JP2002210659A - Finishing tool of chemical/mechanical flatting technology pad of grid-like diamond array - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a finishing tool of a chemical/mechanical flatting technology pad capable of using abrasive grains for uniformly finishing or adjusting the chemical/mechanical flatting technology pad. SOLUTION: This finishing tool of the chemical/mechanical flatting technology pad has the abrasive grains 180 disposed at a uniform interval. Each of the abrasive grains is made of cemented carbide material such as diamond. The abrasive grains are adhered to a substrate 40 additionally covered with a rust preventing layer 130. The rust preventing layer prevents erosion of a brazed alloy 90 by a chemical slurry used in relation to the pad. The prevention of the chemical erosion allows the finishing tool to finish the pad while the pad polishes a work piece. The abrasive grains are not only disposed at the uniform interval on the substrate 40 and but also extended from the substrate in a uniform distance, so that the chemical/mechanical flatting technology pad can be groomed and finished both horizontally and vertically. A manufacturing method of the finishing tool of the chemical/mechanical flatting technology pad is also disclosed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

FIELD OF THE INVENTION The present invention relates generally to an apparatus and method for finishing and conditioning a chemical mechanical planarization pad, and more particularly to a chemical mechanical planarization pad. A finishing disc comprising a cemented carbide material such as diamond or cubic boron nitride for finishing and conditioning. More particularly, the present invention relates to a finished disc having a large number of equally spaced abrasive particles coated with a thin film of diamond-type carbon to protect against chemical erosion.

[0002]

2. Description of the Related Art In many industries, chemical mechanical planarization techniques (Chemical Mech.
anical Planarization), that is, chemical mechanical polishing. In particular, the manufacturing industry has begun to rely heavily on chemical mechanical planarization techniques for polishing wafers or flakes made of ceramics, silicon, glass, quartz and metal. This polishing method generally requires applying a wafer to a rotating pad made of a strong organic material such as polyurethane. The pad is added with a chemical that can cause a chemical change on the wafer surface and a large amount of abrasive particles that act to physically erode the wafer surface. This slurry is continuously added to a rotating chemical-mechanical planarization technology pad (chemical-mechanical polishing pad), and the wafer is polished in a desired manner by two chemical and mechanical actions acting on the wafer. Is done.

Of particular importance to the quality of the resulting polishing is that the abrasive particles are distributed throughout the pad. The surface of the pad typically retains the particles by means such as voids in the polyurethane or rough texture on the surface of the pad. The flexible pad surface also provides sufficient support for the abrasive to act on the wafer.

[0004] A problem associated with maintaining the texture of the pad surface is the accumulation of abrasive debris from the workpiece, abrasive slurry, and finishing disk. This build-up causes "polishing" or hardening of the pad surface, which reduces the slurry's ability to retain abrasive particles.

Attempts have been made to re-activate the surface of the pad by "carding" it with various devices. This method is known as "finishing" or "conditioning" the chemical mechanical planarization technology pad. Many types of devices and methods have been used for this purpose. One such device is a disk having a plurality of superhard crystal grains, such as diamond particles, attached to a surface or substrate.

[0006] Unfortunately, such diamond disks made in a conventional manner present certain problems. First, the diamond begins to be removed from the disk substrate and becomes trapped on the chemical mechanical planarization technology pad. This will injure the workpiece being polished. Second, conventional disks tend to clump in groups or have irregularly spaced diamonds on the substrate surface. Irregular grouping causes the chemical mechanical planarization pads to have overfinished portions that create wear zones and unfinished portions that create a polished layer. In either case, the polishing efficiency of the pad decreases and irregular polishing occurs. Finally, the diamonds in these disks do not extend uniformly above the substrate surface of the disks. This non-uniformity, in addition, results in a non-uniform finish of the chemical mechanical planarization technology pad, since only those particles that project sufficiently high from the finishing tool will contact the pad. An uneven finish on the pad surface results in uneven or uneven wafers.

[0007] The falling off of diamonds from the disk substrate is due to a poor method of attaching them. When diamond is held on a substrate by electroplated nickel, there is no bonding force other than mechanical fixing of the diamond. Thus, these particles begin to fall off as they are released from the fixation. This withdrawal process is facilitated by chemical erosion of the chemical slurry on the electroplating material.

On the other hand, when diamond is brazed to a substrate, this chemical force holds the diamond more firmly. However, the acid in the chemical slurry rapidly breaks down the brazing and removes the diamond. For this reason, the polishing process is stopped and then restarted during the finishing to minimize the exposure of the brazing to the chemical.
This alternating sequence of polishing and finishing is time consuming and therefore also inefficient.

In view of the foregoing, there is provided a chemical mechanical planarization pad finishing tool which provides uniform combing or grooming of a chemical mechanical planarizing pad. ) Is desired. In addition, a chemical mechanical planarization pad finishing tool that grooms the chemical mechanical planarization pad to a uniform height is more desirable. In addition, there is a further need for a chemical mechanical planarization pad finishing tool that does not allow diamond particles to escape. Finally, it resists acid degradation of chemical slurries, and
A chemical mechanical planarization pad finishing tool that continuously completes a chemical mechanical planarization pad even while polishing in an acidic slurry is performed is highly desirable.

[0010]

Accordingly, it is an object of the present invention to provide a chemical mechanical planarization pad finish that can use abrasive particles to uniformly finish or condition the chemical mechanical planarization pad. To provide tools.

It is another object of the present invention to provide a chemical mechanical planarization pad finishing tool in which abrasive particles are less likely to escape.

It is a further object of the present invention to provide a method for producing a chemical mechanical planarization pad which is capable of being continuously finished even under polishing action in an acidic slurry. It is to provide a chemical-mechanical planarization technology pad finishing tool having resistance.

Yet another object of the present invention is to provide a chemical barrier that prevents the dissolution or decomposition of elements from the disk that contaminate the wafer being polished.

It is yet another object of the present invention to provide a method for uniformly finishing or conditioning a chemical mechanical planarization technology pad.

It is yet another object of the present invention to provide a chemical mechanical planarization pad finishing tool that has a tendency to shed abrasive particles even when the pad is immersed in an acidic slurry. It is to provide a method for reducing the above.

[0016]

Means for Solving the Problems, Functions and Effects of the Invention
The purpose mentioned above and other purposes not specifically mentioned are:
The invention is accomplished in a specific embodiment of the illustrated chemical mechanical planarization pad finishing tool, in which the chemical mechanical planarization pad finishing tool comprises a substrate member or a uniform mutual spacing applied to the substrate. The particles generally comprise a hard material in a single or polycrystalline form, such as diamond or cubic boron nitride.

In one method of manufacturing or forming a pad finishing tool of the present invention, a brazing powder and an organic binder are thoroughly mixed to produce a dough. . The dough is then stretched between two rollers to make a flexible sheet of brazing alloy. Next, the abrasive particles are uniformly distributed on the braze alloy on the sheet using a template including a plurality of holes having the same spacing. The holes in the template are larger than the dimensions of a single abrasive particle or "coarse grain" but smaller than the dimensions of two of them. When all the holes are filled with abrasive particles, the excess abrasive particles are removed and the abrasive particles are pressed onto the brazing alloy sheet to embed them in the brazing alloy sheet. Next, the template is removed and a brazing alloy containing abrasive particles is adhered to the substrate with an acrylic adhesive. Finally, the entire assembly is brazed in a vacuum furnace to perform a brazing process to attach the abrasive particles to the substrate.

Alternatively, the abrasive particles can be attached to the substrate with an acrylic adhesive using the template described above. Next, brazing alloy particles are poured down onto the abrasive particles and the substrate. Finally, the entire assembly is heated in a vacuum brazing furnace to complete the brazing process and firmly bond the abrasive particles to the substrate.

A desired arrangement pattern can be obtained by using the template to arrange the abrasive particles in a regulated manner. This pattern is almost every possible pattern, but most importantly,
It is to provide the possibility to even out the spacing of the abrasive particles on the substrate. In addition, the use of a template having uniformly sized holes ensures uniform dimensions of each abrasive particle. Finally, a flat surface for pressing the abrasive particles against the substrate is used to create a uniform height of the abrasive particles projecting above the surface of the substrate. This uniform height of the abrasive particles ensures that the chemical mechanical planarization technology pad is plowed or finished to a uniform depth. Further, by uniformly dispersing the abrasive particles throughout the substrate, it is possible to uniformly finish the entire surface of the pad.

After the abrasive particles are fixed to the substrate, a thin film or plating of additional rust inhibitor material is applied to the chemical mechanical planarization pad finishing tool. This film effectively "seals" or "seals" the surface of the chemical mechanical planarization technology pad finishing tool. This seal protects the abrasive particles and brazing or other bonding agents and also makes the abrasive slurries, especially those slurries containing acids, less susceptible to chemical attack from the chemicals. When the surface of the chemical mechanical planarization technology pad finishing tool is less susceptible to chemical erosion, the abrasive particles are also less likely to fall out. Therefore, the chemical-mechanical planarization technology pad finishing tool, while polishing, protects the adhesive that adheres the abrasive particles to the substrate from chemical erosion,
The chemical mechanical planarization technology pad can be continuously finished.

[0021]

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings.

A chemical mechanical planarization technology pad finishing tool according to the present invention (chemical mechanical polishing pad finishing tool);
Prior to disclosing and describing the attendant methods of use and manufacture, the present invention is not limited to the particular methods and materials disclosed herein, but extends to equivalents as recognized by one of ordinary skill in the relevant art. It will be understood.
It should also be understood that the techniques employed herein are used only for the purpose of describing particular embodiments and are not intended to be limiting.

[0023] As used herein, the singular forms "a", "an" and "the" include plural referents unless the content clearly dictates otherwise in context. Therefore, "abrasive particles"
Or, reference to "grit" includes one or more abrasive particles or grit.

In describing the present invention, the following terminology will be used in accordance with the definitions set forth below.

"Abrasive particles" used herein,
"Coarse grain" or similar phrases means any hard crystalline, polycrystalline, or mixed material, and includes, but is not limited to, diamond, polycrystalline diamond, cubic boron nitride. And polycrystalline cubic boron nitride.
Furthermore, the terms "abrasive particles", "coarse grains", "diamonds", "polycrystalline diamond", "cubic boron nitride" and "polycrystalline cubic boron nitride" are interchangeable.

As used herein, "substrate" means the base of a chemical mechanical planarization pad finishing tool having a surface to which abrasive particles are bonded. The base may have any shape, thickness, or material, and may include, but is not limited to, metals, alloys, ceramics, and mixtures thereof.

As used herein, "euhedral"
Means an "idiomorphic" or intact natural shape with a growing crystallographic surface.

As used herein, "sharp point" means any narrow vertex that becomes a crystal, including, but not limited to, tubes, ridges, spires and other protrusions.

[0029] As used herein, "metal" means any type of metal, alloy, or mixture thereof,
Including but not limited to steel, iron and stainless steel.

The Applicant has discovered an apparatus for conditioning or improving the efficiency and quality of chemical mechanical planarization technology pads (chemical mechanical polishing pads). Methods for using and manufacturing this device are included herein. The use of the apparatus to condition or finish a pad using chemical mechanical planarization techniques not only increases both the life of the disk and the life of the pad, but also the stability with which the pad is used and, therefore, Both of the throughputs to accomplish that task are improved. In addition, the uniformity and defect rate of the polished wafer are improved.

Referring to FIG. 1, there is shown a conventional chemical mechanical planarization pad finishing tool 10 having a plurality of diamond particles 50 electroplated on a substrate 40. Electroplating material 60 is typically nickel precipitated from an acidic solution. This electroplating method is not only expensive and time consuming, but also environmentally harmful due to the waste material produced by the method.

The electroplated chemical mechanical planarization technology pad finishing tool 10 has a number of disadvantages, as clearly shown in FIG. First, the electroplating material 60 cannot form any chemical bonds with the diamond particles 50. Therefore, the diamond particles 50 are held on the substrate 60 only by a weak mechanical force. This mechanical force is quickly counteracted by the greater frictional forces acting on the diamond particles 50 when the pad finishing tool rubs against the chemical mechanical planarization technology pad, is easily separated from the electroplating material 60, and Plating material 60
Leave an empty space like space 70 inside. This void is immediately filled with post-polishing residues of the workpiece, and chemicals and abrasives from the slurry. However, this deposited residue hardens and, when it separates,
Often, fine scratches are created, reducing the yield of polished wafers.

Since the mechanical force generated by the electroplating material 60 is the only means of holding the diamond particles 50 on the substrate 40, exposure of the diamond particles 50 on the electroplating material must be kept to a minimum. . Therefore, contact between the electroplating material 60 and the chemical mechanical planarization technology pad cannot be avoided. This contact abrades the electroplating material and promotes the separation of diamond particles 50.

In addition, electroplating material 60 tends to grow beyond diamond 50 at certain locations, such as protrusions 80. This overgrowth, in addition to the already low exposure and plugged spacing of the diamond particles 50, makes it difficult, if not impossible, to meaningfully dig into the chemical mechanical planarization technology pad. Without such sinking, the finishing method suffers significant handicap.

Referring to FIG. 2, a conventional chemical mechanical planarization pad having a substrate 40, having diamond particles 50 brazed to the substrate 40, comprising a brazing material 90 and a conventional brazing A chemical mechanical planarization technology pad 20 using the technology is shown. Brazing materials include alloys mixed with carbide formers. The carbide former can chemically bond the diamond particles 50 to the brazing material 90 and then bond to the substrate 40. This mating arrangement is
thachment), but with some undesirable side effects.

The brazing material 90 must be kept to a minimum so that it does not completely cover the diamond particles 50. Thus, the diamond particles 50 are wrapped with only a thin film or plating of the brazing material 90. This problem is constituted by the fact that typical brazing materials are mechanically weak. This mechanical weakness compensates for the chemical bonding force between the diamond particles 50 and the brazing material 90 because the brazing material itself breaks at the separated diamond particles 50.

Another problem with the brazing material 90, like the electroplated nickel described above, is that it is very susceptible to chemical attack by the abrasive slurry. This chemical erosion causes the diamond particles 50 to separate, weakening the brazing material 90. Therefore,
Polishing of the workpiece must be suspended to reduce the exposure of the chemical mechanical planarization technology pad finishing tool 20 to the chemical slurry, and the pad finishing tool 20 must be suspended before the pad finishing tool 20 is applied. The chemical slurry must be able to be removed from the pad. This suspension during the polishing process increases the time required to manufacture the final product and is therefore inefficient.

Another obstacle to conventional brazing is that the surface tension of the molten alloy tends to "aggregate" the abrasive particles 50 when applied to the substrate 40. This densification is shown at 100 away from the gap 110. The overall result is that the distribution of diamond particles 50 is not uniform, which makes grooming less efficient. This inefficiency is due to gaps 110 which create areas that remain unadjusted in the chemical mechanical planarization technology pad.

This non-uniform adjustment causes the chemical mechanical planarization technology pad to wear out faster than other areas, so that generally the worn out area is properly adjusted. The workpiece is subject to uneven polishing due to less efficient polishing.

Another consequence of the dense abrasive particles is that the brazing material 90 forms a plurality of peaks. The formation of the peaks pushes some diamond particles to a higher height above the substrate 40 than other abrasive particles. For this reason, the highest projecting abrasive particles are deeply immersed in the chemical mechanical planarization technology pad, and these abrasive particles hinder the exertion of the grooming effect of the abrasive particles that are less entrapped. This also results in inefficiencies and inconsistencies in adjustment.

Significantly different from the conventional chemical mechanical planarization pad finishing tool, the present invention allows for uniform finishing of the chemical mechanical planarization pad. Referring to FIG. 3, there is shown a chemical mechanical planarization pad finishing tool formed in accordance with the principles of the present invention.
This chemical mechanical planarization technology pad finishing tool has a plurality of abrasive particles 180 adhered or secured to a substrate member or substrate 40 with a brazing material 90. Abrasive particles 1
80 is made of any super-hard material. Preferred materials include, but are not limited to, diamond, polycrystalline diamond, cubic boron nitride, and polycrystalline cubic boron nitride.

FIG. 3 shows the rust prevention layer 130. The rust preventive layer is formed on the entire surface of the chemical mechanical planarization pad finishing tool after the abrasive particles 180 are bonded to the substrate 40 by a method described below.
Rust stop layer 130 is made of other super-hard material such as diamond or diamond-type carbon. In a preferred embodiment, rust inhibitor layer 130 includes at least about 70% diamond in a non-diamond carbon matrix. The thickness of the rust preventive layer 130 can be arbitrarily determined, but is usually in the range of 0.5 to 3 μm. In a preferred embodiment, rust stop layer 130 has a thickness of about 1 μm. Such a thin rust prevention layer 130 can be formed by a physical vapor deposition (PVD) method. Physical vapor deposition methods utilizing the cathodic arc of a graphite cathode are known in the art and can be used to form the rust stop layer 130.

The advantages provided by the rust stop layer 130 are:
The anti-rust layer effectively "seals" the working surface,
Seal any other surface of the chemical mechanical planarization pad finishing tool that is susceptible to chemical erosion. As a sealant, the rust stop layer 130 protects the brazing material 90 from chemical attack by the polishing chemical slurry held in the chemical mechanical planarization technology pad. This protection allows the chemical mechanical planarization pad finishing tool 30 to continuously finish the pad while the chemical mechanical planarization pad is polishing a work piece, thus reducing the conventional chemical mechanical planarization. Planarization techniques can eliminate the suspension of production taken to extend the life of the pad finishing tool. The continuous and uniform finish of the chemical mechanical planarization technology pad allows for greater manufacturing output and also increases the life and efficiency of the chemical mechanical planarization technology pad.

The method of bonding the abrasive particles 180 to the substrate 40 is shown in FIGS. First, the template 140 having the holes 150 is placed on the brazing alloy 90. The use of the template allows the placement of the abrasive particles 180 to be regulated by designing a template having a desired pattern of holes. The pattern for abrasive particle placement can be selected by those skilled in the art to meet the specific needs of the conditions under which the chemical mechanical planarization pad finishing tool will be used.

In one aspect of the invention, the distribution of holes is such that the abrasive grains 1 joined by the brazing alloy 90
80 in a grid pattern with the spacing between the holes defined to form the desired amount of spacing between them. In a preferred embodiment, the grit is uniformly spaced at a distance of about 1.5 to about 10 times the size of each grit.

The template 140 is brazed to the alloy sheet 9
After being placed on the top 0, the holes 150 are filled with abrasive particles 180. The holes 150 have predetermined dimensions, so that only one abrasive particle fits in each hole. Abrasive particles of any size are acceptable, i.e. grit,
In one aspect of the invention, the size of the particles is from about 100 micrometers to about 350 micrometers (about 0.1 mm to about 0.35 mm) in diameter.

In another aspect of the invention, the dimensions of the holes in the template are custom made to obtain a pattern of abrasive particles of different or substantially uniform dimensions. In a preferred embodiment, the holes in the template are sufficient to select only coarse particles having a size within 50 micrometers of each other. This uniformity of grit size contributes to the grooming uniformity of the chemical mechanical planarization technology pad so that the workload of each abrasive particle is evenly distributed. Also, a uniform workload reduces the pressure of individual abrasive particles and increases the useful life of the chemical mechanical planarization technology pad finishing tool 30.

The holes 150 of the template are all coarse grains 180
, The excess abrasive particles are removed and a flat surface 160 is applied to the abrasive particles 18. Flat surface 160
Shows that this is the abrasive particles 180 in the brazing alloy sheet 90.
It must be a strong and rigid material so that it can be pressed. Such materials typically include, but are not limited to, steel, iron, alloys thereof, and the like.

The abrasive particles 180 are shown in FIG. 6 as being embedded in the braze alloy sheet 90. Since the surface 160 is flat, the abrasive particles 180 extend a certain distance from the substrate 40. This distance is determined by the thickness of the template 140, and in the preferred embodiment, each abrasive particle extends a distance within 50 micrometers.

The abrasive particles 180 shown in FIGS. 4 to 6 are rounded. However, it is pointed in FIG. The scope of the present invention includes abrasive particles of any shape, including self-shaped or natural shaped particles. However, in a preferred embodiment, the abrasive particles 180 have sharp points or substrate 4
It has edges or edges extending away from zero.

Abrasive particles 180 are brazed to alloy sheet 19
After embedding in 0, the sheet is bonded to the substrate 40 as shown in FIG. The brazing alloy used may be any brazing alloy known in the art, but is preferably a nickel alloy having a chromium content of 2% by weight or more.

Because the abrasive particles 180 are embedded in the brazing alloy 90, the surface tension of the liquid brazing alloy is not sufficient to cause a consolidation of the particles. In addition, the degree of brazing is small and no "mountains" are formed. Rather, the brazing creates a concave surface between each abrasive particle, which provides meaningful support and slurry rejection. Finally, in a preferred embodiment, the thickness of the brazing alloy sheet 90 is selected between about 10% and about 90% of each abrasive particle to protrude above the outer surface of the brazing material 90. You.

The abrasive particles 18 in the brazing alloy sheet 90
As a result of the method for embedding zeros, a uniform space 120 is formed. In addition, the abrasive grits 180 extend a certain height or distance above the substrate 40 so that when applied to a chemical mechanical planarization technology pad, they are evenly distributed within the fibers of the pad. Protruding to a certain depth. The uniform spacing and uniform protrusions ensure that the chemical mechanical planarization pad is evenly finished or groomed, and that this is the polishing of the chemical mechanical planarization pad. Increase efficiency and extend its useful life.

For a better understanding of the invention, some examples are given below. These examples in no way limit the scope of the invention.

EXAMPLE 1 Two chemical mechanical planarization technology pad finishing disks are manufactured as follows. The mixture of metal powder and organic binder is spread flat to make a sheet of brazing alloy. 13
A diamond coarse MBS970 from General Electric having an average size of 5 micrometers and 225 micrometers is embedded in the brazed alloy sheet using a template. The template used formed the diamond grit in a grid pattern having a diamond grit spacing of 900 micrometers.

After placing the diamond grit in the brazing alloy sheet, the sheet was attached to a metal substrate using an acrylic adhesive. The assembly was then brazed at 1000 ° C. in a vacuum furnace. The result was two flat disks having a diameter of about 100 millimeters and a thickness of about 6.5 millimeters.

Next, with respect to these discs, a test was conducted on discs having an arrangement of diamond particles five times or more in an arbitrary shape. These discs were installed on a STRAUSBOUGH machine approximately 71 cm (28 cm).
Inches) chemical mechanical planarization technology used to finish the pad. 8 inches in alkaline slurry
The pad was used to polish a silicon wafer. The results of the test are shown in Table I below. DG 1
35-900 is a disk with 135 micrometer particles separated by a distance of 900 μm, and DG 2
25 is a disk with 225 micrometer particles separated by a distance of 900 μm.

[0058]

[Table 1]

As can be seen, both disks having a uniform grain arrangement performed significantly better than disks having randomly arranged diamonds. In addition, disks with 135 micron particles were nearly twice as powerful as random particle disks.

Example 2 Two additional diamond disks were produced by the method of Example 1. However, 225 micrometers and 27
A 5 micron diamond size was used. In addition, each disk was coated with a 1 micrometer thick diamond-type carbon coating to protect the braze alloy. The diamond type carbon film was deposited by a cathodic arc method.

Next, an applied material machine for polishing an 8-inch silicon wafer.
e) These discs were compared to conventional diamond discs by finishing a chemical mechanical planarization technology pad mounted on (Mira). The pad
Dipped in an acidic slurry of H3. The finishing was performed at the original position while the polishing was being performed. The results are shown in Table 2 below. DG 275-700 is 700
It contains coarse particles of 275 micrometers in size, uniformly spaced in μm. 700 μm for DG 225-700
AT is a conventional diamond disc containing 225 micrometer sized grit, and AT containing randomly distributed grit without a protective coating.

[0062]

[Table 2]

As can be seen from Table 2, conventionally produced diamond disks were unable to maintain the removal rate of polished wafers. Furthermore, only 1.5% of the metal bond remained in the acidic atmosphere of the polishing slurry.
It was time. Later, the diamonds fell and began to cause numerous scratches on the expensive wafer. However, the disks of the present invention remained in the acid for over 30 hours. Such lifetimes can result in significant good finishing of the chemical-mechanical planarization technology pads, and make a significant improvement over the prior art in overall cost and wafer manufacturing yield. Of course, it will be understood that the above-described embodiments only illustrate the application of the principles of the present invention.

Many modifications and alternative arrangements may be made by those skilled in the art without departing from the spirit and scope of the invention, and the appended claims are intended to cover such modifications and arrangements. It covers. Thus, while the invention has been elaborated and elaborated on in what is believed to be the most practical and preferred embodiment in the future, those skilled in the art will appreciate that various dimensions, It will be apparent that many changes can be made without departing from the principles and concepts described above, including materials, shapes, forms, functions, methods of operation, assemblies and uses.

[Brief description of the drawings]

FIG. 1 is a side view of a conventional chemical mechanical planarization pad finishing tool employing an electroplating method for bonding diamond to a disk substrate.

FIG. 2 is a side view of a conventional chemical mechanical planarization technology pad finishing tool formed using a conventional brazing method for bonding diamond particles to a disk substrate.

FIG. 3 is a side view of a chemical mechanical planarization pad finishing tool formed in accordance with the principles of the present invention.

FIG. 4 is a side view of a braze alloy sheet having a template for placing abrasive particles thereon according to the principles of the present invention.

FIG. 5 is a side view of a braze alloy sheet having a template on a surface and abrasive particles filling the holes of the template. A flat surface used in pressing abrasive particles onto the brazing alloy sheet in accordance with the principles of the present invention is shown.

FIG. 6 is a side view of a braze alloy sheet having pressed abrasive particles in accordance with the principles of the present invention.

[Explanation of symbols]

 Reference Signs List 30 chemical mechanical planarization technology pad finishing tool 40 substrate 90 brazing material 130 rust-proof layer 140 template 150 template hole 160 flat surface 180 abrasive particles

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) B24D 3/06 B24D 3/06 CB C09K 3/14 550 C09K 3/14 550F 550D H01L 21/304 622 H01L 21/304 622F

Claims (48)

[Claims] 1. A method, comprising: a plurality of abrasive particles having dimensions within a desired size range, wherein the abrasive particles are uniformly spaced and uniform to a predetermined height above a substrate member. Attached to the substrate member so as to extend,
Chemical mechanical polishing pad finishing tool. 2. The chemical mechanical polishing pad finishing tool according to claim 1, wherein said abrasive particles are crystalline particles of diamond or cubic boron nitride and are in a single crystal or polycrystalline form. 3. The chemical mechanical polishing pad finishing tool according to claim 1, wherein said dimensional range is between 50 and 250 micrometers. 4. The chemical mechanical polishing of claim 1 wherein said abrasive particles are substantially uniform in size such that all abrasive particles have a size within 10% of each other. Pad finishing tool. 5. A plurality of uniformly spaced abrasive particles are distributed according to a predetermined pattern such that a predetermined distance between any two abrasive particles is maintained. The chemical-mechanical polishing pad finishing tool of claim 1, wherein the polishing pad finishes. 6. A chemical mechanical polishing pad finishing tool according to claim 5, wherein the predetermined distance between each of the particles is about 1.5 to 10 times the average size of the particles. 7. The chemical mechanical polishing pad finishing tool according to claim 5, wherein said predetermined pattern is a grid. 8. The chemical mechanical polishing pad finishing tool according to claim 1, wherein the predetermined height above the substrate is a uniform height extending within 50 micrometers of all abrasive particles. . 9. The chemical mechanical polishing pad finishing tool according to claim 1, wherein the predetermined height above the substrate is not less than 70 μm on average. 10. The chemical mechanical polishing pad finishing tool according to claim 1, wherein said abrasive particles have a self-shaped crystal shape. 11. The chemical mechanical polishing pad finishing tool according to claim 1, wherein the abrasive particles have a predetermined shape. 12. The abrasive particles having sharp points or edges directed away from the substrate.
6. The chemical mechanical polishing pad finishing tool according to claim 1. 13. The substrate according to claim 1, wherein said substrate is made of a metal material.
6. The chemical mechanical polishing pad finishing tool according to 4. 14. The chemical mechanical polishing pad finishing tool according to claim 12, wherein said metallic material is stainless steel. 15. The chemical mechanical polishing pad finishing tool of claim 1, wherein said abrasive particles are attached to said substrate by a brazing alloy. 16. The brazing alloy further comprises a nickel alloy having chromium in an amount of at least about 1% by weight.
The chemical mechanical polishing pad finishing tool of claim 14. 17. The brazing alloy according to claim 14, wherein the brazing alloy is on the surface of the substrate at a predetermined thickness such that each abrasive particle is exposed between about 10-90% thereof. A chemical mechanical polishing pad finishing tool. 18. A chemical mechanical polishing pad finishing tool coated with a rust inhibitor layer. 19. The chemical-mechanical polishing pad finishing tool of claim 18, wherein the abrasive particle layer is bonded to the substrate by electroplated nickel. 20. The chemical mechanical polishing pad finishing tool according to claim 18, wherein said rust stop layer comprises diamond-type carbon. 21. The diamond-type carbon according to claim 18, wherein at least 70% is contained in the diamond joint.
6. The chemical mechanical polishing pad finishing tool according to claim 1. 22. The chemical-mechanical polishing pad finishing tool of claim 18, wherein said rust stop layer has a thickness of about 3 micrometers or less. 23. The chemical mechanical polishing pad finishing tool of claim 18, wherein said diamond-type carbon has an atomic carbon content of at least about 95%. 24) a) providing a substrate member; b) disposing a plurality of abrasive particles at uniform intervals on a surface of the substrate member; c) providing each abrasive particle with the substrate member. A method of manufacturing a chemical mechanical polishing pad finishing tool, comprising: attaching the abrasive particles to the substrate member such that the abrasive particles extend to a predetermined height above. 25. The method of claim 24, wherein the abrasive particles are diamond or cubic boron nitride crystalline particles and are in a single crystal or polycrystalline form. Method. 26. The steps a) and c) further include: a) brazing a template having a predetermined pattern of a plurality of holes such that the abrasive particles are regulated by the location of the holes. Placing on a sheet of alloy; b) filling the holes of the template with abrasive particles; c) removing abrasive particles that are not in the holes of the template; d) removing the abrasive particles from within the brazing alloy. Pressing the abrasive particles contained in the holes against the brazing alloy sheet so as to begin to be partially embedded in the brazing alloy sheet; e) so that the abrasive particles remain in situ on the brazing alloy sheet; Removing the template; f) attaching the brazing alloy sheet containing the abrasive particles to a substrate; and g) brazing the resulting product in a vacuum furnace. Including
A method for manufacturing a chemical mechanical polishing pad finishing tool according to claim 24. 27. The method of claim 26, wherein the holes have dimensions sufficient to accommodate only one abrasive particle. 28. The chemical mechanical polishing pad finishing tool of claim 27, wherein said holes have predetermined dimensions selected to accommodate a predetermined range of abrasive particles. Production method. 29. Each abrasive particle has an average size in the range of about 50 to 250 micrometers.
The method for producing a chemical mechanical polishing pad finishing tool according to claim 1. 30. The chemical mechanical polishing pad finish of claim 24, wherein said abrasive particles are substantially uniform in size such that all abrasive particles have a size of 10% of each other. Tool manufacturing method. 31. The chemistry of claim 26, wherein said predetermined pattern of holes is spaced enough to create a predetermined distance between any two particles. For producing mechanical and mechanical polishing pad finishing tools. 32. The predetermined distance between each particle is:
32. The particle is 1.5 to 10 times the size of the particle.
The method for producing a chemical mechanical polishing pad finishing tool according to claim 1. 33. The method of claim 26, wherein the predetermined pattern of holes is a grid. 34. The chemical mechanical polishing pad of claim 24, wherein the predetermined height from the substrate member is a uniform height where all abrasive particles extend within 50 micrometers. Manufacturing method of finishing tools. 35. The abrasive particles have a self-shaped shape,
A method for manufacturing a chemical mechanical polishing pad finishing tool according to claim 24. 36. The method of claim 24, wherein the abrasive particles have a predetermined shape. 37. The method of claim 24, wherein the abrasive particles have sharp points or edges directed away from the surface of the substrate. 38. The method according to claim 24, wherein the abrasive particles are formed of a metal material. 39. The method according to claim 38, wherein said metal material is stainless steel. 40. The brazing alloy sheet is manufactured by joining brazing alloy particles with an organic binder and forming the joined particles into a sheet of a desired thickness.
7. The method for producing a chemical mechanical polishing pad finishing tool according to 6. 41. The method of claim 40, wherein the step of forming the brazing alloy particles into a sheet is performed by rolling, extruding or tape casting. 42. The brazing alloy comprises a nickel alloy having chromium in an amount of at least about 1% by weight.
7. The method for producing a chemical mechanical polishing pad finishing tool according to 6. 43. The chemistry of claim 26, wherein said brazing alloy sheet has a brazing thickness sufficient to expose about 10-90% of each abrasive particle above said brazing alloy. For producing mechanical and mechanical polishing pad finishing tools. 44. The method according to claim 24, further comprising coating the abrasive particles and the brazing alloy with a rust inhibitor layer. 45. The method according to claim 44, wherein the rust preventive layer includes diamond or diamond-type carbon. 46. The method of claim 44, wherein the rust stop layer has a thickness of about 3 micrometers or less. 47. The method of claim 44, wherein the diamond-type carbon has an atomic carbon content of at least about 90%. 48. The method according to claim 47, wherein said coating step is performed by using a cathodic arc method.