CN108161773B - Ceramic bond grinding tool - Google Patents
Ceramic bond grinding tool Download PDFInfo
- Publication number
- CN108161773B CN108161773B CN201711112043.9A CN201711112043A CN108161773B CN 108161773 B CN108161773 B CN 108161773B CN 201711112043 A CN201711112043 A CN 201711112043A CN 108161773 B CN108161773 B CN 108161773B
- Authority
- CN
- China
- Prior art keywords
- oxide
- network
- grinding
- vitrified bonded
- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000919 ceramic Substances 0.000 title claims description 12
- 239000000463 material Substances 0.000 claims abstract description 30
- 229910008253 Zr2O3 Inorganic materials 0.000 claims abstract description 15
- 239000006061 abrasive grain Substances 0.000 claims abstract description 15
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims abstract description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052593 corundum Inorganic materials 0.000 claims abstract description 10
- 229910001845 yogo sapphire Inorganic materials 0.000 claims abstract description 10
- FUJCRWPEOMXPAD-UHFFFAOYSA-N Li2O Inorganic materials [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 claims abstract description 8
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 claims abstract description 8
- 239000000654 additive Substances 0.000 claims abstract description 7
- 230000000996 additive effect Effects 0.000 claims abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052681 coesite Inorganic materials 0.000 claims description 7
- 229910052906 cristobalite Inorganic materials 0.000 claims description 7
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 229910052682 stishovite Inorganic materials 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 229910052905 tridymite Inorganic materials 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Inorganic materials [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 claims 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims 2
- NOTVAPJNGZMVSD-UHFFFAOYSA-N potassium monoxide Inorganic materials [K]O[K] NOTVAPJNGZMVSD-UHFFFAOYSA-N 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 24
- 238000005245 sintering Methods 0.000 abstract description 17
- 239000011230 binding agent Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 5
- 239000003082 abrasive agent Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000012530 fluid Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 1
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 1
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007676 flexural strength test Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
Abstract
Provided is a vitrified bonded abrasive tool which has a low sintering temperature, is appropriately consumed by grinding, and maintains mechanical strength and water resistance. The vitrified bonded abrasive tool has abrasive grains and a bonding material, wherein the bonding material contains a network-forming oxide composed of SiO as a main component, an oxide modifying the network as an additive, and an intermediate oxide2、Al2O3And B2O3The oxide for modifying the network contains Na2O、CaO、K2O, BaO, or Li2O, the intermediate oxide is composed of ZnO and Zr2O3And (4) forming.
Description
Technical Field
The present invention relates to a vitrified bond grinding wheel attached to a grinding wheel provided in a grinding device for grinding a workpiece.
Background
The back surface of a wafer having a plurality of devices formed on the surface thereof is ground to thin the wafer to a predetermined thickness, and then the wafer is divided along predetermined lines to be divided, thereby forming device chips. Device chips including devices such as ICs and LSIs are used in large quantities in electronic apparatuses such as mobile phones and personal computers.
A grinding apparatus is used for grinding the back surface of the wafer. The grinding device includes a disc-shaped grinding wheel, a spindle rotatably supporting the grinding wheel, a motor for rotating the spindle, and the like. The grinding wheel is attached with a plurality of grindstones, and these grindstones are brought into contact with a workpiece such as a wafer to grind the workpiece.
As the grinding tool mounted on the grinding wheel, a grinding tool called a vitrified bonded grinding tool is particularly widely used. The vitrified bonded abrasive tool is formed by mixing and sintering a bonding material mainly composed of vitreous and abrasive grains.
In general, when a workpiece is ground by a grinding wheel having a grindstone attached thereto, the bonding material is appropriately consumed, and unused abrasive grains contained in the grindstone are successively exposed from the bonding material, resulting in self-sharpening. Therefore, the grinding performance of the grinding tool is maintained at a certain level. But, for example, with SiO2、Al2O3And B2O3The vitrified bonded abrasive tool of vitreous bonding material having network-forming oxides as a main component is very hard,it is difficult to consume, so that self-sharpening is difficult to sufficiently occur, and it is difficult to keep the grinding performance constant.
In addition, for example, in the case of a vitrified bonded abrasive tool having a bonding material containing the network-forming oxide as a main component, the sintering temperature is usually set to
However, when a vitrified bonded abrasive tool is sintered at a high temperature, the abrasive grains contained in the tool are easily carbonized and deteriorated. Even when grinding is performed using a vitrified bonded grinding wheel in which abrasive grains are deteriorated, the grinding wheel cannot exhibit expected performance.
Therefore, in order to facilitate self-sharpening of the grindstone and to prevent deterioration of the abrasive grains, a technique has been performed in which an oxide for modifying a network is further added to the material of the grindstone to lower the sintering temperature of the vitrified bonded grindstone. If the sintering temperature of the vitrified bonded grinding tool is lowered, the bonding material is likely to be consumed moderately, and self-sharpening of the grinding tool is likely to occur. The oxide for modifying the network may be Na2O、CaO、K2O、BaO、Li2O。
Here, the oxide forming the network has a strong covalent bonding property and is an oxide capable of forming a network structure (glass structure) alone. The oxide having a modified network is an oxide having a modified network structure of an oxide forming a network and having a changed physical or chemical property, and does not form a network structure by itself.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2000-288881
Disclosure of Invention
Problems to be solved by the invention
When such an oxide for modifying a network is added to a binder constituting a vitrified bonded abrasive tool, the mechanical strength of the vitrified bonded abrasive tool is lowered, which is problematic. In addition, in the grinding of a workpiece by a grinding wheel, a grinding fluid is supplied to a portion to be ground of the workpiece, but if an oxide for modifying a network is added to a binder, the water resistance of the vitrified bond grinding wheel is lowered, and the vitrified bond grinding wheel is easily dissolved in the grinding fluid, which is problematic.
The present invention has been made in view of the above problems, and an object of the present invention is to provide a vitrified bonded grinding tool which has a relatively low sintering temperature, is appropriately consumed by grinding, and maintains mechanical strength and water resistance.
Means for solving the problems
According to one aspect of the present invention, there is provided a vitrified bonded abrasive tool having abrasive grains and a bond material, characterized in that the bond material contains a network-forming oxide composed of SiO as a main component, an oxide modifying the network as an additive, and an intermediate oxide2、Al2O3And B2O3The oxide for modifying the network contains Na2O、CaO、K2O, BaO, or Li2O, the intermediate oxide is composed of ZnO and Zr2O3And (4) forming.
In addition, according to another aspect of the present invention, there is provided a vitrified bonded abrasive tool having abrasive grains and a bonding material, characterized in that the bonding material contains a network-forming oxide composed of SiO as a main component, an oxide modifying a network as an additive, and an intermediate oxide2、Al2O3And B2O3The oxide for modifying the network contains Na2O、CaO、K2O, BaO, or Li2O, the intermediate oxide being made of ZnO.
In addition, according to another aspect of the present invention, there is provided a vitrified bonded abrasive tool having abrasive grains and a bonding material, characterized in that the bonding material contains a network-forming oxide as a main component as an additiveNetwork-modifying oxides of agents, and intermediate oxides, the network-forming oxides consisting of SiO2、Al2O3And B2O3The oxide for modifying the network contains Na2O、CaO、K2O, BaO, or Li2O, the intermediate oxide consists of Zr2O3And (4) forming.
Effects of the invention
The vitrified bonded abrasive tool according to one embodiment of the present invention contains a network-forming oxide as a main component and an oxide for modifying the network as an additive. The network-forming oxide is made of SiO2、Al2O3And B2O3The oxide for modifying the network contains Na2O、CaO、K2O, BaO, or Li2And O. By the function of the oxide modifying the network, the sintering temperature of the vitrified bonded abrasive tool can be lowered and the bonding material can be consumed moderately.
In addition, the vitrified bond grinding tool according to one embodiment of the present invention contains ZnO and Zr2O3An intermediate oxide composed of ZnO, or Zr2O3The intermediate oxide of the composition. The intermediate oxide is an oxide capable of forming a network structure or modifying a network structure by making a multicomponent system, but cannot form a network structure alone. When the intermediate oxide is added to the binder of the vitrified bonded abrasive tool, the vitrified bond in which the sintering temperature is lowered by adding the oxide for modifying the network can be maintained to have high mechanical strength and water resistance.
Therefore, according to the present invention, it is possible to provide a vitrified bonded abrasive tool which has a low sintering temperature, is appropriately consumed by grinding, and maintains mechanical strength and water resistance.
Drawings
Fig. 1 is a perspective view schematically showing the structure of a grinding wheel.
Detailed Description
Embodiments of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view schematically showing the structure of a grinding wheel to which the vitrified bonded abrasive tool of the present embodiment is attached.
As shown in fig. 1, the grinding wheel 2 to which the vitrified bonded grinding tool of the present embodiment is attached includes a disk-shaped (annular) base 4 formed of stainless steel, aluminum, or the like. The base 4 has a 1 st surface 4a and a 2 nd surface 4b parallel to each other, and a circular opening 4c penetrating the base 4 from the 1 st surface 4a to the 2 nd surface 4b is formed in the center thereof. A plurality of vitrified bonded abrasives 6 according to the present embodiment are arranged in a ring shape on the 2 nd surface 4b of the base 4.
The grinding wheel 2 is rotated to press the vitrified bond grinding wheel 6 against the surface to be ground of the workpiece, thereby grinding the workpiece. The workpiece is typically a semiconductor wafer, a resin substrate, a ceramic substrate, or the like, but other substrates may be used as the workpiece.
Each vitrified bonded abrasive tool 6 has abrasive grains and a bond material. The abrasive grains are formed of, for example, diamond, CBN (Cubic Boron Nitride), or the like. The abrasive grains may be appropriately selected according to the specifications of the vitrified bonded abrasive tool 6 and the like.
The bond material of the vitrified bonded abrasive tool 6 comprises a network-forming oxide as a main component and an oxide modifying the network as an additive. The network-forming oxide is made of SiO2、Al2O3And B2O3The oxide for modifying the network contains Na2O、CaO、K2O, BaO, or Li2O。
To be composed of SiO2、Al2O3And B2O3The sintering temperature of the vitrified bonded grinding tool made of the conventional bonding material with the network-forming oxide as the main component and the glass is as high as
To the extent of (c). Therefore, the abrasive grains are carbonized during sintering and deteriorated. In addition, the main component is vitreousThe vitrified bonded grinding tool made of the binder according to (1) is extremely hard and hardly worn, so that sufficient self-sharpening is hardly caused and it is difficult to maintain the grinding performance constant.
If it will consist of Na2O、CaO、K2O, BaO, or Li2The oxide formed by O and the like and modifying the network is added into the bonding material, so that the sintering temperature of the ceramic bond grinding tool can be reduced to
When the sintering temperature is lowered, the vitrified bond grinding tool is appropriately consumed in accordance with the grinding work, and self-sharpening can sufficiently occur to maintain a certain grinding performance.
However, the vitrified bonded grinding tool made of the bonding material to which the oxide modifying the network is added has a low mechanical strength and a low water resistance. In grinding of a workpiece, a large force is applied to a vitrified bonded grinding wheel attached to a grinding wheel. During the grinding process, a grinding fluid containing water is supplied to a workpiece portion of the workpiece. Therefore, when grinding is performed using a vitrified bonded grinding wheel having low mechanical strength and water resistance, the vitrified bonded grinding wheel is likely to be damaged.
On the other hand, the vitrified bond grinding tool 6 of the present embodiment includes ZnO and Zr as a binder2O3An intermediate oxide composed of ZnO, or Zr2O3The intermediate oxide of the composition. When the binder includes such an intermediate oxide, the mechanical strength of the vitrified bonded abrasive tool made of the binder to which the oxide modifying the network is added is improved, and the water resistance is also improved.
Therefore, the vitrified bonded grinding tool of the present embodiment has a low sintering temperature, is appropriately consumed during grinding, and has a performance suitable for grinding because mechanical strength and water resistance are maintained.
Examples
In this embodiment, the pairContaining ZnO and Zr2O3An intermediate oxide composed of ZnO, or Zr2O3The formed ceramic bond grinding tool of the intermediate oxide is manufactured by changing the mixing amount of the intermediate oxide. For each intermediate oxide, the mixing amount was changed to make two kinds of the intermediate oxides, and a total of 6 kinds of the vitrified bonded abrasives were manufactured. The water resistance and the breaking strength of each of the produced vitrified bond abrasives were tested.
Will contain ZnO and Zr2O3The names of the constituted vitrified bonded abrasive tools of intermediate oxides are designated "examples 1-1" and "examples 1-2", respectively. The vitrified bonded abrasive tools containing an intermediate oxide composed of ZnO will be referred to by the names "example 2-1" and "example 2-2", respectively. Will contain Zr2O3The names of the constituted vitrified bonded abrasive tools of intermediate oxides are designated "example 3-1" and "example 3-2", respectively. In addition, as a comparative example, a vitrified bonded abrasive tool containing no intermediate oxide was produced. The sample was named "comparative example".
As a material of the vitrified bonded abrasive tool, an oxide forming a network, an oxide modifying the network, and an intermediate oxide were prepared. The materials are mixed by a predetermined method and sintered at a relatively low temperature in the range of 700 to 1000 ℃ to produce a vitrified bonded abrasive tool. The compounding ratio of each material contained in the binder of each ceramic binder is shown in table 1 below.
[ Table 1]
Next, each of the vitrified bond grinding stones was subjected to an experiment for evaluating water resistance and flexural strength.
For the flexural strength test, a hard strength measuring apparatus "AGI-1 kN" manufactured by Shimadzu corporation was used. The pressure rate was set to 1 mm/min, the load capacity was set to 0N to 1kN, and the pressure value at the time of fracture was recorded as the breaking strength by pressing the produced vitrified bond abrasive tool. The bending strength of the vitrified bonded abrasive tool of the comparative example was set to 100, and the relative value of the bending strength of each vitrified bonded abrasive tool of the example at this time was calculated. The relative values of the flexural strength of each vitrified bond abrasive tool are shown in table 2 below.
In the water resistance evaluation test, each of the vitrified bonded abrasives thus produced was immersed in hot water for a certain period of time, and the weight was measured before and after the immersion. In the present test, hot water was used to bring the test environment close to the environment during grinding, considering that the vitrified bonded grinding tool is heated by heat generated during grinding.
First, for each vitrified bond abrasive tool, the weight was measured before immersion in hot water. Next, after immersing in hot water for a predetermined time, the vitrified bond grinding tool was dried, and then the weight was measured again. Then, the solubility was calculated as a value obtained by dividing the weight of each vitrified bond grinding tool before the impregnation by the weight of the grinding tool after the impregnation. Then, the relative value of the solubility of each vitrified bonded abrasive tool of the example at this time was calculated assuming that the value of the solubility of the vitrified bonded abrasive tool of the comparative example was 100.
The smaller the relative value of the solubility, the lower the solubility in the grinding water, the higher the water resistance. That is, the lower the weight change of the vitrified bonded grinding tool, the lower the water resistance. Table 2 below shows the relative values of the solubility of each vitrified bond abrasive tool of the examples.
[ Table 2]
As shown in table 2, it can be seen that: the water resistance and flexural strength of each of the vitrified bonded abrasive articles of the examples including the intermediate oxide were greatly improved as compared to the vitrified bonded abrasive articles of the comparative examples without the intermediate oxide. Therefore, the following steps are carried out: comprising ZnO and Zr2O3Ceramic bonding of examples of structured intermediate oxidesThe abrasive tools (examples 1-1 and 1-2) are particularly high in water resistance and flexural strength.
As described above, it was confirmed that: for the composition containing ZnO and Zr2O3An intermediate oxide composed of ZnO, or Zr2O3The vitrified bonded abrasive tool of the intermediate oxide thus constituted can maintain high mechanical strength and water resistance even when it is produced by sintering at a relatively low temperature.
When grinding is performed using a vitrified bonded grinding tool manufactured at a relatively low sintering temperature, the grinding tool is consumed moderately and self-sharpening is likely to occur. Thus, it was confirmed that: according to one embodiment of the present invention, a vitrified bonded abrasive tool can be provided which has a low sintering temperature, is appropriately consumed by grinding, and maintains mechanical strength and water resistance.
The present invention is not limited to the description of the above embodiments, and can be implemented in various modifications. The structure, method, and the like of the above embodiments can be appropriately modified and implemented without departing from the scope of the object of the present invention.
Description of the symbols
2 grinding wheel
4 base station
4a,4b face
4c opening part
6 ceramic bond grinding tool
Claims (2)
1. A vitrified bonded abrasive tool having abrasive grains and a bond material, characterized in that,
the ceramic bond abrasive tool is used for grinding semiconductor wafers, resin substrates and ceramic substrates,
the bonding material comprises a network-forming oxide as a main component, an oxide modifying the network as an additive, and an intermediate oxide,
the network-forming oxide is made of SiO2、Al2O3And B2O3The structure of the utility model is that the material,
the network-modifying oxide contains Na2O、CaO、K2O, BaO or Li2O，
The intermediate oxide is composed of ZnO and Zr2O3And (4) forming.
2. A vitrified bonded abrasive tool having abrasive grains and a bond material, characterized in that,
the ceramic bond abrasive tool is used for grinding semiconductor wafers, resin substrates and ceramic substrates,
the bonding material comprises a network-forming oxide as a main component, an oxide modifying the network as an additive, and an intermediate oxide,
the network-forming oxide is made of SiO2、Al2O3And B2O3The structure of the utility model is that the material,
the network-modifying oxide contains Na2O、CaO、K2O, BaO or Li2O，
The intermediate oxide consists of Zr2O3And (4) forming.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-237625 | 2016-12-07 | ||
| JP2016237625A JP6854634B2 (en) | 2016-12-07 | 2016-12-07 | Vitrified bond whetstone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108161773A CN108161773A (en) | 2018-06-15 |
| CN108161773B true CN108161773B (en) | 2022-03-11 |
Family
ID=62527001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711112043.9A Active CN108161773B (en) | 2016-12-07 | 2017-11-13 | Ceramic bond grinding tool |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6854634B2 (en) |
| KR (1) | KR20180065909A (en) |
| CN (1) | CN108161773B (en) |
| TW (1) | TWI745471B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111546247B (en) * | 2020-04-30 | 2022-03-25 | 郑州力弘超硬材料有限公司 | Diamond grinding tool low-temperature ceramic bonding agent for optical fiber contact pin and preparation method thereof |
| CN111761525A (en) * | 2020-07-16 | 2020-10-13 | 重庆强泰砂轮制造有限公司 | Grinding wheel under condition of heavy damage to railway rails |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1257051A (en) * | 1998-12-11 | 2000-06-21 | 王永利 | Unfired chromium corundum refractory material products |
| CN101362316A (en) * | 2008-10-06 | 2009-02-11 | 天津大学 | Low-temperature high-strength devitrified glass ceramics bond cubic boron nitride grinding wheel |
| CN102674871A (en) * | 2012-05-14 | 2012-09-19 | 天津大学 | Low-temperature high-strength ceramic bond and preparation method thereof |
| EP2567784A1 (en) * | 2011-09-08 | 2013-03-13 | 3M Innovative Properties Co. | Bonded abrasive article |
| CN103223644A (en) * | 2013-04-10 | 2013-07-31 | 天津大学 | Vitrified bond cubic boron nitride (CBN) grinding wheel for grinding titanium alloy |
| CN104339279A (en) * | 2014-10-09 | 2015-02-11 | 贵州荣清工具有限公司 | Grinding wheel with split dovetail groove structure |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09507169A (en) * | 1993-12-28 | 1997-07-22 | ミネソタ・マイニング・アンド・マニュファクチュアリング・カンパニー | Abrasive grains based on alpha-alumina |
| JP4154067B2 (en) | 1999-04-06 | 2008-09-24 | 株式会社ディスコ | Grinding equipment |
| JP2002018726A (en) * | 2000-07-03 | 2002-01-22 | Fsk Corp | Vitrified bond super-abrasive grinding wheel and its manufacturing method |
| EP1432659A1 (en) * | 2001-08-02 | 2004-06-30 | 3M Innovative Properties Company | Ceramic materials, abrasive particles, abrasive articles, and methods of making and using the same |
| US6609963B2 (en) * | 2001-08-21 | 2003-08-26 | Saint-Gobain Abrasives, Inc. | Vitrified superabrasive tool and method of manufacture |
| EP2505312B1 (en) * | 2007-03-14 | 2015-11-18 | Saint-Gobain Abrasives, Inc. | Method of making a bonded abrasive article |
| KR20120085863A (en) * | 2009-10-27 | 2012-08-01 | 생-고벵 아브라시프 | Vitreous bonded abrasive |
-
2016
- 2016-12-07 JP JP2016237625A patent/JP6854634B2/en active Active
-
2017
- 2017-11-02 TW TW106137927A patent/TWI745471B/en active
- 2017-11-13 CN CN201711112043.9A patent/CN108161773B/en active Active
- 2017-11-30 KR KR1020170162631A patent/KR20180065909A/en not_active Application Discontinuation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1257051A (en) * | 1998-12-11 | 2000-06-21 | 王永利 | Unfired chromium corundum refractory material products |
| CN101362316A (en) * | 2008-10-06 | 2009-02-11 | 天津大学 | Low-temperature high-strength devitrified glass ceramics bond cubic boron nitride grinding wheel |
| EP2567784A1 (en) * | 2011-09-08 | 2013-03-13 | 3M Innovative Properties Co. | Bonded abrasive article |
| CN102674871A (en) * | 2012-05-14 | 2012-09-19 | 天津大学 | Low-temperature high-strength ceramic bond and preparation method thereof |
| CN103223644A (en) * | 2013-04-10 | 2013-07-31 | 天津大学 | Vitrified bond cubic boron nitride (CBN) grinding wheel for grinding titanium alloy |
| CN104339279A (en) * | 2014-10-09 | 2015-02-11 | 贵州荣清工具有限公司 | Grinding wheel with split dovetail groove structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201829714A (en) | 2018-08-16 |
| CN108161773A (en) | 2018-06-15 |
| KR20180065909A (en) | 2018-06-18 |
| TWI745471B (en) | 2021-11-11 |
| JP2018089761A (en) | 2018-06-14 |
| JP6854634B2 (en) | 2021-04-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI300024B (en) | ||
| Pei et al. | Fine grinding of silicon wafers | |
| TW474856B (en) | Vitrified bond tool and method of manufacturing the same | |
| Liu et al. | Grinding wheels for manufacturing of silicon wafers: a literature review | |
| EP2219824B1 (en) | Abrasive processing of hard and/or brittle materials | |
| JP5539339B2 (en) | High porosity vitrified superabrasive product and manufacturing method | |
| JP2018020438A (en) | Abrasive articles and method of forming the same | |
| JP5414706B2 (en) | Superabrasive wheel and grinding method using the same | |
| CN108161773B (en) | Ceramic bond grinding tool | |
| JP2018529539A (en) | Flexible abrasive rotating tool | |
| KR101891189B1 (en) | Polishing tool and manufacturing method thereof and manufacturing method of polished article | |
| TWI707027B (en) | Grinding grindstone | |
| JP2013099831A (en) | Grinding stone | |
| JP5640064B2 (en) | Vitrified bond superabrasive wheel and method of grinding a wafer using the same | |
| JP5419173B2 (en) | Super abrasive wheel and grinding method using the same | |
| KR20180134025A (en) | Vitrified super abrasive grain wheel | |
| TW202339868A (en) | Ceramic bond grinding tool | |
| KR20100009088A (en) | Method for manufacturing diamond grinding tool, diamond grinding tool by the same manufacturing method | |
| JP2003039328A (en) | Metal bond wheel and manufacturing method therefor | |
| JP2010247287A (en) | Manufacturing method for silicon carbide single crystal substrate | |
| JPH04322972A (en) | Binder material for diamond abrasive grain | |
| JP2003309094A (en) | Dresser for processing cmp | |
| JP2022145324A (en) | Vitrified tool and manufacturing method thereof | |
| CN201824482U (en) | Wire used for cutting | |
| JPH0757473B2 (en) | Super Abrasive Wheel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |