CN201922355U - Diamond grinding wheel - Google Patents

Diamond grinding wheel Download PDF

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Publication number
CN201922355U
CN201922355U CN2010206654393U CN201020665439U CN201922355U CN 201922355 U CN201922355 U CN 201922355U CN 2010206654393 U CN2010206654393 U CN 2010206654393U CN 201020665439 U CN201020665439 U CN 201020665439U CN 201922355 U CN201922355 U CN 201922355U
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CN
China
Prior art keywords
diamond
grinding wheel
diamond layer
annular
abrasive wheel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010206654393U
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Chinese (zh)
Inventor
刘权
何立民
康春梅
于丽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenyang Liming Aero Engine Group Co Ltd
Original Assignee
Shenyang Liming Aero Engine Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenyang Liming Aero Engine Group Co Ltd filed Critical Shenyang Liming Aero Engine Group Co Ltd
Priority to CN2010206654393U priority Critical patent/CN201922355U/en
Application granted granted Critical
Publication of CN201922355U publication Critical patent/CN201922355U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to the field of alloy grinding tools, in particular to a diamond grinding wheel. The design key points of the diamond grinding wheel are as follows: the diamond grinding wheel comprises a diamond layer and a grinding wheel matrix, and is characterized in that a dovetail groove is arranged on the grinding wheel matrix, and the diamond layer and the grinding wheel matrix are linked through the dovetail groove and bonded through a bonding agent. The diamond layer comprises diamonds, the bonding agent and filling material, wherein the diamond is selected from No.100-No.120, the bonding agent is selected from polyimide resin, and the filling material is selected from No.200 copper powder, zinc oxide and dichromium trioxide. The material of the grinding wheel matrix is selected from ZAl501, the grinding wheel matrix is in the shape of a bowl, and the dovetail groove is arranged on the surface on the upper edge. The diamond grinding wheel can solve the problem that the diamond layer is easy to fall off, and simultaneously provides the high-quality diamond layer; furthermore, the grinding efficiency and the service life of the diamond grinding wheel using a resin bonding agent are improved.

Description

A kind of diamond-impregnated wheel
Technical field
The utility model relates to alloy grinding tool field, is specifically related to a kind of diamond-impregnated wheel.
Background technology
Diamond-impregnated wheel is mainly used in the processing rigid alloy.With respect to other grinding tools following advantage is arranged: (1) grinding efficiency is than common grinding tool height; (2) the very high capacity of heat transmission is arranged, thermal conductivity is about 9~10 times of silicon carbide abrasive particles; (3) has less radius of corner, than being easier to cut machined material.
Diamond-impregnated wheel generally is divided into three kinds: i.e. resinoid bond diamond-impregnated wheel, metal-bonded diamond emery wheel and ceramic bond diamond emery wheel.Wherein two kinds of emery wheels of resinoid bond diamond-impregnated wheel and other are compared, and have that grinding heat is little, self-sharpening good and characteristics such as grinding efficiency height, therefore are applied in widely in the grinding of hard brittle materials such as carbide alloy, pottery and glass.
The resinoid bond diamond-impregnated wheel generally is made up of three parts: abrasive wheel substrate, non-diamond layer and diamond layer.The effect of abrasive wheel substrate is to bear, and supports diamond layer; The non-diamond layer connects abrasive wheel substrate and diamond layer; Diamond layer is the working portion of diamond-impregnated wheel, also is to guarantee the diamond-impregnated wheel grinding efficiency and the key stratum in grinding life-span.If connection is bad between this three, in the emery wheel course of work, each several part just comes off easily, often occurs between diamond layer and the non-diamond layer and come off.
Summary of the invention
The purpose of this utility model is the deficiency that exists at prior art, design a kind of diamond-impregnated wheel, when the solution diamond layer comes off problem easily, a kind of gem grade diamond layer is provided, improve the grinding efficiency and the service life of resinoid bond diamond-impregnated wheel.
The technical scheme that realizes the utility model purpose is:
Abrasive wheel substrate by a diamond layer and a bowl type structure is formed, and main points are that abrasive wheel substrate wall upper surface is provided with rectangle filling mouth and annular dovetail slot, and the bottom surface is provided with a pilot hole;
It is 5mm that described rectangle is filled mouth long, and wide is 4mm, the wide 2mm of annular dovetail slot, dark 1mm, the dovetail angle is 20 °, diamond layer be filled into that rectangle on the abrasive wheel substrate is filled mouthful and annular dovetail slot in and bond the material selection ZAl501 of abrasive wheel substrate by binding agent;
Described binding agent is selected the polyimide resin powder for use;
Described diamond layer is made up of diamond, bond and filler, and wherein diamond is selected 100#~120# for use, and bond is selected polyimide resin for use, and filler is made up of 200# copper powder, zinc oxide and chrome green.
Compared with prior art, characteristics of the present utility model and beneficial effect thereof are:
(1) the utility model makes abrasive wheel substrate and diamond layer rely on the dovetail groove on the abrasive wheel substrate to be linked together, and has avoided coming off between non-diamond layer and the diamond layer;
(2) diamond layer of the utility model design improves resinoid bond emery wheel grinding efficiency, prolongs 10~30% service life.
Description of drawings
The structural representation of Fig. 1 diamond-impregnated wheel;
The partial enlarged drawing of the abrasive wheel substrate of Fig. 2 diamond-impregnated wheel and diamond layer point of attachment;
1 diamond layer wherein, 2 abrasive wheel substrates, 3 rectangles are filled mouthful, 4 annular dovetail slots, 5 pilot holes.
The specific embodiment
Below in conjunction with embodiment the utility model is elaborated, but protection domain of the present utility model is not limited only to following embodiment:
Embodiment 1: diamond layer 1 is 5mm with the abrasive wheel substrate 2 that is shaped as bowl type by the length that is arranged at abrasive wheel substrate 2 wall upper surfaces, the annular rectangle filling mouth 3 of the wide 4mm of being and annular dovetail slot 4 connect and bond by binding agent, abrasive wheel substrate 2 bottom surfaces are provided with a pilot hole 5, annular dovetail slot 4 wide 2mm, dark 1mm, the dovetail angle is 20 °, the material selection ZAl501 of abrasive wheel substrate 2, the diamond layer 1 that is filled into annular rectangle filling mouth 3 and annular dovetail slot 4 is selected 100#~120# diamond 3g for use, bond polyimide resin 3g, 200# copper powder 4g, zinc oxide 1g and chrome green 1g, the diamond-impregnated wheel of making is with respect to traditional emery wheel, and grinding efficiency improves 10%.
Embodiment 2: diamond layer 1 is 5mm with the abrasive wheel substrate 2 that is shaped as bowl type by the length that is arranged at abrasive wheel substrate 2 wall upper surfaces, the annular rectangle filling mouth 3 of the wide 4mm of being and annular dovetail slot 4 connect and bond by binding agent, abrasive wheel substrate 2 bottom surfaces are provided with a pilot hole 5, annular dovetail slot 4 wide 2mm, dark 1mm, the dovetail angle is 20 °, the material selection ZAl501 of abrasive wheel substrate 2, the diamond layer 1 that is filled into annular rectangle filling mouth 3 and annular dovetail slot 4 is selected 100#~120# diamond 3.5g for use, bond polyimide resin 4g, 200# copper powder 7g, zinc oxide 3g and chrome green 4g, the diamond-impregnated wheel of making is with respect to traditional emery wheel, and grinding efficiency improves 30%.

Claims (3)

1. diamond-impregnated wheel, abrasive wheel substrate (2) by a diamond layer (1) and a bowl type structure is formed, it is characterized in that abrasive wheel substrate (2) wall upper surface is provided with annular rectangle and fills mouthful (3) and an annular dovetail slot (4), the bottom surface is provided with a pilot hole (5).
2. a kind of diamond-impregnated wheel according to claim 1, it is characterized in that it is 5mm that described annular rectangle is filled mouthful (3) length, wide is 4mm, the wide 2mm of annular dovetail slot (4), dark 1mm, the dovetail angle is 20 °, and diamond layer (1) is filled into annular rectangle on the abrasive wheel substrate (2) and fills in mouthful (3) and the annular dovetail slot (4) and by binding agent and bond the material selection ZAl501 of abrasive wheel substrate (2).
3. a kind of diamond-impregnated wheel according to claim 1 is characterized in that described binding agent selects the polyimide resin powder for use.
CN2010206654393U 2010-12-17 2010-12-17 Diamond grinding wheel Expired - Fee Related CN201922355U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010206654393U CN201922355U (en) 2010-12-17 2010-12-17 Diamond grinding wheel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010206654393U CN201922355U (en) 2010-12-17 2010-12-17 Diamond grinding wheel

Publications (1)

Publication Number Publication Date
CN201922355U true CN201922355U (en) 2011-08-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010206654393U Expired - Fee Related CN201922355U (en) 2010-12-17 2010-12-17 Diamond grinding wheel

Country Status (1)

Country Link
CN (1) CN201922355U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103707205A (en) * 2013-12-27 2014-04-09 贵州金特磨削科技开发有限公司 Grinding wheel structure and manufacturing method
CN104339279A (en) * 2014-10-09 2015-02-11 贵州荣清工具有限公司 Grinding wheel with split dovetail groove structure
CN104742032A (en) * 2015-04-24 2015-07-01 新野鼎泰电子精工科技有限公司 Resin grinding wheel for slotting micro drill blade and manufacturing method of resin grinding wheel
CN105058251A (en) * 2015-07-07 2015-11-18 新野鼎泰电子精工科技有限公司 Twig tungsten steel end face length control resin wheel and preparation method thereof
CN109227419A (en) * 2018-09-20 2019-01-18 贵州荣清工具有限公司 The major diameter manufacturing method that integrally ultra-thin resin-diamond is sliced

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103707205A (en) * 2013-12-27 2014-04-09 贵州金特磨削科技开发有限公司 Grinding wheel structure and manufacturing method
CN104339279A (en) * 2014-10-09 2015-02-11 贵州荣清工具有限公司 Grinding wheel with split dovetail groove structure
CN104742032A (en) * 2015-04-24 2015-07-01 新野鼎泰电子精工科技有限公司 Resin grinding wheel for slotting micro drill blade and manufacturing method of resin grinding wheel
CN105058251A (en) * 2015-07-07 2015-11-18 新野鼎泰电子精工科技有限公司 Twig tungsten steel end face length control resin wheel and preparation method thereof
CN109227419A (en) * 2018-09-20 2019-01-18 贵州荣清工具有限公司 The major diameter manufacturing method that integrally ultra-thin resin-diamond is sliced

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110810

Termination date: 20151217

EXPY Termination of patent right or utility model