TW457171B - Abrasive tool - Google Patents

Abstract

The abrasive particle layer 22 in which the super abrasive particle 26 is dispersed in metal plating phase 25 is prepared on a base plate 21 of electrodeposited wheel 20, the abrasive particle concave part 27A and abrasive particle convex part 27B by super abrasive particle 26 is prepared to the radius direction in mutually and the surface of the cross-section is made as sign wave like, and the abrasive particle concave part 27A and abrasive particle convex part 27B is formed in the shape of a concentric circle ring like on a surface of the abrasive particle layer. The discharge of slurry is promoted by abrasive particle concave 27A part, and also the damage by polishing of a ground face is made small by abrasive particle convex part 27B. You may adopt the shape of a three layer ring of concentricity or three layer's spiral like abrasive particle layer 121 as the wheel 120. Especially, this electrodeposited wheel 20 and the wheel 120 are suitable as a pad conditioner of CMP equipment.

Description

Λ7 B7 4571 71 V. Description of the invention G) [Technical field of the invention] The present invention relates to the provision of a grinding stone for adjusting a grinding stone used when a surface of a material to be polished such as a semiconductor wafer is polished by a CMP device. This specification is based on the Japanese patent application (Japanese Patent Application No. J5) No. 8 and Japanese Patent Application No. 1 1-2361 75. Part of the content of this specification is taken from the statement of the patent application. . [Known technology] In the conventional technology, the Cm p device (with 苐) for chemically and mechanically polishing the surface of a cut semiconductor wafer (hereinafter referred to as a crystal circle) is used in the conventional technology. Example of unrecoverable CMP device). Since the wafers of semiconductor devices need to be polished as they are miniaturized, they have high precision and are free of defects on the surface. The CMP polishing mechanism is a mechanical / chemical polishing method that uses a combination of mechanical components (free abrasive particles) of monoxide particles and other components such as alkaline solution ^

This CMP apparatus 1 is mounted on a disc-shaped rotary table 3 capable of rotating a ten-mandrel 2 as shown in FIG. 17, and is provided with a polishing pad 4 for polishing made of, for example, hard ethyl aminoacetate. The polishing pad 4 has a rotatable wafer moving head 5 at a position a which is offset from the central axis 2 of the polishing pad 4. The wafer moving head 5 is a circular plate having a smaller diameter than the polishing pad 4 and is used to hold the wafer 6. The wafer 6 is arranged between the aa circular moving head 5 and the polishing pad 4. The wafer surface on the side is mirror-polished D. During the grinding operation, 'free abrasive grains composed of, for example, the above-mentioned silicon dioxide particles are used as the abrasive, and the etching solution for the etching solution is mixed. CNS) A4 size (210 x 297 mm) I ------ f I -------- Order --- --- II 〈Please read the precautions on the back before writing this page ) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 311610 ___B7_ V. Description of the invention G) The polishing slurry S is supplied to the polishing pad 4. This polishing slurry S flows on the wafer 6 and polishing held by the wafer moving head 5. Between the pads 4, the wafer 6 rotates by moving the head 5. At the same time, since the polishing pad 4 rotates around the center axis 2 island center, one side of the wafer 6 can be polished by the polishing pad 4. The polishing pad 4 made of hard helium formate for honing wafers is provided with most fine foamed layers of honing to hold the polishing pads s, and the polishing held in these foamed layers is used. Polishing of wafers 6 and wafer 6 can be performed-but excessive retention of polishing slurry s in the foamed layer will cause the disadvantage of reduced polishing efficiency of wafer 6 and may also be caused by the polishing operation of wafer 6 The problem is that the flatness of the polishing surface of the polishing pad is reduced, and the polishing accuracy of the wafer 6 is further reduced. Therefore, as shown in FIG. 7, the conventional CMP apparatus 1 is provided with a polishing pad adjuster 8, and the surface of the polishing pad 4 is re-polished (adjustment of the polishing pad adjuster 8 is set on a turntable). 3 An electrodeposition grinding disc is provided on the external rotating shaft 9 via the arm rod 10 'The arm 1 () is rotated by the rotation shaft 9 to cause the electrodeposition grinding disc 1 to swing back and forth on the rotating polishing pad 4' using electricity Deposition grinding disc i 丨 Polishes the surface of polishing pad 4 so that the flatness of the surface of polishing pad 4 can be restored or maintained. As shown in FIG. 18, the electrodeposition grinding disc I 1 is attached to a disc-shaped metal base plate.丨 2 "_. Before being formed into a ring-shaped abrasive grain layer by Rische 丨 3

: c) Figure & Yuan this grinding platinum camp] 3 series by electroplating etc. f will be 锧 I and other super I | Hu 疙 grain Bu: 丨 metal bonds with the button 丨 敎 敎 敎: on the metal floor 11: The last ten 丨 媾 者. The gold used to protect the superabrasive particles 丨 4. It is a plated looking structure 丨 5 surface A7 Β7 45? 171 V. Description of the invention (: Opened / formed into a substantially flat, self-plated metal structure 】 5 The front ends of the protruding superabrasive particles 14 are also located on approximately the same plane. F Please read the precautions on the back before writing this page), Incheon, using this type of electrodeposition grinding disc 1] When grinding the adjuster 8 The polishing slurry s supplied on the polishing pad 4 for polishing the wafer 6 is kept too much due to the fine foam layer. When the polishing pad 4 is used, the electrodeposition polishing disk u has poor processability to the polishing pad, so the polishing pad 4 has The surface flatness is poor. Even if the polishing pad is adjusted, the problem of insufficient adjustment of the surface of the polishing pad (worked surface) will be solved. In addition, in the case where the surface adjustment operation of the polishing pad 4 is performed with the electrodeposition grinding disc 1 having a substantially flat front end surface formed by the superabrasive particles 14, when the electrodeposition grinding disc Π is used for the polishing operation, the entire surface is used. For surface contact, the foamed layer on the surface of the polishing pad 4 is squeezed, so that the opening is blocked, and there is no space for the polishing slurry to leak out. This causes a problem that the polishing ability of the polishing pad 4 faces the wafer. Jibei Intellectual Property | 7 Industrial and consumer cooperatives, and the company's EPP, and when the grinding operation using the electric product grinding disc 11 is used for grinding, the electrodeposition grinding disc is shown in FIG. 20, and the electrodeposition grinding disc u is at least inclusive of The lid corresponds to a distance on the radius of the polishing pad 4 and performs polishing while swinging back and forth. However, in this case, the polishing area of each portion of the annular superabrasive particle layer 13 is determined by the length in the transverse direction parallel to the operation of the polishing pad 4. That is, in FIG. 1S (A), the polishing length (area) of the abrasive grain layer 13 in the a direction which is slightly parallel to the rotation direction p of the polishing pad 4 is set to the same polishing length in the b direction as L2, and the c direction. The grinding length in the a direction is 2x LI, and the grinding length in the b direction is based on the paper size. Applicable to China National Standard (CNS) A4 specifications < 2] 〇 297 Male f ----- 3 311610 Λ 7 ____R _ V. Description of the invention G) L.2, the grinding length in the c direction is 2x L3, and the grinding length (area) from the center of the abrasive grain layer 丨 3 to the end facing the swing direction is 2x LI < 2x L 2 < 2 x L 3. When the sum of the grinding length (area) is the workload of each part, the workload of the abrasive grain layer 丨 3. In the direction slightly parallel to the rotation direction of the polishing pad 4, the distribution is shown in Figure 2] status. However, in the annular abrasive particle layer [.3], when the workload of each part (a, b, c) which is slightly parallel to the turning direction P of the polishing pad 4 is different, the outer peripheral area of the polishing pad 4 The polishing amount will be larger than the radial central area of the polishing pad, which will impair the uniformity of the polishing, make the restoration of the surface flatness of the polishing pad or the great cause of removing the blockage of the mesh holes become more incomplete, and more because of wear. The unevenness causes the problem of reduced electrode life. In order to improve the above problem, as shown in FIG. 20, the outer portion of the electrodeposition polishing disc Η is beyond the edge of the polishing pad 4, and the maximum workload of the c area in the polishing of the polishing pad 4 is sacrificed to ensure the flatness Degree, a swing motion that is approximately orthogonal to the rotation direction P of the polishing pad 4 is added to the | electrodeposition grinding disc Π. ; However, this kind of grinding operation that makes the electrodeposition grinding disc swing

V will make the polishing efficiency poor, and make the electrodeposited grinding discs 丨】 Exceeding the polishing pad 4 or performing swinging motions will not relieve the uneven workload. Therefore, there is no way to obtain sufficient efficacy. In view of the above-mentioned problems, we provide a polishing stone which can be used in this line. When polishing ^ polishing pads,-the surface is polished to remove the polished surface I '-please read the precautions on the back before filling this page )

Ding.-= D —line ------------- 7 --------- I ---- 5 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 4

1 71 A _____B7__ 5. Description of the invention (5) The slurry 'side can perform excellent grinding processing operations on the grinding surface. Another object of the present invention is to provide a grinding stone capable of achieving uniform grinding without sacrificing the grinding work of the abrasive particle layer. In order to achieve the above-mentioned object, "the abrasive stone of the present invention is provided with an abrasive particle layer fixed on a metal seat plate", and its superabrasive particles are dispersedly arranged on the bonding structure. It is characterized in that convex surfaces are provided on the surface of the abrasive particle layer And recess. The concave and convex portions are formed on the surface of the abrasive grain layer, so that the contact area with the abrasive surface such as the grindstone becomes discontinuous rather than continuous surface contact. Therefore, the damage to the abrasive surface is also reduced, and the concave portion is reduced. Since the polishing slurry can be stored, not only can the polishing slurry be stored in the recessed portion as the polishing is performed, but also the polishing slurry can be discharged from the surface to be polished, so that excessive polishing slurry remains on the surface to be polished and adversely affects polishing. In addition, in a preferred aspect of the present invention, the convex portion and the concave portion on the surface of the abrasive grain layer form a continuous linear shape ^ By forming a continuous linear shape through the concave portion, the accumulation of the slurry in the concave portion can also be increased . According to another preferred aspect of the present invention, the convex portion and the concave portion may be continuously formed in a concentric circle shape. In addition, the convex and concave portions on the surface of the abrasive grain layer may have a sine wave shape from the wound surface. According to another preferred aspect of the present invention, the abrasive stone of the present invention is a single-layer abrasive stone ', which is characterized in that the abrasive grain layer is provided with a plurality of layers at intervals in the diameter direction. On a single-layer abrasive stone, the abrasive particle layer is formed by a plurality of layers separated radially, so that the sum of the abrasive length (area sum) of the abrasive particle layer area which is slightly parallel to the relative movement direction of the abrasive material such as a polishing pad 2 Now it is almost uniform, so the performance of uneven workload in each region is applicable to China National Standard (CNS) A4 (210 X 297 mm) " 311610 Agriculture. ------ (Please read the notes on the back before writing this page) A 7 V. Invention Description (6 is enough to get a change of business. The Intellectual Property Bureau of the Ministry of Economic Affairs's Consumer Consumption Co., Ltd. has printed a good letter, and the crime is reached. Accurate and uniform grinding of the material to be grounded. In addition, the so-called single-layer grinding stone refers to the combination of metal: only the layer of superabrasive particles is included, including electrodeposited grinding stone. 1 is metal bonded grinding; 5. Wish Stone or clothing Another ideal aspect of the present invention is the grinding ring or spiral shape. "A plurality of " what is wrong with this aspect, the abrasive grains which are roughly flat with the relative moving direction of the abrasive material In the layer area, there are fewer moving directions and f moving directions .... 〕 A generally uniform bear is present at a random position in the direction of a roughly straight parent. Another ideal aspect of the present invention is that the plurality of layers constituting the abrasive grain layer are three or more. Since the abrasive grain layer is divided into a plurality of layers, The grinding length of the grinding electrode layer region substantially parallel to the direction of movement of the sound material to be researched "and the sound in the direction of the movement of the clock to be polished are substantially orthogonal. / Furthermore, according to the present invention In another ideal aspect, the plurality of layers of the abrasive particle layer have a larger inner layer width than the outer layer, and the grinding length and U diameter of the abrasive particle layer region where the relative moving direction of c S and the relative direction of the abrasive grains are slightly parallel are larger. The outer layer is larger, so when the inner layer is relatively wide, the above grinding. Long change and balance are easy to obtain. In addition, according to the present invention, the ideal layer layer is chamfered plus j_ operation = View from the history section. Please read the precautions on the back before filling this page.) Binding: Ordering: Thread. Λ4. · ^ 67171 A7 137 Jing Wuzhi I Finance Employment M) Printing by employee consumer cooperatives V. Inventions Instructions (7) When the single-layer grinding stone is turned and the material to be polished, such as a polishing pad, is polished, the chamfered portion starts to contact the material to be polished. Therefore, the material to be polished is continuously roughened from chamfer 4 to precision grinding. This results in better grinding accuracy. According to another desirable aspect of the present invention, in the abrasive grain layer, the average abrasive grain size of the super abrasive grain layer provided on the outermost layer is smaller than the average abrasive grain size of the super abrasive grain provided on the inner layer. Although the single-layer grinding stone is used for grinding operation, slight vibration occurs due to the grinding resistance, but because the super-abrasive particle size of the outermost layer of the abrasive particle layer is small, the adverse effects of vibration can be reduced, and The abrasiveness of the material to be polished improves the roughness of the polishing surface, and the particle size of the superabrasive particles in the inner layer is large, so it is possible to improve the polishing ability and the discharge efficiency of the polishing debris. In addition, the heights of the outermost layer and the inner layer of the abrasive grain layer are set to be substantially equal to each other, and the height of the metal seat plate of the outermost layer is higher than that of the inner layer metal seat plate. The height difference is set to be equivalent to super grinding The average particle size of the pellets is poor. It does n’t matter if the average particle size of the superabrasive particles in each of the layers of the number of edges of the abrasive particle layer is different, it is set at the same height to ensure the polishing accuracy. In addition, in the "grinding stone of the present invention", the superabrasive particles are dispersed and arranged in a single layer in a metal bonded structure to form a layer of abrasive particles, and the polishing layer is mounted on a metal base to form a single-layered abrasive stone. , The imaginary line extending a plurality of arbitrary positions in a direction substantially parallel to the relative moving direction of the material to be polished, and the grinding length of the aforementioned abrasive grain layer intersecting the imaginary line, please read the precautions on the back.% This page binding The size of the paper is applicable to the national standard (CNS) A4 specification (210 X 297 mm) 311610 Intellectual property of the Ministry of Economic Affairs 垲 Second consumer cooperation. Fj! &Quot;. 3 · '心 Λ 7 __Β7_ V. Description of the invention (8 ) And department are generally the same. When a single-layer abrasive stone is rotated for grinding and removal, the abrasive particle layer at any position slightly orthogonal to the imaginary line does not cause much difference in the workload of polishing. Therefore, the flatness of the material to be polished such as a polishing pad is remarkable. High-level grinding process-In addition, the abrasive particle layer can also be arranged on the single-sided peripheral area of the metal seat plate-the single-layer abrasive stone is particularly suitable for adjustment as a polishing pad of a CMP device. [Embodiments of the Invention] Hereinafter, embodiments of the present invention will be described with reference to the drawings. A first embodiment of the present invention will be described with reference to FIGS. 3 to 4. The first embodiment of the electrodeposition grinding disc 20 (electrodeposition grinding wheel) disclosed in FIG. 2 and FIG. 2 is mounted on the arm of the adjusting pad 8 of the CMP apparatus 1 to make it work. On this electrodeposition grinding disc 20, a metal seat plate 21 is provided as, for example, a substantially flat circular plate, and on the other side 2 1 a of the outer peripheral side fixing surface 2 1 b, abrasive particles having a substantially annular shape are provided. Layer 2 2. Fixing surface 2 of the metal seat plate 21 1b * Viewed from a radial cross-section shown in FIG. 3, the seat plate recesses 2 3 a and the seat plate protrusions 23 b alternate in a radial direction and become approximately sinusoidal. The shape is curved, and each of the seat plate recesses 2 3 a and the seat plate protrusions 2 3 b are concentric circles with the center of the metal seat plate 21 as an axis. All the abrasive grain layers 22 on the fixing surface 21 have approximately the same thickness. The abrasive grain layers 2_2 are made of diamond diamond or (VB: \, etc. super abrasive grains + 2 6 minutes, and are arranged on a metal plating layer such as nickel 2 5 Structure of the organization: Therefore, the surface of the abrasive grain layer composed of the superabrasive grain 2 f) of the electrodeposition abrasive disc 2 ϋ 中 is formed by the fixed surface along the metal seat plate 2 丨 S convex Shape: ΐ ^ ^ S u 'Ν :; Λ1 # .¾ (-H: > / (Please read the urgent notes on the back of 璜 before filling out this page)

A7 17t _______B7__ 5. Description of the invention 〇) alternately form concentric annular grinding rough concave portions 27A (concave portions) and abrasive grain convex portions 2 7 B (convex portions). From the longitudinal section of the electrodeposited abrasive disk 20 shown in FIG. 3, the depth difference D in the depth direction of the abrasive grain recesses 27A and the abrasive grain protrusions 27B is set to be shorter than the length in the same direction of the single superabrasive grains 26. Therefore, the leading end of the superabrasive particles 20 located in the abrasive grain recessed portion 27A and the base end of the superabrasive particles 26 of the abrasive grain protruding portion 27B are located at a protruding height position relative to the '. Therefore, when the abrasive particle diameter of the superabrasive particles 26 is d, the height difference between the abrasive particle concave portions 27A and the abrasive particle convex portions 27B is in the range of (l / 2) d to 2d. In addition, the distance L between two abrasive grain recesses 2 7 A and 2 7 A adjacent to each other in the radial direction of the abrasive grain layer 2 2 or the abrasive grain protrusions 2 7 B and 2 7 B is set at The range from d to 3d is better. The reason is that if the height difference D is greater than 2d, 'the polishing slurry discharged from the polishing pad 4 will be too much, which will adversely affect the subsequent grinding operation: on the contrary, it is less than (1 / 2) d will reduce the slurry discharge efficiency. In addition, when the distance L is larger than 3 d, the polishing efficiency is impaired, and when the distance L is smaller than d, the contact area is enlarged, and damage to the polishing pad is increased. In addition, the 'abrasive particle layer 22 is formed to have an uneven shape along the fixing surface 21b of the metal seat plate 21 by having substantially the same thickness by an operation such as plating. The superabrasive particles 26 dispersedly arranged in the metal ore layer structure 25 of the abrasive particle layer 22 are arranged along the shape of the fixing surface 2 1 b of the metal seat plate 21 to form, for example, one layer. When manufacturing such an electrodeposited grinding disc 20, it is attached to a fixed surface 21b to be electroplated on one side 21a of one side of a metal plate 21 having a slightly circular plate shape. The diameter _ — — — — — — — — — — — --- I ΙΓ --- Order- -------- (Please read the precautions on the back first, and then this page.) The scale of the printed paper is applicable to the employees ’cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. China Solid National Standard (CNS) A4 specification (210 x 297 mm) 9 311610 B7 V. Description of the invention (1.) The metal seat plate recesses 2 3 a and the metal seat plate protrusions 2 3 b are alternately formed to the ground to form a ring. The concentric circular shape is shielded except for the fixing surface 2 1 b. Next, in order to deposit the abrasive grain layer 22 by electroplating, a plating solution (not shown) is filled with a plating solution containing metal ions such as nickel and cobalt. In this plating tank, a shielded metal seat plate 21 is placed and connected to the cathode. At the same time, a metal seat plate 2] is arranged in parallel to the anode plate, and the two poles are energized. After that, the fixing surface 2 1 b The superabrasive particles 26 are contacted on the upper surface, and the metal plating structure 25 containing the superabrasive particles 26 is precipitated on the fixing surface 2] b of the metal seat plate 2t serving as a cathode, and the first to third figures are obtained. The disclosed electrodeposition grinding disc 20. Since the electrodeposition polishing disc 20 of this embodiment has the above-mentioned structure, the electrodeposition polishing disc 20 can be mounted on the adjuster 8 of the CM.P apparatus 1 to perform the adjustment operation of the polishing pad 4. First, the electrodeposition grinding disc 20 is installed at the front end of the arm 10 I of the adjuster 8, and the rotary table 3 is rotated while reciprocatingly turning the rotary cypress 9, as shown in FIG. The electrodeposition grinding disc 20 grinds the polishing pad 4 on the turntable 3. ^ In such a case, the superabrasive particles 26 'provided on the abrasive particle protrusions 27B of the electrodeposited abrasive disc 2 2 / T :, ΐ of the abrasive particle protrusions 27B will be pressed into the polishing pad y | For polishing, the foam that is open on the surface of the polishing pad 4 .. the polishing slurry accumulated in the medical pad will be scraped out, and some of the scraped out polishing slurry will be scraped. · Flat electrodeposition polishing disc 1 known in i 丨In j, there is no supply for escape!! a ¥ uf is then pressed into the lifting layer of the polishing pad 4 < but in the actual implementation of φ ^, can be used to keep the honing slurry. In the recessed part of the abrasive grain layer 2 2 please read the precautions on the back before filling in this -S: Packing " 0 ___; 丨 457 17 Printed by the Consumers Cooperative of Wisdom and Time Bureau of the Ministry of Economic Affairs 11 A7 B7 Five ' Invention Description (il) Within 27A. In addition, since the recessed portion 27 A of the abrasive grains and the metal seat plate 21 of the electrodeposition polishing disc 20 form a coaxial concentric circle shape, the storage amount of the polishing slurry is large, and it can be reliably recovered from the foaming layer of the polishing pad 4. Grinding slurry. The polishing slurry stored in the abrasive particle recess 27 a of the polishing particle layer 22 is moved back and forth between the arm 10 of the adjuster 8 and the rotation of the polishing pad 4 to cause the polishing slurry to be removed from the surface of the polishing pad 4 Excluded. Therefore, the free abrasive grains contained in the polishing slurry will not remain in the polishing pads, and will not adversely affect wafer polishing after adjustment. At the same time, the concentric circular abrasive particle protrusions 27B provided on the abrasive particle layer 22 of the electrodeposited abrasive disk 20 are pressed into the surface of the polishing pad 4 to some extent, and the superabrasive particles 26 in this portion are used for polishing. The contact area of the abrasive grain layer 22 with the abrasive pad 4 is only the abrasive grain protrusions 27 b, and the abrasive grain recesses 2 7 A are not in contact. When the grinding is performed, the surface of the abrasive pad 4 is intermittently polished, and only the electrodeposition abrasive disc 20 Part of the area of the scanned area will be ground or cut by the abrasive particle protrusions 27 B during grinding ^, because the damage caused by grinding is relatively small. In this way, the surface of the worn pad 4 can be polished again by the superabrasive particles 26 of the abrasive particle protrusions 2 7 B, and the flatness of the polishing pad 4 can be restored or maintained. Processability. As described above, according to the present embodiment, “except that the excess polishing slurry accumulated in the fine foamed layer of the polishing pad 4 can be scraped out and kept in the abrasive grain recess 27A and discharged,” the abrasive grains can be used. The abrasive particle protrusions 27B of the layer 22 again grind the surface of the polishing pad 4 to reduce the damage of the polishing pad 4 and the paper size applies the Chinese National Standard (CNS) A4 specification (2) 0 X 297 mm 311610. tlilfj — — — ---------- I ^ --------- IC Please read the notes on the back before writing this page) _I £ 7_ V. Description of the invention () 2) And maintain flatness. Next, a modification example of the electrodeposited grinding disc 20 of this embodiment and other embodiments will be described. The same symbols as those of the first embodiment will be described with the same symbols. FIG. 5 shows the electrodeposition grinding disc 3 0 of the first modification example with the metal seat plate 2] The outer peripheral fixing surface 2 1 b has four metal seat plate portions 23 a and metal in a sine wave shape in a radial section. The seat plate convex portion 23b is formed into a substantially concentric circular ring shape. The abrasive grain layer 31 is formed along the concave-convex shape of the fixing surface 2b, so that the abrasive grain recesses 2 7 A and the abrasive grain 3 portions B alternate in a radial direction and have concentric circles. In addition, the abrasive grain layer 31 forms groove-shaped grooves 32 which are deeper than the abrasive grain recesses 2 7 A of the abrasive grain layer 31 at predetermined intervals (45 ° intervals on the 5th). The groove 32 is formed in a U-shaped cross section in FIG. 6, but the cross section shape can be set to any shape as long as it has at least the same depth as the abrasive grain recess 2 7A. By adopting such a structure, when the adjustment operation of the polishing pad 4 is performed by using the electrodeposition polishing disk 30, the polishing slurry stored in the abrasive grain recess 2 7 A will be discharged through the groove 32 at any time. Externally, the discharge of the slurry is improved. Fig. 7 shows a second modification of the first embodiment. In Figure ☆, the electrodeposited abrasive disc 3 5 is mounted on the annular fixing surface 3 6 on the outer peripheral side of the metal plate 2 1 which is too slightly disc-shaped. The abrasive particle layer 3 7 is super-abrasive particles 2 dispersedly arranged in the metal ore layer structure 2 5 and constitutes a special abrasive wall. Please read the precautions on the back of the surface before writing this page-pack- -" Mouthline ---- Economic and Trade Bureau of Intellectual Property ^^ Consumer Cooperation ^., · 1 · '" Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 13 457171 A7 _______ B7 V. Description of Invention (13 37a) The abrasive grain concave portion 278 and the abrasive grain convex portion 28B are formed in such a manner that the base line t of the imaginary slightly convex curve shown by a point chain line in the longitudinal section is used as the centerline to draw the sine curve. That is, the surface of the metal plating structure 25 and the superabrasive particles 26 protruding from the surface are fixed in a sinusoidal curve. In addition, the abrasive grain recesses M and the abrasive grain protrusions 27 B on the surface 37a of the abrasive grain layer 37 are formed in a ring shape in a plan view. By comparing this structure 'with the above-mentioned embodiment, the amount of pressing of the abrasive grain convex portion 27 and the linear grinding pad 4 is large, and the polishing efficiency is improved. Viewed from the cross section of the abrasive particle layer 37 shown in FIG. 7, since the abrasive grain recesses M # on both sides are “arranged obliquely outwards”, although the storage capacity of the abrasive grains passing through the abrasive grain recesses 278 is small, but The discharge efficiency is improved, so the discharge efficiency of the overall slurry is not reduced. FIG. 8 shows a modification example # 3 of the first embodiment. In this example, the abrasive grain layer 4 j of the electric grinding wheel 40 is formed alternately in the form of quadrangular recesses 42A and 42A in the longitudinal section, and the recesses 42 and the protrusions 42B also form concentric rings. shape. Fig. 9 shows a second embodiment of the present invention. In this embodiment, as in the first embodiment, the electrodeposition grinding disc 45 is formed into a substantially concentric circular ring shape, and a substantially circular plate-shaped metal seat plate has a ring-shaped fixing surface 2 1 b on the outer peripheral side in the diameter. A metal seat plate recessed portion 23 a and a metal seat plate portion are formed into a sine wave shape in a longitudinal section, and the abrasive grain layer 46 is composed of superabrasive grains 26 and a metal plating structure 25. The research layer 46 is formed along the concave-convex shape of the fixing surface so that its surface is ^ paper size. Applicable to China National Standard (CNS) A4 Regulations. -------- 311610- -------------Zhuang Yi 'II ί 1 II f Order. I —II --- I f Please read the sound on the back first? The matter is again on this page '} 5. Description of the invention (! 4) The mesh-like groove-shaped abrasive grain recesses 4 7 A are composed of abrasive grains Λ 47 B which are separated from each other by the abrasive grain recesses 4 7 A. . According to such a structure, 'the abrasive grain recesses 4 7 A are connected to form a mesh shape in the radial direction and the peripheral direction, so that the storage and discharge of the polishing slurry can be more reliable. In addition, 'the polishing liquid 1 can be injected on any of the radially inner side, the outer side, and the circumferential direction, and a more precise grinding operation can be performed. Next, FIG. 10 shows a modified example of the second embodiment. In this abrasive grain layer 50, there are two circular shaped abrasive grain recessed portions 51A having a substantially arc-shaped groove shaped abrasive grain recessed portion 5A and two abrasive grain shaped portions 5B and 5 located in the middle of the pair of arcuate shaped abrasive grain recessed portions 5A. 1 C, the abrasive grain recesses 5 1 A and the abrasive grain protrusions 5 B, 5 1 C constitute an abrasive grain layer 50 composed of superabrasive grains 26 and metal as in the second embodiment described above. This configuration of the plating structure 25 can also obtain the same effect as that of the fourth modification. In addition, the concave-convex shape of the abrasive grain layers 46, 50 formed in the second embodiment and its modification can be formed by knurling, transfer processing, and cutting processing. Fig. Π shows the third embodiment of the present invention. . In the electrodeposition grinding disc 55 shown in FIG. The uneven shape of the fixing surface 2 1 b of the metal seat plate 2 1 of the same shape shown in the embodiment is formed to have approximately the same thickness, and the metal plating structure 2 5 Φ. Super-grinding of a single layer or a plurality of layers with a precise filling arrangement Grain 26 is used to manufacture such abrasive grain layer 5 (at 1 ''), for example, a vibration filling type electric chain is used: Chain: 'ί: Immediately. The abrasive grain layer 2 in the form of a solid form 2 "-j _丨 I silver in each circle, Ϊ, and 丨 Cao H is filled with a metal containing iron .. Please read the precautions on the back before filling this page)

8 7 457171 V. Description of the invention (15 electroplating solution of abrasive grains. In this plating tank, a shielded metal base plate is placed and connected to the cathode, and an anode plate is arranged in parallel with the metal base plate 21— Mix the electric key liquid while applying current to both poles. In this state, the metal seat plate 21 or the plating bath or the plating solution is vibrated while precipitating on the fixing surface 2 of the metal seat plate 2 as the cathode. The metal-plated structure 25 containing the superabrasive particles 26 can be obtained as shown in FIG. Π. The electrodeposition grinding disc 55 with the superabrasive particles 26 arranged on the fixing surface 21b of the metal seat plate 21 is filled by this vibration. The electrodeposition method of this method can simply arrange and superposition the superabrasive particles 26. In addition, in the above-mentioned embodiment or each modification, the abrasive particle layers 22, 30, 35, 40, 55 of the electrodeposited abrasive discs 20, 30, 35, 40, and 55, 37, 4], 56 of abrasive grain recesses 27 A, 42 A and abrasive grain protrusions 27 B '42 B are formed in a plurality of concentric circles, and abrasive grain recesses 27 A, 42A and abrasive grain protrusions 27 The structure of B and 42 B is not limited by the above embodiment. An appropriate structure may be adopted. For example, the abrasive grain recesses 27 A and 42 A and the abrasive grain protrusions 27 B and 42 B may be formed to extend radially and linearly and be arranged alternately, or the abrasive grain recesses 27A. , 42A, and abrasive grain protrusions 27B, 42B form a dot shape, and are arranged in a checkerboard pattern in the vertical and horizontal directions.

In addition, the cross-sectional shapes of the abrasive grain recesses 27 A, 42 A, 47 A, and 5 1 A and the abrasive grain protrusions 27 B, 42, 47 B, 5 B, 5] C are not limited to a quadrangle or a circle. It is arc-shaped, and an appropriate shape D metal seat plate 21 can be used for forming the abrasive grain layer 22, 37, 41, and% of the fixed surface 2 1 b. It is not necessary to imitate the abrasive grain recess 27 a on the surface of the abrasive grain layer. ------ I -------- ^ --------- f Please read the notes on the back first and then write this page} Ministry of Economic Affairs 5? Hui Property Bureau Employees' Consumer Cooperatives Standards for printed wood paper are in accordance with Chinese National Standards (CNsI ^ g (2ί0 x 297 Gongchu) 15 311610 ii; the Ministry of Intellectual Property Bureau of the Ministry of Finance, Consumers and Consumers, '.Γ ;; One!-: Use other 槔 4 Real drag shape ° I Roughly round <) ring-shaped gold ') Λ · 1 Λ 7 ____ Β7_ V. Description of the invention (16) 42 Α and the shape of the abrasive projections 2 7 Β, 42 Β, also 邛In form. The following diagrams 2 through 4] illustrate the first deposition grinding disc of the present invention] 2 0 is arranged on the surface of the disc-shaped metal seat plate 11 2 丨 2 2 is provided on the outer peripheral side by a concentric circle (non-concentric circles are also A plurality of layers (three layers in the figure) of the abrasive particle layer] 2 1 and the abrasive particle layer] 2] is formed on the outermost periphery with the largest diameter (for example, the same diameter as the metal seat plate H2) A polishing layer 丨 2iA side is spaced apart to form a second abrasive particle layer 丨 21β, and a third abrasive particle layer with the smallest diameter is formed at the innermost point i 2] c is polished from the first layer to the first- The grain layers mA, b, and c form concentric circles, and no abrasive grain layer is formed on the inside of the first abrasive grain layer 1 2 1 C. Each abrasive grain layer ⑵A, B, and C is in a group such as nickel The superabrasive grains I such as diamond are dispersedly arranged in the weaving (metal-plated structure) 25, and the superabrasive grains 26 are arranged in a layer only in the thickness direction of the metal-bonded structure. The electrodeposition grinding disc U0 is made into a single-layer grinding stone. Each of the calendar pine layers 1 2 1 A, β, and C is exposed, Sedimentary grinding disc 丨 2 〇 X-X 唆 却 but 丨-Figure 13 of the longitudinal section of the urine «front end grinding surface 1 21 a, 1 2 1 b, 1 2〗 c on both sides

The medial flange is chamfered into an R shape (or an inclined P to form a chamfered portion t, and the chamfered portions t and t are formed in each abrasive grain layer U 1 A, 丨 2 IR, π i (. 夕 * Bu -u the entire periphery and the first ξ and third abrasive particles] 2 丨 A, Β, C Xi i) net in, " η 丨, Deng Zhoufang asked about the width of the cutting plane UU, ulb 'UU w ^ 'W b: u Λ, Γ ^ e are set at the most. The width of the side grind layer mc: is the largest. The width of the outer layer is broken by 1 I --- (Please read the note on the back first Please fill in this page for matters) Order ----- Line (57 1 71 A7 Printed by B7, Member of Intellectual Property Bureau, Ministry of Economic Affairs, Consumer Cooperative) V. Description of Invention (17)

Gradually shrink. Therefore, the relationship between Wa > Wb > WC and Lvvc is formed. In addition, each of the abrasive grain layers 12iA, b, and DL from the first to third layers has a certain width. The reason for this design is that the imaginary lines a, b, c, and d, which are located at any position substantially orthogonal to the direction of rotation P of the grinding 塾 4, are inscribed in the grinding grains 12] A, B, and C should be written to you # 丄 λα / 1 — The grinding length of the outer abrasive grain layer with a large melon branch (for example, the grinding length Ldl of the imaginary line d) will be greater than the grinding length of the abrasive grain layer with a smaller inner diameter. As the amount increases, the width of the inner abrasive particle layer is increased to make the abrasive length (work load) of each abrasive particle layer more uniform. For example, in FIG. 12, an imaginary line extending substantially parallel to the rotation direction p of the polishing pad 4 with respect to the first to third abrasive grain layers} 2} A, B, and C is slightly aligned with this direction. The orthogonal direction is shifted, and then the imaginary lines a, b, c, and d are drawn to arbitrary positions. For example, the imaginary line a, b intersects the first to second abrasive grain layers 121 A, B, and C, and the imaginary line c is cut outside the second abrasive grain layer 121C, and then kia'b with the first and second abrasive grain layers. Intersect again 'imaginary line d and first abrasive grain layer! 2 1 A is inscribed and intersected ° The first to third abrasive grain layers 12 1 A, B, and C intersecting with each of the imaginary lines a, b, c, and d are set in the following manner. It is assumed that the grinding lengths (areas) of the first to third abrasive grain layers I21A, b, and C intersected by the center of the electrodeposition grinding disc I 2 0 and the closest imaginary line a are Lai, La2, and La3, respectively; from the center of rotation The grinding lengths (areas) of the first to third abrasive grain layers i2Ia, B, and C intersected by the imaginary line b approached 〇 times are set to Lbl, Lb2, and Lb3; the imaginary line c approached again from the center of rotation 0 intersects The first to third abrasive grain layers 1 21 A, B, and C have an M-scale scale applicable to the Chinese national standard (CNSM4 specification (210 X 297 mm) --------------- Install --------- Order --------- Line (Please read the precautions on the back before writing this page) 311610 17 V. Description of the invention) The grinding length (area) is set to L c 1 'L c. 2, L c 3, the first abrasive grain layer intersected by the outer imaginary line d furthest from the center of rotation ο] 2 1 A The grinding length (area) is set to Ld 丨, then it must be set The widths Wa, Wb, and Wc of the first to third abrasive particle layers j 2 1 A, B, and C constitute 2 x (L a) — L a 2 ten i .. a 3) two: 2 x (. L b 1-L b 2 .τ 'L b 3) 2 x (L. c) + U'2) and 2 x (Ld 丨) Relations. With the above relationship, let Wa < Wb < Wc. In addition, the abrasive particle layer 21 is formed at a predetermined interval, for example, 4 5 :: intervals in which the grooves 117 are formed radially to discharge the polishing slurry s or the grinding dust. The groove Π 7 is formed in a straight line from the first to third abrasive grain layers I 2 1 A, B, and C in FIG. 12. However, the groove Π 7 does not necessarily form a row, and It can be staggered to different positions in the circumferential direction of the first to third abrasive particle layers 121Λ, B, and C, and it can be kept in a radial direction. R. Moreover, the grooves in the outer layer 1 1 7 When a large number of strips are formed to form such a shape, the cooling efficiency between the first to third abrasive particle layers 1 2 1 A, B, and C and the performance of discharging abrasive dust become very good. ： U ή, .ί: A.: 5. F 1 ·-nn K n li- nn ί in J · ni— (Please read the precautions on the back before filling out this page) The electrodeposition grinding disc of the fourth embodiment ] 20 has the structure described above. When the polishing pad 4 is adjusted, rotate the polishing pad 4 in the direction of P and rotate the electrodeposition polishing disc 1 2 () at the same time to remove the fluff phenomenon of the polishing pad 4 to restore and maintain the flatness. During the grinding movement, 1 is located on the first to third abrasive particle layers of the code abrasive particle layer 2i, and the abrasive surfaces i 2 1 a, B, and C of the two abrasive layers i 2 1 a 'b' c in the width direction. The edge ίΜί is ii_j 玛 部 ί · '' In order to grind F by electrodeposition grinding disc 丨 2 υ; :: time is α each abrasive grain layer 丨 2 ί A. The side of the investment is 457171 A7

Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention 〇9) The corner t removes the fluffed front end on the surface of the polishing pad 4 while sequentially grinding and removing it, while roughing it. Then, the flat polishing surfaces 121a, b, and c on the top are used for further fine polishing.

In addition, in the first to third abrasive grain layers A, B, and C of the abrasive grain layer 121, the plural numbers are arranged away from the center of the electrodeposited abrasive disc 120 in a direction substantially orthogonal to the rotation direction of the polishing pad 4. Imaginary lines ^, b, c, d and g, the sum of the grinding lengths (sum of area) on each imaginary line 2 X (Lai + La2 + La3), 2x (Lbl + Lb2 + Lb3), 2x (Lcl + Lc2) , 2x (Ld)) are substantially the same. Therefore, as shown in FIG. 4, polishing processing can be performed with substantially the same workload in the entire range of the swing direction of the abrasive particle layer 1 2 1. Therefore, in the adjustment operation of the polishing pad 4, as long as the electrodeposition polishing disc 120 is placed on the polishing pad 4, and it is rotated, it is not necessary to perform a swing operation, and it is possible to effectively perform more southern flatness polishing.塾 Grinding. As described above, when the polishing pad is adjusted according to the present embodiment, it is possible to perform a life-saving polishing operation using the entire range of the grinding discs without having to protrude the electrodeposition grinding disc 120, and it is substantially parallel to the rotation direction p of the grinding wheel 4. The sum of the grinding lengths (the sum of the areas) of the abrasive grain layer 12] is substantially the same. Compared with the conventional electrodeposited grinding disc Π, it is possible to perform a grinding operation with a higher flatness. Further, chamfered portions t, t are provided on both edges in the width direction of each of the abrasive particle layers 12A, B, and C, so that the polishing pad 4 is not damaged, and rough polishing to high-precision polishing operations can be performed. In addition, 'Not subject to electrodeposition grinding discs' 2〇 Pairs ^ -------- ^ --------- ^ (Please read the precautions on the back before writing this page) This paper size applies to China The standard (CNS) A4 specification (210 X 297 mm) 19 311610 Λ7 Intellectual Property Bureau fee 5. Description of the invention (") The influence of the assembly angle of the adjuster 8 can obtain the above effect. A fifth embodiment of the present invention will be described with reference to FIG. 15. It is revealed that the electrodeposited abrasive disc 1 in FIG. 5 and FIG. 5 have the same basic structure as the electrodeposited abrasive disc of the third embodiment. The difference is that the abrasive grain layer 1 3 1 forms a continuous spiral shape. The ideal way is to use abrasive grains. Layers] 3 1 is wound at least in the diameter direction, with three or more layers ^ (Figure 15 shows a state where three layers are formed). In such an embodiment, the abrasive grain layer 1 3 1 is sequentially formed from the first abrasive grain layer formed at the outermost point in order from the three layers in the diametrical direction from the outer side to the inner side. 3 1 A, second polishing The grain layer 1 B and the innermost second grinding and renting layer 1 3 1 C are continuously formed in a spiral shape. Except for the front end and the rear end in the direction of rotation, the width W of the grain layer gradually decreases from the inside to the outside. When the abrasive grain layer 131 is viewed from three layers in the diameter direction, the radial directions of the first abrasive grain layer 131A, the second abrasive grain layer 131B, and the third abrasive grain layer 1 3 1 C are at arbitrary positions. The widths W a, B, and W c are set to be a > Wb > Wc = Electrodeposition grinding disc 1 30, move the imaginary lines a, b, c, and d along the revolution P of the polishing pad 4 to approximately Set the widths of the first to third abrasive grain layers 1 3 1 A, B, C Vva, Vv 'b W c at appropriate positions orthogonal to the direction P, so that the abrasive grains on the imaginary lines a, b, c, and d) The sum of the fractions is 2 X (L a 1 十 L a 1Ϊ 十 ί, a 3):. 2 X (L. B _!-Layer 丨 3 1 grinding length (@ U2 ―- Lb

X

L i I jnnd · 1 I— It > ^ i PE n I-ft t- K n--It) CJi I ns κ ϋ ϋ f (Please read the precautions of Back® before filling this page) c 2 -r L c 3)-^ 2 x (L d 1 j In the embodiment, ^ 1¾ \ S.) A4 ΨΜ '·; / ί' '' '.'U ^ · and embodiment 阂 f 71 A7 B7 V. Description of the invention (21) The same effect. Its "human" will be described with reference to Fig. 16 in a sixth embodiment of the present invention. The electrodeposited abrasive disc 140 shown in FIG. 16 is an abrasive grain composed of the first, second, and third abrasive grain layers 12] A, 12 丨 B, and i21C having the same concentric annular shape as in the third embodiment, for example. The layer 141 is formed on one side 112 a of one of the metal seat plates 112. In addition, on the single surface 112 &, the portions for forming the first, second, and third abrasive particle layers 12iA, 121B, and 121C protrude in a ring shape, and the first protruding portion 141a, the second protruding portion 141b, and the second protruding portion are formed. Protruding portions 141c; first, second, and third abrasive particle layers 121A, 21β, and 121C are provided on each of the protruding portions 141a, Mlb, and 141c. The superabrasive particles 11 4 A 'fixed on the first abrasive particle layer 121A located at the outermost periphery are those having an average particle diameter r 1 smaller than that of the second and third abrasive particle layers ^ 2 j B and 121C. The average particle diameter r2 of the abrasive particles Π4β and 114C is θ. Moreover, the protrusion height of the first protrusion 141a is set to be larger than the second and third protrusions i41b and 141c so that the average particle size difference μ (r2> r) is greater than The super abrasive grains 4 A, 114 B, and I] 4 C of the first to third abrasive grain layers 121A, 121B, and 121C are arranged at the same height. During the polishing of the electrodeposition disk 140, due to the relationship of the polishing resistance, minute vibrations are generated in the vertical direction (in the direction of contacting and leaving the polishing pad 4). However, the outermost first abrasive grain layer 121 that maximizes the vibration amplitude The particle size of the superabrasive particles 11 4 A is smaller than that of other superabrasive particles 1 丨 4 B, that is, the influence of vibration can be reduced 'and the impact force on the polishing pad 4 can be reduced, and the problem of the roughness of the polishing surface can be improved'; You can also use the second and third abrasive grain layers 121B and 121C with super abrasive grains 114B and 114C. The larger paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 311610 (please first (Please read the notes on the back and fill in this page) ^ -------- ^ --------- ί Section 21 printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy Α7 _Β7_ V. Description of the invention (22) Particle size to improve the grinding ability and the discharge function of the grinding chips. In addition, in the above-mentioned embodiments, the abrasive grain layers 丨 2 1, 〖3〗, and 1 4 1 do not necessarily adopt a structure wound into three layers, and two or more layers may be used-in such a situation, Η To properly adjust the width of each layer, the grinding length and the grinding length on an imaginary line approximately orthogonal to the swing direction P can be set to a substantially uniform state. In addition, the abrasive grain layer 1 2],! The widths of 3 I and 4 1 do not have to be the same or simply increase or decrease. The width can also be widened on the way to narrowing, or vice versa. In short, 'As long as the sum of the grinding lengths (areas) on an imaginary line at any position substantially orthogonal to the swing direction P can be set to be substantially uniform. It is needless to say that the single-layer grinding stone of the present invention can be used in other grinding devices in addition to the regulator of the C MP device. The present invention is not limited to electrodeposited abrasive stones such as electrodeposited abrasive discs, and can also be applied to resin-bonded abrasive stones or metal-bonded abrasive stones, or abrasive stones using ordinary abrasive grains: [simple illustration of the diagram] Part 1 The figure is a top view of the first embodiment of the electrodeposition grinding disc of the present invention. Fig. 2 is a central longitudinal sectional view of the electrodeposited abrasive disc shown in Fig. 1. Fig. 3 is an enlarged view of a part of the abrasive grain layer of the electrodeposited abrasive disc shown in Fig. 2. Fig. 4 is a view of the polishing pad being scraped by an electrodeposited honing disc. Fig. 1 is a first modification example of the electrodeposited abrasive disc of the present invention. The top view 苐 e shows the abrasive particles of the iSMm f deposited abrasive disc 矸 II-_'__----I — n I-I · --1 n PI--------In TI si 1 ^ 1 Hr -------[....: T (please read the back of the page first; i will write down this page) 457 1 71 ΑΊ Β7 5. Description of the invention (η) A-A cross-sectional view. Fig. 7 is an important part of a second modification of the electrodeposition grinding disc of the present invention. Fig. 8 is a section of an important part of the third modification of the electrodeposition grinding disc of the present invention. Fig. 9 is a partial top view of the second embodiment of the electrodeposited grinding disc of the present invention.

Article]. The figure is a partial plan view of the second embodiment of the electrodeposited abrasive disc of the present invention. The figure is an electric sectional view of the present invention. D: The important part of the third embodiment of the child disc. The 12th ® is a plan view of the mounting surface of the abrasive grain layer of the electrodeposited disc of the present invention. FIG. 13 is a part 刳 view of the X-X line of the electrodeposition grinding disc shown in FIG. 12. Install -------- order -------- line (please read the connotation on the back before copying this page) Ministry of Economy The relationship diagram of the position of the abrasive grain layer in the direction of rotation of the polishing pad and the workload is shown by cutting the semi-circular part of the electrodeposition grinding disc with a one-point chain line as shown in FIG. 2. Fig. 1.5 is a plan view of an important part of a fifth embodiment of an electrodeposited abrasive disc. Fig. 16 is a partial cross-sectional view of a sixth embodiment of an electrodeposited abrasive disc. Figure 17 is a perspective view of an important part of a conventional CMP apparatus. Fig. 18 is a conventional electrodeposition grinding disc used in the CMP apparatus shown in Fig. 17. (A) is a plan view of a semicircular portion of the electrodeposition grinding disc, and (b) is (a) the Chinese paper standard (CNS) A4 applies to this paper size. Specifications (210 X 297 mm) 23 311610 A 7 _B7_ V. A-A sectional view of the electrodeposition grinding disc shown in the invention description (24). Figure 19 is an enlarged cross-sectional view of the important part of the abrasive grain layer of the electrodeposition grinding disc shown in Figure 18 = Figure 20 is a plan view of important parts of the electrodeposition grinding disc relative to the adjustment state of the polishing pad. Fig. 2 is a diagram showing the relationship between the position of the abrasive grain layer in the direction of rotation of the polishing pad and the workload in the adjustment condition of the electrodeposition grinding disc corresponding to Fig. 20. [Explanation of component symbols] M-Ministry of Intellectual Property Bureau, Industrial and Commercial Cooperatives] CMP device 2 Central axis · * > Rotary table 4 Polishing pad 5 Wafer moving head 6 Wafer 8 Polishing adjuster 9 Rotary pumping 10 Arm 11 Electrodeposited abrasive disc 12 Gold layer bottom plate 1 3 Abrasive grain layer 14 Super abrasive grain 1 5 Gold layer plating structure 20 Electrodeposited abrasive disc 21 Gold layer seat plate 2 1a Surface 2 1 b Surface 22 Abrasive particle layer 23a Seat plate recess 25 Gold layer medium Layer structure 2 super abrasive grain 27A abrasive grain recess 27B abrasive grain protrusion 3 1 abrasive grain layer 32 groove 3 7 grinding · abrasive grain layer i / a surface 4 0 electrodeposition abrasive disc 4 ί abrasive grain layer.Ϊ.- .: ¾ 1-ϊ Η: Φ s: -¾:;. # #Me \ o — ^ p 1 In I—-I-1 _ *-* t one by one on top. I—-1— urn I -i V t I Is I — -I-^ 1 * n —i 1 I (Please read the notes on the back before filling out this page) A7 457171 B7 V. Description of Invention (25) Employees ’Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs Printed 42A concave portion 42B convex portion 45 electrodeposited abrasive disc 46 abrasive particle layer 47A abrasive particle concave portion 47B abrasive particle convex portion 50 abrasive particle layer 51A abrasive particle concave portion 5 1B Abrasive grain protrusion 51C Abrasive grain protrusion 55 Electrodeposited abrasive disc 56 Abrasive grain layer 112 Gold seat plate 117 Groove 120 Disc body 120 Electrodeposited abrasive disc 121 Abrasive grain Tang 13 1 Abrasive grain layer 141 Abrasive grain layer 141 Abrasive grain layer 112a Surface 114B superabrasive grain 114C superabrasive grain 121a grinding surface 121 A grinding surface layer 12 1b grinding surface 121B grinding surface layer 121c grinding surface 121C grinding surface layer 131A first abrasive layer 131B second abrasive layer 131C third abrasive layer 141a Projection 141b Projection 141c Projection a Image line b Image line c Image line d Image line Lai Grind length La2 Grind length La3 Grind length Lbl Grind length Lb2 Grind length Lb3 Grind length M Average particle size difference rl Average particle size r2 Average Particle size ------------- * ------- Order --------- I * (Please read the precautions on the back before filling this page) This paper Standards apply to Chinese National Standard (CNS) A4 specifications (210 X 297 mm) 25 311610 V. Description of invention b S

Degree Width 3 Cw W β! Angle Reverse bt w [t [1— Order — f i t [t [(Please read the precautions on the back before filling in this page)

Claims (1)

457171 A8 BS C8 D8 2 4 Consumption Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 9. "Application scope of patents. A type of abrasive stone, which is a wide-layer package formed by combining the research cat 5¾ such as #-placed abrasive particles in a distributed organization. It is provided on the metal seat plate for polishing, and the convex and concave parts are provided on the surface of the aforementioned abrasive grain layer. 'Characteristics are as follows: The convex and concave parts on the surface of the abrasive stone as described in the patent application range] form a continuous linear pattern. . For example, the grinding stone of item i of the patent scope of the patent, 〇 »^" τ cut grinding stone Λ early-stage grinding stone, and the aforementioned abrasive grain layer is in diameter: ground into layers. You are only provided with plural numbers in the upper direction. For example, the abrasive stone in the scope of patent application No. 3 is a ring or spiral that forms multiple layers. For example, the multiple layers of the abrasive stone in the scope of the patent application are set to three or more layers. For example, the plurality of layers of the abrasive stone in the scope of the patent application No. 3 is wider than the inner layer. For example, the 'aforesaid abrasive grain layer' of the abrasive stone in the scope of the patent application No. 3 is applied to the edger. For example, the abrasive stone in the third item of the patent application range, wherein the abrasive particle layer is such that the average particle diameter of the superabrasive particles provided in the outermost layer is smaller than the average particle diameter of the superabrasive particles provided in the inner layer. For example, the abrasive stone in the scope of patent application No. 3, wherein the height of the outermost layer and the inner layer of the abrasive grain layer is set to be approximately equal to each other. At the same time, the two The distance higher than the above-mentioned inner-layer metal seat plate is set to correspond to the difference in average particle size of the superabrasive particles. Please read the f on the back of the f abrasive layer, where the aforesaid abrasive particle layer is included, and the abrasive layer layer is described by the longitudinal section. The paper dimensions on this page are applicable to China® House Standard (CNS) A4 Dange. (210x297 mm) 27 311610 AB BS C8 I) ST, patent application scope 1 0—A type of abrasive stone, which is a layer of abrasive particles formed by dispersing and disposing superabrasive particles in a single layer from a metal-bonded structure to make the abrasive particles The layer is arranged on a metal seat plate to constitute a grinding stone, which is characterized in that the grinding length of the aforementioned abrasive grain layer extends at a plurality of arbitrary positions in a direction slightly parallel to the relative moving direction of the grinding and intersects with an imaginary line at these arbitrary positions. And the department is about the same. ] I t I i 衣 i i,. ID (ϊ (Please read the precautions on the back before writing this page) The Economic and Intellectual Property Bureau-Industry and Consumer Affairs F; · ΐ :. 社: -π .. iloio