CN209520437U - Ceramic substrate cutting blade - Google Patents
Ceramic substrate cutting blade Download PDFInfo
- Publication number
- CN209520437U CN209520437U CN201822261815.1U CN201822261815U CN209520437U CN 209520437 U CN209520437 U CN 209520437U CN 201822261815 U CN201822261815 U CN 201822261815U CN 209520437 U CN209520437 U CN 209520437U
- Authority
- CN
- China
- Prior art keywords
- slot
- blade
- ceramic substrate
- via hole
- blade body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The utility model relates to ceramic substrate cutting blades, including blade body, are equipped with centre bore and via hole, and slot is equipped on excircle, and the depth of slot is 3mm, and width 1mm, the aperture of via hole is 1mm；Slot is evenly distributed on the excircle of blade body, slot runs through blade body, and the edge of slot is overlapped with blade body outer circumferential edges, and via hole is between adjacent slot, the center of circle of all via holes is located on same circumference, and the length of the circle center distance blade body excircle of via hole is 3mm.Ability is cut using the drainage that fluting greatly improves ceramic substrate cutting blade with aperture, while keeping blade strength, efficiently solves flash and On Blackening caused by existing Ni-based blade ceramic cutting substrate.
Description
Technical field
The utility model belongs to grinding wheel structure technology, and in particular to ceramic substrate cutting blade.
Background technique
Ceramic substrate refer to copper foil be bonded directly at high temperature aluminium oxide or aluminium nitride ceramic substrate surface (single side or
It is two-sided) on special process plate.Made ultra-thin composite substrate has good electrical insulation performance, and high thermal conductivity characteristic is excellent
Solderability and high adhesive strength, and various figures can be etched as pcb board, there is very big current-carrying capability.Cause
This, ceramic substrate has become the basic material of high-power electric and electronic circuit structure technology and interconnection technique.Ceramic basic need
There is sufficiently high mechanical strength, in addition to carrying element, can also be used as support member, require in addition that ceramic substrate processability
Good, dimensional accuracy is high, and surface is smooth, no warpage, bending, micro-crack etc..The Ni-based blade of electroforming is because of its bonding agent characteristic, same
Under equal processing conditions, it is 2-3 times of steel edge in service life, is 6-10 times of resin knife, because it is with the permanent service life, because
This electroformed nickel base diamond saw blade has extensive purposes in the processing of ceramic cutting substrate.The draining of the Ni-based saw blade of electroforming
Row, which cuts, has important influence to the dimensional accuracy and surface smoothness of ceramic substrate.Conventional blade in cutting process due to
Row cuts difficulty, results in blockage, and as a result cooling water can not work in time, causes to cut flash increase, can not arrange to cut in time causes
Fever causes to burn nigrescence phenomenon when colloid is cut.
Summary of the invention
The utility model discloses ceramic substrate cutting blades, have new structure feature, utilize fluting and aperture pole
The drainage for improving ceramic substrate cutting blade greatly cuts ability, while keeping blade strength, efficiently solves existing Ni-based
Flash and On Blackening caused by blade ceramic cutting substrate.
The utility model adopts the following technical solution:
Ceramic substrate cutting blade, including blade body；The blade body is equipped with centre bore；The blade body
Excircle is equipped with slot；The depth of the slot is 3mm.
In above-mentioned technical proposal, the aperture of the centre bore is 40mm, and the diameter of blade body is 68mm, with a thickness of routine
Parameter.
In above-mentioned technical proposal, the slot is 16, it is preferred that 16 slots are evenly distributed on the outer circle of blade body
Zhou Shang.
In above-mentioned technical proposal, the width of the slot is 1mm, it is preferred that the slot runs through blade body, the utility model
It slots on the excircle of blade body, different from pore structure, the edge of slot is overlapped with blade body outer circumferential edges.
In above-mentioned technical proposal, the blade body is equipped with via hole, it is preferred that and the aperture of the via hole is 1mm, into
One step is preferred, and the via hole more has choosing between adjacent slot, and the via hole is 32, most preferably, adjacent slot
Between be equipped with 2 via holes.
In above-mentioned technical proposal, the center of circle of via hole is located on same circumference, it is further preferred that the distance of center circle of via hole
Length from blade body excircle is 3mm.
In the utility model, the slotted planform of institute all, porose planform all, the utility model
The improvement row of offer cuts the fluting open-celled structure of drainage performance, first carries out conventional method to blade body with wire cutting and opens centre bore
Conventional method fluting is carried out with excircle, then uses laser to open circular hole as via hole, solves conventional blade in cutting process
Middle row cuts the problem of difficult, cooling water can not work in time, when being used for ceramic cutting substrate, flash is avoided to increase, colloid is burnt
Burnt nigrescence phenomenon, especially incorporating parametric limit, and for obtained blade while draining chip removal is excellent, intensity is fine.
Detailed description of the invention
Fig. 1 is ceramic substrate cutting blade structural schematic diagram, and wherein A is non-mark figure, and B is mark figure；
Fig. 2 is the ceramic substrate sectional drawing of ceramic substrate cutting blade cutting；
Fig. 3 is the ceramic substrate sectional drawing of one blade of comparative example cutting；
Fig. 4 is the ceramic substrate sectional drawing of two blade of comparative example cutting；
Fig. 5 is the ceramic substrate sectional drawing of three blade of comparative example cutting；
Wherein, blade body 1, centre bore 2, via hole 3, slot 4.
Specific embodiment
Embodiment one
Referring to attached drawing 1, ceramic substrate cutting blade includes blade body 1, is equipped with centre bore 2 and 32 via hole 3,
Each via hole is the same, and attached drawing marks one, and 16 slots 4 are equipped on excircle, and each slot is the same, attached drawing mark one
It is a；The diameter of blade body is 68mm, and the aperture of centre bore is 40mm, and the depth of slot is 3mm, width 1mm, the hole of via hole
Diameter is 1mm；16 slots are evenly distributed on the excircle of blade body, and slot runs through blade body, the edge and blade body of slot
Outer circumferential edges are overlapped, and via hole is equipped with 2 via holes, the center of circle of all via holes between adjacent slot between adjacent slot
On same circumference, the length of the circle center distance blade body excircle of via hole is 3mm；A is non-mark figure in Fig. 1, and B is
Mark figure, mark are desired to make money or profit in it will be appreciated by those skilled in the art that dotted line indicates the via hole center of circle on same circle；The slotted structure of institute
Shape all, the porose planform of institute all, first with wire cutting to blade body carry out conventional method open centre bore with
Excircle carries out conventional method fluting, then uses laser to open circular hole as via hole, solves conventional blade in cutting process
Row cuts the problem of difficult, cooling water can not work in time.If groove width becomes 1.5mm, blade highest feed velocity is
Otherwise chipping occurs for 1.1mm/s, and width becomes smaller or quantity tails off, and reduces chip removal effect；If via hole aperture becomes
1.5mm, then blade highest feed velocity is 1.3mm/s, chipping otherwise occurs, aperture becomes smaller or quantity tails off, and reduces chip removal
Effect；Edge strength, highest feed speed are reduced if the length of the circle center distance blade body excircle of via hole is 2 mm
Degree is 1.1mm/s, reduces chip removal effect if the length of the circle center distance blade body excircle of via hole is 4mm, cuts
Burr is big, more than 18 microns；The slot of the utility model is not contacted with via hole, if slot and Kong Liantong, cutting burr is 26
Micron, 1.1 mm/s of highest feed velocity.
Comparative example one
Compared with embodiment one, via hole is not opened up, as other, specifically: cutting blade includes blade body, is set
There is centre bore, and be equipped with 16 slots on excircle, each slot is the same；The diameter of blade body is 68mm, the hole of centre bore
Diameter is 40mm, and the depth of slot is 3mm, width 1mm；16 slots are evenly distributed on the excircle of blade body, and slot runs through knife
The edge of piece ontology, slot is overlapped with blade body outer circumferential edges.
Comparative example two
Compared with embodiment one, slot is not opened up, as other, specifically: cutting blade includes blade body, is equipped with
Heart hole and 32 via holes, each via hole is the same, and attached drawing marks one；The diameter of blade body is 68mm, centre bore
Aperture is 40mm, and the center of circle of all via holes is uniformly distributed on same circumference, the circle center distance blade body outer circle of via hole
The length in week is 3mm.
Comparative example three
Compared with embodiment one, slot and via hole are not opened up, as other, specifically: cutting blade includes blade body,
It is equipped with centre bore, and the diameter of blade body is 68mm, and the aperture of centre bore is 40mm.
Insert is used for ceramic cutting substrate, after 50 meters of cutting, since draining is imitated when the blade of embodiment one is cut
Fruit is good, and cutting section does not black, and without burr (less than 10 microns), sees attached drawing 2, and the blade cutting effect of comparative example one is slightly worse,
Cutting section slightly blacks, and the right side is jagged to dig (30 microns), sees attached drawing 3, and the blade cutting effect of comparative example two is worse, cutting
Section blacks, and burr digs more (50 microns), sees attached drawing 4, and the blade cutting effect of comparative example three is worst, and cutting section blacks tight
Weight, burr dig serious (80 microns), see attached drawing 5；Respectively cut 10 meters, 20 meters, 42 meters when comparative example three blade,
The blade of comparative example two, comparative example once blade generate cutting burr.In cutting, the blade of embodiment one, comparative example one
Blade, the blade of comparative example two, the blade feed velocity highest of comparative example three be respectively 1.5mm/s, 1.2mm/s, 0.7mm/
S, 0.3mm/s also will appear chipping more than will appear the phenomenon that burning out substrate colloid layer；The blade of embodiment one, comparative example one
Blade, the blade of comparative example two, comparative example three blade cutting life up to 500 meters, 480 meters, 480 meters, 470 meters, work as hair
When raw cutting burr, modifying can continue to cut, until blade can not cut calculation cutting life.
The utility model outer circle fluting has the effect of that certain cutting force and drainage are cut, but if slotting too wide, knife
Piece rigidly declines, and blade breakage is be easy to cause during high-speed cutting, is broken, and the utility model is limited by structure and parameter
It is fixed, the effect that drainage is cut not only was increased, but also will not rigidly affect greatly to blade, and had efficiently solved existing Ni-based blade
Flash caused by ceramic cutting substrate and On Blackening, and blade makes abrasive grain de- by being easy when may wear to suitable
It falls, so that new abrasive grain is exposed, continues to cut, to improve the cutting force of cutting blade, can be improved cutting
Speed.
Claims (10)
1. ceramic substrate cutting blade, which is characterized in that the ceramic substrate cutting blade includes blade body；The knife
Piece ontology is equipped with centre bore；The excircle of the blade body is equipped with slot；The depth of the slot is 3mm；The blade body
Equipped with via hole.
2. ceramic substrate cutting blade according to claim 1, which is characterized in that the aperture of the centre bore is 40mm；
The diameter of blade body is 68mm.
3. ceramic substrate cutting blade according to claim 1, which is characterized in that the slot is 16；The via hole
It is 32.
4. ceramic substrate cutting blade according to claim 3, which is characterized in that 16 slots are evenly distributed on blade
On the excircle of ontology.
5. ceramic substrate cutting blade according to claim 1, which is characterized in that the width of the slot is 1mm.
6. ceramic substrate cutting blade according to claim 1, which is characterized in that the slot runs through blade body.
7. ceramic substrate cutting blade according to claim 1, which is characterized in that the aperture of the via hole is 1mm.
8. ceramic substrate cutting blade according to claim 1, which is characterized in that the via hole be located at adjacent slot it
Between.
9. ceramic substrate cutting blade according to claim 8, which is characterized in that be equipped with 2 via holes between adjacent slot.
10. ceramic substrate cutting blade according to claim 1, which is characterized in that the center of circle of via hole is located at same circle
Zhou Shang；The length of the circle center distance blade body excircle of via hole is 3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822261815.1U CN209520437U (en) | 2018-12-30 | 2018-12-30 | Ceramic substrate cutting blade |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822261815.1U CN209520437U (en) | 2018-12-30 | 2018-12-30 | Ceramic substrate cutting blade |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209520437U true CN209520437U (en) | 2019-10-22 |
Family
ID=68228666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822261815.1U Active CN209520437U (en) | 2018-12-30 | 2018-12-30 | Ceramic substrate cutting blade |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209520437U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111451952A (en) * | 2020-06-15 | 2020-07-28 | 郑州磨料磨具磨削研究所有限公司 | Manufacturing method of electroplating grinding wheel with micro-size cold water tank |
-
2018
- 2018-12-30 CN CN201822261815.1U patent/CN209520437U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111451952A (en) * | 2020-06-15 | 2020-07-28 | 郑州磨料磨具磨削研究所有限公司 | Manufacturing method of electroplating grinding wheel with micro-size cold water tank |
| CN111451952B (en) * | 2020-06-15 | 2021-11-05 | 郑州磨料磨具磨削研究所有限公司 | Manufacturing method of electroplating grinding wheel with micro-size cold water tank |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106384750B (en) | A kind of solar energy is sliced battery | |
| CN209520437U (en) | Ceramic substrate cutting blade | |
| CN208825729U (en) | A kind of Unequal distance ripple saw blade | |
| CN207630298U (en) | A kind of ultra high efficiency multi-wire saw diamond wire | |
| CN108381411A (en) | A kind of the plating ultra-thin cutting slice and its manufacturing method of groove structure | |
| CN202045392U (en) | Milling cutter for dividing printed circuit board | |
| JPH0955573A (en) | Cutting method for resin board | |
| CN205200700U (en) | Ultra -thin saw bit of brazing | |
| CN102615326A (en) | Milling cutter for processing flexible board and forming process thereof | |
| CN113172779B (en) | High-strength scribing knife for semiconductor wafer step cutting and manufacturing method | |
| CN106847765B (en) | A kind of heat-radiating substrate with micro-structure | |
| CN216065816U (en) | Circular saw blade | |
| CN213350868U (en) | Novel turning tool blade | |
| CN201969927U (en) | Miniature drill bit structure for printed circuit boards | |
| CN207930083U (en) | A kind of diamond ultrathin blade for PCB substrate cutting | |
| CN209110266U (en) | A kind of milling cutter for processing line plate | |
| CN101667713A (en) | Method for making novel aluminum nitride ceramic carrier inclined end face for semiconductor laser | |
| CN217044764U (en) | Double-cutting drill point type milling cutter | |
| CN201317057Y (en) | Saw blade with bevel teeth | |
| CN206194754U (en) | Solar energy section battery | |
| CN208374293U (en) | It is a kind of for processing the chit drill of copper workpieces | |
| CN216760403U (en) | Novel reduce electroplating scribing sword that collapses limit | |
| CN109128528A (en) | The laser processing of cutter | |
| CN220113353U (en) | BGA cutting blade | |
| CN204955160U (en) | Diamond coping saw of brazing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |