TW474855B - Electro depositted grinding wheel - Google Patents

Abstract

A vitrified bond tool comprising: a support body; a vitrified bond layer which is formed on a working surface of said support body; and a plurality of abrasive grains which are held by said vitrified bond layer so as to be fixed relative to said working surface of said support body and which are spaced apart from each other with spacing between the adjacent ones of said abrasive grains.

Description

474855 Printed by A7, Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs 5. Description of the invention (1 [Field of the invention] The present invention relates to a method for grinding the surface of a material to be polished, such as a semiconductor wafer, by a CMP (Chemical Mechanical Polishing) device. The polishing pad used for polishing is a conditioner for re-grinding (connitioning), etc. The metal wheel is used for the electrodeposited grinding wheel or metal bond grinding wheel. This grinding wheel is based on a patent application filed in Japan (Japanese Patent Application No. 11-247676, Japanese Patent Application No. 11-247677, Japanese Patent Application No. 269298, Japanese Patent Application No. 11-3 3 87 34 No., No. 2000-29614), and a part of this specification contains the content described in the Japanese application. [Previous Technology] In the past, silicon ingots (silicone ing〇t) were chemically and mechanically ground. An example of a CMP device (Chemical Mechanical Polisbing Machine) on the surface of a cut semiconductor wafer (hereinafter referred to as a wafer) is the device shown in Fig. 32. The wafer is being miniaturized as the device is miniaturized. Request to enter The mirror surface is polished to a high-precision and defect-free surface. The mechanism using CMP polishing is based on the combination of mechanical elements (free abrasive particles) using fine particles such as stone slab, and the use of test liquids or acid liquids. Mechanical and chemical polishing of elements. This CMP apparatus 1 is made of hard urethane on a disc-shaped rotary table 3 mounted on a central axis 2 as shown in FIG. 32. A polishing pad 4 ′ is provided with a wafer carrier capable of rotation at a position facing the polishing pad 4 and being eccentric from the central axis 2 of the polishing pad 4. ---- I --- line (please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 1 311684 A7 V. Invention System (2 ) " I · ~ ^ 5. This wafer holding disc 5 is a disc shape with a smaller diameter than the grinding 塾 4 to hold the wafer 6, and this wafer 6 is arranged on the wafer holding disc 5 and polishing塾 4 is used to grind the surface of 塾 4 side for mirror processing. (Please read the precautions on the back first Write this page} During grinding, for example, free abrasive grains made of the above-mentioned fine particles ⑦ are used as an abrasive, and a mixture of a test liquid for the last name and the like is supplied as a slurry 3. Because of the polishing pad 4, the slurry 8 will flow between the wafer 6 held by the wafer holding disc 5 and the polishing pad 4. Since the wafer holding disc 5 is used, the wafer 6 will rotate and the polishing pad 4 will Rotating around the central axis 2, one side of the wafer 6 will be polished by the polishing pad 4. A plurality of fine foamed layers for holding the slurry s are provided on a polishing pad 4 made of hard urethane or the like for polishing the wafer 6, and crystallized with the slurry s held in the foamed layers. Grinding of circle 6. The repeated polishing of the wafer 6 will cause the flatness of the polishing surface of the polishing pad 4 to be reduced or clogged, which will cause the problems of reduced polishing accuracy and polishing efficiency of the wafer 6. Therefore, as shown in FIG. 32, the CMP apparatus 1 has been provided with a polishing pad re-sharpener 8 for re-grinding or conditioning the surface of the polishing pad 4. The consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed this grinding pad re-sharpening device 8 on a rotating shaft 9 provided on the outside of the rotary table 3 'through the arm'; 'the electric grinding wheel is provided'; and the arm is used to make the arm 1 〇 Rotate, rotate the electrowinning grinding wheel U on the rotating polishing pad 4 and polish the surface of the polishing pad to restore or maintain the flatness of the surface of the polishing pad 4 and so on. Alternatively, the wafer holding disc 5 can be polished by attaching an electrowinning wheel 11. As shown in Figure 33 (A) and (B), the electro-abrasive grinding wheel 11 'is in the form of a circular paper. The Chinese National Standard (CNS) A4 specification (210 X 297 mm) is applied. 2 311684 A7 A7 Ministry of Economy Wisdom Printed by the Consumer Cooperative of the Property Bureau 311684 V. Description of the invention (3) On the plate-shaped support metal 12, # the upper surface is formed into a flat shape, and a ring-shaped grindstone layer 13 is formed in a predetermined width. 13. For example, as shown in FIG. 34, a superabrasive stone such as diamond or CBN = 14 'is dispersed and fixed on the support metal 12 by electroplating or the like. The metal plating phase 15 is made of, for example, nickel. Bu in the millstone grain layer! For 3 surfaces, press 45, for example. The grooves 17,,,; # mi 苒 7 are formed at equal intervals in the radial direction so that the slurry S or cutting powder passes through the grooves 17 and is discharged to the outside. In addition, 'in the case of using such an electric grinding wheel to perform grinding of the polishing pad 4', the electric grinding wheel U is shaken back and forth on the polishing pad 4 at a distance equivalent to at least half of the grinding 塾. Grinding the superabrasive grains 14 of the grindstone layer 13 will push the fluff-side down and cut at the same time. At this time, 'because the superabrasive grains 14 are only from the grindstone layer which becomes the grinding surface. The average particle size of the grindstone particles 14 is about 1/3, so the entire grindstone particle layer 13 will completely collide, dispersing and sliding the grinding pressure, so that the fluff is not cut and pushed down, the cutting effect is not good and it is easy to plug. Purpose and disadvantage. There is also another type of electrowinning wheel described in, for example, Japanese Patent Laid-Open No. 9_19868. This electrowinning wheel gathers 2 to 10 superabrasive stones and is arranged in an island shape. The island-shaped superabrasive grains are dispersedly arranged on the surface of the grinding grain layer as a grinding surface, in order to prevent clogging during soil grinding and achieve long-term grinding processing. Such an electrolytic grinding wheel is a system Masking on the support metal to form an island Bottom plating, in this bottom plating part, 2 to 10 superabrasive stone particles are temporarily fixed in a layer by plating, and then the support metal I ----- II II --- III i I — I order — — 1 — —-(Please read the precautions on the back before filling out this page) 4/4855 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs' A7 B7 V. Description of the invention (4) The whole is electroplated so that the superabrasive grains are electrolyzed However, because of such an electro-abrasive grinding wheel, the super-grindstone particles are electro-deposited and fixed on a flat support metal surface, so the surface of the metal plating phase of the grindstone particle layer and the surface protruding from this surface. The height difference of the superabrasive stone particles is substantially only less than 1/2 of the average particle size of the superabrasive stone particles. Therefore, if this electrowinning wheel is used as a polishing pad re-grinding device, the material to be cut is Composed of polishing pads 4 such as CMP device 1 with foam layer thickness of 1.7mm, etc., and soft fuzz, and a pad with a thickness of about 3.5111111 ((; 113) 1 丨 〇11) In the case of a layer with a soft or flexible structure, the average particle size of the superabrasive grains The difference between the heights below 1/2 and & the entire surface of the grindstone grain layer will completely collide. Therefore, the grinding pressure will not collect on the supergrind grain and spread to the surrounding and slide, so that the fluff will not be cut and will fall down. However, the cutting effect of the cutting layer is not good, the opening of the foam layer collapses, the discharge of the cutting powder becomes insufficient, and the polishing pad is easy to plug. The disadvantage is that the superabrasive grains of the grindstone layer and the surface of the metal plating phase The height difference (clearance) is small, so there is also a disadvantage that the grinding liquid (such as pure water) of the polishing pad 4 is spilled and is easy to dry, which damages the disadvantages of the wet grinding operation. [Disclosure of the Invention] The present invention is based on the above-mentioned In fact, the purpose is to provide a metal-bonded grinding wheel having a good cutting effect and a good discharge of cutting powder and the like, such as an electrowinning grinding wheel. In addition, another object of the present invention is to provide a sharpened notch in an opening of a foamed layer of a polishing pad, which can keep the researcher's grinding wheel in the foamed layer without blocking the eyes. 311684 -------------— I I i 丨 i I Order --- — — — — — — (Please read the notes on the back before filling this page)

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Printed A7 by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ------------ One B7 _ V. Description of the invention (6) The material of the grinding liquid at the bottom of the granular layer is cut into small powder. In addition, clogging of cutting powder does not occur in the part of the superabrasive grain. The small grindstone particle layer portion may also have a height of the bottom of the grindstone particle layer between the adjacent small grindstone particle layer portions to be equal to or larger than the average particle size of the superground stone. The gap between the small grindstone layer of the 5 grindstone layer and the bottom of the grindstone layer is set to be larger than the average particle size of the supergrindstone, which can greatly ensure that the small grindstone particle layer is not completely collided. Can the superabrasive stone part maintain high grinding: the cutting effect is sharp, while the grinding fluid can be maintained at the bottom of the grindstone layer, the cutting powder has better discharge, so that the cutting powder will not be in the superabrasive stone. Partial clogging occurred and good drainage was achieved. The dog part can also be formed into a substantially cylindrical shape with a corner R part and a top part, and super abrasive stones are arranged in the corner R part and the top part. During grinding, the super-grindstone grains in the corner R can be used for rough grinding ', and then the super-grindstone grains on the top can be used for finishing grinding. The proportion of super-grindstone grains in the small-grindstone grain layer is set to 11 to 500, and when viewed in a plane, the proportion of super-grindstone grains relative to the total area of the millstone grain layer It can be set in the range of 20% to 80%. If there are less than 11 superabrasive grains, the rough grinding and fine addition of H to the grindstone 4 cannot be performed continuously. If there are more than 500, there is a disadvantage that the superabrasive grains are easily clogged. In addition, if the area of the superabrasive stone particles is less than 20%, the superabrasive stone particles may fall off during grinding, which shortens the life of the superabrasive stone particles. It may also be caused by the superabrasive stone particles on the ground material such as a polishing pad. Puncture and damage, and if it exceeds 80%, it may cause clogging of the electrowinning wheel. In addition, the small grindstone layer can also be used in addition to the surface of the grindstone layer -------- ^ ---------- ^ (Please read the precautions on the back before filling in this Page) Applicable to this paper standard _ Home Standard (CNS) A4 Specification _ (2KK) χ Norwegian Gongfu) 6 311684 474855 A7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. The description of the invention (7) is listed outside the domain In the central area, the monk wheel is shaken for grinding. // The small grindstone layer can also be arranged in the surrounding area in addition to the central area of the surface of the grindstone layer. ， ^ ^ — In the case of rotating the grinding wheel for grinding processing, it is In addition to M, outside of the small central area, super-grind grains can be arranged for efficient grinding. And "the grinding wheel according to the present invention" has a central area and a peripheral collar or π in the central area, and a plurality of the aforementioned small millstone grains are formed at intervals from each other, and the small millstone is The grain layer part is equipped with a plurality of superabrasive grains with a metal phase. In the surrounding area, the superabrasive grains are attached with a metal bonding phase and the surrounding area is relatively central. Concentration is high. When grinding, the grinding surface of the electroplated grinding wheel is more peripheral than the central area, and the concentration of superabrasive grains is high. The grinding surface will be in stable contact with the material to be cut in the layer of grinding stones in the outer peripheral area. Therefore, the plane balance is better and the vibration during grinding can be suppressed, and the superabrasive grains of the small grinding stone grains in the central area can be used for grinding processing with high grinding pressure and sharp cutting effect. In addition, since the super-grindstone particles are provided in the small-grindstone particle layer portion, the height difference between the bottom of the stone-grain layer between the small-grindstone particle layer portion and the adjacent small-grind particle layer portion can be increased. The relatively soft material such as the polishing pad of the CMP device does not completely collide, and grinding is performed by contacting the superabrasive particles of the small grindstone layer with the material to be cut. 'It can maintain high grinding pressure and sharp cutting effect. In addition, superabrasive grains in the 'peripheral side' area may be individually dispersed and arranged in the metal-bound phase. Or you can form multiple small grindstone layers in the same way as in the central area, and arrange the intervals between these multiple small grindstone layers ^ ----- (Please read the precautions on the back before (Fill this page) Order.-Line · This paper size is applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) 311684 474855 Printed by A7 B7, Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of Invention (8) It is set smaller than the central area. Alternatively, the interval can be set to be the same as that in the central area, and the number of superabrasive particles fixedly adhered to a small grindstone layer portion can be set to be larger than those in the central area. The grinding wheel 'according to the present invention is characterized in that the grindstone grain layer is a small grindstone grain layer portion formed by arranging a plurality of grindstone grain layers at an approximately center and forming an opening for discharging a grinding fluid. The opening of the grinding fluid supply to the surrounding superabrasive grains is provided at the slightly center of the small abrasive grain layer portion, so that the grinding fluid can be directly supplied to the grinding point of the supergrind grains, which does not cause various grinding. Chips sink and accumulate between the superabrasive grains and can be discharged, and reduce the viscosity of the grinding fluid caused by the mixing of the grinding chips for smooth discharge ', and can also promote the cooling of the superabrasive grains to suppress damage. Further, a discharge path may be formed in a region other than the small grindstone layer portion (projection portion). The supply source and discharge path of the grinding fluid are arranged on both sides with the grinding point of the small grindstone layer part, so the distance between the two can be shortened as much as possible, so that the grinding fluid can fully flow to the grinding point. , And prevent the grinding debris from stagnating in the superabrasive grains to smoothly flow. In addition, the opening of the small grindstone grain layer portion can have a diameter ranging from 0.05 to 3. If the diameter 开 of the P opening is smaller than 0-5mm, the grinding fluid cannot be sufficiently supplied at the grinding point. If it exceeds 3.0mm, the proportion of the small grinding stone particle layer will decrease, which will cause the grinding capacity to decrease. So ignore it. In addition, the diameter (D) of the protrusion can also be 2 to ι0 times the diameter of the opening ("in this range" can prevent the grinding and stagnation at the grinding point, and can smoothly flow against the support The height of the metal protrusion can be 0j to 5 0m --- I -------- I -------- Order · -------- (Please read the back first Note: Please fill in this page again.) This paper size is in accordance with Chinese National Standard (CNS) A4 specification (210 X 297 public meals). 8 311684 Printed by the Consumers ’Cooperative of Intellectual Property Bureau of the Ministry of Economy 474855 5. Description of invention (9). If it is within this range, it is possible to easily allow the grinding fluid or grinding chips to flow between the grinding point and the discharge path on the support metal. The distance between adjacent protrusions (L) may be It is a range of 1/3 to 2 times the average outer diameter of the protrusion. If it is within this range, the interval between the small grindstone grain layer portions can be properly set and the grinding pressure of the superabrasive stone grain can be maintained at the same time. Through this gap, various grinding debris can be smoothly discharged by the grinding fluid. The grindstone grain layer can also form a ring or spiral shape of multiple layers. Therefore, the relative movement with the material being cut can be made. The sum of the grinding lengths of the grindstone grain layers in a slightly parallel direction intersects slightly perpendicularly with the moving direction of the material being cut ^ Arbitrary positions' are formed equal. X, for example, if three or more layers are used to form the grinding In the case of the stone grain layer, it is easy to make the sum of the areas of the grinding stone grain layer in any position slightly orthogonal to the direction slightly parallel to the direction of the relative movement of the material being cut. The discharge path can be formed in the diameter The direction is between a plurality of grindstone grain layers arranged at intervals. The discharge path can be formed by a sub-drainage path between the small grindstone grain layer parts which are connected in each grindstone grain layer, and form a ring shape. Or spirally, the main discharge path between a plurality of grindstone grain layers adjacent to each other in the diameter direction. Various grinding layers produced by grinding in the small grindstone grain layer portion will be related to the small grindstone grain layer. The grinding fluid supplied from the opening of the part is flushed out and flows through the secondary discharge path, and then discharged to the outside after passing through the main discharge path. It can be easily discharged, and it can prevent the grinding debris from sinking and staying in the superabrasive particles. In addition, the small millstone grain layer portion can also be thicker than the metal-bonded phase. In the direction, only one layer of superabrasive stone particles is fixed and bonded, which is called a single-layer grinding wheel. In the grinding wheel with a metal bonding phase of the present invention, the small grinding stone particle layer portion may have a ^ (CNS) ATiF (210; 297 i — 311684 I --- (Please read the precautions on the back before filling out this page) Order:-Wire · 474855 A7 V. Description of the invention (10B7 has the first small mill inclined with respect to the diameter passing through the metal center of the support The stone grain layer portion Λ and the second small millstone grain layer portion inclined toward or in the opposite direction are stable due to the center direction of the metal of the first and second small millstone grain layer portions. Therefore, the stable contact area or contact pressure during grinding is stable. Therefore, there is no local damage to the material being cut. 0 The stone grain layer part is arranged to be centered to move relative to the front and back. The grinding length of the grain layer part of the grinding wheel is relatively long and Easy to plug layer, the grinding length is shorter, and the plug S can be eliminated. Therefore, grinding will be performed in a fine manner to suppress the small vibrations during grinding. 〇 Compared with the first and second small grinding stones, the stability of the seat is improved and the width is improved. And the small grindstone layer part can be economically arranged in a radial pattern. In addition, the grinding stone grain layer can be arranged by the Ministry of Intelligence and the Ministry of Intelligence alternately arranged in the circumferential direction of the support metal and the moving material of the cut material and the grinding wheel. The length is short, so it can eliminate the jamming and prevent the company A from grinding and printing on one side. It can suppress the small vibration during grinding and maintain the paper size. It is applicable to Chinese National Standard (CNS) A4. (_21Q x 297 public soil-while grinding 311684 --------------------- Order · -------- (Please read the note on the back first (Fill in this page again)

; Description of the invention (11) The small grindstone grain layer portion has a diameter square relative to the center line of the -W through the metal center of the support.稃 points when grinding; ^ points, and the part inclined in the opposite direction 1 stone ... Good performance, not easy to generate micro vibration, and small

The part of the grain layer of the grinding stone-the ministry J ^, ^ a ^ and /, one of the other blades has a longer grinding length,

It is easy to plug the eyes, but the other— 古 兔 # w e K is a shorter grinding length, so it can eliminate the plug and prevent the reduction of the cutting effect. Longyue b The grindstone grain layer portion may have a third grindstone grain layer portion and a fourth grindstone grain portion that are curved and arranged to face each other across the center line and face to face or along the center line. Layer Department. The small grindstone layer can be arranged in the full range of the support metal, which can further promote the improvement of the grinding amount and the elimination of the clogging. The feature of the electrowinning wheel of this month is that the small grindstone grains are formed by a single superabrasive grain fixedly bonded with a metal and a bonding phase. Since each superabrasive grain is fixed and adhered to each protrusion one by one, the grinding genus or mortar can not be blocked between the superabrasive grains and stagnated to form a consolidated layer. Smooth out. In addition, even if the material to be cut is soft like a polishing pad of a CMP device, it does not completely collide, but only contacts with a single superabrasive grain of a small abrasive grain layer σ 卩 for grinding, so the grinding pressure is relatively high. , Good cutting effect and good discharge of grinding debris. In addition, the small grindstone grain layer portion may be fixed and bonded with a superabrasive grindstone in a recess formed on the upper surface of the protrusion of the support metal. In the manufacturing of grinding wheels, if the superabrasive stone particles are placed on the recesses of the protrusions and fixed and adhered by electroplating, the positioning of the superabrasive stones is easy, and the corners of the crystals of the superabrasive particles can be easily made. It is placed and protruded toward the upper front end, and the grinding accuracy or grinding -------------- install · -------- order ----- --- --- line (please read the notes on the back before filling this page) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs Employee Cooperatives This paper is printed in accordance with the Chinese National Standard (CNS) A4 specification (210 297 public love) 11 3U684 Ministry of Economy Wisdom A7 printed by the Consumer Cooperative of the Property Bureau 丨 " " 一 '" " " " 一 ...—- B7 _ 5. Description of the invention (I2) The grinding performance such as cutting efficiency is high. The outer diameter (D) of the protrusion may be in a range of 13 to twice the average particle diameter of the superabrasive grains. If it is in this range, it can prevent the stagnation of the grinding debris at the grinding point and flush it smoothly. If it is less than 3 times, the strength of the protrusion will decrease, and the superabrasive stone will be caused by the grinding resistance. The grains are easy to fall off and the protrusions are easy to be damaged. If it is 3 times larger, the arrangement interval of the superabrasive grains is too large, which causes the disadvantages such as reduced grinding capacity or accelerated wear of the superabrasive grains. The height of the protrusion relative to the support metal may be in the range of 0.05 to 30 mm. If it is within this range, it is easy to rinse and discharge the grinding fluid or grinding chips between the grinding point and the discharge path on the support metal. The electrodeposition grinding wheel of the present invention is characterized in that the superabrasive grains are short and blocky superabrasive grains. Short and strong superabrasive grains, although the cutting effect of irregUlar superabrasive grains is inferior, but because the corners are regular polygons such as regular hexagons that are not too prominent or nearly spherical , Corners, ridges, etc. are not easy to break or fall off, so it is not easy to produce broken fragments, etc., and it is not to be over-cut during grinding, and it is not easy to produce scratches on the material being cut. And even if the short and strong superabrasive grains are 'separated by being arranged in a single or in a state where a plurality of short and strong superabrasive grains are assembled', the small abrasives that are firmly bonded by a metal bond The stone grain layers are dispersedly arranged to reduce the absolute number of superabrasive grains. At the same time, if each small millstone grain layer is a single superabrasive grain, the effect of cutting or slicing at the corners is good. In the case of a collection of a plurality of superabrasive grains, because the row of superabrasive grains on the outer side is ground at its ridgeline, the cutting and cutting effects are better, and the grinding energy can be guaranteed- -Packing -------- 1 Ordering ----------- Line (Please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 specifications ( 210 X 297 mm) 12 311684 474855 A7 printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. A description of the invention (13 v force. In addition, a plurality of superabrasive stones can be fixedly adhered to the small millstone grain layer. , And the super-grindstone particles on the outer peripheral side may be short and firm super-grindstone particles. Inside the short and firm super-grindstone particles In the field, the cutting effect is not good because of the relationship with other grindstone particles. However, on the outer peripheral side of the surface without other grindstone particles, the cutting and cutting effects at the corners and edge lines are relatively good. The material to be cut is well ground. The number of super-grindstones in the small grindstone layer can be set to 1 to 500, and the ratio of the super-grindstones to the total area of the above-mentioned grindstone in the plane view can be It is set in the range of 2% to 80%. The electrowinning wheel of the present invention may also be a CMP resharpener. [Simplified description of the drawing] FIG. 1 is a view of the electrowinning wheel of the first embodiment of the present invention. Plan view of the grinding surface. Fig. 2 is a central longitudinal sectional view of the electrodeposited grinding wheel shown in Fig. I. Fig. 3 is an enlarged section of a main portion of the small grindstone layer of the electrodeposited grinding wheel shown in Fig. 2. Figures (A) to (D) show the manufacturing process of the electrodepositive grinding wheel of the embodiment. Figure 5 is a 500-times photograph of a part of the polishing pad after being grinded using the electrodepositive grinding wheel of the embodiment. Figure 6 This is a 500-times photograph of a part of a polishing pad after being grinded using an electrode wheel with the structure of the conventional example. The plan view of the grinding surface of the electrodeposited grinding wheel of the second embodiment. -------------- installation -------- order -------- * line (Please read the notes on the back before filling this page)

297 mm) 13 311684 474855 A7 R7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (14) Figure 8 is the central longitudinal section view of the electrodeposited grinding wheel shown in Figure 7. Fig. 9 is a plan view of a grinding surface of an electrodeposited grinding wheel according to a third embodiment of the present invention. Fig. 10 is an enlarged cross-sectional view of a part of a central area and a peripheral area of the electrodeposited grinding wheel shown in Fig. 9. Fig. 11 is a plan view of the surface of the grindstone grain layer on which the grinding wheel according to the fourth embodiment of the present invention is mounted. Fig. 12 is an enlarged view of a part of the second grinding stone grain layer of the grinding wheel shown in Fig. I 丨. Fig. 13 is a sectional view taken along the line B-B of the grinding wheel shown in Fig. 12. Figures 14 (A) to (C) are diagrams showing the manufacturing process of the grinding wheel according to the fourth embodiment. Fig. 15 is a diagram showing the relationship between the position of the grindstone grain layer and the amount of work in the direction of rotation of the polishing pad with respect to the semicircular portion of the grinding wheel shown in Fig. 11 separated by a dotted line. Fig. 16 is a plan view of a grinding wheel according to a fifth embodiment. Fig. 17 is a plan view of a grinding wheel according to a sixth embodiment. Figure 18 is an enlarged view of a part of the grinding stone grain layer of the grinding wheel shown in Figure 17 (please read the precautions on the back before filling this page). Figure 19 shows other forms of the small grinding stone grain layer. Figure 20 of the cw line section is an enlarged view of a part of the grindstone grain layer of the grinding wheel of the seventh embodiment. Fig. 21 is an enlarged view of a part of the grindstone grain layer of the grinding wheel of the 8th embodiment. CNS) A4 specification (210 X 297 mm) 474855 A7 B7 5. Description of the invention (15) Figure. Fig. 22 is an enlarged view of a part of the grindstone grain layer of the grinding wheel according to the ninth embodiment. '(Please read the precautions on the back before filling out this page) Figure 23 is an enlarged view of a part of the grindstone grain layer of the grinding wheel in the tenth embodiment. Fig. 24 is a plan view of the surface of the grindstone grain layer on which the grinding wheel of the eleventh embodiment is mounted. Fig. 25 is an enlarged view of a part of the grindstone grain layer of the grinding wheel shown in Fig. 24; Fig. 26 is a line sectional view of a small grindstone layer portion of the grinding wheel shown in Fig. 25; 27 (A) to (E) are diagrams showing the manufacturing process of the grinding wheel according to the first embodiment. Fig. 28 is a plan view of a grinding wheel according to a twelfth embodiment. Fig. 29 shows a deformed shape of a protrusion of a small grindstone layer portion, (a) is a plan view and a central longitudinal sectional view of another one protrusion, and (B) is a plan view and a side view of another i protrusion . Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Figure 30 shows the ratio of the longest diameters of the two axes of symmetry of the image after the two-dimensional projection of superabrasive grains. (A), (B), (C) (D) is a diagram showing irregular and superabrasive grains. Figure 31 is a plan view of the small grindstone layer shown in Figure 30. Fig. 32 is a perspective view of a main part of a conventional CMP apparatus. Fig. 33 is a partial plan view of the electrodeposited grinding wheel shown in Fig. 32, and (B) is a longitudinal sectional view taken along line A-A of (A). 15 311684 This paper ruler applies the Chinese National Standard (CNS) A4 specification (21G X 297 Gongchu) ------ 474855 A7 _B7_ V. Description of the invention (16) Figure 34 is the millstone shown in Figure 33 Partial longitudinal section of the grain layer. (Please read the precautions on the back before filling out this page) [Explanation of component symbols] Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 3 Rotary table 4 Polishing pad 5 Wafer holding disk 8 Grinder 10 Arm 14 Superabrasive stone 19 Support metal 19a Slightly rounded surface of support metal 20 Electrolytic grinding wheel (electrolytic grinding disc) 20a Grinding surface 21 Hillock (projection) 21a Corner R Part 21b, top 21c, side wall 22, grindstone layer 22a, grindstone layer bottom 24, small grindstone layer section 25, metal plating phase 25a, bottom plating layer 25b, first metal plating phase 25c, second metal plating phase 117, groove 120, electroplated grinding wheel (Electrolytic grinding disc) 122 Grinding stone layer 124 Central area 126 Peripheral area 127 Convex flat portion 217 Guide groove 220 Grinding wheel (single-layer sharpening stone) 222 Support metal 222a One side 222A First grinding stone grain layer 222B Second Grinding stone layer 222C 3rd grinding stone layer 225 small Hill (protrusion) 226 Opening 228 Small millstone grain layer part 230 Water passage 232 Sub-discharge path 234 Main discharge path 320 Grinding wheel (single-layer whetstone) 322 Support metal This paper applies the Chinese national standard (CNS) A4 Specifications (210 X 297 mm) 16 311684 Leaf / leaf OJJ Dumpling production by the Intellectual Property Bureau of the Ministry of Economic Affairs, employee printing Du V. Description of the invention (Π 322a-surface 326 small millstone grain layer 332 pairs of roads 340 grinding wheels 360 grinding wheels 372 grinding Stone grain layer 374A Small millstone grain layer part A 374a Small millstone grain layer part A 422 Support metal 424 Millstone grain layer 424B Second millstone grain layer 425 Hilly part (protrusion) 426 Recessed part 426A Recessed part 428 Small grindstone layer section 431 Main discharge path 440 Grinding wheel 442A 1st grindstone layer 442C 3rd grindstone layer 518A Superabrasive stone column S Grinding h Plane L Departure distance P Moving pad 324 grinding stone Grain layer 330 Metal bonding phase 336 Small hill part (projection) 35 grind wheel 370 grind wheel 374 small grind stone grain part 3 74B small grind stone grain part b —half 374b the other half of the small grind grain grain part a 422a — Surface 424A, first grinding stone grain layer 424C, third grinding stone grain layer 425a, upper surface 426a opening portion 427 Metal bonding phase 4 3 0 Sub-discharge path 434 Masking section 442 Grinding stone layer 442B Second grinding stone layer 518 Super grinding stone 0 Outer grip of the hillock part Height K Foam layer opening ρ The direction of rotation of the polishing pad Ph Grinding Plate Rotating Square Shaw -------------- Install --- (Please read the precautions on the back before filling this page) -I5J1. --Line · This paper size applies to Chinese national standards (CNS) A4 specifications (210 X 297 mm 17 311684 474855 Α7 Β7

G Internal diameter grinding 5. Description of the invention (grinding direction D1 m depth q Μ distance between hillocks (protrusions) [best embodiment of the present invention] The following describes the embodiment of the present invention using the drawings. Here, the same parts as those of the conventional technology described above are designated by the same reference numerals and their descriptions are omitted. The electrodeposited grinding wheel 20 (the electrodeposited grinding disc) of the embodiment shown in FIGS. 1 and 2 is made of, for example, stainless steel. On the slightly circular side i 9a of the formed disc-shaped support metal 19, slightly cylindrical hillock portions 2 1 (protrusions) are formed at predetermined intervals, and grinding stones are formed on the surface of 9 a Layer 22, and its surface is referred to as a grinding surface 20a. In addition, the hillock portions 21 are arranged in a grid-like or mesh-like manner in a central region other than the annular peripheral region 23 on the outer peripheral side of the one surface 19a. The stone grain layer 22 is made of, for example, superabrasive grains 14 such as diamond or cBN, which are arranged in a metal plating phase 25 made of Ni (nickel). For example, the superabrasive grains 14 are fixed only. Adhered to each of the hillock portions 2 1 ′ and not provided on the hillock portions 21 and 21 The bottom of the grindstone layer is 仏. In the hillock part 21, the area of the grindstone layer 22 formed by the super-grindstone particles 14 and the metal electric clock phase 25 arranged along its almost cylindrical surface. As the small grindstone grain layer portion 24. In the small grindstone grain layer portion 24 shown in FIG. 3, each of the small hill portions 21 of the supporting metal "is formed by the side walls 2 1c and corners around the entire periphery. The R portion 21a and the top portion 21b are shaped ", and are fixedly adhered to the entire surface 25 with, for example, u to 500 sleeves." A metal plating phase, such as U to 500 or more superabrasive grains n Bn ft m In n nf im-ri I HB —fl i I 1 · 1. It —EJ ff He vsm nm HI flu n I (Please read the precautions on the back before filling this page) Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 474855 Economy A7 is printed by the Consumer Cooperatives of the Ministry of Intellectual Property Bureau. 5. Description of the invention (19). If the number of superabrasive particles 14 is less than 1 i, the rough grinding and finishing of the grinding pad 4 cannot be implemented continuously. ^ If the number is more than 500, there is a disadvantage that it is easy to cause the plugging of super-grindstone grains. Each small millstone grain layer portion 24 has a maximum diameter D of 01 to 1 m The height h of the bottom 22a of the grindstone layer is made to be more than the average particle size of the supergrind particles 14, which is more than two times the thousand-average particle size. The value is less than 1 mm, for example, about 0.1 mm to 0.7 mm. The reason why the high u is equal to or larger than the average particle size of the superabrasive grains 14 is that only the superabrasive grains 14 are used when the grinding pad 4 is being ground. The grinding process is performed while contacting the polishing pad 4 so as to prevent the bottom 22 a of the grain layer from coming into contact with the polishing pad 4. Here, the small grindstone grain layer portions 24 are connected at the same height. In addition, the area of the superabrasive grains 14 with respect to the total area of the grinding surface 20a under the plane observation of the electrolytic grinding wheel 20 is set in a range of 20% to 80%. If the area of the superabrasive grains M is less than 20%, the superabrasive grains 14 may fall off during grinding, which shortens the life span. It may also be caused by the superabrasive grains 14 piercing the abrasive pad 4 If the polishing pad 4 is damaged, if it exceeds 80%, it may cause clogging on the electrowinning grinding wheel 20. The electrowinning grinding wheel 20 used in this embodiment is the one having the above structure. Next, the manufacturing method of the electrowinning grinding wheel 20 will be described with reference to FIG. 4 as follows. In FIG. 4 (A), one surface 19a of the disc-shaped support metal 19 made of, for example, sus 300 and the like is removed by etching or the like, and a plurality of slightly cylindrical small pieces are left in a grid shape.丘 部 21A…. The portion removed by etching becomes the bottom 22A. Specifically, sulfuric acid or nitric acid may be sprayed to a side 19a 'under high pressure or electrolytic etching or electric discharge machining may be used, leaving small I 1 — — — — — — — — III ·! JI 1 f II ^ · I! 1 i I --- (Please read the precautions on the back before filling out this page) 474855 A7 B7 Invention description (2〇 丘 部 21A ... and other parts are engraved. So, the small hill shown in Figure 4) The portion 21A will be formed on one surface with a grid-like uneven surface. Each of the hillock portions 21 is a sketched columnar shape having a predetermined outer diameter d and a height η. Then, on this surface, sandblasting is used ( sh〇tbiast) or barrel grindlng to grind the edge of each hillock 2! a, so that = into a slightly cylindrical hillock guarded by chamfering as shown in Figure 4 (C) P Alternatively, the support metal as shown in Fig. 4 (c) can also be formed by a mold. Next, the electroplating of superabrasive grains 14 will be described with reference to Fig. 3. Except for each hillock part 21 .. · The part is also covered by a mask (also called), and the whole of each hillock is 21, and the bottom plating layer 25a can be applied by, for example, & ~ etc. It consists of thinly bottom electrical recording. Then, the bottom layer 25a is plated by electroplating, and the first layer can be formed by, for example, calling ~ 々, etc.)! The metal ore phase 25b fixedly bonds a plurality of superabrasive grains 14. Afterwards, from one side, I will remove the mask sheet (delete the klngsheet), and then use electroplating to fully form a second metal electric power phase made of, for example, Nl (Cu, Cr, etc.). Here, it is not necessary to form the second metal electric clock phase at the bottom 22A. In this case, the bottom 22A of the support metal 19 will constitute the bottom 22a of the grindstone grain layer. In this way, a metal ore phase formed by the underplated layer 25a, the first] and the second metal key phases 25b, 25c can be formed. 25Fix the abrasive stone grains μ, the five-line of the superabrasive stone μ, as shown in Figure 3 and Figure 4⑼, and turn 20. In addition, in the above description, in addition to the grinding surface of the electric grinding wheel 20, the paper size is applicable to the Chinese National Standard (CNS) A4 specification (21Q X 297 male; t) ---------- ______ 20 311684 474855 V. Description of the invention (21) The peripheral area 23 of 20a is arranged with a plurality of small grindstone layer portions 24 ..., but it is not necessary to be limited to this, and it can also be formed on the grinding surface 20a in a comprehensive manner.小 磨 层 部 24。 Small grinding layer 24. (Please read the precautions on the back before filling this page.) The electro-abrasive grinding wheel 20 of this embodiment is equipped with the above-mentioned configuration. The electro-abrasive grinding wheel 20 is mounted on the arm 10 of the device 1 in FIG. 32. When re-grinding the polishing pad 4, for example, the arm 1G is shaken with respect to the polishing pad 4 on the rotating rotary table 3, thereby swinging the electric grinding wheel ⑽ back and forth, and grinding the polishing pad 4 to restore or maintain its flatness . When grinding, in the small grindstone grain layer portion of the electrodeposited grinding wheel 20, "the rough grinding of the polishing pad 4 can be carried out by using the superabrasive stone grains 14 in the corner R portion 21a, and then continuously using the corner & portion The superabrasive grains 14 of the top 2ib of 21a are subjected to finishing grinding. And during the grinding, the superabrasive grains are fixed from the corner of the hillock part 2! The entire grinding surface of the stone grain layer 22 will not completely collide with the contact with the polishing pad 4, but only the super-grind stone grains 14 of the small grinding stone grain layer portion 24 are brought into contact with the lamp for grinding, so a higher application can be maintained. The grinding pressure of the superabrasive grain 14 is sharp and the cutting effect is sharp. It is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Therefore, 'the opening of the foamed layer of the polishing pad 4 can be cut sharply without causing the opening to collapse. It can maintain a high holding capacity of the slurry 8. In addition, since it does not completely collide, the grinding liquid inside the foamed layer is not splashed during grinding, and grinding is carried out in a state of containing water. A portion of the corner r portion 213 of the stone layer portion 24 is abraded by the superabrasive stone particles 14 and can still be used. The corner of the corner 21 & the superabrasive grain 14 continues to be ground to extend the durability of the electric grinding wheel 20. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 meals) 21 311684 474855 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (22) Furthermore, during grinding, only the super-grindstone particles 14 of the small-grindstone layer portion 2 4 are in contact with the polishing pad 4 for grinding The bottom 22a of the stone layer does not contact the grinding wheel 4. The grinding fluid can be retained in the bottom 22a of the stone layer between the small stone layer portion 24 and the small stone layer portion 24, and can pass through the stone. The bottom layer 22a of the granular layer discharges the cutting powder. Next, the state after grinding the 塾 4 using the electrowinning wheel 20 of this embodiment is shown in Fig. 5. Fig. 5 is a photograph of the surface of the polishing pad 4 500 times. In the figure, the opening k of the foamed layer on the surface of the polishing pad 4 is sharply ground without collapsing, and the flatness can be restored. Therefore, when polishing the wafer or the like, the slurry s can be ground. The flatness of the polishing pad 4 is restored when it is sufficiently retained in the foamed layer of the polishing pad 4. Here, FIG. 6 shows the use of an electroplated shovel to fix the superabrasive grains on a flat support metal and use a bottom plating layer 'to form the superabrasive grains with the difference in height from the bottom surface of the millstone grain layer. The state in which the electrodeposited grinding wheel of the above-mentioned conventional example is configured to grind the polishing pad 4 with an average particle diameter of 1/2 or less. Fig. 6 is a photograph of the surface of the polishing pad 4 500 times. The grinding surface of the layer approximately completely collided, causing the fluff on the surface of the polishing pad 4 to be collapsed, and the opening k of the foamed layer collapsed so much that it was clogged. Therefore, the holding ability of the grinding slurry s of the grinding pad 4 was insufficient to cause the polishing pad The processability of 4 deteriorates. As described above, in the present embodiment, since the bottom 22a of the grindstone grain layer does not contact, the superabrasive grain 14 of the small grindstone grain layer portion 24 is brought into contact with the grindstone for grinding, The grinding operation from rough grinding to finishing can be carried out continuously, and the grinding pressure applied to the superabrasive grains 14 is high, and the cutting effect is good, and it can be — 1 丨 — — — — — — — — — _ IIII --- Order----------- (Please read the notes on the back before filling this page) This paper size applies the Chinese National Standard (cns) A4 specification (21 × 297 mm) 22 311684 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 23 311684 474855 V. Description of the invention (23 The foaming layer of the polishing pad 4 The openings are sharpened without collapse. In addition, no cutting powder is left in the superabrasive grains 14, no clogging is caused, and the cutting powder has good dischargeability. In addition, the grinding liquid can be maintained at the bottom 22a of the grindstone grain layer between the small grindstone grain layer portions 24 and 24 to prevent the grinding fluid in the foamed layer of the polishing pad 4 from being splashed out, and not to regrind the grinding wheel. The cutting becomes dry and can be maintained in a good moisture-retaining state for wet grinding. △ Next, a second embodiment of the present invention will be described with reference to Figs. 7 and 8. The same parts and components as those in the first embodiment described above will be described using the same symbols. In the electrodeposited grinding wheel 30 of the second embodiment shown in FIG. 7 and FIG. 8, a grindstone grain layer 22 is formed on one surface 19a of the support metal 19, and the central area of the grindstone grain layer 22 is 31 ,,] The small millstone teaching layer portion 24 is not provided, and a plurality of small millstone grain layer portions 24 are arranged in a plurality of layers in a concentric manner in the peripheral area 32 to the outer periphery. Or most of the small grindstone grain layer portions concentric circles μ ... are separated from each other in the circumferential direction and the diameter direction, and the adjacent small grindstone grain layer portions 24, 24 are the bottom 22a of the grindstone grain layer. And ‘side! The grindstone slab layer 22 provided on 9a is only a plurality of superabrasive stone particles 14 fixed at the small grindstone particle layer portion 24 with a metal plating phase 25, respectively. The electro-abrasive grinding wheel 30 'of this embodiment can be mounted on the wafer support plate 5 and can perform grinding and polishing while rotating the polishing pad 4 at a position eccentric to the polishing pad 4 instead of the regrind 8. In this case, since the rotation speed of the central area 3! Of the electrolytic grinding wheel 30 is small and the grinding capacity is also small, the small grinding stone grain layer portion 24 is not advantageous in terms of grinding efficiency. This paper size is applicable (CNS) A4 g⑽χ 297 chuchus -------- Order ------------ Line (Please read the precautions on the back before filling this page) 幷 / 4 Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Milk Economics. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm 24 A7) 5. Description of the invention (24) In addition, it replaces the concentricity with f 2 implementation. The round electromilled grinding wheel 30 of the small grindstone grain layer portion 24 can also be used in the peripheral area _ spiral shape: and the small grindstone grain layer portion 24 .. •. In this case, the same as the first 2 The same effect of the embodiment. The small grindstone grain layer portion 24 can be arranged at an arbitrary interval such as a grid or a mesh shape. Moreover, the arrangement structure of these small grindstone grain layer portions M can also be provided for grinding. The surface 20a is comprehensive. In the above embodiment, the small millstone grain layer portion 24 and the small hill portion 21 are formed into a substantially cylindrical shape, but the shapes of the small millstone grain layer portion 24 and the small hill portion 21 are not Subject to this limitation, it is only necessary that the height from the bottom 22a of the grindstone layer is equal to or greater than the average particle size of the supergrind particles 14, for example, Hemispherical or triangular-cone-shaped convex curved surfaces. Next, the third embodiment of the present invention will be described. The basic structure of the electrodeposition grinding wheel 120 (the electrodeposition grinding disc) of this embodiment is the same as that of the electrodeposition grinding wheel of the first embodiment. 20 is the same, the grindstone grain layer 122 has its surface as a grinding surface 20a, and the slightly circular area in the center is taken as the center area 12 4 ′ and the ring-shaped area outside it is taken as the peripheral area 12 6. 10, one surface 19a of the supporting metal 19 shown in FIG. 10 is formed with a plurality of approximately cylindrical hillocks 21. "on the central area 12 4 at a predetermined interval in a grid or mesh arrangement. On the peripheral area 26 A convex flat portion 127 is formed, for example, to form a small wide annular flat surface with a width of about 3 mm. The hillock portions 21 ... and the convex flat portion 127 are formed at the same height. In the central area 124 ', the grindstone grain layer 22 is formed. A plurality of superabrasive grains 14 are fixedly adhered to each of the hillock portions 21 by a metal plating phase 25, and the hillock portions 21 and the hillock portions 21 are formed only by the metal plating phases 25. Millstone 311684 ^ I ------ ^ -------- ^ (Please read the notes on the back before filling (This page) 474855 Printed by A7 B7, Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (25) The bottom 22a of the grain layer is not provided with a super-grinding stone 14. In addition, the bottom 22a of the grain layer is not provided. It is also possible to have a metal plating phase 25. In this case, the surface of the metal in Block I will be exposed to constitute the bottom 22a of the grindstone grain layer. In the hillock part 2 ', the grindstone grain layer 22 is along a substantially cylindrical shape. The super-grindstone particles 14 and the small-grindstone particle layer portion 24 of the metal plating phase 25 are provided on the surface. The manufacturing method of the electrolytic grinding wheel 120 in this embodiment is slightly the same as that in the i-th embodiment. The method for producing the metal plating phase 25 will be described with reference to Fig. 10 as follows. In the small grindstone layer portion 24, each of the hillock portions 21 of the support metal 19 is formed by the side wall 21c, the corner ruler 2U, and the top portion 21b formed on the entire periphery. One or more superabrasive grains 14 are fixed and adhered with a metal plating phase 25. In the peripheral area 126, on the annular convex plane portion 127, superabrasive grains 14 are dispersed and fixed one by one with a metal plating phase 25, and these superabrasive grains 14 and small millstone grain layer portions 24 are located The same height H. In addition, the concentration of the superabrasive particles 14 in the peripheral area 126 is made higher than that of the superabrasive particles 14 in the central area 124. In addition, in the central area 124 and the peripheral area 126, referring to Fig. 10, the electroplating of the superabrasive grains 14 will be described below. Except for the convex plane portion 127 and each of the hillock portions 2 1..., The entire surface of the convex plane portion 127 and each of the hillock portions 21 is covered with, for example, Ni ( Cu, Cr, etc.) is a thin layer of underplating. Next, a plurality of superabrasive grains 14 are fixed and adhered to the underplated layers 25a, 25b by electroplating with the first metal plating phases 25c, 25d made of, for example, Ni (Cu, Cr, etc.). Then 'peel off the mask sheet from one side 2 1 a and use electroplating to fully form it again 丨 — I — —lit I 1 I ϊ I 1 I --------- (Please read the precautions on the back before filling (This page) This paper size applies to China National Standard (CNS) A4 (21〇x 297 public love) 25 311684

474855 V. Description of the invention (26) The second metal plating phases 25e, 25f made of Ni (Cu, Cr, etc. are also acceptable). Alternatively, 'the second metal plating phases 25e and 25f may be formed only on the convex flat portion 127 and the small hill portion 21 while maintaining the mask. In this case, the bottom 22a of the grindstone layer that becomes the concave portion may not be formed. A metal plating phase 25 is formed. In this way, the metal-electric phase 25 formed by the underplated layers 25a, 25b, the first and second metal-electric phases 25c, 25d, 25e, 25f is formed, and each superabrasive grain 14 is fixedly adhered to the hillock. The grindstone particle layer 22 ′ shown in FIG. 10 of the portion 21 and the convex plane portion 127 forms the electrowinning grinding wheel 120. In this case, by appropriately setting the interval of the small grindstone grain layer portion 24, the concentration of the supergrind 14 in the peripheral area 126 can be set to be higher than that of the supergrind 14 in the central area 124. high. Alternatively, one of the hillock portions 21 ... and the convex plane portion 127 may be alternately masked and plated separately by other manufacturing methods. In this case, as long as the amount of superabrasive grains 14 in the plating solution is increased or decreased, the degree of concentration of the peripheral area 127 and the central area 124 can be adjusted to be different. It is also possible to directly form the grindstone grain layer 24 by electroplating under the hillock portion 21 and the convex plane portion 127 of the support metal 19 without performing the underplating layer, and additionally remove the mask and perform plating on the bottom portion 22A to form磨石 粒 层 底 22a. The diameter of the electrolytic grinding wheel 120 is set to, for example, 101 mm, and the width of the peripheral area 126 is set to, for example, about 3 mm or less. The area of the superabrasive grains 14 with respect to the total area of the grinding surface 20a is set to a range of 20% to 80% under the plane observation of the electric grinding wheel 120. The electro-abrasive grinding wheel 120 in this embodiment has the above-mentioned structure, and then IIIII II — — ---- · I — III II ---- II --- (Please read the precautions on the back before filling this page) Economy Printed by the Intellectual Property Bureau of the Ministry of Intellectual Property Cooperatives The paper is printed in accordance with Chinese national standards (CNS> A4 specification (210 297 mm) 26 311684 474855 A7 Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs Consumer Cooperatives V. Invention Description (27) Cutting operations It can be performed in substantially the same manner as in the first embodiment. In addition, in the electrowinning wheel 12 of the present embodiment, the concentration degree of the superabrasive grains 14 in the peripheral area 126 of the grinding surface 20a is smaller than that in the central area 124 is High ', so the stability of the electric grinding wheel 120 during grinding is high, the electric grinding wheel 120 shakes in the up and down direction with less vibration, and the plane balance is better. It can also be set from the groove 17 suitable for the surrounding area 126. The cutting powder and the like are discharged to the outside. In the peripheral area 126, the height difference between the superabrasive particles 14 and the metal plating phase 25 is about 1/3 of the average particle size of the superabrasive particles 14 and the concentration is high. Time It is easy to completely collide, but because the width of the surrounding area 126 is set to, for example, less than about 3 mm, even if the superabrasive particles 14 are clogged, the effect on the cutting effect is small, and the central area 124 is ground. There is almost no adverse effect on performance. As mentioned above, in the present embodiment, since the peripheral area 126 of the electric grinding wheel 120 can contact the polishing pad 4 to maintain a good planar balance, vibrations during grinding can be suppressed. In addition, in the central area 124. The bottom of the grindstone layer does not contact the polishing pad 4 and only the supergrind particles M of the small grindstone layer portion 24 contact the polishing pad 4 and perform grinding. The pressure is high 'ϋ It can be continuously performed from rough grinding to finishing grinding with good cutting effect without sharpening the opening of the foamed layer of the polishing pad 4 and sharpening. Peripheral area 126 In the same manner as in the central area 124, a plurality of small grindstone grain layer portions 24 are formed at predetermined intervals, and the superabrasive stone grains 14 are fixedly adhered to the small hill portion 21 with a metal electrode 25. In this case, this paper Standards for Family Safety Standards (CNS) A4 Specifications ⑽-27 311684 -------------- install — (Please read the notes on the back before filling this page) Order · -line

TOJJ

V. Description of the invention (28), the diameter d of the grindstone grain layer portion 24 and the ancient house M 124 ^ and Huduo are the same as those in the central field and make the door of the small grindstone grain layer portion 24 dazzle> In order to be narrower, Br > is narrower than the central area H, the fixed adhesion of the superabrasive grains 14 to the periphery 126e t @ ”can be increased. Alternatively, the number of solid J layers 24 can be increased. The 14 millstone grains are more than the small millstone grains in the central area 24. If this structure is adopted, even in fruit, the cut-through area 126 'knife effect? 1 can effectively suppress the plug and Improve the discharge of the cutting powder. Use the arrangement of the small grindstone layer layer 24 in the Tongyang area 124 to adopt a suitable arrangement such as a spiral shape instead of a grid or a mesh IIIIIIIII — · I 1 (Please read the note on the back first Please fill in this page for further information.) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. In addition, the metal binding phase may not be based on the metal plating phase 2 :::: sintering to maintain the superabrasive grains, as long as it has a 2: 5 phase grinding wheel The grinding wheel 22 of the fourth embodiment shown in FIG. 11 (a single-layer grinding disc is configured as follows, Figure 12; Figure 5 and Figure 12 and Figure 13, not on the slightly circular side 222 of the disc-shaped support metal 222, the outer periphery < is provided by the formation of concentric circles (can be non-concentric circles ), A grindstone grain layer 224 formed by a plurality of rings (three layers in the figure). The first grindstone having the largest diameter (for example, the same diameter as the support metal 222) is formed on the outermost side of the grindstone grain layer 224. The grain layer 224 is formed with a second grindstone grain layer 224b at intervals on its inner side, and a third grindstone grain layer 224C with a minimum diameter is formed at intervals on the innermost side. The third grindstone grain layer 224C There is no grindstone layer on the inner side. On the one surface 222a of the support metal 222, the ring-shaped areas of the i-th to third grindstone layers 222A, B, and C are set to be thicker than the other areas. Standards apply to China National Standard (CNS) A4 specifications (210 X 297 public reply)

Order:-line · 855

5. Description of the invention (29) One layer (such as the height difference shown in Fig. 13), this is called the first seat metal # 222A, the second seat metal portion 222B, and the third belonging portion 222C. Furthermore, on the second support metal portion α 2B shown in FIG. 12 and FIG. 13, a plurality of cylindrical hillock portions 225 (projection j) are formed at predetermined intervals, and a cross-section is formed in the center thereof. Circular opening 226. In addition, a small ring-shaped small grindstone layer layer portion is formed on the small hill portion 225. The small grindstone layer portion 228 is dispersedly arranged in the metal bonded phase (metal plating phase) of Nl and Nl 2 1 5 Super fixed abrasive grains with diamond or other 2U are fixed. This small grindstone grain layer part is a single-layered grinding wheel configured with only one supergrind grain 2 1 4 in its thickness direction, and is produced, for example, by electroplating. In addition, a plurality of small grindstone grain layer portions 228 having the same structure are also provided on the first support metal portion 222A and the third support metal portion 22%. Further, as shown in Fig. 13, inside the support metal 222, a water passage 230 is formed across the areas of the first to third millstone grain layer portions 224A, 224B, and 224C. This water passage 230 communicates with an opening 226 formed in the center of each of the small grindstone grain layer portions 228 formed in the i-th to third grindstone grain layers 224A, 224B, and 224C, and supplies pure water as an unillustrated supply source, for example. The grinding fluid is circulated in the water passage 230 and is discharged from each opening 226 to the outside. Here, the inner diameter d of the opening 226 is set in a range of, for example, 0.5 to 3 mm, and the diameter D of the small hill portion 225 (protrusion) is set to a range of 2 (1 to 10 d.). The height h of each support metal portion 222A, B, and 225 of the 225 is set in the range of 0.1 to 5 mm. In addition, the distance L between two adjacent small hill portions 225, 225 is set to the diameter d of the small hill portion 225. I --- (Please read the notes on the back before filling out this page) Order: --Line Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is sized to the Chinese National Standard (CNS) A4 (210 X 297) Love) 29 311684 474855 A7 B7 V. Description of the invention (30) 1/3 to 2 times. And, in each support metal part 222A, B, r λ L, the adjacent hillock 2 2 5 The field discharge path 232 having a mesh shape is formed between 2 2 5. The auxiliary discharge path 232 is not formed with a grindstone grain layer, and a direction is used to discharge the grinding chips or grinding chips of the polishing pad 4 through the grinding liquid. The solidified material cage of the pulp s ^ 荨 荨. In addition, a slightly annular main discharge path 234 is formed in the gap between the first to third millstone grain layers 224A, B, and C. The main row The exit paths 234 and 234 are wider than the secondary exhaust path 234, and the depth is the same as the height difference between the support metal portions 222A, 222B, and 222c. Also, the first to third millstone grain layers 224A, In B and C, a groove 117 is formed at a predetermined interval, for example, 45. The groove 117 is used to discharge the grinding slurry s or grinding chips in the diameter direction. This groove U7 is shown in FIG. The third grindstone grain layer 224A, B, and c form a line of straight lines, and the bottom surface is set at a position approximately the same depth as the main discharge path 234. In addition, the grooves 117 do not necessarily need to form a line, but may be formed in the i-th to 3 The grindstone grain layers 224A, B, and C are moved to different positions in the circumferential direction and arranged toward the diameter direction. In addition, for the inner layer, the groove U7 of the outer layer can also be added. The cooling efficiency between the first to third grindstone grain layers 224 A, B, and C and the discharge of grinding chips are better. The grinding wheel 20 of this embodiment is configured as described above, and secondly, referring to FIG. 14, the grinding wheel The manufacturing method of 22〇 is explained. In FIG. 14 (A), a circular plate made of, for example, sus 304 or the like is used. One surface 222a of the pedestal support metal 222 is partially removed by etching or the like, and a plurality of raised portions are left in a ring manner to form the first support metal portion — IIII!! II-(Please read the note on the back first Please fill in this page again for the matters)--Line · Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed on a paper scale applicable to Zhongguanjiabiaohua (CNS) A4 χ 公 公 30 311684 474855 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 Five Description of the Invention (31) 222A, second support metal portion 222B, and third support metal portion 222c. Of the portions removed in the remaining time, the area between the support metal portions 222A, B, and c becomes the main discharge path 234. In this way, one side 222a of the support metal milk can be formed. Here, one side 222a may be formed by mold molding or the like instead of etching. In addition, within the support metal 222, a hollow water passage 230 is formed in a region facing the jth to third support metal portions 222A 'B, C, and this water passage 230 is connected to the first to third parts. Openings 226 perforated at predetermined intervals in the third support metal portions 222A, B, and C. Its “person” is shown in FIG. 14 (A), leaving the openings corresponding to the first to third support metal portions 222A, β, and c of the surrounding hillock portion 222 communicating with the water passage 23 °. The area is covered by a Qin or Qinji alloy electric clock to surround the opening for 226 weeks. _ After the plated metal is deposited in a slightly cylindrical shape because of the way around the city, the hillock shown in Figure 14 The sections 25 ... are formed in a plurality at a predetermined interval, respectively. Here, it is also possible to form the hillock portion 225 instead of electroplating by etching or electric discharge machining. Here, the area other than the hillock portion 225 of each of the support metal portions 222a, b, and c constitutes the sub-exhaust path 2 3 2. In addition, when the grindstone granulation is performed, as shown in FIG. 14, the main and auxiliary discharge paths 234, 232 and the like except the hillock portion 225 ... are covered with resin, and the air is discharged from the water passage 230 through each opening 226. -While plating. In this way, as shown in FIG. 4 (C), the superabrasive stone particles 14 are fixedly adhered to each of the hillock portions 2 2 5 except for the water passage 23 by the other metal bonding phase 15. 'The paper size applies the Chinese National Standard (CNS) A4 specification 297 public issue 311684 I -------- ^ --------- ^ (Please read the precautions on the back before filling this page) Economy Printed by the Consumer Cooperative of the Ministry of Intellectual Property Bureau 311684 474855 A7 ______ — B7 ______ V. Description of the Invention (32) Here, 'the plating solution containing the superabrasive stone particles 14 can also be discharged from the openings 226 through the water passage 230, and then the small A method of performing electric keys on the hill 225. In this case, the plated metal is precipitated in the water passage 230, but the superabrasive grains 14 cannot be fixedly adhered. In addition, the first to third millstone grain layers 224A, B, and C with a predetermined interval in the diameter direction are set to have the widest Wa, Wfc, Wc so that the innermost millstone grain layer 224C is the largest, and the more The narrower width of the outer layer. Therefore, it is set to Wa < Wb < Wc. Here, the widths of the first to third grindstone grain layers 224A 'B, C are each a certain width. The purpose of this setting is, as shown in FIG. 11, an imaginary line a, b, c at any position in a direction which intersects the rotation direction P of the polishing pad 4 slightly perpendicularly. The imaginary lines a, b, and c are inscribed in the respective grindstone grain layers 224A, B, and C. In the case that the grinding length intersecting with the grindstone layer with a larger diameter on the outer side (for example, the grinding length Ldl of the imaginary line d) can be greater than the grinding length intersecting with a grindstone layer with a small diameter on the inner side, Large, so that the workload (grinding length) during grinding can be greater, and the width of the inner grindstone grain layer is increased to make the grinding degree (workload) of each grindstone grain layer More even. For example, 1 ′ in the U figure will be relative to the first! The rotation direction p of the third grinding stone grain layer 224A 'B'CS grinding 塾 4 extends in an approximately parallel imaginary line, moves in a direction slightly perpendicular to this direction, and draws an imaginary line a at an arbitrary position. b, C, d, for example, the imaginary line a, ^ intersects with the first to third millstone grain layers 224A, B, C, and the imaginary line c disk millstone grain layer 224C is connected to the first! And the second grindstone grain layer 224a, b intersects' a virtual line d and the second grindstone grain layer 224A is inscribed and intersected. 'This paper size applies to China's national standard (X 297 Gongchu) ------- --- -------------- installation --------- order ----- --- Line 1 (Please read the precautions on the back before filling out this page) Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 474855 A7 ___ B7 V. Description of the invention (33) and the imaginary lines a 'b, c The grinding length of the first to third millstone grain layers 224A, B, and C intersected by, d is set as follows. For example, if the grinding lengths (areas) of the first to third millstone grain layers 224A, B, and C intersect at the imaginary line a closest to the center 0 of the grinding wheel 220 are set to Lal, La2, and La3, they will rotate in pairs. The grinding length (area) of the first to third millstone grain layers 224A, B'C intersecting the imaginary line b that is the second closest to center 0 is set to Lbl, Lb2, and Lb3, and the imaginary next to the center of rotation 〇 The grinding length (area) of the first and second millstone grain layers 224A and B intersecting with the line 〇 is set to Lcl, Lc2, and the imaginary line (the first millstone grain that crosses 1) at the outermost imaginary line farthest from the rotation center 〇 The grinding length of layer 224A is set to Ldl, then: 2x (Lai + La2 + La3) = 2x (Lb 1 + Lb2 + Lb3) = 2χ (Lcl +

Lc2) and 2x (Ldl), the widths Wa, Wb, and Wc of the i-th to third grindstone grain layers 224a, B, and C are set. As a result, Wa < Wb < Wc. The grinding wheel 220 of this embodiment is provided with the above-mentioned structure. When re-grinding the polishing pad 4, the grinding wheel 4 is rotated while the grinding wheel 4 is rotated to grind the fluff of the polishing pad 4 and restore or maintain it. flatness. During grinding, the small grindstone grain layer portions 228 of the first to third grindstone grain layers 224A, B, and C of the grindstone grain layer 224 pass through the water passage 23 and pass through the opening 226 formed in the center thereof. The grinding point between the superabrasive grains 214 and the polishing pad 4 is ground while supplying a grinding fluid such as pure water. Accordingly, it is possible to suppress the grinding layer of the polishing pad 4 generated by the grinding of the superabrasive grains 2ΐ4 ·· of the small grinding stone grain layer portion 228 or the circuit metal or silicon of the silicon wafer remaining on the polishing pad 4. Grinding gens are adhered and fixedly attached to the superabrasive stone = 2 14 ... and reduce the viscosity of the grinding fluid containing these grinding chips to promote the application of this national standard (CNS) A4 g (21 () x 297 Gongchu — 33 311684 --- I ---- IIIIII '1 II i III · 1! 11! 111 (Please read the note on the back? Matters before filling out this page)

474855 V. Description of the invention (34) The main discharge path 234 is discharged through the Zhao discharge path 232. In addition, the grinding fluid can be used to promote the cooling of the superabrasive grains 2 14 to prevent the damage of the superabrasive grains 2 14 and to suppress the accumulation of various grinding debris in the superabrasive grains 214 214. Therefore, the superabrasive grains 214 of the small millstone grain layer portions 228 provided in each of the millstone grain layers 224A, B, C, etc., the grinding chips of the grinding pad 4 or other various grinding chips, etc. will be removed from the opening. The grinding fluid discharged from 226 is flushed and does not block between the superabrasive grains 214 ... and is discharged through the auxiliary discharge path 232 around the small millstone grain layer portion 228, and then passes through the main discharge path 234 and the guide groove. 2 1 7 while draining outside. In addition, the grinding points generated by the super-grindstone grains 214 of each small grindstone grain layer portion 228 are sufficiently popular with the grinding fluid supplied from the adjacent opening 226, and the grinding debris will not stagnate in the super The magnitude D of the degree to which the grindstone particles 214 ... are washed away, and the height difference h between the grinding point and the auxiliary discharge path 232 is set to such an extent that the grinding fluid or grinding debris can be easily discharged. Furthermore, among the first to third grindstone grain layers 224A, B, and C of the grindstone grain layer 224, they are moved from the center of the grinding wheel 220 in a direction slightly perpendicular to the rotation direction p of the polishing pad 4, and moved As for the permuted imaginary lines a 'b' c at any arbitrary position, since the sum of the grinding lengths (sum of area) on each imaginary line is 2x (Lal + La2 + La3) and 2x (Lbl + Lb2 + Lb3) 4 2x (Lcl + Lc2) is roughly the same as 2x (Ldl). As shown in Figure ι5, for all areas of the shaking direction that intersects with the P direction of the millstone grain layer 224 slightly perpendicularly, it can work slightly equally. Grinding. Therefore, in the re-grinding of the polishing pad 4, 'only the grinding wheel is placed on the polishing pad 4 and rotated, and it does not necessarily need to make a shaking movement, to advance ------------ --------- Order --------- (Please read the precautions on the back before filling out this page) The paper size printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs applies the Chinese national standard ( CNS) A4 size (210 X 297 male; t) 34 311684 A7

474855 V. Description of the invention (35) Grinding of the polishing pad 4 with higher efficiency and higher flatness. As described above, according to this embodiment, various grinding chips such as the grinding chips of the polishing pad 4 or the solidified product of the slab slurry S, the circuit metal of the silicon wafer, or the grinding chips of silicon can be ground points by themselves. The superabrasive grain 214 of the small grindstone layer portion 228 easily flows out of the grinding fluid through the opening 226 adjacent to this to the sub-discharge passage 232, so as to surely block the superabrasive grain 214 ... between. In addition, the grinding fluid can suppress the wear and tear of the superabrasive grains 214 due to various grinding debris, and can promote the cooling of the superabrasive grains 214 to suppress the damage of the superabrasive grains ^. In addition, since the sum of the grinding lengths (sum of the areas) of the grindstone grain layers 224 that are slightly parallel to the rotation direction p of the polishing pad 4 can be approximately equal, a grinding process with a higher flatness can be performed. Next, a fifth embodiment of the present invention will be described with reference to FIG. The grinding wheel 24 shown in FIG. 16 has the same basic structure as the grinding wheel 220 of the i-th embodiment. The difference lies in that the grindstone grain layer ⑷ forms a continuous spiral of the working layer, and preferably has at least the grindstone grain layer. 242 is wound three or more layers at intervals in the diameter direction (three layers are formed in FIG. 16). In this embodiment, the first grindstone grain layer 242A, the second grindstone grain layer 242A, the second grindstone layer 242A, and the second grindstone layer are formed continuously in a spiral shape when viewed from three layers from the outer side to the inner side in the diameter direction. The grindstone grain layer 242β and the innermost third grindstone grain layer 242C. In addition, a spiral-shaped main discharge path is formed between each of the grindstone grain layers 242, 242B, and 242C, and each of the grindstone grain layers 242A, 242B, and 242C has a plurality of pre-amplifier intervals L. The small grindstone layer portion 228 ... has a way out in the gap. ! ^ -------- ^ --------- ^ (Please read the notes on the back before filling out this page) Member of the Intellectual Property Bureau of the Ministry of Economic Affairs, M Consumer Cooperative, printed on paper standards applicable in China Standard (CNS) A4 regulations ^^) 297 public love) 35 311684 474855 A7 5. Description of the invention (36) This embodiment can also obtain the same effect as the fourth embodiment. Hereinafter, a sixth embodiment of the present invention will be described. The grinding wheel 320 (single-layer grinding disc) of the embodiment shown in FIG. 17 and FIG. 18 is provided with a slightly annular grinding stone grain on the outer peripheral side of the disc-shaped support metal 322 on the outer surface 322a of the approximately circular shape. Layer 324. The grindstone grain layer 324 is, for example, a small grindstone grain layer portion 326 which is slightly rectangular or rod-shaped in a plan view, and the long side direction is aligned toward the direction close to the center of the support metal 322 in the circumferential direction. Each. Here, between the small grindstone grain layer portions 326,..., Arranged in such a manner that the areas of the grindstone grain layer 324 are separated from each other in the circumferential direction constitute a sub discharge path 332. Each small grindstone layer portion 3 2 6 'as shown in the longitudinal cross-sectional view of FIG. 19' is formed by forming a small hill portion 336 which is raised in a substantially rectangular parallelepiped shape from the one surface 322a of the support metal 322 'and The upper surface 336a of the small hill part 336 is formed by fixing and bonding superabrasive grains 4 ... with a metal bonding phase 3 3 0. The number of superabrasive grains 14 per ^ small millstone grain layer portion 326 is set to 3 to 25. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page). Because the height of the small hill 336 for one side 322a of the support metal 322 is set to the range of 0.1 to 5.0 mm Between the grinding point and the auxiliary discharge path 332, the grinding fluid or grinding debris can be blocked and can be smoothly flushed and discharged. Moreover, even if it is a grinding 塾 4-series soft person who is the material to be cut, the grain layer of the grindstone It seems that it will still not completely collide, but can be contacted only by the grinding point of the superabrasive grain; the grinding pad 4 can maintain a high grinding pressure.

If the height H is less than 0.1mm, there is no such effect and it is easy to collide. If it exceeds 5.0mm, it will not get a better effect and it will form more than 5.0mm. The paper size applies the Chinese National Standard (CNS) A4 specification. (210 x 297 public love) 311684 B7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs of the People's Republic of China 5. The Invention Note (37) of Gao Xiaoqiu is not in line with economic interests. Also, the size of the slightly grindstone layer layer 326 car-f-A, „τ _ under the observation of a thousand rectangles is the length Lax wide Lb, and the width M average particle size of 1.3 to 10 Sixth from the left, and about ^ times of # 磨 & grindstone, the length "is set to a size more than 3 times the width, and the value of the aspect ratio E π weight is set. The length La is set to 2 to 15 mm, for example, La = 10 mm and Lb = 2 mm. In Figures 17 and 18, the small grindstone 4 J grindstone tertiary layer 326 is an example.

For example, if the centerline 〇1 is on the front side of the rotation direction of the grinding wheel 320, it is the first small grindstone grain layer portion 326A inclined at a positive angle of 0 to the centerline 〇1, and the small grindstone grain layer on the S side of the rotation direction.胄 326 is a second small millstone grain layer portion 326B having a negative angle, and is formed by arranging the small millstone grain layer portion in a circle shape in a Qiu shape. The i-th millstone grain layer portion MM and the second whetstone grain layer portion 326B are slightly line-symmetrical with the center line 01 in the diameter direction passing through the center 0. Furthermore, for example, in FIG. 18, if the grinding wheel 32 is rotated relative to the moving direction ρ of the polishing pad 4 of the material to be cut, the grinding stone grain layer 324 can be set by combining the forces of two directions P and Ph. Grinding direction g. This grinding direction G will change its position in accordance with the circumferential rotation position of the grindstone grain layer 324 according to the angle Ph. The grinding wheel 3 20 of the present embodiment is configured as described above. When regrinding the polishing pad 4, the grinding pad 彳 is rotated in the 卩 direction while the grinding wheel 320 is rotated in the Ph direction and the grinding pad 4 is ground. Raising to restore or maintain its flatness. During grinding, there is a large figure with a large figure width in the shape of a circle in the circumferential direction on the ring-shaped grindstone layer 3 24. Please read the precautions on the back before filling in the second I. Paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) 37 311684 474855 A7 B7 V. Description of the invention (38) For the small grindstone layer 326A, 326B, it will form a slight line contact with the entire circumference When comparing the previous grinding wheel with a ring-shaped grinding stone grain surface, even if (please read the precautions on the back before filling this page) the surface of the grinding stone grain layer is slightly uneven, the stability and stability of the seat is still good and not easy. Vibration during grinding. Therefore, a high grinding pressure can be maintained without causing local damage to the abrasive plastic 4. In Fig. 18, in the pair of small grindstone grain layer portions 326A and 326B formed in a slightly figure-eight shape in a certain area of the grindstone grain layer 324, the first small grindstone grain layer portion 326A is aligned with the center line. The inclination angle θ ′ forming the inclination angle θ ′ near the grinding direction G has a longer grinding length and enables longer grinding. Therefore, since the amount of grinding is large and the amount of generated grinding chips is large, clogging is likely to occur. Located at the rear side of the rotation direction of the first small grinding stone layer portion 326A: The small f stone layer layer Satoshi intersects at an angle that is slightly at a right angle to the grinding direction G. Grinding of grinding 塾 4 Long perch and contention. Therefore, the first small millstone grain layer portion 326A can be generated and

The grinding debris of the plugged between the stone layer portion 326A and 326B is moved to the rear of the small stone layer portion 326B together with the grinding fluid and the like, and the grinding wheel 32 〇 # is discharged to eliminate the plug. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs ::: The grinding stone on the grinding wheel 320 ... 24 is ring-shaped, depending on its rotation position, the rotation direction Ph may be located on the upper nm Shishi Muxing grinding 塾 4 rotation The direction P is the same or the opposite direction. In this case, the grinding direction G of the month A will overlap the direction P or / and Ph. However, it is also opened in this hall because of a pair of first and second small grindstone layers. The parts 326A and 326B are inclined to the center line and opposite sides of the center line. Most of them are in the direction of grinding, and they will cross the small grindstone layer 326 obliquely. However, as described above, from — _ _The scale of the small millstone granule 3 2 6 ^ The paper size is applicable to the Chinese national standard specifications (21 × 297 Gongchu ^ -------- 38 311684 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 474855 V. Description of the invention (39) Long grinding is performed, while short grinding is performed by the other small grindstone layer portion 326, and the grinding chips are arranged backward in the rotation direction Ph as described above. The grinding wheel of this embodiment In 320, due to the multiple small millstone grain layer sections 326 arranged in the meshing distance, they are still slightly straight to HG Existing in the direction, so that the plurality of small grindstone grain layer portions 326 ... are in slight linear contact with the polishing pad 4, so the contact area or contact pressure with the polishing pad 4 can be stabilized, even if the surface of the small grindstone grain layer portion 326 has Concavity and convexity, its seat stability is still good, and it can suppress the small vibration that occurs during grinding, and suppress the reduction of the grinding force, and can prevent local damage to the polishing pad 4. Also, by centering on the center line 01, The plural pairs of small grindstone grain layer portions 326A, 326B, etc. arranged obliquely on the opposite side can ensure the grinding amount interactively, and eliminate the clogging of the grinding shoulder to improve the discharge of the grinding layer and suppress the cutting. The effect is reduced. A person will explain the seventh embodiment of the present invention with reference to FIG. 20. In the grinding wheel 34 shown in FIG. 20, the grindstone grain layer on the outer peripheral side of the one surface 322a of the support metal 332. In 341, the first and second small millstone grain layer portions 326A having the same shape as the small millstone grain layer portion 326 of the sixth embodiment are arranged in a small figure in a zigzag shape in the circumferential direction on the small hill portion 336. , 326B. And, it is provided between the paired first and second small millstone grain layer portions 326A, 326B. The third small millstone grain layer portion 342A and the fourth small millstone grain layer portion 342B having a small aspect ratio of the small millstone grain layer portion 326 are small, and the third and fourth small millstone grain layer portions 342A, 342B They are separated and arranged separately from the wide part of other small millstones. — III1III1III1 --- I 1 1 Ϊ I Order ------- (Please read the precautions on the back before filling this page) Sg Standard (CNS) A4 Specification (210 X 297 Public Love) 39 311684 4/4855 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 ----------- g?-__ _ 5 Explanation of the invention (40) The third small millstone grain layer portion 324A has a width-to-width ratio of Lb and a length Lc (< La), and forms, for example, the first! The small millstone grain layer portion 326 extends slightly parallel in the longitudinal direction. The fourth small grindstone grain layer portion SUB has a width-to-width ratio of Lb and a length Ld (< La), and is formed to extend slightly parallel to, for example, the second small grindstone grain layer portion 326B in the longitudinal direction. Also, the first and second small grindstone grain layer portions 326A and 326B are provided on the opposite sides of the third and fourth small grindstone grain layer portions 342A and 342β in the circumferential direction, respectively. The portion 326 has the same width and a small longitudinal width of the fifth small grindstone grain layer portion 342c and the sixth small grindstone grain layer portion 342D. The fifth and sixth small grindstone grain layer portions 342C and 342D are respectively from other The small grindstone grain layer portions 326A, 326B, 342A, and 342β are arranged separately. These small grindstone grain layer portions 342A, 342B, 342C, and 342D are also formed on the hillock portions. The grinding wheel 340 of the seventh embodiment is provided with the above-mentioned structure, and the third to sixth small millstone grain layer portions 342 to 342D are appropriately dispersed among the i and second small millstone grain layer portions 326A and 326B. And are arranged slightly parallel to any of the small grindstone grain layer portions 326A, 326B, and during the grinding process of the polishing pad 4, a plurality of small grindstone grain layer portions 326A, 342A, 342C having a longer grinding length It can continuously interact with a plurality of small grindstone grain layer portions 326B, 342B, and 342D that can easily discharge the grinding layer in the circumferential direction, which can further improve the grinding efficiency, and at the same time, can appropriately eliminate the clogging of the grinding debris. Also, the increase in the small grindstone layer portions 342A to 342D can further improve the stability of the grinding surface of the grinding wheel 340. Next, 'refer to Figure 21' for the eighth embodiment of the present invention. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm). 311684 Pack --------- Order- -------- Line (Please read the notes on the back before filling this page)

5. Description of the invention (41). In the grinding wheel 350 shown in FIG. 21, a substantially annular grinding stone grain layer 352 is formed on the outer peripheral side of one surface 322 a of the disc-shaped support metal 322. This grindstone layer 352 is composed of two pairs of the first small grindstone grain layer portions 326A, 32 and the second small grindstone grain layer portions 326B, 326B into a rhombus (or slightly well-shaped) to form a rhombus group. The portion 354, which is a diamond-shaped group portion 354, is formed in a diameter direction, for example, two groups each, and is sequentially arranged in the circumferential direction. Therefore, the two groups of diamond-shaped group sections 354, 354, which are arranged side by side in the diameter direction, form a center line 〇1 and a diagonal line of each of the two groups of diamond-shaped group sections 352 is superimposed. And, in each of the diamond-shaped group sections 354, two are each! The small grindstone grain layer portions 326A and 326A and the second small grindstone grain layer portions 326b and 326B are arranged so as to face each other, and the small grindstone grain layer portions 326A and 326β are arranged separately from each other. According to such a structure, the first small grindstone grain layer having a longer grinding length is arranged alternately in each of the diamond-shaped group portions 354 so as to have an angle similar to the grinding direction G in the diameter direction of the grinding wheel 350. The portion 326A and the second small millstone plate layer portion 326B which intersects the grinding direction G slightly perpendicularly and has a short grinding length, and also has a first small millstone grain layer portion 326A in the circumferential direction, and The two small grindstone layer portions 326B are arranged in an interactive manner. Therefore, it has the effect of ensuring that a large amount of grinding can be ensured and that it can be effectively discharged every time the plug 'of the grinding layer is encountered. And “the increase in the small grindstone grain layer portion 3 2 6” will improve the seat stability during grinding. Next, referring to Fig. 22, a ninth embodiment of the present invention will be described. ------------- Install --------- Order --------- line (please read the precautions on the back before filling this page) The paper size printed by the Property Cooperative's Consumer Cooperative is subject to the Chinese National Standard (CNS) A4 (21 × 297 mm) 41 311684 474855 A7

V. Description of the invention (42) In the grinding wheel 36 shown in FIG. 22, the grindstone grain layer 3 62 of the one face 322a of the genus 322 is 2 pairs. The second small millstone grain layer portion 326B is combined into a rhombus (or, (second slightly well-shaped)) to form the diamond group portion 364 ', and the first small millstone grain layer 胄 A that is composed of the sides 构成 1 X is completely penetrated. Or the second small millstone grain layer portion 326B is used as a common edge and is used only for water permeation, and is arranged in a mesh shape into a plurality of diamond-shaped group portions 364. In each of the widows, ^, in the valley love-shaped group portion 364, Each of the two j-th small grindstone grain layer portions 326A, 326A, 艿 1, and the second small-grindstone grain layer portions 326b, 326B are arranged so as to face each other, and each of the small grindstone grain-layer portions 326A And 326B are arranged separately from each other. In this embodiment, since a plurality of diamond-shaped groups 364 ... are arranged on one side 322a, it is similar to the grinding direction when grinding.小 1 small millstone grain layer portion 326A or the second small millstone grain layer p 326B with a larger grinding length, and the grinding length which is slightly perpendicular to the grinding direction and shorter The second small grindstone layer portion 326B or the second small grindstone layer portion is arranged in an interactive manner, which has the effect of ensuring that a large amount of grinding can be ensured and that it can be effectively discharged every time the plug of the grinding debris is encountered. And, with the increase of the small grindstone layer section 3 2 6, the stability and stability of the seat during grinding will also be improved. It is printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs-owed 'refer to Figure 2 3' The tenth embodiment of the present invention will be described. In the grinding wheel 37 shown in FIG. 23, a slightly annular grindstone grain layer 372 is formed on the outer side of one surface 3 22a of the support metal 322. Here, the grindstone In the grain layer 372, a plurality of small millstone grain layer portions 374 which are slightly arc-shaped (curved) are arranged on both sides of the center line 〇1 drawn at predetermined intervals. The extension of the centerline 〇1 moves its position in order and shifts its position in order. The scale of this millstone is applicable to China National Standards (CNS) A4 specifications (210 X 297 public love 42 311684 A7 A7. Employees ’intellectual property bureau consumption Cooperative prints 5. Slightly 1/2 the length of Invention Note (43) 374 One way is to set one of the small millstone grain layer portions W that are sequentially moved opposite to each other across these center lines 〇1 as the third small millstone grain layer portion 374A, and the other one is used as the fourth small millstone grain layer 374A. Layer section 374B. To this end, under the plane view of Mohan 370, on the outer side, for example, to the left of the center line, a circle-shaped center point in the direction of the center line qi is provided with a slightly rounded solitary section. 3 small grindstone layer portion 374a, to the right of the center line ο ′, is only a half of the length of the third small grindstone layer portion 374A from a position that is line symmetrical with the third small grindstone layer portion 374a. A fourth small grindstone layer portion 374B is disposed to move from the center point. In addition, the third and fourth small grindstone layer portions 3 74 A 3 74B facing each other across the center line 〇 by a slight 1/2 length are tied to each center line. For example, every two pairs are arranged in the circumferential direction. To form a millstone grain layer 3 7 2. Each of the small grindstone grain layer portions 374A and 374B are separated from each other, and both ends of each of the small grindstone grain layer portions 374A and 374B are located at approximately equal distances from the center line 〇1. In addition, since the small grindstone grain layer portion 374 is slightly arc-shaped, in the figure, half of the small grindstone grain layer portion 374A has an inclination angle close to the grinding direction G, so it is ground. The length is longer, and the other half 3 74b intersects with the grinding direction G slightly perpendicularly and intersects, so the plugging can be eliminated. In the fourth small grindstone layer portion 3 74B, one half 374a and the other half 374b are arranged in a direction opposite to the length direction of the third small grindstone layer portion 37 4 A. Therefore, 'has the ability to ensure a large amount of grinding at the same time' each time the grinding chip is installed -------- * ^ ί -------- line (please read the precautions on the back before filling in this (Page) This paper ruler (CNS) A4 specification (210 X 297 public love) 43 311684 474855 A7 b / V. Description of the invention (44) The plug can be effectively eliminated, and the stability of the seat during grinding is stable Also good effect. Here, the curved small grindstone grain layer portion 374 does not necessarily need to be arranged in a relatively arcuate shape, but only one side may be arranged. In addition, the third small grindstone grain layer portion 374A and the fourth small grindstone grain layer portion 374B may be disposed opposite to each other without shifting the direction of the center line 〇1. In addition, as another example of the shape of the slightly curved small grindstone grain layer portion 374, S-shaped persons may be arranged in a diameter direction and a circumferential direction with each other. It is also possible to form the appropriate small grindstone grain layer portion, for example, the grindstone grain layer formed by combining the i-th and second small grindstone grain layer portions 326A, and the like, as shown in the figure (the same way). A plurality of layers such as three layers are ring-shaped, or formed into a spiral shape as shown in FIG. The grinding wheel 42 ° (single-layer grinding disc) of the embodiment shown in Figure 2 to Figure L1 is shown in Figure 24. For example, the disc-shaped support metal 422 becomes slightly circular as shown in Figure 2. A concentric circle (may be a non-concentric circle). The i-millstone with the largest diameter (for example, the same diameter as the support metal 422) is formed on the outer peripheral side of the support metal 42 ^ 2. The "inside" is formed with a second grindstone grain layer 424B, and at the most formed there is a third s spacer A0 / tn pull layer 424C which has the smallest diameter. The inner side of the third grindstone a 424C is not formed with a grindstone. Plate The layer is on each ring area of one side of the support metal 422 ..., c ::, the third grinding stone grain has a plurality of slightly two Si circles :: round material 317 ^ Γ Please read the back Φ first Matters needing attention to fill in the page II! Order A7

A7 Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives, M. V. Description of the invention (45) Method Rishi P 425 (mostly), and press the sunken system at the center of 425a above it ^ 1 'For example, a slightly conical recess 426. In addition, the inner diameter D1 of the concave portion 426 and the opening portion 426 ^ ~ 6a is set to a size smaller than the average grain size of the superabrasive grain 14, and the repetition degree m is set to, for example, the superabrasive grain 14. The average particle size is slightly less than 1/2. Therefore, in this recessed portion 4-) < 单一 26, a single diamond or CBN is super-abrasive ^, sinked, for example, about 1/4 to 2/5 of the average particle diameter, and embedded and fixed. In addition, because the upper surface 425a of the small hill portion 425 is covered by Ni or Ni " 'metallic metal equivalent of metal alloy phase 427, the superabrasive grains 14, Qiu Ba, sharp knife'. The small grindstone layer portion 4 2 8 is formed. For j hill. A single electro-abrasive wheel with a single superabrasive grain 14 fixedly bonded by a metal bonded phase 427 is formed on the 卩 425. Since the fine corner or sharp part of the front end of the superabrasive stone 纟 14 is plunged into P 425, the corner or sharp part of the opposite end is made larger upward to constitute a material for grinding the material to be cut. Grinding point W (see Fig.%). In addition, in each of the first to third millstone grain layers 424A, B, and C, a sub-exhaust path 430 is formed between the hillock portions 425 and 425 adjacent to each other in the circumferential direction, and the sub-exhaust path 43 is here. There is no grindstone layer formed on the surface, but the grinding chips or solidified product of the slurry s are discharged from the grinding pad 4 by the grinding fluid. ^ Furthermore, the first to third grindstone layers 424A, B In the gap in the straight direction between C and C, a slightly annular main discharge path 43 i is formed. The main exhaust path 4 31 and the auxiliary exhaust path 4 3 0 form, for example, the secondary exhaust path of the main and auxiliary exhaust paths 431 and 430, which are also produced in the same way, and will pass through the outer exhaust path of the outermost J-brother 1 grindstone layer 424A. 430 and discharged to the outside. II ---- I ------ · I I--III — 111 — — — I 1 (Please read the notes on the back before filling out this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 45 311684 474855 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 ______B7 — ---- —, -_____ V. Invention (46) 'Here, outside the base of Xiaoqiu 425 The diameter D is set in a range of 1.3 to 3 times the average particle diameter of the superabrasive grains 14. If it is within this range, it can prevent the stagnation of grinding chips at the grinding point to smoothly flow. If it is 3 times smaller, the strength of the small hill portion 425 decreases, and the supergrind η is easy due to the grinding resistance. Falling off, the small hill portion 425 is easy to be damaged. If it is larger than 3 times, the arrangement interval of the superabrasive grains 14 is too large, so that the grinding ability is reduced, or the wear of the superabrasive grains 14 is accelerated. In addition, the height Η of the small hill portion 425 on the surface 422a of the support metal 422 may be in the range of 0.05 to 3.0 mm. ° If it is within this range, the grinding liquid or grinding debris can be easily washed out and discharged between the grinding point and the main and auxiliary discharge paths 431 and 430 on the support metal 422. Here, if a metal plating layer is formed on one surface 422a of the support metal 422 ', the distance equal to the metal plating becomes a height 成为. The distance M between the small hill portions 425 and 425 adjacent to each other in the diameter direction and the circumferential direction is set to a range of / 3 to 2 times the outer diameter D of the small hill portions 425. If it is within this range, the grinding performance can be ensured, and the small hills 425 and 425 are used as the main discharge path 431 and the auxiliary discharge path 43. The grinding fluid or grinding debris can be easily flushed and discharged, such as less than 1/3. If the magnification is smaller, the grinding performance will be increased, but the grinding chips and the like are easily clogged. If it is larger than 2 magnification, the grinding efficiency will be reduced. The grinding wheel 420 of this embodiment is configured as described above. Next, a manufacturing method of the grinding wheel 42 will be described with reference to FIG. 27. In FIG. 27 (A), one surface 422a of a disc-shaped support metal 422 made of, for example, SUS304 and the like is partially removed into a slightly conical shape by etching or cutting, and the same figure (B ), The recessed part 426A ... -------- aST ---------- (Please read the precautions on the back before filling this page) This paper size Lai towel_ 家 鲜(CNS) A4 Secret ^^^ 97 46 311684 474855 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 -------------- V. Description of the invention (47) Form a ring at predetermined intervals 'And corresponding to the first to third millstone grain layers 424A, B, and C, three layers are formed at appropriate intervals in the diameter direction. Here, instead of the last name engraving, electrical discharge machining or die molding may be used to form a recessed portion 426A on the-surface 422a. Next, in FIG. 27 (0), a region corresponding to the hillock formation around each recessed portion 426A is left on one side 422a and a resin mask is formed, and Ni or Ni-based alloy plating is used on the recessed portion 426A and its surroundings. Precipitate the plated metal to swell, and then form a plurality of small hills 425 as shown in Figure 27 at predetermined intervals. At this time, the electric money metal is evenly formed on the recessed portion 426A and its surroundings. The thickness is precipitated, so a recess 426 will be formed on the upper surface 425a of the small hill portion 425. Here, in order to form the small hill portion 425 into a truncated cone shape, the side surface 434a of the covering portion 434 can be removed from one side of the support metal 422 422 & protrudes to the outside so as to protrude to the upper side, and it is arranged obliquely in the shape of a truncated cone to control the deposition area of the electroplated metal. In addition, in order to form the small hill portion 425 into a substantially cylindrical shape, the mask portion 434 The side surface 43 乜 is formed into an upright cylindrical shape. Next, the superabrasive grain 14 is dropped into the recessed portion 426 on the upper surface 42 5a of each hillock portion 425, for example, while vibrating. At this time, the opening diameter D1 of the recessed portion 426 is set. The average grain size is 14 For the sake of smallness, other corners or sharp portions located at the corners or sharp portions of the superabrasive stone particles 14 will fall and slightly oppose each other, and they will protrude from the upper front side. In FIG. 27 (E), other fields except the upper surface 42 5a of each hillock portion 425 will be discharged from the main and auxiliary roads 々η, 4] I 1! | — — — — — — 1! * 1! ---- 11 (Please read the precautions on the back before filling this page) This paper size is applicable to the Chinese National Standard (CNS) A4 size 297 cages 47 311684 4/4855 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 V. Description of the Invention (48) The resin is masked by the masking portion 434 and the electricity is advanced early. As a result, on the upper surface 425a of each hillock portion 425a, the super waste can be fixed and adhered, such as (millstone 14 with) sii or a metal-based alloy such as Ni-based alloy. The protrusion amount of the superabrasive grains 14 of the phase 427 will be, for example, about 2/3 to 々π of the average grain size. In FIG. 24, the first to third millstone grain layers 424A, B, and C will face The imaginary line 'extending in a direction that is slightly flat with the rotation direction n F of the polishing pad 4 is shifted in the direction 1 which is slightly perpendicular to this direction, and the imaginary line a, b, C, d. Therefore, 'the grinding length (area = work) of the area between the third to third grinding stone grain layers 424A, B, and C (the area where the imaginary lines a, b, and c intersect each other) is the same as the fourth embodiment. The amount of the sum is slightly uniform, so it is possible to perform grinding operations with a higher flatness. The grinding wheel 420 of this embodiment is provided with the above-mentioned structure. If the grinding of the polishing pad 4 is re-grinded, the use of each small grinding can be suppressed. Grinding debris of the polishing pad 4 generated by the grinding of the superabrasive stone particles 14 of the stone layer portion 428 or the circuit metal or silicon of the silicon wafer remaining on the polishing pad 4 The grinding chips and the like adhere to and adhere to the superabrasive grains 4... And reduce the viscosity of the grinding fluid containing the grinding chips, and then pass through the auxiliary discharge path 4 3 0 and the main discharge path 4 3 i to promote the discharge to the outside. And 'the cooling of the superabrasive grains 14 by the grinding fluid can prevent the damage of the superabrasive grains 14 and can suppress the accumulation of various grinding debris on the superabrasive grains. Between 14 and 14. Next, the twelfth embodiment of the present invention will be described with reference to FIGS. 28 and 8. The same reference numerals are used for the same or the same members as the eleventh embodiment described above, and the description is omitted. The grinding wheel 440 shown in FIG. 28 The grinding wheel with the 11th embodiment --------- I ---- install ---------- order * ^ ------- * green (please read first Note on the back, please fill in this page again) This paper size is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) 48 311684 474855 B7 V. Description of the invention (49) Those with the same basic structure of CO, different small millstones Layer section 428 · .. Yiwen preliminarily "arrange a plurality of spirals, and it is better to have at least the millstone M into one continuous spiral or more than three layers (28th Η +, Η spaced in the diameter direction) The winder (three layers are formed in Fig. 28). In this embodiment, the grindstone grain layer 442 is continuous in a spiral shape from the outer side toward the first formation of the outermost circumference when viewed from the three layers inward. The younger brother Tian Tian 1 has a grindstone grain layer 442 eight, a second grindstone grain layer 442B, and takes the inner third grindstone grain layer 442e. A spiral main discharge path 431 is formed, and There are a number of sub-rows that are connected to the main discharge path 431 in the small millstones of each millstone grain layer. Here, the small hill portion 425 can also use other recesses 426 to replace those used in the above embodiment. . For example, as shown in FIG. 29 (a), the recessed portion 426a may not be formed on one surface 422a of the support metal 422, and the hillock portion & electricity may be formed into a slightly truncated cone shape or a substantially cylindrical shape, and be held on the upper surface of 425a. A conical recessed portion 445 is formed in the central portion. Alternatively, after the hillock portion 425 is formed, a cutting process such as a cross-section V-shaped recess 4 4 6 may be formed in the diameter direction of the upper surface 425a by cutting or the like. The hillock portion 425 and the metal bonding phase 427 may be formed by metal bonding. Instead of forming methods such as electroplating gold plating. Alternatively, the hillock portion 425 can be molded integrally with the support metal 422. The electrowinning wheel (electrowinning wheel) of the fourteenth embodiment includes the electrowinning wheel 2 described in the first embodiment, for example, the first embodiment. The same structure, especially the small millstone grain layer on the protrusions 21 of the support metal 19 The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 311684 ^ / 4855 Ministry of Economy Printed by A7 of the Intellectual Property Bureau's Consumer Cooperative. V. Invention Description (50) 24. There are i or a plurality of short and strong superabrasive grains which are fixed and bonded by metal bonding phase. Here, the short and strong super-grindstone grains refer to the largest two-axis images of the grindstone grains after the two-dimensional projection shown in Figures (A), (B), and (C). The ratio of the X-axis to the y-axis of the dimension (eccentricity) y / x is from 丨 to 丨 2, which is the meaning of super-grindstone particles that are close to a regular polygon or a spherical shape such as a regular hexahedron. Contrary to this, the ratio of the y-axis to the x-axis is referred to as an irregular superabrasive stone, which refers to the superabrasive stone shown in Fig. 30 (D) or the superabrasive stone shown in Fig. 34 of the prior art. The meaning of stone grain 14. Here, in Fig. 30 (A) and (b), all the grindstone particles 518 are y / X = l_0 ', and the superabrasive stone particles 14 shown in the same figure (D) are y / x = 2.〇. The superabrasive grains 518 are formed on the entire surface of the abrasive grain layer 22 of the electrodepositive grinding wheel 20 by, for example, i to 500, preferably u to 500, the superabrasive grains 518 in a metal plating phase. 25 fixed glued and constituted. In addition, as shown in FIG. 31, a plurality of super-grindstone particles 518 fixed to each small-grindstone particle layer portion 24 are arranged in a row of at least a plurality of super-grindstone particles 5 1 on the outer peripheral side. 8 A is only arranged in short and strong superabrasive grains 5 丨 8 and fixedly bonded. Moreover, the superabrasive grain row 518A also includes superabrasive grains 18 fixedly adhered to the side surface 21C of the protrusion 21, and these are also arranged by short and strong superabrasive grains. Therefore, the inner superabrasive grains surrounded by the annular superabrasive grain row 518A may have irregular superabrasive grains, but for the sake of convenience of manufacture, short and strong superabrasive grains 518 may also be used. Make up all superabrasive grains. In the case of using such an electric grinding wheel for grinding, in the case of an electric grinding wheel ----------------- I ----- order --------- (Please read the notes on the back before filling out this page) The private paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 50 311684 Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Consumption Cooperative (51 20 of each small grindstone grain layer portion 24 is first rough grinding of the polishing pad 4 with short and strong superabrasive grains 518 in the corner r portion, and then the supergrind that continues to the top of the corner R portion The grains are especially short and strong superabrasive grains 518A in the outer periphery for finishing grinding. In particular, the outer corners or ridges of the superabrasive grains in the outer periphery 5 1 8 A are not excessive. It is sharp and can be ground with a moderate cutting effect, and even if a scratch is generated, it can be suppressed to a small scratch. In the present embodiment described above, the small grind stone layer portion 24 is formed by using short and strong superabrasive stone particles 518. Therefore, in the plane view, the outer portions of the super-grindstone grains 518A in the outer periphery can be inserted into the short-facing super-grindstone grains 518 ... It is not too sharp and has a good cutting effect, and it does not cause sharp partial smashing or missing due to the use of irregular superabrasive grains. Even if the material being cut produces scratches, it can still be stopped by small scratches. During grinding, sharp parts such as corners and ridges do not break and remain on the polishing pad 4 and scratch the surface of the material to be cut, such as wafers, or cause scratches, etc., so that good mirror grinding can be performed. Each of the electro-abrasive grinding wheels of the above-mentioned embodiments can be used for mounting on the wafer holding disc 5 and rotating one side of the polishing pad at a position eccentric to the polishing pad 4 instead of the re-sharpener 8. In the above-mentioned embodiments, The small grindstone layer layer portion 24 ... and the small mound portion 21 .... are formed into a slightly cylindrical or cuboid shape, but the shape of the small grindstone layer layer portion or protrusion is not limited by this. The height。 of the layer bottom 2 should be equal to or larger than the average particle size of the superabrasive grains 14. For example, it can also be a convex surface in the shape of a half or a triangular cone. The scale of this scale applies to the Chinese National Standard (CNS) A4 specification X Male cage 311684------------. I III --- I -1 ^ 11 — — — III {Please read the precautions on the back before filling in this page} 51 474855 .A7 -----— B7____ 5. Description of the invention (52) In addition, the electric wheel 20 '30 which constitutes the grinding wheel in each embodiment of the present invention , 120, grinding wheels 220 '240 ... etc., of course, besides the re-grinding device used in CMP equipment, of course, it can also be used in other grinding and grinding equipment. -(Please read the precautions on the back before filling out this page) Order --------- Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Online Economics This paper is sized for the Chinese National Standard (CNS) A4 (210 X 297 mm) 52 311684

Claims (1)

Member of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed clothing C8 — D8 of Consumer Cooperatives 6. Application scope of patent 1. A grinding wheel with a metal bonding phase, which has a plurality of protrusions formed on the support metal. A plurality of small grindstone grain layers formed by fixedly adhering the superabrasive stone grains with a metal bonding phase are arranged at intervals from each other. 2. The grinding wheel according to the scope of patent application f !, wherein each of the aforementioned small grindstone grain layers is provided with a plurality of superabrasive grits. 3. The grinding wheel according to item 1 in the scope of the patent application, wherein the small grindstone grain layer part is set from the height of the bottom of the grindstone grain layer between the adjacent small grindstone grain layer parts to the average of the super grindstone grains. Particle size or more. 4. The grinding wheel according to item 1 of the patent application range, wherein the aforementioned protrusions are formed into a substantially cylindrical shape with corners R and tops, and these corners R and tops are provided with superabrasive grains. 5. The grinding wheel according to item 1 of the scope of patent application, wherein the super-grindstone particles formed at the aforementioned small grindstone particle layer portions are set to u to 500, and compared to the above-mentioned grindstone particles in plan view The proportion of superabrasive grains in the total area of the layer is set in the range of 20% to 80%. 6. The grinding wheel of item 1 of the scope of the patent application, wherein the small grindstone grain layer portion is arranged in a central area other than the peripheral area of the surface of the grindstone grain layer. 7. The grinding wheel according to item 1 of the patent application range, wherein the small grindstone grain layer portion is arranged in a peripheral area other than the central area of the surface of the grindstone grain layer. 8. As for the grinding wheel in the scope of the first patent application, the grain layer of the grindstone has a central area and a peripheral area on the outer peripheral side thereof. — — · ------ Order ---------- line (please read the precautions on the back before filling this page), .. The Zhang scale is applicable in China _ home standard (CNS) A4 Specifications ⑽χ depending on public love) 53 311384 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs • π -r t'j Pregnancy 巳 Solid phase is formed with an interval m m 前 a stone layer layer section, and The small mills are each attached to the ancient grains in a metal bond phase, and in the aforementioned peripheral areas are millstone grains. The concentration of the superabrasive grains in the superabrasive W domain fixedly adhered to the peripheral phase is lower than that in the central domain. 0 9. As described in the grinding tool of the scope of application for the patent, the small grinding stone grain layer portion ′ and the central opening are used to discharge the grinding fluid. The grinding wheel of claim 1, wherein the discharge path is formed in a field other than the small grindstone layer. U_ 如 Wave of patent application No. 9 of the grinding wheel 'wherein the direct service of the aforementioned small grindstone layer ^ is in the range of 00.5 to 3. Omm. 12. The grinding wheel according to item 9 of the patent application, wherein the diameter of the protrusion is 2 to 10 times the diameter of the opening. 1 3 _If • The grinding wheel in the scope of application for item i, wherein the height of the protrusion relative to the bottom surface of the aforementioned support metal is in the range of 0.1 to 5.0 mm. 14. The grinding wheel according to item 1 of the scope of patent application, wherein the distance between the adjacent protrusions is in the range of 1/3 to 2 times the average diameter of the protrusions. 15. The grinding wheel according to item 1 of the patent application scope, in which the above-mentioned grindstone grain layer is formed into a plurality of layers in a ring shape or a spiral shape. 16. The grinding wheel according to item 9 of the scope of patent application, wherein the discharge path is formed between the aforementioned grinding stone grain layers arranged at intervals in the radial direction. 1 7 _ As for the grinding wheel in the first scope of the patent application, the aforementioned small grindstone grain layer portion is only fixed and adhered to one layer of supergrindstone grains in the thickness direction of the metal bonding phase. 18. For the grinding wheel in the scope of patent application item 1, in which the aforementioned small grindstone layer — — — — 1 — — — — — — — ISII Order-----— II (Please read the precautions on the back first (Fill in this page again.) The paper size applies to Chinese National Standard (CNS) A4_i ^ (210 X 297 mm) 54 311384 ^ Please read the notice of the back of the scope of patent application, and then fill in * I $ Page I The i-th millstone grain layer section inclined with respect to the center line passing through the diameter direction of the metal center of the support; and The grain layer portion or the second small millstone grain layer portion inclined in the opposite direction. Each of the aforesaid and second stone grain layer portions in the grinding wheel 'of item 18 of the patent scope includes a different aspect ratio. A. Applicable to the grinding wheel of the dry patent No. 18 in the patent, in which the front small millstone grain layer P is formed into a slightly rhombic shape and arranged in a radial shape in a manner of being separated from each other. For the grinding wheel in the 18th scope of the patent application, the aforementioned first and second small grindstone grain layers are arranged in an interactive manner in the circumferential direction of the support metal to form a ring. 22. The grinding wheel according to item 1 of the patent application range, wherein the small grindstone grain layer portion has a portion inclined in a direction with respect to a center line passing in a diameter direction of the metal center of the support, and a portion inclined in a reverse direction. 23. The grinding wheel of the 22nd scope of the application for a patent, wherein the small grindstone layer portion has a curved shape, and is moved in a direction opposite to each other and facing or along the centerline across the centerline of the diameter direction The 3rd small grindstone grain layer part and the 4th small grindstone grain layer part arrange | positioned. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 24_ For the grinding wheel in the scope of patent application, the aforementioned small grindstone layer is arranged on the support metal. 25. The grinding wheel according to the scope of the patent application, wherein the small grindstone grain layer part is fixedly adhered to the super abrasive grains of Zhuo with a metal bonding phase. 2 6. The grinding wheel according to item 25 of the scope of the patent application, wherein the small grindstone grain layer part is fixed and bonded with superabrasive grits in the recess formed on the protrusion of the support metal. This paper size applies Chinese national standard (CNS> A4 specification (210 X 297 mm) 55 311384 474855 Printed by A8 B8 C8 D8 of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, patent application scope 27_If you apply for patent scope 25 Item of the metal bonded single-layer grinding wheel, wherein the outer diameter of the aforementioned dog part is in the range of 3 to 3 of the average particle size of the superabrasive stone. The grinding wheel recognized as the item 25 in the patent application scope, wherein it is relative to the aforementioned support The height of the protrusions on the bottom surface of the metal is in the range of 0.05 to 3.0. 29. For the grinding wheel in the scope of the patent application No. 25, wherein the distance between the adjacent protrusions :: is the average outer diameter of the protrusions. ㈣ ... multiply the range. For the grinding wheel in the scope of patent application No. 丨, «^ 彻 / / described in the small grindstone layer is a combination of 1 or a number of short and strong super-ground grindstone particles with metal bonding phase疋. If the grinding stone in the scope of patent application No. 30 is applied, the installation of AT is described as the small grinding stone and the drawer is fixedly bonded with a plurality of super grinding stones, and the enemy system is short and strong. Superabrasive granules. 、 Superabrasive granules on the outer side 32. Rushen Please refer to the grindstone of item 30 of the patent scope, and the super grindstone particles provided by the department are set to i to 50. The plane of the grindstone grain layer with respect to the supergrind of the total area of the grindstone grains is observed in a plane. The following is the range of 20/0 to 80/0. The proportion of the weight is set to 33. For example, the grinding wheel of the scope of patent application, the re-grinding device. Not to mention the grinding wheel system CMP This paper is applicable to national standards (CNS) A4 size (210 X 297 mm) Packing ---------- Order --------- Line (Please read the precautions on the back before filling this page) 56 311384