JP2001071269A - Electrodeposition grindstone - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve sharpness and dischargeability of chips when grinding. SOLUTION: In this grindstone, nearly cylindrical protuberance parts are formed in a center area on one surface of a base metal 19 in a nearly lattice state. An abrasive grain layer 22 is formed on one surface, and plural super abrasive grains are fixed on only the respective protuberance parts by a metal plating phase to form protrusion parts 24. The protrusion part 24 has a height H above a mean grain diameter of the super abrasive grains from an abrasive grain layer bottom part 22a, and has a diameter D of 1-10 mm. The protuberance part of the protrusion part 24 has a corner R part and a top part. The corner R part and the top part are provided with the super abrasive grains. The number of the super abrasive grains provided on each the protrusion part 24 is set to 11-500, while a percentage of an occupying area of the super abrasive grains to the whole area of the abrasive grain layer 22 in a plan view is set to 20-80%.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrodeposition grindstone used for a conditioner for conditioning a polishing pad used when a surface of a material to be polished such as a semiconductor wafer is polished by a CMP apparatus. .

[0002]

2. Description of the Related Art FIG. 9 shows an example of a CMP apparatus (chemical mechanical polishing machine) for chemically and mechanically polishing the surface of a semiconductor wafer (hereinafter simply referred to as a wafer) cut out of a silicon ingot. There is a device. Wafers are required to be mirror-polished so as to have a highly accurate and defect-free surface with the miniaturization of devices. The mechanism of polishing by CMP is based on a mechano-chemical polishing method in which a mechanical element (free abrasive grains) made of fine-particle silica or the like is combined with an etching element made of an alkaline solution, an acidic solution, or the like. In this CMP apparatus 1, a polishing pad 4 made of, for example, hard urethane is provided on a disk-shaped rotary table 3 attached to a center shaft 2 as shown in FIG. A wafer carrier 5 capable of rotating is arranged at a position eccentric from the center axis 2 of the pad 4. The wafer carrier 5 has a disk shape smaller in diameter than the pad 4 and holds the wafer 6. The wafer 6 is disposed between the wafer carrier 5 and the pad 4 and used for polishing the surface on the pad 4 side. It is mirror-finished.

In polishing, for example, the above-mentioned free abrasive grains made of fine silica or the like are used as an abrasive, and a mixture of an alkaline solution for etching and the like is supplied onto the pad 4 as a liquid slurry s. Therefore, the slurry s flows between the wafer 6 held on the wafer carrier 5 and the pad 4, and the wafer 6 rotates on the wafer carrier 5, and at the same time, the pad 4 rotates about the central axis 2. Then, one surface of the wafer 6 is polished by the pad 4. A large number of fine foam layers for holding the slurry s are provided on the pad 4 made of hard urethane or the like for polishing the wafer 6, and the wafer 6 is polished with the slurry s held in these foam layers. Will be However, the repetition of the polishing of the wafer 6 causes the flatness of the polished surface of the pad 4 to be reduced or causes clogging, resulting in a problem that the polishing accuracy and the polishing efficiency of the wafer 6 are reduced.

For this reason, conventionally, the CMP apparatus 1 has
As shown in FIG. 1, a pad conditioner 8 is provided, and the surface of the pad 4 is polished or regrinded (conditioned). The pad conditioner 8 includes an electrodeposition wheel 11 provided on a rotating shaft 9 provided outside the rotary table 3 via an arm 10. The arm 10 is rotated by the rotating shaft 9, thereby rotating the pad 4. Above, the surface of the pad 4 is polished by reciprocatingly oscillating the electrodeposition wheel 11 to recover or maintain the flatness or the like of the surface of the pad 4 and eliminate clogging.
As shown in FIGS. 10 (A) and (B), the electrodeposited wheel 11 has a ring-shaped abrasive layer 13 having a flat surface and a constant width formed on a circular plate-shaped base metal 12. And
For example, as shown in FIG. 11, the abrasive layer 13 is formed by dispersing and fixing superabrasive particles 14 such as diamond or cBN with a metal plating phase 15 on a base metal 12 by electroplating or the like. The metal plating phase 15 is made of, for example, nickel. Incidentally, the surface of the abrasive layer 13 is, for example, 45 °.
Concave grooves 17 are formed in the radial direction at predetermined intervals such as, and the slurry s and chips are discharged to the outside through the concave grooves 17.

When the pad 4 is polished by using the electrodeposition wheel 11, the electrodeposition wheel 11 is reciprocated on the pad 4 at least over a distance corresponding to the radius of the pad 4. When the polishing is performed with the superabrasive grains 14 dispersedly arranged on the abrasive grain layer 13, the pad 4 is cut while brushing down. At this time, the super-abrasive grains 14 form the abrasive layer 1 forming the ground surface.
Since only about 1/3 of the average grain size of the superabrasive grains 14 protrudes from the surface of the abrasive grain 3, the entire abrasive grain layer 13 is solid and the grinding pressure is dispersed and slips, and the brushed hair is knocked down without breaking. There is a drawback that the sharpness is poor and clogging is easy. As another electrodeposition wheel, there is one described in, for example, JP-A-9-19868. This electrodeposition wheel is 2 ~
10 super-abrasives are gathered and arranged in one island shape, and these island-like super-abrasives are dispersed and arranged on the surface of the abrasive layer which is a grinding surface to prevent clogging at the time of grinding, The grinding process can be performed over a long period of time. In such an electrodeposition wheel, an island-like base plating is formed by masking on a base metal, and 2 to 10 superabrasive grains are temporarily fixed to this base plating portion by electroplating, and then the base is fixed. The whole gold is electroplated, and the superabrasive grains are electrodeposited on the abrasive layer.

[0006]

However, in such an electrodeposited wheel, the super-abrasive grains are electrodeposited and fixed on a flat base metal surface. The difference in height between the superabrasive grains protruding from the surface is substantially no more than about の of the average particle size of the superabrasive grains. Therefore, if this electrodeposited wheel is used as a pad conditioner, the work material is made of a soft brushed material having a foamed layer with a thickness of 1.7 mm or the like, such as the pad 4 of the CMP apparatus 1, and a lower portion thereof. In the case of a soft or flexible structure in which a cushion layer having a thickness of about 3.5 mm is provided, the entire surface of the abrasive grain layer is solid at a height difference of about 1/2 or less of the average grain size of the superabrasive grains. You will win. Then, the grinding pressure is not concentrated on the super-abrasive grains, but is dispersed around and slips, and the brush is not cut but falls down, so the sharpness is poor and the opening of the foam layer is crushed, and the discharge of cutting chips is insufficient. And the pad 4 tends to be clogged. In addition, since the height difference (gap) between the superabrasive grains of the abrasive layer and the surface of the metal plating phase is small, the grinding fluid (for example, pure water) of the pad 4 is repelled and easily dried, thus impairing wet grinding. Was.

[0007] In view of such circumstances, an object of the present invention is to provide an electrodeposited whetstone that has good sharpness and good discharge of cuttings and the like. It is another object of the present invention to provide an electrodeposition whetstone in which the opening of the foam layer of the pad is clean and the slurry in the foam layer can be held without clogging.

[0008]

In the electrodeposition grinding wheel according to the present invention, a plurality of projections are formed on the surface of the abrasive grain layer at intervals from each other, and a plurality of superabrasive grains are mounted on each of these projections. It is characterized by being made. Since the superabrasive grains are formed on the projections, the height difference between the bottom of the abrasive layer and the superabrasive grains between the adjacent projections is large, and even a relatively soft work material such as a pad of a CMP apparatus is used. The super-abrasive grains in the projections contact the work material and grind without sticking, so that a high grinding pressure can be maintained on the super-abrasive grains and the sharpness is good, and the bottom of the abrasive layer between the projections In addition, the grinding fluid can be retained, and the cutting powder can be easily discharged.

[0009] The height of the projections from the bottom of the abrasive layer between adjacent projections may be greater than or equal to the average grain size of the superabrasive grains. By ensuring that the gap between the projections and the bottom of the abrasive layer is greater than the average particle size of the superabrasives, the superabrasives in the projections can maintain a high grinding pressure without being solid and have good sharpness. The grinding fluid can be held at the bottom of the abrasive layer, and the discharge of the cutting powder is good. Further, the projection may be formed in a substantially columnar shape having a corner R and a top, and super-abrasive grains may be disposed on the corner R and the top. At the time of grinding, rough grinding is performed with superabrasive grains at the corner R, and then finish grinding is performed with superabrasive grains at the top. The superabrasive grains provided on each projection are 1
The number of the super-abrasive grains may be set in a range of 20% to 80% in a plan view. If the number of superabrasive grains is less than 11, rough grinding and finish grinding for pad 4 cannot be continuously performed, and
When the number is more than 00, there is a disadvantage that clogging of superabrasive grains easily occurs. If the area of the super-abrasive grains is less than 20%, the super-abrasive grains may fall off during grinding, shortening the life, and the super-abrasive grains may damage the work material such as a pad, and may be 80%. If it exceeds, the electrodeposition grindstone may be clogged.

The projections may be arranged in a central region except for an outer peripheral region on the surface of the abrasive grain layer. The grinding process can be performed by swinging the electrodeposition whetstone. Alternatively, the protrusions may be arranged in the peripheral region except for the central region on the surface of the abrasive grain layer.
In the case of grinding by rotating the electrodeposition grindstone, efficient grinding can be performed by arranging superabrasive grains except for a central region having a small peripheral speed. Further, the electrodeposition grindstone may be a CMP conditioner.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will be described below with reference to the accompanying drawings. 1 to 3 relate to the first embodiment. FIG. 1 is a plan view showing a surface of an abrasive layer which is a ground surface of an electrodeposition wheel, and FIG. 2 is a center view of the electrodeposition wheel shown in FIG. FIG. 3 is an enlarged longitudinal sectional view of a main part of a projection of the electrodeposition wheel. The electrodeposited wheel 20 (electroplated whetstone) according to the embodiment shown in FIGS. 1 and 2 is a disk-shaped base 1 made of, for example, stainless steel.
9, a substantially cylindrical raised portion 21 on one surface 19a having a substantially circular shape.
Are formed at predetermined intervals, and the abrasive layer 22 is formed on the surface of one surface 19a, and the surface is defined as a ground surface 20a.
The protruding portions 21 are arranged in a substantially lattice-like or mesh-like manner in a central region except for a ring-like peripheral region 23 on the outer peripheral side of the one surface 19a. The abrasive layer 22 is made of a super-abrasive 1 such as diamond or cBN in a metal plating phase 25 made of, for example, Ni.
4 are provided and are made, for example, by electroplating. Moreover, the superabrasive grains 14 are fixed only on the respective raised portions 21, and the abrasive grain layer bottom portion 22 between the raised portions 21.
a is not provided. In the raised portion 21, a region of the abrasive grain layer 22 including the superabrasive grains 14 and the metal plating phase 25 provided along the substantially columnar surface is referred to as a projection 24.

In the projection 24 shown in FIG.
Are formed by side walls 21c, corner R portions 21a, and top portions 21b formed over the entire circumference, and, for example, 11 to 500 superabrasive grains 14 in the range of 11 to 500 metal plating phases 25 are formed on the entire surface thereof. It is configured to be fixed. Super abrasive 14
If the number is less than 11, the rough grinding and the finish grinding for the pad 4 cannot be performed continuously, and if the number is more than 500, there is a disadvantage that clogging of the super-abrasive grains tends to occur. Each protrusion 24 has a maximum diameter D in the range of φ1 to 10 mm, and the height H from the abrasive grain layer bottom 22 a is equal to or more than the average particle diameter of the superabrasive grains 14, preferably twice or more the average particle diameter, For example, 0.1 mm
Set to about 0.7 mm. The reason why the height H is equal to or larger than the average particle size of the super-abrasive particles 14 is that the super-abrasive particles 14
This is because only the contact is made with the pad 4 to perform the grinding process so that the abrasive grain layer bottom portion 22a does not contact the pad 4. The projections 24 are at the same height. Moreover, the area of the superabrasive grains 14 with respect to the entire area of the grinding surface 20a in a plan view of the electrodeposition wheel 20 is set in a range of 20% to 80%. If the area of the superabrasive grains 14 is less than 20%, the superabrasive grains 14 may fall off during grinding, thereby shortening the life. In addition, the superabrasive grains 14 may touch the pad 4 to damage the pad 4, and If over 80%, electrodeposition wheel 2
0 may be clogged.

The electrodeposited wheel 20 according to the present embodiment is configured as described above. Next, a method of manufacturing the electrodeposited wheel 20 will be described with reference to FIG. In FIG. 4A, for example, a disk-shaped base 19 made of SUS304 or the like is used.
Is removed by etching or the like to leave a plurality of substantially column-shaped raised portions 21A in a lattice shape. The portion removed by etching forms the bottom 22A. Specifically, sulfuric acid or nitric acid is sprayed onto the surface 19a by a high-pressure jet, or the raised portions 21A are formed by electrolytic etching or electric discharge machining.
May be engraved on other parts. .. Shown in FIG. 4 (B) are formed on the entire surface 19a. Each raised portion 21A has a substantially cylindrical shape having a predetermined outer diameter D and a height H '. Then this one side 1
By polishing the edge of each raised portion 21A by shot blasting, barrel polishing, or the like for 9a, a substantially columnar raised portion 21 shown in FIG. 4C is formed. Alternatively, the base metal 19 shown in FIG. 4C may be formed by molding.

Referring to FIG. 3 for the electroplating of the superabrasive grains 14, masking is performed except for the protruding portions 21 to cover the entire surface of each protruding portion 21 with, for example, Ni (Cu, C).
r may be used as the base plating layer 25a. Next, a plurality of superabrasive grains 14 are formed on the base plating layer 25a by, for example, Ni (C
u, Cr, etc.)
Sticks. Then, the masking sheet is peeled off from one surface 19a, and a second metal plating phase 25c made of, for example, Ni (or may be Cu, Cr or the like) is again formed on the entire surface by electroplating. The second metal plating phase 25c need not be formed on the bottom 22A. In this case, the deposit 19
22A constitute the abrasive grain layer bottom 22a. Thus, the super-abrasive grains 14 are formed by the metal plating phase 25 including the base plating layer 25a and the first and second metal plating phases 25b and 25c.
The abrasive layer 22 shown in FIG. 3 and FIG. 4 (d) is formed, and the electrodeposited wheel 20 is formed. In the above description, the peripheral region 2 of the grinding surface 20a of the electrodeposited wheel 20 is described.
Although a large number of the projections 24 are arranged except for the number 3, the projections 24 (projections 21) may be arranged and formed on the entire surface of the grinding surface 20a without being limited to this.

The electrodeposited wheel 20 according to the present embodiment has the above-described configuration, and the pad 4 is mounted on the arm 10 of the CMP apparatus 1 shown in FIG.
In performing the conditioning, the electrodeposition wheel 20 is reciprocated by swinging the arm 10 with respect to the pad 4 on the rotating rotary table 3, and the pad 4 is ground to recover or maintain its flatness. . At the time of grinding, first, in each projection 24 of the electrodeposition wheel 20, the rough grinding of the pad 4 is performed by the superabrasive grains 14 of the corner R section 21a, and then the finish grinding is performed by the superabrasive grains 14 of the top 21b following the corner R section 21a. It can be carried out. Moreover, during grinding, the superabrasive grains 14 are fixed along the corners 21 a to the tops 21 b of the raised portions 21, so that the entire ground surface of the abrasive layer 22 does not come into contact with the pad 4 and collides with the projections. Since the grinding is performed by contact with only the 24 superabrasive grains 14, the grinding pressure applied to the superabrasive grains 14 can be kept high and the sharpness is good.
Therefore, the opening of the foam layer of the pad 4 is cut cleanly and the opening is not crushed, so that the holding capacity of the slurry s can be maintained high. Moreover, since the solid does not contact, the grinding fluid inside the foamed layer is not repelled at the time of grinding, and the grinding is performed in a state containing water.

Even if a part of the super-abrasive grains 14 of the corner R portion 21a of the projection 24 is worn, the remaining corner R portion 21a
The grinding can be continued with the superabrasive grains 14a, and the life of the electrodeposited wheel 20 can be improved. Further, only the superabrasive grains 14 of the projections 24 come into contact with the pad 4 during grinding, and the bottom 22a of the abrasive layer does not contact the pad 4. Therefore, the grinding liquid is applied to the bottom 22a of the abrasive layer between the projections 24. And it is possible to discharge chips and the like through the abrasive layer bottom 22a.

Next, the electrodeposited wheel 20 according to the present embodiment
FIG. 5 shows a state in which the pad 4 is ground by the method. FIG. 5 is a photograph of the surface of the pad 4 at a magnification of 500 times. In the figure, the surface of the pad 4 is finely ground without breaking the opening k of the foam layer, and the flatness can be restored. This allows
When polishing the wafer or the like, the pad 4 is placed in a state where the slurry s or the like can sufficiently stay in the foam layer of the pad 4.
Has been restored. On the other hand, the superabrasive grains were fixed to the base plating layer on the flat base metal by electroplating, and the height difference from the bottom face of the abrasive grain layer was set to be not more than の of the average grain size of the superabrasive grains. FIG. 6 shows a state in which the pad 4 is ground by the electrodeposition wheel according to the conventional example. FIG. 6 is a photograph of the surface of the pad 4 at a magnification of 500 times. According to this, since the ground surface of the abrasive layer is almost solid, the raised surface of the pad 4 is broken down, and the opening k of the foam layer is considerably crushed and clogged. For this reason, the holding ability of the slurry s of the pad 4 becomes insufficient, and the workability of the pad 4 deteriorates.

As described above, according to the present embodiment, since the abrasive layer bottom 22a is not in contact and the superabrasive grains 14 of the projections 24 are in contact with the pad 4 and are ground, the rough grinding to the finish grinding are performed. The grinding can be performed continuously, the grinding pressure applied to the superabrasive particles 14 is high, the sharpness is good, and the opening of the foam layer of the pad 4 can be finely ground without being crushed. In addition, no chips are left on the superabrasives 14 and clogging does not occur, so that the chips can be easily discharged. Moreover, the grinding fluid can be held at the bottom 22a of the abrasive layer between the projections 24, 24, and the repelling of the grinding fluid in the foam layer of the pad 4 can be suppressed. Thus, the wet grinding can be performed without making the condition of the pad 4 dry. It can be maintained in a good water retention state.

Next, a second embodiment of the present invention will be described with reference to FIGS. 7 and 8, and the same parts and members as those in the first embodiment will be described using the same reference numerals. FIG. 7 is a plan view of the electrodeposition wheel, and FIG. 8 is a central longitudinal sectional view of FIG.
In the electrodeposited wheel 30 according to the second embodiment shown in FIGS. 7 and 8, the abrasive layer 22 is formed on one surface 19 a of the base metal 19.
Are formed, and the protrusions 24 are formed in the central region 31 of the abrasive layer 22.
Are not provided, and a large number of protrusions 24 are arranged concentrically in multiple layers up to the outer peripheral edge in the peripheral region 32. A large number of projections 24 forming a concentric circle are separated from each other in the circumferential direction and the radial direction, and the space between the adjacent projections 24 is an abrasive grain layer bottom 22a. Moreover, one side 19a
A plurality of superabrasive grains 14 are fixed to the respective protruding portions 24 of the abrasive grain layer 22 provided thereon by a metal plating phase 25. Instead of the conditioner 8, the electrodeposited wheel 30 according to the present embodiment may be used for grinding the pad 4 while being mounted on the wafer carrier 5 and rotating at a position eccentric to the pad 4. In this case, the electrodeposition wheel 30
Since the peripheral region has a low peripheral speed and a small grinding ability, it is convenient from the viewpoint of the grinding efficiency that the protrusions 24 are not provided.

Instead of the electrodeposition wheel 30 having the concentric projections 24 according to the second embodiment, the projections 24 may be spirally arranged in the peripheral region 32. In this case, the same operation and effect as in the second embodiment can be obtained. Alternatively, the protrusions 24 may be arranged at an arbitrary interval such as a lattice shape or a mesh shape. The arrangement of the projections 24 may be provided on the entire surface of the ground surface 20a. In the above-described embodiment, the protrusion 24 and the protrusion 21 are formed in a substantially columnar shape. However, the shapes of the protrusion 24 and the protrusion 21 are not limited to this, and the height from the abrasive grain layer bottom 22a is not limited thereto. H
Should be equal to or larger than the average particle size of the superabrasive grains 14, and may be a convex curved surface such as a hemisphere or a triangular pyramid. Needless to say, the electrodeposited wheels 20, 30 constituting the electrodeposited grindstone of the present invention can be applied to other polishing and grinding apparatuses other than the conditioner used for the CMP apparatus.

[0021]

As described above, in the electrodeposition grindstone according to the present invention, a plurality of protrusions are formed on the surface of the abrasive grain layer at intervals from each other. Since the height difference between the bottom of the abrasive layer between the projections of the abrasive layer and the superabrasive grains of the projections is large, even a relatively soft work material such as a pad of a CMP apparatus is used. The super-abrasive grains in the protrusions contact the work material and grind without grinding the entire grain layer so that the super-abrasive grains can maintain a high grinding pressure and sharpness, and the sharpness between the protrusions The grinding fluid can be held on the surface of the concave portion of the abrasive layer, and the discharge of the chips is good, so that the chips are not clogged between the superabrasives.

The height of the protrusions from the bottom of the abrasive layer between adjacent protrusions may be equal to or larger than the average particle size of the superabrasives. The super-abrasive grains at the projections can maintain a high grinding pressure without sharpening of the abrasive layer on the work material, and the sharpness is good, and the grinding fluid can be held at the bottom of the abrasive layer between the projections It has a good discharge property of the cutting powder and a good discharge property without clogging of the cutting powder between the superabrasives. Further, the projection may be formed in a substantially columnar shape having a corner R and a top, and super-abrasive grains may be disposed on the corner R and the top. When grinding, rough grinding is performed with superabrasive grains at the corner R portion, and then finish grinding is performed with superabrasive grains at the top portion. The number of superabrasive grains provided on each projection is 11 to 500, and the ratio of the superabrasive grains to the total area of the abrasive layer in a plan view is set in a range of 20% to 80%. Is also good. If the number of super-abrasive grains is less than 11, the rough grinding and the finish grinding for the pad or the like cannot be continuously performed, and if the number is more than 500, clogging of the super-abrasive grains tends to occur. If the area of the super-abrasive grains is less than 20%, the super-abrasive grains may fall off during grinding, shortening the life, and the super-abrasive grains may impinge on a work material such as a pad to damage a wafer or the like, If it exceeds 80%, clogging may occur. By setting the number and the area ratio of the superabrasive grains in each projection as described above, the sharpness can be improved, and the cutting powder can be easily discharged without clogging.

Further, since the projections are arranged in the central region except for the outer peripheral region of the surface of the abrasive grain layer, the grinding process can be performed uniformly by swinging and performing the grinding process. Alternatively, since the protrusions are arranged in the peripheral region except for the central region of the surface of the abrasive layer, when grinding the electrodeposited grinding wheel by rotating, the super-abrasive particles are removed except for the central region having a small peripheral speed. By arranging, efficient grinding can be performed.

[Brief description of the drawings]

FIG. 1 is a plan view of a ground surface of an electrodeposited wheel according to a first embodiment of the present invention.

FIG. 2 is a central longitudinal sectional view of the electrodeposited wheel shown in FIG.

FIG. 3 is an enlarged sectional view of a main part of a protrusion of the electrodeposition wheel shown in FIG. 2;

FIGS. 4A, 4B, 4C, and 4D show a process of manufacturing an electrodeposited wheel according to an embodiment.

FIG. 5 is a 500 × photograph showing a part of a pad ground by an electrodeposition wheel according to an embodiment.

FIG. 6 is a 500 × photograph showing a part of a pad ground by an electrodeposition wheel having a configuration of a conventional example.

FIG. 7 is a plan view of a ground surface of an electrodeposited wheel according to a second embodiment of the present invention.

FIG. 8 is a central longitudinal sectional view of the electrodeposition wheel shown in FIG. 7;

FIG. 9 is a perspective view of a main part of a conventional CMP apparatus.

10A is a partial plan view of the electrodeposited wheel shown in FIG. 9, and FIG. 10B is a longitudinal sectional view taken along line AA of FIG.

11 is a partial longitudinal sectional view of the abrasive grain layer shown in FIG.

[Explanation of symbols]

 14 Superabrasive grain 19 Base metal 20, 30 Electrodeposited wheel 21 Raised part 21a Corner R part 21b Top part 22 Abrasive layer 24 Projection

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/304 622 H01L 21/304 622M (72) Inventor Hanako Hata 246 Egoshi Kurosuno Izumi-cho, Iwaki City, Fukushima Prefecture -1 Mitsubishi Materials Corporation Iwaki Works F term (reference) 3C058 AA04 AA09 AA19 CB03 CB10 DA17 3C063 AA02 AB07 BA24 BB02 BC02 BG03 BG07 CC12 EE10 FF23

Claims (7)

[Claims] 1. An electrodeposited whetstone comprising a plurality of projections formed on a surface of an abrasive grain layer at intervals from each other, and a plurality of superabrasive grains are mounted on each of the projections. 2. The electrodeposited whetstone according to claim 1, wherein the height of the projections from the bottom of the abrasive layer between adjacent projections is equal to or larger than the average grain size of the superabrasives. 3. The projection according to claim 1, wherein the projection is formed in a substantially columnar shape having a corner R and a top, and super abrasive grains are disposed on the corner R and the top.
Electroplated whetstone as described. 4. The number of superabrasive grains provided on each of the protrusions is 11 to 500, and the ratio of the superabrasive grains to the entire area of the abrasive layer in a plan view is in a range of 20% to 80%. The electrodeposited grindstone according to any one of claims 1 to 3, wherein: 5. The electroplated grinding wheel according to claim 1, wherein the projections are arranged in a central region except for a peripheral region on the surface of the abrasive grain layer. 6. The electroplated grinding wheel according to claim 1, wherein the projections are arranged in a peripheral region except for a central region on the surface of the abrasive grain layer. 7. The electrodeposition grinding wheel according to claim 1, wherein said electrodeposition grinding wheel is a CMP conditioner.