WO2005095056A1

WO2005095056A1 - Cmp conditioner

Info

Publication number: WO2005095056A1
Application number: PCT/JP2005/005926
Authority: WO
Inventors: Hiroshi Iiyoshi; Takashi Kimura; Tuguhisa Koyama; Hiroaki Iizuka
Original assignee: Mitsubishi Materials Corporation
Priority date: 2004-03-31
Filing date: 2005-03-29
Publication date: 2005-10-13
Also published as: US20070259609A1; JP2005313310A; KR20060133052A; TW200600265A

Abstract

[PROBLEMS] To prevent generation of scratches due to dropping of abrasive grains by stably and firmly fixing the grains, in a CMP conditioner whereupon the abrasive grains are firmly fixed on a protruding part on a base material upper plane, and to ensure a space for holding a grinding liquid between a protruding edge plane of the protruding part on the circumference of the abrasive grain and a pad, at the time of dressing. [MEANS FOR SOLVING PROBLEMS] The CMP conditioner is provided by forming the protruding parts (3, 4), which protrude from the upper plane (2) of the base material (1) rotating in an axis line rotating direction on the upper plane (2), and firmly fixing a plurality of grinding grains (5) on the protruding parts (3, 4). The grinding grains (5) are firmly fixed on the protruding edge planes (3A, 4A) facing the protruding direction of the protruding parts (3,4), so as not to be protruded from a virtual extension plane (P) extended in the axis line direction from circumferences (3C, 4C) of the protruding planes (3A, 4A).

Description

Specification

CMP conditioner

Technical field

The present invention relates to a CMP conditioner used for dressing a polishing pad of a CMP (chemical mechanical polishing) apparatus for polishing a semiconductor wafer or the like. Background art

[0002] As this type of CMP conditioner, for example, Patent Document 1 discloses that a plurality of substantially columnar projections are formed on the upper surface of a disk-shaped base material (base metal) at intervals and these projections are formed. It has been proposed that a plurality of abrasive grains, such as diamonds, are fixed to the surface by a metal plating phase. Therefore, according to such a CMP conditioner, it is possible to maintain a high grinding pressure on the cannonball in which the top surface of the base material of the conditioner to which the cannonball is fixed does not hit the node / node of the CMP device, and the sharpness can be maintained. The grinding fluid can be retained in the recesses between the projections, and the chip discharge performance can be improved.

[0003] Further, in Patent Document 2, a plurality of small-article layer portions protruding in a convex curved shape are provided at intervals from each other on the upper surface of a base material, and the outer periphery of these small abrasive grain layers is provided. On the side, there is provided a substantially ring-shaped circumferential granule layer portion projecting at the same height as the small abrasive layer portion, and a plurality of granules are also provided with a metal-coated phase on the surface of the granule layer portion. A CMP conditioner that has been fixed by the proposed method has been proposed. Of these, the surface pressure of the conditioner is not excessively increased due to the surface contact of the circumferential gunshot layer with the pad, and the sharpness is reduced at the small shotgun layer. Good grinding can be achieved, thereby suppressing excessive shaving of the nod and crushing of the cannonball, and can secure good sharpness by appropriate cutting.

The outer peripheral side of the base material of the circumferential cannonball layer portion has a convexly curved surface or a tapered shape with a cross section R that is inclined more gradually than the inner side wall, so that peeling of the pad at the start of grinding is prevented. Can be stopped.

Patent Document 1: JP 2001-71269 A

Patent Document 2: Japanese Patent Application Laid-Open No. 2002-337050

Disclosure of the invention Problems the invention is trying to solve

[0004] Incidentally, in Patent Documents 1 and 2, the protrusions protruding from the upper surface of the base material, such as the projecting portion in Patent Document 1 and the small cannonball layer portion and the peripheral cannonball layer portion in Patent Document 2, are disclosed. In order to fix a plurality of munitions on the surface with metal plating phase, mask the top surface of the base material excluding these protrusions and ridges that will become the munition layer, and then fix the abrasive by electroplating Therefore, the projectiles and the shell layer portion have the gunshot particles fixed over the entire surface. For this reason, in such CMP conditioners of Patent Documents 1 and 2, for example, a circular protruding surface constituting a substantially cylindrical protrusion of Patent Document 1 and a cylindrical outer peripheral wall rising from the upper surface of a base material around the protrusion are provided. The projectile is also formed around the intersection ridge portion of the ridge line or the intersection between the ring-shaped (annular) tip surface constituting the circumferential gunshot layer portion of Patent Document 2 and the inner side wall where the base material upper surface force rises. Will be fixed.

[0005] However, an intersection ridge line between a wall surface rising steeply from the upper surface of the base material, such as a peripheral wall surface of these projections and an inner side wall of the circumferential cannon layer portion, and the protruding end surface parallel to the upper surface of the base material. The portion is, for example, the intersection angle between the tip end surface and the wall surface is smaller than the intersection ridge line portion of the tip end surface of the circumferential cannon layer portion of Patent Document 2 and the above-mentioned convex curved surface or the like which has a gentle slope on the outer peripheral side thereof. The pin angles are so-called, and therefore, when the ammunition is fixed on the intersection ridge, the projection also sticks on the end face or on the wall so that the intersection ridge force protrudes. If this occurs, the protruding part cannot be supported by the substrate via the metal plating phase. For this reason, there is a risk that the sticking of such portions of the gunshot may become unstable, and if the unstable gunshot that falls off during the dressing of the pad falls off, the semiconductor wafer to be polished may be damaged. It may cause scratching.

[0006] In addition, when the ammunition is fixed to the entire surface of the protruding portion as described above, and especially when the ammunition is fixed to the intersection ridge portion between the protruding end surface and the wall surface, the nodule contacts the nod at the time of dressing. The cannonball will be positioned almost to the edge of the above-mentioned protruding end surface, and there is sufficient space between the protruding end surface around the prongs near the perimeter and the pad and the pad to hold the grinding fluid during dressing. Is difficult to secure. However, due to the rotation and swinging of the conditioner at the time of dressing, the ammunition positioned at the periphery of the protruding end surface of the protruding portion precedes the other ammunition attached to the protruding end surface. Dressing cut into the pad surface Therefore, if the grinding fluid is not sufficiently held around such a munition, the abrasion of the munition will be remarkably promoted, and the polishing rate of the pad will decrease, and the semiconductor wafer etc. by the CMP apparatus will be reduced. Efficient polishing is hindered and the conditioner life is shortened.

[0007] The present invention has been made under such a background, and in a CMP conditioner in which the projectiles are fixed to the projecting portions protruding from the upper surface of the base material, the projectiles are stably provided. It prevents sticking and prevents the occurrence of scratches due to falling off of the munitions.Moreover, it is possible to secure a space for holding the grinding fluid between the protruding end surface around the munitions and the pad during dressing. It aims to provide a simple CMP conditioner.

Means for solving the problem

[0008] In order to solve the above problems and achieve such an object, a CMP conditioner of the present invention has a projection formed on the upper surface of a base material rotated about an axis so as to also protrude the upper surface force. And a CMP conditioner having a plurality of munitions fixed to the protruding portion, wherein the munitions are moved from the periphery of the protruding surface to the axial direction on a protruding surface facing the protruding direction of the protruding portion. And is fixed so as not to protrude from the virtual extension surface extending to the side.

The invention's effect

[0009] In the CMP conditioner configured as described above, the plurality of munitions fixed to the protruding end surface of the protruding protrusion protrude from the virtual extension surface force on the periphery of the protruding end surface. It's so arranged that some of the shells are located just around the edge! However, even at the opposite side of the projecting direction of the cannonball, that is, on the base material side, there always exists a protruding end surface of the protruding portion. In addition, it can be firmly fixed. In addition, since a plurality of abrasive grains are fixed so that the protruding end face is always disposed on the base material side of the cannon, the pad near the peripheral edge of the above-mentioned abrasive grains during dressing is also provided. A space that can sufficiently hold the grinding fluid can be secured between the tip and the end surface. Therefore, according to the CMP conditioner having the above-described configuration, it is possible to reliably prevent the falling of the munitions at the time of dressing, to prevent the occurrence of scratches on the semiconductor wafer, etc. Efficient semiconductor wafer by maintaining the polishing rate of the pad stably for a long period of time by suppressing wear of nearby abrasive grains And the like, and the life of the conditioner can be extended.

[0010] The plurality of gunshots may be fixed so that a part thereof is located at the very end of the virtual extension surface unless it protrudes from the virtual extension surface. In this case, by adhering only to a region separated by 1Z4 or more of the average particle diameter of the gun from the virtual extension surface, the stability of the gun can be further improved, and the gun can be more reliably prevented from falling off. It is possible to secure a larger space around the cannonball and to secure more sufficient grinding fluid. However, if the ammunition is fixed too deep in the protruding end face, or if a single ammunition is fixed only at the center of the protruding face, for example, May be worn by contact with the pad, or the grinding pressure may be too high due to the gunshot.Therefore, a plurality of shotguns are fixed to the tip end, of which the most It is desirable that the abrasive grains fixed to the peripheral side be fixed to a region within three times the average particle diameter of the virtual extended surface force cannon.

[0011] Here, the protrusion is formed so as to protrude from the upper surface of the base material in a columnar manner, for example, like a substantially columnar protrusion of Patent Document 1, and is perpendicular to the axis. When a protruding end surface and an outer peripheral wall surface rising toward the protruding end surface around the protruding end surface are provided, the cannonball is projected from the outer peripheral edge of the protruding end surface of the protruding portion. What is necessary is just to be fixed so that it does not protrude outside the above-mentioned virtual extension surface which extends. Further, the protrusion is formed in a substantially annular shape on the outer peripheral portion on the upper surface of the base material, for example, as in the case of a circumferential cannonball layer portion in Patent Literature 2, and the substantially annular shape is also perpendicular to the axis of the base material. When the protruding end surface and the inner peripheral wall surface of the base surface on the inner peripheral side of the protruding end surface are provided with a rising force from the upper surface of the base material toward the protruding end surface, and the inner peripheral wall surface, What is necessary is that the protrusion is fixed so as not to protrude inside the upper surface of the base material from the virtual extension surface extending from the inner periphery of the protruding end surface of the protrusion. Furthermore, by coating the top surface of the base material with at least the protruding end surface of the protrusion with an organic tetrafluoride compound, even if a highly corrosive or highly adhesive slurry is used as the grinding liquid, for example, it is ensured. The pad polishing rate described above can be maintained.

Brief Description of Drawings

FIG. 1 shows an embodiment of a CMP conditioner of the present invention, on a substrate 1 along an axis O. FIG. 4 is a plan view of a directional force facing a surface 2 as viewed.

FIG. 2 is a partially enlarged sectional view of the embodiment shown in FIG. 1.

FIG. 3 is a partially enlarged sectional view illustrating a case where the embodiment shown in FIG. 1 is manufactured by a photoresist method.

FIG. 4 is a partially enlarged cross-sectional view illustrating a case where the embodiment shown in FIG. 1 is manufactured by a template method.

FIG. 5 is a cross-sectional view of a CMP conditioner in which a cannonball 5 protrudes from a virtual extension plane P and is fixed.

Explanation of symbols

[0013] 1 base material

2 Upper surface of substrate 1

3, 4 protrusion

3A, 4A Tip surfaces of projections 3, 4

3B Outer wall of protrusion 3

4B Inner wall of protrusion 4

3C, 4C Edge of 3A, 4A

5 abrasive

6 Metal plating phase

7 Photoresist film

8 templates

O Base 1 center axis

P Virtual extension surface

L A region at least 1Z4 of the average grain size of abrasive grains 5 from virtual extension plane P

M Area within 3 times the average grain size of abrasive grains 5 from virtual extension plane P

N Non-stick area

BEST MODE FOR CARRYING OUT THE INVENTION

FIG. 1 and FIG. 2 show an embodiment of the CMP conditioner of the present invention.

In this embodiment, the substrate 1 is made of a metal material such as stainless steel as shown in FIG. The upper surface 2 which is formed in a plate shape and has a circular shape at the time of dressing is directed to a node / node of the CMP apparatus, and the axis O reciprocates in the radial direction of the pad while being rotated about the central axis O of the substrate 1. Rocked. A plurality of protrusions 3 protruding in a column shape from the upper surface 2 are formed on the inner peripheral portion of the upper surface 2 at predetermined intervals, and the outer peripheral portion of the upper surface 2 also has A substantially annular projection 4 projecting from the upper surface 2 is formed, and a plurality of gunshots 5 are fixed to each of the projections 3 and 4. The portion of the upper surface 2 excluding the protrusions 3 and 4 is a flat surface perpendicular to the axis O.

[0015] Of these protrusions 3, 4, the columnar protrusion 3 formed on the inner peripheral portion of the upper surface 2 is projected into a columnar (or disk-like) shape having a center line parallel to the axis O. That is, a flat circular protruding surface 3A perpendicular to the axis O of the base material 1, and a cylindrical outer peripheral surface rising from the upper surface 2 toward the protruding surface 3A around the protruding surface 3A. The outer peripheral wall 3B is formed integrally with the base material 1. Accordingly, in the present embodiment, the outer peripheral wall surface 3B is formed so as to rise vertically from the flat upper surface 2, and the tip end surface 3A vertically intersects with the outer peripheral wall surface 3B, and the intersecting ridge line is circular. The crossing ridge line is a peripheral edge (outer peripheral edge) 3C of the protruding end surface 3A of the protruding portion 3. The plurality of protrusions 3 have the same shape and the same size, that is, the outer diameter and the protrusion height from the upper surface 2 to the protrusion end surface 3A are equal to each other.

On the other hand, the protrusion 4 formed on the outer peripheral portion of the upper surface 2 is also integrally formed with the base material 1 so as to protrude from the upper surface 2 in the direction of the axis O. A flat annular protruding surface 4A, which is also perpendicular to the axis O, and an upper surface 2 on the inner surface of the protruding surface 4A. An inner peripheral wall surface 4B having a cylindrical inner peripheral surface rising from the upper surface 2 toward the tip end surface 4A is provided. Also, the inner peripheral wall surface 4B rises perpendicularly to the upper surface 2 like the outer peripheral wall surface 3B of the protruding portion 3 and vertically intersects with the protruding end surface 4A, so that the intersection ridge line is centered on the axis O. The periphery (inner periphery) 4C of the protruding end surface 4A of the protruding portion 4 is formed in a circular shape. The protruding height of the protruding end surface 4A from the upper surface 2 is equal to the protruding height of the protruding portion 3. The outer peripheral portion of the protruding end surface 4A is an inclined surface 4D that gradually retreats toward the outer peripheral side at an angle smaller than the angle at which the inner peripheral wall surface 4B rises. [0017] Further, the cannonball 5 fixed to such projections 3, 4 is, for example, a diamond cannonball having an average particle diameter of about 160 m, and is provided with a metal-coated phase 6 such as Ni by electrodeposition. Each of the projections 3 and 4 is fixed to each of the projections 3 and 4. In these cannonballs 5, about 30% of the average particle diameter protrudes from the metal-plated phase 6, and the remaining part is buried and held in the metal-plated phase 6. !

[0018] Then, the plurality of gunshots 5 fixed to the projections 3 and 4, respectively, are provided on the projections 3A and 4A of the projections 3 and 4, as shown in FIG. The peripheral edge 3C, 4C force of 4A does not protrude from the virtual extension surface P extending in the axis O direction. That is, in plan view as viewed from the direction facing the upper surface 2 of the base material 1 along the axis O, the projectiles 5 force on the protruding end surfaces 3A, 4A.5 The peripheral edges 3C, 4C of the protruding end surfaces 3A, 4A. It is fixed so as to be located inside the protruding end faces 3A, 4A with respect to the peripheral edges 3C, 4C without overlapping.

[0019] Of the protrusions, the protrusion 3 projecting from the upper surface 2 in a cylindrical shape has a center line parallel to the axis O, and further has an outer peripheral wall surface 3B extending parallel to the center line and an axis O. Since the intersection ridge line with the vertical protruding end surface 3A is the peripheral edge 3C, the virtual extension surface P is an extension surface of the outer peripheral wall surface 3B, and the projectile 5 does not protrude outside the virtual extension surface P. It is like that. In addition, the protrusion 4 formed in an annular shape on the outer periphery of the upper surface 2 also has a protrusion 4A perpendicular to the axis O, and an inner periphery perpendicular to the protrusion 4A, that is, parallel to the axis O. Since the intersection ridge line with the wall surface 4B is the peripheral edge 4C of the protruding end surface 4A, the virtual extension surface P is an extension surface of the inner peripheral wall surface 4B, and the cannonball 5 is located on the upper surface 2 more than the virtual extension surface P. It does not protrude to the peripheral side. In the present embodiment, a plurality of abrasive grains 5 are also fixed to the inclined surface 4D on the outer peripheral side of the protruding end surface 4A of the annular protruding portion 4 by the metal plating phase 6 continuous from the protruding end surface 4A. On the other hand, except for the end surfaces 3A, 4A and the inclined surface 4D, the outer peripheral wall 3B of the protrusion 3; the inner peripheral wall 4B of the protrusion 4; I'm stuck!

Further, in the present embodiment, the above-mentioned cannonball 5 is not only protruded from the virtual extension surface P of the protruding end surfaces 3A, 4A of the protruding portions 3, 4, but also on these protruding end surfaces 3A, 4A. Only within the region L that is at least 1Z4 or more of the above average particle size of the abrasive grains 5 from the virtual extension surface P of All of the plurality of projectiles 5 fixed to the projections 3 and 4 are accommodated in the region L. In addition, the cannonball 5 fixed to the peripheral edges 3C, 4C of the protruding end surfaces 3A, 4A is positioned so as to be located in the area M within three times the average particle size of the cannonball 5 from the virtual extension plane P. Have been. Therefore, in the present embodiment, a non-fixed region N where the munitions 5 are not fixed to at least the width of 1Z4 of the average munition from the peripheries 3C and 4C is formed on the peripheral edges 3C and 4C of the protruding end surfaces 3A and 4A. At least one of the plurality of abrasive grains 5 is fixed in the area M excluding the non-fixed area N, that is, in the area of the peripheral edge 3C, 3D force 1 Z4 to 3 times the average particle diameter. Become.

[0021] In this manner, the cannonball 5 is fixed on the protruding end surfaces 3A, 4A of the protruding portions 3, 4 so as not to protrude from the virtual extension surface P, and particularly, as in the present embodiment, the protruding end surface 3A In order to form the above-mentioned non-adhered area N on the peripheral edges 3C and 4C of 4A and 4A, for example, one of the methods is to form a metal shell 5 only in the area L by a photoresist method as shown in FIG. What is necessary is just to make it adhere by the auxiliary phase 6. In this photoresist method, a portion of the upper surface 2 of the base material 1 on which the projections 3 and 4 are formed as shown in FIG. After coating with the film 7, the substrate 1 is immersed in a plating solution to form an undercoating layer 6A in the area L exposed from the film 7 as shown in FIG. 3 (b). The material 1 is immersed in a plating solution in which the cannonball 5 is dispersed and electrodeposited, so that the cannonball 5 is temporarily fixed by the first metal plating phase 6B as shown in FIG. 3 (c).

Next, as shown in FIG. 3D, after removing the photoresist film 7 by removing the inner and outer peripheral wall surfaces 3B and 4B of the protrusions 3 and 4 and the upper surface 2 between the protrusions 3 and 4, After dispersing the cannonball 5, the base material 1 is immersed in the plating solution, and the second metal plating phase is applied so that the cannonball 5 protrudes at the above-mentioned protrusion amount as shown in FIG. By forming 6C, only the area L exposed from the photoresist film 7 is covered with the base plating layer 6A and the metal plating phase composed of the first and second metal plating phases 6B and 6C. 6, the CMP conditioner of the above embodiment in which the cannonball 5 is fixed can be obtained. In this case, in the non-fixed region N, the second metal plating phase 6C is formed where the lower metal plating layer 6A and the first metal plating phase 6B are not formed. The phase 6 is formed so as to be slightly thinner at the peripheral edges 3C and 4C as shown in FIGS. 2 and 3 (e). In addition, instead of such a photoresist method, the gunshot particles may be fixed only in the predetermined region L by a template method as shown in FIG.

In this template method, as shown in FIG. 4, an upper plate 8A in which the above-mentioned region L on the upper surface 2 of the base material 1 where the munitions 5 are fixed is opened, and an inner peripheral wall surface of the annular projection 4 4B, a template 8 in which a lower plate 8B having an outer diameter portion that can be fitted into the lower plate 8B and having a hole capable of accommodating the outer peripheral wall surface 3B of the columnar projection 3 is formed by spot welding or the like is used. As described above, the template 8 is fitted with the outer diameter portion of the lower plate 8B into the inner peripheral wall surface 4B of the protrusion 4 and the outer peripheral wall surface 3B of the protrusion 3 accommodated in the hole, as described above. The outer diameter portion of the lower plate 8B and the inner peripheral force of the hole are attached to the upper surface 2 of the base material 1 such that the overhang portion 8C of the upper plate 8A protruding comes into close contact with the protruding end surfaces 3A, 4A of the protrusions 3, 4.

[0024] In this state, by temporarily fixing the cannonball 5 in the same manner as in Figs. 3 (a) to 3 (c), the portion of the protruding end surfaces 3A, 4A where the overhang portion 8C is in close contact is grounded. Since the plating layer 6A and the first metal plating phase 6B are not formed and the cannonball 5 is not temporarily fixed, the template 8 is removed in the next step, and then the same as in FIGS. 3 (d) and 3 (e). By forming the second metal-coated phase 6C, the portion where the overhang portion 8C is in close contact is defined as the non-adhered region N, and the cannonball 5 is formed in the region L further away from the peripheral edges 3C and 4C. The CMP conditioner of the above embodiment fixed by the plating phase 6 can be obtained. In the case of using the template method, the inner peripheral wall surface 4B of the annular projection 4 of the base material 1 is subjected to a finishing force such as lathe finishing to thereby lower the inner peripheral wall surface 4B. It is desirable that the outer diameter of the plate 8B be fitted so that high positioning accuracy can be obtained when the template 8 is mounted on the upper surface 2.

[0025] Further, on the upper surface 2 of the base material 1 to which the cannonball 5 is fixed, at least the protruding end surfaces 3A, 4A of the protruding portions 3, 4, for example, polytetrafluoroethylene (PTFE), Chemical polyethylene “propylene hexafluoride copolymer resin (FEP), tetrafluoroethylene” perfluoroalkyl vinyl ether copolymer resin (PFA), tetrafluoroethylene / ethylene copolymer resin (ET FE), etc. Desirably, an organic tetrafluoride compound is coated. Of course, these protruding end surfaces 3A, 4A, the above-mentioned inclined surface 4D to which the cannonball 5 is fixed, the outer peripheral wall surface 3B of the protruding portion 3 where the cannonball 5 is not fixed, the inner peripheral wall surface 4B of the protruding portion 4, and the protruding surface. Including top surface 2 between parts 3 and 4 The entire upper surface 2 of the substrate 1 may be coated with such an organic tetrafluoride compound. Such a tetrafluoroorganic compound is obtained, for example, by immersing the substrate 1 on which the cannonballs 5 are fixed by the metal-plated phase 6 as described above in a liquid in which the tetrafluoroorganic compound is dispersed. It is formed by crushing and applying electrodeposition coating.

[0026] However, for example, in the CMP conditioner having the above configuration manufactured by these methods, the protrusion 3 which protrudes in a columnar shape on the inner peripheral side of the upper surface 2 of the base material 1 and the outer periphery of the upper surface 2 are formed in an annular shape. On the protruding end faces 3A, 4A facing the protruding directions of these protruding parts 3, 4, a plurality of gunshots 5 fixed to the formed protruding part 4 are provided with the peripheral edges 3C, 4C of the protruding end faces 3A, 4A. The projectile 4 does not protrude beyond the virtual extension surface P extending in the direction of the axis O from 4C, so that each of the individual gunshots 5 is entirely metallized on the opposite side to the above-mentioned projection direction by the protruding end surfaces 3A and 4A. It is in a state of being supported via the auxiliary phase 6. However, at this point, for example, as shown in FIG. 5, even if the end of the abrasive grains 5 on the opposite side of the protruding direction is on the protruding end faces 3A, 4A, the abrasive grains 5 are larger than the virtual extension plane P. If the projectiles are fixed so that they protrude, the projectiles 3A and 4A cannot support the projectiles at the projecting portions, and the projectiles become unstable. Since the surfaces 3A and 4A can support and stably adhere to the projections 3 and 4, it is possible to reliably prevent these munitions 5 from falling off during dressing, and are polished by a CMP device. It is possible to prevent the occurrence of scratches on a semiconductor wafer or the like.

[0027] In addition, since the plurality of gunshots 5 are fixed without protruding from the imaginary extension surface P of the protruding end surfaces 3A and 4A in this manner, the gunshots 5 are located on the peripheral edges 3C and 4C side among these gunshots 5 Around the cannonball 5, there is a node / metal between the pads facing each other at the time of dressing and the protruding surfaces 3A, 4A, or more precisely, around the portion protruding from the metal plating phase 6 of the cannonball 5. A larger space is secured between the plating surface 6 and the surface. Therefore, when the base material 1 of the CMP conditioner rotates while rotating around the axis O during dressing, the projectile 5 located on the side of the peripheral edges 3C and 4C that precedes the other projectiles 5 is surrounded by Since the polishing liquid bites into the pad while a sufficient amount of the polishing liquid is retained in the above space, wear of the preceding cannonball 5 on the peripheral edges 3C and 4C can be suppressed, and polishing of the pad for a long period of time can be suppressed. It is possible to maintain the rate stably, extend the life of the conditioner, and Also, efficient polishing of a semiconductor wafer or the like can be promoted.

In the present embodiment, in the present embodiment, the plurality of cannonballs 5 fixed to the protruding end surfaces 3A, 4A are located in a region L further away from the virtual extension surface P by 1Z4 or more of the average particle size of the abrasive particles 5. As a result, as described above, the non-fixed region N to which the cannonball 5 is not fixed is formed on the peripheral edges 3C and 4C of the protruding end surfaces 3A and 4A. A larger space can be secured around the leading cannonball 5 located on the side of the rim 3C, 4C, so that the cannonball 5 can be accompanied by more grinding fluid. Since the pad is held and bites into the pad, its wear can be further suppressed. Further, by forming the metal-plated phase 6 also in the non-fixed region N as in the present embodiment, the fixing strength of the cannonball 5 on the peripheral edges 3C and 4C is further increased to improve the stability. This makes it possible to more reliably prevent the shell 5 from falling off.

[0029] On the other hand, in the present embodiment, among the plurality of munitions 5 thus fixed in the region L, the abrasive particles 5 fixed to the peripheral edges 3C and 4C are the same as the imaginary extension surface P. Is located in the area M within 3 times the average grain size of the abrasive grains 5, and therefore, the dressing is used as in the case where the powerful gunshot 5 is placed too deep in the tip surfaces 3A and 4A. It is possible to prevent the peripheral edges 3C, 4C of the protruding end surfaces 3A, 4A and the metal-plated phase 6 therearound from being brought into contact with the pad which is sometimes elastically deformed by being pressed by the cannonball 5, thereby preventing the pad from being worn. In addition, since a plurality of gunshots 5 press the pad for each of the protruding end surfaces 3A and 4A, the grinding pressure due to this pressing is dispersed, and the grinding pressure concentrates as in the case of pressing with a single gunshot, for example. To prevent the pad from being cut too much.

[0030] Further, when at least the protruding end surfaces 3A, 4A of the protruding portions 3, 4 on the upper surface 2 of the base material 1 on which the cannonballs 5 are fixed as described above, the tetrafluoro organic compound is coated. Organic tetrafluoride compounds such as these are easily reacted with highly corrosive chemicals.

2

, -CH OH (carbinol group), -COOCH (notyl ester group), COF, -CO

2 8

OH, — CC H (notyl fluoride group), etc. do not exist, so corrosion resistance is high.

2

Even when a highly corrosive slurry is used as the grinding fluid, the corrosion of the metal plating phase 6 that holds the munitions 5 is suppressed, preventing the munitions 5 from falling off, resulting in scratching and a reduction in polishing rate. be able to. Also, by coating the organic tetrafluoride compound in this way, Even when a highly adhesive so-called ceria-based slurry in which fine particles of cerium oxide are dispersed, for example, is used as a grinding fluid, such fine particles are particularly likely to form a node on the upper surface 2 of the substrate 1. Aggregation and adhesion to the protruding end surfaces 3A and 4A that are in contact with each other can be prevented, and the fine particles that have aggregated and adhered to this prevent the abrasive grains 5 from biting the pad, thereby deteriorating the polishing rate. It is possible to prevent the particles that have condensed and adhered from being peeled off and to cause scratches, so that the polishing rate can be stabilized and the scratches can be prevented and the ivy effect can be more reliably achieved. Becomes possible.

In the present embodiment, the protrusion 3 is formed in a columnar shape, and its outer peripheral wall surface 3B rises vertically from the upper surface 2 of the base 1, and the protruding end surface 3A also vertically intersects at the peripheral edge 3C. Also, the inner peripheral wall 4B of the protrusion 4 also rises vertically from the upper surface 2 and vertically intersects with the protruding end surface 4A at the peripheral edge 4C, so that the extension surfaces of these wall surfaces 3B, 4B coincide with the virtual extension surface P. For example, these walls 3B, 4B are inclined such that they gradually recede toward the protruding end surfaces 3A, 4A in the protruding direction, so that the protrusions 3, 4 have a trapezoidal cross section. In this case, the virtual extension plane P is a ridge line (periphery 3C, 4C) where the wall surfaces 3B, 4B intersect with the protruding end surfaces 3A, 4A regardless of the inclination of the wall surfaces 3B, 4B. The force is also a surface extended in the direction of the axis O. Also, the intersection ridges between the protruding end surfaces 3A, 4A and the wall surfaces 3B, 4B may be formed into a convex curved surface such as an arc of a cross section. In this case, the peripheral edges 3C, 4C are formed as flat protruding end surfaces 3A, 4C. The virtual extension surface P is an extension surface extending in the direction of the tangential force axis O. Furthermore, the protrusion 4 does not have to be a complete annular shape.For example, slits extending in the radial direction of the disk-shaped substrate 1 are formed in the protrusion 4 at circumferentially spaced intervals. You can!

Example

Next, the effects of the present invention will be demonstrated with reference to examples of the present invention. In the present embodiment, based on the above embodiment, a CMP conditioner (Example 1) in which an organic tetrafluoride compound is coated on the Organic compound (Tylene tetrafluoride perfluoroalkyl vinyl ether copolymer resin (PFA), molecular formula: 1 (CF) · (ROCF

2 4 m

= CF)) Polishing the pad with a CMP conditioner (Example 2) coated with

2 n

Condition) and measure the nod polishing rate (μm /) for each predetermined elapsed time (h). Specified. In addition, as a comparative example with respect to Examples 1 and 2, without forming the non-adhesion region N of the abrasive grains 5 by the photoresist method or the template method as described above, as shown in FIG. , 4A, a CMP conditioner in which the cannonball 5 protruded was manufactured, and the pad was polished under the same conditions as in Examples 1 and 2, and the change in the pad polishing rate was measured. Table 1 shows the results.

[table 1]

However, in these Examples 12 and Comparative Example, the outer diameter of the base material 1 was 108 mm, the outer diameter of the columnar projection 3 (the outer diameter of the projection end face 3A) was 2 mm, and the inner diameter of the annular projection 4 ( The inner diameter of the tip surface 4A) is 90 mm, the outer diameter of the tip surface 4A is 94 mm, the projection height of the projection 34 is 0.3 mm, and the tip surfaces 3A and 4A are the same as in Examples 12 and Comparative Examples. Average 35 per area A roughly equal number of gunshots 5 were stuck. Further, in Example 2, the thickness of the coating layer made of the organic tetrafluoride compound was about 5 μm, and about 30% of the average particle diameter of the cannonball 5 was made to protrude this coating layer force. I was

On the other hand, the polishing pad was a foamed polyurethane pad (trade name: IC1000) manufactured by Rohm and Haas Co., and had an outer diameter of 380 mm, and the above-mentioned ceria-based slurry was used as a grinding fluid. The rotation speed of the pad was 40 rpm, and the rotation speed of the conditioner was also 40 rpm, and conditioning was performed while applying a load of 80 N to the substrate 1 of the conditioner.

[0036] However, from the results in Table 1 above, in the CMP conditioner of the comparative example, the polishing rate is significantly lower than that of Examples 1 and 2 and the time has elapsed since 1 hour after the start of pad polishing. It can be seen that the reduction rate of the polishing rate in each case is significantly higher than in Examples 1 and 2. Also, after 1 hour, many gunshots 5 that seem to have dropped the conditioner are dispersed on the surface of the nod, and the top surface 2 of the base 1 after polishing was observed. Many of the projectiles 5 protruding from surfaces 3A and 4A had fallen off. In addition, adhesion of the agglomerated cerium oxide particles was also observed on the tip surfaces 3A and 4A.

[0037] On the other hand, in the CMP conditioners of Examples 1 and 2, the polishing rate at the beginning of polishing is particularly high in Example 1, and the rate of decrease in the polishing rate with time is also suppressed low. It was possible to maintain a significantly higher polishing rate than the comparative example throughout the polishing. In addition, even when the upper surface 2 of the base 1 and the surface of the polishing pad were observed after the polishing was completed, no dropping of the cannonball 5 was observed, and in Example 2, aggregation of the cerium oxide particles on the tip surfaces 3A and 4A was observed. No adhesion was observed. The reason why the polishing rate at the beginning of polishing is lower in Example 2 than in Example 1 is that in Example 2, the tip surfaces 3A and 4A were coated with an organic tetrafluoride compound, so that the It is considered that this is because the protrusion amount is smaller than that in Example 1.

Claims

The scope of the claims

[1] A CMP conditioner in which a protrusion protruding from the upper surface is formed on an upper surface of a base material rotated about an axis, and a plurality of munitions are fixed to the protrusion. The CMP conditioner is fixed so as not to protrude from a virtual extension surface extending in the axial direction from a peripheral edge of the protruding end surface on a protruding end surface facing the protruding direction of the protruding portion.

[2] The plurality of munitions are fixed only in a region on the protruding end surface which is separated from the imaginary extension surface by an average particle diameter of the munitions of 1Z4 or more. The above-mentioned CMP conditioner.

[3] Among the plurality of ammunition, the ammunition fixed to the peripheral edge most on the protruding end face is fixed to a region within three times the average particle diameter of the ammunition from the virtual extension surface. The CMP conditioner according to claim 2, characterized in that:

[4] The protruding portion is formed so as to protrude in a columnar shape, the protruding end surface being perpendicular to the axis, and the base material upper surface force around the protruding end surface. Wherein the abrasive grains are fixed so as not to protrude outside the virtual extension surface extending from the outer peripheral edge of the protruding end surface of the projection. A CMP conditioner according to any one of claims 3.

[5] The protruding portion is formed in a substantially annular shape on an outer peripheral portion of the upper surface of the base material, and has a substantially annular protruding end surface perpendicular to the axis, and an inner peripheral surface of the protruding end surface on the base material upper surface. And an inner peripheral wall surface that also rises toward the protruding end surface on the side of the base material, and wherein the cannonball is arranged such that the protruding portion extends from the imaginary extension surface extending from the inner peripheral edge of the protruding end surface of the protruding portion. 4. The CMP conditioner according to claim 1, wherein the CMP conditioner is fixed so as not to protrude inside.

[6] The method according to any one of claims 1 to 5, wherein an organic tetrafluoride compound is coated on at least a tip end surface of the projection on the upper surface of the base material. Described CM p conditioner _n