JP5957317B2 - Dresser for polishing cloth and method for producing the same - Google Patents

Description

  The present invention relates to a dresser used for grinding a polishing cloth in a chemical mechanical planar polishing (hereinafter abbreviated as CMP) process, and a manufacturing method thereof.

  Equipment for polishing the surface of semiconductor wafers, equipment for flattening the surface of wiring and insulating layers in the process of manufacturing integrated circuits, equipment for flattening the surface of Al plates and glass plates used for magnetic hard disk substrates, etc. Then, CMP polishing is used. CMP polishing is, for example, a method of flattening a surface to be polished by pressing the surface to be polished while supplying a slurry liquid containing fine abrasive grains to a rotating substrate to which a urethane polishing pad is attached. It is. As a matter of course, the polishing ability of the polishing pad decreases with the use time. Therefore, in order to suppress this decrease in polishing ability, the surface layer portion of the polishing pad is ground at regular intervals. Thereby, a new surface of the polishing pad can always be brought out on the surface, and the flatness of the polishing pad is maintained. This grinding is called dressing, and the parts used for dressing are called dressers. In general, a dresser is obtained by bonding abrasive grains to a metal substrate by electrodeposition or brazing.

  Conventionally, a dresser is required not to scratch the pad. More recently, as the focus depth of the pattern exposure apparatus decreases due to the extremely narrow line / space of the integrated circuit, or the recording capacity of the magnetic hard disk increases, the amount of metal eluted from the dresser components is suppressed as much as possible. Needs are getting higher. This is because the metal component in the dresser is eluted into the slurry during the dressing and the semiconductor wafer or the like is contaminated through the polishing pad.

The following are disclosed as dressers aimed at suppressing the eluted metal. Patent Document 1 discloses a dresser in which a plate having diamond abrasive grains fixed to the surface of a MgO—SiO ₂ sintered body is attached to a resin substrate. Patent Document 2 discloses a dresser in which diamond abrasive grains are fixed to a resin substrate. Patent Document 3 discloses a dresser in which diamond abrasive grains fixed to a powder sintered body of W, Si, and SiO ₂ are bonded to a resin, a ceramic, and a stainless steel plate. Patent Document 4 discloses a dresser in which abrasive grains formed by forming a diamond film on a substrate made of silicon carbide are fixed. Patent Document 5 discloses a dresser in which a diamond abrasive grain is fixed to a support material made of glass and a ceramic powder composite.

  On the other hand, Patent Document 6 proposes cutting a silicon wafer with a wire saw made of a core wire in which diamond abrasive grains are held by a subbing layer made of a resin.

JP 2008-132573 A JP 2001-25957 A JP 2001-179638 A JP 2004-291129 A International Publication No. 2008/062846 JP 2009-285791 A

  As described above, in order to suppress metal elution, a dresser using a ceramic sintered body other than metal or a resin as a member constituting the dresser has been disclosed. However, when diamond abrasive grains are fixed to the ceramic sintered body, there is a problem that the diamond abrasive grains deteriorate due to the reaction between the diamond abrasive grains and the sintered powder. On the other hand, when diamond abrasive grains are fixed to the resin support material, since the fixing force between the resin and diamond is weak, the diamond falls off during dressing, resulting in a problem of frequent scratches.

  An object of the present invention is to provide a dresser in which abrasive grains are less dropped during dressing, and preferably metal elution is suppressed.

The gist of the present invention is as follows.
[1] A polishing cloth dresser in which a plurality of abrasive grains are fixed to a single layer with a resin on the surface of a support material,
A polishing cloth dresser in which a metal layer exists between the resin and the abrasive grains, and a surface of the metal layer in contact with the resin has an uneven portion.
[2] The polishing dresser according to [1], wherein a wetting angle θ between the resin and the metal layer is in a range of 0 <θ <90 ° on a line where the resin and the metal layer are in contact with each other. .
[3] The dresser for polishing cloth according to [1] or [2], wherein the metal layer has a thickness of 0.1 μm to 20 μm.
[4] The uneven portion of the metal layer has an interval between adjacent concave portions and convex portions of 0.05 μm to 10 μm, and a difference in height between the bottom of the adjacent concave portion and the highest portion of the convex portion is 0. The dresser for abrasive cloth according to any one of [1] to [3], which is 0.05 μm to 15 μm.
[5] The dresser for polishing cloth according to any one of [1] to [4], wherein the metal layer is composed of one or more metals of Ti, Ni, Al, Cu, brass, Cr, and Au.
[6] The dresser for polishing cloth according to any one of [1] to [4], wherein the abrasive grains have a particle size of 5 μm to 300 μm.
[7] The dresser for polishing cloth according to any one of [1] to [5], wherein the abrasive grains are diamond abrasive grains.
[8] The dresser for abrasive cloth according to any one of [1] to [7], wherein the support material is made of resin or metal.
[9] The dresser for polishing cloth according to [8], having a resin layer for adhering abrasive grains to a surface of the metal support material, and a surface in contact with the resin layer of the metal support material having an uneven portion. .
[10] The dresser for abrasive cloth according to [8] or [9], wherein the metal support is made of stainless steel.

[11] A method for producing a dresser for polishing cloth according to any one of [1] to [10],
A step of forming a metal layer on the surface of the abrasive grains, a step of etching the metal layer to form the concavo-convex portions, and a method of supporting the abrasive grains with a resin through the etched metal layer A method of manufacturing a dresser for polishing cloth, comprising the step of adhering to a surface of the polishing pad.

  The dresser for polishing cloth of the present invention has a sufficient fixing force between the resin and the abrasive grains, and the falling off of the abrasive grains is suppressed. Moreover, since it is possible to suppress the falling off of the abrasive grains, it is possible to suppress the occurrence of scratches. For this reason, when the dresser of the present invention is applied to a CMP polishing pad conditioner, the quality of the product substrate can be improved and high productivity can be maintained. Moreover, since there is a sufficient fixing force between the metal support material and the resin layer for fixing the abrasive grains, it is possible to suppress the resin layer from peeling off from the metal support material.

FIG. 1A is a schematic cross-sectional view of the dresser for polishing cloth of the present invention, FIG. 1B is a schematic view showing the interface between the metal layer of the dresser for polishing cloth of the present invention and the resin support material, and FIG. It is a schematic diagram which shows the interface of a metal support material and a resin layer. 2A is a perspective view of the dresser for polishing cloth from the abrasive grain arrangement surface, and FIG. 2B is a schematic diagram showing the wetting angle θ between the resin and the metal layer on the line where the resin and the metal layer are in contact with each other. is there. It is a figure which shows the arrangement pattern of the abrasive grain in an Example.

  Depending on the area of one dresser surface, several to tens of thousands of single crystal abrasive grains (for example, diamond abrasive grains, preferably artificial diamond abrasive grains) are usually fixed. In particular, the surface of diamond is usually stable because carbon atoms are covalently bonded. Therefore, even if diamond is brought into contact with the resin, the diamond and the resin cannot be chemically bonded. Therefore, even if the diamond abrasive grains are fixed to the resin, a sufficient bonding force has not been obtained.

  The inventors of the present invention covered the abrasive grains with a metal layer, provided fine irregularities on the surface of the metal layer, and fixed it to the resin. As a result, the resin enters the concavo-convex portion of the surface of the metal layer, and it has been found that the abrasive grains can be fixed with a sufficient fixing force by the anchor effect at the interface between the resin and the metal layer, and the present invention has been completed.

1. Polishing Cloth Dresser The polishing cloth dresser of the present invention has a support material and a plurality of abrasive grains fixed to a single layer on the surface thereof. Further, the support material in the dresser of the present invention may be a resin support material or a metal support material having a resin layer on the surface. A plurality of abrasive grains are fixed to a single layer on a resin layer formed on a metal support.

  A dresser for an abrasive cloth of the present invention is schematically shown in FIGS. As shown in FIG. 1A, a metal layer 2 exists between the resin 3 and the abrasive grains 1. Moreover, as shown in FIG. 1B, the surface of the metal layer 2 in contact with the resin 3 has an uneven portion. The resin 3 enters the unevenness of the metal layer 2 and the two are bonded by the anchor effect. Therefore, according to this invention, the dresser for abrasive cloth excellent in the adhering force of the abrasive grain 1 is implement | achieved.

  Resin 3 may be a resin constituting a resin support, or may be a resin layer 4 formed on the surface of a support such as a metal support (see FIG. 1C). As shown in FIG. 1C, the surface of the support material 5 (for example, a metal support material) in contact with the resin layer 4 has an uneven portion. The resin layer 4 enters the unevenness of the metal support material 5 and the two are bonded by the anchor effect. Of course, the dresser for polishing cloth of the present invention may be provided with other members as required.

(About metal layers)
The metal layer in the dresser for polishing cloth of the present invention is a layer between the resin and the abrasive grains. Although a metal layer may be provided also on the exposed surface of the support material, from the viewpoint of preventing the metal component from eluting when dressing with the dresser for polishing cloth, only a part of the exposed surface of the support material is used. It is preferable to arrange the metal layer or not to arrange it as much as possible.

  The metal layer has an uneven portion on the surface in contact with the resin. The thickness of the metal layer is preferably 0.1 μm to 20 μm. The thickness of the metal layer means an average thickness. If the metal layer is too thin, it is difficult for a suitable uneven portion to exist on the surface, and the anchor effect at the interface between the resin and the metal layer is reduced. Moreover, even if the thickness of the metal layer is increased to form a large uneven portion, it is difficult to further improve the anchor effect. The thickness of the metal layer is an average thickness observed when the cross-section of the dresser for polishing cloth is directly observed by SEM or TEM.

  In the concavo-convex part of the metal layer, the distance between the adjacent concave part and convex part is preferably 0.05 μm to 10 μm. If the distance is less than 0.05 μm, it is difficult to form the unevenness itself, and it becomes difficult to obtain an anchor effect with the resin. On the other hand, when the interval is more than 10 μm, since the slope of the surface from the lowest part of the concave part to the highest part of the convex part becomes gentle, the anchor effect with the resin tends to be lowered. In addition, the space | interval of an adjacent recessed part and a convex part means the space | interval of the lowest part of an adjacent recessed part, and the highest part of a convex part.

  In the concavo-convex portion of the metal layer, the difference in height between the bottom of adjacent concave portions and the highest portion of the convex portions is preferably 0.05 μm to 15 μm. If the difference in height is less than 0.05 μm, even if an uneven portion is formed on the metal layer, the amount of resin entering is small, and it becomes difficult to obtain a sufficient anchor effect with the resin. Further, even if the height difference is more than 15 μm, it is difficult to obtain further improvement in the anchor effect with the resin.

  It is more preferable that the uneven portion of the metal layer is present on the entire surface of the metal layer in contact with the resin because the anchor effect is maximized. However, a sufficient anchor effect can be obtained if it is present in an area of at least 50% or more of the surface of the metal layer in contact with the resin.

  Furthermore, it has been newly found that the wettability of the resin with respect to the metal layer covering the abrasive grains is remarkably improved by forming fine uneven portions on the metal layer. That is, the wettability of the resin is improved by the fine irregularities on the surface of the metal layer. FIG. 2A is a perspective view of the abrasive grain arrangement surface of the dresser for polishing cloth. When the wettability of the resin with respect to the metal layer covering the abrasive grains is increased, the resin 3 can be held so as to cover the abrasive grains 2 as shown in FIG. 2A.

  The wettability of the resin can be indicated by the wetting angle θ between the resin and the metal layer. The wetting angle θ between the resin and the metal layer refers to the wetting angle between the resin and the metal layer on the line where the resin surface and the metal layer are in contact. More specifically, as shown in FIG. 2B, the wetting angle θ is defined in the same manner as a known wetting angle when a solid and a liquid come into contact with each other. And it was found that the fixing force of the abrasive grains to the support is improved by setting the wetting angle θ in the range of 0 <θ <90 °. When the wetting angle θ is in the range of 10 ≦ θ ≦ 80 °, the fixing force is further improved, which is more preferable.

  Furthermore, in order to improve the pad grinding force, which is one of the important indexes of the polishing cloth dresser, it is necessary that the protruding height of the abrasive grains be large. By setting the wetting angle θ of the resin and the abrasive grains in the range of 0 <θ <90 °, the abrasive grains can be covered with the resin while maintaining a large protruding height of the abrasive grains. For this reason, it is possible to achieve both the pad grinding force and the suppression of falling off of the abrasive grains.

  The wetting angle θ can be controlled by the gap between the concave and convex portions in the concave and convex portions formed on the surface of the metal layer and the difference in height between the highest and lowest portions.

  The thickness of the metal layer, the distance between the concave and convex portions adjacent to the concave and convex portions, and the difference in height between the bottom and the highest portion of the concave portions adjacent to the concave and convex portions are each of the metal layers of ten abrasive grains. Each value is actually measured and taken as the average value of the measured values. In the actual measurement method, a portion where the cross-section can be observed by FIB processing is cut out from the surface portion of the abrasive grain, and the observation is performed directly by SEM or TEM.

  The metal layer covering the abrasive grain surface is preferably composed of one or more metals of Ti, Ni, Al, Cu, brass, Cr, and Au. These metal layers can be formed on the surface of the abrasive grains by a wet process such as solution plating or a dry process such as sputtering or CVD. These metal layers are also excellent in adhesiveness with the diamond abrasive grain surface, and fine irregularities can be easily formed on the surface of the metal layer.

  The metal layer covering the abrasive grains may be a single layer or a laminate composed of a plurality of layers. When the metal layer is composed of a laminated body composed of a plurality of metal layers, it may be possible to further increase the fixing force or improve the workability of the metal layer surface.

  As an example of a specific structure of a laminate of a plurality of metal layers, the surface of diamond abrasive grains is covered with a Ti metal layer, and carbon atoms and Ti atoms of diamond are reacted and chemically bonded. Then, the Ti metal layer is covered with a Ni metal layer or the like. Thereby, a chemical bond between Ti and Ni is also generated, which is more preferable because the bonding force between the diamond abrasive grains themselves and the metal layer can be increased.

  Moreover, the laminated body of a some metal layer may form the metal layer which is easy to chemically bond with an abrasive grain on the abrasive grain side, and may form and obtain the metal layer which tends to form an uneven | corrugated | grooved part on the resin layer side. Thereby, the bond strength between the abrasive grains and the metal layer can be increased, and the metal workability can be improved.

(About abrasive grains)
The abrasive grains in the dresser for polishing cloth of the present invention may be single crystal grain abrasive grains having grinding ability. Single crystal particles include, for example, diamond, cubic boron nitride, boron carbide, silicon carbide, and aluminum oxide. Among these abrasive grains, diamond abrasive grains have a high grinding ability. However, conventionally, even if diamond abrasive grains are fixed to a resin support, sufficient bonding strength has not been obtained. On the other hand, in this invention, the effect that a diamond abrasive grain can be firmly fixed to resin is acquired.

  The grain size of the diamond abrasive grains is preferably 5 μm or more and 300 μm or less. The size of the abrasive grains is appropriately selected according to the object to be polished by CMP. In the case of CMP polishing of a semiconductor integrated circuit, a blocky type which is a relatively large single crystal diamond abrasive grain and whose diamond surface is a crystal wall surface is used. On the other hand, in the case of CMP polishing of a magnetic hard disk substrate such as Al or glass, relatively small single crystal diamond abrasive grains are used.

  When the diameter of the diamond abrasive grains is less than 5 μm, the number of irregularities on the surface of the metal layer provided on each diamond abrasive grain is reduced, so that the anchor effect at the interface between the metal layer and the resin support material is reduced. there is a possibility. On the other hand, when the grain size of the diamond abrasive grains exceeds 300 μm, the unevenness of the pad after polishing by the dresser for polishing cloth is increased, and the flatness of the dressed pad is likely to be lowered. Therefore, if the grain size of the abrasive grains is 10 μm or more and 200 μm or less, it is more preferable from the viewpoint of easy manufacture of a polishing cloth dresser and pad flatness after polishing with the polishing pad.

(About support material)
The support material in the dresser for polishing cloth of the present invention may be a resin support material or a metal support material. As will be described later, in the case of a metal support material, a resin layer is formed on the surface of the metal support material on which abrasive grains are arranged.

  The shape of the support material is not particularly limited, and may be a polygonal shape such as an octagon or an icosahedron. Usually, in pad grinding using a dresser for polishing cloth, the pad is ground while the support material itself rotates. Therefore, in order to ensure uniform grindability, the shape of the support material is preferably a disc shape.

(Resin support material)
The material of the resin support material in the dresser for polishing cloth is not particularly limited, but a thermoplastic resin that is warm and fluid and that is solidified at room temperature is suitable. As will be described later, the abrasive coated with the metal layer is brought into contact with the resin in a fluid state, and the abrasive and the resin are brought into close contact with each other. Thereby, the dresser for polishing cloth can be manufactured.

  The CMP dresser is used in an acidic or alkaline slurry. Therefore, it is preferable that the resin constituting the support material has acid resistance and alkali resistance. Examples of such resins include super engineering plastics such as polyphenylene sulfide (PPS), liquid crystal polymer (LCP), polyamide (PA), polycarbonate (PC), polybutylene terephthalate (PBT), and polyethylene terephthalate (PET), and general-purpose engineering. Plastic and general-purpose plastic can be applied.

  The resin constituting the support material may contain silica particles, alumina particles, alumina fibers, SiC fibers, carbon fibers, and glass fibers. Thereby, the rigidity of the resin-made support material can be adjusted, the coefficient of thermal expansion of the metal layer coated with the abrasive grains can be approximated, and the adhesion between the metal layer and the resin-made support material can be improved.

(About metal support materials)
The material of the metal support in the polishing cloth dresser is preferably stainless steel, which is a material having acid resistance or alkali resistance. A metal member whose acid resistance or alkali resistance is improved by performing treatment such as Ni plating or Cr plating on the surface of a normal steel material can be used.

  When using a metal support material, a resin layer is formed on the abrasive fixed surface of the metal support material. As the material of the resin layer formed on the abrasive fixed surface of the metal support material, the same resin as the resin support material can be used. The thickness of the resin layer may be at least about half the grain size of the abrasive grains, and the adhesive strength of the abrasive grains and the adhesion strength with the metal support material are sufficient. If the thickness of the resin layer is smaller than about half of the grain size of the abrasive grains, the area for covering the abrasive grains with the resin is reduced, so that the adhesive strength of the abrasive grains is reduced. The upper limit of the thickness of the resin layer is not particularly limited, and the thickness can be changed according to the shape of the dresser set in the CMP apparatus.

  The resin layer of the metal support material can be formed directly on the metal support material by injection molding. Or it can form by producing a resin layer (resin film) by a well-known method previously, and thermocompression bonding the resin layer and metal support materials.

  The surface of the metal support material on which the resin layer is formed may be uneven. The unevenness enhances the adhesion between the metal support and the resin layer by an anchor effect. In the concavo-convex portion, the distance between adjacent concave portions and convex portions is preferably 0.05 μm to 10 μm. If the interval is less than 0.05 μm, it is difficult to form the uneven portion and it is difficult to obtain the anchor effect. On the other hand, if it exceeds 10 μm, the slope of the surface from the lowest part of the concave part to the highest part of the convex part becomes gentle, so that the anchor effect tends to be lowered. In addition, the space | interval of an adjacent recessed part and a convex part means the space | interval of the lowest part of an adjacent recessed part, and the highest part of a convex part.

  In the concavo-convex portion, the difference in height between the bottom of adjacent concave portions and the highest portion of the convex portions is preferably 0.05 μm to 15 μm. When the difference in height is less than 0.05 μm, even if an uneven portion is formed on the surface of the metal layer, the amount of resin entering is small, and it is difficult to obtain a sufficient anchor effect. Further, even if the difference is more than 15 μm, it is difficult to further improve the anchor effect.

  If the uneven portions of the metal layer, which is a feature of the present invention, are present on all surfaces of the metal layer in contact with the resin support material, the anchor effect is maximized and more preferable, but the metal layer is in contact with the resin. A sufficient anchor effect can be obtained if it is present in an area portion of at least 50% or more of the surface area of the metal layer.

  The metal may be exposed on the surface of the metal support opposite to the abrasive grain fixing surface. Compared with the case where the metal is exposed on both sides of the metal support material, the elution of the metal is suppressed to half or less. In addition, the amount of the eluted metal can be greatly suppressed by covering the metal by applying a normal resin coating or DLC coating on the surface opposite to the abrasive grain fixing surface.

2. Manufacturing method of polishing cloth dresser The polishing cloth dresser of the present invention is not particularly limited. For example, 1) the surface of the abrasive grains is coated with a metal layer, and 2) the surface of the metal layer is uneven by etching or the like. 3) Abrasive grains coated with a metal layer having a concavo-convex part are obtained by bringing the abrasive grains into contact with the abrasive fixed surface of the resin support.

  In the case of using a metal support material, the polishing cloth dresser of the present invention forms an uneven portion on the surface of the metal support material by etching or the like in addition to 1) and 2). ) It is obtained by performing a step of forming a resin layer on the surface of the metal support material and a step of bringing the abrasive grains into contact with the resin layer. The step of forming the resin layer on the surface of the metal support material and the step of bringing the abrasive grains into contact with the resin layer may be performed simultaneously.

(Formation of metal layer on abrasive grains)
As a method for coating a predetermined metal layer with a predetermined thickness on the surface of diamond abrasive grains, there are known methods such as a) a wet process such as solution plating, or b) a dry process such as sputtering or CVD. The thickness of the metal layer covering the abrasive grains can be controlled by the processing time of each of the above methods.

  In order to coat the abrasive grains with the metal layer by sputtering, the abrasive grains are spread on a metal plate or a glass plate, and the plate is placed at a position facing the target in the chamber of the sputtering apparatus. When sputtering is performed in this state, the metal atoms ejected from the target reach only about half of the surface of the abrasive grains and do not reach about half of the surface of the abrasive grains. Therefore, about half of the surface of each abrasive grain is covered with the metal layer. Thus, you may coat | cover only half of the surface of an abrasive grain with a metal layer.

  The thickness of the metal layer covering the abrasive grains is preferably 0.1 μm to 20 μm. If it is less than 0.1 μm, it is difficult to form a suitable uneven portion on the surface. Therefore, when the thickness of the metal layer is less than 0.1 μm, the anchor effect at the interface between the resin and the metal layer is lowered. Moreover, even if it exceeds 20 μm, it is difficult to expect further improvement of the anchor effect. Therefore, if the thickness of the metal layer is in the range of 3 μm to 20 μm, a suitable uneven portion can be stably formed, and by making the thickness within this range, a more stable anchor effect can be obtained.

  When the abrasive grains are coated with a Ti metal layer, the Ti metal layer is sputtered using a metal Ti target, or the Ti metal layer is treated by a pyrosol process in which a solution containing Ti ions is sprayed onto the abrasive grains heated to a predetermined temperature. It is preferable to form. In particular, when diamond abrasive grains are coated with a Ti metal layer by these treatments, Ti atoms are chemically bonded to C atoms of diamond abrasive grains, so that the adhesion between them is good.

  It is also possible to coat the abrasive grains with a Ti metal layer and then coat with an Ni metal layer. When a Ti metal layer is present on the surface of the abrasive grains, a Ni metal layer can be formed by electroplating.

  When the abrasive grain surface is directly coated with a Ni metal layer, the Ni metal layer can be formed by an electroless Ni plating method using a hypophosphorous acid aqueous solution or the like. In this case, a Ni-P alloy metal layer is obtained.

  In the case where the abrasive grains are coated with an Al metal layer, a method may be used in which the abrasive grains are put into a mesh container made of stainless steel, immersed in molten Al metal, and then pulled up. However, it is difficult to control the thickness of the Al metal layer by this method. Therefore, sputtering is more suitable for forming the Al metal layer.

  When the abrasive grains are coated with a Cu metal layer, the Cu metal layer can be formed on the abrasive grains using an electroless Cu plating method. It is also possible to coat the abrasive grains with a Ti metal layer by the above-described method, then perform electroplating, and further coat with a Cu metal layer.

  The abrasive grains may be coated with brass. Brass is an alloy of Cu 60-70 mass% and Zn 30-40 mass%. A metal layer made of brass is obtained by plating. The brass plating can be obtained from a Cu-Zn alloy plating bath having a predetermined concentration ratio. Also, a metal layer made of brass plating is formed on the abrasive grain surface by performing alloying heat treatment after separately performing Cu plating and Zn plating on the abrasive grain surface so as to have a predetermined mass ratio. Is done. Cu plating can be performed by the method mentioned above. When the Zn plating is formed on the Cu plating, an electroplating method can be used.

  When the abrasive grains are coated with a Cr metal layer, the Cr metal layer can be formed on the abrasive grains by sputtering using metal Cr as a target. Further, abrasive grains plated with Ti, Ni, Cu, or brass in advance may be coated with a Cr metal layer by electroplating.

  When the abrasive grains are coated with an Au alloy layer, an Au—Cu alloy or an Au—Ni alloy is suitable as the Au alloy. When the abrasive grains are coated with the Au—Cu alloy layer, Au electroplating or Au—Cu alloy electroplating is performed on the abrasive grains plated with Cu in advance by electroless plating. The Au—Cu alloy has high hardness when about 60 mass% of Au is present. When the abrasive grains are coated with the Au-Ni alloy layer, Au electroplating or Au-Ni alloy electroplating is performed on the abrasive grains that have been previously plated with Ni by electroless plating.

(Formation of irregularities on the metal layer)
An uneven portion is imparted to a metal layer formed with a predetermined thickness on the surface of the abrasive grains. Examples of the method for providing the uneven portion include a wet etching method and an electrolytic etching method according to each metal. In the wet etching method, by adjusting the concentration of the etching solution, the etching time, etc., the distance between the adjacent concave and convex portions of the concave and convex portions, and the height between the bottom of the adjacent concave portions and the highest portion of the convex portions are adjusted. The difference can be adjusted. Also, in the electrolytic etching method, by adjusting the type of electrolytic solution, current density, etc., the distance between the adjacent concave and convex portions of the concave and convex portions, and the height between the bottom of the adjacent concave portions and the highest portion of the convex portions. The difference between can be adjusted.

  As described above, it is preferable to control the interval between the concave and convex portions adjacent to the concave and convex portions on the surface of the metal layer to be in the range of 0.05 μm to 10 μm, and between the bottom of the adjacent concave portions and the highest portion of the convex portions. It is preferable to control the height difference in the range of 0.05 μm to 15 μm.

  In order to form uneven portions on the Ti metal layer covering the abrasive grains by wet etching, for example, the abrasive grains coated with the Ti metal layer are immersed in an aqueous solution containing nitric acid and hydrofluoric acid in a container, Stir for hours. By changing the concentration of nitric acid and hydrofluoric acid and the immersion time, the gap between the concave and convex portions of the concave and convex portions, and the difference in height between the bottom of the adjacent concave portions and the highest portion of the convex portions can be adjusted. .

  In addition, in order to form an uneven portion on the Ti metal layer by electrolytic etching, for example, a pair of platinum electrodes is placed in a mixed solution of methyl alcohol, ethylene glycol and perchloric acid in a container, and platinum on the anode side Abrasive grains coated with a Ti metal layer may be disposed so as to be in contact with the electrodes, and a DC voltage of several tens of volts may be applied between the electrodes. By adjusting the mixing ratio of methyl alcohol, ethylene glycol and perchloric acid, and the applied voltage, the distance between the concave and convex portions of the concave and convex portions, the height of the bottom of the adjacent concave portions and the highest portion of the convex portions You can change the difference.

  In order to form the concavo-convex portion on the Ni metal layer covering the abrasive grains, for example, wet etching may be performed with an aqueous solution of nitric acid and glacial acetic acid. Alternatively, electrolytic etching may be performed with an aqueous ammonium persulfate solution.

  In order to form the concavo-convex portion on the Al metal layer covering the abrasive grains, for example, wet etching may be performed with an aqueous solution of hydrochloric acid, nitric acid, and hydrofluoric acid. Alternatively, electrolytic etching may be performed with a borohydrofluoric acid aqueous solution.

  In order to form the concavo-convex portion on the Cu metal layer or brass metal layer covering the abrasive grains, for example, wet etching may be performed with an aqueous solution of ammonium persulfate and hydrochloric acid. Alternatively, electrolytic etching may be performed with a phosphoric acid aqueous solution.

  In order to form the concavo-convex portion in the Cr metal layer covering the abrasive grains, for example, wet etching may be performed with an aqueous solution of nitric acid and hydrochloric acid. Alternatively, electrolytic etching may be performed with an aqueous solution of oxalic acid.

  In order to form the concavo-convex portion on the Au metal layer covering the abrasive grains, for example, wet etching may be performed with an aqueous solution of nitric acid and hydrochloric acid. Alternatively, electrolytic etching may be performed with an aqueous hydrochloric acid solution.

(Adhesion of abrasive grains to support material)
In order to fix the abrasive grains to the resin support material, the molding of the resin support material and the fixing of the abrasive grains to the resin support material can be performed simultaneously. For example, the resin-made support material is formed by bringing a resin having fluidity into contact with the abrasive grains and applying pressure to make the resin contact. Thereby, the resin which comprises a resin-made support material can enter the uneven | corrugated | grooved part of the metal layer surface. More specifically, the abrasive coated with the metal layer is temporarily fixed on the substrate, and a fluid resin heated under high pressure conditions is brought into contact with the temporarily fixed abrasive to support the resin. Mold the material. The abrasive grains temporarily fixed to the substrate are preferably patterned in the same manner as the arrangement pattern of the abrasive grains of the dresser. By arranging an adhesive such as an adhesive tape on the substrate in advance, the abrasive grains can be temporarily fixed.

  In order to fix the abrasive grains to the metal support material, first, a resin layer is formed on the surface of the metal support material. In order to form the resin layer on the surface of the metal support material, for example, a resin in a fluid state is brought into contact with the metal support material, and pressure is applied to closely adhere the resin layer. Thereafter, the abrasive grains are temporarily fixed on the resin layer of the metal support material, and the support material temporarily fixed with the abrasive grains is heated to remelt the resin. Thereby, the resin of the resin layer can enter the concavo-convex portion on the surface of the metal layer.

  Further, in order to fix the abrasive grains to the metal support material, a plate-like resin (resin film) is disposed on the metal support material, and the resin melts in a state where the abrasive grains are temporarily fixed on the resin film. The temperature may be raised to a temperature. Thereby, a resin layer can be formed between the metal support material and the abrasive grains.

  An uneven portion is preferably formed on the surface of the metal support material on which the resin layer is formed. In order to form an uneven portion on the surface of the metal support material, the metal support material may be immersed in an etching solution. When a material such as mild steel is used for the metal support material, a picric acid alcohol solution or an alcohol nitrate solution can be used. When SUS304 stainless steel is used as the support material, a ferric chloride solution or a Kalling solution can be used. The difference in height between the gap between the concave and convex portions and the lowest portion of the adjacent concave portions and the highest portion of the convex portions can be controlled by the concentration of these etching solutions and the immersion time.

  An injection molding method and a warm die press method are suitable for bringing the resin into contact with the abrasive grains. In particular, the injection molding method is preferable because of its excellent productivity. In order to improve the adhesion of the resin to the uneven portion on the surface of the metal layer, it is more desirable to remove the gas in the vicinity of the uneven portion by vacuum degassing or the like before the resin contacts the uneven portion. That is, it is preferable to make it the pressure reduction conditions.

  The arrangement pattern of the abrasive grains fixed to the support material may be random or regular. In the case of regular arrangement, abrasive grains may be arranged at each vertex of a matrix such as a triangle, quadrangle, pentagon, or hexagon. Moreover, it is possible to arrange abrasive grains in various pattern areas. In order to place the abrasive grains, for example, the abrasive grains are dropped onto a substrate that can be set in a mold of an injection molding machine through an opening of a sieve having an opening at a predetermined position, and the abrasive grains are arranged at a predetermined position on the substrate. do it.

  In addition, when the abrasive grains coated with a ferromagnetic Ni metal layer are placed on a substrate placed on a magnet, the Ni metal layer covering the abrasive grains is disposed facing the magnet, so the arrangement direction is It's aligned. And the board | substrate which stuck the adhesive tape is piled up, and an abrasive grain is made to adhere to an adhesive tape. Thereby, the abrasive grain part which is not coat | covered with the metal layer adheres to an adhesive tape, and the abrasive grain part coat | covered with the metal layer is exposed without adhering to an adhesive tape. If the abrasive grains and the resin in this state are integrated, the abrasive grain portion coated with the metal layer contacts the resin, and the abrasive grain portion not covered with the metal layer does not contact the resin. Thereafter, if the substrate is removed, the abrasive grains not covered with the metal layer are exposed. Therefore, it is not necessary to remove the metal layer.

  Adjustment of the height of the abrasive grains exposed from the support material (abrasive grain protrusion height) can be adjusted in the state of the abrasive grains temporarily fixed to the substrate. For example, when temporarily fixing abrasive grains to the double-sided tape on the substrate, if the thickness of the double-sided tape is about half of the grain size of the abrasive grains, embedding the abrasive grains in the double-sided tape will result in about half of the abrasive grains. Exposed from double-sided tape. Thereafter, when the resin is brought into contact with the temporarily fixed abrasive and brought into close contact therewith, the abrasive grain portion embedded in the double-sided tape protrudes from the support material without being covered with the resin. As a result, a dresser in which half of the abrasive grains protrude while the abrasive grains and the resin are integrated is obtained.

  When the abrasive particles and the resin that are metal-coated on the entire surface are integrated with each other, the abrasive grain portions protruding from the resin support material are also covered with the metal layer. That is, the portion of the abrasive grain 1 protruding from the resin 3 shown in the schematic diagram of FIG. 1A is also covered with the metal layer 2. In this case, it is possible to dissolve and remove only the metal layer of the abrasive grain portion protruding from the resin 3 with a wet etching solution corresponding to the metal layer covering the abrasive grain. In addition, by integrating the abrasive grains coated with the metal layer and the resin and then performing dummy dressing, only the metal layer at the abrasive grain portion protruding from the resin 3 can be removed. By performing this dummy dressing while flowing a slurry such as colloidal silica, the metal layer can be efficiently removed.

  In this manner, the pad grinding speed is improved by removing the metal layer covering the diamond abrasive grains at the portion protruding from the resin 3. Moreover, it can suppress that a metal component elutes at the time of pad grinding.

  Hereinafter, based on an Example, this invention is demonstrated in detail.

[Example 1]
(Formation of metal layer)
The surface of single crystal artificial diamond abrasive grains having an average particle diameter d of 150 μm was coated with Ni metal by electroless plating. The Ni electroless plating bath contained nickel chloride: 50 g / L, sodium hypophosphite: 10 g / L, sodium citrate: 10 g / L, pH 4 and bath temperature 90 ° C. The plating bath was stirred with a stirrer. In the method of actually measuring the thickness of the metal layer, a portion where the cross section can be observed by FIB processing is cut out from the surface portion of the abrasive grain, and directly observed by SEM or TEM.

(Formation of irregularities)
The abrasive grains on which the Ni metal layer was formed were immersed in an etching solution obtained by diluting a solution of nitric acid: glacial acetic acid = 1: 1 with distilled water to form irregularities on the surface of the Ni metal layer. The gap between the concave and convex portions adjacent to each other in the concavo-convex portion and the difference in height between the bottom of the adjacent concave portion and the highest portion of the convex portion were controlled by the solution concentration of the etching solution and the immersion time. Table 1 shows the concentration (%) of the etching solution and the immersion time (seconds).

  The gap between the adjacent concave and convex portions of the concavo-convex portion, and the difference in height between the bottom of the adjacent concave portion and the highest portion of the convex portion was measured for each of the 10 abrasive grains, and the average value of these values was used. . The thickness of the metal layer was the average thickness measured. The method of actually measuring the distance between the concave and convex portions adjacent to each other in the concavo-convex portion and the height difference between the bottom of the adjacent concave portion and the highest portion of the convex portion is a portion where the cross-section can be observed by FIB processing from the abrasive grain surface portion. Cut out and observed directly with SEM or TEM.

(Formation of resin support material)
The abrasive grains coated with the metal layer having the uneven portions were temporarily fixed on a SUS304 plate having a diameter of 100 mm and a thickness of 2 mm. First, a heat-resistant double-sided tape was affixed on a SUS304 plate. As the double-sided tape, a 100 μm thick heat-resistant double-sided tape was used. Abrasive grains were placed on the attached double-sided tape in the following procedure. About 70 μm corresponding to about half of the diameter (height) of the abrasive grains was pressed into the heat-resistant tape. The temporarily fixed abrasive grains were patterned so as to be located at each vertex of the square matrix, and the interval between the abrasive grains was set to 0.4 mm.

  Specifically, abrasive grains were arranged in a ring-shaped region between a circle 11 having a radius of 25 mm and a circle 12 having a radius of 48 mm drawn on one surface of the SUS304 plate 10. More specifically, this ring-shaped region is divided into four arc-shaped regions (13-1 to 4) at an equal angle (90 °), and a gap (14 mm) between adjacent arc-shaped regions (14 In -1 to 4), diamond abrasive grains were not arranged. Diamond abrasive grains were regularly arranged at each vertex of the square matrix in each of the arc-shaped regions 13-1 to 13-4. The distance between diamond abrasive grains was 0.4 mm. The specific arrangement procedure of the abrasive grains was performed by preparing a sieve having the same pattern as the above-described abrasive grain arrangement and having a hole that allows the abrasive grains to pass through, and dropping the abrasive grains from the sieve mesh.

Next, the SUS304 plate in which the abrasive grains were arranged in a pattern was set on the bottom surface of the mold of the injection molding machine. The abrasive grains of the set SUS304 plate faced the resin inflow side. The diameter of the bottom surface of the mold was 100 mm, and the inner volume of the mold was a cylindrical shape. The resin used was polyphenylene sulfide (PPS). Resin was introduced under the conditions of a mold temperature of 120 ° C., a cylinder temperature of the injection molding machine of 320 to 370 ° C. and an injection pressure of 98 MPa (1000 kgf / cm ² ), and the abrasive grains and the resin were integrated. The amount of resin inflow in one shot was adjusted so that the thickness of the resin support material was 4 mm.

  By removing the SUS304 plate, a dresser for polishing cloth in which diamond abrasive grains were arranged at predetermined positions on the surface of a resin support material having a diameter of 100 mm and a thickness of 4 mm was obtained. The height of the abrasive grains exposed from the resin support (abrasive protrusion height) was about 68 μm. The metal layer covering the abrasive grain surface exposed from the resin was removed by dipping in a solution of nitric acid: 40% hydrofluoric acid = 80: 3.

(Wetting angle θ on the line where the resin surface and metal layer are in contact)
In order to measure the wetting angle θ on the line where the resin and the metal layer of the resin support material are in contact with each other, the cross section containing the abrasive grains and the resin was cut, and the bonding state between the two was observed by SEM. The wetting angle of the resin to the metal layer in the observation cross section was measured using a protractor. In each sample, 10 points were measured and the average value was obtained.

  The wetting angle between the resin surface and the metal layer on the line is controlled by the distance between the concave and convex portions on the concave and convex portions formed on the surface of the metal layer and the difference in height between the highest and lowest portions. I was able to.

(Evaluation)
By the following methods, the amount of metal eluted, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling out of the obtained dressing cloth for polishing cloth were measured.

-Eluted metal amount Each of the prepared dressers for polishing cloth was immersed for 5 days in 1000 mL of a solution in which 4% hydrogen peroxide water was mixed with commercially available slurry for tungsten (Ca2000, W2000). Thereafter, metal elements, Ti, Ni, Al, Cu, Zn, Cr, and Au in the slurry were measured by ICP emission spectroscopic analysis. Table 1 shows the total amount of these elements as the amount of eluted metal into the slurry.

-Pad grinding speed, pad flatness after pad grinding, and number of diamond abrasive grains falling off The pad was ground using the prepared dressing cloth for polishing cloth. The ground pad was made of foamed polyurethane and the pad diameter was 250 mm. This pad was affixed on the polishing machine. The polishing cloth dresser obtained by the above method was fixed to a device having a rotating mechanism and a swinging mechanism in the radial direction of the pad, and a load of 2.0 kg was applied by the pressurizing mechanism and pressed against the pad. While the center of the dresser for polishing cloth was adjusted to the center of the pad, it was swung in the radial direction within a range of 30 mm to 90 mm from the center of the pad. The pad rotation speed was 90 rpm, the dresser rotation speed was 80 rpm, and the oscillation was 10 reciprocations / minute. The pad rotation direction and the dresser rotation direction were the same. Water was supplied to such an extent that the entire ground surface was covered with a water film.

  At the end of 5 minutes from the start of grinding, the grinding was interrupted once, and the pad thickness was measured. The pad thickness was measured with a micrometer along two diameters perpendicular to each other. One diameter was divided into 10 equal intervals, and the average of 20 thickness measurement values near the center of the equally divided portion was determined to obtain the pad thickness. Grinding was continued again, and the pad thickness was measured in the same manner when 10 hours had elapsed from the start of grinding.

  The pad grinding rate was determined from the decrease in pad thickness between 5 minutes and 10 hours later. The pad flatness was evaluated as a value obtained by subtracting the minimum value from the maximum value among the 20 pad thickness values measured after grinding for 10 hours. Further, the number of abrasive grains dropped after 10 hours was determined by observing the used dresser with a stereomicroscope.

[Examples 2 to 11]
Example 1 except that the immersion time of the diamond abrasive grains in the Ni plating bath was adjusted to change the thickness of the metal layer covering the abrasive grains and the conditions for forming the irregularities were changed as shown in Table 1. A dresser for polishing cloth was produced in the same manner as described above. However, the plating bath containing the abrasive grains was stirred with a stirrer, and the abrasive grains were immersed in a new plating bath when the immersion time exceeded 1800 seconds.

[Example 12]
A 0.1 μm Ti metal layer was formed on the abrasive grain surface by a pyrosol method. A Ni metal layer was formed on the Ti metal layer by electroless plating, and uneven portions were formed under the formation conditions shown in Table 1. Otherwise, a dresser for polishing cloth was produced in the same manner as in Example 1.

[Examples 13 to 16]
Polishing in the same manner as in Example 12 except that the immersion time of the diamond abrasive grains in the Ni plating bath was adjusted to change the thickness of the metal layer, and the conditions for forming the irregularities were changed as shown in Table 1. A cloth dresser was prepared. However, the plating bath containing the abrasive grains was stirred with a stirrer, and the abrasive grains were immersed in a new plating bath when the immersion time exceeded 1800 seconds.

[Comparative Example 17]
A polishing cloth dresser was prepared in the same manner as in Example 1 except that the metal layer was not formed.

  The wetting angle θ in the dressers of Examples 1 to 16 is in the range of 0 <θ <90, and it can be seen that both wettability is high and the fixing force is high (the number of diamond dropouts is small). When the wetting angle θ is in the range of 10 ≦ θ ≦ 80 °, the fixing force is further improved. On the other hand, the wetting angle θ in Comparative Example 17 in which no metal layer was formed was θ> 90 ° and the wettability was low. Therefore, in Comparative Example 17, the fixing force was low (a large amount of diamond was dropped).

  The dressers of Examples 1 to 16 all had an eluted metal amount of 0.05 mg / L or less. As a reference example, when the amount of eluted metal in a dresser for Ni electrodeposited polishing cloth produced by trial using a conventionally known method was measured, the amount of eluted metal was 100 to 200 mg / L.

  When the distance between the concave and convex portions adjacent to the concave and convex portions of the metal layer is less than 0.05 μm (see Examples 1 and 13) and exceeds 10 μm (Examples 10, 14, and 15), the metal The anchor effect at the interface between the layer and the resin support was not sufficient, and some diamond abrasive grains dropped out.

  When the difference in height between the bottom of adjacent concave portions of the concave and convex portions of the metal layer and the highest portion of the convex portions is less than 0.05 μm (see Examples 1, 2, and 13), a small number of diamond abrasives Dropping of grains occurred. Therefore, it is possible to prevent the diamond from falling off by setting the distance between the adjacent concave portion and the convex portion of the concave and convex portions and the height of the bottom portion of the adjacent concave portion and the highest portion of the convex portion to 0.05 μm or more. I understand that. On the other hand, in Comparative Example 17 in which the metal layer was not formed, a large amount of diamond dropped out.

  In the dressers of Examples 1 to 16, an excellent pad grinding speed of 4.0 μm / min and an excellent pad flatness of 2.5 μm or less could be obtained.

[Example 21]
(Formation of metal layer)
Single crystal artificial diamond abrasive grains having an average particle diameter d of 150 μm were coated with a Ti metal layer. Coating with Ti metal was performed using a DC magnetron sputtering apparatus, and metal Ti having a purity of 99.9% was used as a target. Diamond abrasive grains were arranged in a single layer on the substrate, and a Ti metal layer was formed on the diamond abrasive grains by sputtering. The sputtering process was interrupted, the direction of the abrasive grains was changed, and the sputtering process was performed again. As a result, there were no abrasive grain parts not covered with the Ti metal layer. The column of coating conditions in Table 2 shows the total sputtering time before and after the interruption. The sputtering conditions were Ar gas 0.3 Pa and output 1000 W. The thickness of the Ti metal layer was controlled by the sputtering time.

(Formation of irregularities)
The abrasive grains were immersed and stirred in an etching solution obtained by diluting 40 mL of nitric acid and 10 mL of 40% hydrofluoric acid with distilled water, thereby forming irregularities on the surface of the Ti metal layer covering the abrasive grains.

(Formation of resin support material)
In the same manner as in Example 1, a polyphenylene sulfide (PPS) resin was introduced under the conditions of a mold temperature of 120 ° C., a cylinder temperature of an injection molding machine of 340 ° C., and an injection pressure of 98 MPa (1000 kgf / cm ² ). An abrasive cloth dresser integrated with a resin support was obtained. The metal layer coated on the surface of the abrasive grain exposed from the resin support was immersed in an etching solution bath and removed. The etching solution was a solution in which the concentration of the etching solution used for forming irregularities on the metal layer was 95 to 100%.

  In the same manner as in Example 1, the wetting angle between the two on the line where the resin surface of the resin support material is in contact with the metal layer was measured.

(Evaluation)
In the same manner as in Example 1, the amount of metal eluted, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling out of the dressing cloth dresser obtained were measured. These results are shown in Table 2.

[Examples 22 to 24]
A dresser for polishing cloth was produced in the same manner as in Example 21 except that the conditions for forming the Ti metal layer (sputtering time) and the conditions for forming the irregularities were changed as shown in Table 2.

[Example 25]
(Formation of metal layer)
Single crystal artificial diamond abrasive grains having an average particle diameter d of 150 μm were coated with an Al metal layer. The coating with Al metal was also performed by sputtering in the same manner as the coating with Ti metal. A metal Al target with a purity of 99.9% was used, and the output was 800 W. The sputtering time was the time shown in Table 2, and the other conditions were the same as in Example 21.

(Formation of irregularities)
Abrasive grains were immersed and stirred in an etching solution in which 75 mL of hydrochloric acid, 25 mL of nitric acid, and 5 mL of 40% hydrofluoric acid were diluted with distilled water to form uneven portions on the surface of the Al metal layer.

(Formation of resin support material)
A polyamide support (PA) was molded into a resin support in the same manner as in Example 1 under the conditions of a mold temperature of 80 ° C., a cylinder temperature of an injection molding machine of 280 ° C., and an injection pressure of 1310 kgf / cm ^2. Got. The metal layer coated on the surface of the abrasive grains exposed from the resin was removed by immersion in an etching solution bath. The etching solution was a solution in which the concentration of the etching solution used for forming irregularities on the metal layer was 95 to 100%.

(Wetting angle θ on the line where the resin surface and metal layer are in contact)
Similar to Example 1, the wetting angle of both on the line where the resin surface is in contact with the metal layer was measured.

(Evaluation)
In the same manner as in Example 1, the amount of metal eluted, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling out of the dressing cloth dresser obtained were measured. These results are shown in Table 2.

[Example 26]
(Formation of metal layer)
Single crystal artificial diamond abrasive grains having an average particle diameter d of 150 μm were coated with 0.1 μm of Ti metal by a pyrosol method, and a Cu metal layer was formed thereon by electroplating. The Cu plating bath contained 70 g / L of cuprous cyanide, 90 g / L of sodium cyanide and 30 g / L of sodium carbonate, and had a pH of 11 and a bath temperature of 55 ° C. Plating conditions were a current density of 3A / dm ^2.

(Formation of irregularities)
Abrasive grains were immersed and stirred in an etching solution obtained by diluting 10 g of ammonium persulfate and 10 mL of hydrochloric acid with distilled water to form uneven portions on the surface of the Cu metal layer.

(Formation of resin support material)
Polybutylene terephthalate (PBT) was used as the material for the resin support. Under the conditions of a mold temperature of 60 ° C., an injection molding machine cylinder temperature of 240 ° C., and an injection pressure of 98 MPa (1000 kgf / cm ² ), a resin support was formed in the same manner as in Example 1 to obtain an abrasive cloth dresser. The metal layer coated on the surface of the abrasive grains exposed from the resin was removed by immersion in an etching solution bath. The etching solution was a solution in which the concentration of the etching solution used for forming irregularities on the metal layer was 95 to 100%.

(Wetting angle θ on the line where the resin surface and metal layer are in contact)
Similar to Example 1, the wetting angle of both on the line where the resin surface is in contact with the metal layer was measured.

(Evaluation)
In the same manner as in Example 1, the amount of metal eluted, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling out of the dressing cloth dresser obtained were measured. These results are shown in Table 2.

[Example 27]
(Formation of metal layer)
The surface of single crystal artificial diamond abrasive grains having an average particle diameter d of 150 μm was coated with Cu by electroless plating. Further, a Zn layer was formed by electroplating. Then, it hold | maintained at 550 degreeC for 5 minute (s) by Ar atmosphere, Cu and Zn were alloyed and it was set as the brass. At this time, the thickness of each plating was controlled so that the mass ratio was Cu 60 to 70% and Zn 30 to 40%.

The electroless plating bath of Cu contains copper sulfate 8-12 g / L, Rossell salt 30-40 g / L, sodium hydroxide 8-10 g / L, and paraformaldehyde 8-12 g / L, pH 13 and temperature 20 ° C. did. The plating thickness was controlled by the immersion time of the diamond abrasive grains. On the other hand, the electroplating bath of Zn contained zinc cyanide 60 g / L, sodium cyanide 35 g / L, and sodium hydroxide 80 g / L, and the bath temperature was 25 ° C. Plating was carried out as a current density of 4A / dm ^2. The plating thickness of Zn was controlled by the plating time.

(Formation of irregularities)
The abrasive grains were immersed in an etching solution obtained by diluting 10 g of ammonium persulfate and 10 mL of hydrochloric acid with distilled water, and stirred to form uneven portions on the surface of the brass alloy layer.

(Formation of resin support material)
Using polyphenylene sulfide (PPS), a resin support was formed in the same manner as in Example 1, and a dresser for polishing cloth was obtained. The metal layer coated on the surface of the abrasive grains exposed from the resin was removed by immersion in an etching solution bath. The etching solution was a solution in which the concentration of the etching solution used for forming irregularities on the metal layer was 95 to 100%.

(Wetting angle θ on the line where the resin surface and metal layer are in contact)
Similar to Example 1, the wetting angle of both on the line where the resin surface is in contact with the metal layer was measured.

(Evaluation)
In the same manner as in Example 1, the amount of metal eluted, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling out of the dressing cloth dresser obtained were measured. These results are shown in Table 2.

[Example 28]
(Formation of metal layer)
Single metal artificial diamond abrasive grains having an average particle diameter d of 150 μm were coated with 0.1 μm of Ti metal by a pyrosol method. Further, a Cr metal layer was formed by electroplating. The electroplating bath of Cr contained chromic anhydride 400 g / L, sodium hydroxide 60 g / L, chromium oxide 8 g / L, and sulfuric acid 0.8 g / L, and the bath temperature was 20 ° C. It was plated at a current density of 70A / dm ^2.

(Formation of irregularities)
The abrasive grains were immersed in an etching solution obtained by diluting 20 mL of nitric acid and 60 mL of hydrochloric acid with distilled water and stirred to form uneven portions on the surface of the Cr layer.

(Formation of resin support material)
Polybutylene terephthalate (PBT) was used as the resin support material. A resin support was molded in the same manner as in Example 1 under conditions of a mold temperature of 60 ° C., an injection molding machine cylinder temperature of 240 ° C., and an injection pressure of 98 MPa (1000 kgf / cm ² ). The metal layer coated on the surface of the abrasive grains exposed from the resin was removed by immersion in an etching solution bath. The etching solution was a solution in which the concentration of the etching solution used for forming irregularities on the metal layer was 95 to 100%.

(Wetting angle θ on the line where the resin surface and metal layer are in contact)
Similar to Example 1, the wetting angle of both on the line where the resin surface is in contact with the metal layer was measured.

(Evaluation)
In the same manner as in Example 1, the amount of metal eluted, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling out of the dressing cloth dresser obtained were measured. These results are shown in Table 2.

[Example 29]
(Formation of metal layer)
Single crystal artificial diamond abrasive grains having an average particle diameter d of 150 μm were coated with 0.1 μm of Ti metal by a pyrosol method, and an Au—Cu alloy layer was formed by electroplating. The electroplating bath of Au—Cu alloy contained 3 g / L potassium gold cyanide, 14 g / L copper cyanide, 0.7 g / L thiourea, and 33 g / L potassium cyanide, and the bath temperature was 60 ° C. It was plated at a current density of 1.5A / dm ^2. By this plating, an approximately 50 mass% Au—Cu alloy layer was obtained.

(Formation of irregularities)
Abrasive grains were immersed and stirred in an etching solution in which 10 mL of nitric acid and 100 mL of hydrochloric acid were diluted with distilled water to form uneven portions on the surface of the Cr layer.

(Formation of resin support material)
Polycarbonate (PC) was used as the resin. A resin support was formed in the same manner as in Example 1 under the conditions of a mold temperature of 80 ° C., an injection molding machine cylinder temperature of 300 ° C., and an injection pressure of 147 MPa (1500 kgf / cm ² ). The metal layer coated on the surface of the abrasive grains exposed from the resin was removed by immersion in an etching solution bath. The etching solution was a solution in which the concentration of the etching solution used for forming irregularities on the metal layer was 95 to 100%.

(Wetting angle θ on the line where the resin surface and metal layer are in contact)
Similar to Example 1, the wetting angle of both on the line where the resin surface is in contact with the metal layer was measured.

(Evaluation)
In the same manner as in Example 1, the amount of metal eluted, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling out of the dressing cloth dresser obtained were measured. These results are shown in Table 2.

[Example 30]
The dresser for polishing cloth was changed in the same manner as in Example 29 except that the formation conditions of the Au—Cu alloy layer (immersion time of Au—Cu in the plating bath) and the formation conditions of the uneven portions were changed as shown in Table 2. Produced. In the same manner as in Example 29, the amount of eluted metal, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling out of the obtained dressing cloth polishing pad were measured. These results are shown in Table 2.

  In the dressers of Examples 21 to 30, the wetting angle θ is in the range of 0 <θ <90, and both wettability is high. Moreover, in the dressers of Examples 21 to 30, all the eluted metals were 0.05 mg / L or less. Therefore, it can be seen that the amount of eluted metal can be suppressed by using the dresser for polishing cloth of the present invention. Furthermore, in the dressers of Examples 21 to 30, an excellent pad grinding rate of 4.0 μm / min and an excellent pad flatness of 2.5 μm or less could be obtained.

  However, when the height between the bottom of the adjacent concave portions of the metal layer and the highest portion of the convex portions is less than 0.05 (Examples 21 and 29), the anchor effect is not sufficient, and some diamond abrasives are used. The grains dropped out. Therefore, it can be seen that the drop-off of diamond can be suppressed by adjusting the interval between the concave and convex portions adjacent to each other and the height between the bottom of the adjacent concave portion and the highest portion of the convex portion. .

[Example 31]
Single crystal artificial diamond abrasive grains having an average particle diameter of 3 μm were used. A dresser for an abrasive cloth was produced in the same manner as in Example 1 except that the immersion time of the abrasive grains in the Ni plating bath and the conditions for forming the irregularities were changed as shown in Table 3. However, the diamond abrasive grains were randomly arranged. The interval between diamond abrasive grains was set to about 5 μm. Also, the diamond abrasive grains are temporarily fixed with a gel adhesive, and the abrasive grains are pushed in before the adhesive is solidified so that the protruding height of the abrasive grains is about half of the abrasive grain diameter. Adjusted.

  About the obtained polishing cloth dresser, the amount of eluted metal, the wetting angle θ, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling off in the same manner as in Example 1. Was measured. These results are shown in Table 3.

[Example 32]
Single crystal artificial diamond abrasive grains having an average particle diameter of 7 μm were used. A dresser for an abrasive cloth was produced in the same manner as in Example 1 except that the immersion time of the abrasive grains in the Ni plating bath and the conditions for forming the irregularities were changed as shown in Table 3. However, the diamond abrasive grains were randomly arranged. The interval between the diamond abrasive grains was set to about 10 μm. Also, the diamond abrasive grains are temporarily fixed with a gel adhesive, and the abrasive grains are pushed in before the adhesive is solidified so that the protruding height of the abrasive grains is about half of the abrasive grain diameter. Adjusted.

  For the resulting polishing cloth dresser, in the same manner as in Example 1, the amount of eluted metal, the wetting angle θ, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling off were obtained. It was measured. These results are shown in Table 3.

[Example 33]
Single crystal artificial diamond abrasive grains having an average particle diameter of 11 μm were used. A dresser for an abrasive cloth was produced in the same manner as in Example 1 except that the immersion time of the abrasive grains in the Ni plating bath and the conditions for forming the irregularities were changed as shown in Table 3. The diamond abrasive grains were arranged at each vertex of the square matrix in the same manner as in Example 1. Moreover, the thickness of the heat-resistant double-sided tape used for temporary fixing was set to half the average particle diameter.

  For the resulting polishing cloth dresser, in the same manner as in Example 1, the amount of eluted metal, the wetting angle θ, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling off were obtained. It was measured. These results are shown in Table 3.

[Example 34]
Single crystal artificial diamond abrasive grains having an average particle diameter of 52 μm were used. A dresser for an abrasive cloth was produced in the same manner as in Example 1 except that the immersion time of the abrasive grains in the Ni plating bath and the conditions for forming the irregularities were changed as shown in Table 3. The diamond abrasive grains were arranged at each vertex of the square matrix in the same manner as in Example 1. Moreover, the thickness of the heat-resistant double-sided tape used for temporary fixing was set to half the average particle diameter.

  For the resulting polishing cloth dresser, in the same manner as in Example 1, the amount of eluted metal, the wetting angle θ, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling off were obtained. It was measured. These results are shown in Table 3.

[Example 35]
Single crystal artificial diamond abrasive grains having an average grain size of 88 μm were used. A dresser for an abrasive cloth was produced in the same manner as in Example 1 except that the immersion time of the abrasive grains in the Ni plating bath and the conditions for forming the irregularities were changed as shown in Table 3. The diamond abrasive grains were arranged at each vertex of the square matrix in the same manner as in Example 1. Moreover, the thickness of the heat-resistant double-sided tape used for temporary fixing was set to half the average particle diameter.

  For the resulting polishing cloth dresser, in the same manner as in Example 1, the amount of eluted metal, the wetting angle θ, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling off were obtained. It was measured. These results are shown in Table 3.

[Example 36]
Single crystal artificial diamond abrasive grains having an average grain size of 148 μm were used. A dresser for an abrasive cloth was produced in the same manner as in Example 1 except that the immersion time of the abrasive grains in the Ni plating bath and the conditions for forming the irregularities were changed as shown in Table 3. The diamond abrasive grains were arranged at each vertex of the square matrix in the same manner as in Example 1. Moreover, the thickness of the heat-resistant double-sided tape used for temporary fixing was set to half the average particle diameter.

  For the resulting polishing cloth dresser, in the same manner as in Example 1, the amount of eluted metal, the wetting angle θ, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling off were obtained. It was measured. These results are shown in Table 3.

[Example 37]
Single crystal artificial diamond abrasive grains having an average grain size of 207 μm were used. A dresser for an abrasive cloth was produced in the same manner as in Example 1 except that the immersion time of the abrasive grains in the Ni plating bath and the conditions for forming the irregularities were changed as shown in Table 3. The diamond abrasive grains were arranged at each vertex of the square matrix in the same manner as in Example 1. Moreover, the thickness of the heat-resistant double-sided tape used for temporary fixing was set to half the average particle diameter.

  For the resulting polishing cloth dresser, in the same manner as in Example 1, the amount of eluted metal, the wetting angle θ, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling off were obtained. It was measured. These results are shown in Table 3.

[Example 38]
Single crystal artificial diamond abrasive grains having an average particle diameter of 285 μm were used. A dresser for an abrasive cloth was produced in the same manner as in Example 1 except that the immersion time of the abrasive grains in the Ni plating bath and the conditions for forming the irregularities were changed as shown in Table 3. The diamond abrasive grains were arranged at each vertex of the square matrix in the same manner as in Example 1. Moreover, the thickness of the heat-resistant double-sided tape used for temporary fixing was set to half the average particle diameter.

  For the resulting polishing cloth dresser, in the same manner as in Example 1, the amount of eluted metal, the wetting angle θ, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling off were obtained. It was measured. These results are shown in Table 3.

[Example 39]
Single crystal artificial diamond abrasive grains having an average grain size of 322 μm were used. A dresser for a polishing cloth was produced in the same manner as in Example 1 except that the immersion time of the diamond abrasive grains in the Ni plating bath of the abrasive grains and the conditions for forming the irregularities were changed as shown in Table 3. The diamond abrasive grains were arranged at each vertex of the square matrix in the same manner as in Example 1. Moreover, the thickness of the heat-resistant double-sided tape used for temporary fixing was set to half the average particle diameter.

  For the resulting polishing cloth dresser, in the same manner as in Example 1, the amount of eluted metal, the wetting angle θ, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling off were obtained. It was measured. These results are shown in Table 3.

  In the dressers of Examples 31 to 39, the wetting angle θ is in the range of 0 <θ <90, and both wettability is high. The eluted metal amounts of Examples 31 to 39 measured in the same manner as in Example 1 were all 0.05 mg / L or less. Therefore, it can be seen that the amount of eluted metal can be suppressed by using the dresser for polishing cloth of the present invention.

  However, when the diameter of the diamond abrasive grains was less than 5 μm (Example 31), the anchor effect was low, and a small number of diamond abrasive grains fell off. On the other hand, when the abrasive grain system exceeded 300 μm (Example 39), the pad grinding speed was improved, but the flatness exceeded 2.5 μm and was lower than the other examples.

[Example 41]
As a metal support, disc-shaped SUS304 stainless steel having a diameter of 100 mm and a thickness of 5 mm was used. The prepared SUS304 stainless steel was immersed in an etching solution obtained by diluting 5 g of ferric chloride and 50 mL of hydrochloric acid with 100 mL of distilled water and stirred to form an uneven portion on the surface of the SUS304 stainless steel. The immersion time was 50 seconds.

(Formation of resin layer on metal support)
SUS304 stainless steel with irregularities formed on the surface was set in a mold of an injection molding machine. Under conditions of a mold temperature of 120 ° C., an injection molding machine cylinder temperature of 340 ° C., and an injection pressure of 98 MPa (1000 kgf / cm ² ), polyphenylene sulfide (PPS) resin flows into the mold to form a resin layer on SUS304 stainless steel. did. The resin layer thickness was set to 80 μm by adjusting the height of the mold.

(Adhesion of abrasive grains)
The same abrasive grains as those used in Example 21 (diamond abrasive grains having an average particle diameter of 150 μm) were used. The abrasive grains were temporarily fixed on a SUS304 plate having a diameter of 100 mm and a thickness of 2 mm. First, a heat-resistant double-sided tape having a relatively low adhesive strength was attached on a SUS304 plate. As the double-sided tape, a 100 μm thick heat-resistant double-sided tape was used. Abrasive grains were placed on the attached double-sided tape in the following procedure. About 70 μm corresponding to about half of the diameter (height) of the abrasive grains was pressed into the heat-resistant tape. The temporarily fixed abrasive grains were patterned so as to be located at each vertex of the square matrix, and the interval between the abrasive grains was set to 0.4 mm.

  Specifically, abrasive grains were arranged in a ring-shaped region between a circle having a radius of 25 mm and a circle having a radius of 48 mm drawn on one surface of the metal support material. More specifically, this ring-shaped region is divided into four arc-shaped regions at an equal angle (90 °), and diamond abrasive grains are arranged in the gap (2 mm width) between adjacent arc-shaped regions. I didn't. In each arc-shaped region, diamond abrasive grains were regularly arranged so as to be located at each vertex of the square matrix (see FIG. 3). The specific arrangement procedure of the abrasive grains was performed by preparing a sieve having the same pattern as the above-described abrasive grain arrangement and having a hole that allows the abrasive grains to pass through, and dropping the abrasive grains from the sieve mesh.

  Next, after the surface of the abrasive grain side of the SUS304 plate, on which the abrasive grains are temporarily fixed in a double-sided tape, is superimposed on the resin layer of the SUS304 support on which the resin layer is formed, With a 2 kg load applied, the temperature was raised to 300 ° C. at which the resin layer melts. After cooling to room temperature, the superimposed SUS plate for temporary fixing was removed from the SUS support. The abrasive was easily peeled off from the double-sided tape and fixed to the resin layer.

  An abrasive cloth dresser was obtained in which diamond abrasive grains were disposed at predetermined positions on a resin support having a diameter of 100 mm and a thickness of 5 mm. The height of the abrasive grains exposed from the resin support material (abrasive grain protrusion height) was about 72 μm. The metal layer covering the surface of the abrasive grains exposed from the resin was removed in the same manner as in Example 22.

(Wetting angle θ on the line where the resin surface and metal layer are in contact)
Similar to Example 1, the wetting angle of both on the line where the resin surface is in contact with the metal layer was measured.

(Evaluation)
In the same manner as in Example 1, the amount of eluted metal, the wetting angle θ, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling out of the resulting dressing cloth dresser were measured. These results are shown in Table 4.

[Example 42]
An uneven portion was formed on the surface of the support material in the same manner as in Example 41 using a disc-shaped stainless steel of SUS304 having a diameter of 100 mm and a thickness of 5 mm as a metal support material. A resin layer having a thickness of 120 μm was formed on the metal support having the uneven portions. The abrasive grains used, the joining of the abrasive grains, the measurement of the wetting angle, and the evaluation were performed in the same manner as in Example 41. The height of the abrasive grains exposed from the resin support (abrasive grain protrusion height) was about 67 μm. These results are shown in Table 4.

[Example 43]
An uneven portion was formed on the surface of the support material in the same manner as in Example 41 using a disc-shaped stainless steel of SUS304 having a diameter of 100 mm and a thickness of 5 mm as a metal support material. A resin layer having a thickness of 200 μm was formed on the metal support having the irregularities. The abrasive grains used, the joining of the abrasive grains, the measurement of the wetting angle, and the evaluation were performed in the same manner as in Example 41. The height of the abrasive grains exposed from the resin support (abrasive protrusion height) was about 68 μm. These results are shown in Table 4.

[Example 44]
As the metal support material, a disc-shaped SUS304 stainless steel having a diameter of 100 mm and a thickness of 5 mm was used. However, the uneven | corrugated | grooved part formation process was not implemented on the SUS304 support material. A 120 μm thick resin layer was formed thereon. The abrasive grains used, the joining of the abrasive grains, the measurement of the wetting angle, and the evaluation were performed in the same manner as in Example 41. The height of the abrasive grains exposed from the resin support (abrasive protrusion height) was about 68 μm. These results are shown in Table 4.

  In the dressers of Examples 41 to 44, the wetting angle θ on the line where the resin layer and the metal layer on the abrasive grain surface are in contact is in the range of 0 <θ <90, and both wettability is excellent. There was no loss of diamond abrasive grains. In Examples 41 to 43 in which the concavo-convex portions were formed on the SUS304 support material, the adhesion of the resin layer was excellent, and no peeling occurred. In Example 44 in which the uneven portion was not formed on the support material, a part of the resin layer was peeled off from the support material. Moreover, in the dressers of Examples 41 to 44, an excellent pad grinding rate of 4.0 μm / min and an excellent pad flatness of 2.5 μm or less could be obtained.

  The eluted metal amounts of Examples 41 to 43 measured in the same manner as in Example 1 were all 0.11 mg / L or less. The amount of the eluted metal in Example 44 in which the resin layer was peeled off was as large as 0.17 mg / L as compared with Examples 41 to 43, but it was in a practically acceptable range. Therefore, it can be seen that the amount of eluted metal can be suppressed by using the dresser for polishing cloth of the present invention.

[Example 51]
As the metal support material, a disc-shaped SUS304 stainless steel having a diameter of 100 mm and a thickness of 5 mm was used. The prepared SUS304 stainless steel was immersed in an etching solution obtained by diluting 5 g of ferric chloride and 50 mL of hydrochloric acid with 100 mL of distilled water, and stirred to form uneven portions on the surface of the support material. The immersion time was 50 seconds.

(Formation of resin layer)
Using an injection molding machine, a mold temperature of 120 ° C., a cylinder temperature of the injection molding machine of 340 ° C., an injection pressure of 98 MPa (1000 kgf / cm ² ), polyphenylene sulfide (PPS) resin was introduced, and the plate thickness was 250 μm. A plate was made. This plate was cut out to a diameter of 100 mm and overlaid on the surface on which the concavo-convex portion of the SUS304 metal support was formed. While applying a load of 5 kgf to the whole, thermocompression bonding was performed at 270 ° C. to form a resin layer having a thickness of 250 μm on the metal support material.

(Adhesion of abrasive grains)
The same abrasive grains as those used in Example 22 (diamond abrasive grains having an average particle diameter of 150 μm) were used. The abrasive grains were temporarily fixed on a SUS304 plate having a diameter of 100 mm and a thickness of 2 mm. First, a heat-resistant double-sided tape having a relatively low adhesive strength was attached on a SUS304 plate. As the double-sided tape, a 100 μm thick heat-resistant double-sided tape was used. Abrasive grains were placed on the attached double-sided tape in the following procedure. About 70 μm corresponding to about half of the diameter (height) of the abrasive grains was pressed into the heat-resistant tape. Abrasive grains were placed on the attached double-sided tape in the following procedure. The temporarily fixed abrasive grains were patterned so as to be located at each vertex of the square matrix, and the interval between the abrasive grains was set to 0.4 mm.

  Specifically, abrasive grains were arranged in a ring-shaped region between a circle having a radius of 25 mm and a circle having a radius of 48 mm drawn on one surface of the metal support material. More specifically, this ring-shaped region is divided into four arc-shaped regions at an equal angle (90 °), and diamond abrasive grains are arranged in the gap (2 mm width) between adjacent arc-shaped regions. I didn't. In each arc-shaped region, diamond abrasive grains were regularly arranged so as to be located at each vertex of the square matrix (see FIG. 3). The specific arrangement procedure of the abrasive grains was performed by preparing a sieve having the same pattern as the above-described abrasive grain arrangement and having a hole that allows the abrasive grains to pass through, and dropping the abrasive grains from the sieve mesh.

  Next, after the surface of the abrasive grain side of the SUS304 plate, on which the abrasive grains are temporarily fixed in a double-sided tape, is superimposed on the resin layer of the SUS304 support on which the resin layer is formed, With a 2 kg load applied, the temperature was raised to 300 ° C. at which the resin layer melts. After cooling to room temperature, the superimposed SUS plate for temporary fixing was removed from the SUS support. The abrasive was easily peeled off from the double-sided tape and fixed to the resin layer.

  A dresser for polishing cloth was obtained in which diamond abrasive grains were arranged at predetermined positions on a metal support having a diameter of 100 mm and a thickness of 5 mm. The height of the abrasive grains exposed from the resin surface from the bottom of the resin surface (abrasive grain protrusion height) was about 70 μm. The metal layer covering the abrasive grain surface exposed from the resin was removed in the same manner as in Example 22.

  Similar to Example 1, the wetting angle of both on the line where the resin surface is in contact with the metal layer was measured.

(Evaluation)
In the same manner as in Example 1, the amount of eluted metal, the wetting angle θ, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling out of the resulting dressing cloth dresser were measured. These results are shown in Table 5.

  In the dresser of Example 51, the wetting angle θ on the line where the resin layer and the metal layer on the abrasive grain surface are in contact is in the range of 0 <θ <90, and the wettability of both is high. There was no loss of diamond abrasive grains. The resin layer in which the concavo-convex portion was formed on the SUS304 support material was excellent in adhesion, and no peeling occurred. Furthermore, the dresser of Example 51 was able to obtain an excellent pad grinding rate of 4.3 μm / min and an excellent pad flatness of 2.4 μm. The amount of eluted metal measured in the same manner as in Example 1 was 0.11 mg / L or less. Therefore, it can be seen that the amount of eluted metal can be suppressed by using the dresser for polishing cloth of the present invention.

  ADVANTAGE OF THE INVENTION According to this invention, the dresser for polishing cloths with few falling-off of an abrasive grain and few elution metals when grinding a pad is obtained. Therefore, the dresser for polishing cloth of the present invention can be applied to dressing polishing pads of various polishing apparatuses.

DESCRIPTION OF SYMBOLS 1 Abrasive grain 2 Metal layer 3 Resin 4 Resin layer 5 Support material 10 SUS304 board 11,12 yen 13-1-4 Arc-like area | region 14-1-4 Gap

Claims (9)

A polishing cloth dresser in which a plurality of abrasive grains are fixed to a single layer with a resin on the surface of a support material,
There is a metal layer between the resin and the abrasive grains, the surface of the metal layer in contact with the resin has an uneven portion ,
The uneven portion has an interval between adjacent concave portions and convex portions of 0.05 μm to 10 μm, and a difference in height between the bottom of the adjacent concave portions and the highest portion of the convex portions is 0.05 μm to 15 μm. ,
A dresser for polishing cloth , wherein a wetting angle θ between the resin and the metal layer is in a range of 0 <θ <90 ° on a line where the resin and the metal layer are in contact with each other . The dresser for polishing cloth according to claim 1 , wherein the metal layer has a thickness of 0.1 μm to 20 μm. The dresser for polishing cloth according to claim 1 or 2 , wherein the metal layer is composed of one or more metals of Ti, Ni, Al, Cu, brass, Cr, and Au. The dresser for abrasive cloth according to any one of claims 1 to 3 , wherein the abrasive grains have a particle size of 5 µm to 300 µm. The dresser for polishing cloth according to any one of claims 1 to 4 , wherein the abrasive grains are diamond abrasive grains. The dresser for polishing cloth according to any one of claims 1 to 5 , wherein the support material is made of resin or metal. The dresser for an abrasive cloth according to claim 6 , further comprising a resin layer for adhering abrasive grains to a surface of the metal support material, and a surface in contact with the resin layer of the metal support material has an uneven portion. The dresser for abrasive cloth according to claim 6 or 7 , wherein the metal support is made of stainless steel. It is a manufacturing method of the dresser for abrasive cloths as described in any one of Claims 1-8 ,
Forming a metal layer on the surface of the abrasive grains;
Etching the metal layer to form the irregularities;
Forming a resin layer on a support material by an injection molding method;
And a step of fixing the abrasive grains to the surface of the support material by the molded resin layer through the etched metal layer.

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