CN115229670A - Grinding piece for LED failure detection - Google Patents
Grinding piece for LED failure detection Download PDFInfo
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- CN115229670A CN115229670A CN202210574542.4A CN202210574542A CN115229670A CN 115229670 A CN115229670 A CN 115229670A CN 202210574542 A CN202210574542 A CN 202210574542A CN 115229670 A CN115229670 A CN 115229670A
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- 238000001514 detection method Methods 0.000 title claims abstract description 16
- 239000006061 abrasive grain Substances 0.000 claims abstract description 19
- 239000002245 particle Substances 0.000 claims abstract description 15
- 230000005540 biological transmission Effects 0.000 claims abstract description 14
- 238000005498 polishing Methods 0.000 claims description 22
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 230000000875 corresponding effect Effects 0.000 description 17
- 238000005520 cutting process Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- 230000033001 locomotion Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000005286 illumination Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000002285 radioactive effect Effects 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
Abstract
The invention provides a grinding piece for LED failure detection, which comprises a main body; the main body is provided with a grinding surface and an observation surface which are oppositely arranged in the vertical direction; a plurality of bulges are arranged on the grinding surface, and the bulges are in a pyramid structure or a triangular prism structure; when the bulges are in a pyramid structure, the bottom surface of each bulge is positioned above, the tip of each bulge faces downwards, grinding particles are arranged on the tip of each bulge, and the side surface of each bulge is an inclined surface; when the protrusions are in a triangular prism structure, one side surface of each protrusion is located above, the other side surfaces of each protrusion are inclined surfaces, one edge of each protrusion faces downwards, and each edge located at the lowest part is provided with abrasive grains; at least one light transmission channel which is arranged vertically exists between each inclined surface and the observation surface, and the light transmission channels are filled with refraction media. The grinding piece can be used for observing the surface of the LED chip below the grinding surface in real time when external equipment is used, and has good practicability.
Description
Technical Field
The invention relates to the field of detection equipment, in particular to a grinding piece for detecting LED failure.
Background
Failure of an LED chip is related to various factors, and in particular, some factors need to be observed after grinding the surface skin (packaging material) of the LED chip. In specific implementation, the LED chip is generally ground and then observed by using a microscope, a magnifier, or other devices.
First, lapping and observation are asynchronous, where there is an action of device switching, where the time involved for device switching is long.
Second, grinding and observation are asynchronous, as grinding is progressively progressive, the surface variations of the LED chip are unknown during this process, which is detrimental to the failure analysis of the LED chip.
Disclosure of Invention
The invention provides a grinding piece for LED failure detection, wherein a microstructure protrusion is arranged on a grinding surface of the grinding piece, grinding particles are arranged at the tip end of the protrusion, and light is guided in and output from the side surface of the grinding piece by a light-transmitting channel, so that the surface of an LED chip under the grinding surface can be observed in real time by external equipment when the grinding piece is used.
Accordingly, the present invention provides a polishing article for LED failure detection, comprising a body;
the main body is provided with a grinding surface and an observation surface which are oppositely arranged in the vertical direction;
a plurality of bulges are arranged on the grinding surface, and the bulges are in a pyramid structure or a triangular prism structure;
when the protrusions are in a pyramid structure, the bottom surface of each protrusion is located above, the tip of each protrusion faces downwards, abrasive particles are arranged on the tip of each protrusion, and the side surface of each protrusion is an inclined surface;
when the protrusions are in a triangular prism structure, one side surface of each protrusion is located above, the other side surfaces of each protrusion are inclined surfaces, one edge of each protrusion faces downwards, and each edge located at the lowest part is provided with abrasive grains;
at least one light-transmitting channel which is arranged vertically exists between each inclined surface and the observation surface, and the light-transmitting channels are filled with refraction media.
In an optional embodiment, the light-transmitting channel includes a light-entering channel, and a peripheral wall of the light-entering channel is a light-reflecting layer.
In an alternative embodiment, the light-transmitting channel includes a light-emitting channel, and a peripheral wall of the light-emitting channel is a light-absorbing layer.
In an alternative embodiment, the slope of the inclined surfaces of all the projections is the same.
An optional embodiment, further comprising a reflective baffle disposed above the body;
the surface of one side of the reflection baffle, which faces the main body, is a reflection surface, a plurality of sub-reflection surfaces are arranged on the reflection surface, and each sub-reflection surface is opposite to the corresponding light transmission channel;
the reflecting baffle is provided with a plurality of through holes, and each through hole is opposite to one corresponding light-transmitting channel.
In an alternative embodiment, the angle between the sub-reflecting surface and the horizontal plane is 45 degrees.
In an alternative embodiment, all of the sub-reflecting surfaces are oriented in the same direction.
In an alternative embodiment, when the protrusions have a triangular prism structure, the grinding member has a shape of a circular disk, and each of the lowermost ridges of the protrusions is directed toward the axis of the grinding member. .
In an alternative embodiment, when the protrusions have a triangular prism structure, all of the lowermost edges of the protrusions are parallel to each other.
In summary, the invention provides a grinding member for detecting LED failure, which utilizes a light-transmitting channel for transmitting out the reflected light of an LED chip, so that an external device can observe the surface of the LED chip, obtain the surface image of the LED chip in real time during the operation of the grinding member, and know the structure of the LED chip more accurately; the microstructure of the grinding surface of the grinding piece is redesigned according to the functions required by the grinding piece, so that the grinding function of the grinding piece is ensured, and light rays can be ensured to be transmitted out of the grinding piece; due to the non-continuous arrangement characteristic of the light-transmitting channel, the position of the light-transmitting channel is associated with the surface position of the LED chip, so that the feasibility of image reconstruction is ensured; furthermore, the light-transmitting channel is filled with the refraction material, so that the observation position of the light-transmitting channel is closer to one side of the abrasive grains, and the real-time property of observation is ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a first enlarged partial schematic view of an abrasive article according to an embodiment of the invention;
FIG. 2 is an enlarged view of a second portion of the polishing member according to the embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
FIG. 1 shows a first enlarged partial schematic view of an abrasive article according to an embodiment of the invention.
The invention provides a grinding piece for LED failure detection, which is designed for external equipment to observe the surface of an LED chip under a grinding surface in real time when the grinding piece is used.
FIG. 1 shows a schematic cross-sectional view of an abrasive article for LED failure detection according to an embodiment of the invention. Specifically, the embodiment of the invention provides a grinding piece for detecting LED failure.
In the embodiment of the invention, in order to solve the defect that the LED chip cannot be observed in real time during grinding, the structure of the grinding piece is improved, so that the LED chip under the grinding piece can be observed when the grinding piece works.
Specifically, the grinding member includes a main body, and for convenience of description, the following description of the orientation will be described with reference to the posture of the main body in fig. 1.
Specifically, the main part has the abrasive surface and the observation face 2 that just right set up in vertical direction, and wherein, the abrasive surface is located the below, and observation face 2 is located the top, and specifically, the abrasive surface is participating in the effect face to the LED chip grinding, and observation face 2 is then a surface just right with the abrasive surface.
Specifically, in the embodiment of the present invention, a plurality of protrusions are disposed on the grinding surface.
There are two embodiments regarding the structure of the protrusions, which are pyramid structures or triangular prism structures.
When the protrusions are in a pyramid structure, the bottom surface of each protrusion is located above, the tip of each protrusion faces downwards, abrasive grains 4 are arranged on the tip of each protrusion, and the side surface of each protrusion is an inclined surface 5.
In particular, geometrically, a pyramid is also called a pyramid, and is a three-dimensional polyhedron formed by sequentially connecting straight line segments from each vertex of a polygon to a point outside a plane where the polygon is located. The polygons are referred to as the base of the pyramids. The reference names of the pyramids are different depending on the shape of the base, and depend on the polygon shape of the base, for example, a pyramid having a square base is called a square pyramid, a pyramid having a triangular base is called a triangular pyramid, a pyramid having a pentagonal base is called a pentagonal pyramid, and so on. In the embodiment of the present invention, when the protrusion is a pyramid structure, the bottom surface of the protrusion is located above (i.e. on one side of the main body), i.e. the top angle of the pyramid is facing downward, and each side surface is an inclined surface 5 compared to the horizontal plane. Abrasive grains 4 are provided on the apex corners of the protrusions, and specifically, the abrasive grains 4 may be embedded in the apex corners of the protrusions. It should be noted that, when the abrasive grains 4 are disposed at the apex of the projection, the apex of the projection is deformed and is no longer in a regular pyramid structure.
Specifically, when the protrusions are triangular prism structures, one side surface of each protrusion is located above, the rest side surfaces of each protrusion are inclined surfaces 5, one edge of each protrusion faces downward, and each edge located at the lowest position is provided with abrasive grains 4.
Specifically, in geometry, a triangular prism is a cylinder with a triangular bottom surface and a quadrangular side surface. In the embodiment of the present invention, when the protrusions have a triangular prism structure, one side surface of each protrusion is located above (toward one side of the body), and the remaining side surfaces of each protrusion are inclined with respect to a horizontal plane, and accordingly, one edge of each protrusion is located below (at the lowermost end of the protrusion) due to the characteristics of the triangular prism structure, and the abrasive grains 4 are disposed on the lowermost edge of the protrusion. Similarly, after the abrasive grains 4 are provided on the edges, the shape of the protrusions is no longer a regular prismatic structure.
Specifically, the design idea of the two convex embodiments is that the grinding member needs a component (grinding particles 4) for grinding, the grinding of the LED chip by the grinding particles 4 mainly depends on the movement of the grinding member, and the movement of the grinding member causes a plurality of grinding particles 4 moving at high speed to contact with the surface of the LED chip and generate cutting; the cutting of the LED chip by the polishing member is substantially micro-cutting (small amount of cutting) of the surface material of the LED chip at a high frequency by the plurality of abrasive grains 4.
Therefore, the polishing effect of the polishing member is mainly related to the number of the polishing particles 4 which make cutting contact with the LED chip per unit time, and correspondingly, the number of the polishing particles 4 which make cutting contact with the LED chip per unit time is related to the arrangement density of the polishing particles 4 on the polishing member and the working speed of the polishing member during the polishing operation. Therefore, theoretically, by increasing the operating speed of the polishing material during the polishing operation, the shortage of the small installation density of the polishing particles 4 on the polishing material can be compensated.
Based on this theory, since the polishing of the LED chip for the polishing inspection is not a processing means for production purposes, but a processing method for observation purposes for accurately sensing the cross-sectional state of the LED chip, it is not necessary to pursue high efficiency of polishing and durability of consumables in the actual inspection, and accordingly, in the embodiment of the present invention, a new design requirement is made for the microstructure of the polished surface, and based on this, the arrangement position of the abrasive grains 4 is not randomly arranged as in the conventional polishing member, but is purposefully arranged at a specific position of the bump, and the rest of the bump has another purpose.
Specifically, when the protrusions have a pyramid structure or a triangular prism structure, they each have an inclined surface 5, and the inclined surface 5 is basically characterized as being a plane and having an inclination angle with respect to a horizontal plane. Specifically, at least one light-transmitting channel 1 is vertically arranged between each inclined surface 5 and the observation surface 2, and the light-transmitting channel 1 is filled with a refraction medium. Specifically, the light transmission channel 1 is a straight channel between the observation surface 2 and the inclined surface 5 for light to pass through, and is filled with a refractive medium.
The light-transmitting channel 1 basically functions to transmit the reflected light on the surface of the LED chip to the outside of the observation surface 2 through the light-transmitting channel 1 and allow the outside to observe.
In practical implementation, in order to ensure the integrity of observation, the arrangement density of the light-transmitting channels 1 is high, and if the light-transmitting channels 1 are of a hollow structure, the overall strength of the main body is low, and the requirements of grinding and cutting of a grinding piece cannot be met, so in the embodiment of the invention, the light-transmitting channels 1 are filled with the refraction medium.
Specifically, in the embodiment of the present invention, one of the refraction media functions to reinforce the overall strength of the main body, so as to ensure the feasibility of the grinding implementation; the other function is that, referring to the structure shown in fig. 1, on the inclined surface 5, due to the existence of the refraction medium, the light that can pass through the light transmission channel 1 is not the light that the light transmission channel 1 is facing the position, but the light that is close to the area near the abrasive grains 4, that is, the area that is closer to the area near the abrasive grains 4 can be observed through the light transmission channel 1, the abrasive grains 4 participate in the actual grinding and cutting, the closer the observation area is to the position of the abrasive grains 4, correspondingly, the more accurate the image of the ground and cut area of the LED chip can be not captured, which is more beneficial to observing the structure of the LED chip.
In the concrete implementation, the grinding piece is in operation, and the grinding surface is towards the below, and the grinding piece moves in the horizontal direction, and the abrasive grain 4 on the grinding surface grinds the cutting to LED chip surface, and in the motion process of grinding piece, the image (light) on LED chip surface can see through to viewing surface 2 one side through printing opacity passageway 1 to make and can observe the surface image of LED chip in the direction of pipe friction face one side.
Specifically, when the grinding member works, because the grinding member is almost attached to the top of the LED chip, correspondingly, the top surface of the LED chip lacks illumination light, which results in insufficient reflection light on the top surface of the LED chip, and the intensity of the reflection light is insufficient to allow the emission light to be observed for the outside after passing through the light transmission channel 1, therefore, in an optional embodiment, the light transmission channel 1 includes a light inlet channel, and the peripheral wall of the light inlet channel is a light reflecting layer. Specifically, at least part of the light-transmitting channel 1 is a light inlet channel, and illumination light can reach the grinding surface side from the observation surface 2 side through the light inlet channel, so that the LED chip in grinding is illuminated.
Further, since only light rays at a specific angle can reach the observation surface 2 side through the light-transmitting channel 1 from the side of the grinding surface, if the top surface of the LED chip is regarded as a mirror surface, only the LED chip is irradiated from the specific angle so that the light rays reflected by the LED chip can reach the observation surface 2 side through the light-transmitting channel 1; in order to ensure that the reflected light can reach one side of the observation surface 2 through the light-transmitting channel 1 due to the fact that the light is reflected in a more complex manner in the transmission process, in the embodiment of the invention, on the inclined surface 5, except for the area corresponding to the light-transmitting channel 1, the light needs to be transmitted and kept as a plane, and other positions of the inclined surface 5 can be provided with diffuse reflection structures; specifically, the diffuse reflection structure is mainly realized by protrusions with irregular microstructures. When the grinding piece works, light rays are reflected after being irradiated on the surface of the LED chip through the light inlet channel, part of the emitted light rays are irradiated on the diffuse reflection structure, and are reflected on the surface of the LED chip again through the diffuse reflection structure, in the process, the light rays are changed into multi-direction light through the directional light, and therefore the light rays reflected again by the LED chip can enter the light transmission channel 1 from a specific angle and reach one side of the observation surface 2 through the light transmission channel 1 with high probability. Specifically, the light inlet channel has no specific requirements on the directivity and the directivity of incident light, so that a reflecting layer can be arranged on the peripheral wall of the light inlet channel, and after the light enters the light inlet channel, most of light can be guided out from the inclined surface 5 through continuous reflection of the reflecting layer, so that the irradiation intensity on the surface of the LED chip is ensured.
Correspondingly, the light-transmitting channel 1 comprises a light-emitting channel, and the peripheral wall of the light-emitting channel is a light-absorbing layer. Specifically, the light-emitting channel plays a role of positioning besides the role of a light-conducting channel. Wherein, the effect of location means, each light-emitting channel only allows the light that reflects through specific angle to get into and derive from observation face 2 on the specific position, the position on the LED chip that the light that derives from observation face 2 corresponds is definite, therefore, in order to play effectual screening effect, the light-emitting channel only allows the light parallel with the light-emitting channel axis to pass through, in order to avoid the interference of other light, be provided with the light-absorbing layer on the perisporium of light-emitting channel, the effect on light-absorbing layer is the light that absorbs and light-emitting channel axis is not parallel, guarantee that the light on the non-corresponding position can not pass through the light-emitting channel, avoid disturbing the observation on the observation face 2.
Further, in order to improve the regularity of observation, in an optional embodiment, the slope rates of all the convex inclined surfaces 5 are the same, and correspondingly, the calculation of the corresponding relationship between the light rays LED out from the observation surface 2 by the light transmission channel 1 and the position of the LED chip is more regular, and the reconstruction of the surface image of the LED chip by using the light rays is simpler.
Specifically, when printing opacity passageway 1 exists, generally need external illumination to pass through printing opacity passageway 1 and lead-in light between LED chip and the abrasive disc, then the reflection light on chip surface is derived again through printing opacity passageway 1 and is supplied 2 one sides of observation face to observe.
FIG. 2 is an enlarged view of a second portion of the polishing member according to the embodiment of the present invention.
Specifically, because the light speed is very fast and the propagation distance of the light is short in the implementation of the embodiment of the present invention, it is difficult to switch the light source and the light receiver simultaneously above the observation surface 2 in a switching manner, and it is also difficult to simultaneously arrange the light source and the light receiver above the observation surface 2 due to the positional interference. Therefore, in the implementation of the present invention, it is generally required to ensure the provision of the light source and the operation of the optical receiver simultaneously, and in order to implement this operation mode, in an optional implementation manner, the reflector in the embodiment of the present invention further includes a reflective baffle 6, where the reflective baffle 6 is disposed above the main body; the surface of one side, facing the main body, of the reflecting baffle 6 is a reflecting surface 3, a plurality of sub-reflecting surfaces 7 are arranged on the reflecting surface 3, and each sub-reflecting surface 7 is opposite to one corresponding light-transmitting channel 1; a plurality of through holes 8 are formed in the reflecting baffle 6, and each through hole 8 is opposite to the corresponding light-transmitting channel 1.
Specifically, according to the foregoing description, the light-transmitting channel 1 can be divided into two types of light-transmitting channels 1, namely, a light-entering channel and a light-exiting channel, specifically, the reflective baffle 6 is disposed above the main body, the direction of the light rays penetrating from the observation surface 2 in the light-transmitting channel 1 is always vertical and upward, the reflective baffle 6 basically functions to reflect the light rays penetrating from the observation surface 2 side of the light-transmitting channel 1 to a non-vertical direction, and the space above the main body is used for installing the light source. From the interference of position consideration, the light source can not be installed between reflecting baffle 6 and the main part, otherwise can block the outgoing of the light in printing opacity passageway 1, and correspondingly, the light source can only be installed in reflecting baffle 6's top, and is corresponding, because it has position difference with the light-emitting passageway to advance the light passageway, relatively, can set up through-hole 8 on reflecting baffle 6 and the position that advances the light passageway and pass through for the light that the light source sent.
And the reflecting baffle 6 is provided with a sub-reflecting surface 7 at the position corresponding to the light-emitting channel, the sub-reflecting surface 7 reflects the light to the corresponding position (non-vertically above) for the corresponding light-emitting channel, specifically, due to the dislocation of the light-emitting channel and the light-entering channel, the through hole 8 and the sub-reflecting surface 7 are also dislocated, and no position interference is generated between the two, in specific operation, the light emitted by the light source above the reflecting baffle 6 enters the light-entering channel of the main body through the through hole 8, the reflected light on the surface of the LED chip is LED out from the side of the observation surface 2 after passing through the corresponding light-emitting channel and is reflected to the light receiver in the non-vertical direction through the sub-reflecting surface 7 corresponding to the light-emitting channel, and the arrangement positions of the light receiver and the light source do not generate interference, which ensures the feasibility of the embodiment of the invention in practice.
Further, in an alternative embodiment, the included angle between the sub-reflecting surface 7 and the horizontal plane is 45 degrees. Correspondingly, the light receiver may be arranged on the horizontal side of the reflective baffle 6.
In an alternative embodiment, all of said sub-reflecting surfaces 7 are oriented identically, i.e. all sub-reflecting surfaces 7 are oriented on the same side of the reflective baffle 6. It should be noted that, in the specific implementation, since the number of the light-emitting channels of the embodiment of the present invention is generally large, if all the light rays are reflected from the same direction at the same horizontal height, on one hand, a situation that part of the sub-reflecting surfaces 7 block the rest of the light rays may occur, and on the other hand, the optical receiver may not perform accurate position positioning on the received light rays.
Therefore, in practice, when the orientations of the sub-reflecting surfaces 7 are the same, the height of the sub-reflecting surfaces 7 needs to be designed. Specifically, for the sake of description accuracy, the description direction is determined based on the relative positional relationship between the light receiver and the reflective baffle 6.
Specifically, a spatial coordinate system is constructed on the basis of the position of the reflecting baffle 6 as an origin, the direction in which the emitting baffle points to the optical receiver as a first direction forward direction (x-axis forward direction), a plane passing through the x-axis and parallel to the observation surface 2 of the main body as an xy plane, the y-axis being perpendicular to the x-axis, and the z-axis being perpendicular to the xy plane.
Specifically, each light-transmitting channel 1 has a fixed x coordinate and a fixed y coordinate, the x coordinate and the y coordinate of the light-transmitting channel 1 are the same as those of the corresponding sub-reflecting surface 7, and the z coordinate of the sub-reflecting surface 7 is determined in the following manner:
in a plurality of sub-reflecting surfaces 7 with the same x coordinate, the smaller the z coordinate; in the y direction, since the light reflected by the sub-reflecting surfaces 7 does not propagate along the y direction, the arrangement of the sub-reflecting surfaces 7 in the y direction does not interfere with each other. In practical implementation, all the sub-reflecting surfaces 7 are arranged in an inclined state, correspondingly, each path of reflected light has an independent channel, the light receiver can know the light-transmitting channel 1 corresponding to the light according to the position of the light, and further know the surface position of the LED chip corresponding to the light, and the light receiver receives all the light and uses an upper computer to perform re-arrangement and reconstruction on the light so as to form a complete and clear pattern (which is not a scattered light path); specifically, the image areas in the image formed by all the light rays obtained at the same time are discrete; but since the abrasive article is moving, a complete image of the LED chip surface can be formed by the superposition of the images.
In an alternative embodiment, when the protrusions have a triangular prism structure, the grinding member has a shape of a circular disk, and each of the lowermost ridges of the protrusions is directed toward the axis of the grinding member. In particular, in the case of an embodiment in which the protrusions are triangular prisms, since the grinding particles 4 are only arranged on the lowermost edge, the distribution of the protrusions on the grinding member is correlated with the direction of movement of the grinding member in order to ensure that the grinding coverage is sufficiently large (sufficient to cover the top surface of the LED chip). Specifically, the grinding member is in a disc structure, when the grinding member moves in a rotating manner during working, the edge of each protrusion located at the lowest part points to the axis of the grinding member, the grinding particles 4 are arranged in a straight line along the corresponding edge, and for the grinding member, the grinding particles 4 are arranged in a structure with a plurality of radioactive rays. When the grinding piece rotates, the grinding particles 4 on the multiple edges grind the LED chip in sequence.
In addition, in the case of implementing the translational oscillation motion of the grinding member, in an alternative embodiment, when the protrusions have a triangular prism structure, all the edges of the protrusions located at the lowermost position are parallel to each other.
In summary, the embodiment of the invention provides a grinding member for detecting LED failure, which utilizes a light-transmitting channel 1 to transmit out the reflected light of an LED chip, so that an external device can observe the surface of the LED chip, obtain the surface image of the LED chip in real time during the operation of the grinding member, and know the structure of the LED chip more accurately; the microstructure of the grinding surface of the grinding part is redesigned according to the functions required by the grinding part, so that the grinding function of the grinding part is ensured, and light rays can be ensured to be transmitted out of the grinding part; due to the non-continuous arrangement characteristic of the light-transmitting channel 1, the position of the light-transmitting channel 1 is associated with the surface position of the LED chip, so that the feasibility of image reconstruction is ensured; furthermore, the light-transmitting channel 1 is filled with a refraction material, so that the observation position of the light-transmitting channel 1 is closer to one side of the abrasive grains 4, and the real-time property of observation is ensured.
While the embodiments of the present invention have been described in detail, the principles and embodiments of the present invention have been illustrated by the specific examples provided herein, which are intended to help understand the methods and concepts of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (9)
1. An abrasive article for LED failure detection comprising a body;
the main body is provided with a grinding surface and an observation surface which are oppositely arranged in the vertical direction;
a plurality of bulges are arranged on the grinding surface, and the bulges are in a pyramid structure or a triangular prism structure;
when the protrusions are in a pyramid structure, the bottom surface of each protrusion is located above, the tip of each protrusion faces downwards, abrasive particles are arranged on the tip of each protrusion, and the side surface of each protrusion is an inclined surface;
when the protrusions are in a triangular prism structure, one side surface of each protrusion is located above, the other side surfaces of each protrusion are inclined surfaces, one edge of each protrusion faces downwards, and each edge located at the lowest part is provided with abrasive grains;
at least one light-transmitting channel which is arranged vertically exists between each inclined surface and the observation surface, and the light-transmitting channels are filled with refraction media.
2. The polishing article of claim 1, wherein the light-transmissive channel comprises a light-entry channel, and wherein a peripheral wall of the light-entry channel is a light-reflective layer.
3. The polishing article for LED failure detection of claim 2, wherein the light-transmissive channel comprises a light-exit channel, a peripheral wall of the light-exit channel being a light-absorbing layer.
4. The abrasive article for LED failure detection according to claim 1, wherein the slope rate of the inclined faces of all the protrusions is the same.
5. The abrasive article for LED failure detection of claim 1, further comprising a reflective baffle disposed above the body;
the surface of one side, facing the main body, of the reflection baffle is a reflection surface, a plurality of sub-reflection surfaces are arranged on the reflection surface, and each sub-reflection surface is opposite to one corresponding light transmission channel;
the reflecting baffle is provided with a plurality of through holes, and each through hole is opposite to the corresponding light-transmitting channel.
6. The abrasive article for LED failure detection according to claim 5, wherein the angle between the sub-reflective surface and the horizontal plane is 45 degrees.
7. The abrasive article for LED failure detection according to claim 5, wherein all of said sub-reflective surfaces are oriented the same.
8. The abrading article for LED failure detection according to claim 1, wherein when the protrusions have a triangular prism configuration, the abrading article is shaped as a disk configuration, with each of the lowermost edges of the protrusions pointing toward the axis of the abrading article.
9. The abrasive article for LED failure detection of claim 8, wherein when said protrusions have a triangular prism configuration, all of the lowermost edges of said protrusions are parallel to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210574542.4A CN115229670A (en) | 2022-05-25 | 2022-05-25 | Grinding piece for LED failure detection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210574542.4A CN115229670A (en) | 2022-05-25 | 2022-05-25 | Grinding piece for LED failure detection |
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| JPH1177517A (en) * | 1997-09-02 | 1999-03-23 | Nikon Corp | Polishing member and polishing device |
| JP2000326233A (en) * | 1999-05-20 | 2000-11-28 | Tsuboman:Kk | Diamond polisher, its manufacture and die |
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| US6533641B1 (en) * | 2000-09-21 | 2003-03-18 | Advanced Micro Devices, Inc. | Grinding arrangement and method for real-time viewing of samples during cross-sectioning |
| CN1608801A (en) * | 2003-10-22 | 2005-04-27 | 智胜科技股份有限公司 | Polishing pad having grooved window therein and method of forming the same |
| JP2010052072A (en) * | 2008-08-27 | 2010-03-11 | Fujikoshi Mach Corp | Method and apparatus for observing pad surface state |
| CN202264139U (en) * | 2011-01-25 | 2012-06-06 | 希力康科技股份有限公司 | Grinding tool |
| WO2014070172A1 (en) * | 2012-10-31 | 2014-05-08 | Duescher Wayne O | Abrasive platen wafer surface optical monitoring system |
| CN104918751A (en) * | 2012-08-02 | 2015-09-16 | 3M创新有限公司 | Abrasive element precursor with precisely shaped features and method of making thereof |
| CN107984374A (en) * | 2017-11-30 | 2018-05-04 | 上海华力微电子有限公司 | A kind of detecting real-time device and its method for detecting for chemically-mechanicapolish polishing grinding rate |
| CN208705518U (en) * | 2018-05-24 | 2019-04-05 | 深圳鑫振华光电科技有限公司 | A kind of optical chip group and optical chip group quality of finish check device |
| CN213319566U (en) * | 2020-09-26 | 2021-06-01 | 绍兴自远磨具有限公司 | Novel plane grinding sheet |
| US20210402556A1 (en) * | 2020-06-24 | 2021-12-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Cmp polishing pad with uniform window |
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2022
- 2022-05-25 CN CN202210574542.4A patent/CN115229670A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH1177517A (en) * | 1997-09-02 | 1999-03-23 | Nikon Corp | Polishing member and polishing device |
| TW457171B (en) * | 1999-01-08 | 2001-10-01 | Mitsubishi Materials Corp | Abrasive tool |
| JP2000326233A (en) * | 1999-05-20 | 2000-11-28 | Tsuboman:Kk | Diamond polisher, its manufacture and die |
| US6533641B1 (en) * | 2000-09-21 | 2003-03-18 | Advanced Micro Devices, Inc. | Grinding arrangement and method for real-time viewing of samples during cross-sectioning |
| CN1608801A (en) * | 2003-10-22 | 2005-04-27 | 智胜科技股份有限公司 | Polishing pad having grooved window therein and method of forming the same |
| JP2010052072A (en) * | 2008-08-27 | 2010-03-11 | Fujikoshi Mach Corp | Method and apparatus for observing pad surface state |
| CN202264139U (en) * | 2011-01-25 | 2012-06-06 | 希力康科技股份有限公司 | Grinding tool |
| CN104918751A (en) * | 2012-08-02 | 2015-09-16 | 3M创新有限公司 | Abrasive element precursor with precisely shaped features and method of making thereof |
| WO2014070172A1 (en) * | 2012-10-31 | 2014-05-08 | Duescher Wayne O | Abrasive platen wafer surface optical monitoring system |
| CN107984374A (en) * | 2017-11-30 | 2018-05-04 | 上海华力微电子有限公司 | A kind of detecting real-time device and its method for detecting for chemically-mechanicapolish polishing grinding rate |
| CN208705518U (en) * | 2018-05-24 | 2019-04-05 | 深圳鑫振华光电科技有限公司 | A kind of optical chip group and optical chip group quality of finish check device |
| US20210402556A1 (en) * | 2020-06-24 | 2021-12-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Cmp polishing pad with uniform window |
| CN213319566U (en) * | 2020-09-26 | 2021-06-01 | 绍兴自远磨具有限公司 | Novel plane grinding sheet |
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