KR20090013366A - Conditioning disc for polishing pad - Google Patents

Conditioning disc for polishing pad Download PDF

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Publication number
KR20090013366A
KR20090013366A KR1020070077425A KR20070077425A KR20090013366A KR 20090013366 A KR20090013366 A KR 20090013366A KR 1020070077425 A KR1020070077425 A KR 1020070077425A KR 20070077425 A KR20070077425 A KR 20070077425A KR 20090013366 A KR20090013366 A KR 20090013366A
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KR
South Korea
Prior art keywords
disk
conditioning
polishing
polishing pad
cutting
Prior art date
Application number
KR1020070077425A
Other languages
Korean (ko)
Inventor
윤경수
Original Assignee
주식회사 세라코리
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Publication date
Application filed by 주식회사 세라코리 filed Critical 주식회사 세라코리
Priority to KR1020070077425A priority Critical patent/KR20090013366A/en
Publication of KR20090013366A publication Critical patent/KR20090013366A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D2203/00—Tool surfaces formed with a pattern

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Nanotechnology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The polishing pad conditioning disc according to the present invention is a polishing pad conditioning disc comprising a disc body and a plurality of cutting protrusions protruding from one surface of the disc body, wherein the cutting protrusions are polygonal pyramid-shaped. At this time, the polishing disk conditioning disk is made of sintered nano powder of ceramic, diamond and boron nitride compound. In addition, a plurality of foreign matter discharge grooves are radially formed on one surface of the disc body in which the cutting protrusion protrudes, and each unit foreign matter discharge groove is formed in a spiral shape.

Therefore, it is possible to increase the polishing efficiency during the conditioning work, to prevent the fall of the protrusions generated, and to prevent scratches due to foreign matter remaining on the cutting protrusions and polishing pads dropped during the conditioning work.

Description

Conditioning Disc for Polishing Pads {CONDITIONING DISC FOR POLISHING PAD}

The present invention relates to a conditioning disk for a polishing pad, and in particular, it is possible to fundamentally prevent the falling of the cutting protrusion generated during the conditioning operation, and to prevent scratches caused by the dropped abrasive particles and foreign matter remaining on the polishing pad. A conditioning disk for a polishing pad.

In general, chemical mechanical polishing (CMP) is a polishing method developed to compensate for the disadvantages of mechanical polishing in which a modified layer is formed and the disadvantages of chemical polishing in which high shape precision cannot be obtained. In addition to the plasma enhanced chemical vapor deposition (PECVD) and reactive ion etching (RIE), it is essential to fabricate submicron scale chips.

Such chemical mechanical polishing is maintained in that it is possible to obtain a high shape precision without forming a deterioration layer as described above, but during the operation, foreign matter such as abrasive particles, tributes and pad debris is generated on the surface of the polishing pad. Blocking the pores of the pad has a disadvantage that planarization of the wafer is impossible. In order to prevent this, the chemical mechanical polishing apparatus maintains the porosity of the polishing pad by conditioning the upper surface of the polishing pad, maintains the flatness by suppressing the non-uniform deformation, and slurry the numerous pores of the polishing pad. A conditioner including a conditioning disc is provided to smoothly supply the gas.

As the above-described conditioning disk, it was common to use a diamond pad conditioning disk having diamond particles attached to one surface thereof in contact with the polishing disk to enable micro cutting of the polishing pad to be conditioned. As a method of attaching diamond to the diamond pad conditioning disk, there are methods such as brazing, electroplating, and sintering.

Meanwhile, conventionally, an oxide line mainly using chemical vapor deposition (CVD) was mainly used, and in the case of the oxide, the corrosion problem was not very important because the polishing slurry was used at an pH of 5.5 or higher. However, in the process of developing and changing semiconductor technology, metal lines (P, W, Al, Cu, etc.) using PVD (Physical Vapor Deposition) are increasing.In this case, work is being performed on strong acids with pH less than 2.0. Due to the corrosion of metals, diamond dropping caused a problem of semiconductor defects. In fact, unlike oxide lines, diamond pad conditioning disks have to be replaced for only 5 to 7.5 hours. .

Accordingly, an object of the present invention is to provide a conditioning disk for a polishing pad capable of increasing resistance to falling off of a cutting protrusion generated during conditioning.

Another object of the present invention is to improve the polishing performance of the cutting projections by making the cutting projection shape a polygonal pyramid shape.

In addition, another object of the present invention is to provide a conditioning disk for a polishing pad that can prevent scratches caused by debris of the cutting protrusion particles and the foreign matter remaining in the polishing pad during the conditioning operation.

In the polishing pad conditioning disk according to the present invention for achieving the above object, in the polishing pad conditioning disk comprising a disk body and a plurality of cutting protrusions protruding on one surface of the disk body, the cutting protrusion is a polygonal pyramid shape It is characterized by that.

On the other hand, the material of the disk is characterized in that made of ceramic, diamond and boron nitride compound (CBN). At this time, the conditioning disk for the polishing pad is made by sintering the nano powder of ceramic, diamond and boron nitride compound.

In addition, a plurality of foreign matter discharge grooves are radially formed on one surface of the disc body in which the cutting protrusion protrudes, and each unit foreign matter discharge groove is formed in a spiral shape.

The conditioning disk for a polishing pad according to the present invention has a cutting protrusion in the shape of a polygonal pyramid, so that the polishing action is actively performed at the corners of the polygonal pyramid, thereby increasing the polishing efficiency.

In addition, by sintering the nano-powder of the ceramic, diamond and boron nitride compound (CBN) it is possible to increase the resistance to the falling off of the projection during conditioning.

Furthermore, foreign matter discharge grooves are provided in the body of the conditioning disk for the polishing pad, thereby preventing the scratches due to them by discharging foreign particles remaining on the polishing pad and the cutting protrusion particles dropped out during the conditioning operation.

With reference to the accompanying drawings will be described embodiments of the present invention;

1 is a perspective view showing an embodiment of a polishing pad conditioning disk according to the present invention, Figure 2 is an enlarged view of part "A" of Figure 1, Figure 3 is a polishing pad conditioning according to the present invention A plan view of one embodiment of a disk.

As shown in Figures 1 to 3, one embodiment of the polishing disk conditioning disk 100 according to the present invention, a disk-shaped disk body 110, and the polishing pad (not shown) of the disk body 110 Comprising: a plurality of cutting protrusions 120 protruding on one surface in contact with, and the foreign matter discharge groove 130 formed on one surface of the cutting protrusion 120 protrudes.

Each part of the polishing disk 100 for conditioning pad 100 is described in more detail as follows.

First, the disk body 110 is formed in a disk shape having a predetermined thickness. The cutting protrusion 120 protruding from one surface of the disc body 110 is formed in a triangular pyramid shape so as to easily cut the polishing pad. However, the present invention is not limited thereto and may be manufactured in various shapes as necessary. Cutting protrusions 120 may be added to the chromium or nickel to prevent corrosion and increase the strength.

On the other hand, a plurality of foreign material discharge groove 130 is formed on one surface of the disk body 110, the cutting protrusion 120 protrudes as described above. The foreign substance discharge groove 130 is for discharging the abrasive particles, tribute and pad dregs remaining on the surface of the polishing pad to the outside, and maintains the porosity of the polishing pad by discharging the foreign matter, and maintains uneven deformation. In order to suppress and maintain flatness, the slurry is smoothly supplied to the pores formed in the polishing pad.

At this time, the foreign substance discharge groove 130 is preferably formed in a plurality of radial in order to effectively discharge the foreign substances generated in the whole portion of the polishing disk 100 for the conditioning pad. In addition, each unit foreign matter discharge groove of the foreign material discharge groove 130 is formed in a spiral so that the generated foreign matter can be easily discharged from the polishing disk conditioning disk 100 in the rotational movement to the outer peripheral surface of the disk body 110 It is preferable that the diameter is formed to increase gradually.

4 is a plan view showing another embodiment of the conditioning disk for polishing pad according to the present invention.

As shown in FIG. 4, another embodiment of the polishing disk conditioning disk 100 according to the present invention includes a disk-shaped disk body 110 and one of the disk bodies 110 as in the above-described embodiment. Comprising a plurality of cutting protrusions 120 protruding on one surface in contact with the polishing pad (not shown), the cutting protrusion 120 includes a foreign material discharge groove 130 formed on one surface protruding.

In this case, a patternless region 140 in which the cutting protrusion 120 is not formed is formed at the center of one surface of the disk body 110, and a pattern region 150 in which the cutting protrusion 120 is formed is formed at the circumference. As such, when the pattern region 150 and the patternless region 140 are formed together on one surface of the disk body 110, micro-cutting is performed when the pattern region 150 contacts with the pattern region 150. At the time of contact with 140, no minute cutting is performed. Therefore, as the micro cutting process is rapidly repeated, the conditioning effect of the polishing pad can be greatly improved.

On the other hand, the polishing pad conditioning disk 100 according to the present invention in order to compensate for the falling off of the cutting protrusion and various problems caused by the use of the diamond pad conditioning disk, ceramic, diamond and It is characterized in that it is made of a mixture of boron nitride compound (cubic boronitride; CBN).

The type of ceramic used herein is preferably a mixture of one or more selected from aluminum oxide (Al 2 O 3 ), zirconia (ZrO 2 ), tungsten carbide (WC) and silicon carbide (SiC).

Looking at the manufacturing method of the above-mentioned polishing pad conditioning disk 100 made of a ceramic, diamond and boron nitride compound as follows.

First, nano-powders of ceramic, diamond and boron nitride compound are mixed at the above-mentioned ratios, that is, 66-74 wt% ceramic, 12-28 wt% diamond, and 12-28 wt% boron nitride compound, and a predetermined pressure is applied thereto. The disk-shaped disk main body 110 is shape | molded. The sintering temperature is preferably about 700-3,000 ° C. At this time, a plurality of cutting protrusions 120 and foreign matter discharge groove 130 is formed on one surface of the disk body 110. The diamond or boron nitride compound is contained as a powder of 10 mu m or less.

Then, when the molding is completed, it is completed by heating to a temperature close to the melting point of the mixture by sintering so that the nanopowders are bonded or some are deposited and connected to each other.

As described above, the polishing disk conditioning disk 100 has the strength required for conditioning and prevents the cutting protrusion 120 from being chipped, thereby removing the protrusions generated during conditioning. It can be prevented fundamentally.

5 is a side cross-sectional view of the cutting protrusion 120 of the conditioning disk 100 according to another embodiment of the present invention. In the drawing, a coating layer 122 is formed on the cutting protrusion. Accordingly, the polishing performance and lifespan of the cutting protrusion can be further improved. The material of the coating layer is not particularly limited. Ceramic may be good or Teflon or fluorine compound.

6 is a side cross-sectional view of a cutting protrusion of a conditioning disk according to another embodiment of the present invention. In this embodiment, the cutting protrusion 120 is formed in the shape of a large polygonal pyramid portion 126 and a small polygonal pyramid 124 placed on the polygonal pyramid portion. Since the polygonal pyramid portion 126 is not well polished, when the polygonal pyramid 124 portion is worn out, the actual polishing performance is lost, and the disk 100 must be replaced. Therefore, it may be a preferred embodiment when proper disk life management is required.

7 is a perspective view of a conditioning disk for a polishing pad according to another embodiment of the present invention. As shown, a protrusion 128 is formed in the polishing disk conditioning disk of this embodiment. The protrusion 128 is formed to extend from the center of the disk to the outer circumference of the disk. The height of the protrusion 128 is slightly lower than the height of the cutting protrusion 120. In this embodiment, it is about 1 mm lower. According to such a structure, since the protrusion 128 scrapes off the to-be-polished particle | grains, a slurry, etc. after grinding | polishing by the cutting protrusion 120, there exists an effect of cleaning a surface. Therefore, polishing can be made more efficient at the next rotation. Although not shown, the protrusion 128 and the discharge groove 130 may be formed together, of course.

Although the shape and manufacturing method of the polishing pad conditioning disk according to the preferred embodiment of the present invention have been illustrated according to the above description and drawings, this is merely an example, and various modifications may be made without departing from the spirit of the present invention. It will be understood by those skilled in the art that variations and modifications are possible.

1 is a perspective view showing an embodiment of a polishing disk conditioning disk according to the present invention.

FIG. 2 is an enlarged view of a portion “A” of FIG. 1.

Figure 3 is a plan view showing one embodiment of a polishing disk conditioning disk according to the present invention.

4 is a plan view showing another embodiment of the conditioning disk for polishing pad according to the present invention.

5 is a side cross-sectional view of the cutting protrusion 120 of the conditioning disk 100 according to another embodiment of the present invention.

6 is a side cross-sectional view of a cutting protrusion of a conditioning disk according to another embodiment of the present invention.

7 is a perspective view of a conditioning disk for a polishing pad according to another embodiment of the present invention.

* Description of the symbols for the main parts of the drawings *

100: conditioning pad for polishing pad 110: disk body

120: cutting protrusion 122: coating layer

128: protrusion 130: foreign substance discharge groove

140: pattern region 150: pattern region

Claims (11)

In the polishing disk conditioning disk comprising a disk body and a plurality of cutting protrusions protruding on one surface of the disk body, A conditioning pad for a polishing pad, characterized by sintering nanoparticles of ceramic, diamond and boron nitride compounds. The method of claim 1, And at least one ceramic selected from the group consisting of aluminum oxide (Al 2 O 3 ), zirconia (ZrO 2 ), tungsten carbide (WC) and silicon carbide (SiC). The method according to claim 1 or 2, Conditioning disk for polishing pad, characterized in that for coating the surface of the cutting projections. The method of claim 3, wherein Conditioning disk for a polishing pad, characterized in that the coating is made of a ceramic, teflon or fluorine compound. The method according to claim 1 or 2, And said cutting protrusion is in the shape of a polygonal pyramid. The method according to claim 1 or 2, And the cutting protrusion has a wide polygonal pyramid portion and a small polygonal pyramid shape placed on the polygonal pyramid portion. The method according to claim 1 or 2, And a plurality of foreign matter discharge grooves are formed radially on one surface of the disk body protruding the cutting protrusion. The method of claim 2, Conditioning disk for a polishing pad, characterized in that the ceramic is produced by sintering at a temperature of about 700-3,000 ℃. The method according to claim 1 or 2, And said diamond or boron nitride compound is contained as a powder of 10 [mu] m or less. The method according to claim 1 or 2, A disk for polishing pads, characterized in that a protrusion extending from the center of the disk to the outer circumference of the disk is formed on the surface of the disk. The method of claim 10, And a height of the protrusion is lower than a height of the cutting protrusion.
KR1020070077425A 2007-08-01 2007-08-01 Conditioning disc for polishing pad KR20090013366A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011028700A2 (en) * 2009-09-01 2011-03-10 Saint-Gobain Abrasives, Inc. Chemical mechanical polishing conditioner
KR101236163B1 (en) * 2012-07-23 2013-02-22 주식회사 제우스 Pad conditioning disk and pad conditioner and pad conditioning method
CN104029125A (en) * 2013-03-08 2014-09-10 鑫晶钻科技股份有限公司 Sapphire polishing pad dresser and manufacturing method thereof
US8905823B2 (en) 2009-06-02 2014-12-09 Saint-Gobain Abrasives, Inc. Corrosion-resistant CMP conditioning tools and methods for making and using same
US9022840B2 (en) 2009-03-24 2015-05-05 Saint-Gobain Abrasives, Inc. Abrasive tool for use as a chemical mechanical planarization pad conditioner
EP3313614A4 (en) * 2015-06-25 2019-05-15 3M Innovative Properties Company Vitreous bond abrasive articles and methods of making the same

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9022840B2 (en) 2009-03-24 2015-05-05 Saint-Gobain Abrasives, Inc. Abrasive tool for use as a chemical mechanical planarization pad conditioner
US8905823B2 (en) 2009-06-02 2014-12-09 Saint-Gobain Abrasives, Inc. Corrosion-resistant CMP conditioning tools and methods for making and using same
WO2011028700A2 (en) * 2009-09-01 2011-03-10 Saint-Gobain Abrasives, Inc. Chemical mechanical polishing conditioner
WO2011028700A3 (en) * 2009-09-01 2011-05-26 Saint-Gobain Abrasives, Inc. Chemical mechanical polishing conditioner
CN102612734A (en) * 2009-09-01 2012-07-25 圣戈班磨料磨具有限公司 Chemical mechanical polishing conditioner
US8951099B2 (en) 2009-09-01 2015-02-10 Saint-Gobain Abrasives, Inc. Chemical mechanical polishing conditioner
KR101236163B1 (en) * 2012-07-23 2013-02-22 주식회사 제우스 Pad conditioning disk and pad conditioner and pad conditioning method
CN104029125A (en) * 2013-03-08 2014-09-10 鑫晶钻科技股份有限公司 Sapphire polishing pad dresser and manufacturing method thereof
EP3313614A4 (en) * 2015-06-25 2019-05-15 3M Innovative Properties Company Vitreous bond abrasive articles and methods of making the same

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