CN102229122A - Special ceramic bond diamond grinding wheel for grinding diamond - Google Patents
Special ceramic bond diamond grinding wheel for grinding diamond Download PDFInfo
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- CN102229122A CN102229122A CN2011101792377A CN201110179237A CN102229122A CN 102229122 A CN102229122 A CN 102229122A CN 2011101792377 A CN2011101792377 A CN 2011101792377A CN 201110179237 A CN201110179237 A CN 201110179237A CN 102229122 A CN102229122 A CN 102229122A
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Abstract
The invention belongs to the field of diamond grinding wheels, and particularly relates to a ceramic bond and a method for manufacturing a ceramic bond diamond grinding wheel for grinding a diamond by adopting the ceramic bond. The ceramic bond is prepared from the following raw materials in percentage by weight: silicon dioxide, borax, lithium hydroxide, zinc oxide, calcium oxide and aluminum oxide; and the ceramic bond is obtained through the steps of: mixing the raw materials, then smelting at the high temperature of 1300+/-5 DEG C, cooling, then performing ball milling to prepare ceramic powder, and sieving through a standard sieve of 180 meshes. The ceramic bond provided by the invention has high intensity and a low coefficient of expansion, so that the ceramic bond can be perfectly matched with the adopted ceramic grinding wheel basal body. The diamond grinding wheel manufactured by adopting the ceramic bond has good heat conductivity and heat resistance; and compared with the traditional resin bond diamond grinding wheel, the ceramic bond diamond grinding wheel not only ensures that the diamond is excellently sintered at the temperature of not being carbonized, but also ensures that grinding grains are always at an excellent holding state without falling off when grinding is carried out. The special ceramic bond diamond grinding wheel has the grinding efficiency and service life far higher/longer than that of the traditional grinding wheel, and has a comprehensive benefit which is increased by over 50%.
Description
Technical field
The invention belongs to the skive field, be specifically related to a kind of vitrified bond, and adopt this vitrified bond preparation be used to polish method of ceramic bond diamond emery wheel of diamond.
Background technology
Diamond is the hardest in the world material, and the polishing diamond needs high-rate grinding, and common corundum and silicon carbide abrasive can't be finished.The most traditional method is that the fixing back of two rough diamonds is rotated mill, the not high and loss diamond of this method efficient with opposite direction.
Follow the generation of carbonado, added diamond industry is successively introduced rough diamond processing with resinoid bond skive and metal anchoring agent diamond wheel, but because the resinoid bond non-refractory, bond carbonization during grinding and abrasive particle is come off can not be finished grinding well.Metallic bond then too wraps up because of its abrasive particle and is difficult for finishing, does not reach desirable grinding efficiency.
Ceramic bond diamond emery wheel of the present invention has the advantage of resinoid bond skive and metal anchoring agent diamond wheel and has remedied both deficiency.Be embodied in:
(1) high strength of vitrified bond and low-expansion coefficient have been realized perfect coupling with the pottery grinding wheel base body that is adopted, to making emery wheel expanding with heat and contract with cold can be because of grinding the time cause matrix to separate with grinding layer;
(2) good heat resistance.The sintering temperature of vitrified bond of the present invention is 695 ~ 705 ℃, and only 180 ~ 220 ℃ of the sintering temperatures of resinoid bond.Compare with the resinoid bond skive, bond of the present invention both can guarantee not to be carbonized at diamond under the temperature of (800 ℃) and obtain good sintering, and bond can not be carbonized and makes abrasive particle be in good can not being come off by gripping state all the time in the time of can guaranteeing grinding again;
(3) chemically stable adapts to various cooling fluids;
(4) heat conduction and heat radiation is good.The pore of more (20 ~ 40%) is arranged in the emery wheel of the present invention, help chip removal and heat radiation during grinding, be difficult for stopping up, can not causing the diamond carbonization;
(5) compare with metal anchoring agent diamond wheel, have good self-sharpening and finishability;
(6) high strength and high grinding speed.Traditional diamond processing linear velocity is 20 ~ 30m/s, and this product has realized on Belgium's up-to-date abrasive drilling stone patent equipment that diamond processes the high-speed grinding of 40m/s since the dawn of human civilization, and has signed supporting agreement with the said firm.
(7) all are better than resin and metal anchoring agent diamond wheel far away in grinding efficiency, service life.Comprehensive benefit can improve more than 50%.
The preparation method of the patent No. a kind of skive vitrified bond that has been 200910304381.1 Chinese disclosure of the Invention and skive is earlier with technical grade SIO
2Colloidal sol and NANO
3, KNO
3, LINO
3, H3BO
3Mix Deng the solution mechanical agitation, adjusting mixed solution PH is 4～6, adds technical grade AL again
2O
3Colloidal sol; The mixed sols of gained is crossed the 100-120 eye mesh screen in 500 ℃ ~ 550 ℃ oven dry, the broken back of grinding, promptly make the skive vitrified bond.Prepare skive on the basis of vitrified bond again making.This vitrified bond has material component and mixes, and the bond particle diameter can reach the nanoscale scope, and rupture strength is 101.8-105.3MPA after the sinter molding; Vitrified bond is complete to the diamond abrasive coating behind the sintering, and the porosity is 20%-28%, and operating speed can reach 80-100M/S.
Summary of the invention
Goal of the invention of the present invention provides a kind of vitrified bond that is used to prepare skive, and adopts this vitrified bond preparation to be exclusively used in the ceramic bond diamond emery wheel of diamond processing.
To achieve the above object of the invention, the technical solution used in the present invention is: a kind of vitrified bond that is used to prepare skive, and the preparation method of described vitrified bond may further comprise the steps:
(1), get compound according to following proportioning mixed material:
Silica 30%～60%;
Borax 6%～18%;
Lithium hydroxide 12%～28%;
Zinc oxide 5%～12%;
Calcium oxide 6%～10%;
Aluminium oxide 2%～20%;
Above-mentioned percentage is weight percentage, and the percentage by weight sum of all raw materials is 100%;
(2) with step (1) gained compound at 1295 ℃～1305 ℃ high melts, cooling back ball milling becomes ceramic powder, is vitrified bond.
In the technique scheme, in the step (2), after cooling back ball milling becomes ceramic powder,, obtain vitrified bond by the standard screen of 180#.
In the technique scheme, the outward appearance of the described vitrified bond superfine powder powder that is white in color, density is 2.6g/cm
3_2.8g/cm
3, fusing point: 760-780 ℃, purity: 〉=99%, tensile strength: 80-120MPa, average grain diameter: 8～15 μ m, softening temperature: 650～680 ℃, sintering temperature: 695 ℃-705 ℃, the coefficient of expansion: 6 * 10
-6～9 * 10
-6
Above-mentioned vitrified bond has high strength and low-expansion coefficient, therefore can mate with the pottery grinding wheel base body that is adopted is perfect; Adopt the skive of this vitrified bond preparation to have good heat-conducting and heat resistance, compare with the resinoid bond skive, both can guarantee under the temperature that diamond is not carbonized, to obtain good sintering, can guarantee again that abrasive particle was in good gripping state all the time and can not comes off when grinding; Grinding efficiency and service life improve greatly.
Therefore, the skive of the above-mentioned vitrified bond preparation of the present invention's claimed employing simultaneously.
A kind of method of utilizing above-mentioned vitrified bond to prepare abrasive drilling stone dedicated ceramic anchoring agent diamond grinding wheel, constitute abrasive drilling stone dedicated ceramic anchoring agent diamond grinding wheel by on grinding wheel base body, being arranged on grinding layer, wherein, the preparation method of described grinding layer may further comprise the steps:
(1) with diamond abrasive, schmigel, vitrified bond or/and pore creating material is inserted in the batch mixer mixes, slowly add interim binding agent after mixing, continue to mix 1～2 hour, loose by standard screen then, obtain compound; Wherein, the percent by volume of diamond abrasive, vitrified bond, schmigel, interim binding agent, pore creating material is respectively: 50%～70%, 18%～25%, 5%～20%, 4%～8%, 0%～3%;
(2) step (1) gained compound is slowly added in the mould, with cold press cold moudling under 60～100 tons of pressure, the idiosome that depanning obtains is the grinding layer base substrate;
(3) step (2) gained grinding layer base substrate is inserted in the sintering furnace, be warming up to 495 ℃-505 ℃ in 80～120 minutes, slow down programming rate and be 3-4 ℃/minute and be warming up to 700 ℃ ± 5 ℃, be incubated 2-3 hour, be cooled to room temperature and take out, standby after the passed examination, promptly get grinding layer.
In the technique scheme, in the step (1), described by standard screen loose in employed standard screen be 60 mesh standard sieves.
In the technique scheme, in the step (1), diamond abrasive granularity 80/100～W5, market is on sale, meets national standard; Schmigel also is the commercial goods, and granularity is 10～40 μ m, meets national standard.
In the technique scheme, in the step (1), the effect of interim binding agent is at normal temperatures the blank particle to be surrounded, links up, sintering or when burning till (about about 450 ℃) then volatilize, decomposition and oxidation, stay a small amount of ash (about 0.5%-2%), can not bring negative effect the final performance of product; Described interim binding agent is a liquid phenolic resin, and its outward appearance is the brownish red transparency liquid, and solid content is 50%, and gel time (171 ℃) is 100～300 seconds, vitrification point (Tg) 〉=250 ℃, and solidification temperature is 200～220 ℃.
In the technique scheme, in the step (1), can be by adding the porosity of how much controlling of pore-creating dosage; Described pore creating material is a powdered carbon, and technical conditions are as follows: real density 1.8-1.95g/cm
3, granularity: 200#, purity: more than 99%, ignition point: 450-600 degree centigrade, market is on sale.
In the technique scheme, in the step (2), described 60～100 tons of pressure are meant 60～100 tons/square centimeter, belong to engineering field abbreviation commonly used.
In the technique scheme, the method that grinding layer is arranged on the grinding wheel base body is a prior art, is specially: grinding layer and grinding wheel base body is bonding with high cohesive force glue of the prior art.
In the technique scheme, the tensile strength of described grinding wheel base body is 45MPa ~ 70MPa, and the coefficient of expansion is 8.3 * 10
-6~ 9.0 * 10
-6, can be selected from but be not limited to: Norton (Norton) white fused alumina grinding wheel base body.
Further in the technical scheme, above-mentioned bonding emery wheel is machined to the shape and size that drawing requires, after the assay was approved warehouse-in.
Because the technique scheme utilization, the present invention compared with prior art has following advantage:
1), therefore can mate with the pottery grinding wheel base body that is adopted is perfect because vitrified bond of the present invention has high strength and low-expansion coefficient.
2) adopt the skive of vitrified bond preparation of the present invention to have good heat-conducting and heat resistance, compare with the resinoid bond skive, both can guarantee under the temperature that diamond is not carbonized, to obtain good sintering, can guarantee again that abrasive particle was in good gripping state all the time and can come off when grinding.
3) adopt the skive of vitrified bond preparation of the present invention to have the good porosity (20%-40%) and tailorability.
4) adopt the skive of vitrified bond preparation of the present invention to have the characteristics of high strength and high grinding speed, traditional diamond processing linear velocity is 20 ~ 30m/s, this product has been realized the high-speed grinding of 40m/s on Belgium's up-to-date abrasive drilling stone patent equipment, on diamond processing history, this is the highest up to now grinding speed.
5) adopt grinding efficiency, the service life of ceramic bond diamond emery wheel of the present invention all to be better than resin and metal anchoring agent diamond wheel far away, comprehensive benefit can improve more than 50%.
Description of drawings
Fig. 1 is the schematic flow sheet of preparation ceramic bond diamond emery wheel among the embodiment;
Fig. 2 is the structural representation of the ceramic bond diamond emery wheel for preparing among the embodiment.
The specific embodiment
Below in conjunction with drawings and Examples the present invention is further described:
Embodiment one: referring to shown in Figure 1, the method for preparing the ceramic bond diamond emery wheel comprises: preparation grinding wheel base body, preparation grinding layer, grinding layer is bonded on the grinding wheel base body, reprocesses, put in storage after the assay was approved by the skive national standard to the shape and size of drawing requirement.
(1) preparation grinding wheel base body: adopt promise to pause (Norton) high-strength ceramic white fused alumina emery wheel, after roughing, fine finishining, tolerance calibrating, test dynamic balancing, obtain qualified grinding wheel base body then as grinding wheel base body; The tensile strength of described grinding wheel base body is 45MPa-70MPa, and the coefficient of expansion is 8.3 * 10
-6~ 9.0 * 10
-6
The preparation grinding layer:
(a) preparation vitrified bond:, get compound according to following proportioning mixed material:
Silica 49%;
Borax 15%;
Lithium hydroxide 21%;
Zinc oxide 7%;
Calcium oxide 6%;
Aluminium oxide 2%;
Above-mentioned percentage is weight percentage.
(b) with step (a) gained compound at 1295 ℃ of-1305 ℃ of high melts, cooling back ball milling becomes ceramic powder, by the #180 standard screen, obtains vitrified bond.
(c) diamond abrasive, schmigel, vitrified bond are inserted in the cartridge type batch mixer mix, after detecting evenly, slowly add interim binding agent, continue to mix 1-2 hour, by 180 mesh standard sieves, obtain compound then at microscopically; Wherein, the percent by volume of diamond abrasive, vitrified bond, schmigel, interim binding agent is respectively: 68%, 21%, 6%, 5%; The diamond abrasive granularity is 325/400, and market is on sale, meets national standard; Schmigel is the commercial goods, and granularity is W20, meets national standard; Interim binding agent is a liquid phenolic resin, the commercial goods.
(d) step (c) gained compound is slowly added in the mould, fill evenly, wipe off, place the cold moudling of 100 tons of press operation platforms.This technology is the cover half moulding, mould is flattened also promptly obtain the grinding layer base substrate after the depanning.
(e) step (d) gained grinding layer base substrate is inserted in the sintering furnace, (100 minutes) are warming up to 495 ℃-505 ℃ fast, and slowing down programming rate is 700 ℃ ± 5 ℃ of 3-4 ℃ of/minute extremely final sintering temperatures, be incubated 2-3 hour, be cooled to room temperature and take out, after the passed examination, promptly get grinding layer.
(2) grinding layer and the grinding wheel base body of emery wheel is bonding with high cohesive force glue (as: ST-811 of Du Pont).
(3) above-mentioned bonding emery wheel is machined to the shape and size that drawing requires, puts in storage after the assay was approved by skive national standard JB/T 7425-94.The structure of gained emery wheel is referring to Fig. 2.
Embodiment two: referring to shown in Figure 1, the method for preparing the ceramic bond diamond emery wheel comprises: preparation grinding wheel base body, preparation grinding layer, grinding layer is bonded on the grinding wheel base body, and reprocess to the shape and size of drawing requirement, after the assay was approved warehouse-in.
(1) preparation grinding wheel base body: adopt pigeon white fused alumina emery wheel as grinding wheel base body, after roughing, fine finishining, tolerance calibrating, test dynamic balancing, obtain qualified grinding wheel base body then; The tensile strength of described grinding wheel base body is 40MPa-80MPa, and the coefficient of expansion is 7.9 * 10
-6~ 9.8 * 10
-6
The preparation grinding layer:
(a) preparation vitrified bond:, get compound according to following proportioning mixed material:
Silica 41%;
Borax 16%;
Lithium hydroxide 23%;
Zinc oxide 12%;
Calcium oxide 6%;
Aluminium oxide 2%;
Above-mentioned percentage is weight percentage.
(b) with step (a) gained compound at 1300 ℃
± 5High melt, cooling back ball milling becomes ceramic powder, by the #180 standard screen, obtains vitrified bond.
(c) schmigel that be 40/60 diamond abrasive with granularity, granularity is W28 and Manufactured vitrified bond are inserted in the cartridge type batch mixer and are mixed, after detecting evenly, slowly add interim binding agent at microscopically, continue to mix 1-2 hour, by 30 mesh standard sieves, obtain compound then; Wherein, the percent by volume of diamond abrasive, vitrified bond, schmigel, interim binding agent is respectively: 51%, 24%, 19%, 6%; The diamond abrasive granularity is 40/60, and market is on sale, meets national standard; The schmigel granularity is W28, and the commercial goods meets national standard; Interim binding agent is a liquid phenolic resin, and market is on sale.
(d) step (c) gained compound is slowly added in the mould, fill evenly, wipe off, place the cold moudling of 100 tons of press operation platforms.This technology is the cover half moulding, promptly obtains the grinding layer base substrate after pressing depanning.
(e) step (d) gained ceramic body is inserted in the sintering furnace, in 100 minutes, be warming up to 500 ℃, slow down programming rate (3 ~ 4 ℃/minute) to 700 ℃ ± 5 ℃ of final sintering temperatures, be incubated 2-3 hour, be cooled to room temperature and take out, standby after the passed examination, promptly get grinding layer.
(2) grinding layer and grinding wheel base body is bonding with high cohesive force glue (DuPont ST-811).
(3) above-mentioned bonding emery wheel is machined to the shape and size that drawing requires, puts in storage after the assay was approved by national standard, the structure of gained emery wheel is referring to Fig. 2.
Embodiment three: a kind of method for preparing the ceramic bond diamond emery wheel comprises: preparation grinding wheel base body, preparation grinding layer, grinding layer is bonded on the grinding wheel base body, and reprocess to the shape and size of drawing requirement, after the assay was approved warehouse-in.
(1) preparation grinding wheel base body: adopt pigeon white fused alumina emery wheel as grinding wheel base body, after roughing, fine finishining, tolerance calibrating, test dynamic balancing, obtain qualified grinding wheel base body then; The tensile strength of described grinding wheel base body is 40MPa-80MPa, and the coefficient of expansion is 7.9 * 10
-6~ 9.8 * 10
-6
The preparation grinding layer:
(a) preparation vitrified bond:, get compound according to following proportioning mixed material:
Silica 41%;
Borax 16%;
Lithium hydroxide 23%;
Zinc oxide 12%;
Calcium oxide 6%;
Aluminium oxide 2%;
Above-mentioned percentage is weight percentage.
(b) with step (a) gained compound at 1300 ℃
± 5High melt, cooling back ball milling becomes ceramic powder, by the #180 standard screen, obtains vitrified bond.
(c) be that 40/60 diamond abrasive, pore creating material powdered carbon, granularity are that the schmigel of W28 and Manufactured vitrified bond are inserted in the cartridge type batch mixer and mixed with granularity, after detecting evenly, slowly add interim binding agent at microscopically, continue to mix 1-2 hour, by 30 mesh standard sieves, obtain compound then; Wherein, the percent by volume of diamond abrasive, vitrified bond, schmigel, interim binding agent, pore creating material is respectively: 50%, 24%, 18%, 6%, 2%; The diamond abrasive granularity is 40/60, and market is on sale, meets national standard; The schmigel granularity is W28, and the commercial goods meets national standard; Interim binding agent is a liquid phenolic resin, and market is on sale.
(d) step (c) gained compound is slowly added in the mould, fill evenly, wipe off, place the cold moudling of 100 tons of press operation platforms.This technology is the cover half moulding, promptly obtains the grinding layer base substrate after pressing depanning.
(e) step (d) gained ceramic body is inserted in the sintering furnace, in 100 minutes, be warming up to 500 ℃, slow down programming rate (3 ~ 4 ℃/minute) to 700 ℃ ± 5 ℃ of final sintering temperatures, be incubated 2-3 hour, be cooled to room temperature and take out, standby after the passed examination, promptly get grinding layer.
(2) grinding layer and grinding wheel base body is bonding with high cohesive force glue (DuPont ST-811).
(3) above-mentioned bonding emery wheel is machined to the shape and size that drawing requires, puts in storage after the assay was approved by national standard, the structure of gained emery wheel is referring to Fig. 2.
Claims (5)
1. vitrified bond that is used to prepare abrasive drilling stone special diamond emery wheel is characterized in that the preparation method of described vitrified bond may further comprise the steps:
(1), get compound according to following proportioning mixed material:
Silica 30%～60%;
Borax 6%～18%;
Lithium hydroxide 12%～28%;
Zinc oxide 5%～12%;
Calcium oxide 6%～10%;
Aluminium oxide 2%～20%;
Above-mentioned percentage is weight percentage, and the percentage by weight sum of all raw materials is 100%;
At 1295 ℃～1305 ℃ high melts, cooling back ball milling becomes ceramic powder, is vitrified bond with step (1) gained compound.
2. according to the described vitrified bond that is used to prepare abrasive drilling stone special diamond emery wheel of claim 1, it is characterized in that, the outward appearance of the described vitrified bond superfine powder powder that is white in color, density is 2.6g/cm
3～2.8g/cm
3, fusing point: 760～780 ℃, purity: 〉=99%, tensile strength: 80～120MPa, average grain diameter: 8～15 μ m, softening temperature: 650～680 ℃, sintering temperature: 695 ℃～705 ℃, the coefficient of expansion: 6 * 10
-6～9 * 10
-6
3. method of utilizing the described vitrified bond of claim 1 to prepare abrasive drilling stone dedicated ceramic anchoring agent diamond grinding wheel, constitute abrasive drilling stone dedicated ceramic anchoring agent diamond grinding wheel by on grinding wheel base body, being arranged on grinding layer, it is characterized in that the preparation method of described grinding layer may further comprise the steps:
(1) with diamond abrasive, schmigel, vitrified bond or/and pore creating material is inserted in the batch mixer mixes, slowly add interim binding agent after mixing, continue to mix 1～2 hour, loose by standard screen then, obtain compound; Wherein, the percent by volume of diamond abrasive, vitrified bond, schmigel, interim binding agent, pore creating material is respectively: 50%～70%, 18%～25%, 5%～20%, 4%～8%, 0%～3%;
(2) step (1) gained compound is slowly added in the mould, with cold press cold moudling under 60～100 tons of pressure, the idiosome that depanning obtains is the grinding layer base substrate;
(3) step (2) gained grinding layer base substrate is inserted in the sintering furnace, be warming up to 495 ℃-505 ℃ in 80～120 minutes, slow down programming rate and be 3-4 ℃/minute and be warming up to 700 ℃ ± 5 ℃, be incubated 2-3 hour, be cooled to room temperature and take out, standby after the passed examination, promptly get grinding layer.
4. according to the described ceramic bond diamond emery wheel of claim 3, it is characterized in that the tensile strength of described grinding wheel base body is 45～70MPa, the coefficient of expansion is 5 * 10
-6～9 * 10
-6
5. according to the described ceramic bond diamond emery wheel of claim 5, it is characterized in that described grinding wheel base body is the white fused alumina grinding wheel base body.
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