 1B to the quilt shown in Fig. 2
Damage size is collapsed when machining object W is cut.Measurement result is listed in table 2.
【Table 2】
| Collapse the generation situation of damage | |
| Product 1 of the present invention | ◎ |
| Product 2 of the present invention | ○ |
| Comparative example 4 | It can not realize |
In the product of the present invention 1 of table 2, the average grain diameter as the boron-doped diamond 1A of abrasive particle is 9 μm, by B4The boron that C is formed
Compound 1B average grain diameter is 3 μm.In the product of the present invention 2 of table 2, the average grain diameter as the boron-doped diamond 1A of abrasive particle is 9 μ
M, it is 3 μm by the cBN boron compound 1B formed average grain diameter.In the comparative example 4 of table 2, mill is used as using boron-doped diamond 1A
Grain, boron compound 1B is used as using HBN (hexagonal boron).But in comparative example 4, it is difficult to obtain average grain diameter for 1 μm~
The HBN of more than 2 μm of larger average grain diameter, it is difficult to compared with other boron compounds with particle diameter, thus in the same terms
Under be designated as " can not realize ".If the average grain diameter for assuming boron-doped diamond 1A is 3 μm, by the flat of the HBN boron compound 1B formed
Equal particle diameter is 1 μm, then is unsuitable for the machined object W of semiconductor applications cutting mostly.According to the result of table 2, the He of product 1 of the present invention
Product 2 of the present invention can make the damage size that collapses on surface be less than 35 μm, it may thus be appreciated that being closed by the boronation for making to use in cutting grinding tool 1
Thing 1B is by B4C or cBN is formed, and can suppress machined object W collapses damage.
It should be noted that the present invention is not limited to above-mentioned embodiment.I.e., it is possible to the model of present inventive concept is not being departed from
Interior progress various modifications are enclosed to implement.For example, in the cutting grinding tool 1 of above-mentioned embodiment, the boron-doping gold as abrasive particle has been used
Hard rock 1A, it is also possible to use the boron-doped diamond 1A as abrasive particle add diamond or coating after diamond.In addition, cutting mill
Tool 1 be configured to containing the coating as abrasive particle after diamond and average grain diameter less than abrasive particle average grain diameter boronation conjunction
Thing 1B.It should be noted that the diamond after coating is diamond coated using copper (Cu), nickel (Ni), silver-colored (Ag) or titanium (Ti)
Part or all obtained from diamond.
The cutting grinding tool 1 of above-mentioned embodiment is to use resin as the resinoid bond cutter with reference to material, but can also
It is to use vitrified bond to be combined as the vitrified bond cutter with reference to material, using metallic bond as the metal with reference to material
Agent cutter or electroforming bonding agent cutter.
Vitrified bond cutter includes the boron-doped diamond 1A and boron compound 1B as abrasive particle, is by boron-doped diamond 1A
Formed with boron compound 1B using being kneaded and being sintered as the vitrified bond with reference to material.It should be noted that pottery
Porcelain bonding agent is preferably used with silica (SiO2) be principal component and be somewhat mixed with the vitrified bond that feldspar etc. forms.
Metallic bond cutter includes the boron-doped diamond 1A and boron compound 1B as abrasive particle, is by boron-doped diamond 1A
Formed with boron compound 1B using being kneaded and being sintered as the metallic bond with reference to material.It is it should be noted that golden
Category bonding agent preferably use using as the bronze of copper and the alloy of tin as principal component and the micro metal knot for being mixed into cobalt, nickel etc. and forming
Mixture.
Electroforming bonding agent cutter passes through molten in the nickel plating for being mixed with the boron-doped diamond 1A for being used as abrasive particle and boron compound 1B
Periphery progress electroforming in liquid to hub portion is made and formed.
Symbol description
1 cutting grinding tool
1A boron-doped diamonds
1B boron compounds
Claims (3)
1. one kind cutting grinding tool, it includes boron-doped diamond and boron compound, and average grain diameter possessed by the boron compound is less than
The average grain diameter of the boron-doped diamond.
2. cutting grinding tool as claimed in claim 1, wherein, the average grain diameter of the boron compound is relative to the boron-doping Buddha's warrior attendant
The average grain diameter of stone is less than more than 1/6 1.
3. the cutting grinding tool as described in claim 1 or claim 2, wherein, the boron compound is boron carbide or cube nitrogen
Change boron.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016125504A JP2017226057A (en) | 2016-06-24 | 2016-06-24 | Cutting grindstone |
| JP2016-125504 | 2016-06-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107538360A true CN107538360A (en) | 2018-01-05 |
Family
ID=60890783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710397603.3A Pending CN107538360A (en) | 2016-06-24 | 2017-05-31 | Cut grinding tool |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2017226057A (en) |
| KR (1) | KR20180001446A (en) |
| CN (1) | CN107538360A (en) |
| TW (1) | TW201808527A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113500502A (en) * | 2021-09-13 | 2021-10-15 | 盛吉盛(宁波)半导体科技有限公司 | Grinding wheel, grinding device and grinding machine for processing semiconductor epitaxial quartz component |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7258385B1 (en) | 2022-07-19 | 2023-04-17 | 株式会社東京ダイヤモンド工具製作所 | Synthetic whetstone, synthetic whetstone assembly, and synthetic whetstone manufacturing method |
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| US3916584A (en) * | 1973-03-22 | 1975-11-04 | Minnesota Mining & Mfg | Spheroidal composite particle and method of making |
| CN102229122A (en) * | 2011-06-29 | 2011-11-02 | 苏州赛力精密工具有限公司 | Special ceramic bond diamond grinding wheel for grinding diamond |
| CN102398228A (en) * | 2010-09-08 | 2012-04-04 | 株式会社迪思科 | Cutting Grinding Wheel |
| CN102452045A (en) * | 2010-10-18 | 2012-05-16 | 株式会社迪思科 | Grinding wheel |
| US20120260582A1 (en) * | 1997-04-04 | 2012-10-18 | Chien-Min Sung | Brazed Diamond Tools and Methods for Making the Same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012086291A (en) * | 2010-10-18 | 2012-05-10 | Disco Corp | Cutting grinding wheel |
| JP2012140256A (en) * | 2010-12-28 | 2012-07-26 | Sumitomo Electric Hardmetal Corp | Diamond sintered compact and method for producing the same |
-
2016
- 2016-06-24 JP JP2016125504A patent/JP2017226057A/en active Pending
-
2017
- 2017-05-11 TW TW106115665A patent/TW201808527A/en unknown
- 2017-05-31 CN CN201710397603.3A patent/CN107538360A/en active Pending
- 2017-05-31 KR KR1020170067598A patent/KR20180001446A/en not_active Application Discontinuation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3916584A (en) * | 1973-03-22 | 1975-11-04 | Minnesota Mining & Mfg | Spheroidal composite particle and method of making |
| US20120260582A1 (en) * | 1997-04-04 | 2012-10-18 | Chien-Min Sung | Brazed Diamond Tools and Methods for Making the Same |
| CN102398228A (en) * | 2010-09-08 | 2012-04-04 | 株式会社迪思科 | Cutting Grinding Wheel |
| CN102452045A (en) * | 2010-10-18 | 2012-05-16 | 株式会社迪思科 | Grinding wheel |
| CN102229122A (en) * | 2011-06-29 | 2011-11-02 | 苏州赛力精密工具有限公司 | Special ceramic bond diamond grinding wheel for grinding diamond |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113500502A (en) * | 2021-09-13 | 2021-10-15 | 盛吉盛(宁波)半导体科技有限公司 | Grinding wheel, grinding device and grinding machine for processing semiconductor epitaxial quartz component |
| CN113500502B (en) * | 2021-09-13 | 2021-11-30 | 盛吉盛(宁波)半导体科技有限公司 | Grinding wheel, grinding device and grinding machine for processing semiconductor epitaxial quartz component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017226057A (en) | 2017-12-28 |
| TW201808527A (en) | 2018-03-16 |
| KR20180001446A (en) | 2018-01-04 |
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