KR100413371B1 - A diamond grid cmp pad dresser - Google Patents

Abstract

The present invention discloses a CMP pad dresser consisting of a plurality of abrasive particles 180 uniformly spaced. The abrasive particles 180 are excellent hard materials and are generally diamond, polycrystalline diamond (PCD), cubic boron nitride (cBN), or polycrystalline cubic boron nitride (PcBN). The abrasive particles 180 are attached to the substrate 40 and then additionally coated with a corrosion resistant layer 130. The corrosion resistant layer 130 is usually diamond or diamond-like carbon coated over the surface of the disc to prevent corrosion of the brazing material 90 by chemical slurry used with the CMP pad. Immunity to chemical corrosion allows the CMP pad dresser to dress the pad while grinding the workpiece. Not only are the spacing of the abrasive particles 180 above the substrate 40 uniform, but also extend to a uniform height from the substrate 40, thereby allowing the abrasive particles 180 to trim or dress the CMP pad in both vertical and horizontal directions. To be able. Also disclosed is a method of making such a CMP pad dresser.

Description

Diamond grid chemical mechanical polishing pad dresser {A DIAMOND GRID CMP PAD DRESSER}

This patent application is part of US patent application Ser. No. 09 / 447,620, filed November 22, 1999. The present invention generally relates to conditioning or dressing CMP (chemical mechanical polishing) pads. The present invention relates to a device for manufacturing the same and a method for manufacturing the same. In particular, the present invention relates to dressing discs containing good hard materials, such as diamond or cubic boron nitride, for conditioning or dressing CMP pads. More particularly, the present invention relates to a dressing disc with uniformly spaced particles, which can be coated with a thin film of diamond, such as carbon, to protect it from chemical erosion.

Many industries now use chemical mechanical polishing (CMP) methods to polish certain workpieces. In particular, the manufacturing industry relies heavily on the CMP method for polishing wafers of ceramic, silicon, glass, quartz and metal. Such polishing methods generally involve pressing the wafer against a rotating pad made of durable organics such as polyurethane. In the pad, a chemical slurry containing chemicals capable of breaking the wafer substrate and a large amount of abrasive particles acting to physically erode the wafer surface are added. Slurry is added continuously to the rotating CMP pad so that the wafer is preferably polished due to the dual chemical and mechanical action applied to the wafer.

One particularly important point with regard to the polishing quality produced is that the abrasive particles are distributed throughout the pad. The top of the pad is usually held by the cavity in the polyurethane and the coarse tissue on the top of the pad. The top of the flexible pad is further provided with the support needed to allow the abrasive to act on the wafer.

In maintaining the upper structure of the pad, the accumulation of abrasive debris from the workpiece, abrasive slurry and dressing disc becomes a problem. This buildup results in “glazing” or curing of the pad top which makes the pad unable to support the abrasive particles of the slurry.

Thus, attempts have been made to reclaim the top of the pad by "combing" the pad using various devices. This process is referred to as "dressing" or "conditioning" of the CMP pad. Many forms of apparatus and methods are used for this purpose. One such device is a disk with a large number of very hard crystalline particles, such as diamond particles attached to a substrate or surface.

Unfortunately, such diamond disks produced by conventional methods have shown some problems. First, the diamond is separated from the disk's substrate and attached to the CMP pad surface. This causes scratches on the workpiece to be polished. Second, in conventional disks, diamonds tend to cluster in clusters or to be unevenly spaced on the surface of the substrate. This non-uniform grouping causes some parts of the CMP pads to be excessively dressed to form wear areas, while other parts lack dressings resulting in a glazing layer. In either case, pad polishing efficiency is reduced, resulting in non-uniform polishing. Finally, the diamond of such disks does not have a uniform height above the substrate surface of the disk. This non-uniformity further results in non-uniform dressings for the CMP pads since only particles protruding from the dresser to a sufficient height contact the pads. Uneven dressings on top of the pads can result in non-uniformity of the wafer.

Since diamond adheres in an inferior manner, diamond separation from the disk substrate occurs. When the diamond is supported on the substrate by electroplated nickel, there is a mechanical fastening of the diamond, not a strong bond. Thus, these particles will separate as soon as they rock and loosen. This separation process is facilitated by chemical erosion of the chemical slurry on the electroplating material.

On the other hand, when diamonds are brazed onto the substrate, the chemical action forces more firmly support the diamonds. However, the acid in the chemical slurry quickly dissolves the braze and separates the diamond. Thus, to minimize the exposure of the brazing material to chemicals, the polishing process must be stopped while the dressing takes place and then restarted. This subsequent alternative method of polishing and subsequent dressing is time consuming and therefore inefficient.

In view of the foregoing, it may be desirable for a CMP pad dresser to provide homogeneous grooming of the CMP pad. In addition, a CMP pad dresser that trims the CMP pad to a uniform depth may be very desirable. In addition, CMP pad dressers that are less sensitive to diamond particle separation may be highly desirable. Finally, CMP pad dressers that are resistant to acid erosion of chemical slurries, can continuously dress CMP pads, and even polishing in acid slurries are highly desirable.

It is an object of the present invention to provide a CMP pad dresser that can use abrasive particles to enable uniform dressing or conditioning of the CMP pad.

Another object of the present invention is to provide a CMP pad dresser which is less sensitive to abrasive particle separation.

It is another object of the present invention to provide a CMP pad dresser with corrosion resistance capable of dressing the CMP pad continuously even while the pad is in the abrasive state in the acid slurry.

It is also an object of the present invention to provide a chemical barrier barrier to the disk to prevent the dissolved elements from the disk from contaminating the wafer being polished.

It is a further object of the present invention to provide a method of dressing or conditioning a CMP pad uniformly.

It is a further object of the present invention to provide a method of reducing the sensitivity of a CMP pad dresser to abrasive particle separation when the pad is immersed in an acid slurry.

1 is a side view of a conventional CMP pad dresser using an electroplating method to secure diamond to a disk substrate.

2 is a side view of a conventional CMP pad dresser manufactured using a conventional brazing method for securing diamond particles to a disk substrate.

3 is a side view of a CMP pad dresser made in accordance with the principles of the present invention.

4 is a side view of a brazing alloy sheet having a template for placing abrasive particles on its surface made in accordance with the principles of the present invention.

FIG. 5 shows a flat surface used to press abrasive particles into a braze alloy sheet in accordance with the principles of the present invention, and is a side view of a brazing alloy sheet with abrasive particles filling the template and holes in the template on the surface.

Figure 6 is a side view of a brazing alloy sheet having abrasive particles pressed inwards in accordance with the principles of the present invention. ** Explanation of symbols for the main parts of the drawings. ** 30: CMP pad dresser 40: Substrate 50: Diamond particle 90 : Brazing material 70, 120: Space 130: Corrosion protection layer 140: Template 150: Hole 160: Flat surface 180: Abrasive particle (grit) 190: Brazing alloy sheet

The above and other objects not specifically mentioned have been achieved through a particular embodiment of a CMP pad dresser for attaching a plurality of evenly spaced abrasive particles to a substrate. Generally, the particles are in monocrystalline or polycrystalline form and are one of very hard materials, such as diamond or cubic boron nitride (cBN). In one method of forming the CMP pad dresser of the present invention, firstly the brazing powder and organic The binder is mixed thoroughly to form a dough. The dough is then rolled through between two rollers to form a flexible brazing alloy sheet. The abrasive particles are then evenly laid on the brazing alloy sheet by the use of a template comprising a plurality of evenly spaced holes. The holes in the template are larger than the size of one abrasive particle or "grit", but smaller than the size of two abrasive particles. When all the holes are filled with abrasive particles, excess abrasive particles are removed and pressed into the brazing alloy sheet to embed the abrasive particles therein using a generally flat surface such as a steel sheet. The template is then removed and a braze alloy sheet containing abrasive particles is attached to the substrate with acrylic glue. Finally, the complete assembly is brazed in a vacuum furnace to complete the brazing process and firmly fix the abrasive particles to the substrate. Alternatively, the abrasive particles may be substrates with acrylic glue using a template as described above. It can be attached to. Then, the brazing material particles are sprayed onto the substrate together with the abrasive particles. Finally, the brazing process is completed by heating the complete assembly in a vacuum brazing furnace so that the abrasive particles are firmly attached to the substrate. By using a template to place the abrasive particles in a controlled manner, any placement pattern can be achieved. Can be. This pattern may be a nearly imaginable pattern, but most importantly, it provides the ability to evenly space abrasive particles over the substrate. In addition, by using a template having holes of uniform size, a uniform size of each abrasive grain is ensured. Finally, using a flat surface to press the abrasive particles into the substrate causes the abrasive particles to project at a uniform height above the substrate surface. Such uniform abrasive particles ensure dressing or plowing of the CMP pads with uniform depth. In addition, the uniform distribution of abrasive particles across the substrate evens the pad dressing across its surface. After attaching the abrasive particles to the substrate, a thin coating of additional corrosion resistant material can be applied to the CMP pad drier. have. Such a coating effectively seals the surface of the CMP pad dresser. Such sealants protect abrasive particles and brazing materials or other fixatives, or reduce their sensitivity to chemical erosion resulting from the chemicals of abrasive slurries, particularly slurries containing acids. As the surface of the CMP pad dresser becomes less sensitive to chemical degradation, its sensitivity to abrasive particle separation is reduced. Therefore, the CMP pad dresser can continuously dress the CMP pad even during the polishing operation because the agent that binds the abrasive particles to the substrate is protected from chemical decomposition. The present invention as described above and other objects and aspects of the present invention. And advantages will become more apparent from the following detailed description set forth in conjunction with the accompanying drawings. Prior to the disclosure of a CMP pad dresser and its accompanying method of use and manufacturing method, the present invention is directed to the specific process steps and materials disclosed herein. It is to be understood that no limitation is imposed and that it extends in parallel to it as will be appreciated by those skilled in the art through the relationship art. It is also to be understood that the terminology used herein is for the purpose of describing particular embodiments only, and is not intended to be limiting.

As used in the description of the invention and the appended claims, the singular forms "a" and "the" include plural supports unless the context clearly dictates otherwise. It should be noted that Thus, for example, “abrasive particles” or “grits” include one or more abrasive particles or one or more grits.

In describing and claiming the present invention, the following terminology will be used in accordance with the definitions set out below.

As used herein, the term “abrasive particles”, or “grits”, or similar idioms mean any good hard crystal, or polycrystalline material, or mixture, but diamond, polycrystalline diamond (PCD), cubic boron nitride, and It is not limited to polycrystalline cubic boron nitride (PCBN). In addition, the terms "abrasive particles", "grit", "diamond", "polycrystalline diamond (PCD)", "cubic boron nitride" and "polycrystalline cubic boron nitride" (PCBN) may be used interchangeably.

As used herein, the term "substrate" refers to the base of a CMP dresser having a surface to which abrasive particles can adhere. This base may be of any shape, thickness or material and is not limited to metals, alloys, ceramics and mixtures thereof.

As used herein, the term "euhedral" means to have a native form or to have an unaltered native shape with grown crystallographic planes.

As used herein, the term "sharp point" means any narrow vertex that is crystallized and is not limited to edges, bumps, obelisks, and other protrusions.

As used herein, the term "metallic material" means any metal form, alloy metal or mixtures thereof, and is not limited to steel, iron, and stainless steel.

Applicants have developed a device for conditioning or dressing CMP pads with improved efficiency and quality. Included herein are methods for using and manufacturing the device. By using devices for conditioning or dressing CMP pads, not only the disc life and pad life can be extended, but also the pads can be used continuously, improving work performance and throughput by work. In addition, the uniformity of the polished wafer was improved and the defect rate was reduced.

Referring to FIG. 1, there is shown a conventional CMP pad dresser 10 equipped with a plurality of diamond particles 50 and an electroplated substrate 40. Electroplating material 60 is generally nickel deposited from an acid solution. Such electroplating methods are not only expensive and time consuming, but are also environmentally harmful due to the waste generated during the treatment.

Electroplated CMP pad dresser 10 as shown in FIG. 1 has many disadvantages. First, electroplating material 60 may not form any chemical bonds with diamond particles 50. Thus, only weak mechanical forces support the diamond particles 50 on the substrate 60. Such mechanical forces are overwhelmed by the greater frictional forces acting on the diamond particles 50 when the pad dresser is rubbed against the CMP pads so that the diamond particles are easily released from the electroplating material 60 and thus in the electroplating material 60. It leaves a cavity like space 70. Such cavities are quickly filled with abrasive residues of the workpiece as well as chemical and abrasive particles from the slurry. However, such deposited residue hardens and often causes fine scratches as it falls, reducing the yield of the polished wafer.

Since the mechanical force by the electroplating material 60 is only a means of supporting the diamond particles 50 on the substrate 40, the exposure of the diamond particles 50 on the electroplating material should be kept to a minimum. Thus, contact between the electroplating material 60 and the CMP pad is inevitable. Such contact wears the electroplating material and promotes separation of the diamond particles 50.

In addition, the electroplating material 60 tends to rise above the diamond particles 50 at the same location as the convex portion 80. This excessive rise already makes the penetration of the diamond particles 50 into the CMP pad quite difficult, if not impossible, in addition to the low exposure and narrow spacing of the diamond particles 50. Without such penetrations, the dressing process is severely disturbed.

Referring to FIG. 2, there is shown a prior art CMP dresser pad with a brazing material 90 and a substrate 40 having diamond particles 50 brazed to the substrate 40 using conventional brazing techniques. . Brazing materials generally include alloy metal mixed with carbide formers. Such carbide formers provide diamond particles 50 for chemically bonding to brazing material 90 which in turn bonds with substrate 40. Such coupling devices significantly increase grit adhesion strength, but involve some undesirable side effects.

The brazing material 90 should be kept to a minimum so as not to completely cover the diamond particles 50. Thus, the diamond particles 50 are only wrapped by a thin coating of the brazing material 90. The problem is caused by the fact that typical brazing materials are mechanically weak. This mechanical weakness cancels the strength of the chemical bond between the diamond particles 50 and the brazing material 90 because the brazing material itself can be sheared by the separated diamond particles.

A further problem with the brazing material 90, such as the electroplated nickel mentioned above, is that it is very sensitive to chemical erosion by the polishing slurry. Such chemical erosion separates the diamond particles 50 by weakening the brazing material 90. Thus, to reduce the exposure of the CMP pad dresser 20 to the chemical slurry, the polishing of the workpiece should be stopped and the chemical slurry exiting the pad before the pad dresser 20 is applied. This interruption of the polishing process increases the time required for producing the finished product and is therefore inefficient.

Another drawback to conventional brazing is that the surface tension of the molten alloy metal tends to produce “chunks” of abrasive particles 50 when applied to the substrate 40. Such agglomerates are indicated at 100 and leave gaps 110. This causes the diamond particles 50 to be unevenly distributed throughout, resulting in inefficient grooming. This inefficiency is due to the gap 110, thus creating areas of the CMP pad that remain unconditioned.

Such non-uniform conditioning causes wear areas of the CMP pad to wear out faster than others, depending on the overall result of the non-uniform polishing because the wear areas of the workpiece are polished less effectively than the properly conditioned areas.

Another effect of agglomerating abrasive particles is in the formation of small mounds in the brazing material 90. Small pile formation raises a few diamond particles above the substrate 40 than other abrasive particles. Thus, the elevated protruding particles penetrate deep into the CMP pad, which would require some trimming effect to prevent less abrasive particles from protruding. This also leads to inefficiency and inadequate conditioning.

In contrast to conventional CMP pad dressers, the CMP pad dresser of the present invention provided a uniform dressing of CMP pads. Referring to FIG. 3, there is shown a CMP pad dresser manufactured in accordance with the principles of the present invention. This CMP pad dresser has a plurality of abrasive particles 180 attached to the substrate 40 by the brazing material 90. The abrasive particles 180 can be any good hard material. It includes certain materials and is not limited to diamond, polycrystalline diamond (PCD), cubic boron nitride (CBN) and polycrystalline cubic boron nitride (PCBN).

As also shown in FIG. 3, there is a corrosion resistant layer 130. This corrosion resistant layer is formed on the surface of the CMP pad dresser after the abrasive particles 180 are attached to the substrate 40 through the method described below. The corrosion resistant layer 130 is made of diamond, or other good hard material such as diamond-like carbon. In a preferred embodiment, the corrosion resistant layer 130 is comprised of at least about 70% diamond in the matrix of non-diamond carbon. Corrosion resistant layer 130 may be of any thickness, but is generally in the range of 0.5-3 μm. In a preferred embodiment, the corrosion resistant layer 130 has a thickness of about 1. Such thin corrosion resistant layer 130 may be manufactured by a physical vapor deposition (PVD) method. PVD methods, such as using a cathode arc with graphite cathode, are known through the prior art and can be used to fabricate the corrosion resistant layer 130.

The advantages provided by the corrosion resistant layer 130 can effectively "seal" the processing surface and also seal other desired surfaces of the CMP pad dresser that are susceptible to chemical erosion. As a seal, the corrosion resistant layer 130 protects the brazing material 90 from chemical erosion by the abrasive chemical slurry held in the CMP pad. This protection allows the CMP pad dresser 30 to continuously dress the CMP pad even when the pad polishes the workpiece, eliminating the manufacturing process interruptions that are essential for extending the life of conventional CMP pad dressers. do. Continuous and uniform dressing of the CMP pads enables more products to be produced, extending the life of the CMP pads and improving their efficiency.

One method of attaching abrasive particles 180 to the substrate 40 is shown in FIGS. 4-6. First, a template 140 consisting of holes 150 is placed on the brazing alloy sheet 190. The use of the template controls that the template with holes is designed in a predetermined pattern to place the abrasive particles 180 in place. The pattern for placing the abrasive particles can be selected by one of ordinary skill in the art to suit the particular requirements for the conditions under which the CMP pad dresser is used.

In one embodiment of the present invention, the distribution of the holes is a grid with gaps between the predesigned holes to form a certain sized gap between the abrasive grit 180 bonded by the brazing material 90. ) Consists of patterns. In a preferred embodiment, the grit is evenly spaced at a distance of about 1.5 to about 10 times the size of each grit.

After the template 140 is placed on the brazing alloy sheet 190, the hole 150 is filled with abrasive particles 180. The hole 150 is preferably predesigned to a size such that only one abrasive particle is filled in each hole. Although abrasive particles or grit of any size can be accommodated, in one embodiment of the present invention, the particle size is about 100 to 350 micrometers in diameter.

In another embodiment of the present invention, the size of the holes in the template is required to obtain a pattern of abrasive particles that vary in size or are substantially uniform in size. In a preferred embodiment, the holes of the template are sufficient to select only grit within 50 micrometers in size of each other. The uniformity of this grit size is due to the uniformity of CMP pad trim as the processing load of each abrasive particle is evenly distributed. In turn, the uniform work load distribution reduces the stress on the individual abrasive particles and effectively extends the life of the CMP pad dresser 30.

After the hole 150 of the template 140 is filled with the grit 180, any excess abrasive particles are removed and a flat surface 160 is applied to the abrasive particles 180. The flat surface 160 should be made of a strong and hard material that can push the abrasive particles 180 down into the brazing alloy sheet 190. Such materials generally include, but are not limited to, steel, iron, alloys thereof, and the like.

The abrasive particles 180 are shown to be included in the brazing alloy sheet 190 in FIG. 6. Since the surface 160 is flat, the abrasive particles 180 will extend away from the substrate 40 at a uniform distance. This distance will be determined by the thickness of the template 140, and in a preferred embodiment, each abrasive particle will extend within 50 micrometers of this distance.

As shown in FIGS. 4-6, the abrasive particles 180 are round. However, in Figure 3 they were sharp. The scope of the present invention includes abrasive particles of any shape including a child shape, or particles forming a natural shape. However, in the preferred embodiment, the abrasive particles 180 have sharp points or edges extending in a direction away from the substrate 40.

After the abrasive particles 180 are included in the brazing alloy sheet 190, the sheets are attached to the substrate 40, as shown in FIG. 3. The brazing alloy used may be any brazing material known through the prior art, but nickel alloys containing at least 2% chromium by weight are preferred.

Since the abrasive particles 180 were included in the brazing alloy sheet 190, the surface tension of the liquid brazing material is insufficient to generate agglomerate of particles. In addition, an increase in the thickness of the brazing material occurs at a much lower level so that no “mass” is formed. In contrast, the brazing material forms a concave surface between each abrasive particle that provides significant support and slurry clearance. Finally, in a preferred embodiment, the thickness of the brazing alloy sheet 190 is selected to be about 10 to about 90% of each abrasive particle for protruding over the outer surface of the brazing material 90.

As a result of the method for including the abrasive particles 180 in the braze alloy sheet 190, a uniform space 120 was formed. In addition, the abrasive grit 180 will extend to a distance or uniform height above the substrate 40, meaning when applied to a CMP pad, and will project to a uniform depth inside the pad fiber. Uniform spacing and uniform protrusions cause the CMP to be uniformly dressed and trimmed, thereby increasing the polishing efficiency of the CMP pad and extending its service life.

In order to provide a better understanding of the present invention, embodiments are provided below. These embodiments are not meant to be used as limitations of the scope of the invention.

Example 1

Two CMP pad dresser discs were made as follows. The brazing alloy sheet is made of a mixture of metal powder and organic binder between two rollers. Diamond grits of MBS970 manufactured by General Electric, Inc., with average sizes of 135 and 225 micrometers, were embedded by the template into the brazing alloy sheet. In the template used, diamond grits were formed in a grid pattern with a distance of 900 micrometers between each diamond grit.

After placing diamond grit particles inside the brazing alloy sheet, the acrylic glue was used to attach the sheet to the metal substrate. The assembly was then brazed in a vacuum furnace at a temperature of 1000 ° C. As a result, two flat disc products having a diameter of about 100 millimeters and a thickness of about 6.5 millimeters were obtained.

These discs were then tested in comparison to discs in which at least five times the amount of diamond particles were arranged in a disordered shape. The disc was used to dress 28 inch CMP pads mounted on the STRAUSBOUGH machine. This pad was used to polish 8 inch silicon wafers in alkaline slurry. The test results are shown in Table 1 below. DG 135-900 is a disk with 135 micrometer particles spaced at a distance of 900 μm, and the DG 225 is a disk with 225 micrometer particles spaced at a distance of 900 μm.

As can be seen from Table 1, the performance of the two disks with uniformly arranged particles far outperformed the disks with diamonds arranged randomly. In addition, disks with 135 micron particles nearly doubled the disk's disordered disk performance.

Example 2

Two additional diamond disks were made by the method of Example 1. However, diamonds of 225 and 275 micrometers in size were used. In addition, each disk was coated with a diamond-like carbon coating to a thickness of 1 micrometer to protect the brazing material. This diamond-like carbon film was deposited by the cathode arc method.

This disk was then compared to conventional diamond disks by dressing CMP pads mounted on an Applied material machine (Mirra) for grinding 8 inch silicon wafers. This pad was immersed in an acid slurry of 3.0 pH. Dressing was carried out simultaneously while polishing was occurring. The results are shown in Table 2 below. DG 275-700 is a disk containing 700 μm grit with uniformly spaced dimensions of 275 micrometers. DG 225-700 is a disk containing 700 μm grit with a uniformly spaced size of 225 micrometers, and AT is a conventional diamond disc containing disorderly distributed grit without a protective coating.

As can be seen from Table 2, conventionally manufactured diamond disks cannot maintain the removal rate of the polished wafer. In addition, the metal bonds were maintained in the acidic atmosphere of the polishing slurry only for 1.5 hours. After that, diamonds began to fall off and caused a lot of scratches on expensive wafers. However, the disc of the present invention was maintained for at least 30 hours in an acidic atmosphere. Such a range of lifetimes resulted in better CMP pad dressing results, with much lower overall costs and higher yields for manufacturing wafers than the prior art. Of course, it should be understood that the embodiments as described above are only explained by the application of the principles of the present invention.

Many modifications and other arrangements may be made by those skilled in the art without departing from the scope and scope of the invention and the claims are intended to limit such modifications and arrangements. Thus, although the invention has been described in more detail above in connection with what is considered the most practical and preferred embodiment of the invention, it is intended to vary in size, material, shape, form, function, method of operation, assembly, and use. It will be understood by those skilled in the art that many changes that are included without limitation can be made without departing from the concepts and principles described herein.

As noted above, the present invention results in a method for including abrasive particles in a braze alloy sheet, whereby a uniform space is created, extending at a uniform distance or height above the substrate when the abrasive grit is applied to the CMP pad, As it protrudes to a uniform depth inside the fiber, the CMP is uniformly dressed and trimmed with uniform space and uniform protrusion to increase the polishing efficiency of the CMP pad and extend its service life.

Claims (48)

A chemical mechanical polishing (CMP) pad dresser comprising a plurality of abrasive particles having a size within a specific size range attached to a substrate member, wherein the abrasive particles are evenly spaced and extend at a constant height above the substrate member. 2. The chemical mechanical polishing (CMP) pad dresser according to claim 1, wherein the abrasive particles are crystal grains of diamond or cubic boron nitride in the form of single crystal or polycrystalline. The chemical mechanical polishing (CMP) pad dresser of claim 1, wherein the specific size range is from 50 to 250 micrometers. 2. The chemical mechanical polishing (CMP) pad dresser of claim 1, wherein the abrasive particles are of uniform size, with all abrasive particles having a size difference within 10% of each other. The chemical mechanical polishing (CMP) pad dresser of claim 1, wherein the plurality of uniformly spaced abrasive particles are distributed in a predetermined pattern such that a distance is maintained between the two particles. 6. The chemical mechanical polishing (CMP) pad dresser according to claim 5, wherein the distance between each particle is 1.5 to 10 times the average particle size. 6. The chemical mechanical polishing (CMP) pad dresser of claim 5, wherein the pattern is a grid. The chemical mechanical polishing (CMP) pad dresser of claim 1, wherein the height above the substrate is a uniform height where all abrasive particles extend within 50 micrometers. 2. The chemical mechanical polishing (CMP) pad dresser according to claim 1, wherein the height on the substrate is at least 70 mu m. The chemical mechanical polishing (CMP) pad dresser of claim 1, wherein the abrasive particles are euhedral crystalline. The chemical mechanical polishing (CMP) pad dresser of claim 1, wherein the abrasive particles have a predetermined shape. The chemical mechanical polishing (CMP) pad dresser of claim 1, wherein the abrasive particles have edges or pointed points oriented away from the substrate. The chemical mechanical polishing (CMP) pad dresser of claim 1, wherein the substrate is made of a metallic material. 13. The chemical mechanical polishing (CMP) pad dresser of claim 12, wherein the metal material is stainless steel. The chemical mechanical polishing (CMP) pad dresser of claim 1, wherein the abrasive particles are attached to the substrate by a brazing material. 15. The chemical mechanical polishing (CMP) pad dresser of claim 14, wherein the brazing material further comprises a nickel alloy having a chromium content of at least 1 wt%. 15. The chemical mechanical polishing (CMP) pad dresser according to claim 14, wherein the brazing material is thick on the surface of the substrate and 10 to 90% of each abrasive particle is exposed. The chemical mechanical polishing (CMP) pad dresser of claim 1, wherein the substrate is coated with a corrosion resistant layer. 19. The chemical mechanical polishing (CMP) pad dresser of claim 18, wherein the abrasive particle layer is bonded to the substrate by electroplating nickel. 19. The chemical mechanical polishing (CMP) pad dresser of claim 18, wherein the corrosion resistant layer is made of diamond-like carbon. 19. The chemical mechanical polishing (CMP) pad dresser according to claim 18, wherein the diamond-containing carbon contains at least 70% of the diamond-like carbon. 19. The chemical mechanical polishing (CMP) pad dresser of claim 18, wherein the corrosion resistant layer is less than 3 microns thick. 19. The chemical mechanical polishing (CMP) pad dresser of claim 18, wherein the diamond shaped carbon has an atomic carbon content of at least 95%. (a) providing a substrate member, (b) uniformly spaced apart the plurality of abrasive particles on the surface of the substrate, (c) attaching the abrasive particles to the substrate such that each abrasive particle extends at a constant height above the substrate member. 25. The method of claim 24, wherein the abrasive particles are crystal grains of diamond or cubic boron nitride in single or polycrystalline form. The method of claim 24, Step (b) and step (c) further comprise a) placing a template with a pattern of holes formed on the brazing alloy sheet such that the placement of the abrasive particles is controlled by the position of the holes; b) filling the holes of the template with abrasive particles; c) removing abrasive particles that are not in the template hole; d) pressurizing the abrasive particles contained in the holes inside the brazing alloy sheet such that the abrasive particles are partially surrounded by the brazing material; e) removing the template so that the abrasive particles remain on the braze alloy sheet; f) attaching a braze alloy sheet comprising abrasive particles to the substrate; g) method of manufacturing a chemical mechanical polishing (CMP) pad dresser, comprising brazing the product in a vacuum furnace. 27. The method of claim 26, wherein the aperture is sized to accommodate only one abrasive particle. 28. The method of claim 27, wherein the aperture is of a size selected to receive a range of abrasive particles. 25. The method of claim 24, wherein the average size of the abrasive particles is in the range of 50 to 250 micrometers. 25. The method of claim 24, wherein the abrasive particles are of uniform size, wherein all abrasive particles have a size difference within 10% of each other. 27. The method of claim 26, wherein the holes of the predetermined pattern are sufficiently spaced apart to make a constant distance between the two particles. 32. The method of claim 31 wherein the distance between each particle is between 1.5 and 10 times the particle size. 27. The method of claim 26, wherein the pattern of particles is a grid. 25. The method of claim 24, wherein all abrasive particles heighting from the substrate are of uniform height extending within 50 micrometers. 25. The method of claim 24, wherein the abrasive particles are shaped to have a magnetic shape. 25. The method of claim 24, wherein the abrasive particles have a predetermined shape. 25. The method of claim 24, wherein the abrasive particles have edges or sharp points directed away from the substrate. 25. The method of claim 24, wherein the substrate member is made of a metallic material. 39. The method of claim 38, wherein the metal material is stainless steel. 27. The chemical mechanical polishing of claim 26, wherein the braze alloy sheet is prepared by bonding brazing alloy particles with an organic binder and forming the bonded particles into sheets of desired thickness. CMP) Pad Dresser Manufacturing Method. 41. The method of claim 40, wherein forming the braze alloy particles into a sheet is accomplished by rolling, extrusion, or tape casting. 27. The method of claim 26, wherein the brazing material comprises a nickel alloy having a chromium content of at least 1 wt%. 27. The method of claim 26, wherein the brazing alloy sheet has a brazing thickness sufficient to allow exposure in the range of 10 to 90% of each abrasive particle on the brazing material. 25. The method of claim 24, further comprising coating the brazing material and the abrasive particles with a corrosion resistant layer. 45. The method of claim 44, wherein the corrosion resistant layer is made of diamond or diamond-like carbon. 45. The method of claim 44, wherein the corrosion resistant layer has a thickness of less than 3 micrometers. 45. The method of claim 44, wherein the diamond shaped carbon has an atomic carbon content of at least 90%. 48. The method of claim 47, wherein said coating step is accomplished using a cathodic arc method.