CN104162848B - Metallic bond grinding wheel for grinding ceramic tile arc chamfers and manufacturing process of metallic bond grinding wheel - Google Patents
Metallic bond grinding wheel for grinding ceramic tile arc chamfers and manufacturing process of metallic bond grinding wheel Download PDFInfo
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- CN104162848B CN104162848B CN201410387456.8A CN201410387456A CN104162848B CN 104162848 B CN104162848 B CN 104162848B CN 201410387456 A CN201410387456 A CN 201410387456A CN 104162848 B CN104162848 B CN 104162848B
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Abstract
The invention discloses a metallic bond grinding wheel for grinding ceramic tile arc chamfers. The metallic bond grinding wheel comprises a base and annular grinding blocks. Each grinding block sequentially comprises a working layer doped with diamond, a transition layer in the middle and a metallic matrix layer at the bottom and further comprises a connecting rod, and each connecting rod comprises a fixed end fixedly connected with the corresponding transition layer and a free end detachably connected with the base. The metallic matrix layers are provided with multiple connecting holes for allowing the connecting rods to penetrate through, and the working layers, the transition layers, the metallic matrix layers and the connecting rods are integrally formed through hot pressing sintering. The invention further provides a manufacturing process of the metallic bond grinding wheel. According to the metallic bond grinding wheel for grinding the ceramic tile arc chamfers, the annular grinding blocks are suitable for grinding the ceramic tile arc chamfers, the working layers containing the diamond are high in grinding capacity, and the grinding blocks which are integrally formed through hot pressing sintering can be well fixed to the base through the connecting rods. The metallic bond grinding wheel can be used for grinding the ceramic tile arc chamfers.
Description
Technical field
The present invention relates to ceramic tile grinding field, particularly a kind of metallic bond emery wheel of grinding ceramic tile circular arc chamfering, with
And the processing technology of this metallic bond emery wheel.
Background technology
Mostly the existing bistrique being adopted for grinding ceramic tile circular arc chamfering machinery is with carborundum, magnesium chloride, magnesium oxide
Based on mineral bonding agent bistrique, also known as magnesia silicon carbide trimming stone, its service life is short, leads to change frequently.And ore deposit
Thing bonding agent bistrique grinding intensity is low, needs circular arc chamfering could be made smooth the polishing of same position pressurization for a long time.
The existing document also diamond grinding head made to metallic bond on the books.Fix abrading block on base, described
Abrading block is the diamond grinding head that fritter, metallic bond are made, because the attachment force between diamond grinding block and base is inadequate
Ideal, abrading block easily comes off from base so that unstable product quality.
Content of the invention
The technical problem to be solved in the present invention is: provides a kind of long service life, grinding capacity is high, and the gold of stable connection
Belong to bonding agent emery wheel.
Additionally provide the processing technology of above-mentioned metallic bond emery wheel.
The technical scheme that the present invention solves technical problem is as follows:
A kind of metallic bond emery wheel of grinding ceramic tile circular arc chamfering, including the grinding block of base and annular, described mill
Cut block and include the working lining mixed with diamond, middle transition zone, the metallic base layer of bottom successively, described grinding block also includes
Connecting rod, described connecting rod includes the fixing end being fixedly connected with transition zone, and the free end with base releasable connection, described
Metallic base layer has the connecting hole that multiple confession connecting rods pass through, and described working lining, transition zone, metallic base layer, connecting rod are led to
Cross the sintering integrated molding of hot pressing.
Metallic base layer of the present invention is additionally provided with multiple reinforced holes, and the bottom of described reinforced hole arranges chamfering, described
Reinforced hole is full of by the extension of transition zone.
It is additionally provided with cushion between base of the present invention and grinding block.
Connecting rod of the present invention is bolt, its fixing end with diameter greater than connecting hole, described base pass through nut and company
Extension bar releasable connection.
A kind of processing technology of metallic bond emery wheel, comprises the following steps:
A. take metallic plate to be fabricated to the metallic base layer of annular, and several connecting holes left by brill thereon；
B. metallic base layer is put in mould, and connecting rod is passed through connecting hole, its fixing end is located at metallic base layer
Top, its free end is located at the lower section of metallic base layer；
C. metallic bond is paved with metallic base layer upper surface and connecting rod buried completely, form transition zone；
D. metallic bond mixing diamond is paved with transition zone and forms working lining；
E. the upper lid of buckling mould, by High Temperature High Pressure by the metallicses hot pressed sintering in mould, is integrally formed out circle
The grinding block of annular；
F. by connecting rod, grinding block is connected on base.
Metallic base layer described in step a of above-mentioned processing technology is additionally provided with multiple reinforced holes, the lower end of described reinforced hole
Portion arranges chamfering, and metallic bond described in step c simultaneously will be full for reinforced hole filling.
Described in step c, d of above-mentioned processing technology, the raw material of metallic bond is joined by the powder stock of following unit of weight
Become: cu80sn20Alloy 8～13, fe62～85, sn2～9, ni2～6, zn3～18.
The thickness of transition zone described in above-mentioned processing technology is 2mm, and described diamond accounts for the 7-10% of working lining unit of weight,
The thickness of described working lining is 6mm, and described metallic base layer is No. 45 steel, and thickness is 1～4mm.
Step e of above-mentioned processing technology is will to grind under conditions of 700 DEG C～770 DEG C of temperature, pressure 110kn～180kn
Cut block Thermocompressed sintering and forming.
A kind of metallic bond emery wheel of grinding ceramic tile circular arc chamfering disclosed by the invention, the grinding block of its annular is suitable for
In grinding ceramic tile circular arc chamfering, the working lining containing diamond has higher grinding capacity, the integrally formed mill of hot pressed sintering
Cut block to be fixed on well on base by connecting rod.Also disclose the processing technology of this metallic bond emery wheel.The present invention
Can be used for grinding ceramic tile circular arc chamfering.
Brief description
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, will make to required in embodiment description below
Accompanying drawing is briefly described.Obviously, described accompanying drawing is a part of embodiment of the present invention, rather than whole enforcement
Example, those skilled in the art's on the premise of not paying creative work, other designs can also be obtained according to these accompanying drawings
Scheme and accompanying drawing.
Fig. 1 is the front view of the present invention；
Fig. 2 is the sectional view at a-a in Fig. 1；
Fig. 3 is the three-dimensional view of the present invention；
Fig. 4 is the partial cross-sectional perspective view of described transition zone.
Specific embodiment
Technique effect below with reference to the design, concrete structure and generation to the present invention of embodiment and accompanying drawing is carried out clearly
Chu, it is fully described by, to be completely understood by the purpose of the present invention, feature and effect.Obviously, described embodiment is this
Bright a part of embodiment, rather than whole embodiments, based on embodiments of the invention, those skilled in the art is not paying
The other embodiment being obtained on the premise of creative work, belongs to the scope of protection of the invention.In addition, be previously mentioned in literary composition
All connection/annexations, not singly refer to component and directly connect, and refer to be added deduct by adding according to the situation that is embodied as
Couple auxiliary less, to form more excellent draw bail.Each technical characteristic in the invention, in not conflicting conflict
Under the premise of can be with combination of interactions.
As shown in figures 1-4, a kind of metallic bond emery wheel of grinding ceramic tile circular arc chamfering, including base 1 and annular
Grinding block, described grinding block includes the working lining 2 mixed with diamond, middle transition zone 3, the metallic base layer 4 of bottom successively,
Described grinding block also includes connecting rod 5, and described connecting rod 5 includes the fixing end being fixedly connected with transition zone 3, and with base 1
The free end of releasable connection, described metallic base layer 4 has the connecting hole that multiple confession connecting rods 5 pass through, described working lining 2, mistake
Cross layer 3, metallic base layer 4, connecting rod 5 are integrally formed by hot pressed sintering.When being used using the emery wheel that metallic bond is made
Between long, be more than 100 times of traditional magnesia silicon carbide trimming stone, can reduce replacement frequency, reduce labor intensity；And using
During hardly plus-pressure is used to emery wheel, and traditional magnesia silicon carbide trimming stone then needs to keep pressure in 2mpa；
Except working portion is worn in addition to consumption, the equal recoverable of other parts；Traditional magnesia silicon carbide wheel use cost is about
For 2.35 yuan/hour, and the metallic bond emery wheel use cost of grinding ceramic tile circular arc chamfering of the present invention is about 1.00
Unit/hour.
It is further used as preferred embodiment, described metallic base layer 4 is additionally provided with multiple reinforced holes, described reinforced hole
Bottom arranges chamfering, and described reinforced hole is full of by the extension of transition zone 3.The extension insertion Metal Substrate of transition zone 3
Body layer 4, so that combination degree between the two is higher, prevents the bad phenomenon that grinding block layering is peeled off.
It is further used as preferred embodiment, between described base and grinding block, be additionally provided with cushion 6.Described cushion
Can be the flexible materials such as rubber, plastics.Because grinding ceramic tile can produce mechanical vibration, cushion effectively can absorb vibrations,
Extend the service life of metallic bond emery wheel.
Be further used as preferred embodiment, described connecting rod 5 is bolt, its fixing end with diameter greater than connecting hole,
Described base 1 passes through nut and connecting rod 5 releasable connection.Traditional magnesia silicon carbide trimming stone is integrally formed with base, when
Its bistrique part is exhausted, then need to remove from grinding machine together with base.And connecting rod 5 is wrapped up by the grinding block of the present invention
In wherein, then it is connected with base 1 by connecting rod 5 so that grinding block can form releasable connection with base 1.When working lining 2 consumes
The connection of connecting rod 5 and base 1 after finishing, can be released, thus realizing the grinding block that more renews and base 1 need not being changed.
The processing technology of above-mentioned metallic bond emery wheel comprises the following steps:
A. take metallic plate to be fabricated to the metallic base layer of annular, and several connecting holes left by brill thereon；
B. metallic base layer is put in mould, and connecting rod is passed through connecting hole, its fixing end is located at metallic base layer
Top, its free end is located at the lower section of metallic base layer；
C. metallic bond is paved with metallic base layer upper surface and connecting rod buried completely, form transition zone；
D. metallic bond mixing diamond is paved with transition zone and forms working lining；
E. the upper lid of buckling mould, by High Temperature High Pressure by the metallicses hot pressed sintering in mould, is integrally formed out circle
The grinding block of annular；
F. by connecting rod, grinding block is connected on base.
Metallic base layer described in step a of above-mentioned processing technology is additionally provided with multiple reinforced holes, the lower end of described reinforced hole
Portion arranges chamfering, and metallic bond described in step c simultaneously will be full for reinforced hole filling.Reinforced hole is made with the extension of transition zone
Obtain metallic base layer even closer with the combination of transition zone.
Wherein described in step c, d, the raw material of metallic bond can be made into by the powder stock of following unit of weight:
(1) cu80sn20Alloy 8～13, fe67～85, sn2～6, ni2～6, zn3～8；
(2) cu80sn20Alloy 8～13, fe65～83, sn2～6, ni2～6, zn5～10
(3) cu80sn20Alloy 8～13, fe62～80, sn2～6, ni2～6, zn8～13
(4) cu80sn20Alloy 8～13, fe54～73, sn4～9, ni2～6, zn13～18.
As further process modification, the thickness of described transition zone is 2mm, and described diamond accounts for working lining unit of weight
7-10%, the thickness of described working lining is 6mm, and described metallic base layer is No. 45 steel, and thickness is 1～4mm.Described metal knot
Mixture emery wheel is single to weigh about 950 grams, use time about 300 hours, and when traditional magnesia silicon carbide wheel uses
Between be 3 hours about, weight be 650 grams about, the industrial residue of generation is than about 1:65.
As further process modification, step e is under conditions of 700 DEG C～770 DEG C of temperature, pressure 110kn～180kn
By grinding block Thermocompressed sintering and forming.
Above the better embodiment of the present invention is illustrated, but the invention is not limited to described enforcement
Example, those of ordinary skill in the art also can make a variety of equivalent modifications without prejudice on the premise of present invention spirit or replace
Change, these equivalent modifications or replacement are all contained in the application claim limited range.
Claims (5)
1. a kind of processing technology of metallic bond emery wheel is it is characterised in that comprise the following steps:
A. take metallic plate to be fabricated to the metallic base layer of annular, and several connecting holes left by brill thereon；
B. metallic base layer is put in mould, and connecting rod is passed through connecting hole, its fixing end is located above metallic base layer,
Its free end is located at the lower section of metallic base layer；
C. metallic bond is paved with metallic base layer upper surface and connecting rod buried completely, form transition zone；
D. metallic bond mixing diamond is paved with transition zone and forms working lining；
E. the upper lid of buckling mould, by High Temperature High Pressure by the metallicses hot pressed sintering in mould, is integrally formed out annular
Grinding block；
F. by connecting rod, grinding block is connected on base.
2. the processing technology according to metallic bond emery wheel as claimed in claim 1 it is characterised in that: metal described in step a
Base layer is additionally provided with multiple reinforced holes, the bottom setting chamfering of described reinforced hole, and metallic bond described in step c will simultaneously
Reinforced hole filling is full.
3. the processing technology according to metallic bond emery wheel as claimed in claim 1 it is characterised in that: described in step c, d gold
The raw material belonging to bonding agent is made into by the powder stock of following unit of weight: cu80sn20Alloy 8～13, fe62～85, sn2～9,
Ni2～6, zn3～18.
4. the processing technology according to metallic bond emery wheel as claimed in claim 1 it is characterised in that: the thickness of described transition zone
For 2mm, described diamond accounts for the 7-10% of working lining unit of weight, and the thickness of described working lining is 6mm, described metallic base layer
It is No. 45 steel, thickness is 1～4mm.
5. the processing technology according to as arbitrary in Claims 1 to 4 described metallic bond emery wheel it is characterised in that: step e be
By grinding block Thermocompressed sintering and forming under conditions of 700 DEG C～770 DEG C of temperature, pressure 110kn～180kn.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410387456.8A CN104162848B (en) | 2014-08-07 | 2014-08-07 | Metallic bond grinding wheel for grinding ceramic tile arc chamfers and manufacturing process of metallic bond grinding wheel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410387456.8A CN104162848B (en) | 2014-08-07 | 2014-08-07 | Metallic bond grinding wheel for grinding ceramic tile arc chamfers and manufacturing process of metallic bond grinding wheel |
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| CN104162848A CN104162848A (en) | 2014-11-26 |
| CN104162848B true CN104162848B (en) | 2017-02-01 |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104526583B (en) * | 2014-12-15 | 2017-06-16 | 郑州磨料磨具磨削研究所有限公司 | Resinoid bond super-abrasive grinding wheel is used in a kind of aluminium oxide ceramics capillary grinding |
| CN105500226A (en) * | 2015-12-28 | 2016-04-20 | 常熟市尚高机械设备有限公司 | Novel ultrahard abrasive grinding wheel |
| CN106956223B (en) * | 2016-01-12 | 2019-03-26 | 蓝思科技（长沙）有限公司 | A kind of metallic bond and its diamond abrasive tool and diamond abrasive tool preparation method |
| CN108972372B (en) * | 2017-06-05 | 2020-10-20 | 江苏华昌工具制造有限公司 | Diamond grinding wheel |
| CN107214637A (en) * | 2017-06-05 | 2017-09-29 | 江苏华昌工具制造有限公司 | Hard emery wheel and preparation method thereof |
| CN107175593B (en) * | 2017-07-17 | 2019-01-04 | 鄂州市金锋超硬材料有限公司 | The production method of diamond-impregnated wheel without pure copper powder |
| CN107378809A (en) * | 2017-07-17 | 2017-11-24 | 福州市闽福石材磨具有限公司 | A kind of Buddha's warrior attendant mill dish and its manufacture craft based on spot welding |
| CN108312078A (en) * | 2018-03-16 | 2018-07-24 | 广州金谷钻石工具有限公司 | A kind of metal-bonded diamond stone material rubbing down horseshoe block |
| CN113103159A (en) * | 2021-03-31 | 2021-07-13 | 珠海市世创金刚石工具制造有限公司 | Grinding wheel for machining hard materials and preparation method thereof |
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| US7744447B2 (en) * | 2005-03-16 | 2010-06-29 | Goei, Co., Ltd. | Abrasive disc |
| CN201632939U (en) * | 2010-03-05 | 2010-11-17 | 西安航天自动化股份有限公司 | Grinding wheel for grinding edges and corners of glass |
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| CN104162848A (en) | 2014-11-26 |
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Effective date of registration: 20210118 Address after: No. 7, north side of village committee, Langxia Industrial Park, Shishan town, Nanhai District, Foshan City, Guangdong Province Patentee after: FOSHAN RUIPUDA DIAMOND TOOLS Co.,Ltd. Address before: No.19, Jiangwan 1st Road, Chancheng District, Foshan City, Guangdong Province Patentee before: Wang Qiang |