CN106493652A - A kind of preparation method of fine granularity Study on Brazed Superabrasive Tools - Google Patents
A kind of preparation method of fine granularity Study on Brazed Superabrasive Tools Download PDFInfo
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- CN106493652A CN106493652A CN201611182980.7A CN201611182980A CN106493652A CN 106493652 A CN106493652 A CN 106493652A CN 201611182980 A CN201611182980 A CN 201611182980A CN 106493652 A CN106493652 A CN 106493652A
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- hard abrasive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
Abstract
The invention discloses a kind of preparation method of fine granularity Study on Brazed Superabrasive Tools, including super hard abrasive periphery parcel solder is formed compound pill；Select inert particulate ball；Compound pill and inert particulate ball are mixed to form compound；Adhesive coated；Cloth spills compound；Remove unnecessary compound；Soldering and removal inert particulate ball step.After using said method, compound uniform monolayers can be made to spread in tool base surface, when soldering is heated, the adhesive layer volatilization on tool base surface is lost with the cementation of inert particulate ball to compound pill, but the solder due to being combined pellet surface can melt trickling, will sprawl and climb, super-hard abrasive is embedded, and super-hard abrasive floating exposure, further solve super hard abrasive distribution to be difficult uniformly, and the uppity difficult problem of soldering pattern.In addition, larger chip space can be formed between abrasive particle, beneficial to grinding radiating, chip removal, can guarantee that Precision Machining.
Description
Technical field
The present invention relates to super hard abrasive instrument preparation field, particularly a kind of preparation of fine granularity Study on Brazed Superabrasive Tools
Method.
Background technology
Soldering refers to the technique for connecting bi-material by the high temperature melting of solder.Solder fusing is characterized in, and female
Material does not melt.Study on Brazed Superabrasive Tools is referred to and for the super hard abrasive with diamond, cubic boron nitride as representative to be welded in base steel
The instrument with working ability prepared on body.Mainly include：Grinding tool, cutting tool, drilling tool three are main kind of.
The type solders such as the multiplex Ni-based, cuprio of current Study on Brazed Superabrasive Tools, silver-based are welded to super hard abrasive,
Solder fusing is made by modes such as sensing heating, resistance heatings, due to solder in the active element such as element such as titanium, chromium cause to surpass
Hard grind material is firmly connected with steel matrix.For element influences such as the oxygen in ensureing super hard abrasive not by air, nitrogen, protection is generally required
Atmosphere, how using vacuum mode or noble gases.
Fine granularity Study on Brazed Superabrasive Tools can be widely applied to accurate cutting, grinding, drilling field, mainly process with steel
Ferrum is ferrous metal, copper, the non-ferrous metal that aluminum is representative, marble, the stone material that pottery is representative and plastics, the rubber of representative
Glue is emerging composite of representative etc..
Heretofore described fine granularity refers to abrasive particle of the granularity between 80 mesh ~ 400 mesh, corresponding coarseness abrasive particle
Refer to the abrasive particle between 30 mesh ~ 80 mesh.Conventional super hard abrasive instrument was focused mostly on before 30 mesh ~ 80 mesh due to granularity, was being prepared
When can have a two ways, a kind of spill abrasive material and solder grain for direct cloth, it is a kind of that in order to coat after cream solder, cloth spills superhard abrasive again
Material.In the case of greater particle size, aforesaid way preferably can be realized.And when super hard abrasive granularity is less than 80 mesh, its
Average-size maximum only 0.2mm, particle size diminish, and prepare difficulty and greatly improve, and concrete existing problems are summarized as follows：
Which kind of 1. it has been difficult to uniformly, no matter mode to carry out cloth using and spill by way of cloth spills, its granularity is less, specific surface
Can be big, easily reunite.
2. fine granularity super hard abrasive specific surface area is big, it is easier to there is oxidation, the phenomenon of corrosion.
3. mating according to solder and granularity, it is little that the amount of solder required for single super hard abrasive compares big grain size abrasive grain
Many, and as solder has the process of fusing and solidification, it is bigger with impact of climbing to cause its embedding on abrasive particle, is difficult abrasive particle
Exposure, embedding depth are too deep, and abrasive particle is difficult to play function.
Additionally, for making fine granularity super-hard abrasive preferably mate with solder, there is such mode：Fine granularity is superhard
Abrasive material is uniformly mixed by a certain percentage with solder, and mixed material is applied in matrix surface then, if this mode is used for preparing
Monolayer abrasive material tools, are difficult uniformly, that is, to be difficult to ensure that trickle granular cell layer is equably arranged in matrix surface, if occurring superhard
, then easily there is cut in finished surface in abrasive material lamination phenomenon, and this is being unacceptable in Precision Machining field.Therefore, how
The good soldering of abrasive particle is made, and super-hard abrasive monolayer is uniform, becomes an industry difficult problem.
The Chinese invention patent of Patent No. 201110366572.8, its have studied the side of fine-granularity diamond single layer soldering
Solder is first heated in vacuum drying oven by method, the method, and then shape layer solder layer carry out surface grinding process again to solder layer, then
Diamond abrasive grain cloth is spilt in solder alloy layer surface.This kind of mode has following limitation：
（1）Instrument needs to heat twice, high cost.In addition, it is necessary to increase the grinding process operation on surface, at complex surface
Reason increases operation difficulty.
（2）The cloth of diamond abrasive grain spills the distribution for also determining diamond surface, and diamond grit is less, uniformity
More it is difficult to accurately be ensured.
（3）There is the risk of solder trickling to perpendicular or cambered surface, cause solder layer uneven in soldering diamond.
（4）Under the conditions of fine granularity super-hard abrasive, solder layer is very thin, and it is right that the surface tension existed after high temperature melting is caused
There is certain difficulty with climbing in the embedding of abrasive particle.
Can be seen that for tool with single layer of super hard abrasive by above-mentioned analysis, reasonably abrasive particle is entered using solder
Row soldering, becomes a difficult problem for industry, does not solve this problem, then super hard abrasive instrument be applied to precision, ultraprecise cutting, grinding,
Drilling processing is not then known where to begin.
Content of the invention
The technical problem to be solved in the present invention is for above-mentioned the deficiencies in the prior art, and provides a kind of fine granularity soldering and surpasses
The preparation method of hard abrasive material tools, the purpose of the preparation method of the fine granularity Study on Brazed Superabrasive Tools are to solve fine granularity to surpass
When prepared by hard grind material doctor, super hard abrasive distribution is difficult uniform, the uppity difficult problem of super hard abrasive soldering pattern.
For solving above-mentioned technical problem, the technical solution used in the present invention is：
A kind of preparation method of fine granularity Study on Brazed Superabrasive Tools, fine granularity Study on Brazed Superabrasive Tools include tool base and
Super hard abrasive of the single layer soldering on tool base surface, it is characterised in that：Preparation method comprises the steps.
Step 1, is combined pill and prepares：Using granulating process, the periphery parcel solder of superabrasive particles is formed
Compound pill；Wherein, super hard abrasive is superhard material of the granularity between 80 mesh ~ 400 mesh.
Step 2, selects inert particulate ball：The fusing point and boiling point of inert particulate ball is required to more than 1100 DEG C, and the inertia
When particle sphere is below 1100 DEG C, there is no metallurgical chemistry reaction with super hard abrasive, solder, tool base material.
Prepared by step 3, compound：The inert particulate ball that compound pill and step 2 prepared by step 1 is selected utilizes batch mixing
Agent mix homogeneously, forms compound.
Step 4, adhesive coated：Cleaning tool matrix surface, coats one layer and glues on tool base surface after the cleaning
Knot agent, the boiling point of the binding agent are more than the boiling point of batch mixing agent.
Step 5, cloth spill compound：Compound cloth prepared by step 3 spills the instrument base for being coated with binding agent in step 4
Body surface face.
Step 6, removes unnecessary compound：The tool base that cloth in step 5 spills compound is heated, now plus
Boiling point and boiling point less than binding agent of the hot temperature requirement more than batch mixing agent, when the batch mixing agent on tool base surface is volatilized, go
Except the unnecessary compound not being connected with binder phase, tool base surface is made to form the uniform granule landforms of monolayer compound.
Step 7, soldering：The tool base for having monolayer compound uniform in step 6 is heated to pricker under protective atmosphere
Weldering temperature, the brazing temperature more than binding agent boiling point but are less than 1100 DEG C；Binding agent volatilizees, solder fusing by superhard abrasive
Grain is partially embedded.
Step 8, removes inert particulate ball：After the completion of soldering, by the lazy of tool base surface by way of applying external force
Property particle sphere remove, you can obtain needed for fine granularity soldering super-hard abrasive particle tool.
Binding agent in the step 4 is for pressure sensitive adhesive with acetone according to volume ratio 1:2~1:15 carry out preparation formation.
Super hard abrasive in the step 1 is the nitridation of diamond, cubic boron nitride, polycrystalline diamond and polycrystalline cubic
One or more in boron.
Inert particulate ball in the step 2 is one or more in silicon dioxide, aluminium sesquioxide or titanium oxide.
In the step 3, the volatilization temperature of batch mixing agent is less than 100 DEG C, and batch mixing agent is not sent out with super hard abrasive and solder
Biochemical reaction.
In the step 6, when the batch mixing agent on tool base surface is volatilized, by contact or contactless applying external force
Mode, remove the unnecessary compound that be connected with binder phase, and the external force for applying be less than the cohesive force of binding agent.
In the step 6, the mode that external force applies is impacted and non-for soft hairbrush direct contact type, contactless Tiny pore
Contact vibrates the one kind in coming off.
In the step 8, the inert particulate ball on tool base surface is removed by way of vibration.
In the step 4, the volatilization temperature of binding agent is 120-550 °.
The step 7, during soldering, the mode of soldering is that resistance heating or noble gases are protected under vacuum brazing or protective atmosphere
The lower sensing heating of shield or vacuum resistance soldering.
The present invention is had the advantages that using after said method：
1. prepared by above-mentioned compound pill, cloth spills compound and removes the methods such as unnecessary compound, accordingly, it is capable to make compound equal
Even monolayer spreads in tool base surface, has the encirclement of solder, it is ensured that every superhard abrasive around single super-hard abrasive
The brazing property of grain.This is highly beneficial for good processing characteristics is obtained.Further, since super-hard abrasive granularity is less,
After batch mixing agent volatilization, specific surface area increases, and super-hard abrasive is increased with tool base contact surface, can form larger adhesion, because
This can reach compound, and thoroughly monolayer sprawls effect.Namely the abrasive particle landforms for being formed be single layer of abrasive particles structure, machining accuracy
Height, the phenomenon that there is no multi-player super-hard abrasive particle stack, it is easy to ensure machining accuracy.
2. after above-mentioned compound monolayer is spread in tool base, when soldering is heated, as brazing temperature is more than bonding
Agent volatilization temperature, therefore, the adhesive layer volatilization on tool base surface is lost with the cementation of inert particulate ball to being combined pill
Go, but the solder due to being combined pellet surface can melt trickling, it will sprawl and climb, super-hard abrasive is embedded, by
In abrasive particle, not only bottom is surrounded by solder, and top is also present, and therefore solder subregion can be to super-hard abrasive surface shape
Into a lamination gold solder bed of material, but as the difference with super-hard abrasive density disclosed by action of gravity and alloy, super-hard abrasive floats
Exposure, and then super hard abrasive distribution is difficult uniform, super hard abrasive soldering shape when solving the preparation of fine granularity super hard abrasive doctor
The uppity difficult problem of looks.
3. as inert particulate ball is not reacted with solder, but the filling of its position makes solder flow to superhard abrasive
Grain, reaches the soldering effect of optimization.And inert particulate ball can be carried out by vibration, applying profile mode after postwelding is gone
Remove.Thus the super-hard abrasive landforms that surface is arranged are obtained according to design requirement.As inert particulate ball is not present, super-hard abrasive
Not only by good soldering, and larger chip space between abrasive particle, is formed, beneficial to grinding radiating, chip removal, this is for Precision Machining
It is necessary and key.
In a word, above procedure technology, due to concise in technology, high degree of automation, and the adaptability to tool construction profile
Good, it is very beneficial for industrialized production and automation mechanized operation, for preparing, precise and ultraprecise machining instrument is extremely advantageous, has
Higher economic worth and benefit.
Description of the drawings
Fig. 1 shows the structural representation for being combined pill in the present invention.
Fig. 2 shows that compound cloth is sprinkled upon the structural representation in tool base in step 5.
After Fig. 3 shows that step 6 removes unnecessary compound, compound monolayer spreads over the structural representation in tool base
Figure.
Wherein have：1. super-hard abrasive granule；2. solder granule；3. pill is combined；4. inert particulate ball；5. instrument base
Body；6. adhesive layer；7. the compound pill for adhering to；8. the inert particulate ball for adhering to.
In addition, R represents that the radius of super-hard abrasive granule, R1 represent the radius of compound pill in Fig. 1.
Specific embodiment
The present invention is further detailed explanation with concrete better embodiment below in conjunction with the accompanying drawings.
The fine granularity Study on Brazed Superabrasive Tools of indication of the present invention includes tool base and single layer soldering in tool base
The super hard abrasive on surface.Wherein, super hard abrasive is superhard material of the granularity between 80 mesh ~ 400 mesh.Super hard abrasive shape is more
Kind, it is simplified model, if super hard abrasive is shaped as spheroidal as shown in Figure 1, and radius is R, then its volume is.
A kind of preparation method of fine granularity Study on Brazed Superabrasive Tools, comprises the steps.
Step 1, is combined pill and prepares：Using granulating process, the periphery parcel solder of superabrasive particles is formed
Compound pill.Require according to preparing, determine species and the consumption of super hard abrasive granularity and corresponding solder, and superhard abrasive
Intergranular away from etc. parameter.
The particle diameter of compound pill is mainly determined by the granularity and the consumption of required solder of super-hard abrasive.Solder
Consumption determined by super hard abrasive granularity and abrasive particle spacing.
For realizing the good soldering of super-hard abrasive, super hard abrasive is embedded using solder in advance, prepared glomerate multiple
Close pill, it is assumed that the R1 shown in radius Fig. 1 of compound pill, then pill is combined according to volume relationship, with formula is calculated as below：
Wherein, K is represented under the good brazing conditions of single abrasive material, the ratio of solder consumption volume and super hard abrasive volume.Namely
Preferably by super-hard abrasive soldering, required solder consumption volume is about K times of the super-hard abrasive of equal volume, its
It is more excellent that middle K takes 0.8～1.45.
As shown in figure 1, solder granule 2 is wrapped up on 1 whole body of superabrasive particles, it is to be achieved by granulating process.
During powder processed, super-hard abrasive can be bondd glomeration by solder.
In addition, above-mentioned super hard abrasive is preferably the nitridation of diamond, cubic boron nitride, polycrystalline diamond and polycrystalline cubic
One or more in boron.Above-mentioned solder is preferably Ni-based, the one kind in cuprio and silver-based etc., more preferably copper
Base, acid bronze alloy hardness are low, and welding performance is excellent, even if after super-hard abrasive is embedded completely, as super-hard abrasive is relative to conjunction
Gold solder density is little, and after solder fusing, super-hard abrasive floats, and remains able to exposure.And the solder at the top of super-hard abrasive,
Can be removed by preliminary sharpening technology.Even if not removing, after preliminary use, the effect of sword is also can reach out such that it is able to real
Existing good soldering super hard abrasive.
Step 2, selects inert particulate ball：The fusing point and boiling point of inert particulate ball is required to more than 1100 DEG C, and the inertia
When particle sphere is below 1100 DEG C, there is no metallurgical chemistry reaction with super hard abrasive, solder, tool base material.Lazy
Property particle sphere be preferably one or more in silicon dioxide, aluminium sesquioxide or titanium oxide etc..Require according to preparing, select to close
The radius of inert particulate ball is designated as R2 by the suitable inert particulate radius of a ball.
The particle diameter of inert particulate ball is mainly determined by the compound pill spacing that arranges, that is, is combined pill spacing and is equal to compound ball
Grain diameter and the diameter sum of inert particulate ball.
Prepared by step 3, compound：The inert particulate ball that compound pill and step 2 prepared by step 1 is selected utilizes batch mixing
Agent mix homogeneously, forms compound.
As inert particulate ball has certain density variation with compound pill, it is difficult to reach mixed uniformly effect, because
This needs to add volatilizable batch mixing agent wherein, and batch mixing agent composition is required to volatilize, and does not affect brazing property.
The volatilization temperature of above-mentioned batch mixing agent is preferably shorter than 100 DEG C, and batch mixing agent is not occurred with super hard abrasive and solder
Chemical reaction.Further, preferably ethanol or methanol etc..
Step 4, adhesive coated：Cleaning tool matrix surface, coats one layer and glues on tool base surface after the cleaning
Knot agent, the boiling point of the binding agent are more than the boiling point of batch mixing agent.
The volatilization temperature of above-mentioned binding agent is preferably 120-550 °, and can play will be bonding with inert particulate ball for compound pill solid
Fixed purpose.Further, binding agent is preferably pressure sensitive adhesive with acetone according to volume ratio 1:2~1:15 carry out preparation formation.
Step 5, cloth spill compound：Compound cloth prepared by step 3 spills the instrument base for being coated with binding agent in step 4
Body surface face.Effect after compound cloth spills is as shown in Figure 2.
If now directly cloth spills the compound pill that super-hard abrasive is formed, the spacing mistake of postwelding super-hard abrasive with alloy welding powder
Little, macro manifestations are that super-hard abrasive is overstocked, will be unfavorable for that chip removal is radiated, and the growth of heat is then for delicate machine tools
Fatal.
Step 6, removes unnecessary compound.
As mixed granule has certain viscosity, the granule for spreading in adhesive surface differs and is set to single berth exhibition, it is possible to
For piling up pattern, as shown in Figure 2.Now, apply the batch mixing agent volatilization that certain temperature there will be, you can allow nonadherent binding agent
Particle detachment.Mixed homogeneously with inert particulate ball due to being combined pill before cloth spills, therefore, monolayer spreads in instrument table
It is equally distributed with inert particulate ball to be combined pill present in the granule in face.
Unnecessary compound is removed, namely removes the inert particulate ball 8 of the compound pill 7 and adhesion adhered in Fig. 2.Specifically go
Except method is：The tool base that cloth in step 5 spills compound is heated, heating-up temperature now requires to be more than batch mixing agent
Boiling point and the boiling point less than binding agent, when the batch mixing agent on tool base surface is volatilized, preferably by contact or noncontact
Formula applies the mode of external force, removes the unnecessary compound not being connected with binder phase, tool base surface is formed such as Fig. 3 institutes
The uniform granule landforms of the monolayer compound that shows.So as to machining accuracy is high, there is no the phenomenon of multi-player super-hard abrasive particle stack, it is easy to
Ensure machining accuracy.
In addition, there is the encirclement of solder around single super-hard abrasive, it is ensured that the brazing property of every super-hard abrasive.
This is highly beneficial for good processing characteristics is obtained.
The mode that external force applies is more preferably soft hairbrush direct contact type, the impact of contactless Tiny pore and non-connects
Touch vibration come off etc. in one kind.
As super-hard abrasive granularity is less, after batch mixing agent volatilization, specific surface area increases, and super-hard abrasive is contacted with tool base
Face increases, and can form larger adhesion, and thoroughly monolayer sprawls effect therefore to reach compound.Namely the abrasive particle for being formed
Landforms are single layer of abrasive particles structure, and machining accuracy is high, there is no the phenomenon of multi-player super-hard abrasive particle stack, it is easy to ensure machining accuracy.
Step 7, soldering：The tool base for having monolayer compound uniform in step 6 is heated to pricker under protective atmosphere
Weldering temperature, the brazing temperature more than binding agent boiling point but are less than 1100 DEG C；Binding agent volatilizees, solder fusing by superhard abrasive
Grain is partially embedded.
The mode of above-mentioned soldering is sensing heating under resistance heating under vacuum brazing or protective atmosphere or inert gas shielding
One kind in, further preferred vacuum resistance soldering, so as to can guarantee that brazing quality, reduce the shadow of air-flow and the rate of heat addition
Ring.
After above-mentioned compound monolayer is spread in tool base, when soldering is heated, as brazing temperature is more than binding agent
Volatilization temperature, therefore, the adhesive layer volatilization on tool base surface is lost with the cementation of inert particulate ball to being combined pill
Go, but the solder due to being combined pellet surface can melt trickling, it will sprawl and climb, super-hard abrasive is embedded, by
In abrasive particle, not only bottom is surrounded by solder, and top is also present, and therefore solder subregion can be to super-hard abrasive surface shape
Into a lamination gold solder bed of material, but as the difference with super-hard abrasive density disclosed by action of gravity and alloy, super-hard abrasive floats
Exposure, and then super hard abrasive distribution is difficult uniform, super hard abrasive soldering shape when solving the preparation of fine granularity super hard abrasive doctor
The uppity difficult problem of looks.
Step 8, removes inert particulate ball：After the completion of soldering, by way of applying external force, preferably mode of vibration will
The inert particulate ball on tool base surface is removed, you can the fine granularity soldering super-hard abrasive particle tool needed for obtaining.
As inert particulate ball is not reacted with solder, but the filling of its position makes solder flow to superhard abrasive
Grain, reaches the soldering effect of optimization.And inert particulate ball can be carried out by vibration, applying profile mode after postwelding is gone
Remove.Thus the super-hard abrasive landforms that surface is arranged are obtained according to design requirement.As inert particulate ball is not present, super-hard abrasive
Not only by good soldering, and larger chip space between abrasive particle, is formed, beneficial to grinding radiating, chip removal, this is for Precision Machining
It is necessary and key.
Above-mentioned preparation method is explained in detail with two kinds of preferred embodiments below.
Embodiment 1
Fine granularity Study on Brazed Superabrasive Tools is super-hard abrasive scroll saw, and for grade material that cuts a gem, super-hard abrasive is 120 mesh grains
The synthetic diamond particles of degree, cutting accuracy have high demands, scroll saw matrix external diameter 0.6mm.Concrete preparation process is as follows：
Step 1, using flouring technology, in the periphery parcel acid bronze alloy weldering of the synthetic diamond particles of 120 mesh mean diameters
Material, forms the compound pill that granularity is 0.125mm.
Step 2, inert particulate ball is from the silicon dioxide or silicon oxide that granularity is 0.2mm.
Step 3, the inert particulate ball that compound pill and step 2 prepared by step 1 is selected are mixed using batch mixing agent ethanol
Uniformly, compound is formed.
Step 4, will be clean for the process of scroll saw matrix surface, and through gluing agent container, scroll saw matrix surface adheres to one layer of bonding
Agent.
Step 5, compound prepared by step 3 is placed in container, and step 4 is stained with the scroll saw matrix of bonding agent from which
In pass through, then scroll saw matrix surface bonding compound.
Step 6, by the compound bondd on thermal current featheriness scroll saw matrix surface, it is ensured that monolayer arrangement effect.
Step 7, as scroll saw matrix is thinner, beneficial to induction brazing mode of heating, argon is protected.
Step 8, after preparation, scroll saw matrix surface brushes away the inert particulate ball particle of adhesion using banister brush, you can obtain
Desired super-hard abrasive scroll saw.
Embodiment 2
Prepared by a kind of expensive material such as sapphire surface rubbing down pad, super-hard abrasive is diamond, and granule is 200 mesh, rubbing down
Pad matrix external diameter 100mm, rubbing down pad matrix thickness are 0.5mm.Concrete preparation process is as follows：
Step 1, using flouring technology, in the periphery parcel copper-base alloy tin solder of the synthetic diamond particles of 200 mesh mean diameters,
Form compound pill of the granularity for 0.68mm.
Step 2, inert particulate ball is from the aluminium sesquioxide that granularity is 0.7mm.
Step 3, the inert particulate ball that compound pill and step 2 prepared by step 1 is selected are mixed using batch mixing agent ethanol
Uniformly, compound is formed.
Step 4, will be clean for the process of rubbing down pad matrix surface, and brushes one layer of bonding agent, rubbing down pad matrix surface adhesion one
Layer binder.Wherein, volumetric concentration 1 pressed by binding agent：8 ratio is mixed with acetone, forms thin layer beneficial on surface.
Compound prepared by step 3 is inverted in rubbing down pad matrix surface by step 5, then rubbing down pad matrix surface bonding is mixed
Close material.
Step 6, then by rubbing down pad matrix vertically, makes most of not glued granules drop using gravity, recycles heat
Air-flow makes the mixture particle not fallen off lose adhesiving effect, recycles banister brush to remove not glued mixture particle, shape
Effect is sprawled into required monolayer.
Step 7, as rubbing down pad is discoid part, beneficial to resistance brazing, therefore selects vacuum brazing mode.
820 degree, it is incubated 18 minutes.
Step 8, after preparation, rubbing down pad matrix surface brushes away the aluminium sesquioxide granule of adhesion using banister brush, you can
Arrive desired super-hard abrasive scroll saw.
The preferred embodiment of the present invention described in detail above, but, the present invention is not limited in above-mentioned embodiment
Detail, the present invention range of the technology design in, multiple equivalents can be carried out to technical scheme, this
A little equivalents belong to protection scope of the present invention.
Claims (10)
1. a kind of preparation method of fine granularity Study on Brazed Superabrasive Tools, fine granularity Study on Brazed Superabrasive Tools include tool base
With single layer soldering tool base surface super hard abrasive, it is characterised in that：Preparation method comprises the steps：
Step 1, is combined pill and prepares：Using granulating process, the periphery parcel solder of superabrasive particles is formed compound
Pill；Wherein, super hard abrasive is superhard material of the granularity between 80 mesh ~ 400 mesh；
Step 2, selects inert particulate ball：The fusing point and boiling point of inert particulate ball is required to more than 1100 DEG C, and the inert particulate
When ball is below 1100 DEG C, there is no metallurgical chemistry reaction with super hard abrasive, solder, tool base material；
Prepared by step 3, compound：The inert particulate ball that compound pill and step 2 prepared by step 1 is selected is mixed using batch mixing agent
Close uniform, formation compound；
Step 4, adhesive coated：Cleaning tool matrix surface, coats a layer binder on tool base surface after the cleaning,
Boiling point of the boiling point of the binding agent more than batch mixing agent；
Step 5, cloth spill compound：Compound cloth prepared by step 3 spills the tool base table for being coated with binding agent in step 4
Face；
Step 6, removes unnecessary compound：The tool base that cloth in step 5 spills compound is heated, heating temperature now
Degree requires the boiling point and the boiling point less than binding agent more than batch mixing agent, when the batch mixing agent on tool base surface is volatilized, removes not
The unnecessary compound being connected with binder phase, makes tool base surface form the uniform granule landforms of monolayer compound；
Step 7, soldering：The tool base for having monolayer compound uniform in step 6 is heated to soldering temperature under protective atmosphere
Degree, the brazing temperature more than binding agent boiling point but are less than 1100 DEG C；Binding agent volatilizees, solder fusing by super-hard abrasive portion
Subpackage is buried；
Step 8, removes inert particulate ball：After the completion of soldering, will be micro- for the inertia on tool base surface by way of applying external force
Grain ball is removed, you can the fine granularity soldering super-hard abrasive particle tool needed for obtaining.
2. the preparation method of fine granularity Study on Brazed Superabrasive Tools according to claim 1, it is characterised in that：The step
Binding agent in 4 is for pressure sensitive adhesive with acetone according to volume ratio 1:2~1:15 carry out preparation formation.
3. the preparation method of fine granularity Study on Brazed Superabrasive Tools according to claim 1, it is characterised in that：The step
Super hard abrasive in 1 is the one kind or many in diamond, cubic boron nitride, polycrystalline diamond and polycrystalline cubic boron nitride
Kind.
4. the preparation method of fine granularity Study on Brazed Superabrasive Tools according to claim 1, it is characterised in that：The step
Inert particulate ball in 2 is one or more in silicon dioxide, aluminium sesquioxide or titanium oxide.
5. the preparation method of fine granularity Study on Brazed Superabrasive Tools according to claim 1, it is characterised in that：The step
In 3, the volatilization temperature of batch mixing agent is less than 100 DEG C, and batch mixing agent does not occur chemical reaction with super hard abrasive and solder.
6. the preparation method of fine granularity Study on Brazed Superabrasive Tools according to claim 1, it is characterised in that：The step
In 6, when tool base surface batch mixing agent volatilize when, by way of contact or contactless applying external force, remove not with
The unnecessary compound of binder phase connection, and the external force for applying is less than the cohesive force of binding agent.
7. the preparation method of fine granularity Study on Brazed Superabrasive Tools according to claim 6, it is characterised in that：The step
In 6, the mode that external force applies is during soft hairbrush direct contact type, the impact of contactless Tiny pore and contactless vibration come off
One kind.
8. the preparation method of fine granularity Study on Brazed Superabrasive Tools according to claim 1, it is characterised in that：The step
In 8, the inert particulate ball on tool base surface is removed by way of vibration.
9. the preparation method of fine granularity Study on Brazed Superabrasive Tools according to claim 1, it is characterised in that：The step
In 4, the volatilization temperature of binding agent is 120-550 °.
10. the preparation method of fine granularity Study on Brazed Superabrasive Tools according to claim 1, it is characterised in that：The step
Rapid 7, during soldering, the mode of soldering be under vacuum brazing or protective atmosphere under resistance heating or inert gas shielding sensing heating or
Vacuum resistance soldering.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108161781A (en) * | 2017-12-19 | 2018-06-15 | 南京航空航天大学 | A kind of preparation method of novel multi-layer Study on Brazed Superabrasive Tools |
| CN108527176A (en) * | 2018-05-09 | 2018-09-14 | 南京固华机电科技有限公司 | A kind of production method of novel diamond tool |
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| DE2411785A1 (en) * | 1973-08-14 | 1975-02-27 | Abrasive Tech Inc | IMPROVED DIAMOND GRINDING TOOL AND METHOD OF MANUFACTURING IT |
| US20080271384A1 (en) * | 2006-09-22 | 2008-11-06 | Saint-Gobain Ceramics & Plastics, Inc. | Conditioning tools and techniques for chemical mechanical planarization |
| CN102896387B (en) * | 2012-09-21 | 2014-11-05 | 南京航空航天大学 | Super-hard abrasive brazing tool distributing technology |
| CN103522206B (en) * | 2013-07-26 | 2015-09-09 | 广东省电力线路器材厂有限公司 | The distributing technique of one-shot forming Study on Brazed Superabrasive Tools |
| CN103506964A (en) * | 2013-09-17 | 2014-01-15 | 广东省电力线路器材厂 | Modified diamond abrasive tool and manufacturing method thereof |
| CN104875132B (en) * | 2015-04-29 | 2018-05-15 | 上海科弗新材料科技有限公司 | The preparation method and Study on Brazed Superabrasive Tools of Study on Brazed Superabrasive Tools |
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| CN108161781A (en) * | 2017-12-19 | 2018-06-15 | 南京航空航天大学 | A kind of preparation method of novel multi-layer Study on Brazed Superabrasive Tools |
| CN108527176A (en) * | 2018-05-09 | 2018-09-14 | 南京固华机电科技有限公司 | A kind of production method of novel diamond tool |
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